Lithographic substrate with purge flow guidance

Abstract

A photolithography substrate container includes an inlet configured to receive a purge gas, a baffle, a photolithography substrate containment space, and an outlet for the purge gas. The baffle can affect a flow of the purge gas received at the inlet to control a flow rate, a pressure differential, and the like of the flow of the purge gas through the photolithography substrate containment space. The baffle can be disposed between the inlet and the photolithography substrate containment space. The baffle can be included on one or more portions of the photolithography substrate container or on an insert configured to attach to the photolithography substrate container.

Description

Technical Field

[0001] This disclosure relates to a container for a photolithographic substrate, which includes features for receiving and guiding a purge flow. Background Technology

[0002] Photolithography components can be expensive and delicate. Photomasks can be sensitive to contaminants or damage from particulate matter. Thin films are also sensitive to contaminants and particles, and are further susceptible to physical damage, such as large pressure differences across the film. Summary of the Invention

[0003] This disclosure relates to a container for a photolithographic substrate, which includes features for receiving and guiding a purge flow.

[0004] By allowing the provision of a purge flow, the substrate container allows contaminants (such as moisture, volatile organic compounds (VOCs), or the like) to be expelled from the space containing the substrate. This reduces or prevents the impact of contaminants on the lithographic substrate, thereby increasing lifespan and providing cost and material savings. By providing the feature of guiding and distributing the purge flow within the container, the effectiveness of the purge flow is increased, as well as the risk of damage, such as that caused by non-uniform flow, excessive flow rate, pressure differentials across the lithographic substrate, or the like.

[0005] In one embodiment, a photolithography substrate container includes a first housing portion, a purge inlet, a purge outlet, and a second housing portion. The first housing portion and the second housing portion define a photolithography substrate receiving space configured to receive a photolithography substrate. The photolithography substrate container further includes a plurality of baffles configured to be positioned between the purge inlet and the photolithography substrate receiving space when the first housing portion and the second housing portion are closed together.

[0006] In one embodiment, at least some of the plurality of baffles are integrally formed with the first housing portion. In another embodiment, at least some of the plurality of baffles are integrally formed with the second housing portion. In another embodiment, at least some of the plurality of baffles are disposed in inserts configured to engage with at least one of the first housing portion and the second housing portion. In another embodiment, the plurality of baffles are disposed in a plurality of rows. In another embodiment, the plurality of baffles are disposed in a single row. In another embodiment, at least some of the plurality of baffles have a rectangular profile. In another embodiment, at least some of the plurality of baffles have a trapezoidal profile.

[0007] In one embodiment, a film container includes a first housing portion, a purge inlet, a purge outlet, and a second housing portion. The first housing portion and the second housing portion define a film receiving space configured to receive a film. The film container further includes a plurality of baffles configured to be positioned between the purge inlet and the film receiving space when the first housing portion and the second housing portion are closed together.

[0008] In one embodiment, at least some of the plurality of baffles are integrally formed with the first housing portion. In another embodiment, at least some of the plurality of baffles are integrally formed with the second housing portion. In another embodiment, at least some of the plurality of baffles are disposed in inserts configured to engage with at least one of the first housing portion and the second housing portion. In another embodiment, the plurality of baffles are disposed in a plurality of rows. In another embodiment, the plurality of baffles are disposed in a single row. In another embodiment, at least some of the plurality of baffles have a rectangular profile. In another embodiment, at least some of the plurality of baffles have a trapezoidal profile.

[0009] In one embodiment, a method for purging a membrane container includes receiving a flow of purge gas at a purge inlet of the membrane container, guiding the purge gas through a plurality of baffles into the membrane containment space of the membrane container, and guiding the purge gas out of the membrane container through a purge gas outlet of the membrane container.

[0010] In one embodiment, the method further includes attaching an insert comprising at least some of the plurality of baffles to the film container. In another embodiment, the method further includes placing a film into the film receiving space. In yet another embodiment, the method further includes cleaning the film container with water and drying the film container after cleaning. Attached Figure Description

[0011] Figure 1 A photolithographic substrate container is shown according to an embodiment.

[0012] Figure 2 A photolithographic substrate container is shown according to an embodiment.

[0013] Figure 3 A photolithographic substrate container is shown according to an embodiment.

[0014] Figure 4A Multiple baffles according to embodiments are shown.

[0015] Figure 4B Multiple baffles according to embodiments are shown.

