An automatic loading and unloading equipment for super-high-capacity double-hollowed carrier boards

Abstract

The application discloses an automatic feeding and discharging equipment for double-milled ultra-high-capacity carrier plates, adopts a symmetrical closed-loop layout, comprises a feeding system and a discharging system, the feeding system and the discharging system are symmetrical in action logic and opposite in operation direction, and the core comprises a double-flower-basket feeding module, an upper-and-lower-layer staggered double-carrier-plate transmission module, a double-gantry deviation rectifying module and a cooperative control system. Through the design of 'double-carrier-plate synchronous sheet laying and taking + upper-and-lower-layer staggered layout', in combination with double-flower-basket synchronous feeding and double-gantry integrated three-axis deviation rectifying technology, double-carrier-plate synchronous sheet laying and taking operation is realized, the capacity is doubled only with a small increase in horizontal occupation, the capacity ceiling of single-carrier-plate operation is broken, the upper-and-lower-layer staggered avoidance mechanism effectively avoids action interference, the high stability operation of the equipment is ensured, the double-gantry integrated deviation rectifying replaces the UVW deviation rectifying module, the equipment has less hardware investment, high compatibility, and greatly reduced unit capacity investment and operation cost.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic cell production equipment technology, and in particular to an automated loading and unloading equipment for ultra-high capacity double-hollow carrier plates. Background Technology

[0002] The global energy transition is accelerating, and heterojunction solar cell technology, with its advantages of high conversion efficiency, low temperature coefficient, and long lifespan, has become the mainstream development path in the photovoltaic industry. As the industry moves towards GW-level or even 1GW-level mass production, stringent requirements are placed on the capacity, precision, space utilization, and cost control of production equipment. As the core load-bearing component in the heterojunction solar cell coating process, the efficiency and space adaptability of the automated loading and unloading system of the perforated carrier plate directly determine the upper limit of the entire production line capacity, plant operating costs, and the company's industrial competitiveness.

[0003] Existing perforated carrier plate loading and unloading technologies are mainly divided into two categories: one is the traditional single carrier plate single basket scheme, which adopts a single-sided single basket feeding + single carrier plate sheet laying mode, with low capacity and poor space utilization, which can no longer meet the needs of GW-level mass production; the other is the improved single carrier plate double basket scheme, which optimizes the feeding cycle through double basket lifting and inserting sheet and step buffer technology, but is still based on the single carrier plate operation logic, and the capacity has an inherent ceiling. If capacity needs to be increased, it can only be achieved by horizontally arranging multiple sets of equipment, resulting in a surge in horizontal footprint, high infrastructure costs, complex synchronous control of multiple equipment, and high risk of motion interference.

[0004] Among similar technical solutions currently on the market, Fujian Jinshi Energy's publicly disclosed "a basket-type wafer loading and unloading mechanism" uses a multi-arm cross-reciprocating transmission structure to improve wafer loading and unloading efficiency. However, it still relies on single-carrier operation, resulting in limited capacity improvement. Furthermore, the multi-arm transmission structure suffers from poor stability and high maintenance difficulty. Suzhou Chengtuo Intelligent's single-sided basket feeding system is specifically designed for single-carrier operation, lacking space optimization design, and requires a significant increase in floor space for capacity expansion. None of the aforementioned existing technologies have solved the core technical problem of "synchronous operation of dual carriers and staggered layout of upper and lower layers," making it impossible to double capacity without significantly increasing floor space and failing to meet the actual needs of GW-level mass production of heterojunction solar cells. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides an automated loading and unloading equipment for ultra-high capacity double-hollow carrier plates. Through the core design of "synchronous wafer laying and picking of double carrier plates + staggered layout of upper and lower layers", combined with dual-gantry integrated three-axis correction technology, the production capacity is doubled with only a slight increase in horizontal footprint compared to single-carrier plate equipment. At the same time, it improves the stability of equipment operation and space utilization, reduces unit production cost, and adapts to the GW-level mass production needs of heterojunction cells.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: an automated loading and unloading equipment for ultra-high capacity double-hollow carrier plates, which adopts a symmetrical closed-loop layout, including a loading system and an unloading system, wherein the loading system and the unloading system have symmetrical action logic and opposite operation directions;

[0007] The feeding system includes a feeding plate conveying mechanism and a feeding basket conveying mechanism, and the unloading system includes an unloading plate conveying mechanism and an unloading basket conveying mechanism.

