A low-power chip packaging structure and a packaging method

Abstract

The application discloses a low-power-consumption chip packaging structure and a packaging method, which comprise a packaging piece for encapsulating a chip by using epoxy resin, wherein the packaging piece is provided with a uniform distribution piece for equidistantly distributing a plurality of groups of chips; in the application, the uniform distribution piece can be used for automatically uniformly distributing, positioning and regularly arranging the to-be-packaged bare chips, realizing batch chip standardization array distribution, completely improving the problems of uneven spacing and position deviation caused by manual placement, guaranteeing that the arrangement specifications of all chips in the same batch are highly unified, improving the consistency and regularity of simultaneous packaging of multiple chips, reducing the packaging defective rate, and greatly improving the overall packaging production efficiency, so that a precise and stable pre-operation basis is provided for subsequent overall resin encapsulation forming.

Description

Technical Field

[0001] This invention relates to the field of chip packaging equipment technology, specifically a low-power chip packaging structure and packaging method. Background Technology

[0002] Low-power chips are integrated circuits developed for scenarios such as the Internet of Things and portable electronics. They are characterized by low power consumption, controllable energy consumption, and adaptability to long-term stable operation. Chip packaging is a process that uses media such as epoxy resin to encapsulate and protect bare chips, which can realize electrical interconnection, physical protection and heat dissipation management of chips, and ensure the normal operation of chips.

[0003] In existing low-power chip mass packaging processes, the arrangement and positioning of bare chips mostly rely on manual operation or simple positioning mechanisms. It is difficult to achieve standardized equidistant array arrangement of multiple chips, which easily leads to uneven chip spacing and slight positional offsets. This results in insufficient packaging consistency within the same batch of chips, indirectly increasing the probability of defective products. At the same time, the manual arrangement mode has limited operational efficiency and is difficult to adapt to the needs of continuous and large-scale production. It cannot provide accurate and stable preconditions for subsequent overall resin encapsulation molding, which to some extent restricts the overall production efficiency of low-power chip packaging technology. Summary of the Invention

[0004] The purpose of this invention is to address the problem that in existing low-power chip mass packaging processes, the arrangement and positioning of bare chips largely relies on manual operation or simple positioning mechanisms, making it difficult to achieve standardized equidistant array arrangement of multiple chips. This often results in uneven chip spacing and slight positional offsets, leading to insufficient consistency in chip packaging within the same batch and indirectly increasing the probability of defective products. Furthermore, the manual arrangement mode has limited operational efficiency, making it difficult to adapt to the needs of continuous and large-scale production. It also fails to provide accurate and stable preconditions for subsequent overall resin encapsulation molding, thus restricting the overall production efficiency of low-power chip packaging processes to a certain extent. Therefore, this invention provides a low-power chip packaging structure and packaging method.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a low-power chip packaging structure and packaging method, comprising: a packaging component for encapsulating chips with epoxy resin, wherein the packaging component is provided with a dividing component for evenly distributing multiple groups of chips;

[0006] The encapsulation component includes a base plate, a support column is fixedly connected to the top of the base plate, a storage box is fixedly connected to the top of the support column, and a limiting frame is fixedly connected to the inner side of the storage box.

[0007] The equalizing component includes a mounting frame fixedly connected to the outside of the limiting frame. An adjustment groove is provided through the outside of the mounting frame. There are four sets of adjustment grooves. A push rod is slidably connected in the adjustment groove located in the width direction of the limiting frame, and a push rod is slidably connected in the adjustment groove located in the length direction of the limiting frame. A moving part 1 is provided on the mounting frame to drive the push rod 1 to move, and a moving part 2 is provided on the mounting frame to drive the push rod 2 to move.

[0008] The movable component includes a linear actuator fixed to the top of the mounting frame. A mounting bracket is fixedly connected to the top of the mounting frame. Two sets of mounting brackets are provided, one of which is fixedly connected to the movable end of the linear actuator. A limit post is fixedly connected inside the mounting bracket. A connecting block one and a connecting block two are slidably connected to the outer circular surface of the limit post. An adjusting rod one is rotatably connected to the connecting block one, and an adjusting rod two is rotatably connected to the connecting block two. A connecting cylinder one is fixedly connected to the adjusting rod one, and a connecting cylinder two is fixedly connected to the adjusting rod two. The connecting cylinder one and the connecting cylinder two are rotatably inserted into each other, so that the adjusting rod one and the adjusting rod two are hinged.

