Integrated liquid cooling heat dissipation system for commercial aerospace server

Abstract

The application discloses an integrated liquid cooling heat dissipation system for a commercial spaceflight server, which comprises a control module, a core heat exchange module, a pump-driven two-phase circulation module, an integrated radiation heat dissipation wing module, a phase change heat buffer module, an intelligent temperature control module, a thermal expansion compensation module and a redundancy guarantee module, and each module cooperatively realizes stable heat dissipation under a spaceflight environment; the control module is mainly an anti-radiation reinforced MCU chip, the circuit of the control module adopts three-mode redundant logic, ECC error correction coding and power isolation current limiting design, software integrated instruction flow verification, fault self-checking and safety mode switching; the core heat exchange module is a three-dimensional micro-channel cold plate array, which adopts a chip-level direct bonding structure to cover the whole heat source of the server. The application has reasonable design, can realize high heat flow dredging, full working condition self-adaptation, lightweight and high reliability, and meets the long-term on-orbit safe working requirement of the server on the star.

Description

Technical Field

[0001] This invention relates to the field of aerospace thermal control technology, and in particular to an integrated liquid cooling system for commercial aerospace servers. Background Technology

[0002] "Commercial space servers" do not refer to ordinary servers used at Earth launch sites, but rather to specialized computing devices that operate in space orbit, namely "space servers." These are computing units deployed on satellites to process massive amounts of data in orbit, rather than simply acting as "pipelines" for data relay. They enable "space-based computing," extending computing power directly to the source of data and moving data centers into space, aiming to solve the energy and heat dissipation bottlenecks faced by ground-based data centers.

[0003] With the development of aerospace technology, the power density of spacecraft payloads continues to increase, and the demands for thermal management are becoming increasingly stringent. The aerospace environment has significant unique characteristics: high-energy particle radiation in space can easily cause electronic components to fail; orbital temperatures range from -180℃ to +130℃, and phase / temperature changes in coolants (especially liquid metals) cause drastic volume changes, easily leading to pipe bursts; furthermore, physical repairs are impossible after launch, and a single point of failure can lead to the failure of the entire mission. Existing ground-based liquid cooling systems rely on natural convection, conventional sealing structures, and commercially available components, which cannot cope with the extreme aerospace environment. Traditional aerospace heat dissipation solutions suffer from insufficient radiation resistance, inadequate thermal expansion and contraction compensation, and a lack of reliability redundancy design, making it difficult to meet the requirements of long-life, zero-failure on-orbit operation. Therefore, we propose an integrated liquid cooling system for commercial aerospace servers to address these issues. Summary of the Invention

[0004] The purpose of this invention is to solve the problems existing in the prior art and to propose an integrated liquid cooling heat dissipation system for commercial aerospace servers, which can achieve high heat flow conduction, full-condition self-adaptation, lightweight and high reliability, and meet the long-term on-orbit safe operation requirements of on-board servers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An integrated liquid cooling system for commercial aerospace servers includes a control module, a core heat exchange module, a pump-driven two-phase circulation module, an integrated radiative heat dissipation fin module, a phase change heat buffer module, an intelligent temperature control module, a thermal expansion compensation module, and a redundancy protection module. The modules work together to achieve stable heat dissipation in aerospace environments. The core of the control module is a radiation-hardened MCU chip. The circuit of the control module adopts triple-modular redundancy logic, ECC error correction coding and power isolation current limiting design. The software integrates instruction stream verification, fault self-test and safe mode switching. The core heat exchange module is a three-dimensional microchannel cold plate array, which adopts a chip-level direct-attach structure to cover the entire heat source of the server. The pump-driven two-phase circulation module is driven by aerospace-grade fluorinated liquid working fluid and dual redundant pumps. The integrated radiative heat dissipation wing module adopts a high emissivity coating and a capillary-reinforced condensation structure. The phase change heat buffer module uses a 45℃ composite phase change material; The intelligent temperature control module uses dual-backup temperature measurement and MPC+PID composite algorithm to achieve multi-condition adaptive control. The thermal expansion compensation module includes an expansion buffer assembly, a flexible structure, and an over-temperature and over-pressure protection unit. The redundancy protection module adopts a multi-dimensional redundancy design, including dual pump redundancy, dual circuit redundancy, heater cold backup, temperature measurement point dual backup, triple sealing structure, leakage detection and alarm, and overheat and overcurrent protection, to achieve no single point of failure in the entire link.