[0008] Both the loading and unloading plate conveying mechanisms include a plate conveying frame and an upper and lower layer staggered double plate conveying module and a double gantry correction module integrated thereon. The upper and lower layer staggered double plate conveying module includes a plate low-position lifting device and a plate conveying mechanism. The plate conveying mechanism is provided with a longitudinally layered upper layer conveying channel and a lower layer conveying channel. The upper and lower layers of the double plates are staggered and operate synchronously without interference, realizing the mid-position staggered separation, high-position plate laying positioning, converging and waiting for materials, and maintenance flow of the double plates.

[0009] The dual-gantry correction module includes a lower-level gantry correction module and an upper-level gantry correction module. Both are calibrated based on a unified absolute coordinate system and are uniformly scheduled by the collaborative control system according to the carrier board position deviation data collected by the CCD vision positioning system to synchronously complete silicon wafer gripping, X / Y / R three-axis integrated correction, and synchronous wafer laying / removal of dual carrier boards.

[0010] Both the loading and unloading basket conveying mechanisms are integrated with a dual basket feeding module, which simultaneously provides silicon wafers to the upper and lower carrier boards or simultaneously recycles silicon wafers.

[0011] Furthermore, the low-position lifting device for the carrier plate includes a low-position carrier plate transmission mechanism one, a low-position carrier plate transmission mechanism two, and a lifting power mechanism, which are used to receive two empty carrier plates one by one and lift them synchronously.

[0012] Furthermore, the carrier plate transmission mechanism includes a middle carrier plate transmission mechanism one, a middle carrier plate transmission mechanism two, a middle lifting device one, a middle lifting device two, a high carrier plate transmission mechanism one, a high carrier plate transmission mechanism two, a high carrier plate convergence transmission mechanism, and an initial carrier plate maintenance transmission mechanism.

[0013] The middle-position carrier plate transfer mechanism one and the middle-position carrier plate transfer mechanism two separate the double empty carrier plates into upper and lower layers by staggering. The middle-position lifting device one and the middle-position lifting device two lift the staggered double empty carrier plates to the high-position carrier plate transfer mechanism one and the high-position carrier plate transfer mechanism two, respectively. The high-position carrier plate transfer mechanism one and the high-position carrier plate transfer mechanism two transport the staggered carrier plates to the upper and lower layer laying stations, respectively.

[0014] The high-level carrier plate confluence and transmission mechanism will merge the upper and lower layers of the fully loaded dual carrier plates in a staggered manner and send them synchronously into the coating equipment. The initial carrier plate maintenance and transmission mechanism will send the initial empty carrier plate into the equipment and integrate it into the flow process. When the carrier plate needs to be repaired, it can be output through this mechanism without interrupting the operation of the whole machine, thus improving the continuous operation capability of the equipment.

[0015] Furthermore, the dual flower basket feeding module is integrated on the carrier plate conveyor frame and the flower basket side frame, including a flower basket conveying system, a dual flower basket transfer mechanism, a dual flower basket lifting mechanism, a dual scooping mechanism, a visual inspection mechanism, an NG rejection mechanism, and a step buffer positioning mechanism;

[0016] The flower basket conveying system includes a full flower basket conveying mechanism and an empty flower basket conveying mechanism, which respectively realize the feeding of full flower baskets and the discharging of empty flower baskets.

