lcos device

Abstract

A silicon-based liquid crystal device includes a substrate, a thermally conductive layer, an LCOS display panel, a printed circuit layer, and a resistive heating element. The thermally conductive layer is on the substrate and has a thermally conductive central region surrounded by a thermally conductive peripheral region. The LCOS display panel is on the thermally conductive central region. The printed circuit layer is on the thermally conductive peripheral region and at least partially surrounds the LCOS display panel. The resistive heating element is electrically connected with the printed circuit layer and thermally connected with the thermally conductive peripheral region. At least a portion of the resistive heating element is directly above or directly below the thermally conductive peripheral region.

Description

Technical Field

[0001] This invention relates to the field of silicon-based liquid crystal technology, and more specifically to a silicon-based liquid crystal device. Background Technology

[0002] Liquid crystal on silicon (LCOS) is a commonly used technology for generating projected images. In an LCOS display panel, the liquid crystals are controlled to influence the reflectivity of light incident on pixelated areas, causing the reflected light to form the desired image. For example, the use of LCOS devices in projection televisions is becoming increasingly popular. However, when the temperature is below a predetermined level (e.g., 70 degrees Celsius), the liquid crystals respond slowly to electrical changes, and the performance of the LCOS display panel (e.g., color reproduction) is not optimal.

[0003] One method of heating an LCOS panel is via a heating element integrated into the substrate of the LCOS panel itself. However, positioning the heating element within the silicon substrate of the LCOS panel limits the voltage and power that can be applied to the heating element. For example, using high voltage / current and / or high heat dissipation within the silicon substrate of the LCOS panel can lead to electrical interference with display operation and / or thermal damage to the silicon substrate. Therefore, temperature control achieved through this design is poor. Summary of the Invention

[0004] The embodiments disclosed herein provide heat to the LCOS panel while avoiding the problems of the existing methods described above.

[0005] In a first aspect, a silicon-based liquid crystal device is provided. The silicon-based liquid crystal device includes a substrate, a thermally conductive layer, an LCOS display panel, a printed circuit layer, and a resistive heating element. The thermally conductive layer is located on the substrate and has a thermally conductive central region surrounded by a thermally conductive peripheral region. The LCOS display panel is located on the thermally conductive central region. The printed circuit layer is located on the thermally conductive peripheral region and at least partially surrounds the LCOS display panel. The resistive heating element is electrically connected to the printed circuit layer and thermally connected to the thermally conductive peripheral region. At least a portion of the resistive heating element is located directly above or directly below the thermally conductive peripheral region.

[0006] In some embodiments, the thermally conductive layer is located on the top surface of the substrate; in a cross section perpendicular to the top surface and intersecting the resistive heating element and the thermally conductive layer, the resistive heating element and the thermally conductive layer are located on opposite sides of the printed circuit layer.

[0007] In some embodiments, the thermally conductive layer is located on the top surface of the substrate; in a cross section perpendicular to the top surface and intersecting the resistive heating element and the thermally conductive layer, the resistive heating element and the thermally conductive layer are located on the same side of the printed circuit layer.

[0008] In some embodiments, the resistive heating element is closest to a first portion of the thermally conductive peripheral region, which is adjacent to a first side surface of the LCOS display panel, and the silicon-based liquid crystal device further includes: an additional resistive heating element (i) electrically connected to a printed circuit layer, (ii) thermally connected to the thermally conductive peripheral region, and (iii) a second portion closest to the thermally conductive peripheral region, which is adjacent to a second side surface of the LCOS display panel, the second side surface being different from the first side surface.

[0009] In some embodiments, the silicon-based liquid crystal device further includes: an additional resistive heating element (i) electrically connected to a printed circuit layer, (ii) thermally connected to a thermally conductive peripheral region, and (iii) adjacent to the resistive heating element; each of the resistive heating element and the additional resistive heating element is closest to a first portion of the thermally conductive peripheral region, the first portion being adjacent to a first side surface of the LCOS display panel.

