Chip visual inspection apparatus

Abstract

The application discloses a kind of chip visual inspection equipment, including feeding device, carrier device, detection device, material moving device and discharging device, carrier device is equipped with variable distance module, detection device includes top surface detection mechanism, attitude adjustment mechanism and excess surface detection mechanism, attitude adjustment mechanism includes moving part, rotating part and multiple vacuum suction nozzle, can drive each chip horizontal rotation, a pair of side camera components are oppositely arranged on first Y direction module, and have the detection channel for vacuum suction nozzle to extend into, at least one side camera component is equipped with side light source towards detection channel, bottom camera component is located below detection channel.The chip of the application is suspended in detection channel, the side of chip is detected by side camera component, and the other side of each chip can be detected after rotation, and the bottom surface of chip can be detected simultaneously, and the visual inspection of multiple chips can be completed in batches, to improve detection efficiency.

Description

Technical Field

[0001] This invention relates to the field of visual inspection device technology, and in particular to a chip visual inspection device. Background Technology

[0002] In the semiconductor chip manufacturing process, visual inspection is a crucial step in ensuring the appearance, size, defects, and assembly quality of chips. It is mainly used to detect defects such as chipping, scratches, dirt, and dimensional deviations on the top, bottom, and multiple sides of the chip. With the miniaturization and high density of chips and the continuous improvement of production speed, traditional manual inspection and single-chip inspection equipment are no longer sufficient to meet the needs of batch, high-speed, and multi-dimensional inspection.

[0003] Existing chip vision inspection equipment generally suffers from the following technical defects in practical applications: First, low inspection efficiency. Most adopt a single-chip sequential inspection mode, which cannot achieve simultaneous feeding and inspection of multiple chips. The processing capacity per unit time is limited, making it difficult to meet the needs of high-speed production lines. Second, the chip spacing is not adjustable. The initial spacing of chips on the tray or fixture is fixed and relatively close. During inspection, problems such as mutual interference between adjacent chips, light source obstruction, and image crosstalk can easily occur, resulting in insufficient inspection accuracy on the side and bottom surfaces. At the same time, the closely arranged chips cannot rotate freely, making it difficult to complete multi-sided, full-angle inspection. Third, the multi-sided inspection process is cumbersome. Top, side, and bottom surface inspections need to be completed by separate mechanisms, workstations, and multiple times. It usually requires multiple flipping, repositioning, and transfer, resulting in complex mechanisms, long cycle times, and poor stability. Summary of the Invention

[0004] The purpose of this invention is to provide a chip visual inspection device that uses a moving part, a rotating part, and a vacuum nozzle to move multiple chips and suspend them in the air within an inspection channel. A side camera assembly is used to inspect the side of the chip, and the rotating part rotates each chip simultaneously to inspect its other side. The bottom surface of the chip can also be inspected at the same time. This allows for batch visual inspection of multiple chips, improving inspection efficiency.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: a chip vision inspection device, comprising a rack, and: The feeding device includes a feeding mechanism and a first transferring mechanism. The first transferring mechanism is used to adsorb and transfer multiple chips located on a tray within the feeding mechanism in an entire row or column. A material loading device includes a first X-axis module and a first Y-axis variable-pitch module disposed on the first X-axis module. The first Y-axis variable-pitch module is provided with a first fixture for holding chips. The detection device includes a top surface detection mechanism, an attitude adjustment mechanism, and a residual surface detection mechanism. The top surface detection mechanism is used to detect the top surface of a chip on a first Y-axis variable pitch module. The attitude adjustment mechanism includes a moving part, a rotating part, and multiple vacuum nozzles. The rotating part is disposed on the moving part, and the multiple vacuum nozzles are disposed on the rotating part. They are driven to adsorb multiple chips after top surface detection and can drive each chip to rotate horizontally and can be misaligned with the first Y-axis variable pitch module. The residual surface detection mechanism includes a first Y-axis module, a side camera assembly, and a bottom camera assembly. A pair of side camera assemblies are disposed opposite each other on the first Y-axis module and have detection channels for the vacuum nozzles to extend into. At least one side camera assembly is provided with a side light source facing the detection channel. The bottom camera assembly is disposed on the first Y-axis module and located below the detection channel. The transfer device is used to transfer the chip, which has been fed by the attitude adjustment mechanism after inspection, to the unloading device.

[0006] As a further optimization, the moving part includes a second X-axis module and a first Z-axis module disposed at the output end of the second X-axis module, and the rotating part is disposed at the output end of the first Z-axis module.

