Punching method and punching device for inner layer plate

Abstract

The application discloses a punching method and a punching device for an inner layer plate. The punching method comprises the following steps: a control system receives size information of an inner layer plate to be processed and a target punching type, automatically calculates a punching number and identifies a punching pin to be avoided, controls a punching pin moving mechanism to drive the punching pin to move to a preset avoiding station, controls a punching pin switching mechanism to drive a target punching pin to switch to a working station, then, the control system performs position compensation on the inner layer plate according to target position information on the inner layer plate, calculates actual punching coordinates of a target punching hole, and controls the punching pin moving mechanism to drive the target punching pin to move to the actual punching coordinates, and finally, a top punch is controlled to descend and a lower die is controlled to close to perform a punching action. The application realizes automatic switching of a punching pin type, automatic avoidance and automatic punching on the same punching device, thereby achieving the technical effects of reducing equipment cost, improving production efficiency and site utilization.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and more specifically, to a punching method and punching apparatus for an inner layer board. Background Technology

[0002] In the manufacturing process of printed circuit boards (PCBs), after the etching process is completed, the inner layer circuit boards typically require OPE (Post-Etch Punch) equipment to punch out PIN holes or rivet holes for lamination positioning, ensuring the interlayer alignment accuracy of subsequent multilayer lamination processes. In existing production processes, the following two methods are commonly used for processing different hole types (such as round holes or slot holes): Firstly, replacing the punch on the same OPE punching machine. This operation requires stopping the machine and manually performing a tedious disassembly and assembly process. The specific steps include: first, removing the punch holder, then using an Allen wrench to remove the punch cover, then replacing it with a punch of the corresponding hole type, then using an Allen wrench to tighten the punch cover again, and finally reinstalling the punch holder back into place.

[0003] Secondly, multiple machines are used for processing, namely two OPE punching machines with different configurations (or pre-set different punches) are used, one for punching round holes and the other for punching slotted holes.

[0004] However, the aforementioned existing technologies all have significant limitations in production practice. Using a single machine for frequent punch replacement is not only time-consuming and labor-intensive, significantly increasing non-productive time and reducing equipment efficiency, but also prone to introducing installation errors due to manual mold assembly and disassembly, making it difficult to guarantee the stability of processing accuracy. While using multiple dedicated machines for separate processing avoids the time spent replacing punches, it requires additional equipment purchases, significantly increasing the company's equipment investment costs and occupying valuable factory space. Furthermore, the flow of multiple machines increases the complexity of handling semi-finished products and production management. Therefore, an improved technical solution that overcomes these shortcomings is urgently needed. Summary of the Invention

[0005] The main objective of this application is to provide a punching method and punching device for inner layer plates, so as to solve the technical problems in the prior art that require manual disassembly and assembly when changing punches of different hole types, which is time-consuming and labor-intensive, or require the purchase of multiple machines, resulting in high costs and large space occupation. The application realizes the technical effect of automatically switching punch types, automatically avoiding obstacles and automatically punching on the same punching device, thereby reducing equipment costs, improving production efficiency and space utilization.

[0006] To achieve the above objectives, this application provides the following technical solution: According to one aspect of this application, a punching method for an inner layer plate is provided, comprising the following steps: Step S1: The control system receives the size information of the inner layer plate to be processed and the target punching type, and determines the minimum moving distance of the punch according to a preset correspondence between the punching type and the minimum moving distance; Step S2: The control system calculates the number of target punches according to the size information, and determines the punches that need to be avoided accordingly; Step S3: The control system sends an avoidance movement command to the punch moving mechanism corresponding to the punch that needs to be avoided, so as to drive the punch that needs to be avoided to move to a preset avoidance station; Step S4: The control system switches to the punch corresponding to the target punch. The mechanism sends a punch switching command to drive the target punch to switch to the working position; Step S5: The target position information on the inner layer plate is obtained through the vision positioning component, and the control system performs position compensation on the inner layer plate according to the target position information, and calculates the actual punching coordinates of the target punching hole after the compensation is completed; Step S6: The control system sends a working movement command to the punch moving mechanism corresponding to the target punch to drive the target punch to move to the actual punching coordinates; and controls the upper die to move down and close with the lower die to perform the punching action.

[0007] Preferably, in step S1, determining the minimum moving distance of the punch according to the preset correspondence between the punching type and the minimum moving distance includes: obtaining the hole feature parameters of the target punching type, wherein the hole feature parameters characterize the width of the slotted hole and / or the diameter of the circular hole; and determining the minimum moving distance of the punch according to the preset mapping relationship between the hole feature parameters and the minimum moving distance.

[0008] Preferably, in step S2, the control system calculates the target number of punches based on the size information and determines the punches to be avoided accordingly, including: acquiring preset plate frame template data, the plate frame template data representing the distances of a plurality of punch positions pre-arranged in the short and long directions at maximum configuration relative to the center of the plate frame template, and the hole layout of the plate frame template adapting to the hole layout of the lower die; acquiring the long side dimension and short side dimension from the size information; comparing the long side dimension with a preset long side dimension threshold and comparing the short side dimension with a preset short side dimension threshold; determining the target number of punches for the inner layer plate in the short and long directions from the plurality of punch positions in the plate frame template according to the comparison result; and identifying the punches corresponding to the punch positions in the plate frame template that exceed the target number of punches as the punches to be avoided.