[0017] The double flower basket lifting mechanism includes a flower basket lifting module, a flower basket transplanting and positioning component, and a silicon wafer alignment component, which are used for the precise picking and placing, positioning, and pre-alignment of silicon wafers in full flower baskets.

[0018] The dual wafer-removing mechanism includes an X-axis wafer-removing assembly, a primary lifting torque converter assembly, a Y-axis transfer assembly, and a secondary lifting torque converter assembly, used for synchronous wafer removal and two torque conversion adaptations.

[0019] The visual inspection mechanism detects the appearance and orientation of the silicon wafers and works with the NG rejection mechanism to reject unqualified silicon wafers and trigger the replacement logic.

[0020] The step buffer positioning mechanism includes a conveyor belt assembly, a silicon wafer alignment assembly, an opening and closing assembly, a buffer positioning assembly, and a lifting assembly. It is used for receiving, aligning, buffering, and positioning silicon wafers to be grasped. The buffer assembly and the conveyor assembly operate independently to avoid material supply interruption.

[0021] Furthermore, the lower gantry correction module and the upper gantry correction module have the same structure, both including linear motor one, gantry rotation point A, gantry Y-axis correction power, gantry suction cup assembly, gantry rotation point B, gantry lifting modules on both sides, and linear motor two.

[0022] The gantry rotation point A, the gantry Y-axis correction power, the gantry suction cup assembly, and the gantry rotation point B constitute a single gantry beam assembly. Multiple sets of this assembly are configured in both the upper and lower modules, along with multiple sets of vacuum suction cups.

[0023] The gantry rotation point B is configured with a linear guide rail that moves along the Y-axis to form a flexible floating connection. The gantry lifting modules on both sides drive the gantry beam assembly to lift as a whole.

[0024] The carrier board position deviation data collected by the CCD vision positioning system is transmitted to the collaborative control system. The linear motor one and linear motor two drive the gantry beam assembly to deflect around the gantry rotation point A through asynchronous misalignment. In conjunction with the gantry Y-axis correction power, X / Y / R three-axis integrated correction is achieved. Through the method of "linear motor asynchronous misalignment + flexible floating connection", X / Y / R three-axis precise correction can be achieved without the need for an additional UVW correction module. Multiple rows of silicon wafers can be picked up simultaneously in one go, matching the requirements of synchronous wafer laying of dual carrier boards.

[0025] As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following advantages:

[0026] 1. This invention, through the design of "simultaneous laying and picking of wafers on dual carrier plates + staggered layout of upper and lower layers", combined with the integrated double gantry correction technology, successfully doubled the production capacity with only a slight increase in the horizontal footprint, breaking through the production capacity ceiling of single carrier plate operation. No new complete equipment is required, the equipment hardware investment is small, and the overall cost is greatly reduced.

[0027] 2. The dual-mechanism synchronous operation eliminates the cycle time loss of the single-carrier mode. The upper and lower layer staggered avoidance mechanism effectively avoids motion interference and ensures the high stability of the equipment. The gantry integrated correction replaces many small UVW correction modules, which simplifies the structure, reduces failure points, and lowers manufacturing costs and maintenance difficulty.

[0028] 3. Based on existing mature technology upgrades, it can be seamlessly integrated with existing HJT / HBC production lines, MES systems and PVD / PECVD equipment; it adopts a modular design, each module is independently detachable, and the upper and lower channels can be started and stopped independently to adapt to different production capacity requirements. Attached Figure Description

[0029] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0030] Figure 1 This is a schematic diagram of the overall system layout of the ultra-high capacity double-hollow carrier plate automated loading and unloading equipment of the present invention;

[0031] Figure 2 This is a schematic diagram of the structure of the loading plate conveying mechanism (a) of the present invention;

[0032] Figure 3 This is a schematic diagram of the structure of the flower basket conveying mechanism (b) of the present invention;

[0033] Figure 4 This is a schematic diagram of the structure of the double flower basket feeding module of the present invention;

[0034] Figure 5This is a schematic diagram of the structure of the upper and lower layer staggered dual-carrier board transmission module of the present invention;

[0035] Figure 6 This is a schematic diagram of the upper and lower double gantry correction module of the present invention.