[0006] Preferably, in the control module, the MCU chip adopts silicon-on-insulator or bulk silicon hardening process, and the control unit is provided with a 2-5mm thick Al / Ti alloy shielding layer. The software of the control unit integrates a key variable redundant storage and periodic readback verification module, which can realize automatic reset of abnormal state during fault self-test.

[0007] Preferably, in the core heat exchange module, the three-dimensional microchannel cold plate is made of lightweight composite material of aluminum-silicon alloy or titanium alloy. The cold plate has three-dimensional cross microchannels etched inside and a nano-graphene thermal conductive layer coated on the surface. Liquid metal thermal interface material is filled between the cold plate and the chip to eliminate air gap thermal resistance. The cold plate adopts a partitioned independent liquid supply design, corresponding to the server motherboard CPU, GPU, memory, and power module to achieve precise heat dissipation of heat sources. The interface is configured with double-sealed quick-connect and leakage guide groove.

[0008] Preferably, the pump-driven two-phase circulation module is equipped with dual redundant micro pumps, which automatically switch over in 0.5s faults, and the key computing unit adopts A / B dual-loop isolation, with the faulty branch cut off within 2s.

[0009] Preferably, in the integrated radiative heat dissipation wing module, the radiative heat dissipation wing is a deployable lightweight truss, with a high emissivity carbon nanotube coating sprayed on the surface, and the condensation end adopts a capillary reinforcement structure to adapt to the microgravity environment and avoid air blockage. It is externally covered with a 10-unit multi-layer heat insulation component and has a permanent sun-facing layout.

[0010] Preferably, the phase change module adopts a composite structure of composite paraffin and metal foam, with a phase change point of 45℃ and a phase change enthalpy of ≥260kJ / kg.

[0011] Preferably, the intelligent temperature control module has multiple sensors evenly arranged on the surface of the cold plate, the back of the chip, and the inlet and outlet positions of the pipeline, which collect temperature data of key points of the system in real time from all directions. Combined with the track β angle, load power and different working modes such as transmission, standby, full computing power and track control, it automatically switches the appropriate heat dissipation and heat replenishment strategies to achieve adaptive temperature control in all scenarios.

[0012] Preferably, the expansion buffer assembly is a pneumatic expansion tank or a piston accumulator with a volume compensation margin of ≥15%. The flexible structure includes a bellows compensation section and a metal hose. The over-temperature and over-pressure protection unit integrates multi-level redundant safety valves, overflow valves, and rupture diaphragms.

[0013] Preferably, the redundancy protection module integrates a fault diagnosis system, supporting autonomous isolation of faulty components, automatic activation of redundant channels, and sensorless fault-tolerant operation.

[0014] Compared with the prior art, the beneficial effects of this invention are as follows: 1. This commercial aerospace server uses an integrated liquid cooling system. The control module adopts a radiation-hardened MCU chip + Al / Ti alloy shielding layer for dual hardware protection. Combined with tri-mode redundancy circuit and ECC error correction coding, it can withstand a radiation dose of ≥100kRad(Si) to ensure the stable operation of the core control logic in a strong radiation environment.

[0015] 2. This integrated liquid cooling system for commercial aerospace servers achieves ultra-low thermal resistance (≤0.02℃ / W) through the synergistic design of a three-dimensional microchannel cold plate, a nano-graphene thermal conductive layer, and liquid metal thermal interface materials. Combined with a pump-driven two-phase circulation and a high-emissivity deployable radiating fin, the heat dissipation power is increased by 8 to 10 times compared to traditional air cooling. It eliminates the dependence of ground-based liquid cooling systems on natural convection and solves the bottleneck of heat dissipation under high-density heat loads in vacuum and microgravity environments. Furthermore, the system adopts lightweight composite materials such as aluminum-silicon alloy and titanium alloy and an integrated design, reducing the weight by 25% to 35% compared to traditional liquid cooling solutions, thereby reducing launch payload costs.

