Positioning device, exposure device, air sensor, and article manufacturing method

Abstract

The present disclosure provides a positioning device, an exposure device, an air sensor, and an article manufacturing method. A positioning device that positions a substrate includes a substrate table mechanism configured to drive the substrate, a measuring apparatus configured to measure a height of the substrate, an air sensor configured to measure the height of the substrate based on a pressure in a pipe while discharging air through the pipe, and a controller configured to control the substrate table mechanism. A measurement range, as a range of heights that the air sensor can measure, is narrower than a range of heights that the measuring apparatus can measure. The controller controls the substrate table mechanism based on an output from the measuring apparatus to cause the height at a measurement position on the substrate to fall within the measurement range.

Description

Technical Field

[0001] This disclosure relates to positioning devices, exposure devices, air sensors, and methods for manufacturing articles. Background Technology

[0002] Japanese Patent Application Publication No. 2010-109378 discloses a photolithography projection apparatus, which includes a first sensor as a process-independent sensor such as an air micrometer and a second sensor as a process-dependent sensor. The measurement values ​​obtained by the second sensor have a process offset error (PDOE) that may depend on the process. The photolithography projection apparatus can perform photolithography at multiple locations on the substrate by scanning a substrate directly below the first and second sensors. Using the measurement values ​​obtained by the first and second sensors, a mapping of the PDOE of the second sensor at each location on the substrate where measurements have been performed is prepared.

[0003] An air sensor is a sensor that measures the height or position of a target based on the pressure within a conduit while air is being expelled through it. Measurement accuracy and sensitivity decrease as the distance between the conduit outlet and the target (i.e., the working distance) increases, and increase as the working distance decreases. Therefore, to achieve high measurement accuracy, the working distance needs to be reduced. However, reducing the working distance may cause the air sensor to collide with the target. Summary of the Invention

[0004] This disclosure provides a technique that helps prevent collisions between an air sensor and a substrate that is the target of measurement.

[0005] This disclosure provides a positioning device in its first aspect for positioning a substrate, the positioning device comprising: a substrate stage mechanism configured to drive the substrate; a measuring device configured to measure the height of the substrate; an air sensor configured to measure the height of the substrate based on pressure in the conduit while air is discharged through the conduit; and a controller controlling the substrate stage mechanism, wherein the measurement range, which is the height range that the air sensor can measure, is narrower than the height range that the measuring device can measure, and the controller controls the substrate stage mechanism based on an output from the measuring device to cause the height at a measurement position on the substrate to fall within the measurement range.

[0006] In its second aspect, this disclosure provides an exposure apparatus that enables a projection optics system to project a pattern of a master onto a substrate and expose the substrate, the exposure apparatus including a positioning device configured to position the substrate, wherein the positioning device is the positioning device defined in the first aspect of this disclosure.

[0007] This disclosure provides a method for manufacturing an article in its third aspect, comprising: exposing a substrate to an exposure apparatus as defined in the second aspect of this disclosure; developing the exposed substrate; and obtaining an article by processing the developed substrate.

[0008] This disclosure provides an air sensor in its fourth aspect, comprising: a reference nozzle configured to discharge air through a first conduit; a measuring nozzle configured to discharge air through a second conduit; a first differential pressure sensor configured to detect a pressure difference between the pressure in the first conduit and the pressure in the second conduit; and a second differential pressure sensor configured to detect a pressure difference between the pressure in the first conduit and the pressure in the second conduit, wherein the first differential pressure sensor and the second differential pressure sensor have different sensitivities.

[0009] This disclosure provides a positioning device in its fifth aspect, the positioning device comprising: an air sensor defined in the fourth aspect of this disclosure and configured to measure the height of a substrate; a substrate stage mechanism configured to adjust the height of the substrate; and a controller configured to control the substrate stage mechanism based on an output from the air sensor.

[0010] This disclosure provides, in its sixth aspect, an exposure apparatus that uses a projection optics system to project a pattern of a master onto a substrate and expose the substrate, the exposure apparatus including a positioning device configured to position the substrate, wherein the positioning device is the positioning device defined in the fifth aspect of this disclosure.