[0009] Preferably, based on the comparison results, determining the target number of punched holes in the inner layer plate in the short side direction and the long side direction from the plurality of punched hole positions of the plate frame template includes: when the long side dimension is less than a first preset threshold, arranging a first number of punched hole positions in the short side direction of the inner layer plate according to the plate frame template; when the long side dimension is greater than or equal to the first preset threshold, arranging a second number of punched hole positions in the short side direction of the inner layer plate according to the plate frame template; the second number is greater than the first number; when the long side dimension is greater than or equal to the first preset threshold, further comparing the long side dimension with a second preset threshold of the long side dimension threshold; if the If the long side dimension is less than the second preset threshold, then a fourth number of punched holes are arranged in the long side direction of the inner layer plate according to the plate frame template; if the long side dimension is greater than or equal to the second preset threshold, then the hole arrangement of the inner layer plate in the long side direction is determined according to the relationship between the short side dimension and the third preset threshold of the short side dimension: when the short side dimension is greater than or equal to the third preset threshold, a third number of punched holes are arranged in the long side direction of the inner layer plate according to the plate frame template; when the short side dimension is less than the third preset threshold, the fourth number of punched holes are arranged in the long side direction of the inner layer plate according to the plate frame template; the third number is greater than the fourth number.

[0010] Preferably, in step S4, the control system sends a punch switching command to the punch switching mechanism corresponding to the target punch to drive the target punch to switch to the working position, including: the control system generating the punch switching command according to the target punch type; in response to the punch switching command, the punch switching mechanism performs a switching action to drive the target punch to extend to the working position, and simultaneously drive the remaining punches in the punch switching mechanism to retract; wherein, the punch switching mechanism is equipped with at least two punches, and the target punch is one of the at least two punches that matches the target punch type.

[0011] Preferably, in step S5, the step of obtaining the target position information on the inner layer plate through the visual positioning component, and the control system performing position compensation on the inner layer plate according to the target position information, includes: the visual positioning component obtaining the target position information on the inner layer plate and sending the target position information to the control system; the target position information characterizes the offset distance of the target relative to the center line of the inner layer plate; the control system calculates the pose deviation between the target center coordinates of the inner layer plate and the preset device center coordinates according to the target position information, and generates a compensation command accordingly and sends it to the position compensation mechanism; the compensation command includes X-axis coordinate compensation amount, Y-axis coordinate compensation amount, and angle compensation amount; the position compensation mechanism responds to the compensation command by driving the inner layer plate to perform translation and rotation actions to eliminate the pose deviation and align the target center coordinates with the device center coordinates.

[0012] Preferably, in step S5, calculating the actual punching coordinates of the target punching hole after compensation includes: obtaining the hole layout parameters of the plate frame template in a preset equipment coordinate system; the hole layout parameters represent the offset distance of each preset punching hole relative to the center line of the short side and the center line of the long side of the plate frame template; the hole layout parameters represent the offset distance of each preset punching hole relative to the center line of the short side and the center line of the long side of the plate frame template; using the equipment center coordinates as a reference, combined with the target position information and the hole layout parameters, calculating the actual punching coordinates of the target punching hole in the equipment coordinate system.

[0013] According to another aspect of this application, a punching device for an inner layer plate is provided, comprising: a punching execution assembly including a plurality of upper dies and a lower die disposed opposite to the upper dies; the upper dies are provided with at least two punches, and a punch switching mechanism and a punch moving mechanism; the punch switching mechanism is used to drive the punches to switch, and the punch moving mechanism is used to drive the punches to move to an avoidance station or a punching station; a control system is communicatively connected to the punch switching mechanism and the punch moving mechanism respectively; the control system is configured to: A clearance movement command or a working movement command is sent to the punch moving mechanism to drive the punch to move to the clearance station or the punching station; and a punch switching command is sent to the punch switching mechanism to drive the punch to extend to the working station; wherein, the lower die base of the lower die is pre-machined with a plurality of punching holes and clearance holes adapted to all punching types in the maximum configuration; the plurality of punching holes are located at the punching station, the clearance holes are located at the clearance station, and the clearance station is located outside the punching station.

[0014] Preferably, the punch switching mechanism includes: a linear drive mechanism; a switching top seat, which is connected to the linear drive mechanism via a push rod; the switching top seat is disposed on the top of the punch and slides in cooperation with the punch, and a first abutting surface and a second abutting surface are arranged adjacent to each other at different heights along the extension and retraction direction of the push rod on the switching top seat, and the first abutting surface and the second abutting surface are connected by an inclined surface; when the linear drive mechanism drives the push rod to extend and retract, the first abutting surface and the second abutting surface alternately abut against the punch: when the first abutting surface abuts against the punch, the punch is driven to move downward; when the second abutting surface abuts against the punch, the punch moves upward.

[0015] Preferably, the punch switching mechanism further includes: a punch seat, wherein at least two punch slots are provided in the punch seat, the top of the punch in each punch slot passes through the punch slot and abuts against the first abutting surface or the second abutting surface, and the bottom of the punch passes through the punch slot and extends into the protective sleeve; when the first abutting surface abuts against the punch, the punch overcomes the elastic force of the spring in the protective sleeve and extends out of the protective sleeve; when the second abutting surface abuts against the punch, under the restoring force of the spring in the protective sleeve, the punch retracts into the protective sleeve; the switching top seat is configured such that when one of the at least two punches abuts against the first abutting surface, the other abuts against the second abutting surface.

