A media window structure preventing by-product drop and semiconductor processing equipment

Abstract

The application relates to the technical field of wafer processing equipment, in particular to a medium window structure capable of preventing by-products from falling and a semiconductor processing equipment, which comprises a medium window body, a by-product suction accessory and a by-product recovery piece; the by-product suction accessory is arranged at the bottom of the medium window body; the by-product recovery piece comprises a rotary driving part and a recovery scraping part, the top of the recovery scraping part is arranged in sliding contact with the bottom of the by-product suction accessory, the recovery scraping part is arranged in radial extension, and the driving end of the rotary driving part is connected with the recovery scraping part; through cooperation of the medium window body, the by-product suction accessory with a suction electric field and the by-product recovery piece capable of rotating in the circumferential direction, the by-product suction accessory is used to actively adsorb and fix the charged by-product particles generated in the reaction on the bottom of the by-product suction accessory by means of the adsorption electric field, so that the problem that the by-products directly deposit and adhere on the surface of the medium window in disorder and are peeled off and fall off due to insufficient adhesion is avoided from the source.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, and in particular to a dielectric window structure and semiconductor processing equipment for preventing by-products from falling off. Background Technology

[0002] In inductively coupled plasma etching equipment, the quartz or ceramic dielectric window must both seal the vacuum and transmit the radio frequency electromagnetic field. However, the byproducts generated by the etching reaction tend to deposit on the side facing the plasma. The deposited layer not only distorts the electromagnetic field and affects the uniformity of discharge, but also peels off due to insufficient adhesion, falling directly onto the wafer below and causing particulate contamination. Existing methods such as airflow optimization and regular cleaning cannot solve this problem at its root, which seriously affects the wafer yield. Summary of the Invention

[0003] This invention relates to a dielectric window structure and semiconductor processing equipment to prevent byproducts from falling off. The purpose is to solve the problem in existing inductively coupled plasma etching equipment where byproducts at the bottom of the dielectric window are easily deposited, peeled off, and fall onto the wafer, causing particle contamination and affecting discharge uniformity and wafer yield.

[0004] To achieve the above objectives, the present invention provides a medium window structure for preventing byproducts from falling, comprising: The medium window body is a window located at the top of the reaction chamber; A byproduct adsorbent is disposed at the bottom of the medium window body. The orthographic projection structure of the byproduct adsorbent on the bottom of the medium window body covers the orthographic projection structure of the window on the bottom of the medium window body. The byproduct adsorbent is connected to an external power source and forms an adsorption electric field after being energized, which is used to adsorb and fix the charged byproduct particles generated by the reaction to the bottom of the byproduct adsorbent. The by-product recovery unit includes a rotary drive unit and a recovery scraping unit. The top of the recovery scraping unit is slidably contacted with the bottom of the by-product adsorption unit, and the recovery scraping unit extends radially. The drive end of the rotary drive unit is connected to the recovery scraping unit to drive the recovery scraping unit to rotate circumferentially and scrape off the by-products adsorbed and fixed on the bottom of the by-product adsorption unit.

[0005] Optionally, the media window structure for preventing by-products from falling also includes a spray element; The air inlet of the spray element is connected to the air supply pipeline, and its air outlet axially passes through the medium window body and the by-product adsorption element and extends into the reaction chamber to deliver plasma into the reaction chamber.

[0006] Optionally, the recycling scraping section includes a first end near the inner sidewall of the window and a second end near the spray element; The rotary drive unit is disposed on the inner sidewall of the window and connected to the first end, and the second end is slidably contacted with the circumferential outer sidewall of the spray component. Alternatively, the rotary drive unit may be disposed on the spray member and connected to the second end, and the first end may be slidably contacted with the inner sidewall of the window.

[0007] Optionally, the rotary drive unit includes a connecting part, a first drive unit, and a plurality of second drive units; The inner wall of the window has a recessed annular storage groove extending circumferentially, and the connecting part is located at the first end of the recycling and scraping part; or the outer wall of the spray component has a recessed annular storage groove extending circumferentially, and the connecting part is located at the second end of the recycling and scraping part. The connecting part extends radially and extends into the annular storage groove, and is slidably in contact with the side wall of the annular storage groove. The first driving part is located on the connecting part, and a plurality of second driving parts are arranged circumferentially in the annular storage groove. The first driving part and the plurality of second driving parts are respectively connected to an independent power supply. By controlling the power on and off of each second driving part, the first driving part is attracted, thereby causing the recycling scraping part to rotate circumferentially through the connecting part.

