A method for manufacturing an ultrathin diamond tool

CN122644583APending Publication Date: 2026-08-28GUANGDONG POLYTECHNIC NORMAL UNIV
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Patent Information

Application Number
CN202610802414.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-04
Publication Date
2026-08-28

AI Technical Summary

Technical Problem

[0004]电镀法虽能通过金属电沉积实现较薄的复合镀层,但其本质仅为机械嵌固,这导致了两个核心问题:一是极薄工具的结构完整性差,由于缺乏冶金结合,随着工具厚度降至微米级,镀层金属对磨料的把持力急剧下降,极易在精密加工中发生磨料脱落与镀层剥离;二是制造精度受限于掩模工艺,难以实现图形化的磨料排布,无法满足复杂图案或变密度排布的定制化需求

Benefits of technology

本发明采用气溶胶沉积形成的超薄金刚石工具胚体,替代传统的电镀法、烧结法、钎焊法。通过气溶胶将金刚石磨料与纳米金属颗粒精准雾化喷射,摆脱了模具和掩模的束缚,能够直接在复杂曲面或超薄基底上数字化的沉积磨料层,实现工具定制化需求,而气溶胶打印非接触式喷射的特点,使得工具厚度可由沉积层数精确控制,轻松突破0.1mm的厚度极限,且无机械应力。后续的激光选择性烧结仅对打印区域进行瞬时高温处理,基体热影响区极小,既保证了薄片基材的力学性能不受损伤,又通过局部冶金结合实现了远超电镀的把持力。

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Abstract

The application discloses a kind of ultra-thin diamond tool preparation methods, by aerosol with nano metal particles precision atomization injection of diamond abrasive, get rid of the bondage of mould and mask, it can be directly deposited abrasive layer on complex curved surface or ultra-thin substrate digitization, realize tool customization demand, and the characteristics of aerosol printing non-contact injection, so that tool thickness can be deposited layer accurately controlled, easily break through 0.1mm thickness limit, and no mechanical stress.Later laser selective sintering only carries out transient high temperature treatment to printing area, and the heat affected zone of the substrate is very small, which ensures that the mechanical properties of the thin sheet substrate are not damaged, and the holding force far exceeds that of electroplating through local metallurgical bonding.
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Description

Technical Field

[0001] This invention relates to the technical field of diamond tool manufacturing methods, specifically to a method for preparing ultrathin diamond tools. Background Technology

[0002] Ultra-thin diamond tools play a crucial role in modern precision manufacturing. Their core value lies in their ability to process hard and brittle materials with extreme precision and efficiency, while minimizing material loss, reducing processing stress, and improving surface quality. These tools include diamond cutting discs, grinding wheels, and wire saws, which are widely used in the semiconductor industry, optoelectronic displays, precision optical component processing, and high-performance composite material cutting in the aerospace field. Ultra-thin diamond tools not only drive the development of microelectronic devices towards smaller, lighter, and more powerful designs, but also serve as key tools for achieving efficient, low-carbon, and high-value-added processing in the high-end manufacturing supply chain. Their technological level directly reflects a nation's core competitiveness in precision manufacturing and materials processing.

[0003] The manufacturing of ultra-thin diamond tools has long been limited by the inherent defects of traditional processes. In particular, when faced with the demand for ultra-thin and customized products, electroplating, sintering and brazing methods have all revealed insurmountable bottlenecks.

[0004] Although electroplating can achieve thin composite coatings through metal electrodeposition, it is essentially just mechanical embedding, which leads to two core problems: First, the structural integrity of ultra-thin tools is poor. Due to the lack of metallurgical bonding, as the tool thickness decreases to the micrometer level, the holding force of the coating metal on the abrasive decreases sharply, making it very easy for the abrasive to fall off and the coating to peel off during precision machining. Second, the manufacturing precision is limited by the mask process, making it difficult to achieve patterned abrasive arrangement and unable to meet the customized needs of complex patterns or variable density arrangements.