[0016] The technical solution provided in this application may include the following beneficial effects: 1) This application integrates several upper punches and matching lower dies on a punching device, and configures punches for processing different hole types on each upper punch; the control system commands the punch switching mechanism to perform the switching action, which not only makes the operation convenient, but also greatly reduces the equipment procurement cost and significantly improves production efficiency and site utilization. 2) For inner layer boards of different sizes, the control system can automatically calculate the target number of punches based on their size information and identify the punches that need to be avoided. It then automatically controls the punch moving mechanism to move the punches to the avoidance positions. This design eliminates the tedious process of manually disassembling punches, improving automation and production efficiency while effectively preventing punch breakage and reducing labor costs. 3) This application achieves full automation of the punching process: the system automatically calculates the number and position of punches based on the inner layer plate size, automatically performs punch avoidance, and automatically matches the minimum moving distance and completes punch switching according to the target hole shape. The entire process requires no manual intervention, completely eliminating the time loss of manually disassembling and assembling punches, while avoiding the risk of punch breakage due to human error; 4) This application has pre-set punching holes on several lower die bases to accommodate various hole types, which effectively overcomes the problem of decreased processing accuracy caused by frequent die changes or lower die adjustments during traditional inner layer plate punching. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application. In the drawings: Figure 1 This is a schematic diagram of the structure of a punching device for an inner layer plate according to this application; Figure 2 This is a top view of the punching device (upper punch lifting seat not shown) for the inner layer plate according to an embodiment of this application; Figure 3 A diagram showing the hole layout parameters of a plurality of punched holes preset for the plate frame template in this application embodiment; Figure 4 This is a schematic diagram of the structure of a lower mold base according to an embodiment of this application; Figure 5 This is a schematic diagram of a plate frame template according to an embodiment of this application; Figure 6 This is a schematic diagram showing the target number of punched holes, target punched hole type, and target punched hole position of an inner layer plate of one size according to an embodiment of this application. Figure 7 This is a schematic diagram of the structure of a punching unit according to an embodiment of this application; Figure 8 This is a schematic diagram of the structure of an upper punch die according to an embodiment of this application; Figure 9 This is a bottom view of an upper punch die according to an embodiment of this application; Figure 10 This is a schematic diagram of the structure of a punching switching mechanism according to an embodiment of this application; Figure 11 This is a schematic diagram of the push rod retracted state of a punching switching mechanism according to an embodiment of this application. Figure 12 This is a schematic diagram of the push rod extension state of a punching switching mechanism according to an embodiment of this application. Figure 13 A schematic diagram of a punch switching mechanism according to an embodiment of this application, showing a state of punch switching; Figure 14 This is another schematic diagram of the punch switching mechanism in an embodiment of this application, showing the punch switching process.

[0018] Explanation of reference numerals in the attached drawings: 1-Upper punch; 10-Upper punch lifting seat; 2-Lower die; 20-Base; 21-Lower die seat; 210-Allowing hole; 31-Punch seat slide; 31a-Positioning hole; 32-Punch seat; 33-Positioning pin; 41-Linear drive mechanism; 42-Switching top seat; 42a-First abutting surface; 42b-Second abutting surface; 42c-Inclined surface; 43-Round punch; 44-Slotted punch; 45-Protective sleeve; 51-Motor; 52-Drive shaft; 53-Drive nut. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0020] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0021] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0022] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0023] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linked," and "socketing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] This application provides a punching method and punching device for an inner layer plate, which solves the technical problems in the prior art that require manual disassembly and assembly when changing punches of different hole types, which is time-consuming and labor-intensive, or require the purchase of multiple machines, resulting in high costs and large space occupation. It realizes the technical effect of automatically switching punch types, automatically avoiding obstacles and automatically punching on the same punching device, thereby reducing equipment costs, improving production efficiency and space utilization.

[0025] The following detailed description of a punching method and punching apparatus for an inner layer plate according to specific embodiments of this application is provided below.

[0026] This embodiment provides a punching method for an inner layer plate, including the following steps: Step S1: The control system receives the size information of the inner layer plate to be processed and the target punching type, and determines the minimum moving distance of the punch according to the preset correspondence between the punching type and the minimum moving distance. Step S2: The control system calculates the target punch number based on the size information and determines the punches to be avoided accordingly; Step S3: The control system sends an avoidance movement command to the punch moving mechanism corresponding to the punch that needs to be avoided, so as to drive the punch that needs to be avoided to move to the preset avoidance position; Step S4: The control system sends a punch switching command to the punch switching mechanism corresponding to the target punch to drive the target punch to switch to the working position; Step S5: Obtain the target position information on the inner layer plate through the visual positioning component. The control system performs position compensation on the inner layer plate according to the target position information and calculates the actual punching coordinates of the target punching hole after the compensation is completed. Step S6: The control system sends a working movement command to the punch moving mechanism corresponding to the target punch to drive the target punch to move to the actual punching coordinates; and controls the upper die to move down and close with the lower die to perform the punching action.

[0027] This embodiment provides a punching device for an inner layer plate, including a punching execution component and a control system. The punching execution component includes a plurality of upper dies and a lower die disposed opposite to the upper dies. Each upper die has at least two punches, a punch switching mechanism, and a punch moving mechanism. The punch switching mechanism drives the at least two punches to switch positions, and the punch moving mechanism drives the punches to move to a clearance position or a punching position. The control system is communicatively connected to both the punch switching mechanism and the punch moving mechanism. The control system is configured to: send a clearance movement command or a working movement command to the punch moving mechanism to drive the punches to move to the clearance position or the punching position; and send a punch switching command to the punch switching mechanism to drive the punches to extend to the working position.

[0028] like Figure 1 and Figure 2 As shown, in a preferred embodiment, the punching execution assembly includes twenty upper punches 1 and twenty lower punches 2. The twenty upper punches 1 are mounted on the upper punch lifting seat 10, and the twenty lower punches 2 are mounted on the base 20. Each upper punch 1 is arranged opposite to one lower punch 2, forming an independent punching unit.

[0029] Each upper die 1 is equipped with two punches. During the punching operation, the control system first controls the punch switching mechanism to drive the target punch that matches the target punching type to extend to the working position. Then, the control system controls the upper die lifting seat 10 to descend, causing the target punch on the upper die 1 to insert into the corresponding punching hole of the lower die 2, thereby completing the punching action.