[0007] As a further optimization, the rotating part includes a mounting plate, a drive assembly, and a rotating assembly. The drive assembly includes a motor and a drive gear disposed at the output end of the motor. The rotating assembly includes a sliding plate and a hollow tube. The sliding plate is slidably disposed on the mounting plate via a guide rail pair, and toothed belts are respectively provided on opposite sides. One of the toothed belts meshes with the drive gear. The hollow tube is rotatably disposed on the mounting plate via a bearing, with a driven gear sleeved at its upper end and a mounting base connected to its lower end. The driven gear meshes with the other toothed belt. The vacuum nozzle is disposed on the mounting base and is connected to the hollow tube via a conduit.

[0008] As a further optimization, the side camera assembly includes an electric cylinder, a side camera, and a prism. The electric cylinder is disposed on the first Y-axis module along the Y-axis, the side camera is disposed on the electric cylinder along the Y-axis, and the prism is disposed in front of the field of view of the side camera to reflect the field of view in the detection channel into the side camera. The first Y-axis module includes a drive unit, a transmission assembly, and a sliding plate. The sliding plate is slidably disposed on the frame via a guide rail pair, and the drive unit is connected to the sliding plate via the transmission assembly.

[0009] As a further optimization, two side light sources are provided, and the two side light sources are matched with two side camera components, which can improve detection efficiency.

[0010] As a further optimization, the bottom camera assembly includes a bottom camera and a bottom light source disposed on the first Y-axis module; the first Y-axis module is also provided with a 3D laser scanner located below the detection channel.

[0011] As a further optimization, the top surface detection mechanism includes a second Y-axis module, a top-position camera, and a top light source. The top-position camera and the top light source are disposed at the output end of the second Y-axis module for detecting the top surface of the chip located on the first Y-axis variable pitch module.

[0012] As a further optimization, the first fixture includes a positioning plate and a pusher assembly. Multiple positioning plates are respectively disposed at the output end of the first Y-axis variable-pitch module, and each has a first half-groove for placing a chip. The pusher assembly includes a driving unit and a pusher plate. The driving unit includes a translation cylinder, and the output end of the translation cylinder is provided with an optical axis via a connecting plate. The pusher plate is disposed on a support plate via a guide rail pair, and a linear bearing is provided at its lower end. One end of the optical axis passes through the linear bearing and is provided with a sealing plate. An elastic element is provided on the optical axis between the connecting plate and the linear bearing. The pusher plate is driven to abut against the chip in its second half-groove and to position the chip in its first half-groove, thus stably positioning the chip and ensuring that the chip has the same distance from the prism during side inspection after being adsorbed by the vacuum nozzle.

[0013] As a further optimization, the feeding mechanism includes a feeding component and a first translation component. A pair of feeding components are arranged side by side for feeding a fully loaded tray and discharging an empty tray, respectively. The first translation component is arranged above the two feeding components and is used to transfer the tray from one feeding component to the other. The first transfer mechanism includes a first transfer component and a plurality of first vacuum nozzles arranged at the output end of the first transfer component. The first vacuum nozzles are driven to adsorb and transfer the chips in the tray to the first Y-axis variable pitch module.

[0014] As a further optimization, the material transfer device includes an adjustment mechanism and a second material transfer mechanism. The adjustment mechanism includes an end Y-axis module and a second Y-axis variable pitch module disposed on the end Y-axis module. The second Y-axis variable pitch module is provided with a second fixture for receiving the inspected chips. The second material transfer mechanism includes a multi-axis robot and a suction component disposed on the output end of the multi-axis robot. The suction component is driven to transfer the chips located in the second fixture to the unloading device.

[0015] As a further optimization, the suction assembly includes a vertical plate, lifting cylinders, and a second vacuum nozzle. The vertical plate is located at the output end of the multi-axis manipulator, and multiple lifting cylinders are arranged side by side on the vertical plate, with a second vacuum nozzle at each output end.

[0016] As a further optimization, the feeding device includes a second translation component and a receiving component. At least one pair of receiving components are arranged side by side for feeding empty trays and feeding full trays, respectively. The second translation component is arranged above the feeding component and is used to move the tray from one receiving component to another.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. Multiple chips are moved and suspended in the air by the cooperation of the moving part, rotating part and vacuum nozzle and placed in the detection channel. The side of the chip is detected by the side camera assembly. The rotating part rotates the chip simultaneously and the other side of the chip is detected. The bottom surface of the chip can also be detected at the same time. The visual inspection of multiple chips can be completed in batches, improving the inspection efficiency. 2. Multiple chips can adjust their spacing within the first fixture via the action of the first Y-axis variable pitch module. This ensures the detection effect of each chip and facilitates the horizontal rotation of adjacent chips via the rotating part for detection of other sides. Attached Figure Description

[0018] Figure 1 This is a structural diagram of the present invention.

