Transparent electromagnetic induction film and electromagnetic induction type handwriting device

Abstract

The application discloses a transparent electromagnetic induction film and an electromagnetic induction type handwriting device, and relates to the technical field of electromagnetic induction. The transparent electromagnetic induction film is divided into a transparent area and a wiring area located at one end of the transparent electromagnetic induction film. The lines arranged in the transparent area are designed in a grid form. The transparent electromagnetic induction film comprises a base layer, a first line layer and a second line layer. The base layer is made of transparent insulating material. The first line layer comprises a first wiring assembly located at the wiring area and a first grid line located at the transparent area. The first grid line comprises a first coil array. The second line layer comprises a second wiring assembly located at the wiring area and a second grid line located at the transparent area. The second grid line comprises a second coil array and a metal grid connecting line connected with the second coil array. The whole transparent electromagnetic induction film is only located at the wiring assembly at one end, which can be observed by naked eyes, and the area proportion of the transparent area is significantly improved.

Description

Technical Field

[0001] This invention relates to the field of electromagnetic induction technology, and more particularly to a transparent electromagnetic induction film and an electromagnetic induction handwriting device. Background Technology

[0002] Electromagnetic Resonance Film (EMR) can detect the position of an electromagnetic pen using the principle of electromagnetic induction, and then calculate the pen's trajectory. Some EMRs are transparent, consisting of a base layer and two sets of gridded coil arrays disposed on the two surfaces of the base layer. Due to the gridded design of the coils, by narrowing the line width of the grid lines, the coil array can be made visually invisible. Thus, the area where the coil array of the EMR is located is visually transparent and can be called the coil arrangement area.

[0003] The electromagnetic induction film also includes an outer perimeter region located outside the coil arrangement area. This perimeter region includes metal wires connected to the coil array. Currently, these metal wires are solid, and there are more or less metal wires around the coil arrangement area. To reduce resistance, carry current, and facilitate connection with the FPC, the line width is relatively large, resulting in a large number of observable metal lines in the perimeter region. This affects the area ratio of the transparent region on the electromagnetic induction film, making it impossible to achieve a near-completely transparent visual experience. Figure 8b As shown, Figure 8b A photograph of an electromagnetic induction film in the prior art is shown, in which visible metal wires are present around all four edges.

[0004] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects.

[0005] The above content is only used to help understand the technical solution of this application and does not constitute an admission that the above is prior art. Summary of the Invention

[0006] The purpose of this invention is to provide a transparent electromagnetic induction film and an electromagnetic induction handwriting device, so as to increase the area ratio of the transparent region on the electromagnetic induction film.

[0007] To achieve the aforementioned objectives, this invention proposes a transparent electromagnetic induction film, which is divided into a transparent area and a wiring area located at one end of the transparent electromagnetic induction film. The wiring within the transparent area is designed with a grid pattern. The transparent electromagnetic induction film includes:

[0008] The base layer is made of insulating material and includes a first surface and a second surface arranged opposite to each other;

[0009] A first wiring layer is disposed on the first surface, including a first wiring assembly located in the wiring area and a first grid line located in the transparent area. The first grid line includes a first coil array, and the first wiring assembly includes a first metal solid connection line connected to the first coil array.

[0010] The second wiring layer, disposed on the second surface, includes a second wiring assembly located in the wiring area and a second mesh wiring located in the transparent area. The second mesh wiring includes a second coil array and a metal mesh connecting line connected to the second coil array. The second wiring assembly includes a second metal solid connecting line connected to the metal mesh connecting line.

[0011] Furthermore, the transparent area includes a coil arrangement area for setting the first coil array and the second coil array, and a first wiring area for accommodating the metal mesh connecting line. The first coil array includes a plurality of first grids, the second coil array includes a plurality of second grids, and the metal mesh connecting line includes a plurality of third grids. The projections of the first grids and the second grids on a plane perpendicular to the thickness direction of the substrate are staggered, and the area of ​​the third grid is smaller than the areas of the first grids and the second grids.

[0012] Furthermore, the sub-grid formed by the overlapping projections of the first grid and the second grid in the thickness direction of the transparent electromagnetic induction film is the same size as the third grid.

[0013] Furthermore, the first coil array includes a first main metal mesh channel extending along the second direction Y and multiple first auxiliary metal mesh channels extending along the first direction X. One end of the first auxiliary metal mesh channel is connected to the first main metal mesh channel along its length, and the other end is connected to the first metal solid connecting line.

[0014] The first wiring assembly includes multiple first metal solid connection lines that are respectively connected to multiple first auxiliary metal mesh channels;

[0015] The first direction X and the second direction Y are perpendicular.

[0016] Furthermore, the second coil array includes a second main metal mesh channel extending along the first direction X and multiple second auxiliary metal mesh channels extending along the second direction Y. One end of the second auxiliary metal mesh channel is connected to the second main metal mesh channel along its length, and the other end is connected to the metal mesh connecting line.

[0017] The second wiring assembly includes multiple second metal solid connection lines that are respectively connected to the multiple metal mesh connection lines.

[0018] Furthermore, the second coil array includes multiple second auxiliary metal mesh channels arranged at intervals along the first direction X, the second auxiliary metal mesh channels extend along the second direction Y, the second wiring layer includes two sets of second wiring assemblies located on both sides of the first wiring assembly, and both ends of the second auxiliary metal mesh channels are electrically connected to the second wiring assembly through metal mesh connecting lines;

[0019] The second wiring assembly includes multiple second metal solid connection lines that are respectively connected to the metal mesh connection lines.

[0020] Furthermore, the first coil array includes a first grid isolation channel disposed between adjacent first auxiliary metal grid channels. The metal wires of the first grid isolation channel are arranged in the same way as those of the first main metal grid channel and the first auxiliary metal grid channel, and a break is provided between the first main metal grid channel and the first auxiliary metal grid channel.

[0021] The second coil array includes a second grid isolation channel disposed between adjacent second auxiliary metal grid channels. The metal wires of the second grid isolation channel and the second auxiliary metal grid channel are arranged in the same way, and there is a break between them.

[0022] The second wiring assembly includes a third mesh isolation channel disposed between adjacent metal mesh connecting lines. The third mesh isolation channel and the metal wires of the metal mesh connecting lines are arranged in the same way, and there is a break between them.

[0023] Furthermore, the first grid line also includes a first grid ground wire disposed on the first surface and a fourth grid isolation channel located inside the first grid ground wire, and the first wiring assembly includes a third metal solid connecting wire connected to the first grid ground wire;

[0024] The first grid line also includes a second grid ground wire disposed on the second surface and a fifth grid isolation channel disposed inside the second grid ground wire, and the second wiring assembly includes a fourth metal solid connection wire connected to the second grid ground wire.

[0025] Furthermore, at least a portion of the fourth grid isolation channel includes at least two cross lines arranged along the width direction of the fourth grid isolation channel, the cross lines being composed of two metal wires;

[0026] At least a portion of the fifth grid isolation channel includes at least two cross lines arranged along the width of the fifth grid isolation channel, the cross lines being composed of two metal wires.

[0027] Furthermore, the width W1 of the fourth grid isolation channel is greater than the width W2 of the first grid isolation channel, and the width W3 of the fifth grid isolation channel is greater than the width W4 of the second grid isolation channel.

