Shielded MEMS electric field detection method, system and apparatus

Abstract

The present application relates to the technical field of electric field detection, and particularly relates to a shielding MEMS electric field detection method, system and device, the method comprising: applying an electric field to an external signal plate, and generating an electric field induction signal through the external signal plate; introducing the electric field induction signal into a metal shielding shell through a conductive connection structure, so that the electric field induction signal is transmitted to an electric field sensitive chip in a shielding environment; driving the electric field sensitive chip to perform mechanical modulation, and sensing the electric field induction signal to generate an initial electric field detection signal; inputting the initial electric field detection signal into a back-end signal processing circuit, and amplifying and demodulating the initial electric field detection signal to obtain an electric field detection output signal; and leading the electric field detection output signal out of the metal shielding shell. Through the present application, the problem that the existing electric field detection scheme is difficult to consider the effective introduction of external electric field and the anti-interference processing of internal sensitive signal in a complex electromagnetic environment, resulting in insufficient electric field detection precision and stability, is effectively solved.

Description

Technical Field

[0001] This invention relates to the field of electric field detection technology, and in particular to a shielded MEMS electric field detection method, system and device. Background Technology

[0002] Electric field detection is an important technology for power equipment condition monitoring, industrial safety early warning, environmental perception and scientific research. Its basic principle is to sense changes in the spatial electric field through a sensitive unit and convert the weak electric field response into a processable electrical signal.

[0003] Existing electric field detection devices typically acquire electric field information using external probes or sensing plates, followed by signal amplification and output via back-end circuitry. However, these devices still have shortcomings in terms of structural integration, anti-interference capability, and adaptability to complex environments. Especially in scenarios with strong external electromagnetic interference or requiring long-term stable installation, stray electric fields, coupling interference, and circuit noise can easily affect the sensing signal, causing fluctuations in the detection results. Although microelectromechanical system (MEMS) electric field sensing chips have advantages such as small size, low power consumption, easy integration, and suitability for mass production, their output signals are relatively weak. Without a reasonable external field introduction structure, shielding packaging structure, and back-end signal processing, it is still difficult to guarantee the stability of the electric field signal during transmission and processing. Therefore, there is an urgent need for an electric field detection scheme that can effectively introduce external electric fields while suppressing external interference and improving the accuracy and stability of electric field detection.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the general background of this disclosure and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] This invention provides a shielded MEMS electric field detection method, system, and device, which can effectively solve the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A shielded MEMS electric field detection method, the method comprising: An external electric field is applied to an external signal plate, and an electric field induction signal corresponding to the external electric field is generated through the external signal plate. The electric field sensing signal is introduced into the interior of the metal shielding shell through a conductive connection structure, so that the electric field sensing signal is transmitted to the MEMS electric field sensing chip in the shielding environment formed by the metal shielding shell. The MEMS electric field sensing chip is driven to perform mechanical modulation, and the MEMS electric field sensing chip senses the electric field sensing signal based on the mechanical modulation to generate an initial electric field detection signal corresponding to the external electric field; The initial electric field detection signal is input into the back-end signal processing circuit located inside the metal shielding shell, and the initial electric field detection signal is amplified and demodulated by the back-end signal processing circuit to obtain the electric field detection output signal; The electric field detection output signal is led out from the metal shielding shell to realize the detection of the external electric field.

[0007] Further, generating an electric field induced signal corresponding to the external electric field through the external signal plate includes: The external signal plate is exposed to the external electric field so that changes in the external electric field can be sensed through the external signal plate; The external signal plate converts the change in the external electric field into the electric field induced signal. The electric field induced signal is transmitted to the interior of the metal shielding shell through the conductive connection structure that is connected to the external signal plate; The electric field sensing signal is coupled to the sensing area of ​​the MEMS electric field sensitive chip inside the metal shielding shell.

[0008] Furthermore, enabling the MEMS electric field sensing chip to sense the electric field sensing signal based on the mechanical modulation includes: A driving signal is applied to the MEMS electric field sensing chip to cause the MEMS electric field sensing chip to generate the mechanical modulation. The MEMS electric field sensing chip modulates and senses the electric field sensing signal under the mechanical modulation action; The MEMS electric field sensing chip converts the electric field sensing signal into the initial electric field detection signal based on charge sensing. The initial electric field detection signal is transmitted to the back-end signal processing circuit.

[0009] Furthermore, the electric field detection output signal is obtained, including: The back-end signal processing circuit provides the MEMS electric field sensing chip with a driving signal for generating the mechanical modulation. The initial electric field detection signal is amplified by the back-end signal processing circuit to enhance the effective electric field component in the initial electric field detection signal. The back-end signal processing circuit performs interference suppression processing on the amplified initial electric field detection signal to reduce the impact of common-mode interference on the initial electric field detection signal. The back-end signal processing circuit demodulates the initial electric field detection signal after interference suppression to obtain the electric field detection output signal characterizing the external electric field.