[0030] This embodiment, by setting twenty punching units, can achieve simultaneous processing of up to twenty holes in the inner layer plate. Specifically, as shown... Figure 2 As shown, the layout of the twenty punching units is adapted to the frame of the inner layer plate: seven punching units (i.e., seven upper punching dies 1 and seven lower punching dies 2) are arranged on each of the two long sides of the inner layer plate, which can punch up to seven holes in each long side direction; three punching units (i.e., three upper punching dies 1 and three lower punching dies 2) are arranged on each of the two short sides of the inner layer plate, which can punch up to three holes in each short side direction.

[0031] Corresponding to the two punches configured on the upper die 1, the lower die base 21 of the lower die 2 has two rows of pre-machined punch holes to accommodate different types of punching processes (e.g., Figure 4 The image shows both slotted and round holes. It should be noted that... Figure 4 The examples only use slotted holes and round holes. In actual applications, other types of punching holes can be pre-processed on the lower die holder 21 according to processing requirements.

[0032] Furthermore, to accommodate inner layer boards of different sizes, in this embodiment, the number of punching holes in both rows is pre-processed according to the maximum configuration, and the punching holes in each row are arranged at intervals along the movement direction of the punch. During actual processing, the control system compares the acquired inner layer board size information with the preset board frame template, and sends corresponding control commands to the punch moving mechanism based on the comparison results: for punches that need to be avoided, an avoidance movement command is sent to drive them to the avoidance station; for punches that need to be worked, a work movement command is sent to drive them to the punching station. Finally, the punches that have moved to the punching station are precisely inserted into the corresponding punching holes on the lower die base 21, thereby realizing the flexible adaptation of the equipment to different sized boards.

[0033] Specifically, in this embodiment, the control system can calculate the target number of punchable holes in the inner layer plate based on the size information of the inner layer plate. The specific steps include: obtaining preset plate frame template data, which represents the distance of a plurality of punching hole positions pre-arranged in the short and long directions in maximum configuration relative to the center of the plate frame template, and the hole position layout of the plate frame template is adapted to the hole position layout of the lower die; obtaining the long side dimension and short side dimension of the inner layer plate from the size information; comparing the long side dimension of the inner layer plate with a preset long side dimension threshold, and comparing the short side dimension of the inner layer plate with a preset short side dimension threshold; and determining the target number of punchable holes in the inner layer plate in the short and long directions from the plurality of punching hole positions of the plate frame template based on the comparison results.

[0034] like Figure 3 As shown, this embodiment provides a plate frame template. The plate frame template has a number of pre-set punching positions and their corresponding punching types, which correspond one-to-one with the number of pre-processed punching positions on the lower die base 21.

[0035] The step of comparing the long side dimension of the inner layer plate with a preset long side dimension threshold and comparing the short side dimension of the inner layer plate with a preset short side dimension threshold; and determining the target number of punched holes in the inner layer plate in the short side direction and the long side direction from a plurality of punched holes in the plate frame template according to the comparison results, includes: when the long side dimension is less than a first preset threshold of the long side dimension threshold, arranging a first number of punched holes in the short side direction of the inner layer plate according to the plate frame template; when the long side dimension is greater than or equal to the first preset threshold, arranging a second number of holes in the short side direction of the inner layer plate according to the plate frame template; the second number is greater than the first number; when the long side dimension is greater than or equal to the first preset threshold, proceeding to... The first step involves comparing the long side dimension with a second preset threshold. If the long side dimension is less than the second preset threshold, a fourth number of holes are arranged along the long side of the inner layer plate according to the plate frame template. If the long side dimension is greater than or equal to the second preset threshold, the hole arrangement of the inner layer plate along the long side is determined according to the relationship between the short side dimension and a third preset threshold of the short side dimension: when the short side dimension is greater than or equal to the third preset threshold, a third number of holes are arranged along the long side of the inner layer plate according to the plate frame template; when the short side dimension is less than the third preset threshold, the fourth number of holes are arranged along the long side of the inner layer plate according to the plate frame template; the third number is greater than the fourth number.

[0036] In a preferred embodiment, the first preset threshold for the board frame template is set to 28, the second preset threshold to 31.5, and the third preset threshold to 24. The preset first quantity is 1, the second quantity is 3, the third quantity is 7, and the fourth quantity is 5. Now, in conjunction with... Figure 5 Taking the inner layer plate with a long side dimension X=36 and a short side dimension Y=24 as an example, the process of determining the target number of punched holes is explained: First, the long side dimension X is compared with the first preset threshold 28. Since 36 > 28, three punching positions are arranged in the short side direction of the inner layer plate according to the plate frame template. Secondly, the long side dimension X is compared with the second preset threshold 31.5. Since 36 > 31.5, it is necessary to further judge in conjunction with the short side dimension. Finally, the short side dimension Y is compared with the third preset threshold 24. Since 24 = 24 (that is, the short side dimension Y is greater than or equal to the third preset threshold), seven punching positions are arranged in the long side direction of the inner layer plate according to the plate frame template.

[0037] In another preferred embodiment, the first preset threshold for the plate frame template is set to 28, the second preset threshold to 31.5, and the third preset threshold to 24. Now, in conjunction with... Figure 6 Taking the inner layer plate with a long side dimension X=28 and a short side dimension Y=24 as an example, the process of determining the target number of punched holes is explained: First, the long side dimension X is compared with the first preset threshold 28. Since 28 = 28 (that is, the long side dimension X is greater than or equal to the first preset threshold), three punching positions are arranged in the short side direction of the inner layer plate according to the plate frame template. Next, the long side dimension X is compared with the second preset threshold 31.5. Since 28 < 31.5 (that is, the long side dimension X is less than the second preset threshold), five punching positions are arranged in the long side direction of the inner layer plate according to the plate frame template.