[0016] 3. This commercial aerospace server uses an integrated liquid cooling system. The thermal expansion compensation module, through expansion buffer components, bellows compensation sections, and flexible structures, comprehensively absorbs the thermal expansion and contraction deformation of the working fluid and pipeline assembly deviations. Combined with multi-level over-temperature and over-pressure protection units, it controls system pressure fluctuations within ±5%, solving the pipeline cracking risk caused by insufficient thermal expansion and contraction compensation in traditional solutions. Furthermore, the system adopts a multi-dimensional redundancy design, coupled with autonomous fault diagnosis and fault component isolation functions, to completely eliminate single-point fault risks and meet the on-orbit operation requirements of "long life and zero failure" for aerospace missions. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the structure of an integrated liquid cooling system for commercial aerospace servers proposed in this invention; Figure 2 This is a schematic diagram illustrating the working process of an integrated liquid cooling system for commercial aerospace servers proposed in this invention. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] Reference Figures 1-2 An integrated liquid cooling system for commercial aerospace servers includes a control module, a core heat exchange module, a pump-driven two-phase circulation module, an integrated radiative heat dissipation fin module, a phase change heat buffer module, an intelligent temperature control module, a thermal expansion compensation module, and a redundancy protection module. The modules work together to achieve stable heat dissipation in aerospace environments.

[0020] The core of the control module is a radiation-hardened MCU chip. The MCU chip adopts silicon-on-insulator or bulk silicon hardening technology, which has excellent radiation resistance and adaptability to harsh working conditions. It can effectively resist the influence of extreme environments such as space radiation and electromagnetic interference, and ensure the stable operation of the core computing logic. At the same time, the control module is equipped with a 2-5mm thick Al / Ti alloy shielding layer. The metal shielding further blocks external radiation and electromagnetic interference, forming a hardware-level double protection and strengthening the overall radiation resistance and anti-interference capability. The control module circuit adopts triple redundancy logic, ECC error correction coding and power isolation current limiting design. The triple redundancy logic realizes the fault-tolerant operation of the core circuit. Even if a single circuit fails, the voting mechanism can still ensure the normal output of control commands and prevent system failure. ECC error correction coding can detect and correct errors in the data transmission and storage process in real time to avoid data distortion causing control abnormalities. The power isolation current limiting design can effectively block external circuit surges and overcurrent interference and prevent power-side fault backflow from damaging the core chip, thereby comprehensively improving the safety and stability of the hardware circuit. The software integrates instruction stream verification, fault self-checking, and safe mode switching. The control module integrates key variable redundant storage and periodic readback verification modules to ensure that core control data is not lost or tampered with, and to maintain the accuracy of control parameters. The fault self-checking unit can monitor the system's operating status in real time, identify abnormal hardware and software states, and automatically reset the abnormal state when a fault is detected, quickly restoring normal operation. The safe mode switching unit automatically switches to a preset safe operating mode when a serious fault occurs in the system, preventing the fault from escalating and ensuring the operational safety of the entire heat dissipation system and controlled equipment.

[0021] The core heat exchange module is a three-dimensional microchannel cold plate array, which adopts a chip-level direct-attach structure to cover the entire heat source of the server. The three-dimensional microchannel cold plate is made of lightweight composite material of aluminum-silicon alloy or titanium alloy. The cold plate has three-dimensional cross-channels etched inside and a nano-graphene thermal conductive layer coated on the surface. The width of the microchannel is 0.2-0.5mm, the depth is 0.3-0.8mm, and the spacing is 0.3mm. The extremely small channel size and cross-arrangement structure can significantly increase the heat exchange area, enhance fluid disturbance, and significantly improve heat exchange efficiency. The thickness of the nano-graphene thermal conductive layer is 5-10μm, and the thermal conductivity is ≥450W / (m・K). Relying on the ultra-high thermal conductivity of graphene, the heat transfer speed from the heat source to the cold plate substrate is further accelerated, breaking the interface heat exchange bottleneck. Liquid metal thermal interface material is filled between the cold plate and the chip to eliminate the thermal resistance of the air gap. The melting point of the liquid metal thermal interface material is ≤10℃ and the thermal conductivity is ≥80W / (m・K). At the same time, the bonding pressure between the cold plate and the chip is strictly controlled at 0.3~0.5MPa to ensure full bonding of the interface. Ultimately, the overall thermal resistance between the cold plate and the chip is ≤0.02℃ / W, achieving ultra-low resistance and high-efficiency heat transfer.