[0016] Figure 5A A portion of a photolithographic substrate container according to an embodiment is shown.

[0017] Figure 5B A portion of a photolithographic substrate container according to an embodiment is shown. Detailed Implementation

[0018] This disclosure relates to a container for a photolithographic substrate, which includes features for receiving and guiding a purge flow.

[0019] As used herein, “photolithography substrate” means a substrate used in the photolithography process, such as a photomask, a thin film, or a combination thereof.

[0020] As used herein, "photolithography substrate container" means a container configured to hold a photolithography substrate, such as a thin film container, a photomask container, or the like.

[0021] Figure 1 A photolithography substrate container according to an embodiment is shown. The photolithography substrate container 100 includes a first housing portion 102 and a second housing portion 104. The photolithography substrate container further includes a purge inlet 106, a purge outlet 108, and a plurality of baffles 110. The photolithography substrate container 100 defines a photolithography substrate receiving space 112.

[0022] The photolithography substrate container 100 is a container configured to hold a photolithography substrate (e.g., a thin film, a photomask, a combination thereof, or the like). In an embodiment, the photolithography substrate container 100 is a thin film container, such as a thin film transport container. In an embodiment, the photolithography substrate container 100 is a photomask container, such as an extreme ultraviolet (EUV) photomask pod.

[0023] The first housing portion 102 is a part of the photolithography substrate container 100 that partially defines the internal space of the photolithography substrate container 100. The first housing portion 102 may be, for example, a piece of a thin film container (e.g., a clamshell portion of the thin film container), a cover of a photomask, a dome of a photomask, or any other suitable portion of the photolithography substrate container.

[0024] The second housing portion 104 is another portion of the photolithography substrate container 100 configured to combine with the first housing portion 102 to form at least a portion of the photolithography substrate container 102. The second housing portion 104 may be, for example, a piece of a thin film container (e.g., another clamshell portion of the thin film container), the base plate of a photomask box, the door of a photomask box, or any other suitable portion of the photolithography substrate container.

[0025] The purge inlet 106 is an inlet that allows purge gas to be introduced into the internal space of the photolithography substrate container 100. The purge inlet 106 can be any suitable structure configured to allow the introduction of purge gas, such as an opening, port, interface, or the like. The purge inlet may be located on at least one of the first housing portion 102 and / or the second housing portion 104. In embodiments, the purge inlet 106 may include any suitable structure for controlling, regulating, filtering, or otherwise modifying the flow through the purge inlet 106, such as a valve, check valve, filter, or the like. The purge gas received at the purge inlet 106 can be any suitable gas for purging the internal space of the photolithography substrate container, such as clean dry air (CDA), ultra-clean dry air (XCDA), nitrogen, inert gas, or the like. The purge inlet 106 may be positioned such that it is outside the photolithography substrate receiving space 112. The purge inlet 106 can be positioned so that it is separated from the photolithography substrate accommodating space 112 by multiple baffles 110.

[0026] The purge outlet 108 is an outlet that allows purge gas to exit the internal space of the photolithography substrate container 100. The purge outlet 108 can be any suitable structure configured to allow purge gas to exit, such as an opening, port, interface, or the like. The purge outlet 108 can be located on at least one of the first housing portion 102 and / or the second housing portion 104. In an embodiment, the purge outlet 108 is located on the same portion of the first housing portion 102 or the second housing portion 104 on which the purge inlet 106 is provided. In an embodiment, the purge outlet 108 is located on the one of the first housing portion 102 or the second housing portion 104 opposite to the purge inlet 106. The purge outlet 108 can include any suitable structure for controlling, regulating, or otherwise modifying the flow exiting the photolithography substrate container 100 through the purge outlet 108, such as a valve, check valve, or the like. The purge outlet 108 can be positioned such that it is outside the photolithography substrate receiving space 112. In an embodiment, the purge outlet 108 may be located on the side of the photolithography substrate accommodating space 112 opposite to the purge inlet 106, such that the photolithography substrate in the photolithography substrate accommodating space will be placed between the purge inlet 106 and the purge outlet 108.