[0028] Furthermore, in the thickness direction of the transparent electromagnetic induction film, the projections of the first grid line and the second grid line have overlapping and non-overlapping regions. The portion of the first grid line corresponding to the overlapping region is called the first overlapping portion, and the portion corresponding to the non-overlapping region is called the first non-overlapping portion. The portion of the second grid line corresponding to the overlapping region is called the second overlapping portion, and the portion corresponding to the non-overlapping region is called the second non-overlapping portion. The grids included in the first overlapping portion and the second overlapping portion are of the same size and are staggered. The distance L3 between the projections of two adjacent parallel metal lines is not less than 100 μm. The grid of the non-overlapping region is smaller than the grids of the first overlapping portion and the second overlapping portion.

[0029] Furthermore, the grid in the non-overlapping region is the same size as the grid formed by the overlap of the first overlapping portion and the second overlapping portion.

[0030] Furthermore, the first grid line includes multiple parallel first metal lines and multiple parallel second metal lines, with the first metal lines and the second metal lines intersecting each other;

[0031] The second grid line includes multiple parallel third metal lines and multiple parallel fourth metal lines, wherein the third metal lines and the fourth metal lines are arranged intersectingly.

[0032] On the other hand, the present invention proposes an electromagnetic induction handwriting device, comprising:

[0033] case;

[0034] Circuit components, connected to the housing; and,

[0035] The transparent electromagnetic induction film as described above is connected to the housing and is at least partially located outside the housing.

[0036] Furthermore, the electromagnetic induction handwriting device also includes a transparent support plate fixedly connected to the housing, and the transparent electromagnetic induction film is attached to the surface of the transparent support plate;

[0037] The wiring area is located inside the housing, and the transparent area is located outside the housing.

[0038] Compared with the prior art, the present invention has the following beneficial effects: According to at least one embodiment of the present invention, the transparent electromagnetic induction film is divided into a transparent area and a wiring area located at one end of the transparent electromagnetic induction film. The circuits in the transparent area are all designed in a grid pattern. The transparent electromagnetic induction film includes a base layer, a first circuit layer, and a second circuit layer. The base layer is made of an insulating material and includes a first surface and a second surface disposed opposite to each other. The first circuit layer is disposed on the first surface and includes a first wiring assembly located in the wiring area and a first grid circuit located in the transparent area. The first grid circuit includes a first coil array, and the first wiring assembly includes a first metal solid connecting line connected to the first coil array. The second circuit layer is disposed on the second surface and includes a second wiring assembly located in the wiring area and a second grid circuit located in the transparent area. The second grid circuit includes a second coil array and a metal grid connecting line connected to the second coil array. The second wiring assembly includes a second metal solid connecting line connected to the metal grid connecting line.

[0039] Because the coil array and metal mesh connecting lines in the transparent area are all designed in a mesh pattern, they cannot be seen with the naked eye. The first and second metal physical connecting lines that can be seen with the naked eye are both located in the wiring area. Therefore, only one end of the entire transparent electromagnetic induction film can be observed to have connecting lines, while the rest is transparent. This significantly increases the area ratio of the transparent area. Furthermore, the wiring area itself needs to be directly connected to the external circuit, so it hardly affects the overall transparent visual effect. The overall light-transmitting area is larger, resulting in a better user experience. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the layered structure of the transparent electromagnetic induction film in some embodiments of the present invention.

[0041] Figure 2 This is a schematic diagram of the circuit arrangement of a transparent electromagnetic induction film in some embodiments of the present invention. The circuits contained in the first circuit layer are indicated by dashed lines in the figure.

[0042] Figure 3 This is a schematic diagram showing the positions of the wiring area, coil arrangement area, and first wiring area of ​​the transparent electromagnetic induction film in some embodiments of the present invention.

[0043] Figure 4 This is a schematic diagram of the circuit layout of the first circuit layer in some embodiments of the present invention.

[0044] Figure 5 This is a schematic diagram of the wiring layout of the second wiring layer in some embodiments of the present invention.

[0045] Figure 6This is a schematic diagram showing how several metal mesh connecting lines are connected to a second auxiliary metal mesh channel in some embodiments of the present invention.

[0046] Figure 7 This is a schematic diagram showing the connection between the metal mesh connecting line and the second auxiliary metal mesh channel closest to the first wiring assembly in some embodiments of the present invention.

[0047] Figure 8a These are photographs of the transparent electromagnetic induction film in some embodiments of the present invention.

[0048] Figure 8b This is a photograph of a transparent electromagnetic induction film with visible metal wires around its periphery, as described in the prior art.

[0049] Figure 9 yes Figure 4 Enlarged view of section I in the middle.

[0050] Figure 10 yes Figure 5 Enlarged view of section II.

[0051] Figure 11 This is a schematic diagram of the superposition of the first and second grid lines in some embodiments of the present invention.

[0052] Figure 12 yes Figure 5 Enlarged view of Part III.

[0053] Figure 13 yes Figure 12 The diagram shown is a schematic of the structure superimposed with the grid of the first coil array.

[0054] Figure 14 yes Figure 4 Enlarged view of the middle IV section.

[0055] Figure 15 yes Figure 5 Enlarged view of the middle V section.

[0056] Figure 16 yes Figure 5 Enlarged view of section VI.

[0057] Figure 17a This is a schematic diagram of the first coil array in some embodiments of the present invention.

[0058] Figure 17b This is a schematic diagram of the second coil array in some embodiments of the present invention.

[0059] Figure 17c yes Figure 17a The first coil array and Figure 17b A schematic diagram of the superimposed second coil array.

[0060] Figure 18a This is a schematic diagram of the first coil array in some embodiments of the present invention.

[0061] Figure 18b This is a schematic diagram of the second coil array in some embodiments of the present invention.

[0062] Figure 18c yes Figure 18a The first coil array and Figure 18b A schematic diagram of the superimposed second coil array.

[0063] Figure 18d This is a schematic diagram showing the positions of the wiring area, coil arrangement area, first wiring area, and second wiring area of ​​the transparent electromagnetic induction film in some embodiments of the present invention.

[0064] Figure 19a This is a front view of a handwriting device according to some embodiments of the present invention.

[0065] Figure 19b This is a side view of a handwriting device according to some embodiments of the present invention.

[0066] Figure 19c This is a schematic diagram of a handwriting device in some embodiments of the present invention with a transparent support plate. Detailed Implementation

[0067] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0068] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0069] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0070] Example 1

[0071] Some embodiments of the present invention propose a transparent electromagnetic induction film, such as Figure 1 and Figure 2 As shown, it includes a base layer 1, a first wiring layer 80 and a second wiring layer 81. The first wiring layer 80 includes a first wiring assembly 3 and a first grid line, and the second wiring layer 81 includes a second wiring assembly 5 and a second grid line.

[0072] In this embodiment, the transparent electromagnetic induction film is divided into two regions: a transparent region and a wiring region 130 located at one end of the transparent electromagnetic induction film. The rest of the transparent electromagnetic induction film, except for the wiring region 130, is a transparent region. The circuits in the transparent region are designed with a grid pattern so that the internal metal circuits are not visible to the naked eye. Solid metal wires can be used in the wiring region 130. These metal wires are visible to the naked eye and have a large width to facilitate wiring with external circuits.