[0010] Furthermore, the electric field sensing signal is transmitted to the MEMS electric field sensing chip in a shielded environment formed by the metal shielding shell, including: The metal shielding shell forms a shielding environment surrounding the MEMS electric field sensitive chip and the back-end signal processing circuit. The shielded environment blocks external stray electric fields, coupled electric fields, and spatial electromagnetic interference. The electric field sensing signal is transmitted to the MEMS electric field sensing chip within the shielded environment; The initial electric field detection signal is transmitted to the back-end signal processing circuit within the shielded environment.

[0011] Further, the electric field detection output signal is led out from the metal shielding shell, including: Power lines and signal output lines are led out through cable channels that pass through the metal shielded housing; Power is supplied to the back-end signal processing circuit located inside the metal shielding housing via the power line; The electric field detection output signal is transmitted from inside the metal shielding shell to outside the metal shielding shell through the signal output line; The electric field detection output signal is output to an external data acquisition device or monitoring system.

[0012] Furthermore, after the power line and signal output line are led out through the cable channel passing through the metal shielding shell, it also includes: The gap between the cable channel and the power line is insulated and sealed. The gap between the cable channel and the signal output line is insulated and sealed. The insulation and sealing treatment prevents external dust, moisture, or conductive impurities from entering the interior of the metal shielding shell; The detection of the external electric field is performed while the metal shielding enclosure remains sealed and protected.

[0013] Furthermore, before applying an external electric field to the external signal plate, the process includes: The external signal plate is fixed to the outside of the object to be detected, so that the external signal plate is in a position that can sense the external electric field; The metal shielding shell is fixed to the object to be tested so that the metal shielding shell remains fixed during the testing process; The metal shielding shell is restricted from rotating, sliding, or shifting relative to the object to be tested; The detection of the external electric field is performed while the metal shielding shell remains fixed. The outer surface of the metal shielding shell is subjected to environmental protection treatment to reduce the impact of the external environment on the shielding environment and testing stability.

[0014] A shielded MEMS electric field detection system, the system comprising: The external field sensing module applies an external electric field to an external signal plate and generates an electric field sensing signal corresponding to the external electric field through the external signal plate. The shielding introduction module introduces the electric field sensing signal into the interior of the metal shielding shell through a conductive connection structure, so that the electric field sensing signal can be transmitted to the MEMS electric field sensing chip in the shielded environment formed by the metal shielding shell. The modulation sensing module drives the MEMS electric field sensing chip to perform mechanical modulation, and enables the MEMS electric field sensing chip to sense the electric field sensing signal based on the mechanical modulation, so as to generate an initial electric field detection signal corresponding to the external electric field. The amplification and demodulation module inputs the initial electric field detection signal into the back-end signal processing circuit located inside the metal shielding shell, and amplifies and demodulates the initial electric field detection signal through the back-end signal processing circuit to obtain the electric field detection output signal; The detection output module outputs the electric field detection signal through the metal shielding shell to realize the detection of the external electric field.

[0015] A shielded MEMS electric field detection device, comprising: A metal shielding shell 3, the interior of which forms a shielding environment; An external signal electrode 4 is disposed outside the metal shielding shell 3 and is used to sense an external electric field to form an electric field sensing signal. An internal electrode plate 8 is disposed inside the metal shielding shell 3 and is electrically connected to the external signal electrode plate 4 for receiving the electric field induced signal introduced by the external signal electrode plate 4. MEMS electric field sensing chip 1, the MEMS electric field sensing chip 1 is disposed inside the metal shielding shell 3 and is correspondingly disposed with the built-in electrode plate 8, and is used to sense the electric field sensing signal under mechanical modulation to generate an initial electric field detection signal. The back-end signal processing circuit 2 is disposed inside the metal shielding shell 3 and electrically connected to the MEMS electric field sensing chip 1. It is used to drive the MEMS electric field sensing chip 1 to perform mechanical modulation and to amplify and demodulate the initial electric field detection signal to generate an electric field detection output signal. An external cable opening 7 is provided on the metal shielding shell 3 and is used to allow the signal output line connected to the back-end signal processing circuit 2 to pass through the metal shielding shell 3.

[0016] The technical solution of this invention can achieve the following technical effects: The external electric field is sensed by an external signal plate and introduced into the metal shielded shell through a conductive connection structure. The MEMS electric field sensing chip performs mechanical modulation and sensing. The sensing signal is then amplified and demodulated by the back-end signal processing circuit, and finally outputs the electric field detection signal. This effectively solves the problem that existing electric field detection schemes are unable to effectively introduce the external electric field and process the internal sensitive signal to resist interference in complex electromagnetic environments, resulting in insufficient electric field detection accuracy and stability.

