A light-weight solder wire delivery head structure with sealing cooling and maintainability functions

Abstract

The application relates to the field of semiconductor device packaging, and discloses a lightweight tin wire conveying head structure with sealing and cooling and maintainable functions, which comprises a conveying head main body composed of a lightweight material structure and a wear-resistant material structure and a tin wire conveying pipe, wherein the conveying head main body is internally provided with a cooling space; through the combined application of the wear-resistant material and the lightweight material, the conveying head structure is greatly lightened in weight on the basis of guaranteeing the structural strength, wear resistance and long service life, can effectively reduce the motion inertia, improve the motion response speed and acceleration for the application scene of the tin drawing head needing high-speed motion, thereby being favorable for improving the equipment production efficiency, and achieving the balanced selection under the requirements of structural lightweight, structural stability, structural durability and production efficiency and the like.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device packaging, specifically a lightweight solder wire delivery head structure that combines sealing and cooling with maintainability. Background Technology

[0002] A hot die bonder is an automated device widely used in the packaging of power semiconductor devices. It is mainly used to fix chips onto lead frames, substrates or other carriers with solder. In the hot die bond process that uses solder wire as the solder supply method, it is usually necessary to transport the solder wire to the surface of the high-temperature lead frame through a solder wire conveyor head to achieve solder application or drawing.

[0003] Since the solder wire eventually comes into contact with the high-temperature lead frame during the conveying process, a cooling structure is usually installed inside the solder wire conveying head to prevent heat from being conducted upwards along the conveying channel and causing the solder wire to melt prematurely inside the conveying head. This cooling medium is used to cool the solder wire conveying channel. In the existing technology, the solder wire conveying head structure mainly includes two forms: a fully sealed welded structure and a fully detachable structure. The fully sealed welded structure has good sealing performance and can be directly cooled by compressed air. The fully detachable structure is easy to maintain and can be quickly disassembled and maintained in case of solder blockage.

[0004] While the solder wire feed head used in existing hot die bonders can achieve the functions of solder wire feeding and cooling, it still has many shortcomings in practical applications:

[0005] While solder wire feed heads made of wear-resistant metal materials such as stainless steel and alloy steel can meet the requirements for strength, wear resistance and service life, their overall weight is relatively large. When applied to hot solder bonding machines, the large motion mass increases the system inertia because the solder head needs to follow the motion mechanism in high-speed reciprocating motion, thereby limiting the motion acceleration and response speed, which is not conducive to further improving the production efficiency of the equipment.

[0006] While aluminum alloy conveyor heads made of lightweight materials can effectively reduce motion inertia and improve motion response speed, their wear resistance is relatively poor. Under long-term conveying and friction of the tin wire, wear and dimensional changes are likely to occur, which will affect the accuracy of tin wire conveying and product quality, and reduce the service life of the conveyor head.

[0007] For solder wire conveying heads with a fully sealed welded structure, although a good sealed cooling cavity can be formed and compressed air can be used directly as the cooling medium, when the inside of the solder wire conveying tube becomes blocked, maintenance and cleaning are difficult because the conveying tube cannot be disassembled. In severe cases, the entire conveying head assembly may need to be replaced, thereby increasing maintenance costs and downtime.

[0008] For tin wire feed heads with a fully detachable structure, although the feed tube can be disassembled and maintained, its structure is difficult to keep completely sealed for a long time. In high-temperature working environments, protective gas is usually required to be used continuously as a cooling medium to avoid gas leakage into the working area and adversely affecting the welding quality. Compared with compressed air, the long-term use cost of protective gas is higher, thus increasing the equipment operating cost. Summary of the Invention

[0009] The purpose of this invention is to provide a lightweight solder wire delivery head structure that combines sealing and cooling with maintainability, in order to solve the problems mentioned in the background art.

[0010] To achieve the above objectives, the present invention provides the following technical solution:

[0011] A lightweight solder wire delivery head structure that combines sealing, cooling, and maintainability includes a delivery head body and a solder wire delivery tube;

[0012] The main body of the conveying head is configured as a multi-segment columnar structure, and the tin wire conveying tube is coaxially nested inside the main body of the conveying head;

[0013] The main body of the conveying head has an internal hollow structure and forms a closed cooling space with the solder wire conveying tube. The cooling space is arranged along the length of the solder wire conveying tube.

