3u system architecture with flip and lock-free structure

Abstract

The application relates to the technical field of servers and discloses a 3U system architecture with a turnover lock-free attachment structure, which comprises a case, a turnover tray module and a turnover shaft assembly, the case is provided with a mainboard module, a graphics processor module and a forced air cooling system; the turnover tray module comprises a turnover module tray, the turnover module tray is integrated with a power supply unit, a hard disk module, a power supply adapter plate and a PCIe module; the turnover shaft assembly is arranged between the side wall of the case and the turnover module tray, and turnover movement of the turnover tray module relative to the case is realized. When the turnover tray module is turned over and opened, the mainboard module below is exposed, and the cable connected between the turnover tray module and the mainboard module or the power supply adapter plate is unfolded in the turnover process without being disassembled. The application integrates multiple functional modules into one through the turnover tray module, realizes overall turnover operation of the lock-free attachment and cable-free disassembly, significantly simplifies the maintenance steps of the internal modules of the server, and improves the assembly efficiency and operation and maintenance portability.

Description

Technical Field

[0001] This invention relates to the field of server technology, and in particular to a 3U system architecture with a flip-lockless structure. Background Technology

[0002] With the rapid iteration of digital technologies such as cloud computing, big data, and artificial intelligence, data centers, as the core carriers of computing power storage and computation, are rapidly developing towards high density, high power consumption, and large scale. In the server field, both air cooling and liquid cooling solutions coexist. To adapt to data centers with diverse business needs or those transitioning from air cooling to liquid cooling, server products that can simultaneously support quick conversion between air cooling and immersion liquid cooling modules will combine the cost flexibility of air cooling with the high-efficiency heat dissipation capabilities of liquid cooling.

[0003] For 3U server architectures that support both air cooling and immersion liquid cooling, the internal module density is higher to meet the space requirements of the liquid cooling enclosure. They typically adopt a modular layered or modular locking design, meaning that different modules need to be disassembled or assembled separately when disassembling or assembling the chassis. At the same time, the cables inside the chassis need to be reconnected after disassembling the modules, which is complicated, has high production costs, and is inconvenient for maintenance. Summary of the Invention

[0004] The purpose of this invention is to provide a 3U system architecture with a flip-and-lock-free structure, which solves the problems of cumbersome operation, low assembly efficiency, and inconvenient maintenance caused by the need to disassemble multiple modules in layers and steps and reconnect cables when maintaining the internal modules of the existing 3U server.

[0005] To achieve the above objectives, the present invention provides a 3U system architecture with a flip-and-lockless mounting structure, including a chassis, a flip tray module and a flip axis assembly, wherein the chassis is provided with a motherboard module, a graphics processor module and an air cooling system; The flip-out tray module includes a flip-out module tray, on which a power supply unit, a hard disk module, a power adapter board, and a PCIe module are provided; The flip axis assembly is disposed between the side wall of the chassis and the flip module tray, and is used to realize the flip movement of the flip tray module relative to the chassis; The flip tray module can be flipped on the chassis via the flip axis assembly. When the flip tray module is flipped open, the motherboard module located below the flip tray module is exposed, and the cable connecting the flip tray module to the motherboard module or the power adapter board unfolds with the flip tray module during the flipping process without needing to be disassembled.

[0006] The flip axis assembly includes a flip bracket, a flip axis stepped stud, and an M4 flip axis screw. The flip bracket has a through hole for the flip axis stud, and the flip axis stepped stud is fixedly connected to the chassis and located inside the chassis. The flip bracket is rotatably connected to the flip axis stepped stud, and the through hole for the flip axis stud is fitted onto the flip axis stepped stud. The flip module tray is fixedly connected to the flip bracket. The M4 flip axis screw passes through the through hole for the flip axis stud and is threadedly connected to the flip axis stepped stud.

[0007] The flip axis assembly further includes a flip module stop pin, which is fixedly connected to the chassis and located inside the chassis.

[0008] The flip shaft assembly further includes an assembly positioning fixture. The flip bracket has an assembly positioning fixture hole, and the chassis has a base positioning fixture hole. The assembly positioning fixture can pass through the base positioning fixture hole and the assembly positioning fixture hole in sequence to position the flip bracket in a preset assembly position.