[0008] Optionally, the recycling scraping section includes a contact surface and a scraping cleaning surface. The contact surface is slidably contacted with the by-product adsorption element. The scraping cleaning surface is located on the side of the recycling scraping section away from the by-product adsorption element and forms an acute angle structure with the contact surface. The scraping cleaning surface is an arc-shaped structure and is curved toward the by-product adsorption element.

[0009] Optionally, the scraping section is provided with a collection chamber connected to the by-product suction component, and the arc-shaped structure is provided with a plurality of collection channels communicating with the collection chamber, so as to collect the scraped by-products into the collection chamber through the collection channels and then extract them.

[0010] Optionally, the connecting portion is provided with a first channel communicating with the collecting cavity; The reaction chamber is provided with a second channel on the side wall near the window or in the spray component to connect the first channel and the by-product suction component, so that the scraped by-products are sequentially extracted through the collection chamber, the first channel, the second channel and the by-product suction component.

[0011] Optionally, the first channel includes a first conductive cavity and a second conductive cavity; The first conductive cavity is disposed at the end of the connecting portion near the recycling scraping portion, and the first conductive cavity is in communication with the collection cavity; the top of the connecting portion has a second conductive cavity that is in communication with the first conductive cavity, and the second conductive cavity is in communication with the second channel, wherein the radial length of the first conductive cavity is greater than the radial length of the second conductive cavity.

[0012] Optionally, the second channel includes a connecting channel, a buffer chamber, and a discharge channel connected in sequence; The chambers of the connecting channel and the buffer chamber both extend circumferentially in a ring-shaped structure, and the radial length of the discharge channel is between the radial length of the connecting channel and the radial length of the buffer chamber. The connecting channel is connected to the second conductive cavity, and the discharge channel is connected to the by-product suction device.

[0013] Optionally, the medium window structure for preventing by-products from falling also includes a shielding ring; The shielding ring is disposed circumferentially within the annular storage groove and is in sliding contact with the side wall of the annular storage groove. The connecting part is fixedly inserted into the shielding ring so that the shielding ring rotates within the annular receiving groove as the connecting part rotates.

[0014] Optionally, the dielectric window structure for preventing by-products from falling also includes an insulating component; The insulating element is located on the side of the by-product recovery element near the by-product adsorption element.

[0015] To achieve the above objectives, the present invention also provides a semiconductor processing apparatus, including a reaction chamber, a chamber cover, an induction coil, a shield, and a second power supply, as well as the aforementioned dielectric window structure for preventing by-products from falling. The chamber cover is disposed on the top of the reaction chamber and connected to the dielectric window body within the dielectric window structure for preventing by-products from falling. The induction coil is disposed on the top of the dielectric window body and connected to the second power supply. The shield is disposed on the top of the reaction chamber and forms a sealed chamber that encloses the induction coil.

[0016] The beneficial effects of this invention are as follows: This invention utilizes a combination of a dielectric window body, a byproduct adsorption element with an adsorption electric field, and a circumferentially rotatable byproduct recovery element. First, the adsorption electric field generated by the byproduct adsorption element actively adsorbs and fixes the charged byproduct particles generated during the reaction to its bottom, preventing the disorderly deposition and insufficient adhesion of byproducts on the dielectric window surface, which can lead to peeling and falling off. Simultaneously, the recovery and scraping unit continuously rotates circumferentially under the drive of the rotary unit, scraping away the adsorbed and fixed byproducts in real time. This prevents excessive accumulation of adsorbed byproducts from affecting the adsorption effect and avoids the risk of byproducts falling off after shutdown. It effectively ensures the uniformity of the electromagnetic field distribution at the dielectric window body, fundamentally solving the wafer contamination problem caused by byproducts falling off, significantly improving wafer processing yield, and eliminating the need for frequent shutdowns to disassemble and clean the dielectric window body, thus reducing equipment maintenance costs. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a semiconductor processing device in some embodiments of the present invention; Figure 2 for Figure 1 An enlarged schematic diagram of the structure at position A in the diagram; Figure 3 for Figure 1 A schematic diagram of the scraping component is shown in the figure; Figure 4 This is a schematic diagram of the shielding ring component in some embodiments of the present invention.