[0005] Sintering relies on high temperature and pressure to shape diamond and metal powder. Although it provides high bonding strength, this method has a fundamental bottleneck when manufacturing ultra-thin tools: due to material flow and thermal stress release at high temperatures, tools are prone to warping and uneven dimensional shrinkage during sintering, making it difficult to control thickness tolerances and almost impossible to stably manufacture tools with a thickness of less than 0.1 mm and high flatness. At the same time, the long customization cycle and high cost of molds severely restrict flexible production of small batches and multiple varieties.

[0006] While brazing achieves extremely high abrasive holding power through chemical bonding, its inherent high-temperature, overall heating process is devastating for ultra-thin tools: the substrate softens during annealing at high temperatures, leading to a loss of tool rigidity; simultaneously, the large-area heat input makes the tool highly susceptible to deformation and makes it impossible to manufacture on flexible or heat-sensitive substrates. Furthermore, the brazing process is complex; altering the abrasive arrangement requires redesigning expensive masks or fixtures, making customized production extremely difficult.

[0007] Therefore, there is an urgent need to develop a diamond tool manufacturing method that combines the ultra-thin and sharpness of electroplating, the firm grip of sintering, and the ability for complete flexibility and customization. Summary of the Invention

[0008] Therefore, in order to solve the above problems, the purpose of this invention is to provide a method for preparing ultrathin diamond tools, comprising the following steps: Composite printing ink is prepared by mixing diamond particles, binder, diluent, surfactant, and metal-based binder. The substrate is fixed on the platform, and the composite printing ink is fed into the aerosol printing device; The aerosol printing equipment is controlled to deposit composite printing ink in the form of aerosol onto a preset area on the substrate to form a tool blank. The tool blank is subjected to laser sintering to obtain a diamond tool.

[0009] Preferably, the metal-based binder includes one or more of copper, nickel, aluminum, and titanium.

[0010] Preferably, the binder solution includes one or more of nano-copper composite ink, nano-nickel composite ink, and nano-titanium composite ink.

[0011] Preferably, the diluent includes one or more of anhydrous ethanol and deionized water.

[0012] Preferably, the weight ratio of the binder, diluent, surfactant, and nanodiamond is 3:9-24:12-30:1.

[0013] Preferably, the mixing process is performed by ultrasonic vibration.

[0014] Preferably, the mixing process is carried out by stirring with mechanical equipment for 2-30 minutes.

[0015] Preferably, the particle size range of the nanodiamond is set to 5-500 nm.

[0016] Preferably, the laser sintering is one of nanosecond laser, picosecond laser, or femtosecond laser processes.

[0017] Preferably, the laser sintering power is 5-500W, the scanning speed is 10-2000mm / s, and the number of scans is 1-20.

[0018] Preferably, the substrate is a hard metal alloy, specifically a copper alloy or a nickel alloy.

[0019] The beneficial effects of this invention are: This invention utilizes ultrathin diamond tool blanks formed by aerosol deposition, replacing traditional electroplating, sintering, and brazing methods. By precisely atomizing and spraying diamond abrasive and nano-metal particles via aerosol, it eliminates the constraints of molds and masks, enabling direct digital deposition of abrasive layers on complex curved surfaces or ultrathin substrates. This allows for customized tool design. The non-contact spraying characteristic of aerosol printing allows for precise control of tool thickness through the number of deposition layers, easily exceeding the 0.1mm thickness limit, without mechanical stress. Subsequent laser selective sintering only applies instantaneous high-temperature treatment to the printed area, minimizing the heat-affected zone of the substrate. This ensures the mechanical properties of the thin substrate remain intact while achieving a holding force far exceeding that of electroplating through localized metallurgical bonding. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the ultrathin diamond tool of the present invention; Figure 2 This is a schematic diagram of the preparation process of the ultrathin diamond tool of the present invention; Figure 3 This is the morphology of the lines after aerosol jet printing according to the present invention; Figure 4 This is a SEM image of the aerosol jet printing process of the present invention; Figure descriptions: 1. Substrate; 2. Diamond particles.

[0022] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0024] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] Example 1: Figure 1-2 This invention illustrates a method for preparing an ultrathin diamond tool, comprising the following steps: Step S1: Mix diamond particles, binder, diluent, surfactant, and metal-based binder to obtain composite printing ink; Step S2: Fix the substrate on the platform and input the composite printing ink into the aerosol printing device; Step S3: Control the aerosol printing equipment to deposit composite printing ink in the form of aerosol onto a preset area on the substrate to form a tool blank; Step S4: Perform laser sintering on the tool blank to obtain a diamond tool.