[0009] The flip axis assembly further includes a flip module positioning pin, which is connected to the flip module tray; a flip module positioning hole is correspondingly provided on the side wall of the chassis; when the flip tray module is flipped to the open position, the flip module positioning pin can engage with the flip module positioning hole to lock the open state of the flip tray module.

[0010] The motherboard module includes a motherboard, a BRIDGE module, an MLB tray, and an I / O module. The MLB tray is fixedly connected to the chassis. The motherboard is fixedly connected to the MLB tray and located on one side of the MLB tray. The BRIDGE module is fixedly connected to the MLB tray and located on one side of the MLB tray. The I / O module is fixedly connected to the MLB tray and located on one side of the MLB tray.

[0011] The graphics processor module includes a graphics processor, a graphics processor tray, and a graphics processor adapter board. The graphics processor tray is fixedly connected to the chassis and located inside the chassis. The graphics processor adapter board is connected to the graphics processor tray. The graphics processor is connected to the graphics processor adapter board.

[0012] The air-cooling system includes a rear fan module and a middle fan module, both of which are detachably connected to the chassis via bolts.

[0013] The PCIe module includes a PCIe bracket, a RISER card, an FHHL PCIe card, and a locking bracket. The RISER card is fixedly connected to the PCIe bracket. The FHHL PCIe card is inserted into the bayonet window of the PCIe bracket. The locking bracket is fixedly connected to both the PCIe bracket and the FHHL PCIe card, and is used to lock the FHHL PCIe card onto the PCIe bracket.

[0014] This invention discloses a 3U system architecture with a flip-up, lock-free mounting structure. By integrating the power supply unit, hard drive module, power adapter board, and PCIe module into a flip-up tray module, and using a flip axis assembly to achieve overall flipping, the operator can maintain the motherboard module without removing any screws or cables. Simply grasp the handle hole and lift upwards; the flip-up tray module will then simultaneously flip all integrated modules, with connecting cables extending naturally without prior disconnection. After maintenance, the tray is snapped back into place, and the cables automatically return to their original positions. This structure achieves convenient maintenance with "one-step flipping, lock-free and disassembly-free," significantly reducing module disassembly and cable plugging / unplugging steps. It avoids the risk of wiring errors or interface damage caused by repeated cable disconnection and reconnection, significantly improving server assembly efficiency and ease of maintenance. Furthermore, the quick-release central and rear fan modules allow for rapid conversion between air-cooled and immersion liquid-cooled systems without replacing the entire chassis, flexibly adapting to the cooling needs of different data centers. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0016] Figure 1 This is a schematic diagram of the overall structure of the 3U system architecture with the flip-and-lock-free attachment structure of the present invention.

[0017] Figure 2 This is a schematic diagram of the structure of the flip tray module of the present invention.

[0018] Figure 3 This is a schematic diagram of the air-cooled chassis of the present invention.

[0019] Figure 4 This is a schematic diagram of the structure of the immersion liquid-cooled chassis of the present invention.

[0020] Figure 5 This is a schematic diagram of the structure of the front window area of ​​the present invention.

[0021] Figure 6 This is a schematic diagram of the structure of the rear window area of ​​the present invention.

[0022] Figure 7This is an exploded view of the 3U system architecture with a flip-and-lock-free attachment structure of the present invention.

[0023] Figure 8 This is a schematic diagram of the motherboard module of the present invention.

[0024] Figure 9 This is an exploded view of the motherboard module of this invention.

[0025] Figure 10 This is a schematic diagram of the PCIe module of the present invention.

[0026] Figure 11 This is an exploded view of the PCIe module of this invention.

[0027] Figure 12 This is a schematic diagram of the structure of the graphics processor module of the present invention.

[0028] Figure 13 This is an exploded view of the graphics processor module of the present invention.

[0029] Figure 14 This is a schematic diagram of the structure of the flip tray module of the present invention.

[0030] Figure 15 This is a schematic diagram of the structure of the flip-up bracket of the present invention.

[0031] Figure 16 This is a schematic diagram of the structure of the flip-shaft stepped stud of the present invention.