[0019] Figure 2 This is a structural diagram of the present invention after the shell has been removed.

[0020] Figure 3 This is a top view of the present invention after the casing has been removed.

[0021] Figure 4 This is a structural diagram of the feeding device of the present invention.

[0022] Figure 5 This is a structural diagram of the material loading device and the detection device of the present invention.

[0023] Figure 6 This is a structural diagram of the first Y-axis pitch-changing module and the first fixture in the material loading device of the present invention.

[0024] Figure 7 for Figure 6 Enlarged view of point A in the middle.

[0025] Figure 8 This is a structural diagram of the surface detection mechanism of the present invention.

[0026] Figure 9 This is a schematic diagram of the operation of the side-view camera assembly of the present invention.

[0027] Figure 10 This is a structural diagram of the rotating part and vacuum nozzle in the attitude adjustment mechanism of the present invention.

[0028] Figure 11 This is a structural view of the rotating part and vacuum nozzle on the other side of the attitude adjustment mechanism of the present invention.

[0029] Figure 12 This is a cross-sectional view of some components in the rotating part of the present invention.

[0030] Figure 13 This is a structural diagram of the material transfer device and the material feeding device of the present invention. Detailed Implementation

[0031] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0032] like Figures 1 to 9 As shown, a chip visual inspection device includes a frame 11, a loading device 20, a loading device 30, an inspection device 40, a transfer device 50, and an unloading device 60. The loading device 20 includes a feeding mechanism 21 and a first transfer mechanism 22. The first transfer mechanism 22 is used to adsorb and transfer multiple chips 1000 located on the feeding tray 101 within the feeding mechanism 21 in an entire row or column. The loading device 30 includes a first X-axis module 31 and a first Y-axis variable pitch module 32 disposed on the first X-axis module 31. The first Y-axis variable pitch module 32 is provided with a first fixture 33 for holding the chips 1000. The inspection device 40 includes a top surface inspection mechanism 41, a posture adjustment mechanism 42, and a residual surface inspection mechanism 43. The top surface inspection mechanism 41 is used to inspect the top surface of the chips 1000 in the first fixture 33 on the first Y-axis variable pitch module 32. The posture adjustment mechanism 42 includes a moving part 421, a rotating part 422, and multiple vacuum nozzles 4 23. A rotating part 422 is disposed on a moving part 421, and multiple vacuum nozzles 423 are disposed on the rotating part 422. They are driven to adsorb multiple chips 1000 after top surface detection and can drive each chip 1000 to rotate horizontally. They can also be misaligned with the first Y-axis variable pitch module 32. The remaining surface detection mechanism 43 includes a first Y-axis module 431, a side camera assembly 432 and a bottom camera assembly 433. A pair of side camera assemblies 432 are disposed opposite to each other on the first Y-axis module 431 and have a detection channel 4300 for the vacuum nozzles 423 to extend into. At least one side camera assembly 432 is provided with a side light source 4320 facing the detection channel 4300. The bottom camera assembly 433 is disposed on the first Y-axis module 431 and located below the detection channel 4300. The material transfer device 50 is used to feed the chips 100 that have been fed by the attitude adjustment mechanism 43 after detection to the unloading device 60.