[0014] The side wall of the conveying head body is provided with an air inlet and an air outlet in sequence in the feeding direction of the tin wire conveying tube. Both the air inlet and the air outlet are connected to the cooling space. The air inlet and the air outlet are respectively connected to the external cooling circulation to circulate and pump the cooling medium into the cooling space through the air inlet.

[0015] The main body of the conveying head is composed of a lightweight material structure and a wear-resistant material structure at both ends of the lightweight material structure and at the contact point with the tin wire conveying pipe.

[0016] As a further embodiment of the present invention: the conveying head body includes an upper shell, an intermediate guide fluid, and a lower shell;

[0017] The intermediate guide fluid is disposed in the middle part of the conveying head body. The upper shell and the lower shell are respectively disposed at the upper and lower ends of the intermediate guide fluid along the feeding direction of the tin wire conveying pipe. The cooling space is formed by the upper shell, the intermediate guide fluid and the lower shell sealing together.

[0018] The air inlet is provided on the side wall of the intermediate fluid guide, and the air outlet is provided on the side wall of the lower housing;

[0019] An extended guide pipe is also provided on the side of the intermediate guide pipe facing the lower housing. The diameter and length of the extended guide pipe are both smaller than the cooling space.

[0020] The air inlet is directly connected to the inner cavity of the extended guide pipe to extend the cooling circulation path.

[0021] As a further embodiment of the present invention: the upper shell, the intermediate fluid guide, and the lower shell are lightweight structural regions made of lightweight metal materials;

[0022] The upper shell, the intermediate fluid guide, and the lower shell are permanently fixed together and cannot be disassembled.

[0023] As a further embodiment of the present invention: the conveying head body further includes an upper connecting seat and a lower connecting seat respectively provided at both ends;

[0024] The upper connecting seat and the lower connecting seat are made of highly wear-resistant metal material;

[0025] The lower connector is covered and disposed at the end of the lower housing, and is sealed and welded to the solder wire delivery pipe;

[0026] The upper connecting seat and the upper housing, as well as the lower housing and the lower connecting seat, are all connected by a detachable sealed connection.

[0027] As a further aspect of the present invention, the cooling medium includes one or more of compressed air, nitrogen, argon, inert gas, and liquid cooling medium.

[0028] As a further embodiment of the present invention: the surfaces of the upper connecting seat and the lower connecting seat are further provided with one or more combinations of a reinforced surface, a wear-resistant coating, and a hard insert.

[0029] As a further aspect of the present invention, the lightweight metal material is formed by one or more combinations of hollow weight-reduction structures, honeycomb structures, topology optimization structures, and additive manufacturing lightweight structures.

[0030] Compared with the prior art, the beneficial effects of the present invention are:

[0031] By applying highly wear-resistant metal materials to the solder wire conveying pipe and key connection parts, and using lightweight metal materials in non-wear-resistant structural areas, the overall weight of the solder wire conveying head is reduced while ensuring structural strength, service life, and stability of key connection parts. This effectively reduces moment of inertia, increases acceleration and response speed, thereby shortening the cycle time and improving equipment production efficiency.

[0032] The combination of partial permanent sealing and partial detachability allows the solder wire delivery pipe to be disassembled and maintained while ensuring its sealing and cooling performance. When the solder wire delivery pipe becomes blocked, it can be directly removed for cleaning or replacement without replacing the entire delivery head assembly, thus reducing maintenance difficulty and equipment downtime. At the same time, it also provides basic sealing conditions for the use of low-cost compressed air cooling media. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of a lightweight solder wire delivery head structure that combines sealing, cooling, and maintainability.

[0034] Figure 2 This is a cross-sectional schematic diagram of a lightweight solder wire delivery head structure that combines sealing, cooling, and maintainability.

[0035] Figure 3 This is a schematic diagram of the mating structure between the lower housing and the lower connecting seat in a lightweight solder wire conveying head structure that combines sealing, cooling, and maintainability.