[0032] Figure 17 This is the present invention. Figure 14 Enlarged view of point B.

[0033] Figure 18 This is a schematic diagram of the installation process of the flip bracket of the present invention.

[0034] Figure 19 This is a schematic diagram of the installation process of the flip-up tray module of the present invention.

[0035] Figure 20 This is a schematic diagram of the flip tray module of the present invention in the fully open state.

[0036] Figure 21 This is an enlarged view of point A in the figure of this invention.

[0037] Figure 22 This is the overall system control logic diagram of the present invention.

[0038] Figures 23 to 25 This is the wiring diagram of the entire system of the present invention.

[0039] In the diagram: 1-Chassis top cover, 2-FHHL PCIe card, 3-RISER card, 4-PCIe bracket, 5-SATA / NVME board, 6-First BRIDGE board, 7-Hard drive module, 8-Chassis, 9-Power adapter board, 10-Power supply slot filling module, 11-Power supply unit, 12-Motherboard, 13-Middle fan, 14-Middle fan bracket, 15-Middle FCB, 16-Rear fan, 17-Rear fan bracket, 18-Rear FCB, 19-Graphics processor, 20-Flip module tray, 21-Graphics processor adapter board, 22-Graphics processor tray, 23-Graphics processor crossbeam, 24-MLB tray, 25-BRIDGE tray, 26-Second BRIDGE board, 27-IO bracket, 28-IO board, 29-Air cooling Chassis, 30-Rear fan module, 31-Middle fan module, 32-Immersion liquid cooling chassis, 33-BRIDGE module, 34-IO module, 36-Motherboard module, 38-Locking bracket, 39-PCIe module, 40-Graphics processor module, 41-Flip tray module, 42-M4 flip axis screw, 43-Flip bracket, 44-Assembly positioning fixture, 45-M3 locking hole, 46-Tray hanging pin hole, 47-Flip axis stud through hole, 48-Assembly positioning fixture hole, 49-Flip module stop pin, 50-Flip module positioning hole, 52-Flip axis stepped stud, 53-Base positioning fixture hole, 54-Flip module positioning pin, 55-Flip axis stepped stud limit hole, 56-Tray hanging pin, 57-M3 locking through hole, 58-Handle hole. Detailed Implementation

[0040] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0041] First embodiment: This invention provides a 3U system architecture with a flip-and-lockless structure, including a chassis 8, a flip tray module 41, and a flip axis assembly. The flip tray module 41 includes a flip module tray 20, on which a power supply unit 11, a hard disk module 7, a power adapter board 9, and a PCIe module 39 are disposed. By integrating multiple functional modules into the flip tray module 41 and using the flip axis assembly to achieve overall flipping, the problem of existing 3U server internal module maintenance requiring step-by-step disassembly of multiple modules and reconnection of cables, resulting in cumbersome operation, low assembly efficiency, and inconvenient maintenance, is solved.

[0042] In this specific embodiment, the chassis 8 is provided with a motherboard module 36, a graphics processor module 40, and an air-cooling system; the flip axis assembly is disposed between the side wall of the chassis 8 and the flip module tray 20, and is used to realize the flip movement of the flip tray module 41 relative to the chassis 8. The flip tray module 41 can be flipped on the chassis 8 via the flip axis assembly. When the flip tray module 41 is flipped open, the motherboard module 36 located below the flip tray module 41 is exposed, and the cable connecting the flip tray module 41 to the motherboard module 36 or the power adapter board 9 unfolds with the flip tray module 41 during the flipping process without needing to be disassembled.

[0043] A chassis cover 1 is also provided on top of the chassis 8. The chassis cover 1 is detachably connected to the chassis 8 and is used to seal the internal space of the chassis 8.

[0044] The chassis 8 adopts a standard 3U height design, and its interior is divided into a front window area, a middle area, and a rear window area from front to back. The flip tray module 41 is located on the upper and middle layers of the front window area, and the motherboard module 36 is located on the lower layer of the front window area and directly below the flip tray module 41. The graphics processor module 40 is located in the rear window area.