[0011] This disclosure provides a method for manufacturing an article in its seventh aspect, comprising: exposing a substrate using an exposure apparatus as defined in the sixth aspect of this disclosure; developing the exposed substrate; and obtaining an article by processing the developed substrate.

[0012] The features of this disclosure will become apparent from the following description of embodiments with reference to the accompanying drawings. The following description of embodiments is given by way of example. Attached Figure Description

[0013] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the embodiments.

[0014] Figure 1A This is a schematic diagram illustrating the arrangement of an exposure apparatus according to one embodiment, incorporating a height measuring device according to one embodiment; Figure 1BThis is a schematic diagram illustrating the arrangement of an exposure apparatus according to one embodiment, incorporating a height measuring device according to this embodiment; Figure 1C This is a schematic diagram illustrating the arrangement of an exposure apparatus according to one embodiment, incorporating a height measuring device according to an embodiment; Figure 2 This is a schematic top view of the substrate stage; Figure 3A This is a diagram schematically illustrating a first example of an arrangement of air sensors; Figure 3B This is a diagram schematically illustrating a second example of an arrangement of air sensors; Figure 4A It is a diagram used to illustrate the measurement or positioning method based on the comparative example; Figure 4B These are diagrams illustrating a measurement or positioning method according to an embodiment; and Figure 5 It is a diagram showing the sequence of driving the substrate to match the measurement position on the substrate with the center position (optimal focus position) of the measurement range of the altitude air sensor. Detailed Implementation

[0015] In the following, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the claims. Several features are described in the embodiments, but not all of these features are necessary, and multiple features can be appropriately combined. Furthermore, in the drawings, the same reference numerals are given the same or similar constructions, and redundant descriptions are omitted.

[0016] Figure 1A , Figure 1B and Figure 1C An arrangement of an exposure apparatus EXP according to one embodiment, incorporated into a positioning device PS according to one embodiment, is schematically shown. The exposure apparatus EXP may include: an illumination optics system 62 for illuminating a master image 61 and a projection optics system 3 for projecting a pattern of the master image 61 onto a substrate 1. The exposure apparatus EXP may be configured to expose the substrate 1 by projecting the pattern of the master image 61 onto the substrate 1 using the projection optics system 3. The exposure apparatus EXP may include: a positioning device PS for positioning the substrate 1, an illumination optics system 62 for illuminating the substrate 1, a projection optics system 3 for projecting a pattern of the master image 61 onto the substrate 1, an optical measuring device OM for measuring the height of the substrate 1, and a controller 63.

[0017] The optical measurement device OM is an oblique incidence measurement device that illuminates the surface of substrate 1 with light and receives reflected light from substrate 1. More specifically, the optical measurement device OM may include a light projector 12 that projects patterned light onto substrate 1 and a light receiver 13 that receives reflected light from substrate 1. The optical measurement device OM may produce measurement errors that depend on the internal structure of substrate 1 (the structure below the uppermost surface) because light is reflected by the internal structure of substrate 1 in addition to the uppermost surface of substrate 1. The controller 63 may be implemented, for example, by a programmable logic device (PLD) such as a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), a general-purpose or special-purpose computer with a program installed, or a combination of all or some of these.

[0018] The exposure apparatus EXP or positioning apparatus PS may include: a substrate stage mechanism SD that holds and drives the substrate 1, a measuring device 51 that measures the height of the substrate 1, and an air sensor 21 that measures the height of the substrate 1. A controller 63 may be used as a controller for the positioning apparatus PS. The exposure apparatus EXP or positioning apparatus PS may include a measuring system MS that measures the position and orientation of the substrate stage 41 and can control the position and orientation of the substrate stage 41 based on the output from the measuring system MS. The measuring system MS may include, for example, multiple measuring devices including measuring devices 42 and 43. The stage measuring system MS can measure the substrate stage 41 about six axes by using multiple measuring devices. The positioning apparatus PS can control the substrate stage 41 about six axes based on the output from the stage measuring system MS. The multiple measuring devices may include, for example, multiple interferometers or multiple encoders, or may include one or more interferometers or one or more encoders.

