A radio frequency SiP test fixture

Abstract

The application discloses a radio frequency SiP test fixture, and belongs to the technical field of SiP testing. The test fixture comprises a shielding machine body, a PCB board, a first transmission body and a second transmission body. The shielding machine body is internally provided with a placement area for fixing a to-be-tested SiP. The PCB board is installed in the shielding machine body, and the PCB board is provided with radio frequency probes. The pins of the to-be-tested SiP are connected with the radio frequency probes. The first transmission body is connected with the bonding pads of the PCB board, and is used for receiving external digital control signals. The second transmission body is connected with the radio frequency probes, and is used for transmitting radio frequency signals. The first transmission body, the second transmission body and the PCB board constitute a structure for transmitting signals in a split mode. In the application, the first transmission body and the second transmission body of the fixture are respectively connected with the PCB board and the radio frequency probes, so that the control signal input and the radio frequency signal transmission of different paths are completed. The fixture does not need to consider the disadvantage that the loss is large when high-frequency transmission is performed in a traditional fixture. Meanwhile, the two kinds of signals are isolated from each other, the stability of the test of the fixture is improved, and the accuracy of the test result of the fixture is finally improved.

Description

Technical Field

[0001] This application relates to the field of SiP testing technology, specifically to a radio frequency SiP testing fixture. Background Technology

[0002] Phased array radar is a key piece of equipment in modern high-tech information warfare, and the transceiver (TR) module is the core component of phased array radar. System-in-Package (SiP) is a high-level packaging technology that realizes multifunctional microsystems through high-density heterogeneous integration. Its core lies in integrating multiple heterogeneous chips and interconnect structures into a single package, breaking through the functional limitations of traditional single-chip packaging. SiP-based TR modules are currently a research hotspot, and the performance of TR_SiP directly affects the performance of the entire radar system. Using fixtures, TR_SiP performance indicators can be accurately measured, facilitating circuit debugging during the R&D phase and final factory testing. In existing fixtures, radio frequency signals are easily affected by external electromagnetic radiation when propagating on the PCB board. When the radio frequency signal travels from the probe to the PCB board, the impedance matching is poor and the loss is high. At the same time, both the control signal and the radio frequency signal are transmitted through the PCB during testing, and interference is inevitable. These design defects result in poor fixture testing performance and inaccurate test results. Summary of the Invention

[0003] The purpose of this application is to provide an RF SiP test fixture to address the aforementioned deficiencies in the prior art.

[0004] To achieve the above objectives, this application employs the following technical solution: This application discloses an RF SiP test fixture, which includes... The shielding body has a placement area for fixing the SiP to be tested; A PCB board is installed inside the shielding housing. The PCB board is equipped with radio frequency probes, and the pins of the SiP under test are connected to the radio frequency probes. The first transmission element is connected to the pads of the PCB board and is used to receive external digital control signals. The second transmission element is connected to the radio frequency probe and is used to transmit radio frequency signals; The first and second transmission bodies are not connected to the same port, and the first transmission body, the second transmission body, and the PCB board constitute a separate signal transmission structure.

[0005] In a further embodiment of this application, the shielding body includes a cover plate, a carrier plate, and supporting components; A limiting frame is installed inside the support member, the cover plate is hinged to the support member, the carrier plate is fixedly connected to the support member, the cover plate can rotate around the hinge point and contact the support member to form a placement area for accommodating the SiP to be tested, and the support member, the cover plate and the support member constitute a closed structure for testing the SiP to be tested.

[0006] In a further embodiment, the cover plate is movably mounted with a locking component, and the support component is provided with a buckle. The locking component is movably assembled and connected to the buckle, thereby fixing the support component and the cover plate.

[0007] In a further embodiment, the limiting frame is provided with a limiting groove, the cover plate is provided with a limiting plate, and the cover plate is movably connected to the support member, so that the limiting groove is connected to the limiting plate, thereby forming the placement area of ​​the SiP to be tested.

[0008] In a further embodiment, the support member is provided with a flange in the circumferential direction, and the cover plate is provided with a receiving groove. The cover plate covers the support member, thereby realizing the assembly connection between the receiving groove and the flange.

[0009] In a further embodiment of this application, the first transmission body includes a first connector and a first cable, the first cable connecting the pads of the PCB board and the first connector, and the first connector being fixedly connected to the shielding body.

[0010] In a further embodiment of this application, the second transmission body includes a second connector and a second cable, the second cable connecting the radio frequency probe and the second connector, and the second connector being fixedly connected to the shielding body.

[0011] In a further embodiment of this application, the placement area for fixing the SiP to be tested is located in the middle of the shielding body.

[0012] In a further embodiment of this application, the ports of the first and second transmission bodies are symmetrically installed on the shielding body.