[0045] The power adapter board 9 is provided with multiple power interfaces. The power supply unit 11 consists of four PSU power supplies arranged side by side. The flip module tray 20 is also provided with a power slot filling module 10 (PSU DUMMY), which is used to fill unused power slots. The hard drive module 7 consists of six SATA or NVMe solid-state drives. The hard drive module 7 is connected to the motherboard 12 (MLB) through the SATA / NVMe board 5. When the flip tray module 41 is flipped by the flip shaft assembly, the power supply unit 11, hard disk module 7, power adapter board 9 and PCIe module 39 integrated on it are flipped synchronously as a whole, without the need to disassemble any component separately.

[0046] The flip module tray 20 is provided with a handle hole 58.

[0047] Under normal use, the flip tray module 41 is in the closed state. At this time, the flip tray module 41 is placed horizontally inside the chassis 8, above the motherboard module 36, and the cables between the modules are in a normal connection state.

[0048] When maintenance, replacement, or repair of the motherboard module 36 is required, the operator does not need to remove any screws or locking structures. Simply grasp the handle hole 58 on the flip-up module tray 20 and lift it upwards; the flip-up module tray 20 will then flip upwards. During the flipping process, the cables (including power cables and high-speed signal cables) connecting the motherboard module 36 or the power adapter board 9 extend naturally along with the flip-up tray module 41 without prior disassembly. When the flip-up tray module 41 is flipped to the open state, the motherboard module 36 located beneath the flip-up tray module 41 is fully exposed, allowing the operator to easily operate on the motherboard module 36.

[0049] After maintenance, the operator closes the flip tray module 41 downwards, and all cables automatically return to their original positions without needing to be plugged in or reconnected. The entire flipping process achieves maintenance operations that are "lock-free and cable-free".

[0050] When it is necessary to convert the air-cooled system to an immersion liquid-cooled system, the operator can quickly convert from the air-cooled chassis 29 to the immersion liquid-cooled chassis 32 by disassembling the air-cooled system and then adding the graphics processor beam 23, without replacing the entire chassis 8.

[0051] This invention, through the design of the flip tray module 41, allows operators to maintain internal modules such as the motherboard without disassembling any screws or cables. They can simply flip the entire module to expose the operating area, thereby improving the assembly efficiency and ease of maintenance of the server.

[0052] The flip axis assembly includes a flip bracket 43, a flip axis stepped stud 52, and an M4 flip axis screw 42. The flip bracket 43 has a flip axis stud through hole 47. The flip axis stepped stud 52 is fixedly connected to the chassis 8 and located inside the chassis 8. The flip bracket 43 is rotatably connected to the flip axis stepped stud 52, and the flip axis stud through hole 47 is fitted onto the flip axis stepped stud 52. The flip module tray 20 is fixedly connected to the flip bracket 43. The M4 flip axis screw 42 passes through the flip axis stud through hole 47 and is threadedly connected to the flip axis stepped stud 52.

[0053] In this embodiment, the flipping bracket 43 is provided with a tray hanging nail hole 46, and the flipping module tray 20 is provided with a corresponding tray hanging nail 56 and a flipping shaft step stud limiting hole 55.

[0054] When installing the flip bracket 43, the flip shaft stud through hole 47 on the flip bracket 43 is nested on the flip shaft stepped stud 52 on the side wall of the chassis 8, and then the M4 flip shaft screw 42 is passed through the flip shaft stud through hole 47 and locked to the flip shaft stepped stud 52. At this time, the flip bracket 43 can rotate 360° around the flip shaft stepped stud 52 as the axis.

[0055] When assembling the flip module tray 20, firstly, insert the tray hook 56 into the tray hook hole 46 to achieve the pre-positioning of the flip module tray 20 on the flip bracket 43; then, align and engage the flip shaft stepped stud limiting hole 55 with the flip shaft stepped stud 52; finally, the flip bracket 43 is also provided with an M3 locking hole 45, and the flip module tray 20 is correspondingly provided with an M3 locking through hole 57. By passing an M3 countersunk screw through the M3 locking through hole 57 and locking it with the M3 locking hole 45, the flip module tray 20 is fixedly connected to the flip bracket 43.

[0056] Secondly, the flip axis assembly also includes a flip module stop pin 49, which is fixedly connected to the chassis 8 and located inside the chassis 8.