[0033] In this invention, the object requiring visual inspection is the chip 1000, and all six surfaces of the chip are inspected. The inspection includes, but is not limited to, surface defects (blurred laser characters, scratches, capacitor misalignment or damage, dirt, etc.), length, flatness, etc. Multiple chips 1000 are arranged in a matrix (multiple rows and columns) within the feeding mechanism 21's feeding tray 101. During feeding, the first transferring mechanism 22 picks up and transfers multiple (e.g., a whole column) chips 1000 from the feeding tray 21 to the loading device 30, specifically into the first fixture 33 located on the first Y-axis variable-pitch module 32. Multiple chips 33 are positioned within the first fixture 33, and the movement of the first Y-axis variable-pitch module 32 increases the distance between adjacent chips 1000 (facilitating framing during visual inspection of each chip 1000 and facilitating subsequent horizontal inspection of each chip 1000). (During rotation, there is no mutual interference). The first fixture 33 is driven by the first X-axis module 31 to move below the top surface inspection mechanism 41. The top surface inspection mechanism 41 performs visual inspection on the top surface of each chip 1000. After the top surface inspection of the chip 1000 is completed, the first fixture 33 is driven by the first X-axis module 31 to continue moving to the side of the top surface inspection mechanism 43. The moving part 421 in the attitude adjustment mechanism 42 drives the rotating part 422 to move multiple vacuum nozzles 423 to the top of the first fixture 33, and each corresponds to multiple chips 1000. The vacuum nozzles 423 are driven by the moving part 421 to move down and adsorb the chips 1000 located on the first fixture 33. After the fixture 33 is unloaded, the first X-axis module 31 and the first Y-axis variable pitch module 32 are reset to carry multiple chips in another row on the two feeding trays 101. At the same time, the vacuum nozzle 423 is driven by the moving part 421 to move the chip 1000 down into the detection channel 4300. The pair of side camera assemblies 432 move along the direction parallel to the detection channel 4300 under the drive of the first Y-axis module 431 to detect the side of each chip 1000. After the detection is completed, the rotating part 422 drives each chip 1000 to rotate horizontally by 90°. The pair of side camera assemblies 432 continue to move along the direction parallel to the detection channel under the drive of the first Y-axis module 431. Moving in the direction of 4300 allows for the detection of the other side of each chip 1000. Thus, the detection of all sides of each chip 1000 can be completed by rotating it. At the same time, as the first Y-axis module 431 moves, the bottom camera assembly 433 can perform visual inspection of the bottom surface of the chip 1000. The visual inspection of the chip 1000 is completed by detecting the top, sides, and bottom surfaces of the chip 1000. After the chip 1000 is inspected, the vacuum nozzle 423 is driven by the moving part 421 to move the chip 1000 to the transfer device 50, and the transfer device 50 feeds the chip 1000 into the unloading device 60.

[0034] This invention utilizes a first fixture 33 of a loading device 30 to carry multiple chips 1000 for top-surface inspection. Then, through the cooperation of a moving part 421, a rotating part 422, and a vacuum nozzle 423, the chips 1000 are lifted and suspended within a detection channel 4300. A side-view camera assembly 432 inspects the sides of the chips 1000. Simultaneously, the rotating part 422 causes each chip 1000 to rotate, allowing inspection of its other sides. The bottom surface of the chips 1000 can also be inspected simultaneously, enabling batch visual inspection of multiple chips 1000 and improving inspection efficiency. Furthermore, the spacing between the multiple chips 1000 within the first fixture 33 can be adjusted (increased) via the action of a first Y-axis variable-pitch module 32. This ensures effective inspection of each chip 1000 and facilitates the horizontal rotation of adjacent chips 1000 driven by the rotating part 422 for inspection of other sides.

[0035] like Figure 8 and Figure 9As shown, the following different methods can be used for the side inspection of chip 1000 by a pair of side camera assemblies 432: 1. A side light source 4320 is provided, which cooperates with a side camera assembly 432. When inspecting chip 1000, the side camera assembly 432 with the side light source 4320 can inspect the surface defects on the side of chip 1000 facing it, while the other side camera assembly 432 can detect the length of chip 1000. After all the chips 1000 on the vacuum nozzles 423 have completed the above inspection, the vacuum nozzles 423 are driven by the rotating part 422 to rotate chip 1000 horizontally by 90°. The pair of side camera assemblies 432 repeat the above inspection items. By repeating the above actions multiple times, the inspection of four sides of chip 1000 and the detection of four length data can be completed (the length data of the two sides can be used for comparison and calibration). 2. The device has two side light sources 4320, which cooperate with two side camera assemblies 432 respectively. When inspecting the chip 1000, the two side light sources 4320 can act on opposite sides of the chip 1000 respectively, allowing the two side camera assemblies 432 to inspect the surface defects of the chip 1000 on the side facing it, and simultaneously inspect the length of the chip 1000. After all the chips 1000 on the vacuum nozzles 423 have completed the above inspection, the vacuum nozzles 423 are driven by the rotating part 422 to rotate the chip 1000 horizontally by 90°. The pair of side camera assemblies 432 repeat the above inspection items. By rotating the chip 1000 once by the rotating part 422, the inspection of the four sides of the chip 1000 and the inspection of the four length data can be completed. Of course, when there are two side light sources 4320, only the surface defects of the four sides of the chip 1000 can be inspected.

[0036] like Figure 5 As shown, preferably, the moving part 421 includes a second X-axis module 4211 and a first Z-axis module 4212 disposed at the output end of the second X-axis module 4211 via a mounting bracket 4210. The rotating part 422 is disposed at the output end of the first Z-axis module 4212 via a mounting plate 4220. The second X-axis module 4211 and the first Z-axis module 4212 work together to drive the vacuum nozzle 423 to move to the first fixture 33 to adsorb the chip 1000, and then move to the detection channel 4300 for visual inspection, and then move to the transfer device 50 to place the inspected chip 1000.

