Fluid seal structure and fluid control device in a semiconductor process

Abstract

The application relates to the technical field of sealing valves, and discloses a fluid sealing structure in a semiconductor process and a flow control device, wherein the fluid sealing structure in the semiconductor process comprises a pipeline body, a flange assembly, a fixed pressure mechanism, an adjustable pressure mechanism and a sensing assembly; the flange assembly is installed on the pipeline body; the fixed pressure mechanism is installed between the flange assemblies; the adjustable pressure mechanism is installed between the flange assemblies; the adjustable pressure mechanism and the sensing assembly are located on one side of the fixed pressure mechanism; and the sensing assembly is installed between the flange assemblies. Through the technical scheme, the problems that, when the dynamic pressure distribution of the sealing structure in the prior art is uneven, the vacuum degree of a cavity and a process atmosphere are destroyed, the sealing element in a weak compression area cannot fully deform to compensate the thermal expansion and cold shrinkage gap, the service life of the sealing is shortened, the particles falling off are mixed into the process cavity, and the yield of chips is reduced are solved.

Description

Technical Field

[0001] This invention relates to the field of sealing valve technology, and more specifically to a fluid sealing structure and flow control device in semiconductor manufacturing processes. Background Technology

[0002] Complete semiconductor process technology: refers to the entire standardized production and manufacturing process from silicon raw materials to finished chip production, which is divided into two major segments: front-end wafer manufacturing and back-end packaging and testing. In various processes of semiconductor wafer manufacturing, fluid sealing structures are used to achieve airtight isolation of process cavities, vacuum pipelines, fluid valve groups, moving shafts, and chemical delivery channels. They are suitable for ultra-high vacuum, high and low temperature alternation, highly corrosive media, and ultra-clean production environments, ensuring that the process environment meets standards, the fluid medium is pure, and the equipment operates stably. They are a basic supporting structure for achieving precision chip manufacturing. The main functions of sealing structures include maintaining the vacuum environment, preventing internal and external fluid leakage, stabilizing process temperature and pressure, protecting the equipment substrate from media corrosion, ensuring the normal operation of dynamic mechanisms, and extending the service life of equipment. They provide airtight and stable production conditions for core processes such as semiconductor lithography, etching, thin film deposition, and ion implantation. The mainstream sealing structures in the existing technology include perfluoroether elastic O-ring seals, metal end face seals, diaphragm seals, and metal bellows seals. The most widely used and popular type is the elastic O-ring seal, which consists of a perfluoroether sealing ring, a sealing groove, and an anti-extrusion retaining ring. It achieves a seal by pre-tightening and compressing the elastic body to deform and fill the gap. It has the advantages of simple structure, convenient installation, corrosion resistance, and high cost performance, and is the standard static seal for semiconductor equipment. However, existing sealing structures, especially elastic sealing structures, still have some problems at the sealing level: uneven dynamic pressure distribution of the sealing structure. When the pressure distribution is uneven, the clamping force in some areas of the sealing surface is too small, which cannot completely fill the assembly micro gaps. Process gases and media in the vacuum chamber are prone to micro-leakage, which can damage the vacuum level and process atmosphere of the chamber. In addition, the seals in areas with weak clamping force cannot fully deform to compensate for thermal expansion and contraction gaps. Under long-term operation, the gaps will become larger, the overall seal life will be significantly shortened, and leakage failures will easily occur prematurely. Secondly, elastic sealing structures such as O-rings and elastic gaskets are prone to twisting, uneven wear, and local extrusion deformation when one side is under excessive pressure and the other side is under insufficient pressure. This can lead to cracking, bulging, permanent deformation, and rapid loss of sealing resilience. With long-term friction and plasma erosion, problems such as pulverization and shedding may even occur, causing the detached particles to mix into the process chamber, resulting in particle defects on the wafer surface and reducing the chip yield.

[0003] In summary, developing a sealing structure that can adjust pressure distribution in real time according to changes in the semiconductor process environment, extend seal life, reduce particulate generation, and lower maintenance costs has become a key technical problem that urgently needs to be solved in the current semiconductor manufacturing field. Summary of the Invention

[0004] This invention proposes a fluid sealing structure and flow control device for semiconductor process manufacturing. It solves the problems in related technologies where uneven dynamic pressure distribution of the sealing structure makes it impossible to completely fill the assembly micro gaps, and micro-leakage of process gas and vacuum medium in the cavity can easily occur, damaging the cavity vacuum and process atmosphere. Furthermore, the sealing component in areas with weak clamping force cannot fully deform to compensate for thermal expansion and contraction gaps, leading to larger gaps under long-term operation, significantly shortening the overall sealing lifespan, and making it prone to premature leakage and gas leakage failures. With long-term friction and plasma erosion, problems such as pulverization and chipping may even occur, causing detached particles to mix into the process cavity, resulting in particle defects on the wafer surface and reducing chip yield.