[0010] In some embodiments, the resistive heating element is closest to a first portion of the thermally conductive peripheral region, which is adjacent to a first side surface of the LCOS display panel, and the first side surface is opposite to a second side surface of the LCOS display panel; the printed circuit layer includes a plurality of addressing electrodes arranged in a first array direction not parallel to the first side surface and the second side surface; the LCOS display panel includes a plurality of bonding pads arranged along a second array direction not parallel to the first side surface and the second side surface.

[0011] In some embodiments, the surface of the resistive heating element is mounted to the printed circuit layer.

[0012] In some embodiments, the printed circuit layer and the thermally conductive layer are located between the resistive heating element and the substrate.

[0013] In some embodiments, the resistance heating element and the LCOS panel are located on the same side of the substrate.

[0014] In some embodiments, the substrate includes a hole, and the printed circuit layer has a printed circuit layer-surface region exposed through the hole; at least a portion of the resistive heating element is located within the hole and is electrically connected to the printed circuit layer at the printed circuit layer-surface region.

[0015] In some embodiments, the silicon-based liquid crystal device further includes a thermally conductive material in the hole that thermally couples a resistive heating element to the thermally conductive layer.

[0016] In some embodiments, a thermally conductive layer is located on a top substrate-surface of a substrate, the top substrate-surface including blind vias at least partially covered by a printed circuit layer-surface region of a printed circuit layer; at least a portion of a resistive heating element is located within the blind vias and is electrically connected to the printed circuit layer at the printed circuit layer-surface region.

[0017] In some embodiments, the silicon-based liquid crystal device further includes a thermally conductive material in a blind hole that thermally couples a resistive heating element to the thermally conductive layer.

[0018] In some embodiments, the material composition of the thermally conductive layer includes graphene.

[0019] In some embodiments, the thermally conductive layer has a thermal conductivity exceeding 1 W / mK.

[0020] In some embodiments, the thickness of the thermally conductive layer is between ten micrometers and one hundred micrometers.

[0021] In some embodiments, the thermally conductive layer is one of thermal paste, thermal adhesive, thermally conductive pads, phase change materials, and metal thermal interface materials.

[0022] In some embodiments, the material composition of the substrate includes one or more of aluminum nitride, aluminum oxide, stainless steel, aluminum, copper, or any combination thereof.

[0023] In some embodiments, the printed circuit layer is a flexible printed circuit layer.

[0024] In some embodiments, the resistance heating element is a positive temperature coefficient thermistor. Attached Figure Description

[0025] Figure 1 This is a system diagram of the LCOS device in the embodiment.

[0026] Figure 2 This is an isometric view of a first LCOS device, which is... Figure 1 An example of an LCOS device.

[0027] Figure 3A for Figure 2 An isometric view of a portion of an LCOS device.

[0028] Figure 3B for Figure 3A A cross-sectional view of a portion of an LCOS device.

[0029] Figure 4 for Figure 3A An isometric view of a portion of an LCOS device.

[0030] Figure 5A , Figure 5B , Figure 5C , Figure 6 and Figure 7 This is a schematic diagram of a second LCOS device, which is... Figure 1 An example of an LCOS device.

[0031] Figure 8A , Figure 8B , Figure 8C , Figure 9 and Figure 10 This is a schematic diagram of a third LCOS device, which is... Figure 1 An example of an LCOS device. Detailed Implementation

[0032] Figure 1 This is a system diagram of an LCOS device 100, which includes a substrate 110, a thermally conductive layer 120, an LCOS display panel 130, a printed circuit layer 140, and a heating element 150. The thermally conductive layer 120 is located on the substrate 110 and has a thermally conductive central region 122 surrounded by a thermally conductive peripheral region 124. The LCOS display panel 130 is located on the thermally conductive central region 122. The printed circuit layer 140 is located on the thermally conductive peripheral region 124 and at least partially surrounds the LCOS display panel 130.