[0017] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a shielded MEMS electric field detection method. Figure 2 This is a schematic diagram of the overall structure and cross-section of a shielded MEMS electric field detection device. Reference numerals: 1. MEMS electric field sensitive chip; 2. Back-end signal processing circuit; 3. Metal shielding shell; 4. External signal electrode plate; 5. Electrode plate insulating base; 6. Fixing bolt; 7. External cable opening; 8. Internal electrode plate. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] Example 1; like Figure 1 As shown, this application provides a shielded MEMS electric field detection method, the method comprising: S10: Apply an external electric field to an external signal plate, and generate an electric field induced signal corresponding to the external electric field through the external signal plate; S20: The electric field sensing signal is introduced into the interior of the metal shielding shell through a conductive connection structure, so that the electric field sensing signal is transmitted to the MEMS electric field sensing chip in the shielded environment formed by the metal shielding shell. S30: Drives the MEMS electric field sensing chip to perform mechanical modulation, and enables the MEMS electric field sensing chip to sense the electric field sensing signal based on the mechanical modulation, so as to generate an initial electric field detection signal corresponding to the external electric field; S40: Input the initial electric field detection signal into the back-end signal processing circuit located inside the metal shielding shell, and amplify and demodulate the initial electric field detection signal through the back-end signal processing circuit to obtain the electric field detection output signal; S50: The electric field detection output signal is led out from the metal shielding shell to realize the detection of the external electric field.

[0023] Specifically, in one embodiment, an external signal electrode is placed in the area where the electric field to be detected is located, exposing the external signal electrode to the external electric field. Under the action of the external electric field, the external signal electrode generates an electric field induced signal corresponding to the electric field strength and its changes. The external signal electrode is connected to an internal electrode inside a metal shielding shell via a conductive connection structure such as a metal needle or metal rod, allowing the electric field induced signal to be introduced into the metal shielding shell and transmitted to the sensing area of ​​the MEMS electric field sensitive chip within the shielded environment formed by the metal shielding shell. The MEMS electric field sensitive chip is disposed inside the metal shielding shell and located at the corresponding position of the internal electrode. The back-end signal processing circuit sends signals to the MEMS electric field sensitive chip. The MEMS electric field sensing chip provides a driving signal, enabling it to mechanically modulate. Based on the principle of charge induction, the chip modulates and senses the electric field signal, generating an initial electric field detection signal corresponding to the external electric field. This initial signal is then input to a back-end signal processing circuit housed within a metal shielding shell. This circuit amplifies, suppresses interference, demodulates, and filters the signal to obtain an output signal characterizing the external electric field. Finally, the output signal is output to an external data acquisition device or monitoring system via a signal output line led from the metal shielding shell, thus achieving the detection of the external electric field. In this process, the metal shielding shell protects against stray electric fields, coupled electric fields, and spatial electromagnetic interference, allowing the MEMS electric field sensing chip and the back-end signal processing circuit to complete electric field sensing and signal processing in a relatively stable shielded environment.

[0024] The technical solution of this invention uses an external signal plate to sense an external electric field and introduce it into the metal shielding shell through a conductive connection structure. The MEMS electric field sensing chip performs mechanical modulation sensing, and the sensing signal is amplified and demodulated by the back-end signal processing circuit to finally output an electric field detection signal. This effectively solves the problem that existing electric field detection schemes are unable to effectively introduce external electric fields and process internal sensitive signals against interference in complex electromagnetic environments, resulting in insufficient electric field detection accuracy and stability.

[0025] Furthermore, the generation of an electric field induced signal corresponding to an external electric field through an external signal plate includes: The external signal plate is exposed to an external electric field so that changes in the external electric field can be sensed through the external signal plate. The external signal plate converts the change in the external electric field into an electric field induced signal. The electric field induced signal is transmitted to the inside of the metal shielding shell through a conductive connection structure that is connected to the external signal plate; This allows the electric field sensing signal to be coupled to the sensing area of ​​the MEMS electric field sensitive chip inside the metal shielding shell.

[0026] In a preferred embodiment, the external signal electrode is strip-shaped and disposed outside the metal shielding shell. The exterior of the external signal electrode is formed of insulating material to support and isolate it. A metal electrode is embedded in the top of the external signal electrode, allowing it to be exposed to the area of ​​the external electric field to be detected and to sense changes in the external electric field. When the external electric field acts on the external signal electrode, the metal electrode generates an electric field induction signal corresponding to the external electric field. This electric field induction signal is transmitted to the interior of the metal shielding shell via a metal needle or rod disposed at the top of the metal shielding shell. Inside the metal shielding shell, a metal needle or rod is connected to an internal electrode plate, allowing the electric field sensing signal to be further transmitted to the internal electrode plate. The internal electrode plate is located above the MEMS electric field sensitive chip and covers the sensing area of ​​the MEMS electric field sensitive chip, thereby enabling the electric field sensing signal to be stably coupled to the MEMS electric field sensitive chip. The external signal electrode plate can also be supported by an electrode plate insulating base, so as to facilitate the installation of the external signal electrode plate on the object to be detected or the device shell, and maintain the relative position stability between the external signal electrode plate and the object to be detected, thereby improving the reliability of the electric field sensing signal introduction process.

