High-speed high-frequency circuit board performance test system and test method

Abstract

The application relates to a high-speed high-frequency circuit board performance test system and a test method. The test system comprises a test carrier and a test device. The test carrier is used for loading a to-be-tested circuit board, and the to-be-tested circuit board is provided with a mounting hole. The test device comprises a test mechanism, a vertical solder-free radio frequency coaxial connector and a positioning pin. The vertical solder-free radio frequency coaxial connector is connected with the test mechanism and can move under the driving of the test mechanism. The positioning pin is arranged on the vertical solder-free radio frequency coaxial connector and is inserted into the mounting hole. During installation, the positioning pin can be directly aligned and inserted into the preset mounting hole of the to-be-tested circuit board to realize assembly and positioning of the vertical solder-free radio frequency coaxial connector and the to-be-tested circuit board. Therefore, screws, pads and other components are not needed, installation and disassembly are convenient and labor-saving, and the test efficiency is improved. Meanwhile, the vertical solder-free radio frequency coaxial connector cannot be continuously used and scrapped due to damage of a threaded hole, and the test cost is avoided from being increased.

Description

Technical Field

[0001] This application relates to the technical field of circuit board performance testing, and in particular to a high-speed, high-frequency circuit board performance testing system and testing method. Background Technology

[0002] With the development of electronic products such as AI and 5G / 6G communications, the mainstream transmission rate of high-speed digital signals inside devices has increased to the current 56 / 112Gbps-PAM4, and will continue to develop towards 224 / 448Gbps in the next step. High-frequency, high-speed digital signals are broadband signals, covering the entire frequency range from DC (direct current) to the signal fundamental frequency. The circuit board is the carrier of the signal processing chip and also the channel for data transmission. Therefore, in the development of high-frequency, high-speed products, the feasibility of the circuit board design scheme is evaluated based on the requirements of manufacturability, reliability, and signal transmission performance. Among them, the characterization of signal transmission performance is mainly carried out in the form of PCB SI test board (Signal Integrity Test Board). The impact of PCB board material, stack-up structure, and PCB manufacturing process on the passive indicators of high-speed signal transmission is measured using vertical solderless RF coaxial connectors. The main indicators of concern are impedance, insertion loss, and crosstalk.

[0003] In related technologies, vertical solderless RF coaxial connectors are typically mounted to test boards using screws. When the test board is thin, spacers are often added to prevent mechanical stress deformation after the screws are tightened. This traditional mounting structure is cumbersome and inefficient in installing and removing screws and spacers, impacting testing efficiency. Furthermore, frequent disassembly and reassembly can damage the threaded holes of the vertical solderless RF coaxial connector, rendering it unusable and increasing testing costs. Summary of the Invention

[0004] Therefore, it is necessary to provide a high-speed, high-frequency circuit board performance testing system and method to address the problems of low testing efficiency and high testing costs.

[0005] A first aspect of this application provides a high-speed, high-frequency circuit board performance testing system, comprising:

[0006] Test carrier, the test carrier being used to mount a circuit board under test, the circuit board under test having mounting holes; and

[0007] The testing device includes a testing mechanism, a vertical solderless RF coaxial connector, and a positioning pin. The vertical solderless RF coaxial connector is connected to the testing mechanism and can move under the drive of the testing mechanism. The positioning pin is mounted on the vertical solderless RF coaxial connector and is inserted into the mounting hole.

[0008] This high-speed, high-frequency circuit board performance testing system is applied to the automated testing and analysis of signal integrity and signal quality of custom-developed circuit boards based on vertical solderless RF coaxial connectors. Specifically, the system first loads the test carrier into the testing mechanism, then mounts the circuit board under test onto the test carrier to achieve proper positioning before testing. Next, the positioning pins and the vertical solderless RF coaxial connector are pre-assembled, and then the connector is installed with the testing mechanism, completing the pre-test preparation. Based on this, by controlling the testing mechanism, the system moves the vertical solderless RF coaxial connector onto the circuit board under test and presses it down to align with the corresponding test pattern. This establishes a signal path between the testing mechanism and the circuit board under test through the vertical solderless RF coaxial connector, enabling automated testing and analysis of the circuit board's signal integrity and signal quality. Furthermore, compared to the traditional method of using threads to install vertical solderless RF coaxial connectors and circuit boards under test, this solution uses pre-installed positioning pins on the vertical solderless RF coaxial connector. These pins can be directly aligned and inserted into the pre-set mounting holes on the circuit board under test, thus achieving assembly and positioning of the vertical solderless RF coaxial connector and the circuit board under test. Therefore, screws, washers, and other components are not required, making installation and disassembly convenient and labor-saving, which helps to improve testing efficiency. At the same time, the vertical solderless RF coaxial connector will not be rendered unusable and scrapped due to damage to the threaded holes, avoiding increased testing costs.