[0036] Explanation of reference numerals in the attached figures:

[0037] a- Loading plate conveyor mechanism, b- Loading basket conveyor mechanism, c- Unloading plate conveyor mechanism, d- Unloading basket conveyor mechanism;

[0038] 1-Low-position lifting device for the carrier plate; 11-Low-position carrier plate transmission mechanism one; 12-Low-position carrier plate transmission mechanism two; 13-Lifting power mechanism.

[0039] 2-Carrier board transmission mechanism, 21-Mid-position carrier board transmission mechanism one, 22-Mid-position carrier board transmission mechanism two, 23-High-position carrier board transmission mechanism one, 24-High-position carrier board transmission mechanism two, 25-High-position carrier board convergence transmission mechanism, 26-Initial carrier board maintenance transmission mechanism;

[0040] 3-Mid-position lifting device, 31-Mid-position lifting device one, 32-Mid-position lifting device two;

[0041] 4-Gantry correction mechanism, 41-Lower gantry correction module, 411-Linear motor one, 412-Gantry rotation point A, 413-Gantry Y-axis correction power, 414-Gantry suction cup assembly, 415-Gantry rotation point B, 416-Both sides of the gantry lifting module, 417-Linear motor two, 42-Upper gantry correction module;

[0042] 5. Visual inspection agencies;

[0043] 6-Step buffer positioning mechanism, 61-Conveyor belt assembly, 62-Silicon wafer alignment assembly, 63-Opening and closing assembly, 64-Buffer positioning assembly, 65-Lifting assembly;

[0044] 3-Carrier plate transfer rack;

[0045] 21-Flower basket conveying system, 211-Full flower basket conveying mechanism, 212-Empty flower basket conveying mechanism;

[0046] 22-Double flower basket transfer mechanism, 23-Double flower basket lifting mechanism, 231-Flower basket lifting module, 232-Flower basket transplanting and positioning component, 233-Silicon wafer straightening component;

[0047] 25-Double-blade mechanism, 251-X-axis blade assembly, 252-Primary lifting torque converter assembly, 253-Y-axis transfer assembly, 254-Secondary lifting torque converter assembly;

[0048] 26-Visual inspection unit, 27-NG rejection unit, 3-Basket side frame. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0050] Example

[0051] refer to Figure 1-6 An automated loading and unloading equipment for ultra-high capacity double-hollow carrier plates adopts a symmetrical closed-loop layout, including a loading system and an unloading system. The loading system and the unloading system have symmetrical action logic and opposite operating directions.

[0052] The feeding system includes a feeding plate conveying mechanism a and a feeding basket conveying mechanism b, and the unloading system includes an unloading plate conveying mechanism c and an unloading basket conveying mechanism d.

[0053] Both the loading plate conveying mechanism a and the unloading plate conveying mechanism c include a plate conveying frame 3 and an upper and lower layer staggered double plate conveying module and a double gantry correction module 4 integrated thereon. The upper and lower layer staggered double plate conveying module includes a plate low-position lifting device 1 and a plate conveying mechanism 2. The plate conveying mechanism 2 is provided with a longitudinally layered upper layer conveying channel and a lower layer conveying channel. The upper and lower layers of the double plates are staggered and operate synchronously without interference.

[0054] The low-position lifting device 1 for the carrier plate includes a low-position carrier plate transmission mechanism 11, a low-position carrier plate transmission mechanism 2 12, and a lifting power mechanism 13, which is used to receive two empty carrier plates one by one and lift them synchronously.