[0027] Furthermore, enabling MEMS electric field sensing chips to sense electric field signals based on mechanical modulation includes: A driving signal is applied to the MEMS electric field sensing chip to induce mechanical modulation in the MEMS electric field sensing chip. This enables the MEMS electric field sensing chip to modulate and sense the electric field sensing signal under mechanical modulation. This enables the MEMS electric field sensing chip to convert the electric field sensing signal into an initial electric field detection signal based on charge sensing. The initial electric field detection signal is transmitted to the back-end signal processing circuit.

[0028] As a preferred embodiment of the above, the MEMS electric field sensing chip is disposed inside a metal shielded shell and arranged correspondingly to the built-in electrode plate. The driving circuit in the back-end signal processing circuit provides a stable driving voltage to the MEMS electric field sensing chip, enabling the MEMS electric field sensing chip to generate periodic mechanical modulation based on piezoelectric driving, and to modulate and sense the electric field sensing signal introduced by coupling through the built-in electrode plate in the resonant working state. The MEMS electric field sensing chip can be a MEMS electric field sensor based on the charge induction principle and can be fabricated based on SOI wafer processing. The weak current signal output by the chip is introduced into the back-end signal processing circuit through an electrical connection. During the mechanical modulation process, the electric field sensing signal corresponding to the external electric field is converted into an initial electric field detection signal. The initial electric field detection signal can simultaneously reflect the DC electric field signal and the AC electric field signal, thereby providing a front-end detection signal for subsequent amplification, interference suppression, demodulation and filtering processing.

[0029] Furthermore, obtaining the electric field detection output signal includes: The back-end signal processing circuit provides a drive signal to the MEMS electric field sensing chip to generate mechanical modulation. The initial electric field detection signal is amplified by the back-end signal processing circuit to enhance the effective electric field component in the initial electric field detection signal; The amplified initial electric field detection signal is processed by a back-end signal processing circuit to suppress interference, thereby reducing the impact of common-mode interference on the initial electric field detection signal. The initial electric field detection signal, after interference suppression processing, is demodulated by the back-end signal processing circuit to obtain the electric field detection output signal characterizing the external electric field.

[0030] As a preferred embodiment of the above, the back-end signal processing circuit is housed inside a metal shielded shell and integrated on a PCB board. The back-end signal processing circuit includes a driving circuit, a charge amplification circuit, a differential amplification circuit, and a signal demodulation circuit. The driving circuit provides a stable driving voltage to the MEMS electric field sensitive chip, enabling the MEMS electric field sensitive chip to operate in a mechanically modulated state. The initial electric field detection signal output by the MEMS electric field sensitive chip is first input to the charge amplification circuit, which performs high-gain, low-noise primary amplification on the weak current signal. The initial electric field detection signal after primary amplification is further input to the differential amplification circuit, which suppresses common-mode interference in the signal and enhances the effective differential signal corresponding to the external electric field. The initial electric field detection signal after differential amplification is input to the signal demodulation circuit, which demodulates and filters the mechanically modulated signal to extract the amplitude and phase information of the external electric field and form an electric field detection output signal. The electric field detection output signal can be output as an analog signal via a signal output line to an external data acquisition device or monitoring system for real-time observation, recording, or subsequent analysis.

[0031] Furthermore, the electric field sensing signal is transmitted to the MEMS electric field sensing chip within a shielded environment formed by a metal shielding shell, including: A shielded environment is formed around the MEMS electric field sensitive chip and the back-end signal processing circuitry by using a metal shielding shell. By shielding the environment, external stray electric fields, coupled electric fields, and spatial electromagnetic interference are blocked; This allows the electric field sensing signal to be transmitted to the MEMS electric field sensing chip within a shielded environment. This allows the initial electric field detection signal to be transmitted to the back-end signal processing circuit within a shielded environment.

[0032] As a preferred embodiment, the metal shielding shell is made of a high-conductivity metal material and forms a closed or nearly closed equipotential shielding structure, creating a shielded environment inside the metal shielding shell to accommodate the MEMS electric field sensing chip and the back-end signal processing circuit. The MEMS electric field sensing chip, the built-in electrode plate, and the back-end signal processing circuit are all arranged within the shielded environment. The electric field sensing signal generated by the external signal electrode plate is introduced into the metal shielding shell through a conductive connection structure, and then transmitted to the built-in electrode plate in the shielded environment, and coupled to the sensing area of ​​the MEMS electric field sensing chip by the built-in electrode plate. The metal shielding shell can isolate external stray electric fields, coupled electric fields, and spatial electromagnetic interference based on the principle of electrostatic shielding, enabling the MEMS electric field sensing chip to complete electric field sensing in a low-interference environment. The initial electric field detection signal generated by the MEMS electric field sensing chip continues to be transmitted to the back-end signal processing circuit in the shielded environment, where the back-end signal processing circuit performs subsequent amplification and demodulation processing. The metal shielding shell can also be provided with a slot for fixing the PCB board, so that the PCB board carrying the back-end signal processing circuit can be stably installed inside the metal shielding shell, thereby reducing the impact of installation deviation, transportation movement, or long-term operation vibration on detection consistency and stability.