[0057] In this embodiment, when the flip tray module 41 flips upward to the preset maximum opening angle, the edge of the flip module tray 20 contacts the flip module stop pin 49, thereby restricting the flip tray module 41 from continuing to flip, playing an over-flip protection role, and avoiding cable pulling or structural damage due to excessive flipping.

[0058] Meanwhile, the flip shaft assembly also includes an assembly positioning fixture 44, the flip bracket 43 has an assembly positioning fixture hole 48, and the chassis 8 has a base positioning fixture hole 53. The assembly positioning fixture 44 can pass through the base positioning fixture hole 53 and the assembly positioning fixture hole 48 in sequence to position the flip bracket 43 in a preset assembly position.

[0059] In this embodiment, during the assembly process, the flip bracket 43 is first temporarily fixed to the side wall of the chassis 8 using the assembly positioning fixture 44, then the M4 flip shaft screw 42 is tightened, and finally the assembly positioning fixture 44 is removed. This fixture ensures the consistency of the installation position of the flip bracket 43 and improves production assembly efficiency.

[0060] In addition, the flip axis assembly also includes a flip module positioning pin 54, which is connected to the flip module tray 20; a flip module positioning hole 50 is correspondingly provided on the side wall of the chassis 8; when the flip tray module 41 is flipped to the open position, the flip module positioning pin 54 can engage with the flip module positioning hole 50 to lock the open state of the flip tray module 41.

[0061] In this embodiment, after the flipping tray module 41 is flipped to the stop position, the operator can move the flipping module positioning pin 54 to make it spring into the flipping module positioning hole 50, thereby preventing the flipping tray module 41 from shaking or falling back due to accidental contact during maintenance; when it needs to be fastened, the operator can move the flipping module positioning pin 54 again to make it disengage from the flipping module positioning hole 50, and then flip it downwards to fasten it.

[0062] Second embodiment: In this specific embodiment, the motherboard module 36 includes a motherboard 12, a BRIDGE module 33, an MLB tray 24, and an I / O module 34. The MLB tray 24 is fixedly connected to the chassis 8. The motherboard 12 is fixedly connected to the MLB tray 24 and is located on one side of the MLB tray 24. The BRIDGE module 33 is fixedly connected to the MLB tray 24 and is located on one side of the MLB tray 24. The I / O module 34 is fixedly connected to the MLB tray 24 and is located on one side of the MLB tray 24.

[0063] In this embodiment, the MLB tray 24 is provided with multiple hooks, and the motherboard 12 is provided with multiple corresponding gourd holes. During assembly, the gourd holes on the motherboard 12 are aligned with the hooks on the MLB tray 24, and then secured with two hand-turned screws on the motherboard 12. The BRIDGE module 33 is provided with gourd holes, which are aligned with the hooks on the MLB tray 24 and secured with one M3 countersunk screw. The IO module 34 is provided with gourd holes, which are aligned with the hooks on the MLB tray 24 and secured with two M3 countersunk screws. With the above structure, the motherboard 12, BRIDGE module 33, and IO module 34 are integrated on the MLB tray 24, forming an independent motherboard module 36, which can be installed and removed as a whole, facilitating production assembly and on-site maintenance. In addition, the IO module 34 is located at the front window of the chassis 8 and has a VGA interface, a USB interface, a power button, a UID button and a health indicator light. It is connected to the motherboard 12 via two signal lines.

[0064] Specifically, the BRIDGE module 33 includes a BRIDGE tray 25 and a first BRIDGE board 6. The BRIDGE tray 25 is connected to the motherboard 12, and the first BRIDGE board 6 is connected to the BRIDGE tray 25.

[0065] Specifically, the IO module 34 includes an IO bracket 27 and an IO board 28. The IO bracket 27 is fixedly connected to the MLB tray 24, and the IO board 28 is mounted on the IO bracket 27.

[0066] The graphics processing unit module 40 includes a graphics processor 19 (GPU), a graphics processor tray 22, and a graphics processor adapter board 21. The graphics processor tray 22 is fixedly connected to the chassis 8 and is located inside the chassis 8. The graphics processor adapter board 21 is connected to the graphics processor tray 22. The graphics processor 19 is connected to the graphics processor adapter board 21.