[0009] As a further embodiment of the present invention: a hydraulic rod is fixedly connected to the top of the base plate, and a placement platform is fixedly connected to the movable top of the hydraulic rod. A release device is provided at the bottom of the limiting frame to release epoxy resin from the storage box into the limiting frame. Four sets of support columns are provided, symmetrically distributed at the top of the base plate, and the tops of the four sets of support columns are connected to a storage box. The storage box is O-shaped. A heating coil is embedded in the placement platform. Four sets of hydraulic rods are provided, and the movable tops of the four sets of hydraulic rods are connected to a placement platform. The four sets of hydraulic rods are located in the inner area of ​​the limiting frame, and the outer side of the placement platform abuts against the inner side of the limiting frame.

[0010] As a further embodiment of the present invention: a release groove is provided on the inner side of the storage box, the bottom end of the inner side of the release groove is flush with the bottom end of the storage box, a guide block is fixedly connected to the bottom end of the storage box, the guide block has a triangular cross-section with the inclined surface facing upward, and the side facing the release groove is the lowest point of the inclined surface, and a through injection hole is provided on the inner side of the limiting frame, and multiple sets of injection holes are provided, evenly distributed on the inner side of the limiting frame, and multiple sets of injection holes are connected to a set of release grooves.

[0011] As a further embodiment of the present invention: the release component includes a spring fixedly connected to the bottom end of the limiting frame, a plug plate fixedly connected to the bottom end of the spring, the plug plate having a convex cross-section, multiple sets of springs evenly distributed on the plug plate, and a sealing block fixedly connected to the top end of the plug plate, the sealing block having the same cross-sectional dimensions as the injection hole, and multiple sets of sealing blocks.

[0012] As a further embodiment of the present invention: both push rod one and push rod two are provided with multiple sets, the length of the adjustment groove in the length direction of the limiting frame is less than the length of the limiting frame, the length of the adjustment groove in the width direction of the limiting frame is less than the width of the limiting frame, the four sets of adjustment grooves are symmetrically distributed along the length and width directions of the limiting frame, each set of push rod one penetrates through the two sets of adjustment grooves in the width direction of the limiting frame, and each set of push rod two penetrates through the two sets of adjustment grooves in the length direction of the limiting frame.

[0013] As a further embodiment of the present invention: the bottom end of the push rod one abuts against the top end of the push rod two, and the total thickness of the push rod one and the push rod two is the same as the height of the inner side of the adjustment groove. The total thickness of the push rod one and the push rod two is the same as the thickness of the chip. Two sets of each of the moving parts one and two are provided, symmetrically distributed at the top of the mounting frame.

[0014] As a further embodiment of the present invention: the second movable component also includes a linear driver, a mounting bracket, a limiting post, a connecting block one, a connecting block two, an adjusting rod one, a connecting cylinder one, a connecting cylinder two, and an adjusting rod two. In the multiple sets of push rod one and push rod two, each set of push rod one is rotatably inserted into the connecting cylinder two at the X-hinged joint of each set of adjusting rod one and adjusting rod two in the two sets of movable components one at both ends. Each set of push rod two is rotatably inserted into the connecting cylinder two at the X-hinged joint of each set of adjusting rod one and adjusting rod two in the two sets of movable components two at both ends.

[0015] A low-power chip packaging method includes the following steps:

[0016] S1. First, the equipment is in the initial standby state, the hydraulic rod is fully extended, and the placement platform is raised to the working area below the equalizing part. The spring contracts and tightens, so that the sealing block seals the injection hole, allowing the epoxy resin inside the storage box to be sealed and stationary. The staff places the batch of bare chips to be packaged into the push rod gap of the placement platform, completing the pre-operation preparation.