[0005] The technical solution of the present invention is as follows: A fluid sealing structure for semiconductor manufacturing processes includes a pipeline body, a flange assembly, a fixed pressure mechanism, an adjustable pressure mechanism, and a sensing assembly. The flange assembly is mounted on the pipeline body; The fixed pressure mechanism is installed between the flange assemblies; The adjustable pressure mechanism is installed between the flange assemblies, and the adjustable pressure mechanism is located on one side of the fixed pressure mechanism; The adjustable pressure mechanism includes a sensing component, which is installed between the flange assemblies.

[0006] Preferably, the flange assembly includes a flange, bolts, nuts, and gaskets; The flange is provided in two parts, and the two flanges are respectively fixedly connected to the two pipe bodies; The bolts are provided in multiple quantities, and all of the bolts rotate between the two flanges; The nut is provided in multiple parts, and the multiple nuts are respectively threaded onto the multiple bolts; The gasket is provided in multiple parts, and the multiple gaskets are rotatably connected to the multiple bolts respectively.

[0007] More preferably, the fixing pressure mechanism includes a fixing ring one, a fixing ring two, a sealing groove, and a perfluoroether sealing ring; The retaining ring is fixedly connected to one of the flanges; The second fixing ring is fixedly connected to another flange. The sealing groove is formed on the first fixing ring; The perfluoroether sealing ring is fixedly connected to the sealing groove, the perfluoroether sealing ring is fixedly connected to the second fixing ring, the perfluoroether sealing ring mates with the sealing groove, and the cross-section of the perfluoroether sealing ring is designed as a trapezoidal structure.

[0008] More preferably, the adjustable pressure mechanism includes a sealing mounting groove, a shape memory alloy sheet, a sealing mating groove, an annular groove, a flexible heating element, a temperature sensor, a wiring ring, and a protective shell; The sealing mounting groove is formed on the first fixing ring, and the sealing mounting groove is located on the side closer to the center of the first fixing ring relative to the sealing groove; The shape memory alloy sheet is fixedly connected in the sealed mounting groove, and the shape memory alloy sheet is designed to be annular. The sealing groove is formed on the second fixing ring, and both the sealing groove and the shape memory alloy sheet are provided with a low-friction coating. The annular groove is formed on the first fixed ring; The flexible heating element is provided in multiple ways, and all of the multiple flexible heating elements are fixedly connected in the annular groove. All of the multiple flexible heating elements are at the same horizontal plane as the shape memory alloy sheet. The temperature sensor is provided in multiple ways, and all of the temperature sensors are fixedly connected to the annular groove. The cable routing ring is detachably connected within the annular groove; The protective shell is detachably connected to the annular groove.

[0009] Furthermore, the sensing component includes a mounting ring groove, a bidirectional slotted ring, a damping spring, a mounting block, and a pressure sensor; The mounting ring groove is provided in two parts, and the two mounting ring grooves are respectively fixedly connected to the first fixing ring and the second fixing ring; The outer wall of the bidirectional slotted ring is slidably connected to the two mounting ring grooves; The damping springs are provided in multiple groups, and the multiple damping springs are divided into two groups. The two groups of damping springs are respectively fixedly connected between the two slots on the bidirectional slotted ring and the two mounting ring slots. The mounting block is fixedly connected to one of the mounting ring grooves; The pressure sensor is provided in multiple parts, and all of the pressure sensors are fixedly connected to the mounting block. The sensing end of the pressure sensor is in contact with another mounting ring groove.

[0010] A semiconductor process flow control device includes a fluid sealing structure for semiconductor process as described in any one of the above solutions.