[0033] The substrate 110 may be made of aluminum nitride, aluminum oxide, stainless steel, aluminum, copper, or any combination thereof. The thermally conductive layer 120 may have a thermal conductivity exceeding 1 W / mK and may contain a material composition including graphene. The thermally conductive layer 120 may be one of thermal paste, thermal adhesive, thermally conductive pads, phase change materials, and metal thermal interface materials. The printed circuit layer 140 may be a flexible printed circuit layer. The heating element 150 may be a resistance heating element, such as a positive temperature coefficient thermistor.

[0034] The heating element 150 is electrically connected to the printed circuit layer 140 and thermally connected to the thermally conductive peripheral region 124. At least a portion of the heating element 150 is located directly above or below the thermally conductive peripheral region 124. The heating element 150 can be surface-mounted to the printed circuit layer 140.

[0035] Figure 2 This is a schematic diagram of an LCOS device 200, which is an embodiment of the LCOS device 100. Figure 3A , Figure 3B and Figure 4 This is a schematic diagram of selected components of the LCOS device 200. It is best to view them together in the following description. Figures 2 to 4The figures in this document depict orthogonal axes A1, A2, and A3. Unless otherwise specified, the height and depth of an object in this document refer to the extent of the object along axis A3. Furthermore, in this document, the horizontal plane is parallel to the A1-A2 plane, the width refers to the extent of the object along axis A1 or axis A2, and the vertical direction is along axis A3.

[0036] LCOS device 200 includes a substrate 210, a thermally conductive layer 220, an LCOS display panel 230, a printed circuit layer 240, and heating elements 250, which are examples of the substrate 110, thermally conductive layer 120, LCOS display panel 130, printed circuit layer 140, and heating elements 150 of LCOS device 100, respectively. LCOS device 200 may include multiple heating elements 250, such as... Figures 2 to 4 As shown. Although Figures 2 to 4 Eight heating elements 250 are shown, but the LCOS device 200 may include a different number of heating elements 250 without departing from its scope.

[0037] The substrate 210 has a top surface 219, which can be parallel to the A1-A2 plane. A thermally conductive layer 220 is located on the top surface 219 and has a central region 222 surrounded on all four sides by peripheral regions 224, such as... Figure 4 As shown in the diagram. The peripheral region 224 includes segments 225(1) and 225(2). The thermally conductive layer 220 has a thickness 228 along axis A3. The thickness 228 can be between ten micrometers and one hundred micrometers.

[0038] Regions 222 and 224 are examples of regions 122 and 124, respectively. In the LCOS device 200, the LCOS display panel 230 and the heating element 250 are located on the same side of the substrate 210, that is, the side close to the top surface 219.

[0039] Figure 3A An isometric view of a portion of an LCOS device 200, including an illustration 301 showing a region of the LCOS device 200 that includes a heating element 250 located on a printed circuit layer 240. The heating element 250 can be surface-mounted to the printed circuit layer 240.

[0040] Figure 3B A cross-sectional view of a portion of the LCOS device 200 shown in Illustration 301. Figure 3B The cross-section is perpendicular to the top surface 219 and parallel to the A1-A3 plane. At least a portion of the heating element 250 may be located above one or more holes 242 in the printed circuit layer 240. Figure 3A and Figure 3BIn the example, the heating element 250 is located above the two holes 242 and on the bridging region 244 of the printed circuit layer 240, as shown. Figure 3B As shown. In Figure 3B In this configuration, (i) the heating element 250 is completely located above the thermally conductive peripheral region 224, and (ii) both the thermally conductive peripheral region 224 and the bridging region 244 are located between the heating element 250 and the substrate 210. Additionally, in Figure 3B In the printed circuit layer 240, the heating element 250 and the heat-conducting layer 220 are located on opposite sides of the printed circuit layer 240.

[0041] The LCOS device 200 may include a thermally conductive fill 270 in a hole 242, which thermally conductive fill 270 thermally couples the heating element 250 to the thermally conductive peripheral region 224. Figure 3B In the illustration, a portion of the thermally conductive filler 270 is cut away to show the hole 242. Examples of the thermally conductive filler 270 include thermal paste and thermal adhesive.