[0036] Figure 4 This is a schematic diagram of the intermediate fluid guide and upper shell in a lightweight solder wire conveying head structure that combines sealing, cooling, and maintainability.

[0037] Figure 5 This is a schematic diagram of the upper connecting seat in a lightweight solder wire conveying head structure that combines sealing, cooling, and maintainability.

[0038] In the diagram: 1-Tin wire delivery pipe, 2-Upper connecting seat, 3-Upper shell, 4-Intermediate guide fluid, 5-Lower shell, 6-Lower connecting seat. Detailed Implementation

[0039] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects disclosed in this embodiment as detailed in the appended claims.

[0040] Please see Figures 1 to 5In this embodiment of the invention, a lightweight solder wire conveying head structure with both sealing and cooling functions and maintainability includes a conveying head body and a solder wire conveying tube 1. The conveying head body is a multi-segment columnar structure, and the solder wire conveying tube 1 is coaxially nested inside the conveying head body. The conveying head body has an internal hollow structure and forms a closed cooling space with the solder wire conveying tube 1. The cooling space is arranged along the length direction of the solder wire conveying tube 1. The sidewall of the conveying head body is provided with an air inlet and an air outlet in sequence in the feeding direction of the solder wire conveying tube 1. Both the air inlet and the air outlet are connected to the cooling space and are respectively connected to an external cooling circulation to circulate and pump cooling medium into the cooling space through the air inlet. The conveying head body is composed of a lightweight material structure and wear-resistant material structures provided at both ends of the lightweight material structure and at the contact points with the solder wire conveying tube 1.

[0041] The conveying head body includes an upper shell 3, an intermediate guide fluid 4, and a lower shell 5. The intermediate guide fluid 4 is located in the middle part of the conveying head body. The upper shell 3 and the lower shell 5 are respectively located at the upper and lower ends of the intermediate guide fluid 4 along the feeding direction of the tin wire conveying pipe. The cooling space is formed by the upper shell 3, the intermediate guide fluid 4, and the lower shell 5 sealing together. The air inlet is located on the side wall of the intermediate guide fluid 4, and the air outlet is located on the side wall of the lower shell 5. An extension guide tube is also provided on the side of the intermediate guide fluid 4 facing the lower shell 5. The diameter and length of the extension guide tube are smaller than the cooling space. The air inlet is directly connected to the inner cavity of the extension guide tube to extend the cooling circulation path.

[0042] The upper shell 3, the intermediate fluid guide 4, and the lower shell 5 are lightweight structural regions made of lightweight metal materials; the upper shell 3, the intermediate fluid guide 4, and the lower shell 5 are permanently fixed together in a non-removable manner.

[0043] The main body of the conveying head also includes an upper connecting seat 2 and a lower connecting seat 6 respectively provided at both ends; the upper connecting seat 2 and the lower connecting seat 6 are made of high wear-resistant metal material; the lower connecting seat 6 is covered and disposed at the end of the lower housing 5 and is sealed and welded to the tin wire conveying pipe 1; the upper connecting seat 2 and the upper housing 3 and the lower housing 5 and the lower connecting seat 6 are all detachably sealed and connected.

[0044] The working principle of this invention is:

[0045] The solder wire conveying head structure of the present invention includes a conveying head body, a solder wire conveying pipe 1 disposed inside the conveying head body, and a cooling space between the conveying head body and the solder wire conveying pipe 1. In use, the solder wire is conveyed to the working end along the solder wire conveying pipe 1. Cooling gas enters the conveying head body through the air inlet and flows in the cooling space, and is finally discharged from the air outlet, thereby continuously cooling the solder wire conveying pipe and preventing the solder wire from melting prematurely due to heat conduction during the conveying process.