[0027] like Figure 1As shown, each of the baffles 110 extends from the second housing portion 104. In an alternative embodiment, each of the baffles 110 may instead extend from the first housing portion 102. The baffles 110 are any suitable baffles configured to guide, deflect, regulate, or otherwise influence the purge gas flow from the purge inlet 106 to achieve desired flow characteristics within the photolithography substrate containment space 112. The baffles 110 may be disposed in one or more rows extending across the interior space of the photolithography substrate container 100. The baffles 110 may have any suitable profile, such as rectangular or trapezoidal in the front view, as... Figure 4A and 4B As shown in the diagram and described below, the baffle 110 may be curved or planar. The baffle 110 may be generally perpendicular or angled relative to the direction of purge gas flow from purge inlet 106 to purge outlet 108. The baffle 110 may have any suitable spacing to achieve the desired flow characteristics, such as uniform spacing, gaps of different sizes between adjacent baffles based on the positions of adjacent baffles, or the like. The spacing of the baffles 110 may be further based on the ability to dry the photolithography substrate container 100 after washing it, for example by having a gap of at least one-eighth (1 / 8) inch between adjacent baffles 110.

[0028] The photolithography substrate accommodating space 112 is part of the internal space of a photolithography substrate container 100 configured to accommodate at least one photolithography substrate (e.g., a photomask, thin film, combination thereof, or the like). The photolithography substrate accommodating space 112 is a continuous space, sized to accommodate at least one photolithography substrate, and configured such that any component of the photolithography substrate container 100 does not interfere with the photolithography substrate when it is located within the photolithography substrate accommodating space 112. In an embodiment, the photolithography substrate accommodating space 112 is defined on one side by a plurality of baffles 110. In an embodiment, the photolithography substrate accommodating space 112 is located on the side of the plurality of baffles 110 opposite to the purge inlet 106. In an embodiment, the photolithography substrate accommodating space 112 is positioned between the plurality of baffles 110 and the purge outlet 108. In an embodiment, the photolithography substrate accommodating space 112 includes one or more suitable supports or holders for supporting and / or holding the photolithography substrate within the photolithography substrate accommodating space 112.

[0029] Figure 2 A photolithography substrate container according to an embodiment is shown. The photolithography substrate container 200 includes a first housing portion 202 and a second housing portion 204. The photolithography substrate container further includes a purge inlet 206, a purge outlet 208, and a plurality of baffles 220. The photolithography substrate container 200 defines a photolithography substrate receiving space 212.

[0030] The photolithography substrate container 200 is a container configured to hold a photolithography substrate (e.g., a thin film, a photomask, a combination thereof, or the like). In an embodiment, the photolithography substrate container 200 is a thin film container, such as a thin film transport container. In an embodiment, the photolithography substrate container 200 is a photomask container, such as an extreme ultraviolet (EUV) photomask cassette.

[0031] The first housing portion 202 is a part of the photolithography substrate container 100 that partially defines the internal space of the photolithography substrate container 100. The first housing portion 102 may be, for example, a piece of a thin film container (e.g., a clamshell portion of the thin film container), a cover of a photomask, a dome of a photomask, or any other suitable portion of the photolithography substrate container.

[0032] The second housing portion 204 is another portion of the photolithography substrate container 202 configured to combine with the first housing portion 202 to form at least a portion of the photolithography substrate container 200. The second housing portion 204 may be, for example, a piece of a thin film container (e.g., another clamshell portion of the thin film container), the base plate of a photomask box, the door of a photomask box, or any other suitable portion of the photolithography substrate container.

[0033] The purge inlet 206 is an inlet that allows purge gas to be introduced into the internal space of the photolithography substrate container 200. The purge inlet 206 can be any suitable structure configured to allow the introduction of purge gas, such as an opening, port, interface, or the like. The purge inlet may be located on at least one of the first housing portion 202 and / or the second housing portion 204. In embodiments, the purge inlet 206 may include any suitable structure for controlling, regulating, filtering, or otherwise modifying the flow through the purge inlet 206, such as a valve, check valve, filter, or the like. The purge gas received at the purge inlet 206 can be any suitable gas for purging the internal space of the photolithography substrate container, such as clean dry air (CDA), ultra-clean dry air (XCDA), nitrogen, inert gas, or the like. The purge inlet 206 may be positioned such that it is outside the photolithography substrate receiving space 212. The purge inlet 206 can be positioned so that it is separated from the photolithography substrate accommodating space 212 by multiple baffles 210.