[0073] The base layer 1 is made of a transparent insulating material, such as PET, PEN, PI, PC, or PMMA. The base layer 1 is typically rectangular, with its two ends in the first direction X being the first end 1a and the second end 1b, and its two ends in the second direction Y being the third end 1c and the fourth end 1d. The first direction X and the second direction Y are perpendicular, for example, they can correspond to the width and length directions of the base layer 1, respectively. Of course, the base layer 1 does not have to be rectangular; it can be configured into other shapes as needed. It is understood that the ends of the transparent electromagnetic induction film are consistent with the shape of the base layer 1, and therefore their ends are also consistent. In the illustrated embodiment, the wiring area 130 is located at the first end 1a, and the transparent area covers the second end 1b, the third end 1c, and the fourth end 1d, schematically, as shown. Figure 2 and Figure 3 As shown in the figure, the area above the double-dotted line 130a is the transparent area, and the area below it is the wiring area 130.

[0074] The base layer 1 includes a first surface 10 and a second surface 11 disposed opposite to each other. A first circuit layer 80 is disposed on the first surface 10, and a second circuit layer 81 is disposed on the second surface 11. It should be noted that the base layer 1 can be a single-layer structure, or a structure with two or more layers.

[0075] In this case, both the first and second grid lines are located in the transparent area. For example... Figure 2 , Figure 4 and Figure 5 As shown, the first grid line includes a first coil array 2, and the first wiring assembly 3 includes a first metal solid connecting line 30 located in the wiring area 130 and connected to the first coil array 2. The second grid line includes a second coil array 4 and a metal grid connecting line 50 connected to the second coil array 4, and the second wiring assembly 5 includes a second metal solid connecting line 51 located in the wiring area 130 and connected to the metal grid connecting line 50.

[0076] like Figure 3 As shown, the transparent area includes a coil arrangement area 12 for setting up the coil array and a peripheral area located outside the coil arrangement area 12. The peripheral area includes a first wiring area 131 for setting up the metal mesh connecting lines 50. The first wiring area 131 and the connection area 130 are respectively provided on the two sides adjacent to the coil arrangement area 12. Figure 3 In the diagram, the wiring area 130 is located at the first end 1a, and the first wiring area 131 is located at the fourth end 1d. Schematic, the area below the line containing the double-dotted line 130a is the wiring area 130, and the area above the line containing the double-dotted line 130a and to the right of the line containing the double-dotted line 130b is the first wiring area 131. The first coil array 2 and the second coil array 4 are both located in the coil arrangement area 12, which is also the effective input area for electromagnetic interaction between the transparent electromagnetic induction film and the electromagnetic pen. Optionally, the coil arrangement area 12 is located in the middle of the transparent electromagnetic induction film.

[0077] like Figure 4 As shown, Figure 4 A schematic diagram of the wiring contained in the first wiring layer 80 of some embodiments is shown. The first coil array 2 includes a first main metal mesh channel 21 extending along a second direction Y and multiple first auxiliary metal mesh channels 20 extending along a first direction X. One end of the first auxiliary metal mesh channel 20 in the length direction is connected to the first main metal mesh channel 21. Two adjacent first auxiliary metal mesh channels 20 and the first main metal mesh channel 21 connecting them can constitute a coil.

[0078] The first wiring assembly 3 is located in the wiring area 130. It includes multiple first metal physical connection lines 30 that are respectively connected to multiple first auxiliary metal mesh channels 20. It can be understood that the first metal physical connection lines 30 and the first auxiliary metal mesh channels 20 are in one-to-one correspondence. One end of the first metal physical connection line 30 is connected to the end of the first auxiliary metal mesh channel 20 that is away from the first main metal mesh channel 21, and the other end is provided with a wiring terminal near the edge of the first end 1a of the base layer 1 for connecting to external circuits.

[0079] like Figure 5 As shown, Figure 5 A schematic diagram of the circuitry contained in the second circuit layer 81 is shown. The second coil array 4 includes a second main metal mesh channel 41 extending along a first direction X and multiple second auxiliary metal mesh channels 40 extending along a second direction Y. One end of the second auxiliary metal mesh channel 40 is connected to the second main metal mesh channel 41 along its length. Two adjacent second auxiliary metal mesh channels 40 and the second main metal mesh channel 41 connecting them can constitute a coil. The second mesh circuitry includes multiple metal mesh connecting lines 50 that are respectively connected to the second auxiliary metal mesh channels 40.

[0080] The second wiring assembly 5 is located entirely within the wiring area 130. It includes multiple second metal solid connection lines 51 that are respectively connected to multiple metal mesh connection lines 50. The boundary between the second auxiliary metal mesh channel 40 and the metal mesh connection lines 50 is indicated by a dashed line 5a in the figure. It can be understood that the metal mesh connection lines 50 and the second auxiliary metal mesh channel 40 are in one-to-one correspondence, and the second metal solid connection lines 51 and the metal mesh connection lines 50 are also in one-to-one correspondence. The metal mesh connection lines 50 are connected to the ends of the second auxiliary metal mesh channels 40 that are away from the second main metal mesh channel 41. One end of the second metal solid connection line 51 is connected to the metal mesh connection line 50, and the other end has a terminal near the edge of the first end 1a of the base layer 1 for connection to external circuits.

[0081] The first wiring area 131 is used to install the metal mesh connecting line 50, i.e., the metal mesh connecting line 50 is located at the fourth end 1d, and the wiring area 130 is used to install the second metal solid connecting line 51, i.e., the second metal solid connecting line 51 is located at the first end 1a. For example... Figure 6 As shown, Figure 6 A schematic diagram is shown showing a plurality of metal mesh connecting lines 50 connected to a second auxiliary metal mesh channel 40. The metal mesh connecting lines 50 include a first part 500 connected to the second auxiliary metal mesh channel 40 and a second part 501 connected between the first part 500 and the second metal solid connecting line 51. The first part 500 extends along the second direction Y, and the second part 501 extends along the first direction X, and the two are L-shaped.

[0082] It is understandable that the first portion 500 and the second portion 501 of the metal mesh connecting line 50, which are closer to the outer edges (second end 1b and fourth end 1d), are longer. For example... Figure 7As shown, the metal mesh connecting line 50 connected to the second auxiliary metal mesh channel 40 closest to the first wiring assembly 3 may only include the second part 501, excluding the first part 500. In this case, the metal mesh connecting line 50 is located within the coil arrangement area 12 to reduce the space occupied in the second direction Y. In this embodiment, only the metal mesh connecting line 50 closest to the first wiring assembly 3 is located within the coil arrangement area 12, while the remaining metal mesh connecting lines 50 are located in the first wiring area 131. Optionally, the boundary line 50a between the metal mesh connecting line 50 located in the coil arrangement area 12 and the second auxiliary metal mesh channel 40 is inclined relative to both the first direction X and the second direction Y to increase the number of nodes at the connection and improve the current carrying capacity. In other embodiments, all metal mesh connecting lines 50 may include the first part 500 and the second part 501, and all metal mesh connecting lines 50 are located in the first wiring area 131.

[0083] In this document, components whose names contain the word "grid" (such as the first grid line, the second grid line, the first main metal grid channel 21, the first auxiliary metal grid channel 20, the second main metal grid channel 41, the second auxiliary metal grid channel 40, and the metal grid connecting line 50, etc.) indicate that the component adopts a grid-like design, including, for example, metal wires arranged in an interlaced grid pattern. It also indicates that it is invisible to the naked eye; for example, the metal wires are made invisible by controlling the line width to be less than or equal to 5μm. To clearly illustrate the approximate shape of each channel, some accompanying drawings (e.g., Figure 2 , Figures 4 to 7 In the text, gridded structures such as grid channels and grid connectors are represented by solid lines to indicate their outlines. The outline formed by connecting the outermost points of a gridded line can be used as the general outline of the gridded line to determine its approximate area. See the enlarged view in Figure 7 for an example. Figures 18a to 18c As shown, the gridded lines do not actually have this outline.