[0009] The technical solution of this application will be further described below:

[0010] In one embodiment, the vertical solderless RF coaxial connector includes a flange portion, a coaxial portion, and an intermediate connecting portion, wherein the flange portion is connected to the coaxial portion via the intermediate connecting portion;

[0011] The flange portion has a threaded hole, and the positioning pin includes a threaded section and a positioning section connected together. The threaded section is screwed into the threaded hole, and the positioning section protrudes to the outside of the flange portion and is inserted into the mounting hole.

[0012] In one embodiment, the outer peripheral wall of the positioning segment is formed with an inlet portion, which is used to guide the positioning segment into the mounting hole.

[0013] In one embodiment, the test mechanism includes a test head, which includes a crossbeam portion with a loading hole, into which the vertical solderless RF coaxial connector is inserted.

[0014] In one embodiment, the test head further includes a vertical beam portion, and the horizontal beam portion is connected to the vertical beam portion;

[0015] The testing mechanism also includes a transfer module and a test base, the vertical beam is installed on the test base, and the test base is connected to the transfer module.

[0016] In one embodiment, the test stand includes a seat plate and a boss connected together. The seat plate is connected to the transfer module, and the boss is provided with a receiving hole. The vertical beam portion is installed in the receiving hole.

[0017] In one embodiment, the test seat further includes an elastic element and a pressure sensor, both of which are installed in the receiving hole. The elastic element is arranged closer to the opening of the receiving hole than the pressure sensor. A portion of the vertical beam is inserted into the receiving hole and abuts against one end of the elastic element, while the other end of the elastic element abuts against the pressure sensor.

[0018] A support column is formed by protruding from the side of the vertical beam away from the horizontal beam. The elastic element is fitted onto the outside of the support column. When the elastic element is compressed to a preset state, the support column abuts against the pressure sensor.

[0019] In one embodiment, the transfer module includes a three-axis motion platform and a robotic arm, the robotic arm is mounted on the three-axis motion platform, the base plate is connected to the robotic arm, and a force feedback sensor is mounted on the robotic arm;

[0020] And / or, the test carrier is recessed to form a test groove, the test groove being used to accommodate the circuit board under test; the groove wall of the test groove is provided with a positioning post, the positioning post being used to be adapted and installed with the positioning hole on the circuit board under test; wherein, when the test carrier is made of metal, a non-conductive adhesive film is laid in the test groove, the non-conductive adhesive film being used to support the circuit board under test.

[0021] In one embodiment, the high-speed, high-frequency circuit board performance testing system further includes a computer and a network analyzer. The computer is electrically connected to the network analyzer, the network analyzer has an RF cable, the RF cable is electrically connected to the vertical solderless RF coaxial connector, and the computer is electrically connected to the three-axis motion platform.

[0022] A second aspect of this application also proposes a testing method for a high-speed, high-frequency circuit board performance testing system as described in any of the above embodiments, comprising the following steps:

[0023] The testing facility was calibrated.

[0024] The test carrier is loaded into the test mechanism, and then the circuit board to be tested is loaded into the test carrier;

[0025] Import the test program;

[0026] Test point alignment;

[0027] The circuit board under test is subjected to performance testing to obtain scattering parameters;

[0028] Data analysis and determination of scattering parameters are performed. Attached Figure Description

[0029] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a high-speed, high-frequency circuit board performance testing system according to an embodiment.

[0032] Figure 2 This is a schematic diagram of the structure of a test device according to one embodiment.

[0033] Figure 3 for Figure 2 The main view structure diagram.

[0034] Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure at point AA.

[0035] Figure 5 for Figure 2 A schematic diagram of the exploded structure of the test device.

[0036] Figure 6 This is an assembly structure diagram of a test head, a vertical solderless RF coaxial connector, and a positioning pin, as shown in one embodiment.

[0037] Figure 7 This is a schematic diagram of the structure of a test head according to one embodiment.

[0038] Figure 8 This is a schematic diagram of the structure of a vertical solderless RF coaxial connector according to an embodiment.

[0039] Figure 9 This is a schematic diagram of the positioning pin in one embodiment.

[0040] Figure 10This is a schematic diagram of the structure of a circuit board under test according to an embodiment.

[0041] Figure 11 This is a flowchart illustrating the steps of a test method for a high-speed, high-frequency circuit board performance testing system according to an embodiment.

