Semiconductor wafer synchronous loading and unloading transmission device

Abstract

The present application relates to transmission device technical field, especially a kind of semiconductor wafer synchronous feeding and discharging transmission device.Its technical scheme includes support frame, deposition equipment, open-close structure, feeding and discharging structure, feeding structure, purging structure and bearing base module;Including deposition equipment includes deposition tank;The open-close structure includes motor one and closure plate;The feeding and discharging structure includes hydraulic rod, motor two, feeding frame and material walking frame;The feeding structure includes collection frame, valve block two, motor three and push plate;The bearing base module includes base body and processing track.The present application improves versatility and maintenance convenience by independent bearing base module, eliminates station waiting by synchronous feeding and discharging design, reduces the number of deposition tank door opening, cooperates with independent channel and synchronous purging to guarantee deposition environment stability, avoids wafer breakage by extruded part and track cooperative conveying, improves device practicality, stability and production efficiency and wafer yield.

Description

Technical Field

[0001] This invention relates to the field of transmission device technology, and in particular to a semiconductor wafer synchronous loading and unloading transmission device. Background Technology

[0002] In semiconductor wafer thin film deposition, synchronous loading and unloading is a key step to improve production efficiency and ensure process stability. Most existing deposition equipment does not achieve true synchronous loading and unloading, and mostly adopts a serial loading and unloading mode. That is, the deposited wafer and carrier are first taken out from the deposition tank, and then the wafer to be processed and the carrier are pushed in. There is a significant waiting gap between workstations, which greatly reduces production efficiency.

[0003] Meanwhile, existing devices typically employ integrated, non-separable carrier bases, resulting in poor versatility and difficulty in adapting to different wafer sizes. Furthermore, they are inconvenient to maintain and have high debugging costs. Existing transport mechanisms lack precise coordinated control, making the carrier base prone to collisions and displacement during transport, leading to wafer damage. Additionally, the timing of loading / unloading is mismatched with the deposition process, requiring significant manual intervention and hindering large-scale production. All these issues restrict the efficiency and yield improvement of wafer deposition processes. Therefore, those skilled in the art have provided a semiconductor wafer synchronous loading / unloading transport device to address the problems mentioned in the background. Summary of the Invention

[0004] The purpose of this invention is to address the problems existing in the background art by proposing a semiconductor wafer synchronous loading and unloading transmission device.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor wafer synchronous loading and unloading transfer device, comprising a support frame, a deposition equipment, an opening and closing structure, a loading and unloading structure, a feeding structure, a purging structure, and a support base module; the deposition equipment includes a deposition tank; The opening and closing structure includes a motor and a closing plate. The closing plate moves longitudinally driven by the motor and moves the sedimentation tank. The loading and unloading structure includes a hydraulic rod, a motor, a feeding frame, and a conveying frame; the feeding frame and the conveying frame are both connected to the inside of the sedimentation tank, the feeding frame is provided with symmetrically distributed feeding tracks, and the conveying frame is provided with symmetrically distributed arc-shaped tracks. The feeding structure includes a collection frame, a valve block two, a motor three, and a push plate. The motor three is fixed at the lower end of the collection frame. The feeding structure is used to push the material received by the material feeding frame individually. The support base module includes a base body and a processing track. The base pump body is provided with a placement tray for placing semiconductor wafers. The processing track is symmetrically distributed inside the deposition tank. The base body is transported inside the processing track.

[0006] Preferably, the sedimentation tank has an inlet and an outlet at both ends, the inlet corresponds to a feeding frame, the outlet corresponds to a conveying frame, the feeding track extends to the inlet, and the processing track extends to the outlet.

[0007] Preferably, both ends of the base body are rotatably mounted with equally spaced ball bearings. The ball bearings are rolled and fitted into the inner walls of the feeding track and the processing track. Through the rolling support provided by the ball bearings, the base body moves inside the feeding track and the processing track.

[0008] Preferably, one end of the deposition device is provided with an outlet cover, and a plate valve is provided at the opening of the outlet cover.

[0009] Preferably, the inner wall of the sedimentation tank is provided with a conductive rail, the lower end of the base body is provided with a brush that is slidably installed inside the conductive rail, the lower end of the placement plate is provided with a support rod that slides through the interior of the base body, the outer wall of the support rod is sleeved with a positioning ring, and a spring is provided between the positioning ring and the base body and sleeved on the outside of the support rod.

[0010] Preferably, the output end of the motor is rotatably mounted inside the upper end of the sedimentation tank, and the output end of the motor is provided with a screw. The inner walls of the inlet and outlet are slidably mounted with closing plates. The inner wall of the sedimentation tank is provided with two sets of symmetrically distributed positioning rails. The inner walls of the positioning rails are rotatably mounted with equidistantly distributed positioning beads. The positioning beads are attached to the outer wall of the closing plate. The inner wall of the sedimentation tank is provided with sealing sleeves at the inlet and outlet to provide sliding sealing support for the closing plate.

[0011] Preferably, the inner wall of the sedimentation tank is provided with a bearing bracket, the lower end of the screw is rotatably installed inside the bearing bracket, a connecting plate is provided between the closing plates, a nut is embedded in the connecting plate, and the nut is threadedly installed on the outer wall of the screw.