[0011] The working principle and beneficial effects of this invention are as follows: 1. In this invention, the adjustable pressure mechanism utilizes the characteristics of shape memory alloys and, in conjunction with real-time monitoring and feedback from sensing components, heats the shape memory alloy to adjust the pressure distribution of the sealing structure. This stabilizes the dynamic pressure and prevents the sealing component in areas with weak clamping force from failing to fully deform and compensate for thermal expansion and contraction gaps. Under long-term operating conditions, the gaps will widen, significantly shortening the overall seal lifespan and causing premature leaks, air leaks, insufficient clamping force in some areas of the sealing surface to completely fill assembly micro-gaps, and easy micro-leakage of process gases and media in the vacuum chamber, which can damage the vacuum level and process atmosphere. This ensures the safe and long-term operation of semiconductor processes. 2. In this invention, the fixed pressure mechanism achieves sealing through a conventional elastic sealing structure, which can provide uniform initial sealing pressure and ensure that the basic sealing function can still be maintained under the condition of no external control. In the partitioned sealing method, the elastic sealing structure is an auxiliary seal, which is not prone to problems such as chipping or cracking. Moreover, the elastic sealing structure is located on the outer ring, which can prevent particles from falling into the process cavity and affecting the cost and quality of semiconductors. Attached Figure Description

[0012] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0013] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the sealing structure of the present invention; Figure 3 This is a schematic diagram of the structure of the fixing ring and the shape memory alloy sheet of the present invention. Figure 4 This is a schematic diagram of the fixed ring II structure of the present invention; Figure 5 This is a schematic diagram of the adjustable pressure mechanism of the present invention; Figure 6 This is a schematic diagram of the structure of the sensing component of the present invention; Figure 7 This is a schematic diagram of the structure of the fixing ring of the present invention; Figure 8 This is a schematic diagram of the structure of the sealing mounting groove and the shape memory alloy sheet of the present invention.

[0014] In the diagram: 1. Pipeline body; 2. Flange; 3. Bolt; 4. Nut; 5. Gasket; 6. Retaining ring one; 7. Retaining ring two; 8. Sealing groove; 9. Perfluoroether sealing ring; 10. Sealing mounting groove; 11. Shape memory alloy sheet; 12. Sealing mating groove; 13. Annular groove; 14. Flexible heating element; 15. Temperature sensor; 16. Wiring ring; 17. Protective shell; 18. Mounting ring groove; 19. Bidirectional slotted ring; 20. Damping spring; 21. Mounting block; 22. Pressure sensor. Detailed Implementation

[0015] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0016] like Figures 1-8 As shown, this embodiment proposes a fluid sealing structure for semiconductor process manufacturing, including a pipeline body 1, and further including flange assemblies, a fixed pressure mechanism, an adjustable pressure mechanism, and a sensing component. The flange assembly is mounted on the pipeline body 1, the fixed pressure mechanism is mounted between the flange assemblies, and the adjustable pressure mechanism is mounted between the flange assemblies, with the adjustable pressure mechanism located on one side of the fixed pressure mechanism. The adjustable pressure mechanism includes a sensing component, which is mounted between the flange assemblies. This structure addresses the following pain points in the prior art: When studying the sealing structure issues in semiconductor manufacturing processes, traditional single-material sealing structures cannot meet the high precision, long lifespan, and stability requirements of modern semiconductor processes. Although existing improvement schemes have improved sealing performance to some extent, they still have limitations such as uneven pressure distribution, insufficient dynamic adaptability, and poor long-term stability. Through analysis of existing technologies, it was found that dynamic pressure changes frequently in the semiconductor process environment, and traditional sealing structures cannot respond to these changes in real time, leading to a decline in sealing performance and a shortened lifespan. Furthermore, the particles generated by the sealing structure during long-term operation can seriously affect chip yield, and existing technologies lack real-time monitoring and intelligent control of the pressure distribution in the sealing system. Therefore, this solution utilizes an adjustable pressure mechanism to adjust the pressure distribution of the sealing structure by heating the shape memory alloy, leveraging its properties and real-time monitoring feedback from sensing components. This stabilizes the dynamic pressure and prevents areas with weak clamping force from failing to fully deform and compensate for thermal expansion and contraction, leading to widening gaps over long-term operation, significantly shortening the overall seal lifespan, and premature leakage. It also addresses issues such as insufficient clamping force in some areas of the sealing surface, inability to completely fill assembly micro-gaps, and the potential for micro-leakage of process gases and media within the vacuum chamber, disrupting the chamber vacuum and process atmosphere. This ensures the safe and long-term operation of semiconductor processes. Furthermore: The flange assembly includes a flange 2, bolts 3, nuts 4, and gaskets 5. There are two flanges 2, which are fixedly connected to two pipe bodies 1 respectively. There are multiple bolts 3, which rotate between the two flanges 2. There are multiple nuts 4, which are threaded onto the multiple bolts 3 respectively. There are multiple gaskets 5, which are rotatably connected to the multiple bolts 3 respectively. The flange assembly is locked together by bolts 3, nuts 4, and gaskets 5. It can be quickly disassembled. The multiple bolts 3 are symmetrically tightened, and the pressure is applied evenly, which has the advantages of uniform tightening and good sealing performance.