[0042] Explanation of reference numerals in the attached figures:

[0043] 100. High-speed, high-frequency circuit board performance testing system; 10. Test carrier; 20. Test device; 21. Test mechanism; 22. Vertical solderless RF coaxial connector; 221. Flange; 222. Coaxial part; 223. Intermediate connection part; 23. Positioning pin; 231. Threaded section; 232. Positioning section; 2321. Inlet part; 24. Test head; 241. Crossbeam part; 2411. Loading hole; 242. Vertical beam part; 243. Support column; 25. Transfer module; 26. Test seat; 261. Seat plate; 262. Boss; 2621. Receiving hole; 263. Elastic element; 264. Pressure sensor; 265. Connecting shaft; 30. Computer; 40. Network analyzer; 200. Circuit board under test; 210. Positioning hole; 220. Test pattern. Detailed Implementation

[0044] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0045] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0046] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0047] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0048] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0049] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0050] See Figure 1 This application presents a high-speed, high-frequency circuit board performance testing system 100, which includes a test carrier 10 and a test device 20, according to an embodiment of the present application.

[0051] Please continue reading. Figure 2 ,as well as Figures 5 to 10The test carrier 10 is used to load the circuit board under test 200, which has mounting holes. The test device 20 includes a test mechanism 21, a vertical solderless RF coaxial connector 22 and a positioning pin 23. The vertical solderless RF coaxial connector 22 is connected to the test mechanism 21 and can move under the drive of the test mechanism 21. The positioning pin 23 is mounted on the vertical solderless RF coaxial connector 22 and is inserted into the mounting hole.

[0052] Specifically, the purpose of the test is to measure the impact of the board material, stack-up structure and manufacturing process of the circuit board under test 200 on the passive performance of high-speed signal transmission by using a vertical solderless RF coaxial connector 22. The main performance indicators to be considered include impedance, insertion loss and crosstalk.

[0053] In summary, implementing the technical solution of this embodiment will achieve the following beneficial effects: The high-speed, high-frequency circuit board performance testing system 100 of this solution is applied to the automated testing and analysis of signal integrity and signal quality of the circuit board 200 under test, which is custom-developed based on the vertical solderless RF coaxial connector 22. Specifically, in use, the test carrier 10 is first loaded into the test mechanism 21, and then the circuit board 200 under test is installed on the test carrier 10 to achieve the installation and positioning of the circuit board 200 under test before testing; then, the positioning pin 23 is connected to the vertical solderless RF coaxial connector 22. The shaft connector 22 is pre-assembled into one unit, and then the vertical solderless RF coaxial connector 22 is installed with the test mechanism 21, thus completing the preparation work before testing. On this basis, by controlling the test mechanism 21, the test mechanism 21 moves the vertical solderless RF coaxial connector 22 onto the circuit board under test 200 and presses it down to align with the corresponding test pattern 220. This establishes a signal path between the test mechanism 21 and the circuit board under test 200 through the vertical solderless RF coaxial connector 22, thereby enabling automated testing and analysis of the model integrity and signal quality of the circuit board under test 200.

[0054] Furthermore, compared to the traditional method of using threads to install the vertical solderless RF coaxial connector 22 and the circuit board under test 200, this solution uses a pre-installed positioning pin 23 on the vertical solderless RF coaxial connector 22. The positioning pin 23 can be directly aligned and inserted into the pre-set mounting holes on the circuit board under test 200 to achieve assembly and positioning of the vertical solderless RF coaxial connector 22 and the circuit board under test 200. Therefore, screws, washers, and other components are not required, making installation and disassembly convenient and labor-saving, which helps to improve testing efficiency. At the same time, the vertical solderless RF coaxial connector 22 will not be rendered unusable and scrapped due to damage to the threaded holes, thus avoiding increased testing costs.

[0055] Please continue reading. Figure 8 and Figure 9In one embodiment, the vertical solderless RF coaxial connector 22 includes a flange portion 221, a coaxial portion 222, and an intermediate connecting portion 223, wherein the flange portion 221 is connected to the coaxial portion 222 via the intermediate connecting portion 223.

[0056] The flange 221 has a threaded hole. The positioning pin 23 includes a threaded section 231 and a positioning section 232 connected to each other. The threaded section 231 is screwed into the threaded hole, and the positioning section 232 protrudes to the outside of the flange 221 and is inserted into the mounting hole.

[0057] The main function of the vertical solderless RF coaxial connector 22 is to lead the signal from the circuit board under test 200 to the standard coaxial cable, and then transmit it to the test mechanism 21. The flange portion 221 is used to assemble onto the circuit board under test 200 to achieve assembly and positioning of the vertical solderless RF coaxial connector 22 and the circuit board under test 200. For example, the flange portion 221 and the surface of the circuit board under test 200 are in surface-to-surface contact to improve stability. The coaxial portion 222 is used for direct connection with the coaxial cable. The intermediate connecting portion 223 is a structural transition used to achieve impedance matching between the flange portion 221 and the coaxial portion 222.