[0012] Preferably, the second motor is fixed at one end of the feeding frame, and the output end of the second motor is provided with a second screw that is rotatably installed inside the feeding frame. A second nut is threadedly installed on the outer wall of the second screw. A second bearing bracket is provided at one end of the feeding frame, and one end of the second screw is rotatably installed inside the second bearing bracket. A push block is provided at the upper end of the second nut. A slide is provided on the inner wall of the lower end of the feeding frame. The second nut is slidably installed on the outer wall of the slide. An output pipe is provided at one end of the feeding frame, and a control valve is provided inside the output pipe. A valve frame is embedded inside the upper end of the feeding frame, and a first valve block is slidably installed inside the valve frame. A hydraulic rod with a telescopic end connected to a plate valve is provided at the upper end of the feeding frame.

[0013] Preferably, the feeding structure includes a collection frame, a second valve block, a third motor, and a push plate. The output end of the motor is provided with a turntable, the push plate is fixed to the outer wall of the turntable, the inner wall of the collection frame is provided with symmetrically distributed guide plates, one end of the collection frame is sleeved on the outer side of the feeding frame, the collection frame has a valve port inside, the second valve block is slidably installed inside the valve port, one end of the second valve block is provided with a support collar, the support collar is slidably installed with a positioning rod, one end of the positioning rod is provided with a positioning seat connected to the outer wall of the collection frame, a first spring is provided between the positioning seat and the support collar and sleeved on the outer side of the positioning rod, the force-bearing end of the second valve block is inclined, and the bottom of the feeding frame and the collection frame sleeved together has a stroke groove for the push plate to rotate and move.

[0014] Preferably, the purging structure includes a storage tank, a pump is provided at the output end of the storage tank, and a first purging pipe and a second purging pipe are provided at the output end of the pump. One end of the first purging pipe is provided with a connecting cover that communicates with the sedimentation tank, and the second purging pipe passes through the feed frame.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention sets up a fixed base for deposition as an independent support base module, enabling it to stably support semiconductor wafers and provide power. It adapts to the thin film deposition processing requirements inside the deposition tank. The device constructs independent loading and unloading channels through a feed frame and a feed rail connected to the deposition tank. With the help of an extruder built into the feed frame, along with the feed and processing rails, the support base module is transported smoothly and accurately. The opening and closing structure precisely controls the opening and closing of each channel, preventing contamination caused by the deposition environment connecting with the outside world. Simultaneously, a purging structure intervenes to purge when the channels are open, effectively removing impurities and dust, ensuring the cleanliness and stability of the deposition environment. While the feed frame pushes the support base module to be processed, the extruder simultaneously pushes the processed wafer and support base module into the feed rail, truly achieving simultaneous loading and unloading, significantly improving operational efficiency. By designing the support base as an independent module, versatility and ease of maintenance are enhanced, allowing for the processing of wafers of different specifications and reducing equipment debugging and maintenance costs. The synchronous loading and unloading design completely eliminates waiting gaps at workstations, reduces the number of times the deposition tank door is opened, avoids vacuum environment disruption and temperature fluctuations, and improves wafer deposition yield. The independent channel design, combined with a purging structure, prevents impurities and dust from entering the deposition tank, ensuring a stable deposition environment and improving thin film deposition quality. The extrusion components and track work together to ensure smooth movement of the support base module, preventing wafer collisions and displacement, and reducing breakage rates. The opening and closing structure precisely controls the on / off state, and in conjunction with the energized support base, achieves coordinated operation of the entire process of processing, conveying, and loading / unloading, resulting in a high degree of automation, reduced manual intervention, and suitability for large-scale mass production needs, thus improving the overall practicality, stability, and production efficiency of the equipment. Attached Figure Description

[0016] Figure 1 This is a front-view three-dimensional structural schematic diagram of the present invention; Figure 2 This is a side-view perspective view of the three-dimensional structure of the present invention; Figure 3 This is a schematic diagram of the main cross-sectional three-dimensional structure of the sedimentation tank of the present invention; Figure 4 For the present invention Figure 3 Side view of the three-dimensional structure; Figure 5 This is a front-view three-dimensional structural diagram of the opening and closing structure of the present invention; Figure 6 This is a top-view perspective view of the loading and unloading structure of the present invention. Figure 7 This is a schematic diagram of the main sectional three-dimensional structure of the feed frame of the present invention; Figure 8 This is a top-section three-dimensional structural diagram of the feeding frame of the present invention; Figure 9 This is a three-dimensional structural diagram of the valve block from both sides of the present invention; Figure 10 This is a three-dimensional structural diagram of the motor of the present invention viewed from below. Figure 11 This is a front-view three-dimensional structural diagram of the support base module of the present invention; Figure 12 This is a top-section three-dimensional structural diagram of the valve frame of the present invention.

[0017] Figure label: 100. Support frame; 200. Sedimentation equipment; 201. Sedimentation tank; 202. Feed inlet; 203. Discharge outlet; 204. Plate valve; 205. Drainage hood; 300. Opening and closing structure; 301. Motor 1; 302. Screw 1; 303. Connecting plate; 304. Bearing bracket 1; 305. Nut 1; 306. Closing plate; 307. Positioning rail; 308. Positioning pressure ball; 400. Loading and unloading structure; 401. Valve frame; 402. Hydraulic rod; 403. Valve block one; 404. Motor two; 405. Feeding frame; 406. Feeding frame; 407. Arc track; 408. Slide; 409. Feeding track; 410. Bearing bracket two; 411. Push block; 412. Output pipe; 413. Nut two; 414. Screw two; 500. Feeding structure; 501. Collection frame; 502. Guide plate; 503. Valve block two; 504. Valve port; 505. Positioning seat; 506. Positioning rod; 507. Support collar; 508. Spring one; 509. Stroke groove; 510. Motor three; 511. Turntable; 512. Push plate; 600. Purge structure; 601. Storage tank; 602. Pump; 603. Purge pipe one; 604. Purge pipe two; 605. Connecting cover; 700, Support base module; 701, Machining track; 702, Base body; 703, Placement tray; 704, Ball bearing II; 705, Conductive rail; 706, Brush; 707, Support rod; 708, Positioning ring; 709, Spring II. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figures 1 to 12 The present invention provides four embodiments: Example 1:

[0020] A semiconductor wafer synchronous loading and unloading transfer device includes a support frame 100, a deposition equipment 200, an opening and closing structure 300, a loading and unloading structure 400, a feeding structure 500, a purging structure 600, and a support base module 700; the deposition equipment 200 includes a deposition tank 201. The opening and closing structure 300 includes a motor 301 and a closing plate 306. The closing plate 306 moves longitudinally driven by the motor 301 and closes the sedimentation tank 201. The loading and unloading structure 400 includes a hydraulic rod 402, a motor 404, a feeding frame 405, and a conveying frame 406; the feeding frame 405 and the conveying frame 406 are both connected to the inside of the sedimentation tank 201. The feeding frame 405 is provided with symmetrically distributed feeding tracks 409, and the conveying frame 406 is provided with symmetrically distributed arc tracks 407. The feeding structure 500 includes a collection frame 501, a valve block 503, a motor 510, and a push plate 512. The motor 510 is fixed at the lower end of the collection frame 501. The feeding structure 500 is used to push the material received by the material feeding frame 406 separately. The carrier base module 700 includes a base body 702 and a processing track 701. The base pump body is provided with a placement tray 703 for placing semiconductor wafers. The processing track 701 is symmetrically distributed inside the deposition tank 201. The base body 702 is transported inside the processing track 701.

[0021] In this embodiment, during the thin film deposition process of semiconductor wafers, the semiconductor wafers are stably placed, transported, loaded and unloaded, and deposited. At the same time, the deposition environment is controlled to be stable to ensure the normal operation of the process. The device consists of a support frame 100, a deposition equipment 200, an opening and closing structure 300, a loading and unloading structure 400, a feeding structure 500, a purging structure 600, and a support base module 700. These parts are interconnected and cooperate with each other. The deposition tank 201 is the cavity in which the wafer completes the thin film deposition process. All deposition processes must be carried out inside the deposition tank 201. The opening and closing structure 300 consists of a motor 301 and a closing plate 306. The motor 301 drives the closing plate 306 to move up and down, controlling the opening and closing of the inlet 202 and outlet 203 of the deposition tank 201. When the channel is open, the wafer can enter and exit. When the channel is closed, the deposition tank 201 is isolated from the outside world to prevent external air, dust, and impurities from entering. The loading / unloading structure 400 includes a hydraulic rod 402, a motor 404, a feed frame 405, and a conveyor frame 406. The feed frame 405 stores the wafers to be processed and the carrier base module 700, while the conveyor frame 406 receives the processed wafers and the carrier base module 700. The feed frame 405 and the conveyor frame 406 are respectively connected to the deposition tank 201, forming independent loading and unloading channels. The feeding structure 500 pushes and organizes the materials in the conveyor frame 406 to ensure a continuous and uninterrupted unloading process. The purging structure 600 introduces gas into the deposition tank 201 and the feed frame 405 to remove residual gas, dust, and impurities, maintaining a clean and stable deposition environment. The support base module 700 is used to directly place semiconductor wafers. After placement, it is stable and does not wobble. It can move smoothly on the track and be powered to meet the power supply requirements of deposition processing. The entire device completes the automated operation of wafers from feeding, conveying, deposition processing to unloading through the coordinated cooperation of various structures, realizing synchronous loading and unloading and stable deposition processing.

[0022] The wafer transport, loading / unloading, and deposition processes are completed according to a fixed procedure, with the process repeated cyclically to ensure continuous and uninterrupted production. First, the semiconductor wafer to be processed is placed stably on the carrier base module 700, ensuring it is upright and stable to prevent tilting or falling off. Then, the carrier base module 700 with the wafer is placed into the feed track 409 within the feed frame 405. Multiple carrier base modules 700 can be arranged sequentially in the feed frame 405 to achieve continuous feeding. After the preparation work is completed, the opening and closing structure 300 is activated. The motor 301 drives the closing plate 306 to move upward, simultaneously opening the inlet 202 and outlet 203 of the deposition tank 201, connecting the feed frame 405, the deposition tank 201, and the feed frame 406 to form a complete transport channel.