[0017] S2. After that, the equipment automation program is started. Moving part one and moving part two work synchronously. Through the linkage of various structures, push rod one and push rod two slide to separate and calibrate the bare chips, so that the chips are arranged in an equidistant array. Then the hydraulic rod retracts at a constant speed, which drives the placement stage to move down, presses against the plug-in plate and stretches the spring, releases the sealing block, and opens the resin guide channel of the storage box, release tank and injection hole.

[0018] S3. Finally, the epoxy resin flows out at a uniform speed along the guide block, completely encapsulating the bare chip. The heating coil built into the placement stage operates at a constant temperature to ensure that the resin is cured and formed uniformly. After curing, the hydraulic rod continues to move down to complete the demolding and component removal. Then the hydraulic rod resets, and the spring rebounds to reseal the injection hole with the sealing block. The equipment returns to standby mode, enabling continuous batch packaging production.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. In this invention, the resin storage, automatic filling and constant temperature curing of low power chip packaging can be completed independently through the packaging component, realizing integrated automated operation of the packaging process, greatly reducing the error caused by manual intervention, stabilizing the packaging environment, making the resin filling more uniform and the curing more complete, effectively reducing defects such as packaging bubbles, missing glue, deformation, etc., significantly improving the chip packaging molding accuracy and overall yield, adapting to batch continuous packaging production, and ensuring the structural stability and reliability of low power chip after packaging;

[0021] 2. In this invention, the equalizing component can automatically evenly divide, position, and arrange the bare chips to be packaged, realizing a standardized array distribution of chips in batches. This completely improves the problems of uneven spacing and positional offset caused by manual placement, ensuring that the arrangement specifications of all chips in the same batch are highly uniform, improving the consistency and regularity of packaging multiple chips at the same time, reducing the packaging defect rate, and significantly improving the overall packaging production efficiency. This provides a precise and stable pre-operation foundation for subsequent overall resin encapsulation molding. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the package structure in this invention;

[0024] Figure 3 This is a cross-sectional view of the package in this invention;

[0025] Figure 4 In this invention Figure 3 A schematic diagram of the structure at point A;

[0026] Figure 5 In this invention Figure 3 A schematic diagram of the structure at point B;

[0027] Figure 6 This is a schematic diagram of the structure of the evenly divided component in this invention;

[0028] Figure 7 This is a schematic diagram of the push rod structure in this invention;

[0029] Figure 8 This is a schematic diagram of the moving part in this invention.

[0030] In the diagram: 1. Encapsulation component; 11. Base plate; 12. Support column; 13. Storage box; 131. Release groove; 132. Guide block; 14. Limiting frame; 141. Injection hole; 15. Hydraulic rod; 16. Placement platform; 17. Release component; 171. Plug-in plate; 172. Sealing block; 173. Spring; 2. Dividing component; 21. Mounting frame; 22. Moving component one; 221. Linear actuator; 222. Mounting bracket; 223. Limiting column; 224. Connecting block one; 225. Connecting block two; 226. Adjusting rod one; 227. Connecting cylinder one; 228. Connecting cylinder two; 229. Adjusting rod two; 23. Moving component two; 24. Push rod one; 25. Push rod two; 26. Adjusting groove. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Reference Figure 1 In this embodiment of the invention, a low-power chip packaging structure and packaging method are provided, including: a packaging component 1 for encapsulating the chip with epoxy resin, wherein the packaging component 1 is provided with a dividing component 2 for evenly distributing multiple groups of chips.