[0017] The fixed pressure mechanism includes a first fixed ring 6, a second fixed ring 7, a sealing groove 8, and a perfluoroether sealing ring 9. The first fixed ring 6 is fixedly connected to one flange 2, and the second fixed ring 7 is fixedly connected to another flange 2. The sealing groove 8 is formed on the first fixed ring 6, and the perfluoroether sealing ring 9 is fixedly connected to the sealing groove 8 and the second fixed ring 7. The perfluoroether sealing ring 9 mates with the sealing groove 8. The cross-section of the perfluoroether sealing ring 9 is designed as a trapezoidal structure. The fixed pressure mechanism uses a high-elasticity perfluoroether sealing ring 9 and an adjustable pressure mechanism to form a zoned sealing structure. The perfluoroether sealing ring 9 has excellent elasticity and high-temperature resistance. It is manufactured using a molding process, and its trapezoidal cross-section design can provide uniform initial sealing pressure, ensuring that basic sealing function can be maintained even without external control.

[0018] The adjustable pressure mechanism includes a sealing mounting groove 10, a shape memory alloy sheet 11, a sealing mating groove 12, an annular groove 13, a flexible heating element 14, a temperature sensor 15, a wiring ring 16, and a protective shell 17. The sealing mounting groove 10 is formed on the fixing ring 6 and is located on the side closest to the center of the fixing ring 6 relative to the sealing groove 8. The shape memory alloy sheet 11 is fixedly connected in the sealing mounting groove 10 and is annular. The sealing mating groove 12 is formed on the fixing ring 7 and both the sealing mating groove 12 and the shape memory alloy sheet 11 are coated with a low-friction coating. The annular groove 13 is formed on the fixing ring 6. Multiple flexible heating elements 14 are provided and fixedly connected in the annular groove 13. The multiple flexible heating elements 14 are all at the same horizontal plane as the shape memory alloy sheet 11. Multiple temperature sensors 15 are provided and fixedly connected in the annular groove. On the 13, the wiring ring 16 is detachably connected to the annular groove 13. The wiring ring 16 is used to facilitate the wiring of the temperature sensor 15 and the flexible heating element 14, and to prevent the wiring harness from becoming tangled and causing safety problems. The protective shell 17 is detachably connected to the annular groove 13. The shape memory alloy sheet 11 is made of nickel-titanium shape memory alloy. Within the phase transformation temperature range of the shape memory alloy sheet, the alloy will undergo a phase transformation from austenite to martensite, resulting in material deformation, thereby changing the sealing pressure. The low-friction coating on the sealing mating groove 12 and the shape memory alloy sheet 11 can significantly reduce the friction and wear of the sealing interface and extend its service life. In contrast, with the adjustable pressure mechanism of this solution, with the cooperation of the temperature sensor 15 and the control system, the flexible heating element 14 can finely adjust the deformation degree of the shape memory alloy sheet 11 at the position of insufficient sealing pressure under the monitoring of the temperature sensor 15, thereby finely controlling the sealing pressure.

[0019] Finally, the sensing assembly includes a mounting ring groove 18, a bidirectional slotted ring 19, a damping spring 20, a mounting block 21, and a pressure sensor 22. Two mounting ring grooves 18 are provided, respectively fixedly connected to a first fixing ring 6 and a second fixing ring 7. The outer wall of the bidirectional slotted ring 19 is slidably connected to the two mounting ring grooves 18. Multiple damping springs 20 are provided, divided into two groups. The two groups of damping springs 20 are respectively fixedly connected between two slots on the bidirectional slotted ring 19 and the two mounting ring grooves 18. The mounting block 21 is fixedly connected to a mounting block 21. Multiple pressure sensors 22 are provided on the mounting ring groove 18. All pressure sensors 22 are fixedly connected to the mounting block 21. The sensing end of the pressure sensor 22 is in contact with another mounting ring groove 18. The pressure sensor 22 is a piezoresistive pressure sensor 22, and it is under the unified control of the control system, just like the temperature sensor 15 and the flexible heating element 14. It monitors the pressure distribution of the sealing interface at all times. The control system can adjust the heating power according to the temperature change and change the pressure provided by the shape memory alloy sheet 11 to ensure stable sealing performance under different temperature conditions.