[0084] In this document, components whose names contain the word "solid" (such as the first solid metal connection line 30 and the second solid metal connection line 51) indicate that the component uses a solid line design, rather than a mesh design. These components are visually visible, and their line width can be designed to be wider to reduce resistance, carry current, and facilitate connection to external circuits. To improve the reliability of the connection between the solid metal connection lines and the mesh channels / mesh connection lines, such as... Figure 7 As shown, the end of the metal solid connecting line is provided with a widened portion 510, which can increase the contact area with the metal mesh, thereby improving the reliability of the conductive connection. In this application, the metal solid connecting line and the meshed lines such as mesh channels and mesh connecting lines can all be connected using the structure of the widened portion 510.

[0085] Because the coil array and metal mesh connecting lines 50 within the transparent area are designed in a mesh pattern, they cannot be observed with the naked eye. However, the first and second metal physical connecting lines 30 and 51, which are visible to the naked eye, are both located at the first end 1a (connection area 130). Therefore, only the first end 1a of the entire transparent electromagnetic induction film shows visible connecting lines; the rest is transparent. Figure 8a As shown, Figure 8a A photograph of a transparent electromagnetic induction film is shown, showing the connecting lines visible only near the first end 1a. The transparent electromagnetic induction film, with the connecting lines visible only on one side, significantly increases the area ratio of the transparent region. Since the first end 1a (connection area 130) itself needs to be directly connected to the external circuit, it hardly affects the overall transparent visual effect, resulting in a larger overall light-transmitting area and a better user experience. For example, when it is used to cover calligraphy practice books or sketchbooks for copying, there is almost no obstruction from the metal wires, further enhancing the user experience.

[0086] It is understandable that the position of the double-dotted line 130a can be determined as follows: Determine the point closest to the first end 1a among the multiple first auxiliary metal mesh channels 20, and draw a line passing through this point and parallel to the second direction Y (perpendicular to the extension direction of the first auxiliary metal mesh channel 20). This line is the double-dotted line 130a. The double-dotted line 130b is a line passing through the vertical outline of the first auxiliary metal mesh channel 20 closest to the metal mesh connecting line 50, and it is set along the first direction X (consistent with the extension direction of the first auxiliary metal mesh channel 20). Optionally, such as... Figure 4 As shown, the length L1 of each of the first auxiliary metal mesh channels 20 is the same, so that the coils of the first coil array 2 are nearly identical in size and impedance, resulting in better consistency of the induced current and electromagnetic field, which can improve the accuracy of electromagnetic pen position detection. Similarly, as Figure 5 As shown, the length L2 of each of the second auxiliary metal mesh channels 40 is the same, and it extends to align with the outline of the rightmost first auxiliary metal mesh channel 20.

[0087] Both the first and second grid lines adopt a gridded design, including metal wires arranged in an interlaced grid pattern. In some embodiments, such as... Figure 9 As shown, Figure 9 It shows Figure 4 An enlarged view of section I shows that the first grid line includes multiple parallel first metal lines 220 and multiple parallel second metal lines 221. The first metal lines 220 and second metal lines 221 are intersected to form a grid. (See diagram below.) Figure 10 As shown, Figure 10 It shows Figure 5An enlarged view of Part II shows that the second grid line includes multiple parallel third metal lines 420 and multiple parallel fourth metal lines 421. The third metal lines 420 and fourth metal lines 421 are intersected to form a grid.

[0088] In the thickness direction of the transparent electromagnetic induction film, the projections of the outlines of the first grid line and the second grid line have overlapping and non-overlapping regions. The part of the first grid line corresponding to the overlapping region is called the first overlapping part, and the part corresponding to the non-overlapping region is called the first non-overlapping part. The part of the second grid line corresponding to the overlapping region is called the second overlapping part, and the part corresponding to the non-overlapping region is called the second non-overlapping part.

[0089] Optionally, the first and second overlapping portions include grids of the same size that are staggered. Optionally, the spacing L3 between the projections of two adjacent parallel metal lines is not less than 100μm. This prevents the metal lines of the two grids from being too close together, thus avoiding the appearance of a thicker metal line and reducing the transparency. In some electromagnetic induction films, the grids on the top and bottom sides are set to be perfectly aligned. However, due to processing errors, the metal lines of the two grids may be slightly misaligned. The combined width of the two metal lines increases, making them visible to the human eye.

[0090] Optionally, the grid in the non-overlapping area is smaller than the grid in the first and second overlapping portions. In this case, the grid density in the overlapping and non-overlapping areas is closer after the first and second grid lines are superimposed, resulting in a more consistent light transmission effect across the area covered by the lines. Grid density can be defined as the number of grids per unit area. Further, optionally, the grid in the non-overlapping area is the same size as the grid formed by the overlap of the first and second overlapping portions (i.e., the grid in the overlapping area), ensuring consistent light transmission in both areas. It is understood that the size and density of the grid can be controlled by controlling the spacing of the metal lines in a given area.

[0091] Figure 2In the illustrated embodiment, the projections of the entire first grid line and the corresponding portions of the second grid line are located in the overlapping area. The entire first grid line constitutes the first overlapping portion, while the metal mesh connecting line 50 is located in the non-overlapping area, belonging to the second non-overlapping portion. In this case, the grid size of the first grid line can be entirely the same. The grid size of the portion of the second grid line outside the first wiring area 131 is completely identical, and the grid size of the portion of the second grid line inside the first wiring area 131 is also completely identical. The grid size of the portion of the second grid line inside the first wiring area 131 is smaller than that of the first grid line and the grid size of the portion of the second grid line outside the first wiring area 131. This way, the spacing between the metal lines in each area does not need to vary excessively, which helps reduce manufacturing difficulty.

[0092] In some embodiments, such as Figure 9 As shown, the mesh size of the first main metal mesh channel 21 and the first auxiliary metal mesh channel 20 (i.e., the mesh of the first coil array 2) is the same. This mesh is referred to as the first mesh 22, and one of the first meshes 22 is indicated by a thick line in the figure. Further reference Figure 10 , Figure 10 It shows Figure 5 In the enlarged view of Part II, the size of the grid (i.e. the grid of the second coil array 4) of the second main metal grid channel 41 and the second auxiliary metal grid channel 40 is the same. This grid is called the second grid 42. One of the second grids 42 is shown in the figure with a thick line.

[0093] The projections of the first grid 22 and the second grid 42 on a plane perpendicular to the thickness direction of the base layer 1 are staggered, as shown below. Figure 11 As shown, Figure 11 A schematic diagram of the projected positions of the first grid 22 and the second grid 42 is shown, wherein the dashed line indicates the first grid 22 and the solid line indicates the second grid 42. Optionally, the spacing L3 between the projections of two adjacent parallel metal lines is not less than 100 μm.

[0094] The first coil array 2 does not extend to the first trace area 131. Figure 5 Midpoint line 5a and Figure 3 (The double-dotted line 130b overlaps), therefore, the first coil array 2 does not overlap with the metal mesh connecting line 50 in the thickness direction of the base layer 1, forming the second non-overlapping portion. In the embodiment where the metal mesh connecting line 50 closest to the first wiring assembly 3 is located within the coil arrangement area 12, the first coil array 2 does not overlap with the metal mesh connecting line 50 within the first wiring area 131, but overlaps with the metal mesh connecting line 50 located within the coil arrangement area 12. However, since this portion has a very small area, it can be ignored. Of course, the mesh of the first coil array 2 can also be configured to avoid the gaps in the metal mesh connecting line 50 to prevent overlap.