[0019] The measuring device 51 is an optically, electrostatically, or magnetically measuring device for the height of the substrate 1. For example, the measuring device 51 may be a spectral interferometer laser displacement meter. Alternatively, the measuring device 51 may be an oblique incidence measuring device that illuminates the substrate 1 with light and receives reflected light from the substrate 1. The air sensor 21 may also be referred to as an air microsensor. The air sensor 21 may be configured to measure the height of the substrate 1 at a resolution of nanometers or 1 nm or higher. The air sensor 21 may be configured to measure the height of the substrate 1 based on the pressure of the conduit while air is being discharged through it. The measurement results obtained by the air sensor 21 are unaffected by the internal structure of the substrate 1.

[0020] The exposure apparatus EXP may include a reference plate 2 having a reference surface RS. For example, the reference plate 2 may have a reference mark whose position is detected by an alignment sensor (not shown), and the reference plate 2 may be placed on a substrate stage 41. The reference surface RS may be a flat surface. The measurement range of the height range that the air sensor 21 can measure is narrower than the height range that the measuring device 51 can measure. The controller 63 may be operated by controlling the substrate stage mechanism SD based on the output from the measuring device 51 so that the height at the measurement position on the substrate 1 (its surface) falls within the measurement range of the air sensor 21.

[0021] Figure 1A The diagram schematically illustrates the state of measuring the height at a first measurement position on the substrate 1 using the optical measuring device OM, and the state of measuring the height of the reference plane RS using the measuring device 51 and / or the air sensor 21. Figure 1B The diagram schematically illustrates the state of measuring the height at the measurement position on the substrate 1 using measuring device 51 and / or air sensor 21. Figure 1C The diagram schematically illustrates the state of the height of the reference plane RS as measured by the optical measuring device OM.

[0022] Figure 2 A schematic top view of the substrate stage 41 is shown. Additional reference plates 4 and 5 may be arranged on the substrate stage 41. Reference plates 4 and 5 may have reference marks. The thermal deformation of the top plate of the substrate stage 41 can be evaluated by measuring the position of the respective reference marks on the reference plates 2, 4, and 5 using an off-axis observer (not shown).

[0023] Figure 3A A first arrangement example of an air sensor 21 is schematically shown. The air sensor 21 may include a reference nozzle 22 discharging air through a first conduit 71, a measuring nozzle 23 discharging air through a second conduit 72, and a differential pressure sensor 25 detecting the difference between the pressure in the first conduit 71 and the pressure in the second conduit 72. The air sensor 21 may also include a mass flow controller 28, through which air can be supplied to the reference nozzle 22 and the measuring nozzle 23. An air supply source 31 may supply air to the mass flow controller 28. A filter 29 and a valve 30 may be arranged between the mass flow controller 28 and the air supply source 31. The exposure device EXP or positioning device PS may include a drive mechanism (e.g., a lifting mechanism) 24 for moving the air sensor 21. The mass flow controller 28 may supply air to the reference nozzle 22 and the measuring nozzle 23 via a sensor 27, such as a pressure gauge or flow meter. The air sensor 21 may also include a processor 26. The processor 26 may convert the output from the differential pressure sensor 25 into altitude information. The reference nozzle 22 and the measuring nozzle 23 can each be provided with orifices 34 at the inlet and outlet.

[0024] The mass flow controller 28 supplies air with constantly regulated pressure and flow rate to the reference nozzle 22 and the measuring nozzle 23. The mass flow controller 28 is capable of operating based on the output from the sensor 27 to maintain the pressure at the outlet side of the mass flow controller 28 at a predetermined pressure (e.g., 70 kPa). (0.01 kPa). The diameter of each orifice 34 can fall within, for example, the range of 0.1 mm to 0.2 mm. Because the orifices 34 resist airflow, the pressure in the first conduit 71 of the reference nozzle 22 can be maintained constant. The pressure in the second conduit 72 of the measuring nozzle 23 becomes a value corresponding to the distance between the measuring nozzle 23 and the target surface, and the pressures in the first conduit 71 of the reference nozzle 22 and the second conduit 72 of the measuring nozzle 23 are supplied to the differential pressure sensor 25. Therefore, the pressure difference corresponding to the distance between the measuring nozzle 23 and the target surface is supplied to the differential pressure sensor 25. The air sensor 21 does not produce any measurement error due to the internal structure located below the target surface.