[0034] The purge outlet 208 is an outlet that allows purge gas to exit the internal space of the photolithography substrate container 200. The purge outlet 208 can be any suitable structure configured to allow purge gas to exit, such as an opening, port, interface, or the like. The purge outlet 208 can be located on at least one of the first housing portion 202 and / or the second housing portion 204. In an embodiment, the purge outlet 208 is located on the same portion of the first housing portion 202 or the second housing portion 204 on which the purge inlet 206 is disposed. In an embodiment, the purge outlet 208 is located on the one of the first housing portion 202 or the second housing portion 204 opposite to the purge inlet 206. The purge outlet 208 can include any suitable structure for controlling, regulating, or otherwise modifying the flow exiting the photolithography substrate container 200 through the purge outlet 208, such as a valve, check valve, or the like. The purge outlet 208 can be positioned such that it is outside the photolithography substrate receiving space 212. In an embodiment, the purge outlet 208 may be located on the side of the photolithography substrate accommodating space 212 opposite to the purge inlet 206, such that the photolithography substrate in the photolithography substrate accommodating space will be placed between the purge inlet 206 and the purge outlet 208.

[0035] Baffle 210 is disposed on both the first housing portion 202 and the second housing portion 204, wherein... Figure 2 In the embodiment shown, some baffles 210 extend from the first housing portion 202 and other baffles 210 extend from the second housing portion 204. The baffles 210 may be any suitable baffle configured to guide, deflect, regulate, or otherwise influence the purge gas flow from the purge inlet 206 to achieve desired flow characteristics within the photolithography substrate containment space 212. The baffles 210 may be disposed in one or more rows extending across the internal space of the photolithography substrate container 200. The baffles 210 may have any suitable profile, such as rectangular or trapezoidal in the front view, as... Figure 4A and 4BAs shown in the diagram and described below. The baffle 210 may be curved or planar. The baffle 210 may be generally perpendicular or angled relative to the direction of purge gas flow from purge inlet 206 to purge outlet 208. The baffle 210 may have any suitable spacing to achieve the desired flow characteristics, such as uniform spacing, gaps of different sizes between adjacent baffles based on their positions, or the like. The spacing of the baffles 210 disposed on the same one in the first housing portion 202 or the second housing portion 204 may be further based on the ability to dry the photolithography substrate container after washing it, for example by having a gap of at least one-eighth (1 / 8) inch between the baffles disposed on one of the first housing portion 202 or the second housing portion 204. It should be understood that the baffles 210 may protrude alternately from the first housing portion 202 and the second housing portion 204 to allow a larger gap between adjacent baffles on one of the first housing portion 202 or the second housing portion 204 when the container is opened for drying, compared to the size of the gap between adjacent baffles when the first housing portion 202 and the second housing portion 204 are closed together.

[0036] The photolithography substrate accommodating space 212 is part of the internal space of a photolithography substrate container 200 configured to accommodate at least one photolithography substrate (e.g., a photomask, thin film, combination thereof, or the like). The photolithography substrate accommodating space 212 is a continuous space, sized to accommodate at least one photolithography substrate, and configured such that any component of the photolithography substrate container 200 does not interfere with the photolithography substrate when it is located within the photolithography substrate accommodating space 212. In one embodiment, the photolithography substrate accommodating space 212 is defined on one side by a plurality of baffles 210. In one embodiment, the photolithography substrate accommodating space 212 is located on the side of the plurality of baffles 210 opposite to the purge inlet 206. In one embodiment, the photolithography substrate accommodating space 212 is positioned between the plurality of baffles 210 and the purge outlet 108. In one embodiment, the photolithography substrate accommodating space 212 includes one or more suitable supports or holders for supporting and / or holding the photolithography substrate within the photolithography substrate accommodating space 212.

[0037] Figure 3 A photolithography substrate container according to an embodiment is shown. The photolithography substrate container 300 includes a first housing portion 302 and a second housing portion 304. The photolithography substrate container further includes a purge inlet 306, a purge outlet 308, and an insert interface 310. The photolithography substrate container 300 further includes an insert 312, which includes a plurality of baffles 314. The photolithography substrate container 300 defines a photolithography substrate receiving space 316.

[0038] The photolithography substrate container 300 is a container configured to hold a photolithography substrate (e.g., a thin film, a photomask, a combination thereof, or the like). In an embodiment, the photolithography substrate container 300 is a thin film container, such as a thin film transport container. In an embodiment, the photolithography substrate container 300 is a photomask container, such as an extreme ultraviolet (EUV) photomask cassette.