[0055] The carrier plate transmission mechanism 2 includes a mid-position carrier plate transmission mechanism 1 21, a mid-position carrier plate transmission mechanism 22, a mid-position lifting device 1 23, a mid-position lifting device 24, a high-position carrier plate transmission mechanism 1 25, a high-position carrier plate transmission mechanism 26, a high-position carrier plate convergence transmission mechanism 27, and an initial carrier plate maintenance transmission mechanism 28.

[0056] The middle-position carrier plate transfer mechanism 1 21 and the middle-position carrier plate transfer mechanism 22 separate the double empty carrier plates into upper and lower layers by staggering. The middle-position lifting device 1 23 and the middle-position lifting device 24 lift the staggered double empty carrier plates to the high-position carrier plate transfer mechanism 1 23 and the high-position carrier plate transfer mechanism 24, respectively. The high-position carrier plate transfer mechanism 1 23 and the high-position carrier plate transfer mechanism 24 transport the staggered carrier plates to the upper and lower layer laying stations, respectively.

[0057] The operation flow of the upper and lower layer staggered dual-carrier plate transmission module is as follows: In the initial state, the low-position lifting device 1 is in the low position. First, the first empty carrier plate is received by its built-in low-position carrier plate transmission mechanism 11. Then, the lifting power mechanism 13 drives the device to rise to a preset height, and the second empty carrier plate is received by the second low-position carrier plate transmission mechanism 12, completing the orderly reception of the dual carrier plates one by one. After reception, the entire device is lifted to the middle position, and the two empty carrier plates are simultaneously sent to the carrier plate transmission mechanism 2. In the middle position, the first empty carrier plate is transmitted to the middle position carrier plate transmission mechanism 21 and stopped, while the second empty carrier plate continues to move forward and is transmitted to the middle position carrier plate transmission mechanism 22 and stops, realizing the upper and lower layer staggered separation. Next, the middle lifting device 23 lifts the first empty carrier plate to the high carrier plate transfer mechanism 26 as the upper layer laying station; the middle lifting device 24 lifts the second empty carrier plate to the high carrier plate transfer mechanism 25 as the lower layer laying station.

[0058] The dual-gantry correction module 4 includes a lower gantry correction module 41 and an upper gantry correction module 42. The two have the same structure and both include a linear motor 411, a gantry rotation point A 412, a gantry Y-axis correction power 413, a gantry suction cup assembly 414, a gantry rotation point B 415, two gantry lifting modules 416, and a linear motor 417.

[0059] The gantry rotation point A412, the gantry Y-axis correction power 413, the gantry suction cup assembly 414, and the gantry rotation point B415 constitute a single gantry beam assembly. Multiple sets of this assembly are configured in both the upper and lower modules, along with multiple sets of vacuum suction cups. The gantry rotation point B415 is equipped with a linear guide rail that moves along the Y-axis, forming a flexible floating connection. The gantry lifting modules 416 on both sides drive the gantry beam assembly to lift and lower as a whole.

[0060] The lower gantry correction module 41 and the upper gantry correction module 42 are calibrated based on a unified absolute coordinate system. The carrier board position deviation data collected by the CCD vision positioning system 5 is transmitted to the collaborative control system. The linear motor 1 411 and the linear motor 2 417 drive the gantry beam assembly to deflect around the gantry rotation point A412 through asynchronous misalignment. In conjunction with the gantry Y-axis correction power 413, X / Y / R three-axis integrated correction is performed. Through the method of "linear motor asynchronous misalignment + flexible floating connection", X / Y / R three-axis precise correction can be achieved without the need for an additional UVW correction module. Multiple rows of silicon wafers can be picked up simultaneously in one go, matching the requirements of synchronous wafer laying of dual carrier boards.