[0022] In addition, the cold plate adopts a zoned independent liquid supply design, corresponding to the server motherboard CPU, GPU, memory, and power module respectively. It can precisely adjust the liquid supply and heat exchange intensity according to the heating characteristics of each heat source to achieve precise heat dissipation. The interface is equipped with a double-sealed quick-connect and a leakage guide groove. The double-sealed structure greatly improves the sealing reliability of the interface and effectively prevents the working fluid from leaking. The leakage guide groove can guide the leaked working fluid in time in the event of extreme sealing failure, avoiding leakage to server components and causing short circuit failure, thus ensuring the safe operation of the equipment.

[0023] The pump-driven two-phase circulation module uses aerospace-grade fluorinated liquid working fluid and dual redundant pumps. This working fluid has dielectric properties, a low freezing point, and vacuum compatibility, making it suitable for extreme server operating conditions. It achieves efficient, phase-change-free heat transfer and safe electrical isolation. The pump-driven two-phase circulation module is equipped with dual redundant micro pumps with automatic fault switching in 0.5 seconds to ensure uninterrupted circulation power supply. At the same time, it adopts a fishbone-type parallel distributor and a Venturi flow balancing structure. Through fluid dynamics optimization, it precisely controls the flow of each branch, strictly controlling the branch flow deviation within 5%, ensuring the uniformity and consistency of heat exchange in each heat source unit. The critical computing unit adopts A / B dual-loop isolation, and the faulty branch is cut off within 2 seconds. When any loop fails, the system can quickly cut off the faulty branch within 2 seconds to prevent the spread of thermal runaway and ensure the continuous and stable heat dissipation of the core computing unit, further enhancing the fault resistance and safety of the entire heat dissipation system.

[0024] The integrated radiating heat dissipation wing module employs a high-emissivity coating and a capillary-reinforced condensation structure. The radiating heat dissipation wing is a deployable, lightweight truss that balances the need for compact space during launch with the requirement for a large heat dissipation area after launch. Its surface is coated with a high-emissivity carbon nanotube coating with an emissivity ε≥0.95, ensuring that the radiating wing can release internal heat to the near-absolute-zero deep-space environment in the form of infrared radiation with maximum efficiency. To address the critical issue of bubble formation and airlock in two-phase flow under microgravity, a capillary-reinforced structure is used at the condensation end. This structure utilizes capillary force to actively drive the condensate recirculation, ensuring that the working fluid can still stably complete the phase change cycle and maintain efficient heat exchange even without gravity assistance. The radiating wing is externally encased in a 10-unit multi-layer thermal insulation component, providing protection against atomic oxygen, ultraviolet radiation, and space debris. The radiating wing adopts a permanently sun-facing layout, which maximizes the temperature difference between the deep-space cold background and the surface of the radiating wing by continuously keeping it away from the direct sunlight. This maximizes heat dissipation efficiency without consuming any active energy, thus creating a passive safety terminal for the server thermal management system.