[0033] Reference Figures 2 to 5The encapsulation component 1 includes a base plate 11, with a support column 12 fixedly connected to the top of the base plate 11. A storage box 13 for storing epoxy resin is fixedly connected to the top of each support column 12. Four sets of support columns 12 are symmetrically distributed at the top of the base plate 11, and the tops of all four sets of support columns 12 are connected to one storage box 13. The storage box 13 is O-shaped, and a limiting frame 14 is fixedly connected to the inner side of the storage box 13. A hydraulic rod 15 is fixedly connected to the top of the base plate 11, and a placement platform 16 is fixedly connected to the movable top of each hydraulic rod 15. A heating coil is embedded in the placement platform 16. Four sets of hydraulic rods 15 are provided, and the movable tops of all four sets of hydraulic rods 15 are connected to one placement platform 16. Four sets of hydraulic rods 15 are located inside the limiting frame 14. The outer side of the placement platform 16 abuts against the inner side of the limiting frame 14. The bottom end of the limiting frame 14 is provided with a release element 17 that releases epoxy resin from the storage box 13 into the limiting frame 14. In the initial state, the hydraulic rods 15 are in the extended state, raising the placement platform 16 below the equalizing component 2. The storage box 13 has a release groove 131 inside, and the bottom end of the release groove 131 is flush with the bottom end of the storage box 13. A guide block 132 is fixedly connected to the bottom end of the storage box 13. The guide block 132 has a triangular cross-section with the inclined surface facing upward, and the side facing the release groove 131 is the lowest point of the inclined surface. The limiting frame 14 has a through injection hole inside. 141, multiple sets of injection holes 141 are evenly distributed inside the limiting frame 14. These multiple sets of injection holes 141 communicate with a set of release grooves 131. The release element 17 includes a spring 173 fixedly connected to the bottom end of the limiting frame 14. A plug-in plate 171 is fixedly connected to the bottom end of the spring 173. The plug-in plate 171 has a convex cross-section. Multiple sets of springs 173 are evenly distributed on the plug-in plate 171. A sealing block 172 is fixedly connected to the top end of the plug-in plate 171. The sealing block 172 has the same cross-sectional dimensions as the injection holes 141. Multiple sets of sealing blocks 172 are provided. In the initial state, the springs 173 are in a contracted state, driving the plug-in plate 171 to insert into the bottom end of the limiting frame 14, so that each... The sealing block 172 is inserted into a set of injection holes 141 to seal the injection holes 141. After the equalizing component 2 evenly distributes multiple sets of chips on the placement stage 16, the hydraulic rod 15 retracts and drives the placement stage 16 to move down synchronously, so that the chips on the placement stage 16 are away from the equalizing component 2, until the top of the placement stage 16 moves to be flush with the bottom of the injection hole 141. During this process, the bottom of the placement stage 16 abuts against the inside of the U-shaped plug plate 171. The plug plate 171 moves down and the spring 173 extends. When the top of the placement stage 16 moves to be flush with the bottom of the injection hole 141, the top of the sealing block 172 is flush with the bottom of the injection hole 141, so that the inside of the storage box 13, the release groove 131 and the injection hole 141 are connected.

[0034] The above solution, through the cooperation of the base plate 11, support column 12, storage box 13, limiting frame 14, hydraulic rod 15, placement stage 16 and release component 17 equipped with the encapsulation component 1, can realize the sealed storage, automatic controlled release and constant temperature curing of epoxy resin. Relying on the flow guide block 132, release groove 131 and multiple sets of evenly distributed injection holes 141 to form a regular flow guide channel, and with the elastic sealing structure composed of spring 173, plug plate 171 and sealing block 172, the timing and flow rate of resin injection can be precisely controlled, effectively avoiding encapsulation defects such as resin leakage, uneven injection and air bubbles. At the same time, the heating coil built into the placement stage 16 stabilizes the encapsulation temperature, greatly improving the chip encapsulation molding accuracy and production yield.