[0038] The first, second, and third preset thresholds of the plate frame template, as well as the specific values ​​of the first to fourth quantities, all depend on the actual distribution of holes on the plate frame template. Specifically, as follows: Figure 3 As shown, when the long side dimension X is less than the first preset threshold 28, the D1 and C1 holes on the plate frame template will extend beyond the edge range of the inner layer plate, making it impossible to punch the D1 and C1 holes in the short side direction. In this case, only one hole can be punched in the short side direction. It should be noted that if the hole distribution of the plate frame template changes, the above thresholds and quantity parameters will also be adjusted accordingly.

[0039] After calculating the target number of punches based on the dimensions of the inner layer plate, the control system determines the punches that need to be avoided. The specific determination logic includes: When the long side dimension X is less than the first preset threshold, the control system arranges a first number of punching holes in the short side direction of the inner layer plate according to the plate frame template, and determines the punches corresponding to the first number of holes in the short side direction of the plate frame template as punches that need to be avoided. When the long side dimension X is less than the second preset threshold, the control system arranges the fourth number of punching positions in the long side direction of the inner layer plate according to the plate frame template, and determines the punches corresponding to the fourth number of holes in the long side direction of the plate frame template as punches that need to be avoided.

[0040] In a preferred embodiment, the first preset threshold for the plate frame template is set to 28, the second preset threshold to 31.5, and the third preset threshold to 24. Now, in conjunction with... Figure 6 Taking the inner layer plate with a long side dimension X=28 and a short side dimension Y=24 as an example, the process of determining the punch that needs to be avoided is explained: Comparing the long side dimension X with the second preset threshold 31.5, since 28 < 31.5 (i.e., the long side dimension X is less than the second preset threshold), the D2 and C2 holes in the long side direction of the plate frame template will exceed the edge range of the inner layer plate. Therefore, only 5 punching holes are arranged in the long side direction of the inner layer plate according to the plate frame template, and the punches corresponding to the D2 and C2 holes in the long side direction of the plate frame template are identified as the punches that need to be avoided.

[0041] The control system sends an avoidance movement command to the punch moving mechanism corresponding to the punch that needs to be avoided, so as to drive the punch that needs to be avoided to move to a preset avoidance station. This includes: the control system controlling the drive mechanism of the punch moving mechanism to operate according to the avoidance movement command, so as to drive the punch seat carrying the punch that needs to be avoided to move; under the drive of the drive mechanism, the punch that needs to be avoided moves to the avoidance station and aligns with the avoidance hole of the avoidance station; wherein, the avoidance hole is set on the lower die seat of the lower die, and the avoidance hole is located outside the punching station where the inner layer plate to be processed is located, thereby ensuring that all punches are in a safe area when not in operation, and avoiding damage.

[0042] like Figures 7 to 9 As shown, the punch moving mechanism includes a punch seat slide 31, a punch seat 32, and a drive mechanism. The punch seat slide 31 is mounted on the upper die lifting seat 10; the punch seat 32 is located below the punch seat slide 31 and slides in cooperation with it; the drive mechanism drives the punch seat 32 to slide within the punch seat slide 31, and includes a motor 51, a drive shaft 52, and a drive nut 53. The punch seat 32 is connected to the drive nut 53, and the motor drives the punch seat 32 to move linearly along the axial direction of the drive shaft via the drive shaft. Figure 7 As shown, the distribution direction of the two rows of punch holes pre-machined on the lower die holder 21 is parallel to the axial direction of the drive shaft. Therefore, when the punch holder 32 moves linearly along the axial direction of the drive shaft, it drives the punches installed in the punch holder 32 to move synchronously along the distribution direction of the two rows of punch holes on the lower die holder 21.

[0043] The two rows of punching holes on the lower die holder 21 are both located in the punching station, which is used to support the inner layer plate; in addition, a clearance station is provided outside the punching station. Figure 4 As shown, in addition to the two rows of punching holes, the lower die base 21 is also pre-machined with clearance holes 210, which are set in the clearance station.

[0044] The punch moving mechanism drives the punch that needs to be avoided to move to the preset avoidance position. Specifically, it includes: opening the pneumatic valve on the punch holder 32, causing the positioning pin 33 to move downward under air pressure and compress the spring below it until the positioning pin 33 disengages from the positioning hole 31a on the current punch holder slide 31; then, the motor drives the punch holder 32 to slide along the transmission shaft, moving the punch that needs to be avoided to the avoidance hole position 210 of the lower die holder 21; finally, the pneumatic valve is closed, and the positioning pin 33 is inserted into the corresponding positioning hole 31a under the reset action of the spring below it, thereby completing the punch avoidance action and mechanical locking.

[0045] This embodiment predefines the correspondence between punching type and minimum moving distance, and determines the minimum moving distance of the punch based on this correspondence.

[0046] Specifically, determining the minimum moving distance of the punch according to the preset correspondence between the punching type and the minimum moving distance includes: obtaining the hole feature parameters of the target punching type, wherein the hole feature parameters characterize the width of the slotted hole and / or the diameter of the circular hole; and determining the minimum moving distance of the punch according to the preset mapping relationship between the hole feature parameters and the minimum moving distance.

[0047] In a preferred embodiment, such as Figure 3 As shown, the mapping relationship between the preset hole feature parameters and the minimum moving distance is specifically configured as follows: The preset punching types include slotted holes, first circular holes, and second circular holes. Regarding the minimum moving distance setting, the diameters of the first and second circular holes are different, therefore the minimum moving distances corresponding to the circular punches adapted to both are also different. When the width of the slotted hole is the same as the diameter of either the first or second circular hole, the minimum moving distance of the slotted punch adapted to that slotted hole is consistent with the minimum moving distance of the circular punch adapted to the corresponding circular hole.