[0095] like Figure 12 As shown, Figure 12 It shows Figure 5 In the enlarged view of section III, the metal mesh connecting line 50 includes a mesh referred to as the third mesh 52. In some embodiments, the area of ​​the third mesh 52 is set to be smaller than the area of ​​the first mesh 22 and the second mesh 42, thus the density of the third mesh 52 is greater than that of the first mesh 22 and the second mesh 42. On the one hand, since the first mesh 22 and the second mesh 42 are staggered, the overall density of the first mesh 22 and the second mesh 42 increases when viewed directly from the transparent electromagnetic induction film, resulting in a slight decrease in the transparency of the coil arrangement area 12. By setting the area of ​​the third mesh 52 to be smaller than the area of ​​the first mesh 22 and the second mesh 42, the density of the third mesh 52 can be made closer to the overall density of the first mesh 22 and the second mesh 42, thereby making the transparency of the first wiring area 131 (non-overlapping area) and the overlapping area of ​​the mesh lines similar, resulting in better transparency consistency in the area where the mesh lines are located on the transparent electromagnetic induction film. Figure 13 It shows in Figure 12 The diagram shows the second coil array 4 superimposed with the first coil array 2. The dashed lines represent the grid of the first coil array 2, and the solid lines represent the grid of the second coil array 4. The area to the left of the dotted line 5a is the overlapping region (coil arrangement area 12), and the area to the right is the non-overlapping region (first wiring area 131). As can be seen from the diagram, the density of the third grid 52 is close to the density of the grid formed by the superposition of the first grid 22 and the second grid 42. Furthermore, the denser third grid 52 has more grid nodes, which can improve current carrying efficiency, reduce resistance, and better carry current. This avoids the deterioration of electrical performance caused by the gridding of the connecting lines connected to the second coil array 4, and also avoids making the metal grid connecting lines 50 too wide to increase the current carrying capacity.

[0096] Optional, such as Figure 13 As shown, the first grid 22 and the second grid 42 are the same size. Their projections on a plane perpendicular to the thickness direction of the base layer 1 form a sub-grid with the same size as the third grid 52. One of the sub-grids is shown in the figure with a thick line. At this time, the area of ​​the third grid 52 is one-quarter of the area of ​​the first grid 22 and the second grid 42, which has good conductivity. The transparency of the coil arrangement area 12 is the same as the transparency of the first wiring area 131.

[0097] like Figure 9 and Figure 11As shown, the spacing D1 between two adjacent first metal wires 220 and the spacing D2 between two adjacent third metal wires 420 are the same, as are the spacing D3 between two adjacent second metal wires 221 and the spacing D4 between two adjacent fourth metal wires 421. Furthermore, the first metal wires 220 and third metal wires 420 are parallel, and the second metal wires 221 and fourth metal wires 421 are parallel, ensuring that the grid sizes of the first and second overlapping portions are identical. Optionally, the spacings D1, D2, D3, and D4 range from 0.20mm to 0.80mm, and more preferably from 0.30mm to 0.50mm. The grid shape can be, for example, a square, rectangle, or rhombus; optionally, the grid shape is a square. Further optionally, the spacings D1, D2, D3, and D4 are all the same size.

[0098] like Figure 12 As shown, Figure 12 It shows Figure 5 In the enlarged view of section III, the density of the third metal wires 420 and fourth metal wires 421 constituting the metal mesh connecting line 50 is greater than the density of the third metal wires 420 and fourth metal wires 421 included in the second coil array 4. Specifically, in the metal mesh connecting line 50, the spacing D5 between two adjacent third metal wires 420 is half the spacing D2, and the spacing D6 between two adjacent fourth metal wires 421 is half the spacing D4, so that the size of the third mesh 52 is consistent with the size of the sub-mesh.

[0099] It is understandable that the first and second grid lines can also include a ground wire. Similarly, the ground wire also adopts a grid design, and insulation isolation between different functional grid channels can be achieved by setting a break 230. An example is given below.

[0100] like Figure 9 As shown, the first coil array 2 also includes a first grid isolation channel 23 disposed between adjacent first auxiliary metal grid channels 20. The approximate location of the first grid isolation channel 23 is indicated by a dashed line in the figure. The metal wires of the first grid isolation channel 23 and the first auxiliary metal grid channel 20 are arranged in the same way to ensure a uniform and continuous grid distribution. A break 230 is provided between the first grid isolation channel 23 and the first auxiliary metal grid channel 20 to ensure insulation between adjacent first auxiliary metal grid channels 20. In this way, the first grid isolation channel 23 and the first auxiliary metal grid channel 20 together form a basically consistent complete grid array, resulting in better overall transparency and consistency.

[0101] Similarly, such as Figure 10As shown, the second coil array 4 also includes a second grid isolation channel 43 disposed between adjacent second auxiliary metal grid channels 40. The position of the second grid isolation channel 43 is indicated by a dashed line in the figure. The metal wires of the second grid isolation channel 43 and the metal wires of the second auxiliary metal grid channel 40 are arranged in the same way to ensure a uniform and continuous grid distribution. A break 230 is provided between the second grid isolation channel 43 and the second auxiliary metal grid channel 40 to ensure insulation between adjacent second auxiliary metal grid channels 40. In this way, the second grid isolation channel 43 and the second auxiliary metal grid channel 40 together form a basically consistent complete grid array, resulting in better overall transparency and consistency.

[0102] Similarly, such as Figure 12 As shown, the second grid line includes a third grid isolation channel 53 disposed between adjacent metal grid connecting lines 50. The metal wires of the third grid isolation channel 53 and the metal grid connecting lines 50 are arranged in the same way to ensure a uniform and continuous grid distribution. A break 230 is provided between the third grid isolation channel 53 and the metal grid connecting lines 50 to ensure insulation between adjacent metal grid connecting lines 50. In this way, the third grid isolation channel 53 and the metal grid connecting lines 50 together form a basically consistent complete grid array, resulting in better overall transparency and consistency.

[0103] In some embodiments, such as Figure 4 As shown, the first grid line also includes a first grid ground wire 60 disposed on the first surface 10 and a fourth grid isolation channel 61 located inside the first grid ground wire 60. The first grid ground wire 60 is located outside the first coil array 2, in the peripheral area. The first wiring assembly 3 includes a third metal solid connection wire 32 connected to the first grid ground wire 60. By setting a ground wire on the periphery of the first coil array 2 and connecting it to the system ground, common-mode noise can be discharged, external interference can be shielded, and the end magnetic field can be shaped, thereby improving the accuracy of electromagnetic pen position detection.

[0104] like Figure 14 As shown, Figure 14 It shows Figure 4 The enlarged view of the middle IV section shows that the arrangement of the metal wires of the first grid ground line 60 is consistent with the arrangement of the metal wires of the first grid isolation channel 23, the first coil array 2, and the fourth grid isolation channel 61, so that the grid is evenly and continuously distributed, forming a basically consistent complete grid array, and the overall transparency is better.