[0025] The phase change heat buffer module uses a 45℃ composite phase change material. The core adopts a composite structure of composite paraffin and metal foam. The phase change point is 45℃, and the phase change enthalpy is ≥260kJ / kg. It relies on the high latent heat characteristics to achieve efficient heat storage and release, taking into account both heat buffer performance and structural stability. The composite paraffin, as the core phase change substrate, can complete the solid-liquid phase change process at a constant temperature of 45℃, efficiently absorbing or releasing a large amount of heat. The metal foam is embedded in the composite paraffin and quickly absorbs transient high heat through the phase change process, effectively suppressing the transient overheating problem of the chip and heat exchange circuit, maintaining a constant temperature in the heat source area, and smoothing heat load fluctuations. This reduces the start-up and shutdown and frequent speed adjustment of the pump-driven two-phase circulation module caused by sudden changes in heat load, significantly reducing the power consumption fluctuation of the circulation pump, improving the operational stability and energy efficiency of the entire thermal management system, and realizing the synergistic cooperation between passive heat peak control and active heat dissipation system.

[0026] The intelligent temperature control module employs dual-backup temperature measurement and an MPC+PID composite algorithm to achieve adaptive control under multiple operating conditions. The temperature measurement stage features dual-backup temperature measurement nodes (MF501 and DS18B20) paired with NTC thermistors with an accuracy of ±0.1℃. Multiple sensors are evenly distributed on the surface of the cold plate, the back of the chip, and at the inlet and outlet of the pipelines, comprehensively collecting real-time temperature data from key system points to eliminate measurement failures and data deviations. The module incorporates pressure and flow sensors to monitor system operating status in real-time, including pipeline pressure and working fluid flow. Combined with track β angle, load power, and different operating modes such as transmit, standby, full computing power, and track control, it automatically switches to appropriate heat dissipation and heat replenishment strategies to achieve adaptive temperature control across all scenarios.

[0027] The thermal expansion compensation module includes an expansion buffer assembly, a flexible structure, and an over-temperature and over-pressure protection unit. It comprehensively adapts to the thermal expansion and contraction deformation of the working fluid, taking into account both system pressure stability and safety protection under extreme conditions, ensuring the long-term reliable operation of the thermal management loop. The expansion buffer assembly is either a bladder-type expansion tank or a piston-type accumulator, with a reserved volume compensation margin of ≥15%. It can fully absorb the volume changes caused by the thermal expansion and contraction of the working fluid, maintaining the internal volume balance of the loop. The bladder-type expansion tank adopts an N2 or Ar inert gas back pressure design to isolate the working fluid from the outside air, preventing oxidation and deterioration of the working fluid, while ensuring stable buffer pressure. The piston-type accumulator has high-precision volume adjustment capability, with a volume adjustment accuracy of ±1%, accurately matching the working fluid volume fluctuation requirements of the loop. The flexible structure includes a corrugated pipe compensation section and a metal hose. The corrugated pipe compensation section has an axial displacement absorption capacity of ≥10mm, effectively absorbing axial and radial deformations caused by thermal expansion and contraction and assembly deviations, eliminating thermal stress, and preventing pipe cracking and leakage. The metal hose possesses excellent flexibility and pressure-bearing performance, adapting to complex pipeline layouts and further enhancing deformation compensation capabilities. The over-temperature and over-pressure protection unit integrates multi-stage redundant safety valves, relief valves, and rupture diaphragms to construct a multi-level safety protection system. It can strictly control system pressure fluctuations within ±5%, avoiding sudden pressure rises and falls that could affect loop stability. When the system experiences over-temperature or over-pressure anomalies, the multi-stage protection components activate step by step to release pressure, quickly restoring normal operating conditions and eliminating the risk of pipe bursts and working fluid leakage.

[0028] The redundancy protection module adopts a multi-dimensional redundancy design, covering all aspects of system operation, completely eliminating the risk of single-point failure, and building a highly reliable and fault-tolerant thermal management system protection system to achieve stable and uninterrupted operation of the entire link. This includes dual pump redundancy, dual circuit redundancy, heater cold backup, dual backup of temperature measurement points, and a triple sealing structure. It also integrates leakage detection and alarm, overheat and overcurrent protection, achieving zero single-point failure in the entire link. The drive pump redundancy adopts a 1 main and 1 backup or dual active parallel structure, and the sensor redundancy adopts median or mean value decision logic to ensure that the system function is uninterrupted and the data acquisition is accurate when a single component fails. The triple sealing structure, combined with metal seals or welded seals, eliminates the risk of working fluid leakage from the structural level, further improving the system's airtightness and reliability.