[0023] Next, the loading and unloading structure 400 is activated. Motor 2 404 drives screw 2 414 to rotate, driving nut 2 413 and push block 411 to move forward. Push block 411 pushes the support base module 700 at the front end of the material frame 405, which enters the processing track 701 inside the sedimentation tank 201 through the feed port 202, completing the loading action. When the processing support base module 700 enters the sedimentation tank 201, the already processed support base module 700 inside the tank is simultaneously pushed and enters the conveying frame 406 through the discharge port 203, realizing the synchronous completion of loading and unloading. After loading and unloading are completed, the opening and closing structure 300 is activated again, and motor 1 404 drives screw 2 414 to rotate, driving nut 2 413 and push block 411 to move forward. 1. The closing plate 306 moves downward, closing the inlet 202 and outlet 203, restoring the deposition tank 201 to a closed state. Then, the purging structure 600 is activated. The pump 602 pumps gas from the storage tank 601 through purging pipes 1 (603) and 2 (604) into the deposition tank 201 and the feed frame 405, respectively, to remove residual gas, dust, and impurities, ensuring the cleanliness and stability of the deposition tank 201. After purging, the deposition tank 201 initiates thin-film deposition. The bottom brush 706 of the support base module 700 contacts the conductive rail 705 on the inner wall of the deposition tank 201, providing stable power for the deposition process. After deposition is completed, the opening and closing structure 300 is reopened, and the loading and unloading actions are repeated for the next batch of wafers to be processed. This continuous cycle ensures continuous production.

[0024] Through the above structural design and process operation, stable and reliable performance is achieved, solving various problems existing in traditional equipment and improving production stability and practicality. The device sets the support base as an independent module, which can be disassembled, installed, and maintained separately. When the module is damaged, there is no need to disassemble the whole machine; only the damaged module needs to be replaced, making maintenance simple and convenient, saving time and costs. At the same time, the independent module is compatible with semiconductor wafers of different specifications, making it more applicable and versatile. The device is equipped with a dual-channel feeding frame 405 and a feeding frame 406. A single push action can complete the feeding of wafers to be processed and the ejection of processed wafers, achieving truly synchronous loading and unloading. There is no need to unload first and then load, reducing station waiting time, avoiding time waste, and effectively improving overall work efficiency. The opening and closing structure 300 precisely controls the opening and closing of the channel of the deposition tank 201. It opens during loading and unloading and closes in time after completion, reducing the contact time between the deposition tank 201 and the outside world, preventing external air and impurities from entering. Combined with the purging structure 600, after the channel is opened, it purifies to thoroughly remove residual impurities, maintains the cleanliness and stability of the inside of the deposition tank 201, reduces the impact of impurities on film quality, and improves product yield. In addition, the side wall of the support base module 700 is equipped with rolling elements that roll and move on the track, making the operation smooth and stable. The whole device has a simple structure, is sturdy and durable, operates stably and is not prone to failure. It has a high degree of automation, and the operator only needs to place the wafer and perform simple supervision. Frequent operation is not required, which reduces the intensity of manual labor and is suitable for the long-term, high-volume, and continuous production needs of semiconductor wafers. Example 2:

[0025] The sedimentation tank 201 has an inlet 202 and an outlet 203 at both ends. The inlet 202 corresponds to the feeding frame 405, and the outlet 203 corresponds to the conveying frame 406. The feeding track 409 extends to the inlet 202, and the processing track 701 extends to the outlet 203.

[0026] Both ends of the base body 702 are rotatably mounted with equally spaced ball bearings 704. The ball bearings 704 are rolled and fitted with the inner walls of the feeding track 409 and the processing track 701. Through the rolling support provided by the ball bearings 704, the base body 702 is driven to move inside the feeding track 409 and the processing track 701.

[0027] The sedimentation equipment 200 is provided with an outlet cover 205 at one end, and a plate valve 204 is provided at the opening of the outlet cover 205.

[0028] The sedimentation tank 201 has a conductive rail 705 on its inner wall. The base body 702 has a brush 706 that is slidably installed inside the conductive rail 705 at its lower end. The placement tray 703 has a support rod 707 that slides through the base body 702 at its lower end. The support rod 707 has a positioning ring 708 sleeved on its outer wall. A spring 709 that is sleeved on the outside of the support rod 707 is provided between the positioning ring 708 and the base body 702.

[0029] In this embodiment, the semiconductor wafer synchronous loading and unloading conveyor primarily functions to stably place, position, transport, and load / unload wafers during semiconductor wafer thin film deposition. Simultaneously, it ensures stable power supply to the support base during movement, guaranteeing continuous deposition processing and improving the overall stability and reliability of the device. Based on Embodiment 1, the structure is further refined by adding features such as track extensions, ball bearing supports, lead-out covers 205, plate valves 204, conductive rails 705, brushes 706, support rods 707, and springs 709, thus perfecting the entire device.

[0030] The sedimentation tank 201 has an inlet 202 and an outlet 203 at both ends. The inlet 202 corresponds to the feeding frame 405, and the outlet 203 corresponds to the conveying frame 406. The feeding track 409 extends to the inlet 202, and the processing track 701 extends to the outlet 203, ensuring smooth entry and exit of the support base module 700 and a continuous conveying path without jamming, deviation, or other issues. The base body 702 has equidistantly distributed ball bearings 704 installed at both ends. These ball bearings 704 can roll in close contact with the inner walls of the feeding track 409 and the processing track 701, making the base body 702 move more smoothly and stably on the tracks, reducing friction, shaking, and wear, protecting the tracks and the base body 702, and extending their service life.