[0105] The fourth grid isolation channel 61 is located between the first grid ground wire 60 and the first coil array 2. A break 230 is provided between the fourth grid isolation channel 61 and the first grid ground wire 60 and the first coil array 2 to ensure insulation isolation between the fourth grid isolation channel 61 and the first grid ground wire 60 and the first coil array 2. The width W1 of the fourth grid isolation channel 61 (see reference numerals) Figure 14 The width W2 of the first grid isolation channel 23 is greater than the width of the first grid isolation channel 23 (see label). Figure 9 This design reliably avoids interference from coupled signals, while the smaller spacing between the metal mesh channels of the first coil array 2 results in better positioning accuracy. Figure 14 As shown, at least a portion of the fourth grid isolation channel 61 includes at least two cross lines arranged along the width direction of the fourth grid isolation channel 61 (the first grid isolation channel 23 has only one cross line arranged along its width direction). The cross line is composed of two metal wires, and there is a break 230 between adjacent cross lines, that is, adjacent cross lines are all broken. Compared with setting the break 230 only at the adjacent positions between the fourth grid isolation channel 61 and the first grid ground wire 60 and the first coil array 2, setting the break 230 between adjacent cross lines can effectively improve the insulation effect.

[0106] like Figure 5 As shown, the second grid circuit also includes a second grid ground wire 70 disposed on the second surface 11 and a fifth grid isolation channel 71 located inside the second grid ground wire 70. The second grid ground wire 70 is located outside the second coil array 4, the metal grid connecting line 50, and the second wiring assembly 5, i.e., in the peripheral area. The second wiring assembly 5 includes a fourth metal solid connecting line connected to the second grid ground wire 70. By setting a ground wire connection system around the second coil array 4, common-mode noise can be discharged, external interference can be shielded, and the end magnetic field can be shaped, thereby improving the accuracy of electromagnetic pen position detection.

[0107] The second grid ground wire 70 is distributed at the first end 1a, the second end 1b, the third end 1c, and the fourth end 1d, forming a ring with an opening at the first end 1a. The portion of the second grid ground wire 70 corresponding to the metal grid connecting line 50 is located within the first wiring area 131; this portion is called the inner portion 70a. The portion of the second grid ground wire 70 corresponding to the second coil array 4 is located outside the first wiring area 131; this portion is called the outer portion 70b. Wherein, as... Figure 15 and Figure 16 As shown, Figure 15 and Figure 16 They are shown respectively Figure 5Enlarged views of sections V and VI show that the metal wire arrangement of the outer portion 70b is consistent with the arrangement of the metal wires in the second coil array 4 and the fifth grid isolation channel 71 corresponding to the outer portion 70b (the grid is larger). The metal wire arrangement of the inner portion 70a is consistent with the arrangement of the metal wires in the third grid isolation channel 53, the metal grid connecting line 50, and the fifth grid isolation channel 71 corresponding to the inner portion 70a (the grid is smaller). Furthermore, the first grid ground wire 60 does not have a portion that enters the first wiring area 131; it is only distributed outside the first wiring area 131, and its thickness direction in the base layer 1 does not overlap with the grid in the first wiring area 131. Figure 4 In the illustrated embodiment, the first grid ground line 60 is distributed at the second end 1b and the third end 1c in an L-shape. In this way, the projection of the first grid ground line 60 and the outer portion 70b in the thickness direction of the base layer 1 is superimposed, and there is no grid ground line superimposed on the inner portion 70a (i.e., the inner portion 80a belongs to the second non-overlapping portion). The density of the grid after the outer portion 70b and the first grid ground line 60 are superimposed is close to the density of the grid in the inner portion 70a, resulting in better overall transparency consistency.

[0108] like Figure 5 , Figure 15 and Figure 16 As shown, the fifth grid isolation channel 71 is located between the second grid ground wire 70 and the second coil array 4, and between the second grid ground wire 70 and the metal grid connecting line 50. A break 230 is provided between the fifth grid isolation channel 71 and the second grid ground wire 70, the second coil array 4, and the metal grid connecting line 50 to ensure insulation isolation between the fifth grid isolation channel 71 and the second grid ground wire 70, the second coil array 4, and the metal grid connecting line 50. The width W3 of the fifth grid isolation channel 71 (see reference numerals) Figure 16 The width W4 of the second grid isolation channel 43 is greater than the width of the second grid isolation channel (see label). Figure 12 This design reliably avoids interference from coupled signals. Simultaneously, the spacing between the auxiliary metal mesh channels of the second coil array 4 is smaller, resulting in better positioning accuracy. The widths of the portion of the fifth mesh isolation channel 71 corresponding to the inner portion 70a and the portion corresponding to the outer portion 70b can be the same or different. If they are different, the width of the smaller portion is used as the width of the fifth mesh isolation channel 71. Figure 16As shown, at least a portion of the fifth grid isolation channel 71 includes at least two cross lines arranged along the width direction of the fifth grid isolation channel 71 (the second grid isolation channel 43 has only one cross line arranged along its width direction). The cross line is composed of two metal wires, and there is a break 230 between adjacent cross lines, that is, adjacent cross lines are all broken. Compared with setting the break 230 only at adjacent positions between the fifth grid isolation channel 71 and the second grid ground wire 70, the second coil array 4, and the metal grid connecting line 50, the insulation effect can be effectively improved.

[0109] Optionally, the metal lines of the first circuit layer 80 and the second circuit layer 81 are provided with a blackening layer to reduce reflection and improve transparency.

[0110] Optionally, the first circuit layer 80 and the second circuit layer 81 may also include a transparent insulating layer covering the surface of the metal wire to protect the circuit.

[0111] Understandably, when the first grid circuit is entirely composed of alternating first metal wires 220 and second metal wires 221 with the same spacing, and different functional channels are separated by a break 230, the entire first grid circuit has the same grid density, making manufacturing very convenient. Similarly, the second grid circuit outside the first wiring area 131 is composed of alternating third metal wires 420 and fourth metal wires 421 with the same spacing, and the part inside the first wiring area 131 is also composed of alternating third metal wires 420 and fourth metal wires 421 with the same spacing. However, the grid density inside the first wiring area 131 is greater than the grid density outside. Again, the functional channels requiring insulation are separated by a break 230, and the second grid circuit forms two areas with different grid densities, which is also convenient to manufacture. Further optionally, the grid densities of the first and second grid circuits outside the first wiring area 131 are the same, while the grid density of the second grid circuit inside the first wiring area 131 is smaller. Alternatively, the second grid line located within the first wiring area 131 has the same grid density as the grid obtained by overlapping the first and second grid lines, resulting in better overall transparency consistency.

[0112] Optionally, the linewidth of the first metal line 220, the second metal line 221, the third metal line 420, and the fourth metal line 421 is less than or equal to 5 μm, and the thickness is not less than 5 μm and further not less than 6 μm, in order to reduce impedance and ensure detection accuracy.