[0029] The redundancy protection module has a built-in dedicated fault diagnosis system that supports autonomous isolation of faulty components, automatic activation of redundant channels, and sensorless fault-tolerant operation. It has a strong autonomous fault handling capability, can monitor the operating status of all system components in real time, accurately identify fault locations, realize autonomous isolation of faulty components, and automatic and rapid activation of redundant channels. At the same time, it supports sensorless fault-tolerant operation. Even in extreme cases such as sensor failure, it can still maintain the basic temperature control and heat dissipation functions of the system, ensuring that the core computing power equipment is not affected by faults and can continue to work safely and stably.

[0030] The functional principle of this invention can be further explained through the following steps: Step 1: System Startup and Initialization Calibration After the system is powered on, the control module activates the anti-radiation hardware protection (Al / Ti alloy shielding layer + triple redundancy circuit) and the software verification mechanism (ECC error correction + instruction flow verification). The intelligent temperature control module activates the MF501 / DS18B20 dual backup temperature measurement nodes and pressure / flow sensors to complete full-point data calibration (temperature measurement accuracy ±0.1℃). The pump-driven two-phase circulation module starts the dual redundant pumps to establish the initial working fluid circulation (branch flow deviation ≤5%), and the core heat exchange module's three-dimensional microchannel cold plate is bonded to the chip (pressure 0.3~0.5MPa). In the integrated radiative heat dissipation wing module, the radiative wings are deployed and locked in a back-sun layout (emissivity ε≥0.95). The phase change heat buffer module and the redundancy protection module complete self-tests and enter standby mode. The thermal expansion compensation module initializes the expansion buffer component (with a reserved volume margin of ≥15%) and the flexible structure, and establishes the initial loop pressure (fluctuation ≤±5%).

[0031] Step 2: Real-time identification of multiple operating conditions The sensor matrix continuously collects key data: server load power, chip temperature, pipeline temperature / pressure / flow, track β angle, and ambient temperature. Intelligent determination of operating conditions based on data features: Launch conditions: Sudden increase in load power (≥50% / s) + triggering by vibration and shock signals; Standby condition: Load power ≤ 30% of rated value + chip temperature ≤ 40℃ (for 30 seconds); Full computing power operation: Load power ≥ 80% of rated value + chip temperature ≥ 55℃ (lasting 10s); Low temperature operation: Ambient temperature ≤ -50℃ + chip temperature ≤ 35℃ (for 20 seconds); Track control conditions: Load power fluctuation ±20% / min + dynamic change of track β angle.

[0032] Step 3: Main heat dissipation circuit operation (basic full-condition operation) Chip heat conduction: Core chips such as CPU / GPU generate heat during operation, and the heat is transferred to the microchannel cold plate through liquid metal thermal interface material (thermal conductivity ≥80W / (m・K)) and nano-graphene thermal conductive layer (thermal conductivity ≥450W / (m・K)); Cold plate heat absorption and heat exchange: 0.2-0.5mm narrow channel enhances heat exchange, the working fluid (aerospace-grade fluorinated liquid) forms a two-phase flow, efficiently absorbing heat (thermal resistance between cold plate and chip ≤0.02℃ / W). Working fluid circulation and delivery: Dual redundant pumps drive the flow of the working fluid, which is then balanced by a herringbone-shaped distributor and delivered to the radiant heat dissipation fins. Radiation-induced condensation: The radiation wing eliminates microgravity blockage through a capillary-enhanced condensation structure. The high-emissivity coating radiates heat into deep space, and the working fluid condenses and flows back to the cold plate, completing a closed-loop cycle.

[0033] Step 4: Full-condition adaptive control Standby operating condition control: The pump-driven two-phase circulation module reduces the pump speed and adjusts the working fluid flow rate to 40%–60% of the rated value. The core heat exchange module shuts down the non-critical heat source liquid supply channels to reduce ineffective heat dissipation; The phase change heat buffer module stores redundant heat to prevent the system temperature from getting too low.

