A heat dissipation structure, a heat dissipation system and a manufacturing method thereof

Abstract

The application provides a heat dissipation structure, a heat dissipation system and a manufacturing method thereof. The heat dissipation structure comprises a framework, which forms a closed ring shape, an inner cavity is formed in the ring shape, and the framework has a flow channel extending along the ring shape; a first shell plate is arranged on a first side of the framework and is in sealed connection with the first side of the framework to cover a first side of the inner cavity and a first side of the flow channel; a second shell plate is arranged on a second side of the framework opposite to the first side and is in sealed connection with the second side of the framework to cover a second side of the inner cavity and a second side of the flow channel, so that the inner cavity forms a sealed cavity and the flow channel forms a sealed flow channel; and a capillary structure is arranged on an inner plate surface of at least one of the first shell plate and the second shell plate and on a cavity wall of the inner cavity. The application improves the heat exchange efficiency by arranging the flow channel on the outer periphery of the inner cavity of the framework and arranging the capillary structure on the cavity wall of the inner cavity.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology, and in particular relates to a heat dissipation structure, a heat dissipation system and a method for manufacturing the same. Background Technology

[0002] As laptops become more high-performance and thinner, the power consumption and heat generation of internal electronic components (such as central processing units and graphics processing units) have increased significantly. Traditional heat pipe cooling methods are insufficient to quickly and evenly dissipate the high heat flux density within a limited space, resulting in a bottleneck in heat dissipation efficiency.

[0003] Therefore, vapor chambers (VCs) with two-dimensional surface contact characteristics were proposed to achieve more efficient heat dissipation. However, for high-performance gaming laptops, while the VC, as the main heat dissipation component, performs its function to the fullest, it still cannot meet its heat dissipation requirements. How to further improve the heat dissipation performance of VCs is an urgent problem to be solved. Summary of the Invention

[0004] In view of the above-mentioned problems existing in the prior art, the purpose of this application is to provide a heat dissipation structure, heat dissipation system and manufacturing method with high heat dissipation efficiency.

[0005] The technical solution adopted in this application embodiment is a heat dissipation structure, comprising: A skeleton that forms a closed ring, with an inner cavity formed within the ring, and the skeleton having a flow channel extending along the ring; A first shell plate is disposed on the first side of the skeleton and is sealed to the first side of the skeleton to cover the first side of the inner cavity and the first side of the flow channel; The second shell plate is disposed on the second side of the skeleton opposite to the first side and is sealed to the second side of the skeleton to cover the second side of the inner cavity and the second side of the flow channel, so that the inner cavity forms a closed cavity and the flow channel forms a closed flow channel; Capillary structures are provided on the inner surface of at least one of the first shell plate and the second shell plate, and on the cavity wall of the inner cavity.

[0006] In an optional embodiment, the skeleton includes a surrounding plate and a flow channel plate. The surrounding plate forms a closed ring, and the flow channel plate is located outside the surrounding plate. Both ends of the flow channel plate are connected to the surrounding plate, and the flow channel is formed between the flow channel plate and the surrounding plate.

[0007] In an optional embodiment, the enclosure plate and the flow channel plate are an integral structure; and / or The heat dissipation structure also includes an inlet connector and an outlet connector that are respectively connected to the flow channel. The inlet connector is located near the first end of the flow channel, and the outlet connector is located near the second end of the flow channel.

[0008] In an optional embodiment, the inlet connector and the outlet connector are integrated on the same connector seat, and a flow guide groove is provided in the second shell plate. The first end of the flow guide groove is connected to the second end of the flow channel; the outlet connector is connected to the second end of the flow guide groove; and the inlet connector is connected to the first end of the flow channel.

[0009] In an optional embodiment, the dimension of the flow channel, which is perpendicular to its extension direction and parallel to the surfaces of the first and second shell plates, is 3mm-4mm.

[0010] In an optional embodiment, the outer contour of the skeleton is T-shaped and includes a vertical portion and a horizontal portion. The horizontal portion includes a first horizontal portion and a second horizontal portion located on opposite sides of one end of the vertical portion; and / or The first horizontal portion and the second horizontal portion have the same dimensions in the horizontal direction; the vertical portion has a larger dimension in the vertical direction than the first horizontal portion in the horizontal direction; the vertical portion has a larger dimension in the horizontal direction than the first horizontal portion in the horizontal direction.