[0039] The first housing portion 302 is a part of the photolithography substrate container 100 that partially defines the internal space of the photolithography substrate container 100. The first housing portion 102 may be, for example, a piece of a thin film container (e.g., a clamshell portion of the thin film container), a cover of a photomask, a dome of a photomask, or any other suitable portion of the photolithography substrate container.

[0040] The second housing portion 304 is another part of the photolithography substrate container 300 configured to combine with the first housing portion 302 to form at least a portion of the photolithography substrate container 302. The second housing portion 304 may be, for example, a piece of a thin film container (e.g., another clamshell portion of the thin film container), the base plate of a photomask box, the door of a photomask box, or any other suitable portion of the photolithography substrate container.

[0041] The purge inlet 306 is an inlet that allows purge gas to be introduced into the internal space of the photolithography substrate container 300. The purge inlet 306 can be any suitable structure configured to allow the introduction of purge gas, such as an opening, port, interface, or the like. The purge inlet may be located on at least one of the first housing portion 302 and / or the second housing portion 304. In embodiments, the purge inlet 306 may include any suitable structure for controlling, regulating, filtering, or otherwise modifying the flow through the purge inlet 306, such as a valve, check valve, filter, or the like. The purge gas received at the purge inlet 306 can be any suitable gas for purging the internal space of the photolithography substrate container, such as clean dry air (CDA), ultra-clean dry air (XCDA), nitrogen, inert gas, or the like. The purge inlet 306 may be positioned such that it is outside the photolithography substrate receiving space 312. The purge inlet 306 can be positioned so that it is separated from the photolithography substrate accommodating space 312 by multiple baffles 310.

[0042] A purge outlet 308 is an outlet that allows purge gas to exit the internal space of the photolithography substrate container 300. The purge outlet 308 can be any suitable structure configured to allow purge gas to exit, such as an opening, port, interface, or the like. The purge outlet 308 can be located on at least one of the first housing portion 302 and / or the second housing portion 304. In an embodiment, the purge outlet 308 is located on the same portion of the first housing portion 302 or the second housing portion 304 on which a purge inlet 306 is provided. In an embodiment, the purge outlet 308 is located on the first housing portion 302 or the second housing portion 304 opposite to the purge inlet 306. The purge outlet 308 can include any suitable structure for controlling, regulating, or otherwise modifying the flow exiting the photolithography substrate container 300 through the purge outlet 308, such as a valve, check valve, or the like. The purge outlet 308 can be positioned such that it is outside the photolithography substrate receiving space 312. In an embodiment, the purge outlet 308 may be located on the side of the photolithography substrate receiving space 316 opposite to the purge inlet 306, such that the photolithography substrate in the photolithography substrate receiving space will be placed between the purge inlet 306 and the purge outlet 308.

[0043] The insert interface 310 is a feature configured to retain the insert 312 formed on one or both of the first housing portion 302 and / or the second housing portion 304. The insert interface may be any suitable mechanical interface capable of allowing attachment of the insert 312, such as one or more recesses, channels or other recesses configured to receive one or more portions of the insert 312, slots, tabs, posts or other protrusions configured to be received by the insert 312, or the like.

[0044] Insert 312 is configured to be secured to the first housing portion 302 and / or the second housing portion 304 such that the photolithography substrate container 300 can be closed to receive insert 312. Insert 312 may include any suitable features for attachment to the photolithography substrate container 300 at insert interface 310. Insert 312 may include, for example, one or more protrusions (e.g., slots, tabs, pillars, or the like) configured to be received in recesses, channels, or other recesses provided in insert interface 310, or one or more suitable recesses, channels, or other recesses configured to receive protrusions provided on insert interface 310. Insert 312 is configured to provide a baffle 314 within the photolithography substrate container 300, for example, between purge inlet 306 and photolithography substrate receiving space 316.