[0025] The output voltage of the differential pressure sensor 25 can depend on the diameter of the aperture 34. As the diameter of the aperture 34 increases, the measurement resolution increases. On the other hand, the working distance increases, and the measurement time decreases. Conversely, as the diameter of the aperture 34 decreases, the measurement resolution decreases. On the other hand, the working distance decreases, and the measurement time increases. For example, when the height of the reference plane RS changes by 1 nm, the diameter of the aperture 34 can be determined to change the output voltage of the differential pressure sensor 25 by 2 mV. In this case, the working distance is, for example, 35 micrometers.

[0026] When the positioning device PS changes the height of the substrate stage 41 by a predetermined height, the controller 63 can calibrate the air sensor 21 based on the output from the air sensor 21. Calibration of the air sensor 21 may include updating the conversion formula used by the processor 26 to convert the output voltage of the differential pressure sensor 25 into height. When the positioning device PS changes the height of the substrate stage 41 in increments (e.g., increasing or decreasing in 1 nm increments), the controller 63 can calibrate the air sensor 21 based on the change in the output from the differential pressure sensor 25. Generally, the conversion formula is non-linear. The conversion formula may include a time drift component and / or a temperature-dependent component. The base of the reference plate is formed of a metal or ceramic material with a small coefficient of thermal expansion, and the reference mark may be formed of quartz glass.

[0027] The controller 63 can calibrate the air sensor 21 so that the result obtained by measuring the height of the reference surface RS of the reference plate 2 using the air sensor 21 becomes 0. Alternatively, the controller 63 can obtain a corrected measurement value by holding the result obtained by measuring the height of the reference surface RS of the reference plate 2 using the air sensor 21 as a reference value and subtracting this reference value from the measurement value obtained by measuring the height at the measurement position using the air sensor 21. In this case, calibration includes the operation of holding the reference value. Similarly, the controller 63 can calibrate the optical measuring device OM so that the result obtained by measuring the height of the reference surface RS of the reference plate 2 using the optical measuring device OM is 0. Alternatively, the controller 63 can obtain a corrected measurement value by holding the result obtained by measuring the height of the reference surface RS of the reference plate 2 using the optical measuring device OM as a reference value and subtracting this reference value from the measurement value obtained by measuring the height at the measurement position using the optical measuring device OM. In this case, calibration includes the operation of holding the reference value. Since the drift of the air sensor 21 is quite large, the air sensor 21 can be calibrated frequently, for example, once every 9 seconds.

[0028] For example, the air sensor 21 and the optical measurement device OM can be calibrated separately using the reference plane RS of the reference plate 2. If the difference between the results obtained by measuring the height at the measurement position on the substrate 1 using the air sensor 21 and the optical measurement device OM is equal to or greater than a predetermined value (e.g., 10 nm), the controller 63 can update or generate correction information. The controller 63 can update or generate correction information to match the measurement results obtained by the optical measurement device OM with the measurement results obtained by the air sensor 21.

[0029] The controller 63 can obtain a first result by measuring the height of a first measurement position on the substrate 1 and the height of the reference surface RS of the reference plate 2 using the optical measuring device OM. The controller 63 can also obtain a second result by measuring the height of the first measurement position on the substrate 1 and the height of the reference surface RS of the reference plate 2 using the air sensor 21. The controller 63 can also correct the result obtained by measuring the second measurement position on the substrate 1 using the optical measuring device OM based on the first and second results. The controller 63 can generate correction information for correcting the result obtained by measuring the second measurement position on the substrate 1 using the optical measuring device OM, for example, based on the first and second results. The controller 63 can generate correction information based on, for example, the difference between the first and second results. By correcting the result obtained by measuring the height of the second measurement position on the substrate 1 using the optical measuring device OM based on the correction information, the controller 63 can obtain the height information of the second measurement position with high accuracy in a short time.