[0037] like Figures 10 to 12As shown, specifically, the rotating part 422 includes a mounting plate, a drive assembly 4221, and a rotating assembly 4222. The mounting plate includes a vertical plate 42201 and a horizontal plate 42202 locked onto the vertical plate 42201. The vertical plate 42201 is located at the output end of the first Z-axis module 4212. Both the drive assembly 4221 and the rotating assembly 4222 are located on the horizontal plate 42202. The drive assembly 4221 includes a motor 42211 and a drive gear 42212 located at the output end of the motor 42211. The rotating assembly 4222 includes a sliding plate 42222 and a hollow tube 42226. 222 is slidably mounted on the horizontal plate 42202 of the mounting plate via the first guide rail pair 42221, and toothed belts 42223 are respectively provided on opposite sides. One toothed belt 42223 meshes with the driving gear 42212. The hollow tube 42226 is rotatably mounted on the horizontal plate 42202 of the mounting plate via the bearing 42225. The upper end of the tube is fixedly sleeved with a driven gear 42224 and the lower end is connected to the mounting base 42227. The driven gear 42224 meshes with the other toothed belt 42223. The vacuum nozzle 423 is mounted on the mounting base 42227 and is connected to the hollow tube 42226 via a conduit (not shown). Based on the above configuration, when the suction nozzle 423 needs to be driven to rotate horizontally, the motor 42211 drives the drive gear 42212 to rotate. The toothed belt 42223 meshing with the drive gear 42212 is driven to move linearly, thereby causing the slide plate 42222 to translate on the first guide rail pair 42221. This causes another toothed belt 42223 on the slide plate 42222 to drive the driven gear 42224 meshing with it to rotate, which in turn drives the hollow tube 42226 to rotate horizontally and drives the mounting base 42227 to rotate, thereby driving the vacuum suction nozzle 423 to rotate horizontally. Furthermore, the hollow structure of the hollow tube 42226 is connected to the vacuum suction nozzle 423 through a conduit, which does not affect its ability to transmit negative pressure to the vacuum suction nozzle 423 to adsorb the chip 1000 during rotation. The above structure can realize the synchronous and independent horizontal rotation of multiple chips 1000, which is convenient for visual inspection of other sides after the chip 1000 has been rotated horizontally by 90°.

[0038] like Figure 8 and Figure 9As shown, preferably, the side-view camera assembly 432 includes an electric cylinder 4321, a side-view camera 4322, and a prism 4323. The electric cylinder 4321 is disposed along the Y direction on the first Y-direction module 431. The side-view camera 4322 is disposed along the Y direction on the electric cylinder 4321 via a bracket. The prism 4323 is disposed in front of the field of view of the side-view camera 4322, and is used to reflect the field of view within the detection channel 4300 at a 90° angle into the side-view camera 4322. Considering the rational use of space, the combination of the side-view camera 4322 and the prism 4323... The side of the chip 1000 can be reflected into the side camera 4322. The side camera 4322 is mounted on the electric cylinder 4321. The distance between the lens of the side camera 4322 and the prism 4323 can be adjusted by the action of the electric cylinder 4321. When detecting the side of the chip 1000 in the length and width directions (the distance from the prism 4323 changes), or when detecting different types of chips, the side camera 4322 can be adjusted to accurately focus and detect the side of the chip 1000. Furthermore, the first Y-axis module 431 includes a drive unit 4311, a transmission assembly 4312, and a sliding plate 4313. The sliding plate 4313 is slidably mounted on the frame 11 via a second guide rail pair 4314. The drive unit 4311 can be a motor, which is connected to the sliding plate 4313 via the transmission assembly 4312. The transmission assembly 4312 can be a conventional combination of a drive wheel, a driven wheel, and a belt. The sliding plate 4313 is connected to one side of the belt, and the sliding plate 4313 drives the side camera 4322 located on it to move and perform visual inspection on the side of each chip 1000 located in the detection channel 4300.

[0039] Preferably, the bottom camera assembly 433 includes a bottom camera 4331 and a bottom light source 4332 disposed on the sliding plate 4313 of the first Y-axis module 431, which can realize visual inspection of the bottom surface of the chip 1000; in addition, the sliding plate 4313 of the first Y-axis module 431 is also provided with a 3D laser scanner 434 located below the detection channel 4300, which can be used to detect the flatness of the bottom surface of the chip 1000.