[0046] Specifically, the main body of the conveyor head includes an upper connecting seat 2, an upper housing 3, an intermediate guide fluid 4, a lower housing 5, and a lower connecting seat 6. The solder wire conveying pipe 1, the upper connecting seat 2, and the lower connecting seat 6 constitute the key structural areas that are in direct contact with the solder wire conveying pipe. The upper housing 3, the intermediate guide fluid 4, and the lower housing 5 constitute the lightweight structural areas of the main body of the conveyor head. The solder wire conveying pipe 1 and the lower connecting seat 6 are connected by a sealed weld to form a permanent sealed structure at the working end. The upper connecting seat 2 and the upper housing 3, as well as the lower housing 5 and the lower connecting seat 6, are connected by a detachable sealed connection. The structure allows for the disassembly and maintenance of the delivery pipe; the upper shell 3, the intermediate guide pipe 4, and the lower shell 5 are permanently connected to form a sealed cooling cavity; the cooling space is formed by the upper shell 3, the intermediate guide pipe 4, and the lower shell 5 together, and under the action of the extended guide pipe, the cooling space is divided into inner and outer layers. The inner layer is directly connected to the air inlet and closely cooperates with the tin wire delivery pipe 1, so that the incoming cooling compressed gas can obtain the optimal cooling effect, and then the airflow (cooling medium) is discharged through the outer space and connected to the air outlet.

[0047] Compared to existing technologies, this embodiment employs a conveyor head body composed of a combination of highly wear-resistant and lightweight materials. Key stress-bearing components that directly contact or connect with the solder wire conveying tube are made of highly wear-resistant metal materials to ensure structural strength, wear resistance, and long service life. Meanwhile, components far from wear areas and primarily responsible for structural support are made of lightweight metal materials to reduce overall weight and moment of inertia. While ensuring the wear resistance and structural reliability of key components, the overall weight of the conveyor head can be significantly reduced, thereby reducing moment of inertia and achieving higher motion response speed and acceleration. This approach is suitable for high-speed soldering applications, and for soldering applications, it can reduce the load on the motion mechanism and improve equipment operational stability.

[0048] Unlike existing connection and sealing methods, in this embodiment, one end of the solder wire conveying pipe 1 is permanently sealed to the working end (to the lower connecting seat 6), preventing cooling gas from leaking from the working end. This ensures that a sealed cooling cavity can be formed inside the conveying head, allowing compressed air to be used directly as the cooling medium. Meanwhile, the other end of the solder wire conveying pipe 1 (to the upper connecting seat 2) is detachably connected to the conveying head body. When the solder wire conveying pipe becomes blocked, the connection structure can be disassembled to remove the solder wire conveying pipe from the conveying head body, and the blocked area can be cleaned by heating or replaced. This avoids the problem of the entire conveying head being scrapped due to blockage of the conveying pipe, reduces maintenance costs, and shortens equipment downtime.

[0049] In this embodiment of the invention, a lightweight solder wire delivery head structure that combines sealing and cooling with maintainability is provided, wherein the cooling medium includes one or more of compressed air, nitrogen, argon, inert gas, and liquid cooling media.

[0050] The surfaces of the upper connecting seat 2 and the lower connecting seat 6 are further provided with one or more combinations of reinforced surfaces, wear-resistant coatings, and hard inserts.

[0051] The lightweight metal material is also formed through one or more combinations of hollow weight-reduction structures, honeycomb structures, topology optimization structures, and additive manufacturing lightweight structures.

[0052] In this embodiment, the options for cooling medium, high wear-resistant metal material, and lightweight metal material are expanded. Thanks to the sealed cooling space structure in the previous embodiment, this embodiment can select a variety of cooling media and high-pressure compressed air for cooling. Cooling with compressed air is the most economical technical solution.

[0053] For highly wear-resistant metal materials, surface strengthening, wear-resistant coatings, and hard inserts are all technical means to enhance their wear resistance. Specifically, these include: using heat treatment to strengthen the surface hardness; using surface strengthening processes such as nitriding and carburizing; using surface treatment processes such as electroplating and electroless plating; using wear-resistant coatings such as DLC coating, CrN coating, TiN coating, and ceramic coating; using hard alloy insert structures; and using metal matrix composite structures.

[0054] For lightweight metal materials, specifically, magnesium alloys, titanium alloys, carbon fiber composites, and polymer composites can be selected; or lightweight structures can be manufactured using materials such as honeycomb structures, hollow weight-reduction structures, integrated topology optimization structures, and lightweight structures formed by additive manufacturing.