[0045] exist Figure 3In the embodiment shown, baffle 314 is included in insert 312. Baffle 314 is any suitable baffle configured to guide, deflect, regulate, or otherwise influence the purge gas flow from purge inlet 306 to achieve desired flow characteristics within the photolithography substrate containment space 316. Baffle 314 may be disposed in one or more rows extending across the internal space of the photolithography substrate container 300. Baffle 314 may have any suitable profile, such as rectangular or trapezoidal in front view, as... Figure 4A and 4B As shown in the diagram and described below, the baffle 314 may be curved or flat. The baffle 314 may be generally perpendicular or angled relative to the direction of purge gas flow from purge inlet 306 to purge outlet 308. The baffle 314 may have any suitable spacing to achieve the desired flow characteristics, such as uniform spacing, gaps of different sizes between adjacent baffles based on the position of adjacent baffles, or the like. The spacing of the baffles 314 may be further based on the ability to dry the insert 312 after washing, for example by having a gap of at least one-eighth (1 / 8) inch between adjacent baffles 314.

[0046] The photolithography substrate accommodating space 316 is part of the internal space of a photolithography substrate container 300 configured to accommodate at least one photolithography substrate (e.g., a photomask, thin film, combination thereof, or the like). The photolithography substrate accommodating space 316 is a continuous space, sized to accommodate at least one photolithography substrate, and configured such that any component of the photolithography substrate container 300 does not interfere with the photolithography substrate when it is located within the photolithography substrate accommodating space 316. In an embodiment, the photolithography substrate accommodating space 316 is defined on one side by the insert interface 310 and / or the insert 312 when the insert 312 is attached to the photolithography substrate container 300. In an embodiment, the photolithography substrate accommodating space 316 is located on the side of a plurality of baffles 314 opposite to the purge inlet 306. In an embodiment, the photolithography substrate accommodating space 316 is positioned between the plurality of baffles 314 and the purge outlet 308. In an embodiment, the photolithography substrate receiving space 316 includes one or more suitable supports or holders for supporting and / or holding the photolithography substrate within the photolithography substrate receiving space 316.

[0047] Figure 4A Multiple baffles according to embodiments are shown. Figure 4A The image shows a front view of multiple baffles. Each of the baffles 402 has a rectangular outline, i.e., when in... Figure 4A It appears rectangular in the front view shown. Figure 4AA gap 404 is provided between each of the baffles 402 shown. The gaps 404 may have a uniform width along their height. In embodiments, the gaps 404 are sized to facilitate drying of the container containing the baffles 402 after washing, for example by making each gap 404 at least one-eighth (1 / 8”) inch wide. In embodiments, this spacing of the gaps is provided when all the baffles 402 extend from the same container housing portion. In embodiments where the baffles 402 extend alternately from opposite container housing portions (e.g., as described above),... Figure 2 As shown in the diagram, when the container is closed, the gap 404 between adjacent baffles 402 can be adjusted in size regardless of water buildup. For example, when the container is closed, the width of the gap 404 between the baffles 402 can be less than one-eighth (1 / 8”) inch. The width of the gap 404 can be selected based on the desired flow characteristics within the container containing the baffles 402. In embodiments, the width of the gap 404 can be varied along the length of a row of baffles 402, for example, based on the distance of a particular baffle 402 from the centerline of the container, the distance from the purge inlet, or any other suitable basis for selecting the adjustment size of the gap 404 to achieve the desired flow conditions within the container containing the baffles 402.

[0048] Figure 4B Multiple baffles according to embodiments are shown. Figure 4B Multiple baffles according to embodiments are shown. Figure 4B The image shows a front view of multiple baffles. Each of the baffles 412 has a trapezoidal profile, i.e., when in... Figure 4B It appears trapezoidal in the front view shown in the image. Figure 4B A gap 414 is provided between each of the baffles 412 shown. Due to the trapezoidal shape of the baffles 412, the gaps 414 may have a varying width along their height. In embodiments, the gaps 414 are sized to facilitate drying of the container containing the baffles 412 after washing, for example by making each gap 414 at least one-eighth (1 / 8”) inch wide where the baffles 412 meet the container shell portion to which they are attached. In embodiments, this spacing of the gaps is provided when all the baffles 412 extend from the same container shell portion. In embodiments where the baffles 412 extend alternately from opposite container shell portions (e.g., as described above), Figure 2As shown in the diagram, when the container is closed, the gap 414 between adjacent baffles 412 can be adjusted in size regardless of water buildup effects. For example, when the container is closed, the gap 414 between the baffles 412 includes at least a portion in which the width of the gap 414 is less than one-eighth (1 / 8”) inch. The width of the gap 414 can be selected based on the desired flow characteristics within the container containing the baffles 412. In embodiments, the width of the gap 414 can be varied along the length of a row of baffles 412, for example, based on the distance of a particular baffle 412 from the centerline of the container, the distance from the purge inlet, or any other suitable basis for selecting the adjustment size of the gap 414 to achieve the desired flow conditions within the container containing the baffles 412.