[0067] In this embodiment, the graphics processor adapter board 21 is fixedly connected to the graphics processor tray 22 by nine M3 flathead screws. There are ten graphics processors 19, with their gold fingers inserted into corresponding slots on the graphics processor adapter board 21, arranged side-by-side. The graphics processor adapter board 21 is connected to the power adapter board 9 via a power cable for power supply; the signals from the ten graphics processors 19 are connected to the motherboard 12 via multiple MCIO interfaces on the graphics processor adapter board 21 and high-speed signal lines. The graphics processor module 40 is located in the rear window area of ​​the chassis 8, forming a front-to-back layout with the flip-up tray module 41 located in the front window area, achieving high-density computing power deployment. The graphics processor adapter board 21 is also connected to the central FCB 15 and the rear FCB 18 via signal lines for signal control of the fan module.

[0068] Secondly, the air-cooling system includes a rear fan module 30 and a middle fan module 31, both of which are detachably connected to the chassis 8 via bolts.

[0069] In this embodiment, the central fan module 31 includes five hot-swappable central fans 13, a central fan bracket 14, and a central FCB 15. The rear fan module 30 includes five hot-swappable rear fans 16, a rear fan bracket 17, and a rear FCB 18. The central FCB 15 and the rear FCB 18 are connected to the power adapter board 9 via power cables to supply power to the fan modules; simultaneously, they are connected to the graphics processor adapter board 21 and the motherboard 12 via signal lines to achieve fan speed control and status monitoring. The central fan module 31 provides air cooling for the motherboard module 36, hard drive module 7, and PCIe module 39, while the rear fan module 30 provides air cooling for the graphics processor module 40. When it is necessary to convert the air-cooled system to an immersion liquid-cooled system, simply remove the hand-turned screws, remove the middle fan module 31 and the rear fan module 30 as a whole, and then add the graphics processor crossbeam 23 to complete the conversion. There is no need to replace the entire chassis 8.

[0070] Meanwhile, the PCIe module 39 includes a PCIe bracket 4, a RISER card 3, an FHHL PCIe card 2, and a locking bracket 38. The RISER card 3 is fixedly connected to the PCIe bracket 4. The FHHL PCIe card 2 is inserted into the bayonet window of the PCIe bracket 4. The locking bracket 38 is fixedly connected to both the PCIe bracket 4 and the FHHL PCIe card 2, and is used to lock the FHHL PCIe card 2 onto the PCIe bracket 4.

[0071] In this embodiment, there are two RISER cards 3. The locking holes on each RISER card 3 are aligned with the locking studs on the PCIe bracket 4, and then secured with two M3 flathead screws. A total of four M3 flathead screws are used for both RISER cards 3. There are also two FHHL PCIe cards 2. After being inserted into the bayonet window of the PCIe bracket 4, the locking bracket 38 is placed over the bayonet tail of the FHHL PCIe card 2. Two M3 flathead screws are then passed through the screw holes on the locking bracket 38 and the FHHL PCIe card 2 and secured to the PCIe bracket 4, thus firmly fixing the two FHHL PCIe cards 2 to the PCIe bracket 4. The PCIe module 39 is a separate module, pre-assembled and installed on the flip module tray 20. The RISER cards 3 are connected to the motherboard 12 via two high-speed signal lines to transmit PCIe signals.

[0072] Finally, the power adapter board 9 is equipped with a gold finger interface. One end of the first BRIDGE board 6 is connected to the power adapter board 9 via the gold fingers, and the other end is connected to the second BRIDGE board 26 at the rear of the motherboard 12 via a power cable, and then connected to the motherboard 12 via the gold fingers to provide power to the motherboard system. The IO module 34, PCIe module 39, hard drive module 7, and graphics processor module 40 are respectively connected to the power interface on the power adapter board 9 via corresponding power cables to form a complete power supply system. The signals required by the SATA / NVMe SSD in the hard drive module 7 are achieved by connecting to the MCIO interface on the motherboard 12 via the SATA / NVMe board 5.