[0013] The beneficial effects of this application are as follows: The fixture in this application is equipped with a first transmission body and a second transmission body, which are respectively connected to the PCB board and the RF probe to complete the input of control signals and the transmission of RF signals through different paths. It does not need to consider the disadvantage of large loss during high-frequency transmission in traditional fixtures, and at the same time, it achieves mutual isolation between the two signals, improves the stability of fixture testing, and ultimately improves the accuracy of fixture test results. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the RF SiP test fixture in the embodiments of this application; Figure 2This is an exploded view of the RF SiP test fixture in the embodiments of this application; Figure 3 This is a schematic diagram of the cover plate in an embodiment of this application; Figure 4 This is a schematic diagram of the limiting frame in an embodiment of this application; Figure 5 This is a schematic diagram of the support structure in an embodiment of this application.

[0015] The components include: 1. Shielded body; 2. First connector; 3. Second connector; 4. Carrier board; 5. Limiting frame; 6. PCB board; 61. RF probe; 7. First cable; 8. Second cable; 11. Cover plate; 13. Support component; 100. SiP under test; 111. Limiting plate; 112. Locking component; 51. Limiting groove; 52. Through hole; 131. Buckle; 101. First transmission body; 102. Second transmission body. Detailed Implementation

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this application or its application or use. Example 1

[0017] like Figure 1 and Figure 2 As shown, this application discloses an RF SiP test fixture, which includes a shielded body 1, a PCB board 6, a first transmitter 101, and a second transmitter 102. The shielded body 1 has a placement area for fixing the SiP 100 under test. The PCB board 6 is installed inside the shielded body 1 and has an RF probe 61. The pins (BGA balls) of the SiP 100 under test are connected to the RF probe 61. The first transmitter 101 is connected to the pads of the PCB board 6 for receiving external digital control signals. The second transmitter 102 is connected to the RF probe 61 for transmitting RF signals. The first transmitter 101 and the second transmitter 102 are not connected to the same port. The first transmitter 101, the second transmitter 102, and the PCB board 6 constitute a separate signal transmission structure. The placement area for the SiP 100 under test used in this test is located in the middle of the shielded body 1.

[0018] During testing, this fixture transmits signals through two lines: the first transmission body 101 and the second transmission body 102. The first transmission body 101 connects to the pads on the PCB board 6 and to an external host computer to receive external digital control signals. The second transmission body 102 connects to the RF probe 61. The RF signals transmitted in the RF probe 61 pass directly through the PCB board 6 and connect to the second transmission body 102. The two lines avoid mutual interference and improve test accuracy.

[0019] As attached Figure 2 As shown, in this embodiment, the shielding body 1 is made of a metal material with shielding effect; the shielding body 1 includes a cover plate 11, a carrier plate 4, and a support member 13; the cover plate 11, the carrier plate 4, and the support member 13 form a placement area for the SiP100 to be tested, a limiting frame 5 is installed in the support member 13, the cover plate 11 is hinged to the support member 13, the carrier plate 4 is fixedly connected to the support member 13, the cover plate 11 can rotate around the hinge point and contact the support member 13 to form a placement area for accommodating the SiP100 to be tested, the support member 13, the cover plate 11, and the support member 13 constitute a closed structure for testing the SiP100 to be tested; wherein a locking assembly is provided between the cover plate 11 and the support member 13 for fixing the two.

[0020] As attached Figure 3 and Figure 5 As shown, in this embodiment, the locking assembly includes a locking member 112 movably mounted on the cover plate 11, and a buckle 131 provided on the support member 13. The locking member 112 is movably assembled and connected to the buckle 131, thereby fixing the support member 13 and the cover plate 11. Normally, the locking member 112 is slidably mounted on the side wall of the cover plate 11, and a pair of springs are longitudinally connected between the locking member 112 and the cover plate 11. A hook is provided on the side of the locking member 112 facing the cover plate 11. By pressing the locking member 112, the hook and the buckle 131 are engaged, forming a closed metal environment.

[0021] In other embodiments, a groove matching the shape of the buckle 131 is provided on the locking member 112, and the groove diameter gradually changes to provide greater friction between the groove and the buckle 131.

[0022] As attached Figure 3 and Figure 4As shown, in this embodiment, the limiting frame 5 is provided with a limiting groove 51. The size of the limiting groove 51 matches the SiP100 to be tested. The cover plate 11 is provided with a limiting plate 111. When the limiting plate 111 is set in position, when the cover plate 11 moves to contact the support member 13, the limiting plate 111 will cover the limiting groove 51. At this time, the limiting plate 111 and the limiting plate 111 form a placement space for the SiP100 to be tested, thereby forming a placement area for the SiP100 to be tested. The limiting plate 111 here not only has the function of forming a placement space, but also restricts the space of the SiP100 to be tested when the cover plate 11 is closed, preventing it from shaking and improving the test accuracy. The limiting groove 51 here has a through hole 52, which allows the RF probe 61 on the PCB board 6 to pass through and connect to the SiP100 to be tested. Example 2

[0023] This embodiment improves the support member 13 based on the above embodiment. In this embodiment, the support member 13 is provided with a flange in the circumferential direction, and the cover plate 11 is provided with a corresponding receiving groove. When the cover plate 11 covers and closes the support member 13, the receiving groove and the flange are assembled and connected, which improves the fit between the support member 13 and the cover plate 11, enhances the shielding effect of the fixture, and reduces external interference.