[0049] Figure 5A A portion of a photolithography substrate container 500 according to an embodiment is shown. In the container housing portion 502, a plurality of baffles 504 are disposed between the purge inlet 506 and the photolithography substrate receiving region 508. Figure 5A As shown, multiple baffles are disposed in multiple rows extending across the container housing portion 502. The multiple rows of baffles 504 are offset such that gaps 510a disposed in the first row of baffles are not aligned with gaps 510b disposed in the second row of baffles, as defined by the horizontal axis direction X relative to the container housing portion 502. The photolithography substrate container 500 further includes a purge outlet 512.

[0050] Figure 5B A portion of a photolithography substrate container 520 according to an embodiment is shown. In the container housing portion 522, a plurality of baffles 524 are disposed between the purge inlet 526 and the photolithography substrate receiving region 528. Figure 5B As shown, at least some of the baffles are angled relative to the horizontal axis direction X of the container housing portion 522, wherein the angle is an angle other than parallel or perpendicular. In an embodiment, all the various baffles 524 within the plurality of baffles 524 are angled such that they have the same angle relative to the horizontal axis direction X of the container housing portion 522. In an embodiment, the various baffles 524 within the plurality of baffles 524 may have different angles relative to the horizontal axis direction X of the container housing portion 522. For example, the angle may be varied based on the distance of a particular baffle 524 from the centerline of the container housing portion 522, based on the distance of a particular baffle 524 from the purge inlet 526, or any other suitable basis for selecting the angle that enables the desired flow characteristics to be achieved within the container containing the container housing portion 522. In an embodiment, the plurality of baffles 524 are oriented such that there is no angle relative to the horizontal axis direction X of the container housing portion 522. The photolithography substrate container 520 further includes an outlet 530.

[0051] aspect :

[0052] It should be understood that any of aspects 1 to 8 may be combined with any of aspects 9 to 16 or 17 to 20. It should be understood that any of aspects 9 to 16 may be combined with any of aspects 17 to 20.

[0053] Aspect 1. A photolithographic substrate container, comprising:

[0054] First shell portion;

[0055] Purge inlet;

[0056] Blow out the outlet;

[0057] The second housing portion defines a photolithography substrate receiving space configured to receive a photolithography substrate.

[0058] Multiple baffles are configured to be positioned between the purge inlet and the photolithography substrate receiving space when the first housing portion and the second housing portion are closed together.

[0059] Aspect 2. The photolithographic substrate container according to aspect 1, wherein at least some of the plurality of baffles are integrally formed with the first housing portion.

[0060] Aspect 3. The photolithographic substrate container according to any one of aspects 1 to 2, wherein at least some of the plurality of baffles are integrally formed with the second housing portion.

[0061] Aspect 4. A photolithographic substrate container according to any one of aspects 1 to 3, wherein at least some of the plurality of baffles are disposed in an insert configured to engage with at least one of the first housing portion and the second housing portion.

[0062] Aspect 5. A photolithographic substrate container according to any one of aspects 1 to 4, wherein the plurality of baffles are disposed in a plurality of rows.

[0063] Aspect 6. A photolithographic substrate container according to any one of aspects 1 to 4, wherein the plurality of baffles are arranged in a single row.

[0064] Aspect 7. A photolithographic substrate container according to any one of aspects 1 to 6, wherein at least some of the plurality of baffles have a rectangular profile.

[0065] Aspect 8. A photolithographic substrate container according to any one of aspects 1 to 7, wherein at least some of the plurality of baffles have a trapezoidal profile.

[0066] Aspect 9. A film container comprising:

[0067] First shell portion;

[0068] Purge inlet;

[0069] Blow out the outlet;

[0070] The second housing portion, the first housing portion and the second housing portion define a film receiving space configured to receive a film; and

[0071] Multiple baffles are configured to be positioned between the purge inlet and the membrane receiving space when the first housing portion and the second housing portion are closed together.

[0072] Aspect 10. The film container according to aspect 9, wherein at least some of the plurality of baffles are integrally formed with the first housing portion.

[0073] Aspect 11. The film container according to any one of aspects 9 to 10, wherein at least some of the plurality of baffles are integrally formed with the second housing portion.