[0030] Figure 3BA second arrangement example of the air sensor 21 is schematically shown. In this second arrangement example, instead of the differential pressure sensor 25 in the first arrangement example, a first differential pressure sensor 25A and a second differential pressure sensor 25B are arranged. The first differential pressure sensor 25A detects the pressure difference between the pressure in the first conduit 71 and the pressure in the second conduit 72. Similarly, the second differential pressure sensor 25B detects the pressure difference between the pressure in the first conduit 71 and the pressure in the second conduit 72. The first differential pressure sensor 25A and the second differential pressure sensor 25B have different sensitivities (and measurement ranges). The processor 26 can convert the output from the first differential pressure sensor 25A into altitude information. The processor 26 can also convert the output from the second differential pressure sensor 25B into altitude information.

[0031] The principle of a spectral interferometric laser displacement meter (hereinafter referred to as the displacement meter), which can be used as measuring device 51, will be described below. The displacement meter illuminates a reference surface and a measuring surface with light, for example, emitted from a light source (e.g., a laser). The reference surface is located within the displacement meter. Light applied to the reference surface is reflected by the reference surface to form reference light. Light applied to the measuring surface is reflected by the measuring surface to form measuring light. The reference light and the measuring light interfere with each other to form interference light. The intensity of the interference light at each wavelength varies according to the difference between the optical path length of the reference light and the optical path length on the measuring surface. For example, a diffraction grating or the like is used to disperse the interference light so that the intensity of each wavelength can be measured. This allows the measurement of the optical path length difference, and ultimately the measurement surface relative to the reference surface can be measured. The displacement meter requires a short measurement time, for example, 0.1 milliseconds.

[0032] Figure 4A This is a diagram used to illustrate the measurement and positioning methods based on the comparative example. Figure 4B This is a diagram illustrating the measurement and positioning methods according to this embodiment. (Refer to...) Figure 4A and Figure 4BReference numeral Ras indicates the range that air sensor 21 can measure (measurement range), and reference numeral Rh2 indicates the range that measuring device 51 can measure (measurement range). Reference numeral 73 indicates the range within the measurement range Ras of air sensor 21 located below the center of the measurement range Ras. Reference numeral 76 indicates the range within the measurement range Ras of air sensor 21 located above the center of the measurement range Ras. Reference numeral 78 indicates the range located below and close to the lower end of the measurement range Ras. Reference numeral 79 indicates the range below the lower end of range 78. Reference numeral 77 indicates the output saturation range from air sensor 21. Reference numeral 74 indicates the range that coincides with the measurement range Rhs of measuring device 51 but does not coincide with the measurement range Ras of air sensor 21. Reference numeral 75 indicates the range that does not coincide with either the measurement range Rhs of measuring device 51 or the measurement range Ras of air sensor 21.

[0033] The following will refer to Figure 4A The operation of the comparative example is described. In the comparative example, only the air sensor 21 is used to control the height of the substrate 1. It is assumed that in this case, the time required for the air sensor 21 to perform one measurement is 300 milliseconds, the working distance of the air sensor 21 is 30 μm, and the measurement range Ras is... 1μm. Note that μm refers to micrometers.

[0034] Assuming substrate 1 is initially located within range 79, the substrate stage mechanism SD drives the surface of substrate 1 to a height near the measurement range Ras of air sensor 21. Since the working distance of air sensor 21 is 30 μm, care must be taken to drive the surface of substrate 1 to a height near the measurement range Ras. When the surface of substrate 1 moves to a height near the measurement range Ras (e.g., range 78) of air sensor 21, substrate 1 may collide with air sensor 21 unless it is driven in steps of 30 μm or less at a time. Because the measurement range Ras is only... The substrate 1 is 1 μm thick, so it can pass through the measurement range Ras during stepper drive. In this case, since the output from the air sensor 21 is saturated, the substrate 1 can be detected to have entered the range 77 based on this saturation. For example, if the output of the differential pressure sensor from the air sensor 21 is -5V to +5V, then the air sensor 21 outputs +5V when saturated.

[0035] Subsequently, in the second step, since the measurement range Ras of the air sensor 21 is... The step size is 1 μm, so the substrate 1 gradually descends to move the surface of the substrate 1 to the center of the measurement range Ras of the air sensor 21. Assuming the range 79 is 20 μm × 10 steps = 200 μm, the total measurement time of the air sensor 21 in the first step is 3,000 milliseconds. Assuming a stepping drive of 2 μm × 10 steps = 20 μm, the total measurement time of the air sensor 21 in the second step is 3,000 milliseconds.