[0011] In an optional embodiment, the heat dissipation structure further includes a capillary mesh, which is laid on the inner surface of the first shell plate. The periphery of the capillary mesh is bent to form a folded edge that adheres to the cavity wall of the inner cavity. The folded edge is sintered with the copper powder filling the cavity wall to form a capillary structure on the cavity wall.

[0012] A heat dissipation system includes a water tank, a water pump, a radiator, a fan, and a heat dissipation structure according to any one of claims 1 to 7; the inlet of the water pump is connected to the water tank, the outlet of the water pump is connected to the liquid inlet of the heat dissipation structure, and the water pump is used to pump liquid in the water tank into the flow channel; the radiator is disposed on the outer surface of the heat dissipation structure and is in contact with the heat dissipation structure, and the fan is disposed adjacent to the radiator and is used to drive airflow through the radiator to remove heat from the radiator.

[0013] A method for manufacturing a heat dissipation structure includes: A skeleton is fabricated, forming an inner cavity and a flow channel extending along the outer periphery of the inner cavity; A first shell plate is provided on the first side of the skeleton to cover the first side of the inner cavity and the first side of the flow channel; The capillary mesh substrate is cut and stamped according to the inner contour dimensions of the cavity to obtain the initial mesh sheet; The initial mesh is pressed into the inner cavity using a sintering fixture adapted to the inner contour of the inner cavity. The periphery of the initial mesh is bent to form a folded edge, which is located between the outer periphery of the sintering fixture and the cavity wall of the inner cavity. Copper powder is filled between the folded edge and the cavity wall of the inner cavity. After sintering, the sintering fixture is removed. The initial mesh is sintered on the inner plate surface of the first shell plate and the cavity wall of the inner cavity to form a capillary structure layer. A capillary layer is formed on one side of the second shell plate, and the second shell plate is sealed to the second side of the inner cavity and the second side of the flow channel with the capillary layer thereon facing the inner cavity.

[0014] In an optional embodiment, a connector seat integrating an inlet connector and an outlet connector is provided on the second shell plate, a flow guide groove is provided inside the second shell plate, and the first end of the flow guide groove is connected to the second end of the flow channel, the outlet connector is connected to the second end of the flow guide groove, and the inlet connector is connected to the first end of the flow channel.

[0015] Compared with the prior art, the beneficial effects of the embodiments of this application are as follows: By setting a flow channel around the inner cavity on the skeleton and setting a capillary structure on the cavity wall of the inner cavity surrounded by the skeleton, an effective heat transfer area is formed near the cavity wall in the inner cavity. The flow channel is equivalent to the condensation end. The heat transfer medium in the inner cavity and the heat transfer medium in the flow channel exchange heat here. After the water vapor at the cavity wall of the inner cavity condenses, it flows to the evaporation end (heat source) with the capillary structure, which greatly increases the heat exchange efficiency of the inner cavity and the flow channel. The heat of the heat source is carried out of the system by the heat transfer medium in the flow channel, which greatly improves the heat dissipation capacity of the heat dissipation structure.

[0016] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and are not intended to limit this application.

[0017] The overview of various implementations or examples of the technology described in this application is not a full disclosure of the entire scope or all features of the disclosed technology. Attached Figure Description

[0018] In drawings that are not necessarily drawn to scale, the same reference numerals may describe similar parts in different views. The drawings generally illustrate various embodiments by way of example rather than limitation and, together with the description and claims, serve to illustrate the claimed embodiments. Where appropriate, the same reference numerals are used in all drawings to refer to the same or similar parts.

[0019] Figure 1 This is a schematic diagram of the heat dissipation structure according to an embodiment of this application.

[0020] Figure 2 for Figure 1 Enlarged view of part A in the middle.

[0021] Figure 3 This is a schematic diagram of the skeleton of an embodiment of this application.

[0022] Figure 4 This is a schematic diagram of the structure of the initial mesh sheet after cutting and stamping according to an embodiment of this application.

[0023] Figure 5 This is a schematic diagram of the initial mesh sintered onto the first shell plate and the cavity wall of the inner cavity in an embodiment of this application.

[0024] Figure 6 This is a test state diagram of the heat dissipation structure according to an embodiment of this application, wherein the second shell plate is removed in order to show the flow channel.

[0025] Figure 7 This is a PQ curve diagram of the water flow in the flow channel in the heat dissipation structure of this application embodiment.