[0035] Reference Figures 6 to 8The equalizing component 2 includes a mounting frame 21 fixedly connected to the outside of the limiting frame 14. An adjustment groove 26 is provided through the outside of the mounting frame 21. Four sets of adjustment grooves 26 are provided, symmetrically distributed along the length and width directions of the limiting frame 14. The length of the adjustment groove 26 along the length direction of the limiting frame 14 is less than the length of the limiting frame 14, and the length of the adjustment groove 26 along the width direction of the limiting frame 14 is less than the width of the limiting frame 14. A push rod 24 is slidably connected within the adjustment groove 26 along the width direction of the limiting frame 14, and the push rod 24 passes through two sets of adjustment grooves 26 along the width direction of the limiting frame 14. A push rod 25 is slidably connected within the adjustment groove 26 along the length direction of the limiting frame 14, and the push rod 25 passes through two sets of adjustment grooves 26 along the length direction of the limiting frame 14. The adjustment groove 26 is provided. The bottom end of the push rod 24 abuts against the top end of the push rod 25, and the total thickness of the push rod 24 and the push rod 25 is the same as the inner height of the adjustment groove 26. The total thickness of the push rod 24 and the push rod 25 is the same as the chip thickness. Multiple sets of push rods 24 and 25 are provided. The mounting frame 21 is provided with a moving part 22 that drives the push rod 24 to move along the length direction of the limiting frame 14. The mounting frame 21 is provided with a moving part 23 that drives the push rod 25 to move along the width direction of the limiting frame 14. Two sets of each of the moving parts 22 and 23 are provided, symmetrically distributed at the top end of the mounting frame 21. The moving part 22 includes a linear driver 221 fixed to the top end of the mounting frame 21. A mounting bracket 222 is fixedly connected to the top. The mounting bracket 222 is U-shaped. Two sets of mounting brackets 222 are provided in each set of movable parts 22. One set is fixedly connected to the movable end of the linear actuator 221. A limit post 223 is fixedly connected inside the mounting bracket 222. A connecting block 1 224 and a connecting block 225 are slidably connected to the outer circular surface of the limit post 223. Both connecting blocks 1 224 and connecting blocks 225 are convex in shape and consist of a set of cylinders and a set of rectangular blocks. An adjusting rod 1 226 is rotatably connected to the cylinder on the connecting block 1 224. An adjusting rod 229 is rotatably connected to the cylinder on the connecting block 225. A connecting cylinder 1 227 is fixedly connected to the adjusting rod 1 226. Three sets of connecting cylinders 1 227 are provided and evenly distributed on the adjusting rod. On one side of adjustment rod 226, a cylinder on connecting block 224 is inserted into a set of connecting cylinders 227. Connecting cylinders 228 are fixedly connected to adjusting rod 229. Three sets of connecting cylinders 228 are evenly distributed on one side of adjusting rod 229. A cylinder on connecting block 225 is inserted into a set of connecting cylinders 228. The inner diameter of connecting cylinder 227 is the same as the outer diameter of connecting cylinder 228. The connecting cylinder 227 located in the middle of adjusting rod 226 and adjusting rod 229 is rotatably inserted into connecting cylinder 228, causing adjusting rod 226 and adjusting rod 229 to form an X-shaped hinge. Multiple sets of adjusting rod 226 and adjusting rod 229 are provided. These multiple sets of X-shaped hinged adjusting rods 226 and adjusting rod 229 are connected by connecting cylinders located at the upper and lower ends.The adjusting rod 226 and adjusting rod 229 are hinged to each other in an X-shape. The moving part 23 also includes a linear actuator 221, a mounting bracket 222, a limiting post 223, a connecting block 224, a connecting block 225, adjusting rod 226, a connecting cylinder 227, a connecting cylinder 228, and adjusting rod 229. In the multiple sets of push rods 24 and 25, each set of push rods 24 is rotatably inserted into the connecting cylinder 228 at the X-hinged joint of each set of adjusting rods 226 and 229 in the two sets of moving parts 22. Similarly, each set of push rods 25 is rotatably inserted into the connecting cylinder 228 at the X-hinged joint of each set of adjusting rods 226 and 229 in the two sets of moving parts 23.

[0036] The above solution utilizes the linkage structure of the mounting frame 21, adjustment slot 26, push rod 1 24, and push rod 25 of the equalizing component 2, along with the moving component 1 22 and moving component 2 23. By relying on multiple sets of X-shaped hinged adjustment rods 1 226 and 2 229 to achieve synchronous extension and retraction adjustment, multiple sets of bare chips can be quickly arranged in an equidistant array. This adapts to the batch packaging needs of low-power chips of different quantities and specifications. By utilizing the structural characteristics of push rod thickness matching chip thickness, the chip position is precisely limited, eliminating chip offset, stacking, and uneven spacing issues. This effectively ensures the consistency of batch chip packaging and significantly improves packaging regularity and automated production efficiency.

