A circuit board pressing and glue filling device

Abstract

The present application relates to the technical field of circuit board processing, in particular to a circuit board pressing and glue filling device, which comprises a vacuum hot press body, a conveying screw and a base, further comprises a first alignment assembly, the first alignment assembly comprises a steel plate table fixedly installed on the upper surface of the base, and a turnover frame movably installed on both sides of the steel plate table, a first electric push rod is fixedly installed on the turnover frame, a first connecting rod is hinged to the output shaft of the first electric push rod, and an installation frame is hinged to the other end of the first connecting rod, through the cooperation of the first alignment assembly and the second alignment assembly, the core plate can be accurately aligned when the rigid and flexible circuit board laminates are aligned, when the flexible core plate laminates, through the morphological change of the first alignment assembly and the second alignment assembly, the reinforcing glue can be applied to the surface of the flexible core plate and the prepreg by cooperating with the glue injection assembly, and the flexible core plate is flattened to prevent curling and improve the subsequent pressing precision.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, specifically to a circuit board pressing and potting device. Background Technology

[0002] In the production process of printed circuit boards (PCBs), lamination is an extremely important process, which is divided into lamination and hot lamination steps. Lamination refers to using heat and pressure to press the assembled copper foil, prepreg, and core board into a multilayer board that meets the requirements. The step of assembling the copper foil, prepreg, and core board is called lamination. The accuracy of the lamination step affects the interlayer bonding strength and dimensional stability of the multilayer PCB, which directly determines the final performance of the PCB. Therefore, the lamination step in the lamination process is one of the core links in the manufacturing process of multilayer PCBs.

[0003] Traditional rigid circuit board lamination equipment often uses infrared light and steel clamps to align copper foil, prepreg, and core board during the lamination process. However, with the current trend of thinner and foldable consumer electronics, the volume of rigid circuit boards is becoming increasingly prominent, making it difficult to adapt to the internal space layout requirements of new products such as wearable devices and foldable screen phones. Flexible circuit boards use flexible polymer films such as polyimide (PI) and polyester (PET) as core board substrates. Due to their repeated bending, thinness, and light weight, they are widely used in smartphone ribbon cables, smartwatch sensor modules, and other scenarios. However, during the lamination of the core board of flexible circuit boards, the PI film undergoes a dehydration condensation reaction during the imidization process. If the biaxial stretching is not sufficient during the production stage, shrinkage and warping problems are likely to occur during lamination. In addition, the film itself has uneven internal stress, which can easily lead to curling due to stress release. Therefore, traditional lamination equipment is difficult to adapt to the lamination process of flexible circuit boards, thus affecting the lamination quality of the circuit boards. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a circuit board pressing and potting device, which solves the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a circuit board pressing and potting device, comprising a vacuum hot press body, a conveying screw and a base, and further comprising a first alignment component. The first alignment component comprises a steel plate fixedly mounted on the upper surface of the base, and a flipping frame movably mounted on both sides of the steel plate. A first electric push rod is fixedly mounted on the flipping frame, and a first connecting rod is hinged to the output shaft of the first electric push rod. A mounting frame is hinged to the other end of the first connecting rod. An alignment component is movably mounted in the inner cavity of the mounting frame. Guide rails are fixedly mounted on both sides of the flipping frame, and guide rods are fixedly mounted on both ends of the mounting frame. The guide rods are movably mounted to the guide rails. It also includes a second alignment component, which includes a first drive module, a guide module and a second drive module. The first drive module includes a second electric push rod fixedly mounted on a guide rail. A connector is fixedly mounted on the output shaft of the second electric push rod, and the connector is slidably mounted on the surface of the mounting frame.

[0006] Preferably, a first guide post is fixedly installed on both sides of the top of the alignment member. The first guide post passes through the mounting frame and extends to the top of the mounting frame. A first reset spring is sleeved on the outer periphery of the first guide post.

[0007] Preferably, a servo motor is fixedly mounted on the upper surface of the base, and the output shaft of the servo motor is fixedly connected to the tilting frame.

[0008] Preferably, the guide module includes a second guide post fixedly installed on the connector, a second return spring sleeved on the outer periphery of the second guide post, and a positioning frame movably installed on the outer surface of the second guide post.

[0009] Preferably, the second drive module includes a third electric push rod fixedly mounted on the connector. A connecting column is fixedly mounted on the output shaft of the third electric push rod. The connecting column is fixedly connected to the positioning frame. A second connecting rod is movably mounted on the outer surface of the connecting column. A drive shaft is fixedly mounted on the other end of the second connecting rod. A driven arm is movably mounted on the outer surface of the drive shaft. The driven arm is movably mounted between the driven arm and the connector. A pressure roller is detachably connected to one end of the driven arm.