[0024] As attached Figure 2 As shown, in this embodiment, the first transmission body 101 includes a first connector 2 and a first cable 7. The first cable 7 connects the pads of the PCB board 6 and the first connector 2. The first connector 2 is fixedly connected to the support member 13. In actual manufacturing, the first connector 2 uses a J30J rectangular connector for use with an external host computer.

[0025] In this embodiment, the second transmission body 102 includes a second connector 3 and a second cable 8 (coaxial cable). The second cable 8 connects the RF probe 61 and the second connector 3. The second connector 3 is fixedly connected to the support member 13. Here, the second connector 3 is an RF connector used to connect external RF test instruments. The first connector 2 and the second connector 3 are symmetrically and circumferentially arranged and installed on the four side walls of the support member 13.

[0026] In the test, the second cable 8 was used to transmit the radio frequency signal. In the traditional solution, after the radio frequency signal passes through the probe, the electromagnetic field is sent into the transmission line through the pad on the PCB board 6. It is difficult to make the matching of this part of the conversion small, and the loss is large at high frequency. The technical path of the radio frequency signal going directly to the second cable 8 after passing through the radio frequency probe 61 in this application has better impedance matching than the traditional approach. Furthermore, the radio frequency (RF) signal is separated from the SiP control signal. In traditional solutions, both RF and control signals are transmitted through the PCB board and share a common reference ground, inevitably leading to crosstalk between the two types of electrical signals. In this application, the radio frequency signal is transmitted through the radio frequency probe 61 and the second cable 8, and the digital control signal is transmitted through the radio frequency probe 61, the pads of the PCB board 6 and the first connector 2, so as to achieve mutual isolation between the two signals and improve the stability of the fixture. This application designs a highly stable and low-loss integrated metal radio frequency SiP test fixture by changing the fixture structure, optimizing the signal propagation path and isolating the transmission of different electrical signals.

[0027] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

Claims

1. A radio frequency SiP test fixture, characterized in that, include The shielding body has a placement area for fixing the SiP to be tested; A PCB board is installed inside the shielding housing. The PCB board is equipped with radio frequency probes, and the pins of the SiP under test are connected to the radio frequency probes. The first transmission element is connected to the pads of the PCB board and is used to receive external digital control signals. The second transmission element is connected to the radio frequency probe and is used to transmit radio frequency signals; The first and second transmission bodies are not connected to the same port, and the first transmission body, the second transmission body, and the PCB board constitute a separate signal transmission structure.

2. The RF SiP test fixture according to claim 1, characterized in that, The shielding body includes a cover plate, a carrier plate, and supporting components; A limiting frame is installed inside the support member, the cover plate is hinged to the support member, the carrier plate is fixedly connected to the support member, the cover plate can rotate around the hinge point and contact the support member to form a placement area for accommodating the SiP to be tested, and the support member, the cover plate and the support member constitute a closed structure for testing the SiP to be tested.

3. The RF SiP test fixture according to claim 2, characterized in that, The cover plate is movably mounted with a locking component, and the support component is provided with a buckle. The locking component is movably assembled and connected to the buckle to fix the support component and the cover plate.

4. The RF SiP test fixture according to claim 2, characterized in that, The limiting frame is provided with a limiting groove, and the cover plate is provided with a limiting plate. The cover plate is movably connected to the support member, so that the limiting groove is connected to the limiting plate, thereby forming the placement area of ​​the SiP to be tested.

5. The RF SiP test fixture according to claim 2, characterized in that, The support member has a flange in the circumferential direction, and the cover plate has a receiving groove. The cover plate covers the support member to realize the assembly connection of the receiving groove and the flange.

6. The RF SiP test fixture according to claim 1, characterized in that, The first transmission body includes a first connector and a first cable. The first cable connects the pads of the PCB board to the first connector, and the first connector is fixedly connected to the shielding body.

7. The RF SiP test fixture according to claim 1, characterized in that, The second transmission element includes a second connector and a second cable, the second cable connecting the radio frequency probe and the second connector, and the second connector being fixedly connected to the shielding body.

8. The RF SiP test fixture according to claim 1, characterized in that, The placement area for fixing the SiP to be tested is located in the middle of the shielding body.

9. The RF SiP test fixture according to claim 1, characterized in that, The ports of the first and second transmission bodies are symmetrically installed on the shielded body.

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