[0033] Furthermore, the electric field detection output signal is led out from the metal shielding shell, including: Power and signal output lines are led out through cable channels that pass through the metal shielded housing; Power is supplied to the back-end signal processing circuitry located inside the metal shielded enclosure via a power cord; The electric field detection output signal is transmitted from inside the metal shielding shell to outside the metal shielding shell via the signal output line; The electric field detection output signal is sent to an external data acquisition device or monitoring system.

[0034] As a preferred embodiment of the above, the sidewall of the metal shielding shell is provided with an external cable opening. The position and diameter of the external cable opening can be adaptively designed according to the layout of the PCB board inside the metal shielding shell and the wire diameter of the external connecting cable. Both the power supply line and the signal output line are led out from inside the metal shielding shell through the external cable opening. The power supply line is used to provide a stable operating voltage to the drive circuit, amplification circuit and demodulation circuit in the back-end signal processing circuit. The power supply line can be a three-core interface cable, corresponding to the positive power supply, negative power supply and ground terminal respectively. The signal output line is connected to the output terminal of the back-end signal processing circuit and is used to transmit the electric field detection output signal formed after amplification and demodulation to the outside of the metal shielding shell. The signal output line can be an SMA coaxial cable to reduce the influence of external interference during the signal output process and facilitate connection to external data acquisition equipment or monitoring system. The electric field detection output signal can be an electric field sensing analog signal. After receiving the electric field sensing analog signal, the external data acquisition equipment or monitoring system can perform real-time observation, recording and analysis of the external electric field.

[0035] Furthermore, after the power and signal output lines are led out through the cable channel that runs through the metal shielding shell, it also includes: Insulate and seal the gap between the cable channel and the power line; Insulate and seal the gap between the cable channel and the signal output line; Insulation and sealing processes prevent external dust, moisture, or conductive impurities from entering the metal shielding shell. The detection of external electric fields is performed while the metal shielding enclosure remains sealed and protected.

[0036] As a preferred embodiment, after the power line and signal output line are led out through the external cable opening on the side wall of the metal shielding shell, insulating sealant is injected and filled at the external cable opening position, so that the insulating sealant fills the gap between the external cable opening and the power line and the gap between the external cable opening and the signal output line. After the insulating sealant cures, it forms a mechanical reinforcement structure and interface sealing structure at the cable insertion point, thereby improving the stability of the connection position between the power line, signal output line and the metal shielding shell, and reducing the impact of cable shaking or pulling on the reliability of internal circuit connection. The interface sealing structure can prevent external dust, moisture and other conductive impurities from entering the interior of the metal shielding shell, so that the MEMS electric field sensitive chip, built-in electrode plate and back-end signal processing circuit are in a relatively closed shielded environment. During long-term use, the shielding environment inside the metal shielding shell can maintain a good airtight protection state, thereby reducing the influence of external environmental factors on the electric field induction signal, the initial electric field detection signal and the electric field detection output signal, and improving the stability and reliability of electric field detection in complex environments.

[0037] Furthermore, before applying an external electric field to the external signal plate, the following steps are included: The external signal plate is fixed to the outside of the object to be tested so that the external signal plate is in a position that can sense the external electric field; The metal shielding shell is fixed to the object to be tested so that the metal shielding shell remains fixed during the testing process; Restrict the metal shielding enclosure from rotating, sliding, or shifting relative to the object being tested; The external electric field is detected while the metal shielding enclosure remains fixed. Environmental protection treatment is applied to the outer surface of the metal shielding enclosure to reduce the impact of the external environment on the shielding environment and testing stability.

[0038] As a preferred embodiment of the above, the external signal electrode is supported by an insulating base, which is mounted on the housing of the object or equipment under test. This allows the external signal electrode to be stably positioned within the area of ​​the external electric field and maintains its positional relationship with the housing. The metal shielding housing is mounted on the housing of the object or equipment under test using fixing bolts. These bolts ensure a tight fit between the metal shielding housing and the mounting surface, achieving stable mounting against rotation, slippage, and displacement. During electric field detection, the relative positions of the metal shielding housing, external signal electrode, conductive connection structure, internal electrode, and MEMS electric field sensitive chip remain stable. This allows the external electric field to be stably introduced into the metal shielding housing via the external signal electrode and conductive connection structure, reducing detection errors caused by installation shaking, positional deviation, or long-term operational displacement. When used outdoors or in complex environments, the outer surface of the metal shielding housing can be coated with a hydrophobic, weather-resistant, or anti-fouling coating. This prevents water and dirt accumulation on the housing surface, reducing the impact of rainwater, stains, and environmental aging on shielding performance and detection stability, thereby improving the long-term reliability of the electric field detection device.