[0010] Preferably, it further includes an adhesive injection assembly, which includes an adhesive injection groove formed on the surface of the alignment member, and a stopper rod movably mounted to the alignment member. The stopper rod passes through the mounting frame and extends to the top of the mounting frame. A piston is fixedly mounted at the bottom of the stopper rod and is movably mounted in the inner cavity of the alignment member.

[0011] Preferably, it also includes a presser foot assembly, which includes a magnetic base disposed on the surface of the steel plate platform and a limiting frame fixedly mounted on the magnetic base. A limiting spring is fixedly connected to the limiting frame, and a positioning block is fixedly connected to the other end of the limiting spring.

[0012] Preferably, when the driven arm is in its initial state, its bottom is above the limiting frame.

[0013] In the above technical solution, the beneficial effects of the present invention are: by cooperating with the first alignment component and the second alignment component, the core board can be accurately aligned when stacking rigid and flexible circuit boards. When stacking flexible core boards, by changing the shape of the first alignment component and the second alignment component, the adhesive can be applied to the surface of the flexible core board and the prepreg, and the flexible core board can be flattened to prevent it from curling, thereby improving the subsequent pressing accuracy.

[0014] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and are not intended to limit this disclosure.

[0015] This application provides an overview of various implementations or examples of the technology described in this disclosure, and is not a full disclosure of the entire scope or all features of the disclosed technology. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the structure of the present invention. Figure 3 ; Figure 4 This is a schematic diagram showing the positional relationship between the first alignment component and the second alignment component of the present invention; Figure 5 This is a schematic diagram of the dispensing assembly of the present invention. Figure 1 ; Figure 6 This is a schematic diagram of the dispensing assembly of the present invention. Figure 2 ; Figure 7 This is a schematic diagram of the working state of the second alignment component of the present invention; Figure 8 This is a schematic diagram of the application process of the present invention; Figure 9 For the present invention Figure 4 A magnified schematic diagram of the partial structure at point A in the middle; Figure 10 For the present invention Figure 7 A magnified schematic diagram of the structure at point B in the middle.

[0017] In the diagram: 1. Vacuum hot press body; 11. Control panel; 12. Protective door; 13. Stacking table; 14. Pulley; 15. Limiting wheel; 16. Three-axis slide table; 17. Pressure plate; 18. Conveyor screw; 19. Base; 110. Slide rail; 2. Steel plate table; 21. Tilting frame; 22. Servo motor; 23. First electric push rod; 24. First connecting rod; 25. Mounting frame; 26. Alignment piece; 27. First guide post; 28. First composite... 3. Positioning spring; 4. Connecting piece; 5. Second guide post; 6. Second return spring; 7. Positioning frame; 8. Second electric push rod; 9. Third electric push rod; 10. Connecting post; 11. Second connecting rod; 12. Drive shaft; 13. Driven arm; 14. Pressure roller; 15. Glue injection groove; 16. Plug rod; 17. Piston; 18. Guide rail; 19. Guide rod; 20. Magnetic base; 10. Limiting frame; 11. Limiting spring; 22. Positioning block. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] Example 1: Please refer to Figures 1 to 4 ,and Figure 7 The present invention provides a technical solution: a circuit board pressing and potting device, including a vacuum hot press body 1, a conveying screw 18 and a base 19, and a first alignment component. The first alignment component includes a steel plate platform 2 fixedly installed on the upper surface of the base 19, and a flipping frame 21 movably installed on both sides of the steel plate platform 2. A first electric push rod 23 is fixedly installed on the flipping frame 21. A first connecting rod 24 is hinged to the output shaft of the first electric push rod 23. The other end of the first connecting rod 24 is hinged to a mounting frame 25. An alignment member 26 is movably installed in the inner cavity of the mounting frame 25. A first guide post 27 is fixedly installed on both sides of the top of the alignment member 26. The first guide post 27 penetrates the mounting frame 25 and extends to the top of the mounting frame 25. A first return spring 28 is sleeved on the outer periphery of the first guide post 27.

[0020] A servo motor 22 is fixedly mounted on the upper surface of the base 19, and the output shaft of the servo motor 22 is fixedly connected to the flipping frame 21.

[0021] Guide rails 6 are fixedly installed on both sides of the flipping frame 21, and guide rods 61 are fixedly installed at both ends of the mounting frame 25. The guide rods 61 are movably installed with the guide rails 6 and are used to guide the mounting frame 25 when the first electric push rod 23 drives the mounting frame 25 to move.