[0058] The positioning pin 23 can be screwed into the threaded hole of the flange 221 via the threaded section 231, so that the positioning pin 23 and the vertical solderless RF coaxial connector 22 can be assembled and fixed. The installation method is simple and the connection reliability is high. The exposed positioning section 232 is used to insert into the preset mounting hole on the circuit board under test 200 to achieve quick and efficient assembly and positioning of the vertical solderless RF coaxial connector 22 and the circuit board under test 200.

[0059] Furthermore, based on the above embodiments, the outer peripheral wall of the positioning segment 232 is formed with an inlet portion 2321, which is used to guide the positioning segment 232 into the mounting hole. For example, in this application, the inlet portion 2321 is a conical surface, which, by adopting a pointed structure, makes it easier for the positioning pin 23 to be inserted into the mounting hole, and also allows the positioning pin 23 to be effectively inserted into the mounting hole even with a certain alignment deviation.

[0060] Specifically, in this application, two positioning pins 23 are installed on the flange portion 221, and the two positioning pins 23 are arranged side by side at intervals along the length direction of the flange portion 221. The two positioning pins 23 are respectively aligned and inserted into the corresponding mounting holes on the circuit board under test 200 to further improve the stability of the installation, and at the same time prevent the vertical solderless RF coaxial connector 22 from rotating during the test, which would affect the accuracy of the test results or even damage the circuit board under test 200.

[0061] Please continue reading. Figure 2 ,as well as Figures 5 to 7Furthermore, based on any of the above embodiments, the test mechanism 21 includes a test head 24, which includes a crossbeam portion 241. The crossbeam portion 241 has a loading hole 2411, into which a vertical solderless RF coaxial connector 22 is inserted. Therefore, the vertical solderless RF coaxial connector 22 can be directly inserted into the loading hole 2411 to achieve assembly and fixation with the test head 24. The installation method and structure are simple and highly feasible.

[0062] For example, the shape and size of the loading hole 2411 are adapted to the shape and size of the flange 221 respectively. The flange 221 is inserted into the loading hole 2411, and the installation and fixation are achieved by means of the interference fit between the hole wall of the loading hole 2411 and the outer peripheral surface of the flange 221.

[0063] In an optional embodiment, the test head 24 further includes a vertical beam portion 242, to which a horizontal beam portion 241 is connected. For example, the vertical beam portion 242 and the horizontal beam portion 241 form a T-shaped structure.

[0064] Please continue reading. Figures 1 to 4 The test mechanism 21 also includes a transfer module 25 and a test base 26. The vertical beam 242 is installed on the test base 26, and the test base 26 is connected to the transfer module 25.

[0065] During testing, the transfer module 25 outputs a moving force, which in turn drives the vertical solderless RF coaxial connector 22 mounted on the test head 24 to move quickly and accurately to the test pattern 220 on the circuit board under test 200 via the test base 26. Then, pressing down allows the positioning pin 23 to be inserted into the mounting hole, completing the precise assembly of the vertical solderless RF coaxial connector 22 onto the circuit board under test 200.

[0066] Furthermore, in order to improve testing efficiency, loading holes 2411 are provided on both sides of the crossbeam portion 241 in the thickness direction of the vertical beam portion 242. Each loading hole 2411 is equipped with a vertical solderless RF coaxial connector 22, so that the performance test can be performed on two test patterns 220 on the circuit board under test 200 at the same time.

[0067] It should be noted that the center distance between the two mounting holes 2411 is determined by the corresponding component package layout on the circuit board under test 200, with a conventional design value of 500mil or 600mil.

[0068] In this application, the crossbeam 241 and the vertical beam 242 are an integral structure and are made of stainless steel, which has higher durability and structural stability.

[0069] Please continue reading. Figures 2 to 5Specifically, in one embodiment, the test base 26 includes a base plate 261 and a boss 262 connected to each other. The base plate 261 is connected to the transfer module 25, and the boss 262 has a receiving hole 2621. The vertical beam portion 242 is installed in the receiving hole 2621. The base plate 261 and the boss 262 are an integral structure, which can ensure the overall structural performance while reducing the number of parts and improving the manufacturability of the test base 26. The vertical beam portion 242 is installed into the receiving hole 2621 and fastened to the hole wall of the receiving hole 2621 to achieve assembly and fixation of the test head 24 and the test base 26.