[0039] Example 2; Based on the same inventive concept as the shielded MEMS electric field detection method in the foregoing embodiments, the present invention also provides a shielded MEMS electric field detection system, the system comprising: The external field sensing module applies an external electric field to an external signal plate and generates an electric field sensing signal corresponding to the external electric field through the external signal plate. The shielding introduction module introduces the electric field sensing signal into the interior of the metal shielding shell through a conductive connection structure, so that the electric field sensing signal can be transmitted to the MEMS electric field sensing chip in the shielded environment formed by the metal shielding shell. The modulation sensing module drives the MEMS electric field sensing chip to perform mechanical modulation, and enables the MEMS electric field sensing chip to sense the electric field sensing signal based on the mechanical modulation, so as to generate an initial electric field detection signal corresponding to the external electric field. The amplification and demodulation module inputs the initial electric field detection signal into the back-end signal processing circuit located inside the metal shielding shell, and amplifies and demodulates the initial electric field detection signal through the back-end signal processing circuit to obtain the electric field detection output signal; The detection output module outputs the electric field detection signal through the metal shielding shell to realize the detection of the external electric field.

[0040] The adjustment system described above in this invention can effectively realize a shielded MEMS electric field detection method, and the technical effects it can achieve are as described in the above embodiments, which will not be repeated here.

[0041] Example 3; Based on the same inventive concept as the shielded MEMS electric field detection method in the foregoing embodiments, the present invention also provides a shielded MEMS electric field detection device, comprising: Metal shielding shell 3, the interior of metal shielding shell 3 forms a shielded environment; External signal plate 4 is disposed outside the metal shielding shell 3 and is used to sense the external electric field to form an electric field sensing signal. Built-in electrode plate 8 is disposed inside the metal shielding shell 3 and is electrically connected to the external signal electrode plate 4 for receiving the electric field induction signal introduced by the external signal electrode plate 4. MEMS electric field sensing chip 1 is disposed inside the metal shielding shell 3 and is correspondingly disposed with the built-in electrode plate 8. It is used to sense the electric field sensing signal under the action of mechanical modulation to generate an initial electric field detection signal. The back-end signal processing circuit 2 is disposed inside the metal shielding shell 3 and is electrically connected to the MEMS electric field sensing chip 1. It is used to drive the MEMS electric field sensing chip 1 to perform mechanical modulation and to amplify and demodulate the initial electric field detection signal to generate an electric field detection output signal. External cable opening 7 is provided on the metal shielding shell 3 and is used for the signal output line connected to the back-end signal processing circuit 2 to pass through the metal shielding shell 3.