[0020] A semiconductor process flow control device includes a fluid sealing structure in a semiconductor process according to any one of the above-mentioned solutions.

[0021] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fluid sealing structure for semiconductor manufacturing processes, comprising a pipeline body (1), characterized in that, Also includes: A flange assembly, which is mounted on the pipe body (1); The flange assembly includes two flanges (2), which are respectively fixedly connected to the two pipeline bodies (1). A fixed pressure mechanism is installed between the flange assemblies; The fixed pressure mechanism includes: A fixing ring (6) is fixedly connected to a flange (2); Fixing ring two (7), which is fixedly connected to another flange (2); A sealing groove (8) is formed on the fixing ring (6); Perfluoroether sealing ring (9), the perfluoroether sealing ring (9) is fixedly connected to the sealing groove (8), the perfluoroether sealing ring (9) is fixedly connected to the fixing ring two (7), the perfluoroether sealing ring (9) cooperates with the sealing groove (8), and the cross section of the perfluoroether sealing ring (9) is set as a trapezoidal structure; An adjustable pressure mechanism is installed between the flange assemblies, and the adjustable pressure mechanism is located on one side of the fixed pressure mechanism; The adjustable pressure mechanism includes: A sealing mounting groove (10) is formed on the fixing ring (6), and the sealing mounting groove (10) is located on the side of the fixing ring (6) near the center of the circle relative to the sealing groove (8). A shape memory alloy sheet (11) is fixedly connected in the sealed mounting groove (10), and the shape memory alloy sheet (11) is annular; A sealing groove (12) is formed on the fixing ring (7), and both the sealing groove (12) and the shape memory alloy sheet (11) are provided with a low friction coating. An annular groove (13) is formed on the fixed ring (6); Flexible heating element (14), multiple flexible heating elements (14) are provided, and multiple flexible heating elements (14) are fixedly connected in the annular groove (13), and multiple flexible heating elements (14) are on the same horizontal plane as the shape memory alloy sheet (11); Temperature sensor (15), multiple temperature sensors (15) are provided, and multiple temperature sensors (15) are fixedly connected to the annular groove (13); Cable routing ring (16), which is detachably connected to the annular groove (13); A protective shell (17) is detachably connected to the annular groove (13); The adjustable pressure mechanism further includes a sensing component, which is installed between the flange assemblies.

2. The fluid sealing structure in a semiconductor manufacturing process according to claim 1, characterized in that, The flange assembly includes: Bolts (3), multiple bolts (3) are provided, and multiple bolts (3) are rotatably connected between the two flanges (2); Nuts (4), a plurality of nuts (4) are provided, and the plurality of nuts (4) are respectively threaded onto the plurality of bolts (3); Gaskets (5), multiple gaskets (5) are provided, and multiple gaskets (5) are rotatably connected to multiple bolts (3).

3. The fluid sealing structure in a semiconductor manufacturing process according to claim 2, characterized in that, The sensing component includes: The mounting ring groove (18) is provided in two parts, and the two mounting ring grooves (18) are respectively fixedly connected to the first fixing ring (6) and the second fixing ring (7); A two-way slotted ring (19) is provided, the outer wall of which is slidably connected to the two mounting ring grooves (18); Damping springs (20), there are multiple damping springs (20), the multiple damping springs (20) are divided into two groups, and the two groups of damping springs (20) are respectively fixedly connected between two slots and two mounting ring slots (18) on the bidirectional slotted ring (19); Mounting block (21), which is fixedly connected to one of the mounting ring grooves (18); Pressure sensor (22), multiple pressure sensors (22) are provided, and multiple pressure sensors (22) are fixedly connected to the mounting block (21). The sensing end of the pressure sensor (22) is in contact with another mounting ring groove (18).

4. A semiconductor process flow control device, characterized in that, The invention includes a fluid sealing structure in a semiconductor manufacturing process as described in any one of claims 1 to 3.

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