[0040] like Figure 5 As shown, the top surface inspection mechanism 41 includes a second Y-axis module 411, a top camera 412, and a top light source 413. The top camera 412 and the top light source 413 are both connected to the output end of the second Y-axis module 411 via connectors to inspect the top surface of the chip 1000 located in the first fixture 33 on the first Y-axis variable pitch module 32. That is, the second Y-axis module 411 can drive the top camera 412 to move along the Y-axis to inspect the top surface of each chip 1000.

[0041] like Figure 6 and Figure 7As shown, preferably, the first fixture 33 includes a positioning plate 331 and a pusher assembly 332. Multiple positioning plates 331 are respectively disposed at the output end of the first Y-axis variable pitch module 32, and each has a first half-groove 3310 for placing the chip 1000. The pusher assembly 332 includes a driving unit 3321 and a pusher plate 3322. The driving unit includes a translation cylinder 33211. The output end of the translation cylinder 33211 is provided with an optical axis 33213 via a connecting plate 33212. The pusher plate 3322 is disposed on the support plate 33210 via a third guide rail pair 33216, and its lower end has a... For the linear bearing 33215, one end of a pair of optical shafts 33213 passes through the pair of linear bearings 33215 respectively, and a sealing plate (not shown) is provided at the end to prevent the optical shaft 33213 from disengaging from the linear bearing 33215. An elastic element 33214 is provided on the optical shaft 33123 between the connecting plate 33212 and the linear bearing 33215. The elastic element 33214 can be a spring sleeved on the optical shaft 33213. The push plate 3322 is driven to abut against the chip 1000 through the second half-groove 33220 at its end and to position the chip 1000 with the first half-groove 3310. Specifically, when multiple chips 1000 are placed in the first fixture 33, they are first placed in the first half-groove 3310 for initial positioning. After the spacing between adjacent chips 1000 is adjusted by the first Y-axis variable pitch module 32, the translation cylinder 33211 is activated. Through the combination structure of the optical axis 33213, the elastic element 33214 and the linear bearing 33215, the push plate 3322 is pushed to move towards the chip 1000 by the third guide rail pair 33216. This causes the second half-groove 33220 at the end of the push plate 3322 to abut against the chip 1000. The cooperation between the second half-groove 33220 and the first half-groove 3310 achieves secondary positioning of the chip 1000. Moreover, during the positioning process of the chip 1000, the buffering function of the elastic element 33214 can avoid damage to the chip 1000.The positioning of chip 1000 by the first fixture 33 serves two functions: firstly, it ensures the stability of chip 1000 on the first fixture 33, maintaining stability during movement; secondly, it ensures that multiple chips 1000 located on the first fixture 33 have the same position and orientation, facilitating visual inspection after the top camera 412 moves above each chip 1000. Furthermore, when the moving part 421 drives multiple vacuum nozzles 423 to adsorb multiple chips 1000 respectively, the multiple chips 1000 are repositioned on the first fixture 33 after secondary positioning. With the same position on each vacuum nozzle 423, after the vacuum nozzle 423 completes the adsorption of the chip 1000, the push plate assembly 332 is driven to reset, and the chip 1000 can be disengaged upward from the first fixture 33 by the movement of the moving part 421. During this process, it can be ensured that each vacuum nozzle 423 adsorbs the chip 1000 in the same position. When the side camera assembly 432 detects the side of the chip 1000, it can be ensured that the side of each chip 1000 has the same distance from the prism 4323, which makes it easier for the side camera 4322 to perform visual inspection of the side of the chip 1000 after focusing.

[0042] like Figure 2 and Figure 4As shown, preferably, the feeding mechanism 21 includes a feeding component 211 and a first translation component 212. A pair of feeding components 211 are arranged side by side. One feeding component 211 is used to feed a feeding tray 101 fully loaded with chips 1000, and the other feeding component 211 is used to unload an empty feeding tray 101. The first translation component 212 is arranged above the two feeding components 211 and is used to transfer the feeding tray from one feeding component to another. Specifically, the feeding component 211 can adopt a conventional arrangement in the prior art, which includes a lifting module and a support platform arranged on the upper end of the lifting module. Multiple feeding trays 101 fully loaded with chips 100 are stacked on the support platform of one feeding component. After the first transfer mechanism 22 has finished adsorbing and removing the chips 1000 from the uppermost feeding tray 101, the first translation component 212 transfers the empty feeding tray to another feeding tray. A feeding component enables the continued feeding of another fully loaded chip 1000 feeding tray and the automatic recycling of an empty feeding tray. The first translation component 212 can also be conventionally configured, including a first translation plate 21211 mounted on the frame 11 via a fourth guide rail pair 21210. The first translation plate 21211 is connected to a drive component and has a first vertical module 2122 mounted on it. The output end of the first vertical module 2122 passes downward through the first translation plate 21211 and is connected to a first gripping component 2123. The first gripping component 2123 can be driven to move above a feeding component 211 and grip an empty feeding tray 101, and then move above another feeding component 211 to stack empty feeding trays. Furthermore, a buffer 2124 can be provided between the first gripping component 2123 and the first translation plate 21211. The first material transfer mechanism 22 includes a first material transfer component 221 and a plurality of first vacuum nozzles 222 disposed at the output end of the first material transfer component 221. The first vacuum nozzles 222 are driven to adsorb and transfer the chips 1000 in the material supply tray 101 to the first fixture 33 of the first Y-axis variable pitch module 32. Specifically, the first material transfer component 221 includes an initial X-axis module 2211, an initial Y-axis module 2212 disposed at the output end of the initial X-axis module, and a second Z-axis module 2213 disposed at the output end of the initial Y-axis module. Each first vacuum nozzle 222 is disposed at the lower end of the second Z-axis module 2213. The above structure can realize the precise movement of the first vacuum nozzles 222 in three-dimensional space.