[0042] Specifically, in one particular implementation, such as Figure 2As shown, the shielded MEMS electric field detection device includes a MEMS electric field sensing chip 1, a back-end signal processing circuit 2, a metal shielding shell 3, an external signal electrode 4, an electrode insulating base 5, fixing bolts 6, an external cable opening 7, and an internal electrode 8. The metal shielding shell 3 can be a cuboid structure and is made of a high-conductivity metal material. The interior of the metal shielding shell 3 forms a shielded environment to accommodate the MEMS electric field sensing chip 1, the back-end signal processing circuit 2, and the internal electrode 8, thereby blocking external stray electric fields, coupled electric fields, and spatial electromagnetic interference based on the principle of electrostatic shielding, enabling the internal sensitive signal to be sensed and processed in a low-interference environment. A slot can also be provided inside the metal shielding shell 3, where the PCB board carrying the back-end signal processing circuit 2 is fixedly installed, thereby reducing the impact of installation deviations, transportation movement, or long-term operational vibrations on detection consistency and stability. An external signal electrode 4 is disposed outside the metal shielding shell 3 and supported by an electrode insulating base 5. The electrode insulating base 5 can be fixed to the object to be detected or the shell of the equipment, so that the external signal electrode 4 is stably arranged in the area of ​​external electric field action. The external signal electrode 4 can be strip-shaped, with the outside formed by insulating material and a metal electrode embedded at the top, so that the external signal electrode 4 can induce an electric field signal under the action of an external electric field. The external signal electrode 4 is electrically connected to the internal electrode 8 located inside the metal shielding shell 3. Specifically, the electrical connection can be achieved by a metal needle or metal rod set at the top of the metal shielding shell 3, so as to introduce the electric field signal induced by the external signal electrode 4 into the interior of the metal shielding shell 3. The internal electrode 8 is disposed above the MEMS electric field sensitive chip 1 and is arranged corresponding to the sensing area of ​​the MEMS electric field sensitive chip 1, so that the electric field sensing signal can be stably coupled to the MEMS electric field sensitive chip 1 through the internal electrode 8. MEMS electric field sensing chip 1 is disposed inside the metal shielding shell 3 and is used for front-end sensing of the electric field sensing signal introduced through the built-in electrode plate 8. MEMS electric field sensing chip 1 can be an electric field sensing chip based on the charge induction principle and achieve mechanical modulation through piezoelectric driving, thereby modulating and sensing the DC electric field signal and the AC electric field signal. MEMS electric field sensing chip 1 can be fabricated based on SOI wafer processing, and the chip signal can be introduced into the back-end signal processing circuit 2 on the PCB board through gold wire bonding. The back-end signal processing circuit 2 is disposed inside the metal shielding shell 3 and is electrically connected to MEMS electric field sensing chip 1. The back-end signal processing circuit 2 can include a driving circuit, a charge amplification circuit, a differential amplification circuit, and a signal demodulation circuit. The driving circuit is used to provide a stable driving voltage to MEMS electric field sensing chip 1, the charge amplification circuit is used to perform primary amplification of the weak current signal output by MEMS electric field sensing chip 1, the differential amplification circuit is used to suppress common-mode interference and enhance the effective differential signal, and the signal demodulation circuit is used to demodulate and filter the mechanically modulated sensing signal to obtain an electric field detection output signal that can characterize the external electric field. The metal shielding shell 3 has an external cable opening 7 on its side wall. Power cables and signal output cables can be led out from inside the metal shielding shell 3 through the external cable opening 7. The power cable is used to provide working voltage to the back-end signal processing circuit 2. The power cable can be a three-core interface cable with corresponding positive power, negative power and ground terminals respectively. The signal output cable is connected to the output terminal of the back-end signal processing circuit 2 and is used to transmit the electric field detection output signal to external data acquisition equipment or monitoring system. The signal output cable can be an SMA coaxial cable. The electric field detection output signal can be an electric field sensing analog signal. The external cable opening 7 can be filled and cured with insulating sealant to form a mechanical reinforcement structure and interface sealing structure at the cable insertion point, thereby preventing external dust, moisture and conductive impurities from entering the interior of the metal shielding shell 3. The fixing bolts 6 are used to fix the metal shielding shell 3 to the object or equipment shell to be tested, so that the metal shielding shell 3 fits tightly with the mounting surface and achieves stable installation without rotation, slippage, or displacement. The outer surface of the metal shielding shell 3 can also be coated with a hydrophobic, weather-resistant, or anti-fouling coating to reduce the impact of water accumulation, dirt accumulation, and environmental aging on shielding performance and detection stability. During operation, the external electric field is first induced by the external signal plate 4 to form an electric field induction signal. The electric field induction signal enters the interior of the metal shielding shell 3 through the conductive connection between the external signal plate 4 and the internal plate 8, and is coupled to the MEMS electric field sensitive chip 1. Under the action of the driving signal provided by the back-end signal processing circuit 2, the MEMS electric field sensitive chip 1 performs mechanical modulation sensing and generates an initial electric field detection signal. The back-end signal processing circuit 2 amplifies, suppresses interference, demodulates, and filters the initial electric field detection signal to generate an electric field detection output signal. The electric field detection output signal is output to the external device through the signal output line passing through the external cable opening 7, thereby realizing the detection of the external electric field.

[0043] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely exemplary illustrations of the application as defined herein, and are to be considered as covering any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from its scope. Thus, if such modifications and modifications fall within the scope of this application and its equivalents, this application intends to include such modifications and modifications.

Claims

1. A shielded MEMS electric field detection method, characterized in that, The method includes: An external electric field is applied to an external signal plate, and an electric field induction signal corresponding to the external electric field is generated through the external signal plate. The electric field sensing signal is introduced into the interior of the metal shielding shell through a conductive connection structure, so that the electric field sensing signal is transmitted to the MEMS electric field sensing chip in the shielding environment formed by the metal shielding shell. The MEMS electric field sensing chip is driven to perform mechanical modulation, and the MEMS electric field sensing chip senses the electric field sensing signal based on the mechanical modulation to generate an initial electric field detection signal corresponding to the external electric field; The initial electric field detection signal is input into the back-end signal processing circuit located inside the metal shielding shell, and the initial electric field detection signal is amplified and demodulated by the back-end signal processing circuit to obtain the electric field detection output signal; The electric field detection output signal is led out from the metal shielding shell to realize the detection of the external electric field.

2. The shielded MEMS electric field detection method according to claim 1, characterized in that, The generation of an electric field induced signal corresponding to the external electric field through the external signal plate includes: The external signal plate is exposed to the external electric field so that changes in the external electric field can be sensed through the external signal plate; The external signal plate converts the change in the external electric field into the electric field induced signal. The electric field induced signal is transmitted to the interior of the metal shielding shell through the conductive connection structure that is connected to the external signal plate; The electric field sensing signal is coupled to the sensing area of ​​the MEMS electric field sensitive chip inside the metal shielding shell.

3. The shielded MEMS electric field detection method according to claim 1, characterized in that, The method for enabling the MEMS electric field sensing chip to sense the electric field sensing signal based on the mechanical modulation includes: A driving signal is applied to the MEMS electric field sensing chip to cause the MEMS electric field sensing chip to generate the mechanical modulation. The MEMS electric field sensing chip modulates and senses the electric field sensing signal under the mechanical modulation action; The MEMS electric field sensing chip converts the electric field sensing signal into the initial electric field detection signal based on charge sensing. The initial electric field detection signal is transmitted to the back-end signal processing circuit.