[0036] In the third step, based on the measurement results obtained in the second step, the positioning device PS is controlled to bring the surface of substrate 1 within ±0.1 μm of the center position of the measurement range Ras (optimal focusing position). The position of the surface in the Z-axis direction at this point is measured and recorded by the measurement system MS. Positioning the surface of substrate 1 at the optimal focusing position (height) takes a total of 6,000 milliseconds. This is quite time-consuming.

[0037] In this situation, it is difficult to omit the second and subsequent measurements performed by the air sensor 21. Although there are methods for driving the substrate 1 based on measurements from the measurement system MS, the driving accuracy achieved by the driving mechanism 24 that drives the air sensor 21 can be, for example, approximately 1μm. Additionally, considering the tilt angle of substrate 1 is... The thickness error of 30μm and substrate 1 is The measurement time is 20 μm (SEMI standard). The first step can begin at range 78. Assuming range 78 is located 50 μm from the center of the measurement range Ras of air sensor 21, the measurement takes 900 ms, with the first step being 20 μm × 3 steps = 60 μm. Furthermore, since the second and subsequent steps cannot be omitted, 3,000 ms are required, with 2 μm × 10 steps = 20 μm. Therefore, the total time required for the second and subsequent measurements is approximately 3,900 ms.

[0038] The following will refer to Figure 4B The operation of this embodiment is described. It is assumed that in this case, a spectral interferometric laser displacement meter (hereinafter referred to as displacement meter) is used as measuring device 51. It is also assumed that the time required for one measurement by measuring device 51 (displacement meter) is 0.1 msec, the working distance of measuring device 51 is 11.8 mm, and the measurement range Rhs is ±500 μm.

[0039] Regarding the positional relationship between the air sensor 21 and the measuring device 51, for example, it can be ensured beforehand that they are within ±200 μm of each other. This accuracy can be reliably guaranteed through machining precision and assembly adjustment. In the first measurement, it takes 6,000 ms to perform the first to third steps. However, note that the measurement value obtained by the measuring device 51 is stored when the surface of the substrate 1 is located at the center of the measurement range Ras of the air sensor 21.

[0040] In the second and subsequent measurements, the measuring device 51 can measure the height of the substrate 1 and adjust the position of the substrate 1 based on the measurement results. This makes it possible to significantly reduce the time required until the air sensor 21 takes measurements.

[0041] In the second step of this embodiment, operation can begin from range 74 based on the output from the measuring device 51. After performing a measurement (0.1 msec) immediately upon starting operation from range 74, the surface of the substrate 1 can be moved to the center of the measuring range Ras of the air sensor 21. Then, the air sensor 21 performs a measurement (300 msec) and then checks whether the surface of the substrate 1 has entered the measuring range Ras. Finally, based on the measurement result obtained by the air sensor 21, the positioning device PS is controlled to make the surface of the substrate 1 fall within a range of ±0.1 μm from the center position of the measuring range Ras (optimal focus).

[0042] The time required for each of the second and subsequent measurements, which was 3,900 msec in the comparative example, has been reduced to approximately 300 msec in this embodiment.

[0043] In this case, a spectral interferometer laser displacement meter is shown as an example of the measuring device 51. However, for example, a capacitive sensor, a laser displacement meter, a laser interferometer, or an encoder can be used. Furthermore, the measuring device 51 can be placed on a substrate stage, or the positional relationship between the measuring device 51 and the air sensor 21, as well as the position of the substrate 1, can be measured from a position independent of the air sensor 21 and the substrate stage 41.

[0044] After adjusting the height of the substrate 1 using the air sensor 21, that is, after positioning the substrate 1 in the Z-axis direction, the drive mechanism 24 retracts the air sensor 21 to the retracted position. Thereafter, an exposure operation is performed on the substrate 1. When the air sensor 21 measures the next substrate 1, the drive mechanism 24 drives the air sensor 21 to the measurement position.