[0070] Furthermore, the test base 26 also includes a connecting shaft 265, a boss 262 with an elongated slot, and a vertical beam portion 242 with a through hole. After the vertical beam portion 242 is inserted into the receiving hole 2621, the connecting shaft 265 can be inserted into the aligned through hole and elongated slot. This allows the test head 24 to float horizontally relative to the test base 26, ensuring that even with alignment deviations, the positioning pins 23 on the vertical solderless RF coaxial connector 22 can still adaptively and accurately insert into the mounting holes on the circuit board under test 200. In addition, the mechanical locking structure formed by the connecting shaft 265 inserted into the through hole and elongated slot better constrains the degree of freedom of the test head 24 relative to the test base 26, preventing the test head 24 from falling off the test base 26 during use.

[0071] In another embodiment, the test socket 26 further includes an elastic element 263 and a pressure sensor 264. Both the pressure sensor 264 and the elastic element 263 are installed within the receiving hole 2621. The elastic element 263 is positioned closer to the opening of the receiving hole 2621 than the pressure sensor 264. A portion of the vertical beam portion 242 is inserted into the receiving hole 2621 and abuts against one end of the elastic element 263, while the other end of the elastic element 263 abuts against the pressure sensor 264. The elastic element 263 provides the vertical elastic floating capability of the vertical solderless RF coaxial connector 22, thereby preventing rigid collisions that could damage the circuit board 200 under test and / or the vertical solderless RF coaxial connector 22 when it mates with the circuit board 200 under test. During the process of the transfer module 25 pressing the vertical solderless RF coaxial connector 22 toward the circuit board under test 200, the pressure sensor 264 can monitor the contact pressure in real time so as to control the pressing stroke by providing feedback signals. This ensures that the positioning pin 23 is accurately installed into the mounting hole and that the vertical solderless RF coaxial connector 22 and the circuit board under test 200 are assembled in place. However, it also avoids the problem of excessive compression that could cause deformation and damage to the circuit board under test 200, thus greatly improving the safety and reliability of the high-speed, high-frequency circuit board performance testing system 100.

[0072] For example, in this application, the elastic element 263 is a helical spring. Of course, in other optional embodiments, the elastic element 263 can also be a spring sheet, an elastic sleeve, an elastic column, etc., which can be flexibly selected according to actual needs.

[0073] Based on this, a support column 243 protrudes from the side of the vertical beam portion 242 away from the horizontal beam portion 241. An elastic element 263 is fitted onto the outside of the support column 243. When the elastic element 263 is compressed to a preset state, the support column 243 abuts against the pressure sensor 264. Fitting the elastic element 263 onto the outside of the support column 243 provides installation positioning for the elastic element 263. When the vertical solderless RF coaxial connector 22 is pressed down, causing the elastic element 263 to be compressed to the preset state, the support column 243 completes its travel across the gap between itself and the pressure sensor 264, thus directly abutting against the pressure sensor 264. This triggers the pressure sensor 264 to detect and provide feedback on pressure. Because the support column 243 can form a rigid trigger with the pressure sensor 264, it ensures that the pressure sensor 264 can more accurately sense the downward pressure value, facilitating downward pressure control by the system and improving the assembly accuracy and safety of the vertical solderless RF coaxial connector 22 and the circuit board under test 200.

[0074] Furthermore, based on any of the above embodiments, the transfer module 25 includes a three-axis motion platform and a robotic arm. The robotic arm is mounted on the three-axis motion platform, and the base plate 261 is connected to the robotic arm. A force feedback sensor is installed on the robotic arm. Specifically, the three-axis motion platform includes an X-axis movement module, a Y-axis movement module, and a Z-axis movement module. The three modules are assembled together and mounted on the test platform to provide individual or at least two-axis linkage degrees of freedom in the X, Y, and Z axes. This allows the robotic arm to drive the test base 26, test head 24, and vertical solderless RF coaxial connector 22 to move flexibly and quickly in space, and to accurately align the vertical solderless RF coaxial connector 22 with the test pattern 220 on the circuit board under test 200.

[0075] For example, the base plate 261 is vertically arranged and has a first hole. The robotic arm has a second hole corresponding to the first hole. Fasteners are inserted into the first and second holes to assemble and fix the base plate 261 and the robotic arm. The installation method is simple and the connection strength is high.

[0076] It should be noted that the circuit board under test 200 has multiple component packages of vertically arranged solderless RF coaxial connectors 22 in a regular structure, and these component packages are arranged to form different test patterns 220.