[0048] It should be noted that the aforementioned preset punching types are not fixed. In practical applications, those skilled in the art can flexibly add, delete, or replace punching types (e.g., add a third circular hole or an irregular hole) according to specific processing requirements, sheet material, or hole arrangement characteristics, and establish a corresponding new mapping relationship between hole feature parameters and minimum moving distance. This application does not impose strict limitations on this.

[0049] In this embodiment, the control system internally stores a mapping table between hole characteristic parameters and minimum movement distance. For example, when a target punched hole of width d1 is received, the control system retrieves the mapping table using a lookup method, directly obtains the corresponding minimum movement distance a1, and generates a motion control command. Alternatively, when a target punched hole of diameter d2 is received, the control system retrieves the mapping table using a lookup method, directly obtains the corresponding minimum movement distance a2, and generates a motion control command.

[0050] Therefore, when the target punching type is input into the control system, the control system will automatically match and determine the minimum moving distance of the punch, and then control the punch moving mechanism to drive the punch to move according to the minimum moving distance. For example... Figure 4 As shown, the minimum moving distance on the lower die holder 21 is represented by the spacing between adjacent punched holes in the same column. Specifically, the hole spacing between adjacent slotted holes is a1, while the hole spacing between adjacent circular holes with a diameter of d2 is a2.

[0051] When the target punching type is input into the control system, the control system will automatically match the target punch corresponding to that type and its dedicated punch switching mechanism, and send a punch switching command to the punch switching mechanism, thereby driving the target punch to switch precisely to the working position.

[0052] Specifically, the control system generates a punch switching command based on the target punching type; in response to the punch switching command, the punch switching mechanism performs a switching action to drive the target punch to extend to the working position and simultaneously drive the remaining punches in the punch switching mechanism to retract; wherein, the punch switching mechanism is equipped with at least two punches, and the target punch is one of the at least two punches that matches the target punching type.

[0053] like Figures 10 to 14 As shown, the punch switching mechanism includes a linear drive mechanism 41 and a switching top seat 42. The linear drive mechanism 41 is connected to the switching top seat 42 via a push rod. The switching top seat 42 is located on the top of the punch and slides in cooperation with it. Along the extension / retraction direction of the push rod, the switching top seat 42 has adjacent, staggered first abutment surfaces 42a and 42b, with a ramp 42c providing a smooth transition between them. When the linear drive mechanism 41 drives the push rod to extend or retract, the first and second abutment surfaces alternately abut against the punch.

[0054] The linear drive mechanism 41 can be any one of a pneumatic cylinder, a hydraulic cylinder, or an electric actuator. Preferably, considering that a pneumatic cylinder has a simple structure, large output force, and can well adapt to high-frequency reciprocating motion, a pneumatic cylinder is selected as the linear drive mechanism 41 in this embodiment. In other alternative embodiments, the linear drive mechanism 41 can also be a linear motor or a motor lead screw drive assembly, or other device capable of realizing linear reciprocating drive.

[0055] like Figure 11 and 12 As shown, taking the circular punch 43 as an example, when the push rod extends, the first contact surface 42a abuts against the circular punch 43 and drives it to move downward; when the push rod retracts, the second contact surface 42b abuts against the circular punch 43, and the circular punch 43 moves upward.

[0056] like Figure 13 and 14 As shown, the punch holder 32 has two punch slots, and a round punch 43 and a slotted punch 44 are respectively inserted into the two punch slots. The top of the round punch 43 passes through the punch slot and abuts against the first abutting surface 42a or the second abutting surface 42b, while its bottom passes through the punch slot and extends into the protective sleeve 45 (e.g., Figure 11(As shown). During operation, when the first contact surface 42a contacts the round punch 43, the round punch 43 moves downward against the elastic force of the spring inside the protective sleeve 45 and extends out of the protective sleeve; when the push rod retracts and the top of the round punch 43 switches from the first contact surface 42a to the second contact surface 42b, since the bottom surface of the second contact surface 42b is higher than the bottom surface of the first contact surface 42a, the round punch 43 moves upward under the restoring force of the spring inside the protective sleeve 45, thereby retracting into the protective sleeve.

[0057] like Figure 13 and Figure 14 As shown, a round punch 43 and a slotted punch 44 are respectively inserted into the two punch slots. In the working state, the two punches are in a complementary state with the contact surface: when the round punch 43 contacts the first contact surface 42a, the slotted punch 44 contacts the second contact surface 42b; conversely, when the round punch 43 switches to contact the second contact surface 42b, the slotted punch 44 simultaneously switches to contact the first contact surface 42a.

[0058] When the punch that needs to be avoided moves to the avoidance hole position, and the punch switching mechanism completes the punch switching action, the control system sends a working movement command to the punch moving mechanism corresponding to the target punch, thereby driving the target punch to move precisely to the actual punching coordinates of the target punching hole position.

[0059] The process of determining the actual punching coordinates of the target punching hole position includes: obtaining the target position information on the inner layer plate through the vision positioning component, and the control system performing position compensation on the inner layer plate according to the target position information; after the position compensation is completed, the control system calculates the actual punching coordinates of the target punching hole position.

[0060] Specifically, the target position information on the inner layer board is obtained through a visual positioning component. The control system performs position compensation on the inner layer board based on the target position information. This includes: the visual positioning component first obtains the target position information on the inner layer board, which represents the offset distance between the target set on the inner layer board and the center line of the inner layer board, and sends the target position information to the control system; the control system calculates the target center coordinates of the inner layer board based on this information, and calculates the pose deviation between the target center coordinates and the preset equipment center coordinates; and generates a compensation command based on this information and sends it to the position compensation mechanism; the compensation command includes X-axis coordinate compensation amount, Y-axis coordinate compensation amount, and angle compensation amount; the position compensation mechanism responds to the compensation command by driving the inner layer board to perform translation and rotation movements to eliminate the pose deviation and make the target center coordinates of the inner layer board accurately aligned with the equipment center coordinates.