[0022] It also includes a presser foot assembly, which includes a magnetic base 7 disposed on the surface of the steel plate platform 2, and a limiting frame 71 fixedly installed on the magnetic base 7. A limiting spring 72 is fixedly connected to the limiting frame 71, and a positioning block 73 is fixedly connected to the other end of the limiting spring 72.

[0023] Specifically, the present invention also includes a control panel 11, a protective door 12, a stacking table 13, pulleys 14, limit wheels 15, a three-axis slide table 16, a pressure plate 17, and a slide rail 110. The control panel 11 is installed on the side of the vacuum hot press body 1 for easy operation by the user. It is used to set and control the core parameters such as pressing temperature, pressure, holding time, heating and cooling rates, and displays the actual temperature of the pressure plate 17 and the current system pressure, vacuum degree, and other operating data in real time to match the pressing process requirements of different products such as rigid circuit boards and flexible circuit boards. The protective door 12 is controlled by a lifting mechanism, and its four sides are equipped with high-pressure resistant doors. A temperature-sealing strip and a stacking platform 13 are installed on the front side of the protective door 12 to support the base platform 19 for stacking operations. Pulleys 14 and limiting wheels 15 are installed on the surface of the stacking platform 13. Pulleys 14 are in movable contact with the bottom of the base platform 19 to assist the base platform 19 in moving. Limiting wheels 15 are in movable contact with both sides of the base platform 19 to limit the base platform 19. A three-axis slide table 16 is installed in the hot pressing cavity of the vacuum hot press body 1 to adjust the position of the pressure plate 17. A conveying screw 18 is connected to the base platform 19 through a screw sleeve to convey the base platform 19 in and out of the hot pressing cavity of the vacuum hot press body 1, and is guided by the slide rail 110. Furthermore, traditional rigid circuit board laminating equipment often uses infrared light in conjunction with steel clamps to align the copper foil, prepreg, and core board during the lamination process. However, during the sequential lamination process, the alignment of the four sides of the copper foil, prepreg, and core board with the infrared light is still determined manually, which introduces a certain degree of error. In this invention, the base 19 is moved to the upper surface of the lamination stage 13 via the conveyor screw 18. Then, according to the required copper foil size for the circuit board, the limiting frames 71 are installed on the surface of the steel plate stage 2 via the magnetic base 7, ensuring that the inner frame dimensions of the four limiting frames 71 are adapted to the copper foil and prepreg. Next, the copper foil and prepreg are placed sequentially inside the limiting frames 71, and the elastic force provided by the limiting springs 72 is used to fix the four corners of the copper foil and prepreg using the positioning blocks 73 to prevent them from shifting. Then, the core board is placed on the surface of the prepreg. To ensure that the copper foil and prepreg completely adhere to the core board during the lamination process, their area is larger than that of the core board. Therefore, when laminating the core board, it is necessary to... The core board is initially centered according to the infrared beam. Then, the first guide post 27 is lifted, causing the alignment piece 26 to move upward. The first electric push rod 23, with its pre-set drive stroke, is then activated to drive the first connecting rod 24, causing the first connecting rod 24 to move the mounting frame 25, allowing the alignment piece 26 to pass the limit frame 71. The first guide post 27 is then released, allowing the bottom of the alignment piece 26 to contact the prepreg. As the first electric push rod 23 continues to drive, the two alignment pieces 26 will contact the core board. At this point, the first electric push rod 23 stops driving, and the core board is initially centered. It is important to note that when the first electric push rod 23 is in its initial state, the first connecting rod 24 is tilted, ensuring that the first connecting rod 24 can smoothly drive the mounting frame 25 when the first electric push rod 23 is driven, avoiding the connection rod from jamming. Secondly, it is necessary to ensure the magnetic strength of the magnetic base 7 to prevent it from shifting positionally with the steel plate platform 2 during the stacking and pressing process, which would affect the pressing accuracy.

[0024] Example 2: Please refer to Figures 4 to 10 It also includes a second alignment component, which includes a first drive module, a guide module and a second drive module. The first drive module includes a second electric push rod 34 fixedly mounted on the guide rail 6. A connector 3 is fixedly mounted on the output shaft of the second electric push rod 34. The connector 3 is slidably mounted on the surface of the mounting frame 25. A ball bearing can be set at the bottom of the connector 3 to reduce the friction when the connector 3 moves.

[0025] The guide module includes a second guide post 31 fixedly installed on the connector 3, a second return spring 32 sleeved on the outer periphery of the second guide post 31, and a positioning frame 33 movably installed on the outer surface of the second guide post 31.