[0045] Although the measuring device 51 is fixed in the above embodiment, the measuring device 51 can also be driven (moved up and down) by the drive mechanism 24 together with the air sensor 21.

[0046] For example, the air sensor 21 can retract based on detections such as detecting a sudden tilt of the substrate 1 or a loss of holding function of the substrate chuck mounted on the substrate stage 41 relative to the substrate 1. This prevents the substrate 1 from colliding with the air sensor 21.

[0047] Figure 5 An exemplary process is illustrated for driving substrate 1 (substrate stage 41) to match the measurement position on substrate 1 (its surface) with the center position (optimal focus position) of the measurement range Ras of air sensor 21. Controller 63 controls this process. In step S501, controller 63 causes measuring device 51 to begin measuring the height at the measurement position on substrate 1. In step S502, controller 63 controls substrate stage mechanism SD based on the output from measuring device 51. More specifically, controller 63 controls substrate stage mechanism SD to move substrate 1 (substrate stage 41) upwards, thereby bringing the height at the measurement position on substrate 1 closer to the center position of the measurement range Ras.

[0048] In step S503, based on the output from the measuring device 51, as the height of the measuring position on the substrate 1 approaches the measuring range Ras, the controller 63 reduces the driving speed of the substrate stage mechanism SD relative to the substrate. In step S504, when the height of the measuring position on the substrate 1 enters the measuring range Ras, the controller 63 causes the substrate stage mechanism SD to stop driving the substrate 1.

[0049] In step S505, the controller 63 stops the substrate stage mechanism SD from driving the substrate 1 while simultaneously causing the air sensor 21 to measure the height of the measurement position on the substrate 1. If the output from the air sensor 21 falls within a predetermined range, i.e., if the air sensor 21 can measure the measurement position on the substrate 1, the controller 63 executes step S507. Conversely, if the output from the air sensor 21 does not fall within the predetermined range, i.e., if the air sensor 21 cannot measure the measurement position on the substrate 1, the controller 63 executes step S506.

[0050] In step S507, the controller 63, based on the output from the air sensor 21 in step S505, controls the substrate stage mechanism SD to set the height of the measurement position on the substrate 1 at the target height, i.e., the center position of the measurement range Ras. In this case, the controller 63 controls the substrate stage mechanism SD based on the output from the air sensor 21 to set the height of the measurement position on the substrate 1 at the target height, which is obtained by checking whether the output falls within a predetermined range.

[0051] In step S506, if the output from the air sensor 21 does not fall within the predetermined range, the controller 63 controls the substrate stage mechanism SD to make the height at the measurement position on the substrate 1 fall within the predetermined range by using the air sensor 21.

[0052] The following describes a method for manufacturing articles (semiconductor IC components, liquid crystal display components, MEMS, etc.) using the aforementioned exposure apparatus. Articles are manufactured by processing a substrate coated with a photosensitive agent (wafer, glass substrate, etc.) in an exposure step, a development step (developing the substrate (photosensitive agent), and other known processing steps after processing the developed substrate. Other known steps include, for example, etching, resist stripping, dicing, bonding, and encapsulation. This article manufacturing method can produce articles of higher quality than conventional methods.

[0053] Although this disclosure has been described with reference to exemplary embodiments, it should be understood that this disclosure is not limited to the disclosed exemplary embodiments. The scope of the appended claims should be given the broadest interpretation to cover all such variations and equivalent structures and functions.

Claims

1. A positioning device for positioning a substrate, the positioning device comprising: A substrate stage mechanism configured to drive the substrate; A measuring device configured to measure the height of the substrate; An air sensor is configured to measure the height of the substrate based on the pressure in the conduit while air is being discharged through the conduit. as well as A controller is configured to control the substrate stage mechanism. The measurement range of the air sensor, which is capable of measuring heights, is narrower than the height range that the measuring device can measure. The controller controls the substrate stage mechanism based on the output from the measuring device, so that the height of the measuring position on the substrate falls within the measuring range.

2. The positioning device according to claim 1, wherein, Based on the output from the measuring device, the controller reduces the drive speed of the substrate stage mechanism relative to the substrate as the height at the measuring position on the substrate approaches the measuring range.