[0031] A lead-out cover 205 is provided at one end of the deposition equipment 200. A plate valve 204 is installed at the opening of the lead-out cover 205 to control the opening and closing of the external channel of the deposition tank 201, further isolating the external environment and preventing external impurities and air from entering the deposition tank 201, thereby improving the stability of the internal environment of the deposition tank 201. A conductive rail 705 is provided on the inner wall of the deposition tank 201. A brush 706 is installed at the lower end of the base body 702. The brush 706 can be slidably installed inside the conductive rail 705 to ensure that the base body 702 maintains contact and continuous power supply during movement, without power interruption or poor contact. A support rod 707 is installed at the lower end of the placement tray 703. The support rod 707 slides through the base body 702. A positioning ring 708 is sleeved on the outer wall of the support rod 707. A second spring 709 is installed between the positioning ring 708 and the base body 702. The second spring 709 can buffer, absorb shock, and position, allowing the placement tray 703 to float slightly up and down, avoiding excessive force on the wafer, preventing the wafer from being bumped, squeezed, or damaged, and ensuring stable wafer placement and uniform force. Through the cooperation of these structures, the entire device achieves stable wafer transport, precise positioning, smooth movement, continuous power supply, and synchronous loading and unloading.

[0032] The wafer placement, transport, power-on, loading and unloading, and deposition processing are completed in a fixed sequence. The entire process is clear, stable, and continuously cyclical. First, the semiconductor wafer to be processed is placed stably on the placement tray 703, ensuring it is upright, stable, and without tilting or shaking. The placement tray 703 is connected to the base body 702 via a support rod 707 and a second spring 709. The second spring 709 can buffer vibrations and protect the wafer. Then, the carrier base module 700 with the wafer mounted is placed on the feed track 409 within the feed frame 405. The feed track 409 extends to the inlet 202 of the deposition tank 201, ensuring that the carrier base module 700 can smoothly enter the deposition tank 201. After preparation, the opening and closing structure 300 is activated to open the inlet 202 and outlet 203 of the deposition tank 201, connecting the feed frame 405, the deposition tank 201, and the feed conveyor 406.

[0033] Next, the loading and unloading structure 400 is activated. Motor 2 404 drives screw 2 414 to rotate, pushing push block 411 forward. Push block 411 pushes the bearing base module 700 forward along the feeding track 409 and enters the processing track 701 inside the deposition tank 201 through the feed port 202, completing the loading. When the bearing base module 700 moves, the two end balls 2 704 roll on the inner wall of the track, making the movement smooth and stable without jamming. At the same time, the lower end brush 706 of the base body 702 is in contact with the conductive rail 705 on the inner wall of the deposition tank 201, and maintains contact as it moves, ensuring continuous power supply for deposition processing. When the carrier base module 700 to be processed enters the deposition tank 201, the carrier base module 700 that has been processed inside the tank is pushed synchronously and moves along the processing track 701. It enters the feeding frame 406 through the discharge port 203 to complete the unloading. The unloading and loading are carried out simultaneously. After the unloading and loading are completed, the inlet 202 and outlet 203 of the deposition tank 201 are closed, and the purging structure 600 is started to purge the inside of the deposition tank 201 and the feeding frame 405 to remove residual gas and impurities and ensure a clean and stable deposition environment. After the purging is completed, thin film deposition processing begins inside the deposition tank 201. The carrier base module 700 is continuously powered on, and the placement tray 703 is buffered by the second spring 709 to keep the wafer stable. After the deposition processing is completed, the channel is opened again and the unloading and loading actions are repeated to process the next set of wafers. The whole process runs in a cycle and continuously. The lead-out cover 205 and plate valve 204 at one end of the deposition tank 201 can be opened or closed as needed to further isolate the outside world and ensure the stability of the internal environment of the deposition tank 201.

[0034] These structural designs and operational processes enhance the stability, reliability, and practicality of the device, solving more real-world problems and improving overall performance. First, the feeding track 409 extends to the inlet 202, and the processing track 701 extends to the outlet 203, ensuring a smooth and continuous path for the support base module 700, preventing offset, jamming, or stuttering, resulting in more stable transport, reduced malfunctions, and improved operational efficiency. Second, ball bearings 704 are installed at both ends of the base body 702, rolling along the track to reduce friction, wear, and vibration, ensuring smooth and stable operation, protecting the wafers, and preventing damage, displacement, or impacts caused by vibration, friction, or collisions, thus improving wafer integrity and reducing scrap rates. Third, an outlet cover 205 and a plate valve 204 are installed at one end of the deposition tank 201 to further isolate the external environment, preventing external air, dust, and impurities from entering the deposition tank 201, reducing external interference, improving the internal environmental stability of the deposition tank 201, ensuring stable thin film deposition quality, and increasing product yield. In addition, a conductive rail 705 is provided on the inner wall of the deposition tank 201, and a brush 706 is installed at the lower end of the base body 702. The brush 706 slides and fits against the conductive rail 705 to ensure that the support base module 700 is continuously powered during movement, without power outages, poor contact, or unstable power supply. This ensures continuous and stable deposition processing, avoids processing interruptions and product scrapping due to power outages, and improves production stability. Example 3:

[0035] The output end of motor 301 is rotatably mounted inside the upper end of sedimentation tank 201. A screw 302 is provided at the output end of motor 301. A closing plate 306 is slidably mounted on the inner wall of both the inlet 202 and the outlet 203. Two sets of symmetrically distributed positioning rails 307 are provided on the inner wall of sedimentation tank 201. Positioning pressure beads 308 are rotatably mounted on the inner wall of the positioning rails 307 and are equidistantly distributed. The positioning pressure beads 308 are attached to the outer wall of the closing plate 306. Sealing sleeves that provide sliding sealing support for the closing plate 306 are provided on the inner wall of sedimentation tank 201 at the inlet 202 and the outlet 203.