[0037] The working principle of this invention is as follows: During actual packaging operations, the device is initially in a standby state, with the four sets of hydraulic rods 15 fully extended, stably raising the placement platform 16 to the working area directly below the equalizing component 2. At this time, the multiple sets of springs 173 of the release component 17 are in a contracted and taut state, pulling the plug-in plate 171 tightly against the bottom of the limiting frame 14, so that each set of sealing blocks 172 at the top of the plug-in plate 171 is precisely embedded into the corresponding injection hole 141, achieving complete sealing of all injection holes 141. The epoxy resin pre-stored inside the storage box 13 is in a sealed and static state, preventing leakage, volatilization pollution, and other problems, thus preparing for subsequent packaging operations. Workers can then freely place the batch of low-power bare chips to be packaged. The chip is placed on the surface of the placement stage 16 and within the rectangular gap formed by multiple sets of push rods 24 and 25. Then, the automated operation program of the equipment is started. The two sets of symmetrically distributed moving parts 22 and 23 start working synchronously. After each linear actuator 221 starts, it drives the corresponding mounting bracket 222 to move, causing the connecting block 224 and connecting block 225 on the outside of the limiting post 223 to slide in a direction. This drives the multiple sets of X-shaped hinged adjusting rods 226 and 229 to extend and retract synchronously, thereby driving each set of push rods 24 and 25 to slide smoothly along the corresponding adjusting groove 26. The horizontally distributed push rods 24 and the vertically distributed push rods 25 work together to precisely limit the movement of the multiple sets of bare chips on the surface of the placement stage 16. The first separation calibration ensures that all chips are arranged in an evenly spaced array, completely solving the problems of uneven chip spacing and positional misalignment caused by manual chip placement, and ensuring the uniformity of subsequent packaging. After the chips are evenly positioned, the four sets of hydraulic rods 15 retract synchronously and uniformly, causing the placement stage 16 and the chips arranged in an array on its surface to slowly move downwards, gradually removing the chips from the limiting area of ​​the equalizing component 2. During the downward movement of the placement stage 16, its bottom end will gradually press against the inner end face of the U-shaped plug-in plate 171, continuously pressing down on the plug-in plate 171, causing the originally contracted spring 173 to gradually stretch and extend, causing the plug-in plate 171 and the sealing block 172 to move downwards synchronously, slowly releasing the sealing state of the injection hole 141. When the top plane of the placement stage 16 moves precisely to the position of the injection hole... When the bottom of the injection hole 141 is flush with the inside, the hydraulic rod 15 stops retracting. At this time, the top of the sealing block 172 is flush with the bottom of the injection hole 141. The internal cavity of the storage box 13, the release groove 131, and the multiple injection holes 141 are fully connected, forming a smooth resin flow channel. Under the action of gravity, the epoxy resin in the storage box 13 quickly gathers at the release groove 131 along the inclined guide surface of the triangular guide block 132, and then flows into the encapsulation cavity inside the limiting frame 14 at a uniform speed through the multiple evenly distributed injection holes 141, fully encapsulating and filling the bare chips arranged in the array below. Throughout the resin pouring process, the heating coil inside the placement stage 16 continues to work at a constant temperature to maintain a constant temperature in the encapsulation area, ensuring stable flowability and uniform curing of the epoxy resin.This effectively avoids the defects of incomplete low-temperature curing and high-temperature bubbling and deformation, ensuring that the resin fully fills the gaps between chips without voids, insufficient material, or overflow. After the resin completely fills the encapsulation cavity, it is kept at a constant temperature for a period of time to allow the epoxy resin to stabilize and cure, completing the overall encapsulation of batch low-power chips. After the encapsulation and curing are completed, the hydraulic rod 15 continues to move the placement stage 16 downwards until the placement stage 16 and the chip on it are detached from the bottom of the limiting frame 14, making it easy to remove the chip from the placement stage 16. After the chip is removed, the hydraulic rod 15 extends and resets again, lifting the placement stage 16. The bottom of the placement stage 16 is detached from the plug-in plate 171, and the spring 173 elastically contracts and resets, driving the sealing block 172 to re-seal the injection hole 141. The equipment returns to the initial standby state and can directly carry out the next batch of chip encapsulation operations, realizing continuous automated batch production. Low-power chip encapsulation can be completed independently through the encapsulation component 1. The resin storage, automatic filling, and constant-temperature curing processes are integrated into a fully automated encapsulation workflow, significantly reducing errors caused by manual intervention. This stabilizes the encapsulation environment, ensuring more uniform resin filling and more thorough curing. It effectively reduces defects such as bubbles, insufficient resin, and deformation, significantly improving chip encapsulation precision and overall yield. It is suitable for continuous batch encapsulation production, guaranteeing the structural stability and reliability of low-power chips after encapsulation. The equalizer 2 automatically evenly distributes, positions, and neatly arranges the bare chips to be encapsulated, achieving standardized array distribution for batch chips. This completely eliminates the problems of uneven spacing and positional misalignment caused by manual placement, ensuring a high degree of uniformity in the arrangement of all chips in the same batch. This improves the consistency and regularity of simultaneous multi-chip encapsulation, reduces the defect rate, and significantly increases overall encapsulation production efficiency, providing a precise and stable foundation for subsequent resin encapsulation.