[0061] Once the target center coordinates on the inner layer plate are aligned with the equipment center coordinates, the control system calculates the actual punching coordinates of the target punching hole position, including: The control system acquires the hole layout parameters of the plate frame template in the preset equipment coordinate system; the hole layout parameters represent the offset distance of each preset punching hole position relative to the center line of the short side and the center line of the long side of the plate frame template; based on the equipment center coordinates, combined with the target position information and the hole layout parameters, the actual punching coordinates of the target punching hole position in the equipment coordinate system are calculated.

[0062] In a preferred embodiment, the visual positioning component may employ a CCD or CMOS camera to accurately capture the target position information on the inner layer plate. For example... Figure 5 As shown, in this embodiment, the targets are circular holes marked with "T", and a total of four are provided. Two targets are positioned opposite each other along the short side of the inner layer plate, while the other two targets are staggered along the long side to achieve foolproof identification. Given that the preset offset distance from the target to the center line is 1.5 inches, the control system can calculate the short side center line of the inner layer plate by fitting the two targets along the short side, and calculate the long side center line by fitting the two targets along the long side. The intersection of these two center lines is then used as the target center coordinate of the inner layer plate.

[0063] Both the position compensation mechanism and the position compensation method utilize existing technologies. The position compensation mechanism can be any one of an XY platform, a multi-axis servo module, or a mechanical floating compensation device. Preferably, considering the high precision, high response speed, and ease of closed-loop linkage with the control system of the XY platform, an XY platform is selected as the position compensation mechanism in this embodiment. In other alternative embodiments, the position compensation mechanism can also be a multi-axis servo module, a parallel robot, or a mechanical floating compensation device capable of achieving in-plane translation and rotation compensation; position compensation can be coordinate offset compensation based on visual feedback, dynamic compensation based on kinematic models, or passive adaptive compensation based on mechanical structures, etc.

[0064] like Figure 3 As shown, the hole layout parameters of the plate frame template in the equipment coordinate system represent the offset distance of each preset punch hole position relative to the center line of the short side and the center line of the long side of the plate frame template. Since the center coordinates of the plate frame template coincide with the center coordinates of the equipment and are both defined as the origin (0,0), the control system can directly calculate the X and Y coordinates of each preset punch hole position in the equipment coordinate system based on the offset distance of each preset punch hole position relative to these two center lines.

[0065] Once the target center coordinates of the inner layer board are aligned with the device center coordinates, the target center coordinates are set to the origin (0,0). Figure 6 As shown, the inner layer plate has a long side dimension X=28 and a short side dimension Y=24. Based on the aforementioned logic for calculating the target number of holes based on the dimension information, the inner layer plate can have 5 holes on each long side and 3 holes on each short side. Figure 5As shown, in this embodiment, the slotted holes B are distributed along the center lines of each side of the plate frame template, and the distance from the target T to the center line is set to 1.5 inches. The system can calculate the offset distance from the target to the slotted holes B by obtaining the offset of the target T relative to the center line. Based on the positional relationship that the slotted holes B and the target T have the same X-coordinate in the short side direction and the same Y-coordinate in the long side direction, combined with... Figure 3 The hole layout parameters can be used to determine the actual punching coordinates of slotted holes B in each direction in the equipment coordinate system. Then, based on the relative positional relationship between slotted holes B and other preset hole positions, the actual punching coordinates of all other target punching hole positions in the equipment coordinate system can be calculated.

[0066] like Figure 6 As shown, when the target punching type in both the long and short sides is a circular hole with a diameter of d2, the control system responds immediately, instructing the punch switching mechanism to extend the target punch matching the diameter d2 to the working position. Simultaneously, the system automatically matches the minimum moving distance a2 of the punch and controls the punch moving mechanism to feed at this distance, ensuring the target punch is accurately positioned at the punching hole position on the lower die holder 21. Finally, the control system controls the upper die to move downwards and close with the lower die to execute the punching action and complete the punching process.

[0067] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for punching holes in an inner layer plate, characterized in that... This includes the following steps: Step S1: The control system receives the size information of the inner layer plate to be processed and the target punching type, and determines the minimum moving distance of the punch according to the preset correspondence between the punching type and the minimum moving distance; wherein, the minimum moving distance is the distance between adjacent punching positions in the same column on the lower die base. Step S2: The control system calculates the number of target punches based on the size information and determines the punches that need to be avoided accordingly; Step S3: The control system sends an avoidance movement command to the punch moving mechanism corresponding to the punch that needs to be avoided, so as to drive the punch that needs to be avoided to move to the preset avoidance position; Step S4: The control system sends a punch switching command to the punch switching mechanism corresponding to the target punch to drive the target punch to switch to the working position; Step S5: Obtain the target position information on the inner layer plate through the visual positioning component. The control system performs position compensation on the inner layer plate according to the target position information and calculates the actual punching coordinates of the target punching hole after the compensation is completed. Step S6: The control system sends a working movement command to the punch moving mechanism corresponding to the target punch to drive the target punch to move to the actual punching coordinates according to the minimum moving distance, thereby positioning the target punch to the punching hole position of the lower die base; and controls the upper die to move down and close with the lower die to perform the punching action.

2. The punching method for the inner layer plate according to claim 1, characterized in that... In step S1, the minimum moving distance of the punch is determined according to the preset correspondence between the punching type and the minimum moving distance, including: Obtain the hole characteristic parameters of the target punching type, wherein the hole characteristic parameters characterize the width of the slotted hole and / or the diameter of the circular hole; The minimum movement distance of the punch is determined based on the preset mapping relationship between the hole feature parameters and the minimum movement distance.