[0026] Figure 8 This is a graph showing the temperature of the heating block corresponding to the flow rate of water in the flow channel in the heat dissipation structure of this application embodiment.

[0027] Figure label: 1-Skeleton; 11-Inner cavity; 111-Cavity wall; 12-Flow channel; 13-Surrounding plate; 14-Flow channel plate; 2-First shell plate; 3-Second shell plate; 31-Guide channel; 4-Capillary web; 5-Inlet connector; 6-Discharge connector; 7-Connector base; 8-Heat dissipation fins. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the described embodiments of this application without creative effort are within the scope of protection of this application.

[0029] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0030] To keep the following description of the embodiments of this application clear and concise, detailed descriptions of known functions and known components are omitted.

[0031] This application provides a heat dissipation structure that can be applied to heat dissipation in, for example, laptops. Laptops may include gaming laptops and ultrabooks.

[0032] like Figures 1 to 6 As shown, the heat dissipation structure of this embodiment includes a frame 1, a first shell plate 2, a second shell plate 3, and a capillary structure. The frame 1 forms a closed ring, and an inner cavity 11 is formed within the ring. The frame 1 has a flow channel 12 extending along the ring, and a heat transfer medium flows within the flow channel 12. The first shell plate 2 and the second shell plate 3 are respectively disposed on opposite sides of the frame 1, and are used to simultaneously seal the inner cavity 11 and the flow channel 12 from opposite sides, making the inner cavity 11 and the flow channel 12 airtight. Specifically, the first shell plate 2 is disposed on the first side of the frame 1 and is sealed to the first side of the frame 1 to cover the first side of the inner cavity 11 and the first side of the flow channel 12. The second shell plate 3 is disposed on the second side of the frame 1 opposite to its first side and is sealed to the second side of the frame 1 to cover the second side of the inner cavity 11 and the second side of the flow channel 12, so that the inner cavity 11 forms a sealed cavity and the flow channel 12 forms a sealed flow channel 12. The capillary structure is provided on the inner plate surface of at least one of the first shell plate 2 and the second shell plate 3, and on the cavity wall 111 of the inner cavity 11.

[0033] The heat dissipation structure of this application embodiment provides a flow channel 12 surrounding the inner cavity 11 on the frame 1, and a capillary structure on the cavity wall 111 of the inner cavity 11 formed by the frame 1. The heat transfer medium at the cavity wall 111 in the inner cavity 11 exchanges heat with the heat transfer medium in the flow channel 12, making the flow channel 12 equivalent to the condensation end. After the water vapor at the cavity wall 111 of the inner cavity 11 condenses, it flows to the evaporation end (heat source) with the capillary structure, which greatly increases the heat exchange efficiency of the inner cavity 11 and the flow channel 12. The heat from the heat source is carried out of the system by the heat transfer medium in the flow channel 12, which greatly improves the heat dissipation capacity of the heat dissipation structure.

[0034] The heat dissipation structure of this application embodiment forms an innovative vapor chamber (VC) integrated annular liquid cooling system. When water is the preferred heat transfer medium, the annular liquid cooling system specifically refers to annular water cooling. One of the outer surfaces of the first shell plate 2 and the second shell plate 3 is in contact with the surface of the electronic component to be cooled, forming an evaporation surface, while the other outer surface forms a condensation surface. For ease of description, the following will use water as the heat transfer medium, the outer surface of the first shell plate 2 as the evaporation surface, and the outer surface of the second shell plate 3 as the condensation surface as an example.

[0035] This application embodiment includes a vapor chamber cooling structure with an annular water cooling channel, employing a sandwich-like structure. The middle layer is a structural frame 1, with a shell plate on each side, welded to the structural frame 1. The annular water channel (flow channel 12) is contained within the structural frame 1. The frame 1 can be manufactured from copper blocks using Computer Numerical Control (CNC) machining.

[0036] In one embodiment of this application, such as Figure 3 As shown, the skeleton 1 includes a surrounding plate 13 and a flow channel plate 14. The surrounding plate 13 forms a closed ring, and the flow channel plate 14 is located outside the surrounding plate 13, forming a flow channel 12 between the two. The two ends of the flow channel plate 14 are connected to the surrounding plate 13 to seal the two ends of the flow channel 12. The skeleton 1 has a simple and reasonable structure, is easy to form into a ring, lays the foundation for the subsequent formation of a closed inner cavity 11, and is also easy to form the flow channel 12.