[0042] Figure 4 for Figure 3A An isometric view of a portion of the LCOS device. The LCOS display panel 230 has a side surface 231 parallel to the A1-A3 plane, as shown... Figure 2 As shown in the image. Figure 4 The section 225(1) represents the thermally conductive peripheral region 224, which is adjacent to the side surface 231. In an embodiment, the LCOS device 200 includes a plurality of resistive heating elements 250. One or more heating elements 250 (such as those made by...) Figure 4 The heating element 250 (1) and heating element 250 (3) shown in the illustration are closest to segment 225 (1). One or more additional heating elements 250 may be closest to segment 225 (2) of the thermally conductive peripheral region 224, which is adjacent to the second side surface of the LCOS display panel 230, which is different from the side surface 231. For example, the LCOS device 200 may include one or both of the heating elements 250 (2) and heating elements 250 (4).

[0043] The LCOS device 200 may also include a plurality of wires 260, each of which electrically connects a corresponding bonding pad 232 of the LCOS display panel 230 to a corresponding address electrode of the printed circuit layer 240. One or more of the bonding pads 232 and the wires 260 may be arranged in a direction not parallel to the surface 231. For example, the wires 260 may be arranged in a direction parallel to axis A2, and the surface 231 may be parallel to the A1-A3 plane. For clarity, not all wires 260 and bonding pads 232 are parallel to the surface 231. Figure 2 Marked in the middle.

[0044] Figure 5A This is an isometric view of an LCOS device 500, which is an embodiment of the LCOS device 100. Figure 5B The plan view of the LCOS device 500 with sections 5a-5a' and 5b-5b' is shown, with each of sections 5a-5a' and 5b-5b' being parallel to the plane A1-A3. Figure 5C A cross-sectional view of a portion of an LCOS device 500 in one of sections 5a-5a' and 5b-5b'. Figure 6 and Figure 7 This is a schematic diagram of selected components of the LCOS device 500. It is best to view it together with the following description. Figure 5A , Figure 5B , Figure 5C , Figure 6 and Figure 7 .

[0045] The LCOS device 500 includes a substrate 510, a thermally conductive layer 520, a printed circuit layer 540, and at least one heating element 550, which are examples of the substrate 110, thermally conductive layer 120, printed circuit layer 140, and heating element 150 of the LCOS device 100, respectively. The LCOS device 500 also includes an LCOS display panel 230. Figure 5C The cross-sectional view includes a portion of the LCOS device 500, which includes the heating element 550.

[0046] Figure 5A Heating element 550 is not shown because... Figure 5A In the example, the heating element 550 is covered by a printed circuit layer 540. Without deviating from its scope, the circuit layer 540 may include holes that expose a portion of the heating element 550. Because Figure 5B It is a plan view, therefore the heating element 550 is in Figure 5B The heating element 550 is not visible in the center. However, for illustrative purposes, the location of the heating element 550 is shown with a dashed box. For clarity, not all heating elements 550 are shown in the center. Figure 5BMarked in the middle. Although Figure 5B Eight heating elements 550 are shown, but the LCOS device 500 may include a different number of heating elements 550 without deviating from its scope.

[0047] The thermally conductive layer 520 has a central region 522 surrounded by an outer region 524, such as Figure 7 As shown. Regions 522 and 524 are examples of regions 122 and 124, respectively. The peripheral region 524 includes segments 525(1) and 525(2), which are similar to segments 225(1) and 225(2) of the peripheral region 224. The thermally conductive layer 520 has a thickness 228 along axis A3. One or more of sections 5a-5a' and 5b-5b' intersect with the heating element 550, as shown. Figure 5C As shown in the image.