[0113] It should be noted that, although in the above embodiments the first grid line is located entirely in the overlapping region (excluding the first non-overlapping part), in other embodiments it may also be partially located in the non-overlapping region, in which case the first grid line includes the first overlapping part and the first non-overlapping part. Figure 17a , Figure 17b and Figure 17c Schematic diagrams of a first coil array 2, a second coil array 4, and their stacked arrangement are shown in some embodiments. In the figures, the first main metal mesh channel 21 and the second main metal mesh channel 41 do not have overlapping mesh portions. Figure 2 In the corresponding embodiment, the first main metal mesh channel 21 overlaps with the uppermost second auxiliary metal mesh channel 40, and the second main metal mesh channel 41 overlaps with the leftmost first auxiliary metal mesh channel 20. The first main metal mesh channel 21 and the second main metal mesh channel 41 are respectively the first non-overlapping portion and the second non-overlapping portion. The first auxiliary metal mesh channel 20 and the second auxiliary metal mesh channel 40 overlap, respectively the first overlapping portion and the second overlapping portion. At this time, the mesh density of the first non-overlapping portion and the second non-overlapping portion can be set to be greater than the mesh density of the first overlapping portion and the second overlapping portion. Optionally, the mesh density of the first non-overlapping portion and the second non-overlapping portion is the same as the density / size of the mesh formed by the overlap of the first overlapping portion and the second overlapping portion.

[0114] Understandable Figure 17c The blank areas (such as the left and right ends of the first main metal mesh channel) can be set with the mesh isolation channel or a similar structure as described above to improve transparency consistency.

[0115] Example 2

[0116] like Figures 18a to 18c As shown, Figures 18a to 18c The diagrams show a first coil array 2, a second coil array 4, and a stacked configuration of the two, representing several embodiments. The main difference between this embodiment and Embodiment 1 is that in this embodiment, the second coil array 4 includes multiple second auxiliary metal mesh channels 40 spaced apart along a first direction X, and the second auxiliary metal mesh channels 40 extend along a second direction Y. The second coil array 4 does not include a second main metal mesh channel 41 connecting each of the second auxiliary metal mesh channels 40; that is, in Embodiment 1, the second coil array 4 has single-sided routing, while in Embodiment 2, the second coil array 4 has routing on both sides. The second wiring layer 81 includes two sets of second wiring assemblies 5 located on either side of the first wiring assembly 3 to facilitate wiring. Both ends of the second auxiliary metal mesh channels 40 are electrically connected to the second wiring assembly 5 via metal mesh connecting lines 50. Specifically, the second wiring assembly 5 includes multiple second physical metal connecting lines 51 that correspond one-to-one with the multiple metal mesh connecting lines 50.

[0117] Correspondingly, the transparent area includes a second routing area 132, which, along with the first routing area 131, is located on either side of the coil arrangement area 12. (Illustrative example follows.) Figure 18dAs shown, the area above the line containing the double-dotted line 130a and to the left of the line containing the double-dotted line 130c is the second wiring area 132. The double-dotted line 130c is a vertical outline line passing through the outer side of the leftmost first auxiliary metal mesh channel 20, and it is set along the first direction X.

[0118] In this embodiment, in the thickness direction of the transparent electromagnetic induction film, the first grid line includes a first overlapping portion that overlaps with the second grid line and a first non-overlapping portion that does not overlap with the second grid line. The second grid line includes a second overlapping portion that overlaps with the first grid line and a second non-overlapping portion that does not overlap with the first grid line. For example, the first main metal grid channel 21 of the first grid line belongs to the first non-overlapping portion, the metal grid connecting line 50 of the second grid line belongs to the second non-overlapping portion, and the first auxiliary metal grid channel 20 and the second auxiliary metal grid channel 40 belong to the first overlapping portion and the second overlapping portion, respectively.

[0119] Optionally, the first overlapping portion and the second overlapping portion include grids of the same size and staggered, and the grids of the first non-overlapping portion and the second non-overlapping portion are smaller than the grids of the first overlapping portion and the second overlapping portion (i.e., the grid density is smaller). Further optional, the grids of the first non-overlapping portion and the second non-overlapping portion are the same size (i.e., the same density) as the grids formed by the overlap of the first overlapping portion and the second overlapping portion.

[0120] It is understood that the descriptions of other structures (including grid ground wires, isolation channels, etc.) in this embodiment can refer to the above text, and those skilled in the art can also make adaptive adjustments according to the actual situation.

[0121] It is understandable that, compared to Embodiment 2, the single-sided wiring method in Embodiment 1 can reduce the area of ​​the film while keeping the size of the effective input area of ​​the transparent electromagnetic induction film unchanged, which is beneficial for miniaturization.

[0122] Example 3

[0123] This embodiment proposes an electromagnetic induction handwriting device (hereinafter referred to as the handwriting device), which includes the transparent electromagnetic induction film 92 described above.

[0124] In some embodiments, such as Figure 19a and Figure 19b As shown, Figure 19a and Figure 19bThe front view and top view of the handwriting device are shown respectively. The handwriting device includes a housing 90, a circuit assembly connected to the housing 90, and a transparent electromagnetic induction film connected to and located outside the housing 90. Optionally, the circuit assembly is located inside the housing 90, and the circuit assembly may include, for example, a circuit board, a data transmission module, and a battery module. The transparent electromagnetic induction film 92 is electrically connected to the circuit assembly. The battery module is used to power the handwriting device, and the data transmission module may include a data interface and / or a wireless transmission module, enabling communication with external devices. One end (first end 1a) of the transparent electromagnetic induction film 92 is fixedly connected to the housing 90, and this end can extend into the housing 90 to connect with the internal circuit board. The main body of the transparent electromagnetic induction film 92 is located outside the housing 90. For example, the wiring area 130 is located inside the housing 90, and the transparent area is located outside the housing 90. Thus, the exposed part of the transparent electromagnetic induction film 92 does not have any observable circuit structure and is transparent overall.

[0125] When the electromagnetic pen writes on the transparent electromagnetic induction film 92, the film generates an induction signal. This signal is processed by the control chip of the circuit component and then transmitted to an external device via a data transmission module. External devices include, but are not limited to, cloud servers and terminal devices, such as mobile phones, tablets, or computers. The data transmission module can record the content written on the transparent electromagnetic induction film in real time on the external device. The written content can be text, lines, etc., and is related to the actual writing trajectory of the electromagnetic pen.

[0126] When the electromagnetic pen writes on the surface of the transparent electromagnetic induction film 92, its coordinate position is transmitted in real time through the data transmission module, and can be displayed on the screen of an external device in real time. Since the transparent electromagnetic induction film 92 is transparent, it can be placed over other objects (such as tracing paper) for tracing purposes, expanding its functionality. Furthermore, the transparent electromagnetic induction film 92 is flexible and can be rolled up for storage, making it more convenient.

[0127] In some embodiments, such as Figure 19c As shown, the handwriting device also includes a transparent support plate 93 fixedly connected to the housing 90. A transparent electromagnetic induction film 92 is adhered to the surface of the transparent support plate 93, providing rigid support. The transparent support plate 93 and the transparent electromagnetic induction film 92 can be used to cover other object surfaces for tracing. The transparent support plate 93 protects the transparent electromagnetic induction film 92 from wrinkles caused by folding, which would affect the reliability of the transparent electromagnetic induction film 92.

[0128] It is understandable that the transparent electromagnetic induction film of the handwriting device can also be the transparent electromagnetic induction film in the existing technology.

[0129] It should be noted that, in the absence of conflict, the various embodiments described herein can be combined with each other to obtain more implementation schemes.

[0130] The above are merely specific embodiments of the present invention, and any improvements made based on the concept of the present invention shall be considered within the scope of protection of the present invention.