[0077] And / or, in another embodiment, the test carrier 10 is recessed to form a test groove for accommodating the circuit board 200 under test; the groove wall of the test groove is provided with a positioning post for fitting and installing with the positioning hole 210 on the circuit board 200 under test; wherein, when the test carrier 10 is made of metal, a non-conductive adhesive film is laid in the test groove for supporting the circuit board 200 under test.

[0078] By placing the circuit board under test (DUT) 200 into the test slot and using the slot wall to circumferentially limit the DUT 200, the stability of the DUT 200 on the test carrier 10 is improved. Furthermore, the positioning posts and positioning holes 210 are fitted together to further improve the installation accuracy and stability of the DUT 200, preventing the DUT 200 from shifting or becoming misaligned when the vertical solderless RF coaxial connector 22 touches it, thus reducing the alignment accuracy between the vertical solderless RF coaxial connector 22 and the test pattern 220 and leading to inaccurate test results.

[0079] Specifically, the test slot is a rectangular slot, and a positioning post is installed at each of the four apex corners or the middle of the four sides of the test slot; correspondingly, positioning holes 210 are also opened at the four corresponding parts of the rectangular circuit board under test 200, and the four positioning holes 210 are inserted into the four positioning posts one by one.

[0080] In practical use, in order to improve the durability of the test carrier 10, the test carrier 10 is made of metal. At this time, at least one layer of non-conductive adhesive film needs to be laid in the test tank before the circuit board to be tested 200 is placed in the test tank to avoid direct contact with the metal test carrier 10, which could cause short circuits and other problems and affect the accuracy of the test results.

[0081] Please continue reading. Figure 1 In addition, the high-speed, high-frequency circuit board performance testing system 100 of this application also includes a computer 30 and a network analyzer 40. The computer 30 is electrically connected to the network analyzer 40, which has an RF cable that is electrically connected to a vertical solderless RF coaxial connector 22. The computer 30 is electrically connected to a three-axis motion platform. The computer 30 is used to send commands to control the network analyzer 40 to perform tests and to acquire measured S-parameters for data analysis. The network analyzer 40 performs instrument calibration and S-parameter testing under the control of the computer 30.

[0082] S-parameters, or scattering parameters, are the core parameters in the fields of radio frequency, microwave, and high-speed signals. They are used to describe the signal reflection, transmission, and coupling characteristics of multi-port networks (connectors, traces, filters, antennas, chip ports, etc.).

[0083] It should be noted that for each type of circuit board under test 200 with signal integrity and signal quality, a matching test carrier 10 and test plan need to be developed. In order to reduce the complexity of motion control during the test, for the circuit board under test 200 with angular layout wiring, the angle correction is performed by designing the test carrier 10 to ensure that the component packages of the vertical solderless RF coaxial connector 22 on the test board are in a horizontally aligned state.

[0084] The test plan includes the combination of test point coordinates, the name for saving S-parameter test results, and the PASS / FAIL criteria for signal integrity and signal quality specifications.

[0085] Please continue reading. Figure 11 In addition to the above, this application also proposes a testing method for the high-speed, high-frequency circuit board performance testing system 100 as described in any of the above embodiments, comprising the following steps:

[0086] S10: Calibrate the test unit 21.

[0087] A level or spirit level is placed on the platform of the three-axis motion platform and the bottom of the test seat 26 on the robotic arm to test the flatness. When the flatness is found to be poor, the leveling operation is carried out by adjusting the structure to achieve sub-µm flatness adjustment.

[0088] Furthermore, VNA calibration is also included: in order to eliminate systematic errors and obtain the true S-parameters of the device under test (DUT) port, the network analyzer 40 is calibrated using a SOLT calibrator.

[0089] S20: The test carrier 10 is loaded into the test mechanism 21, and then the circuit board to be tested 200 is loaded into the test carrier 10.

[0090] This setup facilitates the alignment and testing of the circuit board under test 200 with the vertical solderless RF coaxial connector 22.

[0091] S30: Import test program.

[0092] The test program contains key information needed for automated testing, such as test point coordinates, test order, test data storage name, and test result judgment criteria.

[0093] S40: Test point alignment.

[0094] The positions of the test points are precisely adjusted using the test patterns 220 at the four corners of the circuit board under test 200, and all test points on the board are corrected according to the theoretical coordinates given in the PCB design data.

[0095] S50: Performs performance testing on the circuit board under test 200 and obtains scattering parameters.

[0096] The scattering parameters are the S-parameters mentioned above. The main control software performs the test according to the S-parameters in the test plan and saves the test results for subsequent data analysis.

[0097] S60: Perform data analysis and determination of scattering parameters.

[0098] Specifically, data analysis includes checking the causality and non-origin of S-parameters to determine if any anomalies exist, and performing post-processing of S-parameters such as de-embedding. Data judgment involves comparing the processed S-parameters with standards to determine whether the data passes or fails, supporting subsequent testing procedures.