[0048] The substrate 510 has a top surface 519, a bottom surface 511 opposite to the top surface 519, and includes one or more holes 512, such as... Figure 5C As shown in the diagram. Each hole 512 extends between a top surface 519 and a bottom surface 511. At least one of surfaces 511 and 519 is parallel to the A1-A2 plane. The top surface 519 is an example of top surface 219. Figure 6 A portion of the heating element 550 extending above the plane of the top surface 519 is shown.

[0049] Each hole 512 exposes a corresponding surface region 542 of the printed circuit layer 540. At least a portion of each heating element 550 is located within the corresponding hole 512 and is electrically connected to the printed circuit layer 540 at the printed circuit layer surface region 542 exposed by the corresponding hole 512. The LCOS device 500 may include a thermally conductive filler 270 in at least one of the holes 512, which thermally conductive filler 270 thermally couples the heating element 550 to the thermally conductive layer 520. A portion of the heating element 550 may be coplanar with the thermally conductive peripheral region 524, such as... Figure 5C As shown in the diagram. Without departing from its scope, at least a portion of the heating element 550 may be located entirely below the plane of the thermally conductive peripheral region 524. In an embodiment, the heating element 550 and the thermally conductive layer 520 (region 524) are located on the same side of the printed circuit layer 540, as shown in the diagram. Figure 5C As shown in the image.

[0050] Figure 8A This is a schematic diagram of an LCOS device 800, which is an embodiment of the LCOS device 100. Figure 8BThe plan view of the LCOS device 800 with sections 8a-8a' and 8b-8b' is shown, with each of sections 8a-8a' and 8b-8b' being parallel to the plane A1-A3. Figure 8C A cross-sectional view of a portion of an LCOS device 800 in one of sections 8a-8a' and 8b-8b'. Figure 9 and 10 This is a schematic diagram of selected components of the LCOS device 800. It is best to view it together with the following description. Figure 8A , Figure 8B , Figure 8C , Figure 9 and Figure 10 .

[0051] The LCOS device 800 includes a substrate 810, a thermally conductive layer 820, and at least one heating element 850, which are examples of the substrate 110, thermally conductive layer 120, and heating element 150 of the LCOS device 100, respectively. The LCOS device 800 also includes a printed circuit layer 540 and an LCOS display panel 230. Figure 8C The cross-sectional view includes a portion of the LCOS device 800, which includes the heating element 850.

[0052] Figure 8A Heating element 850 is not shown because... Figure 8A In the example, the heating element 850 is covered by a printed circuit layer 540. Without deviating from its scope, the circuit layer 540 may include holes exposing a portion of the heating element 850. Because Figure 8B It is a plan view, therefore the heating element 850 is in Figure 8B The heating element 850 is not visible in the center. However, for illustrative purposes, the location of the heating element 850 is shown with a dashed box. For clarity, not all heating elements 850 are shown in the center. Figure 8B Marked in the middle. Although Figure 8B Eight heating elements 850 are indicated, but the LCOS device 800 may include a different number of heating elements 850 without departing from its scope.

[0053] The substrate 810 has a top surface 819, a bottom surface 811 opposite to the top surface 819, and includes one or more blind holes 812, such as Figure 8C As shown in the diagram, at least one of surfaces 811 and 819 is parallel to the A1-A2 plane. Top surface 819 is an example of top surface 519. In this embodiment, the heating element 850 and the thermally conductive layer 520 (region 524) are located on the same side of the printed circuit layer 540, as shown in the diagram. Figure 8C As shown in the image.

[0054] A thermally conductive layer 520 is located on the top surface 819. A blind via 812 is at least partially covered by the printed circuit layer-surface region 542 of the printed circuit layer 540. At least a portion of the heating element 850 is located within the blind via 812 and is electrically connected to the printed circuit layer 540 at the printed circuit layer-surface region 542. The top surface 819 includes a recess region 818, such as... Figure 8C As shown, the recessed region 818 defines a blind via 812. The LCOS device 800 may include a thermally conductive filler 270 in each blind via 812, which thermally couples the heating element 850 to the thermally conductive layer 520. Figure 8C In the middle, a portion of the thermally conductive filler 270 is cut off to indicate Figure 8C Blind hole 812 in the middle.