Claims

1. A transparent electromagnetic induction film, characterized in that, The transparent electromagnetic induction film is divided into a transparent area and a wiring area (130) located at one end of the transparent electromagnetic induction film. The circuits in the transparent area are all designed in a grid pattern. The transparent electromagnetic induction film includes: The base layer (1) is made of insulating material and includes a first surface (10) and a second surface (11) disposed opposite to each other. The first wiring layer (80) is disposed on the first surface (10) and includes a first wiring assembly (3) located in the wiring area (130) and a first grid line located in the transparent area. The first grid line includes a first coil array (2), and the first wiring assembly (3) includes a first metal solid connecting line (30) connected to the first coil array (2). The second wiring layer (81) is disposed on the second surface (11) and includes a second wiring assembly (5) located in the wiring area (130) and a second grid line located in the transparent area. The second grid line includes a second coil array (4) and a metal grid connecting line (50) connected to the second coil array (4). The second wiring assembly (5) includes a second metal solid connecting line (51) connected to the metal grid connecting line (50).

2. The transparent electromagnetic induction film as described in claim 1, characterized in that, The transparent area includes a coil arrangement area (12) for setting the first coil array (2) and the second coil array (4) and a first wiring area (131) for accommodating the metal mesh connecting line (50). The first coil array (2) includes a plurality of first grids (22), the second coil array (4) includes a plurality of second grids (42), and the metal mesh connecting line (50) includes a plurality of third grids (52). The projections of the first grids (22) and the second grids (42) on a plane perpendicular to the thickness direction of the base layer (1) are staggered. The area of ​​the third grid (52) is smaller than the area of ​​the first grids (22) and the second grids (42).

3. The transparent electromagnetic induction film as described in claim 2, characterized in that, The sub-grid formed by the overlapping projections of the first grid (22) and the second grid (42) in the thickness direction of the transparent electromagnetic induction film is the same size as the third grid (52).

4. The transparent electromagnetic induction film as described in claim 3, characterized in that, The first coil array (2) includes a first main metal mesh channel (21) extending along the second direction Y and multiple first auxiliary metal mesh channels (20) extending along the first direction X. One end of the first auxiliary metal mesh channel (20) in the length direction is connected to the first main metal mesh channel (21), and the other end is connected to the first metal solid connecting line (30). The first wiring assembly (3) includes multiple first metal solid connection lines (30) that are respectively connected to multiple first auxiliary metal mesh channels (20); The first direction X and the second direction Y are perpendicular.

5. The transparent electromagnetic induction film as described in claim 4, characterized in that, The second coil array (4) includes a second main metal mesh channel (41) extending along the first direction X and multiple second auxiliary metal mesh channels (40) extending along the second direction Y. One end of the second auxiliary metal mesh channel (40) in the length direction is connected to the second main metal mesh channel (41), and the other end is connected to the metal mesh connecting line (50). The second wiring assembly (5) includes multiple second metal solid connection lines (51) that are respectively connected to multiple metal mesh connection lines (50).

6. The transparent electromagnetic induction film as described in claim 4, characterized in that, The second coil array (4) includes multiple second auxiliary metal mesh channels (40) arranged at intervals along the first direction X. The second auxiliary metal mesh channels (40) extend along the second direction Y. The second line layer (81) includes two sets of second wiring assemblies (5) located on both sides of the first wiring assembly (3). Both ends of the second auxiliary metal mesh channel (40) are electrically connected to the second wiring assembly (5) through metal mesh connecting lines (50). The second wiring assembly (5) includes multiple second metal solid connection lines (51) that are respectively connected to the metal mesh connection line (50).

7. The transparent electromagnetic induction film as described in claim 5 or 6, characterized in that, The first coil array (2) includes a first grid isolation channel (23) disposed between adjacent first auxiliary metal grid channels (20). The metal wires of the first grid isolation channel (23) are arranged in the same way as the first main metal grid channel (21) and the first auxiliary metal grid channel (20), and there is a break between the first main metal grid channel (21) and the first auxiliary metal grid channel (20). The second coil array (4) includes a second grid isolation channel (43) disposed between adjacent second auxiliary metal grid channels (40). The metal wires of the second grid isolation channel (43) and the second auxiliary metal grid channel (40) are arranged in the same way, and a break (230) is provided between them. The second wiring assembly (5) includes a third mesh isolation channel (53) disposed between adjacent metal mesh connecting lines (50). The metal wires of the third mesh isolation channel (53) and the metal mesh connecting lines (50) are arranged in the same way, and there is a break (230) between them.

8. The transparent electromagnetic induction film as described in claim 7, characterized in that, The first grid line also includes a first grid ground wire (60) disposed on the first surface (10) and a fourth grid isolation channel (61) located inside the first grid ground wire (60). The first wiring assembly (3) includes a third metal solid connection wire (32) connected to the first grid ground wire (60). The first grid line also includes a second grid ground wire (70) disposed on the second surface (11) and a fifth grid isolation channel (71) disposed inside the second grid ground wire (70). The second wiring assembly (5) includes a fourth metal solid connection wire connected to the second grid ground wire (70).

9. The transparent electromagnetic induction film as described in claim 8, characterized in that, At least a portion of the fourth grid isolation channel (61) includes at least two cross lines arranged along the width direction of the fourth grid isolation channel (61), the cross lines being composed of two metal wires; At least a portion of the fifth grid isolation channel (71) includes at least two cross lines arranged along the width direction of the fifth grid isolation channel (71), the cross lines being composed of two metal wires.

10. The transparent electromagnetic induction film as described in claim 8, characterized in that, The width W1 of the fourth grid isolation channel (61) is greater than the width W2 of the first grid isolation channel (23), and the width W3 of the fifth grid isolation channel (71) is greater than the width W4 of the second grid isolation channel (43).

11. The transparent electromagnetic induction film as described in claim 1, characterized in that, In the thickness direction of the transparent electromagnetic induction film, the projections of the first grid line and the second grid line have overlapping and non-overlapping regions. The portion of the first grid line corresponding to the overlapping region is called the first overlapping portion, and the portion corresponding to the non-overlapping region is called the first non-overlapping portion. The portion of the second grid line corresponding to the overlapping region is called the second overlapping portion, and the portion corresponding to the non-overlapping region is called the second non-overlapping portion. The grids included in the first overlapping portion and the second overlapping portion are of the same size and are staggered. The distance L3 between the projections of two adjacent parallel metal lines is not less than 100 μm. The grid of the non-overlapping region is smaller than the grids of the first overlapping portion and the second overlapping portion.

12. The transparent electromagnetic induction film as described in claim 11, characterized in that, The grid in the non-overlapping region is the same size as the grid formed by the overlap of the first overlapping portion and the second overlapping portion.

13. The transparent electromagnetic induction film as described in claim 1, characterized in that, The first grid line includes multiple parallel first metal lines (220) and multiple parallel second metal lines (221), and the first metal lines (220) and the second metal lines (221) are arranged to cross each other; The second grid line includes multiple parallel third metal lines (420) and multiple parallel fourth metal lines (421), wherein the third metal lines (420) and the fourth metal lines (421) are arranged in an intersecting manner.

14. An electromagnetic induction handwriting device, characterized in that, include: Casing (90); Circuit components, connected to the housing (90); and, The transparent electromagnetic induction film (92) as described in any one of claims 1 to 13 is connected to the housing (90) and is at least partially located outside the housing (90).

15. The electromagnetic induction handwriting device as described in claim 14, characterized in that, It also includes a transparent support plate (93) fixedly connected to the housing (90), and the transparent electromagnetic induction film (92) is attached to the surface of the transparent support plate (93); The wiring area (130) is located inside the housing (90), and the transparent area is located outside the housing (90).

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