[0037] In an optional embodiment, the enclosure plate 13 and the flow channel plate 14 can be an integral structure. The integral structure eliminates the possibility of fluid leakage by removing welds or seals; the absence of abrupt steps or gaps at the interface allows for smoother fluid flow and lower flow resistance; the overall stress is uniform, making it less prone to cracking due to pressure or vibration, resulting in high structural strength; it also reduces the number of parts, simplifies the assembly process, and lowers potential failure points.

[0038] In one embodiment of this application, such as Figure 1As shown, the heat dissipation structure also includes an inlet connector 5 and an outlet connector 6, which are respectively connected to the flow channel 12. The inlet connector 5 is located near the first end of the flow channel 12, and the outlet connector 6 is located near the second end of the flow channel 12. The heat transfer medium is introduced into the flow channel 12 from the first end through the inlet connector 5. The heat transfer medium absorbs heat from the inner cavity 11 in the flow channel 12 and flows to the second end of the flow channel 12, and finally flows out through the outlet connector 6, realizing the circulation of the heat transfer medium in the flow channel 12 to continuously remove heat from the inner cavity 11.

[0039] The inlet connector 5 and outlet connector 6 can be quick-connect couplings integrated on the same connector seat 7. These quick-connect couplings facilitate rapid installation or removal from external pipelines and utilize a built-in shut-off valve to automatically close when disconnected, preventing fluid leakage.

[0040] Continue to combine Figure 1 The connector seat 7 is fixed to the second shell plate 3. The second shell plate 3 has a guide groove 31. The first end of the guide groove 31 is connected to the second end of the flow channel 12. The liquid outlet connector 6 is connected to the second end of the guide groove 31, allowing the liquid outlet connector 6 to be indirectly connected to the second end of the flow channel 12 via the guide groove 31. The liquid inlet connector 5 is connected to the first end of the flow channel 12. By providing the guide groove 31 within the second shell plate 3, it is convenient to connect the liquid inlet connector 5 and the liquid outlet connector 6 integrated on the connector seat 7 to both ends of the flow channel 12, respectively.

[0041] For example, the guide channel 31 can be elongated. The guide channel 31 has a first end and a second end at its two ends along its length. The liquid outlet connector 6 is located at the connector seat 7 corresponding to the second end of the guide channel 31, and close to the first end of the flow channel 12. The liquid inlet connector 5 is located at the connector seat 7 corresponding to the first end of the flow channel 12. This ensures that the flow path of the heat transfer medium surrounds the entire outer periphery of the inner cavity 11 as much as possible, thereby improving heat exchange efficiency.

[0042] The width of the flow channel 12 is selected and determined according to the size of the shell plate and design requirements, and this application does not impose a specific limitation on it. The width of the flow channel 12 refers to its dimension in a direction perpendicular to its extension direction and parallel to the surfaces of the first shell plate 2 and the second shell plate 3. In one embodiment of this application, the width of the flow channel 12 can be 3mm-4mm.

[0043] The width of the flow channel 12 should be consistent throughout its extension direction to ensure uniform water flow velocity, more even heat dissipation, and no localized overheating hotspots. Furthermore, the heat exchange efficiency should be stable, unaffected by fluctuations in flow velocity. Additionally, the inner wall of the flow channel 12 should be smooth and flat to reduce flow resistance and ensure uniform working fluid velocity. The surface of the inner wall of the flow channel 12 should also have good hydrophilicity, facilitating the wetting and spreading of the working fluid and enhancing phase change heat transfer.

[0044] The shapes of the first shell plate 2 and the second shell plate 3 should be approximately consistent with the shape of the frame 1, and should be adapted to the surface shape of the electronic components to be cooled, so that the outer surface of the first shell plate 2 can cover and fit the surface of the electronic components to be cooled, achieving a good heat dissipation effect. In one embodiment of this application, when the heat dissipation structure of this application is applied to the CPU and GPU chips of a laptop computer, such as... Figure 3 As shown, the frame 1, first shell plate 2, and second shell plate 3 are all designed in a roughly T-shape. This shape is determined by the placement of the motherboard components; for example, in a high-performance gaming laptop, a high-performance CPU and GPU are indispensable. The vertical portion of the T-shape covers these two main chips. The horizontal portion of the T-shape, located on both sides of the vertical portion, houses the cooling fans and heat sinks. This allows the heat from the main chips to be transferred to the heat sinks, and the forced convection of the cooling fans blows the heat out of the system.