[0099] In addition, some key technologies in the testing process need to be explained in detail below.

[0100] The first key technical point is test coordinate transformation.

[0101] By default, the mounting and positioning hole 210 in the lower right corner of the original design file of the circuit board under test 200 is used as the reference point to define a standard planar XY coordinate system. The coordinates of each test point can be represented in the form of (X, Y), where X and Y can be positive or negative values. The coordinate values ​​can be directly exported from the design software and presented in a list format. For cases where the circuit needs to be rotated at a certain angle and placed on the test carrier 10, the rotation angle theta needs to be entered. Theta can be positive or negative, and the default theta=0.

[0102] For differential signal testing, the test points consist of the coordinate positions of four vertical solderless RF coaxial connectors 22, corresponding to an independent network analyzer 40S parameter test, and the test results are exported as a standard S-parameter file for subsequent processing.

[0103] For differential signal testing, the initial test point coordinates exported by the design software are in the following format: [Position coordinates and rotation angles must include units; coordinate values ​​are in mm by default, but um, inch, and mil are also supported; angle values ​​are in degrees by default and rad are also supported]:

[0104] The reference point for the circuit board under test is 200, X0, Y0;

[0105] The rotation angle of the graphic, theta;

[0106] Test point combination 1, X1A, Y1A, X1B, Y1B, X1C, Y1C, X1D, Y1D;

[0107] Test point combination 2, X2A, Y2A, X2B, Y2B, X2C, Y2C, X2D, Y2D;

[0108] Test point combination 3, X3A, Y3A, X3B, Y3B, X3C, Y3C, X3D, Y3D;

[0109] ...

[0110] After the circuit board under test 200 is installed on the test carrier 10, the test position coordinates of the circuit board under test 200 after installation on the test carrier 10 are calculated according to the graphic rotation angle and the installation reference point of the test carrier 10.

[0111] After the test carrier 10 is installed on the test table of the three-axis motion platform, the final test position coordinates of the circuit board under test 200 are calculated based on the positioning reference point of the table, and the test point coordinates of the four corner positions (Xtopleft, Ytopleft), (Xtopright, Ytopright), (Xbottomleft, Ybottomleft), (Xbottomright, Ybottomright) are extracted for the coordinate position calibration of the first test.

[0112] The second key technical point is the leveling method for the test head 24.

[0113] A support column 243 is provided on the upper part of the vertical beam portion 242 of the test head 24, and the top end of the support column 243 is rounded. After the test head 24 is installed, the test head 24 forms a "point contact" with the pressure sensor 264 built into the test base 26 through the rounded top end position. During testing, the test head 24 is pressed down with the test base 26, and after contacting the surface of the circuit board 200 under test, the horizontal beam portion 241 of the test head 24 forms a "surface contact" with the board surface, realizing the self-leveling function of the test head 24.

[0114] The third key technology is floating alignment technology.

[0115] When the test head 24 is installed, its support column 243 is fitted into the elastic element 263, and the inner diameter of the elastic element 263 is 0.2mm larger than the diameter of the support column 243. When the test head 24 is accurately aligned, the positioning pin 23 can enter the positioning hole 210 without obstruction when the test head 24 is pressed down. If there is a positional deviation of 0.1mm or less in the alignment of the test head 24, the position can be corrected through the guide part 2321 of the positioning pin 23. If there is a positional deviation of more than 0.1mm in the alignment of the test head 24, exceeding the horizontal floating capability of the test head 24, the position is determined to be out of tolerance by the robotic arm and the pressing stroke of the test head 24, and the main control software prompts to re-correct the position of the test head 24.

[0116] The principle of floating alignment: The initial length of the elastic element 263 is greater than that of the support column 243 of the test head 24. When the positioning pin 23 contacts the plate surface, the top of the support column 243 has not yet contacted the mounting block. Therefore, the support column 243 can be finely adjusted in position inside the elastic element 263. As the robotic arm continues to press down, the output value of the pressure sensor 264 increases slowly. When the remaining compressed length of the elastic element 263 is greater than that of the support column 243, the support column 243 will directly contact the mounting block, the output value of the pressure sensor 264 will increase sharply, and the test head 24 will lose its floating alignment capability.

[0117] The fourth key technology is the circle center search algorithm.