[0055] Feature combination

[0056] The features described above and those in the following claims can be combined in various ways without departing from their scope. The examples listed below illustrate some possible, non-limiting combinations.

[0057] Example 1. A silicon-based liquid crystal device, comprising: a substrate; a thermally conductive layer located on the substrate and having a thermally conductive central region surrounded by a thermally conductive peripheral region; an LCOS display panel located on the thermally conductive central region; a printed circuit layer located on the thermally conductive peripheral region and at least partially surrounding the LCOS display panel; and a resistive heating element electrically connected to the printed circuit layer and thermally connected to the thermally conductive peripheral region, wherein at least a portion of the resistive heating element is located directly above or directly below the thermally conductive peripheral region.

[0058] Example 2. According to the device of Example 1, the thermally conductive layer is located on the top surface of the substrate; in a cross section perpendicular to the top surface and intersecting the resistive heating element and the thermally conductive layer, the resistive heating element and the thermally conductive layer are located on opposite sides of the printed circuit layer.

[0059] Example 3. In the device according to either Example 1 or 2, the thermally conductive layer is located on the top surface of the substrate; in a cross section perpendicular to the top surface and intersecting the resistive heating element and the thermally conductive layer, the resistive heating element and the thermally conductive layer are located on the same side of the printed circuit layer.

[0060] Example 4. A device according to any one of Examples 1 to 3, wherein the resistive heating element is closest to a first portion of the thermally conductive peripheral region, the first portion being adjacent to a first side surface of the LCOS display panel, and the device further includes: an additional resistive heating element (i) electrically connected to a printed circuit layer, (ii) thermally connected to the thermally conductive peripheral region, and (iii) a second portion closest to the thermally conductive peripheral region, the second portion being adjacent to a second side surface of the LCOS display panel, the second side surface being different from the first side surface.

[0061] Example 5. The device according to any one of Examples 1 to 4 further includes: an additional resistive heating element, which is (i) electrically connected to the printed circuit layer, (ii) thermally connected to the thermally conductive peripheral region, and (iii) adjacent to the resistive heating element; each of the resistive heating element and the additional resistive heating element is closest to a first portion of the thermally conductive peripheral region, which is adjacent to a first side surface of the LCOS display panel.

[0062] Example 6. In the device according to any one of Examples 1 to 5, the resistive heating element is closest to a first portion of the thermally conductive peripheral region, the first portion being adjacent to a first side surface of the LCOS display panel, the first side surface being opposite to a second side surface of the LCOS display panel; the printed circuit layer includes a plurality of addressing electrodes arranged in a first array direction not parallel to the first side surface and the second side surface; the LCOS display panel includes a plurality of bonding pads arranged along a second array direction not parallel to the first side surface and the second side surface.

[0063] Example 7. The device according to any one of Examples 1 to 6, wherein the resistive heating element is surface-mounted to the printed circuit layer.

[0064] Example 8. In the device according to any one of Examples 1 to 7, the printed circuit layer and the thermally conductive layer are located between the resistive heating element and the substrate.

[0065] Example 9. According to the device of Example 8, the resistance heating element and the LCOS panel are located on the same side of the substrate.

[0066] Example 10. A device according to any one of Examples 1 to 9, wherein the substrate includes a hole, the printed circuit layer has a printed circuit layer-surface region exposed through the hole, and at least a portion of the resistive heating element is located within the hole and is electrically connected to the printed circuit layer at the printed circuit layer-surface region.

[0067] Example 11. The device according to Example 10 further includes a thermally conductive material in the hole, which thermally couples the resistance heating element to the thermally conductive layer.

[0068] Example 12. A device according to any one of Examples 1 to 11, wherein a thermally conductive layer is located on a top substrate-surface of a substrate, the top substrate-surface including blind vias at least partially covered by a printed circuit layer-surface region of a printed circuit layer; at least a portion of a resistive heating element is located within the blind vias and is electrically connected to the printed circuit layer at the printed circuit layer-surface region.