[0045] For example, continue to combine Figure 3 The frame 1 includes a vertical portion and a first horizontal portion and a second horizontal portion respectively located on opposite sides of one end of the vertical portion. The first horizontal portion and the second horizontal portion together with the vertical portion form a T-shape. The first horizontal portion has the same horizontal dimension L1 as the second horizontal portion and the same horizontal dimension L2 as the second horizontal portion. The vertical portion has a slightly larger horizontal dimension L3 than the first horizontal portion L1. The vertical portion has a slightly larger horizontal dimension L4 than the first horizontal portion L1.

[0046] For example, the dimensions L1 of the first transverse portion and L2 of the second transverse portion in the transverse direction are both 102.3 mm; the dimension L3 of the vertical portion in the vertical direction is 103 mm; and the dimension L4 of the vertical portion in the transverse direction is 114 mm.

[0047] The capillary structure can be formed by stamping a capillary mesh 4 (or mesh). The capillary structure on the cavity wall 111 (or sidewall) of the inner cavity 11 can be formed by sintering a copper capillary mesh 4 (or copper mesh) with copper powder filling the sidewall.

[0048] For example, the heat dissipation structure also includes a capillary mesh 4, which is laid on the inner surface of the first shell plate 2. The periphery of the capillary mesh 4 is bent in a direction away from the inner surface of the first shell plate 2 to form a folded edge that abuts against the cavity wall 111 of the inner cavity 11. The folded edge is sintered with the copper powder filled in the cavity wall 111 to form a capillary structure on the cavity wall 111.

[0049] This application lays the capillary mesh not only on the inner surface of the first shell plate 2, but also on the side wall of the inner cavity 11 to form a capillary structure on the side wall, transforming the originally ineffective heat transfer area at the edge of the inner cavity 11 into an effective phase change heat transfer area, which will greatly increase the heat exchange between the flow channel 12 and the inner cavity 11.

[0050] This application also provides a heat dissipation system. The heat dissipation system includes a water tank, a water pump, a radiator, a fan, and the heat dissipation structure of any of the above embodiments. The inlet of the water pump is connected to the water tank, and the outlet of the water pump is connected to the liquid inlet 5 of the heat dissipation structure. The water pump is used to pump liquid (water) from the water tank into the flow channel 12. The radiator is disposed on the outer surface of the heat dissipation structure and is in close contact with the heat dissipation structure. The fan is disposed adjacent to the radiator and is used to drive airflow through the radiator to remove heat from the radiator.

[0051] The temperature of the heat transfer medium water in the flow channel 12 is approximately between 40°C and 48°C, and condensation will not occur. Moreover, the design of the water pump and water tank can quickly remove air from the flow channel 12, eliminate air blockage, ensure smooth circulation of the heat transfer medium, reduce flow resistance, and achieve a more uniform and stable flow rate.

[0052] For example, the radiator can use heat dissipation fins 8, which are disposed on the outer surface of the second shell plate 3. This allows the heat from the second shell plate 3 to be quickly conducted to the heat dissipation fins 8, increasing the heat dissipation area, improving the overall heat dissipation efficiency, and accelerating the dissipation of heat to the outside. This application also provides a method for manufacturing a heat dissipation structure, including: Make a skeleton 1, so that an inner cavity 11 and a flow channel 12 extending along the outer periphery of the inner cavity 11 are formed inside the skeleton 1; A first shell plate 2 is provided on the first side of the skeleton 1 to cover the first side of the inner cavity 11 and the first side of the flow channel 12; The capillary mesh substrate (capillary mesh) is cut and stamped according to the inner contour dimensions of the inner cavity 11 to obtain the initial mesh sheet; The initial mesh is pressed into the inner cavity 11 using a sintering fixture that is adapted to the inner contour of the inner cavity 11. The periphery of the initial mesh is bent to form a folded edge, which is located between the outer periphery of the sintering fixture and the cavity wall 111 of the inner cavity 11. Copper powder is filled between the folded edge and the cavity wall 111 of the inner cavity 11. After sintering, the sintering fixture is removed. The initial mesh is sintered on the inner plate surface of the first shell plate 2 and the cavity wall 111 of the inner cavity 11 to form a capillary structure layer. A capillary structure layer is fabricated on one side of the second shell plate 3. The second shell plate 3 is then sealed to the second side of the inner cavity 11 and the second side of the flow channel 12 with the capillary structure layer facing the inner cavity 11. In this way, the fabrication of a heat dissipation structure similar to a sandwich structure is completed.