[0026] The second drive module includes a third electric push rod 4 fixedly mounted on the connector 3. A connecting column 41 is fixedly mounted on the output shaft of the third electric push rod 4. The connecting column 41 is fixedly connected to the positioning frame 33. A second connecting rod 42 is movably mounted on the outer surface of the connecting column 41. A drive shaft 43 is fixedly mounted on the other end of the second connecting rod 42. A driven arm 44 is movably mounted on the outer surface of the drive shaft 43. The driven arm 44 is movably mounted between the connecting member 3. A pressure roller 45 is detachably connected to one end of the driven arm 44.

[0027] It also includes a glue injection assembly, which includes a glue injection groove 5 formed on the surface of the alignment member 26, and a stop rod 51 movably mounted to the alignment member 26. The stop rod 51 passes through the mounting frame 25 and extends to the top of the mounting frame 25. A piston 52 is fixedly mounted at the bottom of the stop rod 51 and is movably mounted in the inner cavity of the alignment member 26.

[0028] When the driven boom 44 is in its initial state, its bottom is above the limit frame 71, which can prevent the driven boom 44 from being interfered with when it moves.

[0029] Based on Example 1, after the core board is initially centered, the connecting post 41 is driven by activating the third electric push rod 4 with a preset drive stroke. This causes the connecting post 41 to drive the second connecting rod 42, which in turn drives the drive shaft 43 to drive the driven arm 44 downward, bringing the driven arm 44 into contact with the prepreg. Then, the second electric push rod 34 with a preset drive stroke is activated to move the driven arm 44 from the other two sides of the core board until it contacts the core board, as per the attached instruction manual. Figure 7 As shown, this completes the core board centering and alignment operation, improving the alignment accuracy. After that, the prepreg and copper foil can be stacked on top of the core board. In addition, when the third electric push rod 4 drives the connecting column 41, the positioning frame 33 will also move because the connecting column 41 is fixedly connected to the positioning frame 33, thereby providing more field of view for the driven boom 44, making it easier for the camera or staff to observe the centering and alignment operation. Furthermore, during the stacking of flexible circuit boards, the PI film, the core material, undergoes a dehydration condensation reaction during imidization. If the biaxial stretching during production is insufficient, shrinkage and warping are likely to occur during stacking. Additionally, the film itself has uneven internal stress, which can easily lead to stress release and curling. Therefore, in this invention, when stacking flexible core boards, the positioning block 73 is used to fix the copper foil and prepreg. Then, the first electric push rod 23 is activated, causing the first connecting rod 24 to drive the mounting frame 25 to a preset position. Next, the second electric push rod 34 and the third electric push rod 4 are activated to drive the follower arm 44 to the preset position, and then the flexible core board is placed in the center. This method can also be used for rigid circuit boards. To prevent the flexible core board from curling, after the flexible core board is centered and aligned, the follower arm 44 needs to be reset, and then the first guide post 27 is lifted. The alignment piece 26 is raised, and the first electric push rod 23 is activated to move the alignment piece 26 to the middle of the upper surface of the flexible core board. At this time, the first guide post 27 is lowered so that the alignment piece 26 contacts the upper surface of the flexible core board. Then, the reinforcing adhesive is injected into the inner cavity of the alignment piece 26 through the glue injection groove 5, and the amount of adhesive injected is lower than the position of the glue injection groove 5. The bottom of the alignment piece 26 has a one-way glue outlet groove. Then, the plug rod 51 is pressed down to squeeze the adhesive, and the first electric push rod 23 is activated to reset, thereby applying the reinforcing adhesive to the surface of the flexible core board and the prepreg. When the alignment piece 26 moves on the surface of the flexible core board, it will generate bidirectional tension, flattening the flexible core board and preventing it from curling. When the alignment piece 26 is separated from the flexible core board, the reinforcing adhesive can shape the flexible core board to prevent it from curling, thereby improving the subsequent pressing accuracy. After that, the prepreg and copper foil are stacked in sequence. As a supplementary embodiment, when the lamination operation is completed, because the flexible core board surface is coated with reinforcing adhesive, it is easy to encounter difficulties in fully adhering during the subsequent lamination of the prepreg. In this invention, the servo motor 22 can be activated to drive the flipping frame 21 to flip, as shown in the attached instruction manual. Figure 8 As shown, a rubber block is then installed at the bottom of the positioning frame 33. The first electric push rod 23 is then activated to drive the alignment piece 26 to move downward, thereby causing the positioning frame 33 to move downward and positioning the flexible core board and the prepreg. During the downward movement of the positioning frame 33, the pressure roller 45 will also come into contact with the prepreg. Then, the third electric push rod 4 is activated to drive the pressure roller 45 to both sides of the prepreg, so that the pressure roller 45 can perform the bonding operation on the prepreg, making it fit more closely with the flexible core board and avoiding the formation of air bubbles and wrinkles. Furthermore, after the lamination is completed, it needs to be conveyed to the hot pressing cavity of the vacuum hot press body 1 by the conveying screw 18. The mechanical vibration during the conveying process can easily cause interlayer displacement of the laminated material, thereby affecting the pressing accuracy. In this invention, when conveying rigid circuit boards or flexible circuit boards, the first electric push rod 23 can be activated to drive the pressure roller 45 to descend, so that the pressure roller 45 contacts the uppermost copper foil to position the laminated material, and then convey it. Before hot pressing, the pressure roller 45 is reset and the reset flipping frame 21 is flipped to avoid affecting the pressing operation of the pressure plate 17. Then, a steel plate is placed on top of the laminated material to balance the pressure, and then hot pressing is performed.