[0073] The power supply for the entire system is connected via four PSU power connectors directly to the power distribution board (PDB). The PDB connects to the gold fingers on the first bridge board, and then a power cable connects to the second bridge board 26. The gold fingers of the second bridge board 26 connect to the MLB, thus powering the motherboard system. In the air-cooled system configuration, the FCB15 in the middle of chassis 8 and the FCB18 at the rear of chassis 8 connect to the PDB via power cables to power the fan modules. Chassis 8 supports five hot-swappable 8056 fan modules in the middle and five external hot-swappable 8056 fan modules at the rear, allowing for fan module maintenance even without server power interruption. The graphics processor adapter board 21 connects to the PDB via a power cable, and the graphics processor 19 connects to the PDB via a rear power cable for power supply. The system can be expanded to support up to 10 graphics processors 19. The IO module 34 assembly chassis features an RJ45 port, VGA port, USB 3.0 port, power button, UID button, and health indicator light on the front panel. Connection to the motherboard is achieved via two signal cables. (See also...) Figure 23 ) The RISE on the front window flip module is connected to the MLB via a power cable. The SATA / NVMe cards are also connected to the MLB via power cables. The signals required by the SATA / NVMe SSD modules are achieved through a high-speed signal cable connected to the MCIO interface on the motherboard. The middle FCB15 and the rear FCB18 each use two signal cables to connect to the graphics processor adapter board 21, and then another signal cable connects them to the MLB. (See also...) Figure 24 ) The PCIe signals on the front window of chassis 8 are connected to the MLB via two high-speed signal lines on RISER card 3. The signals for the 10 graphics processors 19 are connected to the MLB via high-speed signal lines through two MCIO interfaces per group on the graphics processor adapter board 21. (See also...) Figure 25 ) The 3U system architecture with flip-lock-free structure of the present invention: (1) Powerful performance: Based on Intel's 4th and 5th generation Xeon processors, the server platform supports DDR5 memory and PCIe 5.0, significantly improving memory bandwidth and data transfer speed. It integrates Intel Advanced Matrix Extensions (AMX) to enhance AI acceleration capabilities, making it suitable for data centers from edge computing to the cloud.

[0074] (2) Flexible topology scheme: It supports up to 10 high-performance graphics processors (including NVIDIA, AMD, INTEL and other graphics processors, and is deeply adapted to the mainstream computing cards in China); the CPU-Switch can be interconnected with X32 or X16 lanes to achieve high bandwidth communication; and complete complex data processing and model training and inference tasks in the shortest time.

[0075] (3) High reliability: Equipped with a PCIe Gen 5 switch, it supports single and dual wide graphics processor 19 cards, and is compatible with the latest NVIDIA graphics processor 19 and mainstream domestic computing card solutions, ensuring high system stability and reliability to meet the business needs of different customers. It can also be expanded to support 6 SATA / NVME hard drives.

[0076] (4) Portable conversion between air-cooled and immersion liquid cooling systems: Based on the air-cooled system, this architecture uses a quick-release fan module in the middle of chassis 8 to cool the motherboard, front hard drive, and PCIe network card, and a quick-release fan module at the rear of chassis 8 to cool the graphics processor module 40. It can be converted to an immersion liquid cooling system simply by removing the quick-release fan modules in the middle and rear. Therefore, this architecture offers high operational efficiency when converting between air-cooled and immersion liquid cooling systems, more portable configuration expansion, and greater flexibility to adapt to different environmental scenarios, meeting market demands for server compatibility.

[0077] (5) Module flip structure: The internal modules of the chassis 8 adopt a modular design. The PSU, SATA / NVMESSD module and FHHL PCIe module 39 are integrated into a flip structure module. The traditional multi-module step-by-step disassembly action is replaced by the structure flip method. The integrated flip module has a higher space utilization rate in the chassis 8, the module structure is more reliable, and the module assembly and disassembly steps can be significantly reduced in operation. The lock-free structure can also improve production efficiency and reduce maintenance costs.

[0078] (6) Flip-up module cable maintenance without disassembly: When the module flips, the internal cables unfold with the module without disassembly, replacing the need to disassemble cables individually when disassembling traditional multi-module structures. This greatly improves the portability of operation and maintenance. It avoids the risks such as wiring errors that may occur when disassembling and reassembling cables, improves the reliability of system operation and maintenance, brings customers a comfortable and convenient operation and maintenance experience, and enables customers to maintain specific components in a more relaxed way.