[0055] Additionally, maintainable functional areas can be connected using various reusable assembly and disassembly methods, such as flange connections, snap-fit ​​connections, snap ring connections, gland connections, quick-locking connections, modular plug-in connections, pin connections, and clamping connections.

[0056] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the disclosure in the specification and embodiments. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0057] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A lightweight solder wire delivery head structure that combines sealing and cooling with maintainability, characterized in that, Includes the main body of the conveyor head and the tin wire conveying tube (1); The main body of the conveying head is configured as a multi-segment columnar structure, and the tin wire conveying tube (1) is coaxially nested inside the main body of the conveying head; The main body of the conveying head has an internal hollow structure and forms a closed cooling space with the solder wire conveying pipe (1). The cooling space is arranged along the length direction of the solder wire conveying pipe (1). The side wall of the conveying head body is provided with an air inlet and an air outlet in sequence in the feeding direction of the tin wire conveying pipe (1). The air inlet and the air outlet are both connected to the cooling space. The air inlet and the air outlet are respectively connected to the external cooling circulation, so as to circulate and pump the cooling medium into the cooling space through the air inlet. The main body of the conveying head is composed of a lightweight material structure and a wear-resistant material structure set at both ends of the lightweight material structure and at the contact point with the tin wire conveying pipe (1).

2. The lightweight solder wire feeder structure with both sealing and cooling functions and maintainability as described in claim 1, characterized in that, The main body of the conveying head includes an upper shell (3), an intermediate guide fluid (4), and a lower shell (5); The intermediate guide fluid (4) is set in the middle part of the conveying head body. The upper shell (3) and the lower shell (5) are respectively set at the upper and lower ends of the intermediate guide fluid (4) along the feeding direction of the tin wire conveying pipe. The cooling space is formed by the upper shell (3), the intermediate guide fluid (4) and the lower shell (5) sealing together. The air inlet is provided on the side wall of the intermediate guide fluid (4), and the air outlet is provided on the side wall of the lower housing (5); The intermediate guide fluid (4) is also provided with an extended guide tube on the side facing the lower shell (5), and the diameter and length of the extended guide tube are smaller than the cooling space; The air inlet is directly connected to the inner cavity of the extended guide pipe to extend the cooling circulation path.

3. The lightweight solder wire feeder structure with both sealing and cooling functions and maintainability as described in claim 2, characterized in that, The upper shell (3), the intermediate fluid guide (4), and the lower shell (5) are lightweight structural regions made of lightweight metal materials; The upper shell (3), the intermediate fluid guide (4), and the lower shell (5) are permanently fixedly connected in a non-removable manner.

4. The lightweight solder wire feeder structure with both sealing and cooling functions and maintainability as described in claim 3, characterized in that, The conveyor head body also includes an upper connecting seat (2) and a lower connecting seat (6) respectively provided at both ends; The upper connecting seat (2) and the lower connecting seat (6) are made of highly wear-resistant metal material; The lower connecting seat (6) is disposed over the end of the lower housing (5) and is sealed and welded to the solder wire delivery pipe (1); The upper connecting seat (2) and the upper housing (3) and the lower housing (5) and the lower connecting seat (6) are all connected by a detachable sealed connection.

5. The lightweight solder wire feeder structure with both sealing and cooling functions and maintainability as described in claim 1, characterized in that, The cooling medium includes one or more of compressed air, nitrogen, argon, inert gas, and liquid cooling media.

6. The lightweight solder wire feeder structure with both sealing and cooling functions and maintainability as described in claim 4, characterized in that, The surfaces of the upper connecting seat (2) and the lower connecting seat (6) are further provided with one or more combinations of reinforced surfaces, wear-resistant coatings, and hard inserts.

7. The lightweight solder wire feeder structure with both sealing and cooling functions and maintainability as described in claim 3, characterized in that, The lightweight metal material is also formed by one or more combinations of hollow weight-reduction structures, honeycomb structures, topology optimization structures, and additive manufacturing lightweight structures.

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