[0061] The correction principle is as follows: First, two linear motors move synchronously to the wafer picking position, the lifting modules on both sides descend, and the suction cup assembly synchronously picks up the multiple rows of silicon wafers positioned on the upper and lower step buffer mechanisms. Simultaneously, the CCD vision positioning system 5 collects the precise positional deviation of the upper and lower carrier boards in real time, and transmits the data to the collaborative control system. After system calculation, it instructs linear motor 1 (411) and linear motor 2 (417) to perform asynchronous misalignment actions, generating a misalignment amount Δx. Since the gantry rotation point A412 is fixed, while the rotation point B415 can flexibly float via the Y-axis linear guide, this Δx distance difference drives the entire gantry beam assembly to complete a precise angular deflection around point A, achieving R-axis correction. At the same time, the gantry Y-axis correction power 413 performs Y-axis compensation, and the linear motor itself completes X-axis positioning.

[0062] After the alignment is completed, the two gantry cranes descend synchronously, precisely laying the silicon wafers onto the upper and lower carrier plates below. Once the wafers are laid, the fully loaded carrier plates are transferred via the high-level carrier plate transfer mechanism to the upper and lower channels of the high-level carrier plate confluence transfer mechanism 25, forming a confluence, and waiting for the PVD equipment's feed signal before being synchronously fed into the cavity for coating.

[0063] The initial carrier plate maintenance and transmission mechanism 26 sends the initial empty carrier plate into the equipment and integrates it into the flow process. When the carrier plate needs maintenance, it can be output through this mechanism without interrupting the operation of the whole machine, thus improving the continuous operation capability of the equipment.

[0064] Both the loading basket conveyor mechanism b and the unloading basket conveyor mechanism d are integrated with a double basket feeding module 6, which provides silicon wafers to the upper and lower carrier boards simultaneously or recycles silicon wafers simultaneously.

[0065] The double flower basket feeding module 6 is integrated on the carrier plate conveyor frame 3 and the flower basket side frame 7, including a flower basket conveying system 61, a double flower basket transfer mechanism 62, a double flower basket lifting mechanism 63, a double scooping mechanism 64, a vision inspection mechanism 65, an NG rejection mechanism 66, and a step buffer positioning mechanism 67.

[0066] The flower basket conveying system 61 includes a full flower basket conveying mechanism 611 and an empty flower basket conveying mechanism 612, which respectively realize the feeding of full flower baskets and the discharging of empty flower baskets.

[0067] The double flower basket lifting mechanism 63 includes a flower basket lifting module 631, a flower basket transplanting and positioning component 632, and a silicon wafer alignment component 633, which are used for the precise picking and placing, positioning, and silicon wafer pre-alignment of the full flower basket.

[0068] The dual wafer-removing mechanism 64 includes an X-axis wafer-removing assembly 641, a primary lifting torque converter assembly 642, a Y-axis transfer assembly 643, and a secondary lifting torque converter assembly 644, which are used for synchronous wafer removal and two torque conversion adaptations.

[0069] The visual inspection mechanism 65 detects the appearance and orientation of the silicon wafer and works with the NG rejection mechanism 66 to reject unqualified silicon wafers and trigger the replacement logic.

[0070] The step buffer positioning mechanism 67 includes a conveyor belt assembly 671, a silicon wafer alignment assembly 672, an opening and closing assembly 673, a buffer positioning assembly 674, and a lifting assembly 675. It is used for receiving, aligning, buffering, and positioning silicon wafers to be picked up. The buffer assembly and the conveyor assembly operate independently to avoid interruption of material supply.

[0071] The operation flow of the double flower basket feeding module is as follows: the double flower basket lifting mechanism 63 takes out the full flower basket from the preset position of the shuttle line and completes the positioning through the flower basket transplanting and positioning component 632; the silicon wafer straightening component 633 straightens the silicon wafer in the flower basket in both directions to ensure that the silicon wafers have the same posture; then the flower basket lifting module 631 drives the flower basket to descend to the preset wafer removal position and waits for the wafer removal action.