[0027] Step S5: Polish, refine and clean the sintered tools.

[0028] The steps for preparing composite printing ink are as follows: Diamond particles, binder, diluent, surfactant, and metal-based binder are mixed and processed. Nano-copper ink is mixed with anhydrous ethanol, and nano-diamond particles and surfactant polyvinylpyrrolidone are added. The mixture is then subjected to ultrasonic vibration to form a uniform and stable suspension, which serves as the composite printing ink. In the composite ink, the mass fraction of nano-diamond is 1%~15%, and the mass fraction of surfactant PVP is 0.1%~2%. For the following steps: Control the aerosol printing equipment to deposit composite printing ink in the form of an aerosol onto a predetermined area on the substrate to form a tool blank, as detailed below: Set the atomizing gas pressure to 20-80 kPa, the sheath gas flow rate to 10-200 sccm, and the nozzle moving speed to 1-40 mm / s; start printing, and the composite ink is precisely deposited in the form of an aerosol onto the roughened annular area of ​​the substrate to form a uniform tool blank. The steps are as follows: The tool blank is subjected to laser sintering to obtain a diamond tool, as detailed below: Under inert gas protection, a fiber laser is used to scan and sinter the deposited tool blank; the laser power is 10-150 W, the spot diameter is 50-300 μm, and the scanning speed is 1-100 mm / s; the metal binder is melted by laser irradiation and wetted and encapsulated with nanodiamond particles to achieve metallurgical bonding and densification between the composite layer and the substrate. 4) Post-processing: Polish, refine and clean the sintered tools as needed.

[0029] Example 2: Step S1: The nanocomposite ink was prepared using a mixed solution of anhydrous ethanol and ethylene glycol as the solvent system, and nano-copper particles, nano-diamond particles, and polyvinylpyrrolidone (PVP) surfactant as the solutes. The specific preparation method was as follows: First, nano-copper ink (60% solid content) was mixed with anhydrous ethanol and ethylene glycol in a ratio of 1:4.8:3.6. Then, 0.6g of 5-nanometer diamond particles and 0.3g of PVP surfactant were added sequentially to the diluted solution. Next, the mixture was ultrasonically treated for 30 minutes to ensure that the nanoparticles were fully decomposed and agglomerated, achieving initial uniform dispersion. After ultrasonication, the mixture was allowed to stand for a period of time, followed by stirring, to finally obtain a stable nano-copper / diamond composite ink.

[0030] Step S2: Select copper metal as the tool substrate and process it to a dimensional accuracy of 1-5 micrometers and a cylindrical profile through precision grinding; then, perform rigorous ultrasonic cleaning and drying on the cutting edge area of ​​the diamond layer on the substrate; finally, use laser texturing and other technologies to perform controllable roughening treatment on the substrate surface to form a fine texture, which aims to significantly increase its surface area and mechanical interlocking ability, thereby providing an ideal substrate with excellent adhesion and stability for subsequent aerosol jet printing of diamond composite layers.

[0031] Step S3: Fix the pre-fabricated substrate onto the printer heating platform and complete the position calibration. Then, set the key process parameters according to the characteristics of the composite ink: atomizing gas pressure of 1.0 kPa, sheath gas flow rate of 90 sccm, carrier gas flow rate of 400 sccm, printhead movement speed of 20 mm / s, and temperature of 60℃. After setting the parameters, start printing. The composite ink is atomized into an aerosol, which is then ejected from the printhead under the focusing of the sheath gas flow and precisely deposited onto the predetermined area of ​​the substrate along the preset path.

[0032] Step S4: After aerosol jet printing, in-situ sintering is performed using a laser. In the subsequent laser in-situ sintering stage, under the protection of argon or nitrogen, a fiber laser with a wavelength of 1064 nm is used. A focused laser with a power of 75 W and a spot diameter of 150 μm is used to irradiate the deposited layer at a scanning speed of 50 mm / s.