[0079] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A 3U system architecture with a flip-lock-free mounting structure, characterized in that, It includes a chassis, a flip tray module, and a flip axis assembly. The chassis is equipped with a motherboard module, a graphics processor module, and an air-cooling system. The flip-out tray module includes a flip-out module tray, on which a power supply unit, a hard disk module, a power adapter board, and a PCIe module are provided; The flip axis assembly is disposed between the side wall of the chassis and the flip module tray, and is used to realize the flip movement of the flip tray module relative to the chassis; The flip tray module can be flipped on the chassis via the flip axis assembly. When the flip tray module is flipped open, the motherboard module located below the flip tray module is exposed, and the cable connecting the flip tray module to the motherboard module or the power adapter board unfolds with the flip tray module during the flipping process without needing to be disassembled.

2. The 3U system architecture with a flip-and-lock-free structure as described in claim 1, characterized in that, The flip axis assembly includes a flip bracket, a flip axis stepped stud, and an M4 flip axis screw. The flip bracket has a through hole for the flip axis stud. The flip axis stepped stud is fixedly connected to the chassis and located inside the chassis. The flip bracket is rotatably connected to the flip axis stepped stud, and the through hole for the flip axis stud is fitted onto the flip axis stepped stud. The flip module tray is fixedly connected to the flip bracket. The M4 flip axis screw passes through the through hole for the flip axis stud and is threadedly connected to the flip axis stepped stud.

3. The 3U system architecture with a flip-and-lock-free structure as described in claim 2, characterized in that, The flip axis assembly also includes a flip module stop pin, which is fixedly connected to the chassis and located inside the chassis.

4. The 3U system architecture with a flip-and-lock-free structure as described in claim 2, characterized in that, The flip shaft assembly also includes an assembly positioning fixture. The flip bracket has an assembly positioning fixture hole, and the chassis has a base positioning fixture hole. The assembly positioning fixture can pass through the base positioning fixture hole and the assembly positioning fixture hole in sequence to position the flip bracket in a preset assembly position.

5. The 3U system architecture with a flip-and-lock-free mounting structure as described in claim 2, characterized in that, The flip axis assembly also includes a flip module positioning pin, which is connected to the flip module tray; a flip module positioning hole is correspondingly provided on the side wall of the chassis; when the flip tray module is flipped to the open position, the flip module positioning pin can engage with the flip module positioning hole to lock the open state of the flip tray module.

6. The 3U system architecture with a flip-and-lock-free structure as described in claim 1, characterized in that, The motherboard module includes a motherboard, a BRIDGE module, an MLB tray, and an I / O module. The MLB tray is fixedly connected to the chassis. The motherboard is fixedly connected to the MLB tray and located on one side of the MLB tray. The BRIDGE module is fixedly connected to the MLB tray and located on one side of the MLB tray. The I / O module is fixedly connected to the MLB tray and located on one side of the MLB tray.

7. The 3U system architecture with a flip-and-lock-free structure as described in claim 1, characterized in that, The graphics processor module includes a graphics processor, a graphics processor tray, and a graphics processor adapter board. The graphics processor tray is fixedly connected to the chassis and is located inside the chassis. The graphics processor adapter board is connected to the graphics processor tray. The graphics processor is connected to the graphics processor adapter board.

8. The 3U system architecture with a flip-and-lock-free structure as described in claim 1, characterized in that, The air-cooling system includes a rear fan module and a middle fan module, both of which are detachably connected to the chassis via bolts.

9. The 3U system architecture with a flip-and-lock-free structure as described in claim 1, characterized in that, The PCIe module includes a PCIe bracket, a RISER card, an FHHL PCIe card, and a locking bracket. The RISER card is fixedly connected to the PCIe bracket. The FHHL PCIe card is inserted into the bayonet window of the PCIe bracket. The locking bracket is fixedly connected to both the PCIe bracket and the FHHL PCIe card, and is used to lock the FHHL PCIe card onto the PCIe bracket.

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