[0036] The inner wall of the sedimentation tank 201 is provided with a bearing bracket 304. The lower end of the screw 302 is rotatably installed inside the bearing bracket 304. A connecting plate 303 is provided between the closing plates 306. A nut 305 is embedded in the connecting plate 303. The nut 305 is threadedly installed on the outer wall of the screw 302.

[0037] Motor 2 404 is fixed at one end of feed frame 405. A screw 2 414 is rotatably installed inside feed frame 405 at the output end of motor 2 404. Nut 2 413 is threadedly installed on the outer wall of screw 2 414. Bearing bracket 2 410 is provided at one end of feed frame 405. Screw 2 414 is rotatably installed inside bearing bracket 2 410. Push block 411 is provided at the upper end of nut 2 413. Slide 408 is provided on the inner wall of the lower end of feed frame 405. Nut 2 413 is slidably installed on the outer wall of slide 408. Output pipe 412 is provided at one end of feed frame 405. Control valve is provided inside output pipe 412. Valve frame 401 is embedded inside the upper end of feed frame 405. Valve block 1 403 is slidably installed inside valve frame 401. Hydraulic rod 402 with telescopic end connected to plate valve 204 is provided at the upper end of feed frame 405.

[0038] In this embodiment, motor 301 is mounted on the upper end of sedimentation tank 201, and its output end is connected to screw 302. Closure plates 306 are installed on the inner walls of both the inlet 202 and outlet 203. Two sets of symmetrical positioning rails 307 are provided on the inner wall of sedimentation tank 201, with equidistant positioning pressure balls 308 installed inside the rails. The pressure balls fit against the outer wall of the closure plates 306, allowing the closure plates 306 to slide smoothly and be positioned stably. Sealing sleeves are installed at the inlet 202 and outlet 203 to provide sliding sealing support for the closure plates 306, reducing air and dust leakage. Bearing bracket 304 is installed on the inner wall of sedimentation tank 201, and the lower end of screw 302 is installed inside the bracket. Connecting plates 303 connect the closure plates 306, with nuts 305 embedded inside. Nuts 305 are threaded onto screw 302, forming a stable transmission. Motor 404 is fixed to one end of the feeding frame 405, and its output end is connected to screw 414. Screw 414 is fitted with nut 413. Bearing bracket 410 is installed at one end of the feeding frame 405 to support screw 414. A push block 411 is provided on the upper end of nut 413. A slide block 408 is provided on the inner wall of the lower end of the feeding frame 405. Nut 413 slides on slide block 408 to ensure smooth movement of push block 411. One end of the feeding frame 405 is provided with output pipe 412 and control valve. Valve frame 401 is embedded in the upper end. Valve block 403 slides inside the frame. The telescopic end of the upper hydraulic rod 402 is connected to plate valve 204 to realize channel linkage control. The entire structure precisely controls the opening and closing of the channel, stably pushes the bearing base module 700, and ensures reliable sealing, transmission, and conveying.

[0039] Motor 1 (301) starts, driving screw 1 (302) to rotate. Nut 1 (305) moves along screw 1 (302), causing closing plate 306 to slide up and down via connecting plate 303. Positioning beads 308 on positioning rail 307 fit against closing plate 306, reducing sliding resistance. Sealing sleeve ensures sealing during sliding. The feed inlet 202 and discharge outlet 203 open or close simultaneously. Motor 2 (404) starts, driving screw 2 (414) to rotate. Nut 2 (413) slides smoothly along slide block 408, driving push block 411 forward, pushing the base module 700 inside feed frame 405 into sedimentation tank 201 along the track. Simultaneously, the processed module is pushed out to feed frame 406, completing synchronous loading and unloading. Hydraulic rod 402 at the upper end of feed frame 405 is linked to plate valve 204, cooperating with valve frame 401 and valve block 1 (403) to control the opening and closing of feed frame 405 channel. Output pipe 412 controls valve to regulate gas flow. After loading and unloading are completed, motor 301 reverses to drive the closing plate 306 to move down, the sealing sleeve fits into the sealing deposition tank 201, the purging structure 600 is started to clean the cavity, and then thin film deposition is performed. After the processing is completed, the action is repeated and the cycle continues.

[0040] Through precise transmission and sealing design, the stability and practicality of the device's operation are enhanced. The motor 301, screw 302, connecting plate 303, and nut 305 work together to ensure stable and reliable transmission. The positioning ball 308 reduces sliding wear on the closing plate 306, and the sealing sleeve ensures a sealed channel, reducing the entry of external impurities, maintaining a stable deposition environment, and improving film quality. The motor 404, screw 414, slide 408, and pusher 411 work together to ensure smooth and stable pushing without jamming or deviation, guaranteeing accurate synchronous loading and unloading, reducing waiting time, and improving efficiency. The hydraulic rod 402, valve frame 401, and valve block 403 are linked to control the channel, providing flexible operation and reliable sealing, adapting to the sealing requirements of deposition processing. The overall structure features stable transmission, excellent sealing, and precise delivery, reducing malfunctions and lowering maintenance costs. Example 4:

[0041] A turntable 511 is provided at the motor output end, and a push plate 512 is fixed on the outer wall of the turntable 511. A guide plate 502 is symmetrically distributed on the inner wall of the collection frame 501. One end of the collection frame 501 is sleeved on the outer side of the feeding frame 406. A valve port 504 is opened inside the collection frame 501. A valve block 503 is symmetrically distributed inside the valve port 504. A support ring 507 is provided at one end of the valve block 503. A positioning rod 506 is slidably installed inside the support ring 507. A positioning seat 505 connected to the outer wall of the collection frame 501 is provided at one end of the positioning rod 506. A spring 508 is sleeved on the outer side of the positioning rod 506 between the positioning seat 505 and the support ring 507. The force-bearing end of the valve block 503 is inclined. A stroke groove 509 for the push plate 512 to rotate and move is opened at the bottom of the connection between the feeding frame 406 and the collection frame 501.