[0030] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board pressing and potting device, comprising a vacuum hot press body (1), a conveying screw (18), and a base (19), characterized in that: It also includes a first alignment component, which includes a steel plate platform (2) fixedly installed on the upper surface of the base (19), and a flipping frame (21) movably installed on both sides of the steel plate platform (2). A first electric push rod (23) is fixedly installed on the flipping frame (21). A first connecting rod (24) is hinged to the output shaft of the first electric push rod (23). A mounting frame (25) is hinged to the other end of the first connecting rod (24). An alignment member (26) is movably installed in the inner cavity of the mounting frame (25). Guide rails (6) are fixedly installed on both sides of the flipping frame (21). Guide rods (61) are fixedly installed at both ends of the mounting frame (25). The guide rods (61) are movably installed with the guide rails (6). It also includes a second alignment component, which includes a first drive module, a guide module and a second drive module. The first drive module includes a second electric push rod (34) fixedly mounted on the guide rail (6). A connector (3) is fixedly mounted on the output shaft of the second electric push rod (34). The connector (3) is slidably mounted on the surface of the mounting frame (25). The first guide post (27) is fixedly installed on both sides of the top of the alignment member (26). The first guide post (27) passes through the mounting frame (25) and extends to the top of the mounting frame (25). A first reset spring (28) is sleeved on the outer periphery of the first guide post (27). It also includes a glue injection assembly, which includes a glue injection groove (5) formed on the surface of the alignment member (26) and a plug rod (51) movably mounted to the alignment member (26), the plug rod (51) passing through the mounting frame (25) and extending to the top of the mounting frame (25), and a piston (52) fixedly mounted at the bottom of the plug rod (51), the piston (52) being movably mounted in the inner cavity of the alignment member (26).

2. The circuit board pressing and potting device according to claim 1, characterized in that: A servo motor (22) is fixedly installed on the upper surface of the base (19), and the output shaft of the servo motor (22) is fixedly connected to the flipping frame (21).

3. The circuit board pressing and potting device according to claim 1, characterized in that: The guide module includes a second guide post (31) fixedly installed on the connector (3), a second return spring (32) is sleeved on the outer periphery of the second guide post (31), and a positioning frame (33) is movably installed on the outer surface of the second guide post (31).

4. The circuit board pressing and potting device according to claim 3, characterized in that: The second drive module includes a third electric push rod (4) fixedly mounted on the connector (3). A connecting column (41) is fixedly mounted on the output shaft of the third electric push rod (4). The connecting column (41) is fixedly connected to the positioning frame (33). A second connecting rod (42) is movably mounted on the outer surface of the connecting column (41). A drive shaft (43) is fixedly mounted on the other end of the second connecting rod (42). A driven arm (44) is movably mounted on the outer surface of the drive shaft (43). The driven arm (44) is movably mounted between the driven arm (44) and the connector (3). A pressure roller (45) is detachably connected to one end of the driven arm (44).

5. The circuit board pressing and potting device according to claim 4, characterized in that: It also includes a presser foot assembly, which includes a magnetic base (7) disposed on the surface of the steel plate platform (2) and a limiting frame (71) fixedly mounted on the magnetic base (7). A limiting spring (72) is fixedly connected to the limiting frame (71), and a positioning block (73) is fixedly connected to the other end of the limiting spring (72).

6. The circuit board pressing and potting device according to claim 5, characterized in that: When the driven arm (44) is in its initial state, its bottom is above the limiting frame (71).

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