[0033] Example 3: Step S1: The nanocomposite ink was prepared using a mixed solution of anhydrous ethanol and ethylene glycol as the solvent system, and nano-nickel particles, nano-diamond particles, and polyvinylpyrrolidone (PVP) surfactant as the solutes. The specific preparation method was as follows: First, nano-copper ink (60% solid content) was mixed with anhydrous ethanol and ethylene glycol in a ratio of 1:4.8:3.6. Then, 0.6g of 5-nanometer diamond particles and 0.3g of PVP surfactant were added sequentially to the diluted solution. Next, the mixture was ultrasonically treated for 30 minutes to ensure that the nanoparticles were fully decomposed and agglomerated, achieving initial uniform dispersion. After ultrasonication, the mixture was allowed to stand for a period of time, followed by stirring, to finally obtain a stable nano-nickel / diamond composite ink.

[0034] Step S2: Nickel metal is selected as the tool substrate and precision-ground to achieve a dimensional accuracy of 1-5 micrometers and a cylindrical profile. Subsequently, the cutting edge area of ​​the diamond layer on the substrate is subjected to rigorous ultrasonic cleaning and drying. Finally, laser texturing and other technologies are used to controllably roughen the surface of the substrate to form a fine texture, which aims to significantly increase its surface area and mechanical interlocking ability, thereby providing an ideal substrate with excellent adhesion and stability for subsequent aerosol jet printing of diamond composite layers.

[0035] Step S3: Fix the pre-fabricated substrate onto the printer heating platform and complete the position calibration. Then, set the key process parameters according to the characteristics of the composite ink: atomizing gas pressure of 1.0 kPa, sheath gas flow rate of 90 sccm, carrier gas flow rate of 400 sccm, printhead movement speed of 20 mm / s, and temperature of 60℃. After setting the parameters, start printing. The composite ink is atomized into an aerosol, which is then ejected from the printhead under the focusing of the sheath gas flow and precisely deposited onto the predetermined area of ​​the substrate along the preset path.

[0036] Step S4: After aerosol jet printing, in-situ sintering is performed using a laser. In the subsequent laser in-situ sintering stage, under the protection of argon or nitrogen, a fiber laser with a wavelength of 1064 nm is used. A focused laser with a power of 75 W and a spot diameter of 150 μm is used to irradiate the deposited layer at a scanning speed of 50 mm / s.

[0037] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for preparing an ultrathin diamond tool, characterized in that, Includes the following steps: Composite printing ink is prepared by mixing diamond particles, binder, diluent, surfactant, and metal-based binder. The substrate is fixed on the platform, and the composite printing ink is fed into the aerosol printing device; The aerosol printing equipment is controlled to deposit composite printing ink in the form of aerosol onto a preset area on the substrate to form a tool blank. The tool blank is subjected to laser sintering to obtain a diamond tool.

2. The method for preparing ultrathin diamond tools according to claim 1, characterized in that, The metal-based binder includes one or more of copper, nickel, aluminum, and titanium.

3. The method for preparing ultrathin diamond tools according to claim 1, characterized in that, The binder solution includes one or more of nano-copper composite ink, nano-nickel composite ink, and nano-titanium composite ink.

4. The method for preparing ultrathin diamond tools according to claim 1, characterized in that, The diluent includes one or more of anhydrous ethanol and deionized water.

5. The method for preparing ultrathin diamond tools according to claim 1, characterized in that, The weight ratio of the binder, diluent, surfactant, and nanodiamond is 3:9-24:12-30:

1.

6. The method for preparing ultrathin diamond tools according to claim 1, characterized in that, The mixing process is performed by ultrasonic vibration.

7. The method for preparing ultrathin diamond tools according to claim 1, characterized in that, The mixing process involves stirring the mixture with mechanical equipment for 2-30 minutes.

8. The method for preparing ultrathin diamond tools according to claim 1, characterized in that, The particle size range of the nanodiamond is set to 5-500 nm.

9. The method for preparing ultrathin diamond tools according to claim 1, characterized in that, The laser sintering power is 5-500W, the scanning speed is 10-2000mm / s, and the number of scans is 1-20.

10. The method for preparing ultrathin diamond tools according to claim 1, characterized in that, The substrate is a hard metal alloy.