[0069] Example 13. The device according to Example 12 further includes a thermally conductive material in a blind hole, which thermally couples the resistance heating element to the thermally conductive layer.

[0070] Example 14. In the device according to any one of Examples 1 to 13, the material composition of the thermal conductive layer includes graphene.

[0071] Example 15. The device according to any one of Examples 1 to 14 has a thermal conductivity of more than 1 W / mK.

[0072] Example 16. In the device according to any one of Examples 1 to 15, the thickness of the thermally conductive layer is between ten micrometers and one hundred micrometers.

[0073] Example 17. In the device according to any one of Examples 1 to 16, the thermally conductive layer is one of thermal paste, thermal adhesive, thermally conductive pad, phase change material and metal thermal interface material.

[0074] Example 18. The device according to any one of Examples 1 to 17, wherein the material composition of the substrate includes one or more of aluminum nitride, aluminum oxide, stainless steel, aluminum, copper, or any combination thereof.

[0075] Example 19. The device according to any one of Examples 1 to 18 has a printed circuit layer that is a flexible printed circuit layer.

[0076] Example 20. In the device according to any one of Examples 1 to 19, the resistance heating element is a positive temperature coefficient thermistor.

[0077] Modifications to the above methods and systems can be made without departing from the scope of the embodiments of the present invention. Therefore, it should be noted that the content contained in the above specification or shown in the accompanying drawings should be understood as illustrative rather than restrictive. In this document, unless otherwise stated, the phrase "in some embodiments" is equivalent to the phrase "in some embodiments" and does not refer to all embodiments.

[0078] As used in this specification, any of its appendices, and the appended claims, the singular forms “a,” “an,” and “the” include plural indicators unless the context clearly specifies otherwise. It should also be noted that the term “or” is generally used in its non-exclusive meaning, such as including “and / or,” unless the context clearly specifies otherwise. With respect to instances of the terms “and / or” and “at least one of…”, for example, in the cases of “A and / or B,” “at least one of A and B,” and “at least one of A or B,” such wording covers (i) only A, or (ii) only B, or (iii) a choice of both A and B. In the cases of “A, B and / or C”, “at least one of A, B and C”, and “at least one of A, B or C”, such wording covers (i) only A, or (ii) only B, or (iii) only C, or (iv) only A and B, or (v) only A and C, or (vi) only B and C, or (vii) each of A, B and C. This can be extended to as many items as are listed.

[0079] The following claims are intended to cover all the general and specific features described herein, as well as all statements that, in terms of language, fall somewhere in between, within the scope of the inventive methods and systems.

Claims

1. A silicon-based liquid crystal device, comprising: substrate; A thermally conductive layer is located on the substrate and has a thermally conductive central region surrounded by a thermally conductive peripheral region; An LCOS display panel, wherein the LCOS display panel is located on the heat-conducting center region; A printed circuit layer, the printed circuit layer being located on the thermally conductive peripheral area and at least partially surrounding the LCOS display panel; and A resistive heating element is electrically connected to the printed circuit layer and thermally connected to the thermally conductive peripheral region, and at least a portion of the resistive heating element is located directly above or directly below the thermally conductive peripheral region.

2. The silicon-based liquid crystal device according to claim 1, wherein, The thermally conductive layer is located on the top surface of the substrate; In a cross section perpendicular to the top surface and intersecting the resistive heating element and the thermally conductive layer, the resistive heating element and the thermally conductive layer are located on opposite sides of the printed circuit layer.

3. The silicon-based liquid crystal device according to claim 1, wherein, The thermally conductive layer is located on the top surface of the substrate; In a cross-section perpendicular to the top surface and intersecting the resistive heating element and the thermally conductive layer, the resistive heating element and the thermally conductive layer are located on the same side of the printed circuit layer.