[0053] Other capillary structures and powder columns of the heat spreader can be manufactured according to the conventional sintering scheme for heat spreaders.

[0054] In one embodiment of this application, a connector seat 7 integrating an inlet connector 5 and an outlet connector 6 is provided on the outer surface of the second shell plate 3. A guide groove 31 is provided inside the second shell plate 3, and the first end of the guide groove 31 is connected to the second end of the flow channel 12. The outlet connector 6 is connected to the second end of the guide groove 31, and the inlet connector 5 is connected to the first end of the flow channel 12.

[0055] This application, as a loop-type water-cooled large VC, can be equipped with heat dissipation fins 8 and a fan, providing powerful air cooling capabilities; it can also be connected to external water cooling equipment (a water tank and a water pump, with the water pump connected to the inlet connector 5 to send water from the water tank into the flow channel 12 through the inlet connector 5, and then back to the water tank through the outlet connector 6). Based on air cooling, the addition of the loop-type water channel (flow channel 12) will significantly increase the overall heat dissipation capacity.

[0056] The frame 1, the first shell plate 2, and the second shell plate 3 can all be made of copper. The first shell plate 2 and the second shell plate 3 are both fixedly connected to the frame 1 by welding. The heat dissipation fins 8 can be fixed to the outer surface of the second shell plate 3 by welding.

[0057] Understandably, the inner cavity 11 of the skeleton 1 is a sealed chamber after being covered by the first shell plate 2 and the second shell plate 3. After being evacuated, the sealed chamber forms a vacuum chamber, which is filled with a heat transfer medium. The heat transfer medium is generally water, but it can also be a low-boiling-point heat transfer liquid such as methanol or ethanol.

[0058] This application embodiment solves the problem of low heat exchange efficiency in the VC cavity by cleverly designing the large VC capillary structure and laying the flow channel 12 (water channel).

[0059] The water channel surrounds the inner cavity of the large VC (ventilation chamber), where heat exchange occurs between the water channel and the inner wall of the large VC. The heat is then carried out of the system by the water channel, greatly improving the system's heat dissipation capacity. Conventional large VCs lack capillary structures on their side walls and edges, resulting in a significant temperature difference between the VC side walls and the VC cavity. Simply combining the annular water channel with the large VC results in extremely poor heat exchange efficiency.

[0060] like Figure 6 As shown, taking two heating blocks with power consumption of 80W and 180W respectively as an example, the CPU+GPU dual stress test is simulated. The fan flow rate at the two heat sink fins 8 is 7 CFM, the air temperature is 40℃, and the temperature of the water entering the liquid inlet connector 5 is 30℃.

[0061] Table 1 shows the CPU heating block and its temperature as the water flow rate gradually increases from 0 to 0.005 CFM.

[0062] Table 1:

[0063] Combination Figure 7 The PQ curve diagram of the water flow shows the pressure corresponding to the flow rate, and... Figure 8 The simulation results show that when comparing the water flow rate of 0.005 CFM with the original state without water cooling, the temperature of the GPU heating block decreased from 92.62℃ to 63.71℃, with DeltaT=28.91℃. Based on the standard of increasing power consumption by 3W and increasing temperature by 1℃, the maximum cooling benefit brought by water cooling is calculated. Thus, the maximum water flow rate of 0.005 CFM can increase the system power consumption by 86.73W.

[0064] The above description is intended to be illustrative and not restrictive. Those skilled in the art can make variations, modifications, substitutions, and alterations to the above embodiments within the scope of this disclosure. Moreover, the above examples (or one or more of them) can be used in combination with each other, and these embodiments can be combined with each other in various combinations or arrangements.

[0065] The above description is intended to be illustrative and not restrictive. Those skilled in the art can make variations, modifications, substitutions, and alterations to the above embodiments within the scope of this disclosure. Moreover, the above examples (or one or more of them) can be used in combination with each other, and these embodiments can be combined with each other in various combinations or arrangements.