3. The punching method for the inner layer plate according to claim 1, characterized in that... In step S2, the control system calculates the target number of punches based on the size information and determines the punches to be avoided accordingly, including: Obtain preset plate frame template data, wherein the plate frame template data represents the distance of a number of punch holes pre-arranged in the short side direction and the long side direction in the maximum configuration relative to the center of the plate frame template, and the hole layout of the plate frame template is adapted to the hole layout of the lower die. Obtain the long side dimension and short side dimension from the size information; The length of the long side is compared with a preset length threshold, and the length of the short side is compared with a preset short side threshold. Based on the comparison results, the target number of punched holes in the inner layer plate in the short side direction and the long side direction is determined from the plurality of punched hole positions of the plate frame template. The punches corresponding to the punch positions in the plate frame template that exceed the target number of punches are identified as the punches that need to be avoided.

4. The punching method for the inner layer plate according to claim 1, characterized in that... In step S3, the control system sends an avoidance movement command to the punch moving mechanism corresponding to the punch that needs to be avoided, so as to drive the punch that needs to be avoided to move to a preset avoidance position, including: The control system controls the drive mechanism of the punch moving mechanism to move according to the avoidance movement command, so as to drive the punch seat carrying the punch to be avoided to move. Driven by the drive mechanism, the punch that needs to be avoided moves to the avoidance station and aligns with the avoidance hole of the avoidance station. The clearance hole is located on the lower die base of the lower die, and the clearance hole is located outside the punching station where the inner layer plate to be processed is located.

5. The punching method for the inner layer plate according to claim 1, characterized in that... In step S4, the control system sends a punch switching command to the punch switching mechanism corresponding to the target punch to drive the target punch to switch to the working position, including: The control system generates the punch switching command according to the target punching type; In response to the punch switching command, the punch switching mechanism performs a switching action to drive the target punch to extend to the working position and simultaneously drive the remaining punches in the punch switching mechanism to retract; wherein, the punch switching mechanism is configured with at least two punches, and the target punch is one of the at least two punches that matches the target punching type.

6. The punching method for the inner layer plate according to claim 3, characterized in that... In step S5, the target position information on the inner layer plate is obtained through a visual positioning component, and the control system performs position compensation on the inner layer plate based on the target position information, including: The visual positioning component acquires the target position information on the inner layer plate and sends the target position information to the control system; the target position information represents the offset distance of the target relative to the center line of the inner layer plate. The control system calculates the pose deviation between the target center coordinates of the inner layer plate and the preset equipment center coordinates based on the target position information, and generates a compensation command accordingly, which is then sent to the position compensation mechanism. The compensation command includes X-axis coordinate compensation, Y-axis coordinate compensation, and angle compensation. The position compensation mechanism responds to the compensation command by driving the inner plate to perform translation and rotation movements to eliminate the position deviation and align the target center coordinates with the device center coordinates.

7. The punching method for the inner layer plate according to claim 6, characterized in that... In step S5, after compensation is completed, the actual punching coordinates of the target punching position are calculated, including: Obtain the hole layout parameters of the plate frame template in the preset equipment coordinate system; the hole layout parameters represent the offset distance of each preset punch hole relative to the center line of the short side and the center line of the long side of the plate frame template; Using the center coordinates of the equipment as a reference, and combining the target position information and the hole layout parameters, the actual punching coordinates of the target punching hole in the equipment coordinate system are calculated.

8. A punching device for an inner layer plate, characterized in that... ,include: A punching execution assembly includes several upper dies and a lower die disposed opposite to the upper dies; the upper dies are provided with at least two punches, as well as a punch switching mechanism and a punch moving mechanism; the punch switching mechanism is used to drive the punches to switch, and the punch moving mechanism is used to drive the punches to move to an avoidance station or a punching station; The control system is communicatively connected to the punch switching mechanism and the punch moving mechanism, respectively. The control system is configured to: send an avoidance movement command or a working movement command to the punch moving mechanism to drive the punch to move to the avoidance station or the punching station; and send a punch switching command to the punch switching mechanism to drive the punch to extend to the working station; The lower die base of the lower die is pre-machined with a number of punching holes adapted to all punching types, as well as clearance holes, according to the maximum configuration; the number of punching holes are located at the punching station, the clearance holes are located at the clearance station, and the clearance station is located outside the punching station.

9. The punching device for the inner layer plate according to claim 8, characterized in that... The punch switching mechanism includes: Linear drive mechanism; The switching top seat is connected to the linear drive mechanism via a push rod; the switching top seat is disposed on the top of the punch and slides in cooperation with the punch; the switching top seat has a first abutting surface and a second abutting surface arranged adjacent to each other at different heights along the extension and retraction direction of the push rod, and the first abutting surface and the second abutting surface are connected by a slope. When the linear drive mechanism drives the push rod to extend or retract, the first abutment surface and the second abutment surface alternately abut against the punch: when the first abutment surface abuts against the punch, the punch is driven to move downward; when the second abutment surface abuts against the punch, the punch moves upward.

10. The punching device for the inner layer plate according to claim 9, characterized in that... The punch switching mechanism further includes: A punch holder, wherein at least two punch slots are provided in the punch holder, the top of the punch in each punch slot passes through the punch slot and abuts against the first abutting surface or the second abutting surface, and the bottom of the punch passes through the punch slot and extends into the protective sleeve; When the first contact surface abuts against the punch, the punch overcomes the elastic force of the spring inside the protective sleeve and extends out from inside the protective sleeve; when the second contact surface abuts against the punch, under the restoring force of the spring inside the protective sleeve, the punch retracts into the protective sleeve. The upper die is provided with two punches, and the switching top seat is configured such that when one of the two punches abuts against the first abutting surface, the other punch abuts against the second abutting surface.

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