[0042] The purging structure 600 includes a storage tank 601, a pump 602 is provided at the output end of the storage tank 601, and a first purging pipe 603 and a second purging pipe 604 are provided at the output end of the pump 602. One end of the first purging pipe 603 is provided with a connecting cover 605 that communicates with the sedimentation tank 201, and the second purging pipe 604 passes through the feed frame 405.

[0043] In this embodiment, a turntable 511 is installed at the motor output end, and a push plate 512 is fixed on the outer wall of the turntable 511. A symmetrical guide plate 502 is provided on the inner wall of the collection frame 501. One end of the collection frame 501 is sleeved on the outside of the feeding frame 406, and a valve port 504 is opened inside. A symmetrical valve block 503 is installed inside the valve port 504. One end of the valve block 503 is connected to a support collar 507. A positioning rod 506 passes through the collar. The positioning rod 506 is fixed on the positioning seat 505 on the outer wall of the collection frame 501. A spring 508 is sleeved between the positioning seat 505 and the support collar 507. The force-bearing end of the valve block 503 is made into an inclined surface. A stroke groove 509 is opened at the bottom of the connection end between the feeding frame 406 and the collection frame 501 to allow the push plate 512 to rotate and move. The purging structure 600 consists of a storage tank 601, a pump 602, a first purging pipe 603, and a second purging pipe 604. The pump 602 is connected to the storage tank 601, and its output is split into two paths. The first purging pipe 603 is connected to the sedimentation tank 201 via a connecting cover 605, and the second purging pipe 604 passes through the feed frame 405. The entire structure realizes automatic material feeding, guiding and limiting, and elastic reset, while simultaneously purging the sedimentation tank 201 and the feed frame 405 to ensure that the channels and cavities are clean and stable.

[0044] After the processed support base module 700 enters the feeding frame 406, the motor drives the turntable 511 to rotate, and the push plate 512 rotates along the stroke groove 509, pushing the support base module 700 in the feeding frame 406 into the collection frame 501. The module contacts the inclined surface of the valve block 503, squeezing the valve block 503 to move to both sides, compressing the spring 508, allowing the module to pass smoothly through the valve port 504. After the module passes, the spring 508 returns to its original position, causing the valve block 503 to close, preventing subsequent modules from retracting. The guide plate 502 assists the module to slide smoothly, completing the unloading and collection. After loading and unloading are completed, the purging structure 600 is activated. Pump 602 draws gas from storage tank 601. One path enters the deposition tank 201 through purging pipe 1 603 and connecting cover 605 to purge the inside of the chamber; the other path enters the feed frame 405 through purging pipe 2 604 to purge the inside of the channel, removing residual gas, dust, and impurities to ensure a clean and stable deposition environment. Deposition processing is then performed, and the cycle is repeated. High-purity nitrogen is used as the purging gas. Nitrogen is an inert gas with stable chemical properties and does not react with wafers, chamber materials, or process gases, thus not polluting the deposition environment. It removes residual air, moisture, dust, and process byproducts from the deposition tank 201 and feed frame 405, isolates external impurities, and maintains a clean and dry chamber. It also stabilizes the vacuum and temperature field, ensuring the quality and yield of thin film deposition.

[0045] The optimized feeding and purging structure 600 improves feeding stability and the cleanliness of the deposition environment. The motor 510, turntable 511, and pusher plate 512 work together to achieve automatic feeding. The stroke groove 509 limits the movement trajectory of the pusher plate 512, ensuring smooth and uninterrupted operation. The valve block 503, spring 508, and positioning rod 506 form an elastic limiting structure, allowing unidirectional module passage and automatic reset to prevent backflow. The guide plate 502 ensures no feeding deviation, reducing jamming and improving feeding efficiency. The purging structure 600 performs independent purging in two paths, simultaneously cleaning the deposition tank 201 and the feed frame 405, thoroughly removing impurities, maintaining a stable deposition environment, reducing contamination, and improving film deposition quality and product yield.

[0046] The above specific embodiments are merely several preferred embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