[0038] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A low-power chip package structure, comprising: The encapsulation component (1) that encapsulates the chip with epoxy resin is characterized in that the encapsulation component (1) is provided with a dividing component (2) that distributes multiple groups of chips at equal intervals. The package (1) includes a base plate (11), a support column (12) is fixedly connected to the top of the base plate (11), a storage box (13) is fixedly connected to the top of the support column (12), and a limiting frame (14) is fixedly connected to the inside of the storage box (13). The equalizing component (2) includes a mounting frame (21) fixedly connected to the outside of the limiting frame (14). An adjustment groove (26) is provided through the outside of the mounting frame (21). There are four sets of adjustment grooves (26). A push rod one (24) is slidably connected in the adjustment groove (26) located in the width direction of the limiting frame (14). A push rod two (25) is slidably connected in the adjustment groove (26) located in the length direction of the limiting frame (14). A moving part one (22) is provided on the mounting frame (21) to drive the push rod one (24) to move. A moving part two (23) is provided on the mounting frame (21) to drive the push rod two (25) to move. The first movable component (22) includes a linear actuator (221) fixed to the top of the mounting frame (21). A mounting bracket (222) is fixedly connected to the top of the mounting frame (21). The mounting bracket (222) has two sets, one of which is fixedly connected to the movable end of the linear actuator (221). A limiting post (223) is fixedly connected inside the mounting bracket (222). A connecting block one (224) and a connecting block two (225) are slidably connected to the outer surface of the limiting post (223). 5) An adjusting rod 1 (226) is rotatably connected to the connecting block 1 (224), an adjusting rod 2 (229) is rotatably connected to the connecting block 2 (225), a connecting cylinder 1 (227) is fixedly connected to the adjusting rod 1 (226), and a connecting cylinder 2 (228) is fixedly connected to the adjusting rod 2 (229). The connecting cylinder 1 (227) and the connecting cylinder 2 (228) are rotatably inserted, so that the adjusting rod 1 (226) and the adjusting rod 2 (229) are hinged.

2. The low-power chip packaging structure according to claim 1, characterized in that, A hydraulic rod (15) is fixedly connected to the top of the base plate (11). A placement platform (16) is fixedly connected to the movable top of the hydraulic rod (15). A release device (17) is provided at the bottom of the limiting frame (14) to release the epoxy resin in the storage box (13) into the limiting frame (14). Four sets of support columns (12) are provided, symmetrically distributed at the top of the base plate (11). The tops of the four sets of support columns (12) are connected to a storage box (13). The storage box (13) is O-shaped. A heating coil is embedded in the placement platform (16). Four sets of hydraulic rods (15) are provided. The movable tops of the four sets of hydraulic rods (15) are connected to a placement platform (16). The four sets of hydraulic rods (15) are located in the inner area of ​​the limiting frame (14). The outer side of the placement platform (16) abuts against the inner side of the limiting frame (14).

3. The low-power chip packaging structure according to claim 2, characterized in that, The storage box (13) has a release groove (131) on its inner side. The bottom of the release groove (131) is flush with the bottom of the storage box (13). A guide block (132) is fixedly connected to the bottom of the storage box (13). The guide block (132) has a triangular cross-section with the inclined surface facing upwards. The side facing the release groove (131) is the lowest point of the inclined surface. The limiting frame (14) has a through-hole (141) on its inner side. There are multiple sets of injection holes (141) evenly distributed on the inner side of the limiting frame (14). The multiple sets of injection holes (141) are connected to a set of release grooves (131).