3. The positioning device according to claim 2, wherein, When the height at the measurement position on the substrate falls within the measurement range, the controller causes the substrate stage mechanism to stop driving the substrate.

4. The positioning device according to claim 3, wherein, The controller stops the substrate stage mechanism from driving the substrate while simultaneously measuring the height of the substrate using the air sensor.

5. The positioning device according to claim 4, wherein, When the output from the air sensor falls within a predetermined range, the controller controls the substrate stage mechanism based on the output from the air sensor to set the height at the measurement position on the substrate as the target height.

6. The positioning device according to claim 5, wherein, The controller controls the substrate stage mechanism based on the output from the air sensor to set the height at the measurement position on the substrate as the target height. The output of the air sensor is obtained by checking whether the output of the air sensor falls within the predetermined range.

7. The positioning device according to claim 5, wherein, When the output from the air sensor does not fall within the predetermined range, the controller controls the substrate stage mechanism to use the air sensor to bring the height at the measurement position on the substrate into the predetermined range.

8. The positioning device according to claim 1, wherein the measuring device measures the height of the substrate optically, electrostatically, or magnetically.

9. The positioning device according to claim 1, wherein, The measuring device is an oblique incidence measuring device, which is configured to illuminate the substrate with light and receive reflected light from the substrate.

10. The positioning device according to claim 1, wherein, The substrate stage mechanism includes: a substrate stage configured to hold the substrate, a drive mechanism configured to drive the substrate stage, and a measurement system configured to measure the position and orientation of the substrate stage. The controller controls the position and orientation of the substrate stage based on the output from the measurement system.

11. The positioning device according to claim 10, wherein, When the controller changes the height of the substrate stage to a predetermined height based on the output from the measurement system, it calibrates the air sensor based on the output from the air sensor.

12. The positioning device according to claim 1, wherein, The air sensor includes: a reference nozzle configured to discharge air through a first conduit; a measuring nozzle configured to discharge air through a second conduit; and a differential pressure sensor configured to detect the difference between the pressure in the first conduit and the pressure in the second conduit.

13. The positioning device according to claim 12, wherein, The air sensor also includes a mass flow controller, which supplies air to the reference nozzle and the measuring nozzle.

14. The positioning device according to any one of claims 1 to 13, wherein, The air sensor includes: The reference nozzle is configured to discharge air through the first conduit. The measuring nozzle is configured to discharge air through a second conduit. A first differential pressure sensor detects the pressure difference between the first pipeline and the second pipeline. The second differential pressure sensor detects the pressure difference between the first pipeline and the second pipeline, and The first differential pressure sensor and the second differential pressure sensor have different sensitivities.

15. An exposure apparatus that causes a projection optics system to project a pattern of a master onto a substrate and expose the substrate, the exposure apparatus including a positioning device configured to position the substrate. in, The positioning device is the positioning device as defined in any one of claims 1-14.

16. A method for manufacturing an article, comprising: The substrate is exposed using the exposure apparatus as defined in claim 15; The already exposed substrate is developed; as well as An article is obtained by processing the substrate that has already been developed.

17. An air sensor comprising: A reference nozzle, configured to discharge air through a first conduit; The measuring nozzle is configured to discharge air through a second conduit; A first differential pressure sensor is configured to detect the difference between the pressure in the first pipeline and the pressure in the second pipeline; as well as The second differential pressure sensor is configured to detect the pressure difference between the first pipeline and the second pipeline. The first differential pressure sensor and the second differential pressure sensor have different sensitivities.

18. A positioning device, comprising: The air sensor as defined in claim 17 is configured to measure the height of a substrate; A substrate stage mechanism configured to adjust the height of the substrate; as well as The controller is configured to control the substrate stage mechanism based on the output from the air sensor.

19. An exposure apparatus that uses a projection optics system to project a pattern of a master onto a substrate and exposes the substrate, the exposure apparatus including a positioning device configured to position the substrate. in, The positioning device is the positioning device as defined in claim 18.

20. A method for manufacturing an article, comprising: The substrate is exposed using the exposure apparatus as defined in claim 19; The already exposed substrate is developed; as well as An article is obtained by processing the substrate that has already been developed.

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