[0043] like Figure 13As shown, preferably, the transfer device 50 includes an adjustment mechanism 51 and a second transfer mechanism 52. The adjustment mechanism 51 includes an end Y-axis module 511 and a second Y-axis variable-pitch module 512 disposed on the end Y-axis module 511. The second Y-axis variable-pitch module 512 is provided with a second fixture 513 for receiving the inspected chips 1000. The second fixture 513 may have a structure similar to the first fixture 33, which facilitates the positioning of the chips 1000. It should be noted that adjacent chips 1000 are placed on the second fixture 51 with a large gap between them. Therefore, the second fixture 513 is initially positioned after the spacing of the chips 1000, which are spaced apart, is adjusted by the second Y-axis variable pitch module 512 to facilitate placement. After the chips 1000 are placed, the second Y-axis variable pitch module 512 moves to reduce the spacing between the chips 1000. After the above actions are completed, the chips 1000 are repositioned similarly to the first fixture 33 to ensure the positional stability of the chips 1000. After the second transfer mechanism 52 completes the adsorption of the chips 1000, the second fixture 513 releases the chips 1000. The second transfer mechanism 52 includes a multi-axis robot 521 and a suction component 522 disposed at the output end of the multi-axis robot 521. The suction component 522 is driven to adsorb the chips 1000 located in the second fixture 513 and transfers the chips 1000 to the unloading device 60. Furthermore, the suction component 522 preferably includes a vertical plate, a lifting cylinder, and a second vacuum nozzle. The vertical plate is disposed at the output end of the multi-axis robot 521, and multiple lifting cylinders are disposed side by side on the vertical plate. The output ends are each provided with a second vacuum nozzle for adsorbing the chip 1000. The above-mentioned arrangement can be achieved by controlling each second vacuum nozzle individually through each lifting cylinder, so that each chip 1000 can be individually unloaded. For example, when a chip 1000 fails the test, when placing the chip 1000 in the unloading device 60, the chip 1000 can be placed separately on the unloading tray of NG products, which can facilitate the separate unloading of qualified and NG products of the tested chip 1000.

[0044] The unloading device 60 has a similar structure to the feeding device 20, including a second translation component 612 and a receiving component 611. The receiving component 611 has three components: a unloading tray 102 for unloaded feeding, a unloading tray for receiving qualified products, and a unloading tray for receiving NG products. The second translation component 612 is located above the feeding component 611 and is used to move the unloading tray from one receiving component to another. Specifically, the second translation component 612 includes a fifth guide rail 61210 mounted on the frame 11. The second translation plate 61211 is connected to the driving component and is provided with a first vertical module 6122. The output end of the first vertical module 6122 passes downward through the second translation plate 61211 and is connected to a first clamping component 6123. The first clamping component 6123 can be driven to move above a feeding component 611 and clamp an empty feeding tray 102. Then it moves to the corresponding feeding component 611 to stack the empty feeding trays for holding qualified or NG products of chip 1000.

[0045] In addition, such as Figure 1 As shown, a housing 12 is also provided on the outer side of the frame 11 to ensure safety and effectiveness during operation.