[0034] Full computing power operation mode control: The pump-driven two-phase circulation module starts up with both pumps running at full power, enhancing two-phase flow heat exchange; The core heat exchange module activates full-zone liquid supply to maximize heat exchange intensity; The radiant fins are fully open for radiant heat dissipation, and the intelligent temperature control module maintains the chip temperature at 60℃±1.5℃ through a two-stage closed-loop system (pump speed + system pressure).

[0035] High-temperature operating conditions (derived from full computing power operating conditions) control: The radiating fins maintain full-load heat dissipation, and multi-layer thermal insulation components resist external thermal interference; The intelligent temperature control module reduces system pressure, precisely controls the boiling point of the working fluid, and suppresses temperature rise.

[0036] Low-temperature operating condition control: Primary heating: Activate the heater for cold backup to raise the chip temperature to 40°C; Secondary heat replenishment: preheating the circulating working fluid to maintain the system temperature at 38℃~45℃; Reduce pump speed and liquid supply, and close non-critical heat source liquid supply channels to reduce heat loss.

[0037] Launch / orbit control condition regulation: Launch conditions: The pump maintains a moderate flow rate, the phase change module absorbs transient thermal shock, and the thermal expansion compensation module enhances pipeline deformation absorption; Track control operation: MPC+PID composite algorithm predicts and corrects heat load fluctuations, phase change module smooths temperature changes, ensuring 24-hour fluctuation ≤ ±1℃.

[0038] Step 5: Thermal buffering and temperature stabilization The phase change heat buffer module monitors the chip temperature fluctuation in real time. When the rate of change is ≥0.5℃ / s, it quickly absorbs / releases heat (phase change enthalpy ≥260kJ / kg). Smooth temperature fluctuations caused by sudden load increases and operating condition changes, ensuring that the fluctuation is ≤±1℃ within 24 hours; The auxiliary intelligent temperature control module adjusts and regulates parameters, reducing the frequent start-stop of pumps and heaters and improving system energy efficiency.

[0039] Step 6: Fault Redundancy Assurance and Handling Real-time fault monitoring: The redundancy protection module identifies problems such as pump failure, loop leakage, and sensor failure through four-dimensional monitoring of "temperature-pressure-flow-leakage"; Automatic switching of redundant units: Single pump failure: Switch to standby pump within 0.5s, and the flow balancing structure compensates for the deviation; Circuit leakage: Cut off the faulty circuit within 2 seconds, start the backup dual circuit, and divert the working fluid through the leakage diversion channel; Sensor failure: Sensorless fault-tolerant logic + median decision is used to maintain system operation; Stability after fault: The phase change module maintains a stable temperature during switching, and the system automatically returns to normal parameters after the fault is cleared, ensuring uninterrupted heat dissipation.

[0040] Step 7: System shutdown Normal shutdown: Switch to standby mode as instructed, gradually reduce pump speed, release redundant heat from phase change module, and continuously dissipate heat from radiant fins until chip temperature ≤40℃, then shut down the system; Emergency shutdown: In case of extreme failure (dual pump failure, large-area leakage), the heat source input is cut off, and the radiant fins passively dissipate heat until the temperature is ≤40℃ to ensure equipment safety.