[0047] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor wafer synchronous loading and unloading transfer device, comprising a support frame (100), a deposition equipment (200), an opening and closing structure (300), a loading and unloading structure (400), a feeding structure (500), a purging structure (600), and a carrier base module (700); characterized in that: The deposition equipment (200) includes a deposition tank (201); The opening and closing structure (300) includes a motor (301) and a closing plate (306). The closing plate (306) moves longitudinally with the motor (301) as the driving force. The closing plate (306) opens and closes the inlet (202) and outlet (203) of the sedimentation tank (201). The loading and unloading structure (400) includes a hydraulic rod (402), a second motor (404), a feeding frame (405), and a conveying frame (406); the feeding frame (405) and the conveying frame (406) are both connected to the inside of the sedimentation tank (201). The feeding frame (405) is provided with symmetrically distributed feeding tracks (409), and the conveying frame (406) is provided with symmetrically distributed arc-shaped tracks (407). The feeding structure (500) includes a collection frame (501), a valve block (503), a motor (510), and a push plate (512). The motor (510) is fixed at the lower end of the collection frame (501). The feeding structure (500) is used to push the material received by the feeding frame (406) separately. The support base module (700) includes a base body (702) and a processing track (701). The base body (702) is provided with a placement tray (703) for placing semiconductor wafers. The processing track (701) is symmetrically distributed inside the deposition tank (201). The base body (702) is transported inside the processing track (701). The deposition tank (201) has an inlet (202) and an outlet (203) at both ends. The inlet (202) corresponds to the feeding frame (405), and the outlet (203) corresponds to the feeding frame (406). The feeding track (409) extends to the inlet (202), and the processing track (701) extends to the outlet (203). The second motor (404) is fixed at one end of the feeding frame (405). A second screw (414) is rotatably mounted inside the feeding frame (405) at the output end of the second motor (404). A second nut (413) is threaded onto the outer wall of the second screw (414). A bearing bracket (410) is provided at one end of the feeding frame (405). One end of the second screw (414) is rotatably mounted inside the bearing bracket (410). A push block (411) is provided at the upper end of the second nut (413). The feeding frame... (405) A slide block (408) is provided on the inner wall of the lower end. The second nut (413) is slidably installed on the outer wall of the slide block (408). An output pipe (412) is provided at one end of the feeding frame (405). A control valve is provided inside the output pipe (412). A valve frame (401) is embedded inside the upper end of the feeding frame (405). A valve block (403) is slidably installed inside the valve frame (401). A hydraulic rod (402) with a telescopic end connected to the plate valve (204) is provided at the upper end of the feeding frame (405).

2. The semiconductor wafer synchronous loading and unloading conveying device according to claim 1, characterized in that: Both ends of the base body (702) are rotatably mounted with equally spaced ball bearings (704). The ball bearings (704) are rolled and fitted with the inner walls of the feeding track (409) and the processing track (701). Through the rolling support provided by the ball bearings (704), the base body (702) is driven to move inside the feeding track (409) and the processing track (701).

3. The semiconductor wafer synchronous loading and unloading conveying device according to claim 1, characterized in that: The deposition device (200) is provided with an outlet cover (205) at one end, and a plate valve (204) is provided at the opening of the outlet cover (205).

4. The semiconductor wafer synchronous loading and unloading transfer device according to claim 1, characterized in that: The sedimentation tank (201) is provided with a conductive rail (705) on its inner wall. The base body (702) is provided with a brush (706) that is slidably installed inside the conductive rail (705) at its lower end. The placement plate (703) is provided with a support rod (707) that slides through the base body (702) at its lower end. The support rod (707) is fitted with a positioning ring (708) on its outer wall. A spring (709) is fitted between the positioning ring (708) and the base body (702) and is fitted on the outside of the support rod (707).

5. The semiconductor wafer synchronous loading and unloading transfer device according to claim 1, characterized in that: The output end of the motor (301) is rotatably mounted inside the upper end of the sedimentation tank (201). The output end of the motor (301) is provided with a screw (302). The inner walls of the feed inlet (202) and the discharge outlet (203) are slidably mounted with a closing plate (306). The inner wall of the sedimentation tank (201) is provided with two sets of symmetrically distributed positioning rails (307). The inner wall of the positioning rails (307) is rotatably mounted with equidistantly distributed positioning beads (308). The positioning beads (308) are attached to the outer wall of the closing plate (306). The inner wall of the sedimentation tank (201) is provided with a sealing sleeve at the feed inlet (202) and the discharge outlet (203) to provide sliding sealing support for the closing plate (306).

6. The semiconductor wafer synchronous loading and unloading transfer device according to claim 5, characterized in that: The sedimentation tank (201) is provided with a bearing bracket (304) on its inner wall. The lower end of the screw (302) is rotatably installed inside the bearing bracket (304). A connecting plate (303) is provided between the closing plates (306). A nut (305) is embedded in the connecting plate (303). The nut (305) is threadedly installed on the outer wall of the screw (302).

7. The semiconductor wafer synchronous loading and unloading transfer device according to claim 1, characterized in that: The output end of the motor three (510) is provided with a turntable (511), the push plate (512) is fixed on the outer wall of the turntable (511), the inner wall of the collection frame (501) is provided with symmetrically distributed guide plates (502), one end of the collection frame (501) is sleeved on the outside of the feeding frame (406), the collection frame (501) is provided with a valve port (504), the valve port (504) is slidably installed with symmetrically distributed valve blocks two (503), and one end of the valve block two (503) is provided with a support collar (507). A positioning rod (506) is slidably installed inside the support collar (507). One end of the positioning rod (506) is provided with a positioning seat (505) connected to the outer wall of the collection frame (501). A spring (508) is provided between the positioning seat (505) and the support collar (507) and sleeved on the outside of the positioning rod (506). The force-bearing end of the valve block (503) is inclined. The bottom of the material feeding frame (406) and the collection frame (501) are provided with a stroke groove (509) for the push plate (512) to rotate and move.

8. A semiconductor wafer synchronous loading and unloading transfer device according to claim 1, characterized in that: The purging structure (600) includes a storage tank (601), a pump (602) is provided at the output end of the storage tank (601), a purging pipe one (603) and a purging pipe two (604) are provided at the output end of the pump (602), a connecting cover (605) communicating with the sedimentation tank (201) is provided at one end of the purging pipe one (603), and the purging pipe two (604) passes through the feed frame (405).

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