Claims

1. A heat dissipation structure, characterized in that, include: A skeleton that forms a closed ring, with an inner cavity formed within the ring, and the skeleton having a flow channel extending along the ring; A first shell plate is disposed on the first side of the skeleton and is sealed to the first side of the skeleton to cover the first side of the inner cavity and the first side of the flow channel; The second shell plate is disposed on the second side of the skeleton opposite to the first side and is sealed to the second side of the skeleton to cover the second side of the inner cavity and the second side of the flow channel, so that the inner cavity forms a closed cavity and the flow channel forms a closed flow channel; Capillary structures are provided on the inner surface of at least one of the first shell plate and the second shell plate, and on the cavity wall of the inner cavity.

2. The heat dissipation structure according to claim 1, characterized in that, The frame includes a surrounding plate and a flow channel plate. The surrounding plate forms a closed ring, and the flow channel plate is located outside the surrounding plate. Both ends of the flow channel plate are connected to the surrounding plate, and the flow channel is formed between the flow channel plate and the surrounding plate.

3. The heat dissipation structure according to claim 2, characterized in that, The enclosure and the flow channel plate are an integral structure; and / or The heat dissipation structure also includes an inlet connector and an outlet connector that are respectively connected to the flow channel. The inlet connector is located near the first end of the flow channel, and the outlet connector is located near the second end of the flow channel.

4. The heat dissipation structure according to claim 3, characterized in that, The inlet connector and outlet connector are integrated on the same connector seat. The second shell plate is provided with a flow guide groove. The first end of the flow guide groove is connected to the second end of the flow channel. The outlet connector is connected to the second end of the flow guide groove. The inlet connector is connected to the first end of the flow channel.

5. The heat dissipation structure according to claim 1, characterized in that, The channel has a width of 3mm-4mm in the direction perpendicular to its extension and parallel to the width of the first and second shell plates.

6. The heat dissipation structure according to claim 1, characterized in that, The outer contour of the skeleton is T-shaped and includes a vertical portion and a horizontal portion. The horizontal portion includes a first horizontal portion and a second horizontal portion located on opposite sides at one end of the vertical portion; and / or The first horizontal portion and the second horizontal portion have the same dimensions in the horizontal direction; the vertical portion has a larger dimension in the vertical direction than the first horizontal portion in the horizontal direction; the vertical portion has a larger dimension in the horizontal direction than the first horizontal portion in the horizontal direction.

7. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure also includes a capillary mesh, which is laid on the inner surface of the first shell plate. The periphery of the capillary mesh is bent to form a folded edge that adheres to the cavity wall of the inner cavity. The folded edge is sintered with the copper powder filling the cavity wall to form a capillary structure on the cavity wall.

8. A heat dissipation system, characterized in that, The device includes a water tank, a water pump, a radiator, a fan, and a heat dissipation structure as described in any one of claims 1 to 7; the inlet of the water pump is connected to the water tank, the outlet of the water pump is connected to the liquid inlet of the heat dissipation structure, and the water pump is used to pump liquid from the water tank into the flow channel; the radiator is disposed on the outer surface of the heat dissipation structure and is in close contact with the heat dissipation structure, and the fan is disposed adjacent to the radiator and is used to drive airflow through the radiator to remove heat from the radiator.

9. A method for manufacturing a heat dissipation structure, characterized in that, include: A skeleton is fabricated, forming an inner cavity and a flow channel extending along the outer periphery of the inner cavity; A first shell plate is provided on the first side of the skeleton to cover the first side of the inner cavity and the first side of the flow channel; The capillary mesh substrate is cut and stamped according to the inner contour dimensions of the cavity to obtain the initial mesh sheet; The initial mesh is pressed into the inner cavity using a sintering fixture adapted to the inner contour of the inner cavity. The periphery of the initial mesh is bent to form a folded edge, which is located between the outer periphery of the sintering fixture and the cavity wall of the inner cavity. Copper powder is filled between the folded edge and the cavity wall of the inner cavity. After sintering, the sintering fixture is removed. The initial mesh is sintered on the inner plate surface of the first shell plate and the cavity wall of the inner cavity to form a capillary structure layer. A capillary layer is formed on one side of the second shell plate, and the second shell plate is sealed to the second side of the inner cavity and the second side of the flow channel with the capillary layer thereon facing the inner cavity.

10. The method for manufacturing the heat dissipation structure according to claim 9, characterized in that, A connector seat integrating an inlet connector and an outlet connector is provided on the second shell plate. A flow guide groove is provided inside the second shell plate, so that the first end of the flow guide groove is connected to the second end of the flow channel, the outlet connector is connected to the second end of the flow guide groove, and the inlet connector is connected to the first end of the flow channel.

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