[0041] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An integrated liquid cooling system for commercial aerospace servers, characterized in that, It includes a control module, a core heat exchange module, a pump-driven two-phase circulation module, an integrated radiative heat dissipation fin module, a phase change heat buffer module, an intelligent temperature control module, a thermal expansion compensation module, and a redundancy protection module. All modules work together to achieve stable heat dissipation in aerospace environments. The core of the control module is a radiation-hardened MCU chip. The circuit of the control module adopts triple-modular redundancy logic, ECC error correction coding and power isolation current limiting design. The software integrates instruction stream verification, fault self-test and safe mode switching. The core heat exchange module is a three-dimensional microchannel cold plate array, which adopts a chip-level direct-attach structure to cover the entire heat source of the server. The pump-driven two-phase circulation module is driven by aerospace-grade fluorinated liquid working fluid and dual redundant pumps. The integrated radiative heat dissipation wing module adopts a high emissivity coating and a capillary-reinforced condensation structure. The phase change heat buffer module uses a 45℃ composite phase change material; The intelligent temperature control module uses dual-backup temperature measurement and MPC+PID composite algorithm to achieve multi-condition adaptive control. The thermal expansion compensation module includes an expansion buffer assembly, a flexible structure, and an over-temperature and over-pressure protection unit. The redundancy protection module adopts a multi-dimensional redundancy design, including dual pump redundancy, dual circuit redundancy, heater cold backup, temperature measurement point dual backup, triple sealing structure, leakage detection and alarm, and overheat and overcurrent protection, to achieve no single point of failure in the entire link.

2. The integrated liquid cooling system for commercial aerospace servers according to claim 1, characterized in that, In the control module, the MCU chip adopts silicon-on-insulator or bulk silicon hardening process, and the control unit is externally provided with a 2-5mm thick Al / Ti alloy shielding layer. The software of the control unit integrates a key variable redundant storage and periodic readback verification module, and can realize automatic reset of abnormal state during fault self-test.

3. The integrated liquid cooling system for commercial aerospace servers according to claim 1, characterized in that, In the core heat exchange module, the three-dimensional microchannel cold plate is made of lightweight composite material of aluminum-silicon alloy or titanium alloy. The cold plate has three-dimensional cross microchannels etched inside and a nano-graphene thermal conductive layer coated on the surface. Liquid metal thermal interface material is filled between the cold plate and the chip to eliminate air gap thermal resistance. The cold plate adopts a partitioned independent liquid supply design, corresponding to the server motherboard CPU, GPU, memory, and power module to achieve precise heat dissipation of heat sources. The interface is configured with double-sealed quick-connect and leakage guide groove.

4. The integrated liquid cooling system for commercial aerospace servers according to claim 1, characterized in that, The pump-driven two-phase circulation module is equipped with dual redundant micro pumps, which automatically switch over in 0.5s faults. The key computing unit adopts A / B dual-loop isolation, and the faulty branch is cut off within 2s.

5. The integrated liquid cooling system for commercial aerospace servers according to claim 1, characterized in that, In the integrated radiative heat dissipation wing module, the radiative heat dissipation wing is a deployable lightweight truss with a high emissivity carbon nanotube coating on the surface. The condensation end adopts a capillary-reinforced structure to adapt to the microgravity environment and avoid air blockage. It is externally covered with a 10-unit multi-layer heat insulation component and has a permanent sun-facing layout.

6. The integrated liquid cooling system for commercial aerospace servers according to claim 1, characterized in that, The phase change module adopts a composite structure of composite paraffin and metal foam, with a phase change point of 45℃ and a phase change enthalpy of ≥260kJ / kg.

7. The integrated liquid cooling system for commercial aerospace servers according to claim 1, characterized in that, The intelligent temperature control module has multiple sensors evenly distributed on the surface of the cold plate, the back of the chip, and the inlet and outlet positions of the pipeline. It collects temperature data of key points of the system in real time from all directions. Combined with the track β angle, load power, and different working modes such as transmission, standby, full computing power, and track control, it automatically switches the appropriate heat dissipation and heat replenishment strategies to achieve adaptive temperature control in all scenarios.

8. The integrated liquid cooling system for commercial aerospace servers according to claim 1, characterized in that, The expansion buffer assembly is a pneumatic expansion tank or a piston accumulator with a volume compensation margin of ≥15%. The flexible structure includes a bellows compensation section and a metal hose. The over-temperature and over-pressure protection unit integrates multi-level redundant safety valves, overflow valves, and rupture diaphragms.

9. The integrated liquid cooling system for commercial aerospace servers according to claim 1, characterized in that, The redundancy protection module integrates a fault diagnosis system, supporting autonomous isolation of faulty components, automatic activation of redundant channels, and sensorless fault-tolerant operation.

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