[0072] During the wafer removal and torque conversion stage, the X-axis wafer removal assembly 641 of the dual wafer removal mechanism 64 simultaneously removes the silicon wafer from the double baskets and transfers it to the primary lifting and torque conversion assembly 642. The primary lifting and torque conversion assembly 642 simultaneously lifts the silicon wafer and completes a first torque conversion, adapting the silicon wafer to the receiving size of the Y-axis transfer assembly 643. The Y-axis transfer assembly 643 extends to the receiving position, and the primary lifting and torque conversion assembly 642 descends to place the silicon wafer on the Y-axis transfer assembly 643, which then retracts to the corresponding position of the secondary lifting and torque conversion assembly 644. The secondary lifting and torque conversion assembly 644 rises to receive the silicon wafer, simultaneously completing a second torque conversion to adapt to the feeding size of the step buffer positioning mechanism 67, and then descends to smoothly place the silicon wafer onto the conveyor belt assembly 671.

[0073] During the buffering stage, the conveyor belt assembly 671 drives the silicon wafers forward, correcting their left and right orientation as they pass the silicon wafer alignment assembly 672, until the silicon wafers cover the preset area of ​​the conveyor belt. The buffer positioning assembly 674 opens via the opening and closing assembly 673, and the lifting assembly 675 drives it to descend and avoid the silicon wafers on the conveyor belt; subsequently, the opening and closing assembly 673 closes, and the lifting assembly 675 drives the buffer positioning assembly 674 to rise and lift the silicon wafer, completing the buffer positioning and waiting for the gantry correction mechanism 4 to grab it. The loading carrier conveyor mechanism a is equipped with multiple sets of this module, and is arranged correspondingly to the upper and lower double gantry correction mechanisms 4 to achieve synchronous feeding of the upper and lower carriers.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automated loading and unloading device for ultra-high capacity double-hollow carrier plates, characterized in that, The system adopts a symmetrical closed-loop layout, including a feeding system and a discharging system. The feeding system and the discharging system have symmetrical operation logic and opposite operation directions. The feeding system includes a feeding plate conveying mechanism (a) and a feeding basket conveying mechanism (b), and the unloading system includes an unloading plate conveying mechanism (c) and an unloading basket conveying mechanism (d). The loading plate conveying mechanism (a) and the unloading plate conveying mechanism (c) both include a plate conveying frame (3) and an upper and lower layer staggered double plate conveying module and a double gantry correction module (4) integrated thereon. The upper and lower layer staggered double plate conveying module includes a plate low-position lifting device (1) and a plate conveying mechanism (2). The plate conveying mechanism (2) is provided with a longitudinally layered upper layer conveying channel and a lower layer conveying channel. The upper and lower layers of the double plates are staggered and operate synchronously without interference. The dual-gantry correction module (4) includes a lower gantry correction module (41) and an upper gantry correction module (42). The two are calibrated based on a unified absolute coordinate system and are uniformly scheduled by the collaborative control system according to the carrier board position deviation data collected by the CCD vision positioning system (5) to synchronously complete silicon wafer grabbing, X / Y / R three-axis integrated correction and dual carrier board synchronous wafer laying / removal. Both the loading basket conveyor (b) and the unloading basket conveyor (d) are integrated with a double basket feeding module (6) to simultaneously supply silicon wafers to the upper and lower carrier boards or to simultaneously recycle silicon wafers.

2. The automated loading and unloading equipment for ultra-high capacity double-hollow carrier plates according to claim 1, characterized in that, The low-position lifting device (1) includes a low-position carrier plate transmission mechanism one (11), a low-position carrier plate transmission mechanism two (12) and a lifting power mechanism (13), which are used to receive two empty carrier plates one by one and lift them synchronously.