[0118] To improve testing accuracy, a center-finding algorithm is introduced to correct the position of the test head 24. The algorithm works as follows: if there is a significant misalignment, the positioning pin 23 cannot be fully inserted into the positioning hole 210. The downward stroke will not reach the predetermined value, resulting in a sharp increase in pressure feedback, indicating that the position is misaligned and does not meet the test requirements. This is judged as a failure, and the current position coordinates are marked in red on the virtual coordinate graph. Then, the position is offset by a specific value along the X or Y direction, and the misalignment is reassessed and marked with a color [misalignment is judged as a failure and marked in red; otherwise, it is judged as a pass and marked in green]... until a circular pass test position traversal graph is obtained, and the center of the circle is calculated to obtain the precise test position.

[0119] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0120] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A high-speed, high-frequency circuit board performance testing system, characterized in that, include: Test carrier, the test carrier being used to mount a circuit board under test, the circuit board under test having mounting holes; and The testing device includes a testing mechanism, a vertical solderless RF coaxial connector, and a positioning pin. The vertical solderless RF coaxial connector is connected to the testing mechanism and can move under the drive of the testing mechanism. The positioning pin is mounted on the vertical solderless RF coaxial connector and is inserted into the mounting hole.

2. The high-speed, high-frequency circuit board performance testing system according to claim 1, characterized in that, The vertical solderless RF coaxial connector includes a flange, a coaxial part, and an intermediate connecting part, wherein the flange is connected to the coaxial part through the intermediate connecting part; The flange portion has a threaded hole, and the positioning pin includes a threaded section and a positioning section connected together. The threaded section is screwed into the threaded hole, and the positioning section protrudes to the outside of the flange portion and is inserted into the mounting hole.

3. The high-speed, high-frequency circuit board performance testing system according to claim 2, characterized in that, The outer peripheral wall of the positioning segment has an inlet portion, which is used to guide the positioning segment into the mounting hole.

4. The high-speed, high-frequency circuit board performance testing system according to claim 1, characterized in that, The testing mechanism includes a test head, which includes a crossbeam portion. The crossbeam portion has a loading hole, and the vertical solderless RF coaxial connector is inserted into the loading hole.

5. The high-speed, high-frequency circuit board performance testing system according to claim 4, characterized in that, The test head also includes a vertical beam portion, and the horizontal beam portion is connected to the vertical beam portion; The testing mechanism also includes a transfer module and a test base, the vertical beam is installed on the test base, and the test base is connected to the transfer module.

6. The high-speed, high-frequency circuit board performance testing system according to claim 5, characterized in that, The test stand includes a seat plate and a boss connected to each other. The seat plate is connected to the transfer module. The boss is provided with a receiving hole, and the vertical beam is installed in the receiving hole.

7. The high-speed, high-frequency circuit board performance testing system according to claim 6, characterized in that, The test seat also includes an elastic element and a pressure sensor. Both the pressure sensor and the elastic element are installed in the receiving hole. The elastic element is arranged closer to the opening of the receiving hole than the pressure sensor. A portion of the vertical beam is inserted into the receiving hole and abuts against one end of the elastic element, while the other end of the elastic element abuts against the pressure sensor. A support column is formed by protruding from the side of the vertical beam away from the horizontal beam. The elastic element is fitted onto the outside of the support column. When the elastic element is compressed to a preset state, the support column abuts against the pressure sensor.

8. The high-speed, high-frequency circuit board performance testing system according to claim 6, characterized in that, The transfer module includes a three-axis motion platform and a robotic arm. The robotic arm is mounted on the three-axis motion platform, the base plate is connected to the robotic arm, and a force feedback sensor is installed on the robotic arm. And / or, the test carrier is recessed to form a test groove, the test groove being used to accommodate the circuit board under test; the groove wall of the test groove is provided with a positioning post, the positioning post being used to be adapted and installed with the positioning hole on the circuit board under test; wherein, when the test carrier is made of metal, a non-conductive adhesive film is laid in the test groove, the non-conductive adhesive film being used to support the circuit board under test.

9. The high-speed, high-frequency circuit board performance testing system according to claim 8, characterized in that, The high-speed, high-frequency circuit board performance testing system also includes a computer and a network analyzer. The computer is electrically connected to the network analyzer. The network analyzer has an RF cable, which is electrically connected to the vertical solderless RF coaxial connector. The computer is electrically connected to the three-axis motion platform.

10. A method for testing the performance of high-speed, high-frequency circuit boards, applied to the high-speed, high-frequency circuit board performance testing system as described in any one of claims 1 to 9, characterized in that, The performance testing method for high-speed, high-frequency circuit boards includes the following steps: The testing facility was calibrated. The test carrier is loaded into the test mechanism, and then the circuit board to be tested is loaded into the test carrier; Import the test program; Test point alignment; The circuit board under test is subjected to performance testing to obtain scattering parameters; Data analysis and determination of scattering parameters are performed.

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