[0046] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A chip vision inspection device, comprising a rack, characterized in that, Also includes: The feeding device includes a feeding mechanism and a first transferring mechanism. The first transferring mechanism is used to adsorb and transfer multiple chips located on a tray within the feeding mechanism in an entire row or column. A material loading device includes a first X-axis module and a first Y-axis variable-pitch module disposed on the first X-axis module. The first Y-axis variable-pitch module is provided with a first fixture for holding chips. The detection device includes a top surface detection mechanism, an attitude adjustment mechanism, and a residual surface detection mechanism. The top surface detection mechanism is used to detect the top surface of a chip on a first Y-axis variable pitch module. The attitude adjustment mechanism includes a moving part, a rotating part, and multiple vacuum nozzles. The rotating part is disposed on the moving part, and the multiple vacuum nozzles are disposed on the rotating part. They are driven to adsorb multiple chips after top surface detection and can drive each chip to rotate horizontally and can be misaligned with the first Y-axis variable pitch module. The residual surface detection mechanism includes a first Y-axis module, a side camera assembly, and a bottom camera assembly. A pair of side camera assemblies are disposed opposite each other on the first Y-axis module and have detection channels for the vacuum nozzles to extend into. At least one side camera assembly is provided with a side light source facing the detection channel. The bottom camera assembly is disposed on the first Y-axis module and located below the detection channel. The transfer device is used to transfer the chip, which has been fed by the attitude adjustment mechanism after inspection, to the unloading device.

2. The chip vision inspection device according to claim 1, characterized in that, The moving part includes a second X-axis module and a first Z-axis module disposed at the output end of the second X-axis module, and the rotating part is disposed at the output end of the first Z-axis module.

3. The chip vision inspection device according to claim 1 or 2, characterized in that, The rotating part includes a mounting plate, a drive assembly, and a rotating assembly. The drive assembly includes a motor and a drive gear located at the output end of the motor. The rotating assembly includes a sliding plate and a hollow tube. The sliding plate is slidably mounted on the mounting plate via a guide rail pair, and toothed belts are provided on opposite sides. One of the toothed belts meshes with the drive gear. The hollow tube is rotatably mounted on the mounting plate via a bearing. A driven gear is sleeved on its upper end, and a mounting base is connected to its lower end. The driven gear meshes with another toothed belt. The vacuum nozzle is located on the mounting base and is connected to the hollow tube via a conduit.

4. The chip vision inspection device according to claim 1, characterized in that, The side-view camera assembly includes an electric cylinder, a side-view camera, and a prism. The electric cylinder is disposed on a first Y-axis module along the Y-axis, the side-view camera is disposed on the electric cylinder along the Y-axis, and the prism is disposed in front of the field of view of the side-view camera to reflect the field of view in the detection channel into the side-view camera. The first Y-axis module includes a drive unit, a transmission assembly, and a sliding plate. The sliding plate is slidably disposed on the frame via a guide rail pair, and the drive unit is connected to the sliding plate via the transmission assembly.

5. The chip vision inspection device according to claim 1 or 4, characterized in that, There are two side light sources, and the two side light sources are matched with two side camera components.

6. The chip vision inspection device according to claim 1, characterized in that, The bottom camera assembly includes a bottom camera and a bottom light source mounted on the first Y-axis module; the first Y-axis module is also equipped with a 3D laser scanner located below the detection channel.

7. The chip vision inspection device according to claim 1, characterized in that, The top surface detection mechanism includes a second Y-axis module, a top-position camera, and a top light source. The top-position camera and top light source are located at the output end of the second Y-axis module and are used to detect the top surface of the chip located on the first Y-axis variable pitch module.

8. The chip vision inspection device according to claim 1, characterized in that, The feeding mechanism includes a feeding component and a first translation component. A pair of feeding components are arranged side by side for feeding a fully loaded tray and discharging an empty tray, respectively. The first translation component is arranged above the two feeding components and is used to transfer the tray from one feeding component to the other. The first transfer mechanism includes a first transfer component and a plurality of first vacuum nozzles arranged at the output end of the first transfer component. The first vacuum nozzles are driven to adsorb and transfer the chips in the tray to the first Y-axis variable pitch module.

9. The chip vision inspection device according to claim 1, characterized in that, The material transfer device includes an adjustment mechanism and a second material transfer mechanism. The adjustment mechanism includes an end Y-axis module and a second Y-axis variable pitch module disposed on the end Y-axis module. The second Y-axis variable pitch module is provided with a second fixture for receiving the inspected chips. The second material transfer mechanism includes a multi-axis robot and a suction component disposed on the output end of the multi-axis robot. The suction component is driven to transfer the chips located in the second fixture to the unloading device.

10. The chip vision inspection device according to claim 1 or 9, characterized in that, The feeding device includes a second translation component and a receiving component. At least one pair of receiving components are arranged side by side, respectively for feeding empty material trays and feeding fully loaded material trays. The second translation component is arranged above the feeding component and is used to move the material tray from one receiving component to another.

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