4. The silicon-based liquid crystal device of claim 1, wherein the resistive heating element is closest to the first portion of the thermally conductive peripheral region, the first portion being adjacent to the first side surface of the LCOS display panel, and the silicon-based liquid crystal device further comprises: An additional resistive heating element, wherein (i) is electrically connected to the printed circuit layer, (ii) is thermally connected to the thermally conductive peripheral region, and (iii) is a second portion closest to the thermally conductive peripheral region, the second portion being adjacent to a second side surface of the LCOS display panel, the second side surface being different from the first side surface.

5. The silicon-based liquid crystal device according to claim 1, further comprising: An additional resistive heating element is provided, wherein (i) the additional resistive heating element is electrically connected to the printed circuit layer, (ii) the additional resistive heating element is thermally connected to the thermally conductive peripheral region, and (iii) the additional resistive heating element is adjacent to the resistive heating element. Each of the resistive heating element and the additional resistive heating element is closest to a first portion of the heat-conducting peripheral region, which is adjacent to a first side surface of the LCOS display panel.

6. The silicon-based liquid crystal device according to claim 1, wherein the resistive heating element is closest to the first portion of the thermally conductive peripheral region, and the first portion is adjacent to the first side surface of the LCOS display panel. The first side surface is opposite to the second side surface of the LCOS display panel; The printed circuit layer includes a plurality of addressing electrodes arranged in a first array direction that is not parallel to the first side surface and the second side surface; The LCOS display panel includes a plurality of bonding pads arranged along a second array direction that is not parallel to the first side surface and the second side surface.

7. The silicon-based liquid crystal device according to claim 1, wherein the surface of the resistive heating element is mounted to the printed circuit layer.

8. The silicon-based liquid crystal device according to claim 1, wherein the printed circuit layer and the thermally conductive layer are located between the resistive heating element and the substrate.

9. The silicon-based liquid crystal device according to claim 8, wherein the resistive heating element and the LCOS panel are located on the same side of the substrate.

10. The silicon-based liquid crystal device according to claim 1, wherein, The substrate includes holes, and the printed circuit layer has a printed circuit layer surface region exposed through the holes; At least a portion of the resistive heating element is located within the hole and is electrically connected to the printed circuit layer at the printed circuit layer surface region.

11. The silicon-based liquid crystal device according to claim 10, further comprising a thermally conductive material in the hole, the thermally conductive material thermally coupling the resistive heating element to the thermally conductive layer.

12. The silicon-based liquid crystal device according to claim 1, wherein, The thermally conductive layer is located on the top substrate surface of the substrate. The top substrate-surface includes blind vias that are at least partially covered by the printed circuit layer-surface region of the printed circuit layer; At least a portion of the resistive heating element is located within the blind via and is electrically connected to the printed circuit layer at the printed circuit layer surface region.

13. The silicon-based liquid crystal device according to claim 12, further comprising a thermally conductive material in the blind hole, the thermally conductive material thermally coupling the resistive heating element to the thermally conductive layer.

14. The silicon-based liquid crystal device according to claim 1, wherein the material composition of the thermally conductive layer includes graphene.

15. The silicon-based liquid crystal device according to claim 1, wherein the thermally conductive layer has a thermal conductivity exceeding 1 W / mK.

16. The silicon-based liquid crystal device according to claim 1, wherein the thickness of the thermally conductive layer is between ten micrometers and one hundred micrometers.

17. The silicon-based liquid crystal device according to claim 1, wherein the thermally conductive layer is one of thermal paste, thermal adhesive, thermally conductive pad, phase change material, and metal thermal interface material.

18. The silicon-based liquid crystal device according to claim 1, wherein the material composition of the substrate includes one or more of aluminum nitride, aluminum oxide, stainless steel, aluminum, copper, or any combination thereof.

19. The silicon-based liquid crystal device according to claim 1, wherein the printed circuit layer is a flexible printed circuit layer.

20. The silicon-based liquid crystal device according to claim 1, wherein the resistive heating element is a positive temperature coefficient thermistor.

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