[0074] Aspect 12. A film container according to any one of aspects 9 to 11, wherein at least some of the plurality of baffles are disposed in an insert configured to engage with at least one of the first housing portion and the second housing portion.

[0075] Aspect 13. A film container according to any one of aspects 9 to 12, wherein the plurality of baffles are arranged in a plurality of rows.

[0076] Aspect 14. A membrane container according to any one of aspects 9 to 12, wherein the plurality of baffles are arranged in a single row.

[0077] Aspect 15. A film container according to any one of aspects 9 to 14, wherein at least some of the plurality of baffles have a rectangular profile.

[0078] Aspect 16. A film container according to any one of aspects 9 to 15, wherein at least some of the plurality of baffles have a trapezoidal profile.

[0079] Aspect 17. A method of purging a membrane container, comprising receiving a flow of purge gas at a purge inlet of the membrane container, guiding the purge gas through a plurality of baffles into a membrane containment space of the membrane container, and guiding the purge gas out of the membrane container through a purge gas outlet of the membrane container.

[0080] Aspect 18. The method of aspect 17 further includes attaching an insert comprising at least some of the plurality of baffles into the film container.

[0081] Aspect 19. The method according to any one of aspects 17 to 18 further includes placing the film into the film receiving space.

[0082] Aspect 20. The method according to any one of aspects 17 to 19 further includes cleaning the film container with water and drying the film container after the cleaning.

[0083] The examples disclosed in this application should be considered illustrative rather than restrictive in all respects. The scope of the invention is indicated by the appended claims rather than by the foregoing description; and all variations within the equivalent meaning and scope of the claims are intended to be covered therein.

Claims

1. A photolithographic substrate container, comprising: First shell portion; Purge inlet; Blow out the outlet; The second housing portion defines a photolithography substrate receiving space configured to receive a photolithography substrate. and Multiple baffles are configured to be positioned between the purge inlet and the photolithography substrate receiving space when the first housing portion and the second housing portion are closed together.

2. The photolithography substrate container according to claim 1, wherein at least some of the plurality of baffles are integrally formed with the first housing portion.

3. The photolithography substrate container according to claim 1, wherein at least some of the plurality of baffles are integrally formed with the second housing portion.

4. The photolithography substrate container of claim 1, wherein at least some of the plurality of baffles are disposed in inserts configured to engage with at least one of the first housing portion and the second housing portion.

5. The photolithography substrate container according to claim 1, wherein the plurality of baffles are disposed in the plurality of rows.

6. The photolithography substrate container of claim 1, wherein the plurality of baffles are arranged in a single row.

7. The photolithography substrate container of claim 1, wherein at least some of the plurality of baffles have a rectangular profile.

8. The photolithography substrate container according to claim 1, wherein at least some of the plurality of baffles have a trapezoidal profile.

9. A film container comprising: First shell portion; Purge inlet; Blow out the outlet; The second housing portion, the first housing portion and the second housing portion define a film receiving space configured to receive a film; and Multiple baffles are configured to be positioned between the purge inlet and the membrane receiving space when the first housing portion and the second housing portion are closed together.

10. The film container of claim 9, wherein at least some of the plurality of baffles are integrally formed with the first housing portion.

11. The film container of claim 9, wherein at least some of the plurality of baffles are integrally formed with the second housing portion.

12. The film container of claim 9, wherein at least some of the plurality of baffles are disposed in inserts configured to engage with at least one of the first housing portion and the second housing portion.

13. The film container of claim 9, wherein the plurality of baffles are disposed in a plurality of rows.

14. The film container of claim 9, wherein the plurality of baffles are arranged in a single row.

15. The film container of claim 9, wherein at least some of the plurality of baffles have a rectangular profile.

16. The film container of claim 9, wherein at least some of the plurality of baffles have a trapezoidal profile.

17. A method for purging a membrane container, comprising receiving a flow of purge gas at a purge inlet of the membrane container, guiding the purge gas through a plurality of baffles into a membrane containment space of the membrane container, and guiding the purge gas out of the membrane container through a purge gas outlet of the membrane container.

18. The method of claim 17, further comprising attaching an insert comprising at least some of the plurality of baffles into the film container.

19. The method of claim 17, further comprising placing the film into the film receiving space.

20. The method of claim 17, further comprising cleaning the film container with water and drying the film container after the cleaning.

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