4. The shielded MEMS electric field detection method according to claim 1, characterized in that, Obtain the electric field detection output signal, including: The back-end signal processing circuit provides the MEMS electric field sensing chip with a driving signal for generating the mechanical modulation. The initial electric field detection signal is amplified by the back-end signal processing circuit to enhance the effective electric field component in the initial electric field detection signal. The back-end signal processing circuit performs interference suppression processing on the amplified initial electric field detection signal to reduce the impact of common-mode interference on the initial electric field detection signal. The back-end signal processing circuit demodulates the initial electric field detection signal after interference suppression to obtain the electric field detection output signal characterizing the external electric field.

5. The shielded MEMS electric field detection method according to claim 1, characterized in that, The electric field sensing signal is transmitted to the MEMS electric field sensing chip in a shielded environment formed by the metal shielding shell, including: The metal shielding shell forms a shielding environment surrounding the MEMS electric field sensitive chip and the back-end signal processing circuit. The shielded environment blocks external stray electric fields, coupled electric fields, and spatial electromagnetic interference. The electric field sensing signal is transmitted to the MEMS electric field sensing chip within the shielded environment; The initial electric field detection signal is transmitted to the back-end signal processing circuit within the shielded environment.

6. The shielded MEMS electric field detection method according to claim 1, characterized in that, The electric field detection output signal is led out from the metal shielding shell, including: Power lines and signal output lines are led out through cable channels that pass through the metal shielded housing; Power is supplied to the back-end signal processing circuit located inside the metal shielding housing via the power line; The electric field detection output signal is transmitted from inside the metal shielding shell to outside the metal shielding shell through the signal output line; The electric field detection output signal is output to an external data acquisition device or monitoring system.

7. The shielded MEMS electric field detection method according to claim 6, characterized in that, After the power line and signal output line are led out through the cable channel passing through the metal shielded shell, it also includes: The gap between the cable channel and the power line is insulated and sealed. The gap between the cable channel and the signal output line is insulated and sealed. The insulation and sealing treatment prevents external dust, moisture, or conductive impurities from entering the interior of the metal shielding shell; The detection of the external electric field is performed while the metal shielding enclosure remains sealed and protected.

8. The shielded MEMS electric field detection method according to claim 1, characterized in that, Before applying an external electric field to the external signal plate, the process includes: The external signal plate is fixed to the outside of the object to be detected, so that the external signal plate is in a position that can sense the external electric field; The metal shielding shell is fixed to the object to be tested so that the metal shielding shell remains fixed during the testing process; The metal shielding shell is restricted from rotating, sliding, or shifting relative to the object to be tested; The detection of the external electric field is performed while the metal shielding shell remains fixed. The outer surface of the metal shielding shell is subjected to environmental protection treatment to reduce the impact of the external environment on the shielding environment and testing stability.

9. A shielded MEMS electric field detection system, characterized in that, The system includes: The external field sensing module applies an external electric field to an external signal plate and generates an electric field sensing signal corresponding to the external electric field through the external signal plate. The shielding introduction module introduces the electric field sensing signal into the interior of the metal shielding shell through a conductive connection structure, so that the electric field sensing signal can be transmitted to the MEMS electric field sensing chip in the shielded environment formed by the metal shielding shell. The modulation sensing module drives the MEMS electric field sensing chip to perform mechanical modulation, and enables the MEMS electric field sensing chip to sense the electric field sensing signal based on the mechanical modulation, so as to generate an initial electric field detection signal corresponding to the external electric field. The amplification and demodulation module inputs the initial electric field detection signal into the back-end signal processing circuit located inside the metal shielding shell, and amplifies and demodulates the initial electric field detection signal through the back-end signal processing circuit to obtain the electric field detection output signal; The detection output module outputs the electric field detection signal through the metal shielding shell to realize the detection of the external electric field.

10. A shielded MEMS electric field detection device, characterized in that, include: A metal shielding shell (3) forms a shielding environment inside the metal shielding shell (3); An external signal plate (4) is disposed outside the metal shielding shell (3) and is used to sense an external electric field to form an electric field sensing signal. Built-in electrode plate (8) is disposed inside the metal shielding shell (3) and electrically connected to the external signal electrode plate (4) for receiving the electric field induced signal introduced by the external signal electrode plate (4); MEMS electric field sensitive chip (1), the MEMS electric field sensitive chip (1) is disposed inside the metal shield shell (3) and is disposed correspondingly to the built-in electrode plate (8), and is used to sense the electric field sensing signal under mechanical modulation to generate an initial electric field detection signal; The back-end signal processing circuit (2) is located inside the metal shielding shell (3) and is electrically connected to the MEMS electric field sensitive chip (1). It is used to drive the MEMS electric field sensitive chip (1) to perform mechanical modulation and to amplify and demodulate the initial electric field detection signal to generate an electric field detection output signal. External cable opening (7) is provided on the metal shielding shell (3) and is used to allow the signal output line connected to the back-end signal processing circuit (2) to pass through the metal shielding shell (3).

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