4. The low-power chip packaging structure according to claim 3, characterized in that, The release component (17) includes a spring (173) fixedly connected to the bottom end of the limiting frame (14). A plug plate (171) is fixedly connected to the bottom end of the spring (173). The plug plate (171) has a convex cross-section. Multiple sets of springs (173) are provided and evenly distributed on the plug plate (171). A sealing block (172) is fixedly connected to the top end of the plug plate (171). The cross-sectional dimensions of the sealing block (172) are the same as those of the injection hole (141). Multiple sets of sealing blocks (172) are provided.

5. A low-power chip packaging structure according to claim 4, characterized in that, Both push rod one (24) and push rod two (25) are provided with multiple sets. The length of the adjustment groove (26) in the length direction of the limiting frame (14) is less than the length of the limiting frame (14), and the length of the adjustment groove (26) in the width direction of the limiting frame (14) is less than the width of the limiting frame (14). The four sets of adjustment grooves (26) are symmetrically distributed along the length and width directions of the limiting frame (14). Each set of push rod one (24) passes through two sets of adjustment grooves (26) in the width direction of the limiting frame (14), and each set of push rod two (25) passes through two sets of adjustment grooves (26) in the length direction of the limiting frame (14).

6. The low-power chip packaging structure according to claim 5, characterized in that, The bottom end of push rod one (24) abuts against the top end of push rod two (25), and the total thickness of push rod one (24) and push rod two (25) is the same as the height of the inner side of the adjustment groove (26). The total thickness of push rod one (24) and push rod two (25) is the same as the thickness of the chip. There are two sets of each of the moving parts one (22) and two moving parts two (23), which are symmetrically distributed at the top of the mounting frame (21).

7. A low-power chip packaging structure according to claim 6, characterized in that, The second moving part (23) also includes a linear actuator (221), a mounting bracket (222), a limiting post (223), a connecting block one (224), a connecting block two (225), an adjusting rod one (226), a connecting cylinder one (227), a connecting cylinder two (228), and an adjusting rod two (229). In the multiple sets of push rod one (24) and push rod two (25), each set of push rod one (24) is rotatably inserted into the connecting cylinder two (228) at the X-hinged joint of each set of adjusting rod one (226) and adjusting rod two (229) in the two sets of moving parts one (22). The two ends of each set of push rod two (25) are rotatably inserted into the connecting cylinder two (228) at the X-hinged joint of each set of adjusting rod one (226) and adjusting rod two (229) in the two sets of moving parts two (23).

8. A packaging method for a low-power chip packaging structure according to any one of claims 1-7, characterized in that, Includes the following steps: S1. First, the equipment is in the initial standby state. The hydraulic rod (15) is fully extended, raising the placement platform (16) to the working area below the equalizing part (2). The spring (173) contracts and tightens, causing the sealing block (172) to seal the injection hole (141), allowing the epoxy resin inside the storage box (13) to be sealed and stationary. The staff places the batch of bare chips to be packaged in the push rod gap of the placement platform (16) to complete the pre-operation preparation. S2. After that, the equipment automation program is started. Moving part one (22) and moving part two (23) work synchronously. Through the linkage of each structure, push rod one (24) and push rod two (25) slide to separate and calibrate the bare chip, so that the chip is arranged in an equidistant array. Then the hydraulic rod (15) retracts at a constant speed, driving the placement platform (16) to move down, pressing against the plug plate (171) and stretching the spring (173), releasing the sealing block (172), and opening the resin guiding channel of the storage box (13), release groove (131) and injection hole (141); S3. Finally, the epoxy resin flows out at a constant speed along the guide block (132), wrapping the bare chip in all directions. The heating coil built into the placement stage (16) works at a constant temperature to ensure that the resin is cured and formed evenly. After curing, the hydraulic rod (15) continues to move down to complete the demolding and take out the part. Then the hydraulic rod (15) resets, and the spring (173) rebounds to make the sealing block (172) re-seal the injection hole (141). The equipment returns to the standby state and can realize continuous batch packaging production.

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