3. The automated loading and unloading equipment for ultra-high capacity double-hollow carrier plates according to claim 1, characterized in that, The carrier plate transmission mechanism (2) includes a mid-position carrier plate transmission mechanism one (21), a mid-position carrier plate transmission mechanism two (22), a mid-position lifting device one (23), a mid-position lifting device two (24), a high-position carrier plate transmission mechanism one (25), a high-position carrier plate transmission mechanism two (26), a high-position carrier plate convergence transmission mechanism (27), and an initial carrier plate maintenance transmission mechanism (28). The middle-position carrier plate transfer mechanism one (21) and the middle-position carrier plate transfer mechanism two (22) separate the double empty carrier plates into upper and lower layers by staggering. The middle-position lifting device one (23) and the middle-position lifting device two (24) lift the staggered double empty carrier plates to the high-position carrier plate transfer mechanism one (23) and the high-position carrier plate transfer mechanism two (24) respectively. The high-position carrier plate transfer mechanism one (23) and the high-position carrier plate transfer mechanism two (24) transport the staggered carrier plates to the upper and lower layer laying stations respectively. The high-level carrier plate confluence transmission mechanism (25) will merge the upper and lower layers of the fully loaded dual carrier plates in a staggered manner and send them into the coating equipment simultaneously. The initial carrier plate maintenance transmission mechanism (26) will send the initial empty carrier plate into the equipment.

4. The automated loading and unloading equipment for ultra-high capacity double-hollow carrier plates according to claim 1, characterized in that, The double flower basket feeding module (6) is integrated on the carrier plate conveyor frame (3) and the flower basket side frame (7), including the flower basket conveying system (61), the double flower basket transfer mechanism (62), the double flower basket lifting mechanism (63), the double scooping mechanism (64), the vision inspection mechanism (65), the NG rejection mechanism (66), and the step buffer positioning mechanism (67). The flower basket conveying system (61) includes a full flower basket conveying mechanism (611) and an empty flower basket conveying mechanism (612), which respectively realize the feeding of full flower baskets and the discharging of empty flower baskets; The double flower basket lifting mechanism (63) includes a flower basket lifting module (631), a flower basket transplanting and positioning component (632), and a silicon wafer straightening component (633), which are used for the precise picking and placing, positioning, and pre-positioning of the silicon wafers in full flower baskets. The dual wafer-removing mechanism (64) includes an X-axis wafer-removing assembly (641), a primary lifting torque converter assembly (642), a Y-axis transfer assembly (643), and a secondary lifting torque converter assembly (644), which are used for synchronous wafer removal and two torque conversion adaptations. The visual inspection mechanism (65) detects the appearance and orientation of the silicon wafer and cooperates with the NG rejection mechanism (66) to reject unqualified silicon wafers and trigger the replacement logic; The step buffer positioning mechanism (67) includes a conveyor belt assembly (671), a silicon wafer alignment assembly (672), an opening and closing assembly (673), a buffer positioning assembly (674), and a lifting assembly (675), which are used for receiving, aligning, buffering, and positioning silicon wafers to be grasped.

5. The automated loading and unloading equipment for ultra-high capacity double-hollow carrier plates according to claim 1, characterized in that, The lower gantry correction module (41) and the upper gantry correction module (42) have the same structure, both including linear motor one (411), gantry rotation point A (412), gantry Y-axis correction power (413), gantry suction cup assembly (414), gantry rotation point B (415), two gantry lifting modules (416), and linear motor two (417). The gantry rotation point A (412), gantry Y-axis correction power (413), gantry suction cup assembly (414), and gantry rotation point B (415) constitute a single gantry beam assembly. Multiple sets of this assembly are configured in both the upper and lower modules, and are equipped with multiple sets of vacuum suction cups. The gantry rotation point B (415) is equipped with a linear guide rail that moves along the Y-axis to form a flexible floating connection. The gantry lifting modules (416) on both sides drive the gantry beam assembly to lift as a whole. The carrier plate position deviation data collected by the CCD vision positioning system (5) is transmitted to the collaborative control system. The linear motor one (411) and the linear motor two (417) drive the gantry beam assembly to deflect around the gantry rotation point A (412) through asynchronous misalignment action, and cooperate with the gantry Y-axis correction power (413) to perform integrated correction of the X / Y / R three axes.

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