[0018] Explanation of reference numerals in the attached figures: 1. Reaction chamber; 2. Chamber cover; 3. Medium window body; 4. Spray component; 41. Buffer chamber; 42. Connecting channel; 43. Discharge channel; 5. By-product adsorption component; 6. First power supply; 7. By-product recovery component; 71. Recovery scraping section; 711. Collection chamber; 712. Collection channel; 72. Rotary drive section; 721. Annular storage groove; 722. Connecting section; 7221. First conductive cavity; 7222. Second conductive cavity; 723. First drive section; 724. Second drive section; 8. By-product suction component; 9. Insulating component; 10. Induction coil; 11. Shielding cover; 12. Second power supply; 13. Shielding ring component. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.

[0020] This invention relates to a dielectric window structure and semiconductor processing equipment to prevent byproducts from falling off. The purpose is to solve the problem in existing inductively coupled plasma etching equipment where byproducts at the bottom of the dielectric window are easily deposited, peeled off, and fall onto the wafer, causing particle contamination and affecting discharge uniformity and wafer yield.

[0021] To address the problems existing in the prior art, embodiments of the present invention provide a medium window structure to prevent byproducts from falling, such as... Figure 1 As shown, the media window structure for preventing by-products from falling includes a media window body 3, a by-product adsorption component 5, and a by-product recovery component 7.

[0022] In some embodiments, such as Figure 1 As shown, the medium window body 3 is located at the top of the reaction chamber 1. Specifically, the medium window body 3 is located at the top of the chamber cover 2, which is located at the top of the reaction chamber 1, and the chamber cover 2 has a through window. The medium window body 3 covers the window.

[0023] In some embodiments, such as Figure 1 As shown, the byproduct adsorption element 5 is disposed at the bottom of the dielectric window body 3, and preferably, the byproduct adsorption element 5 is connected to the bottom of the dielectric window body 3 by an embedded method. The byproduct adsorption element 5 is connected to the first power supply 6. The first power supply 6 can be a DC high-voltage power supply or a low-frequency AC power supply, and the output voltage and polarity can be flexibly adjusted according to the charge properties of the byproduct. It can form a stable and uniform adsorption electric field on the surface of the byproduct adsorption element 5, ensuring efficient capture of byproduct particles with corresponding charge properties, without the need for matching high-frequency complex power supply circuits. The structure is simple and easy to control, and it can also avoid abnormal discharge damage to the dielectric window body 3 or interference with the plasma process due to excessive voltage, thus balancing adsorption effect and operational safety.

[0024] Preferably, the byproduct adsorption element 5 can be a porous grid, a woven wire mesh, or a hollow electrode plate structure. The grid structure can ensure full coverage of the reaction area, while reserving channels for the magnetic field generated by the subsequent induction coil 10 to pass through, thus avoiding interference with the normal process gas distribution and discharge process. It can also efficiently capture charged byproduct particles by utilizing the uniform adsorption electric field formed around the mesh after energization. At the same time, the hollow characteristics of the grid can reduce its own shielding and attenuation of the radio frequency electromagnetic field, ensuring the electromagnetic field transmission efficiency of the dielectric window body 3, thus balancing the adsorption effect and process stability.

[0025] In some embodiments, such as Figure 1 As shown, the orthographic projection structure of the by-product adsorption element 5 on the bottom of the dielectric window body 3 covers the orthographic projection structure of the window on the bottom of the dielectric window body 3; all charged by-products generated in this area are within the coverage of the adsorption electric field, avoiding by-products in the edge area from being adsorbed and directly deposited on the bottom of the dielectric window body 3, ensuring adsorption without dead corners, blocking the path of peeled by-products falling to the wafer from the source, and also avoiding distortion of the electromagnetic field at the dielectric window by the deposition layer, ensuring discharge uniformity.

[0026] In some embodiments, such as Figure 1 As shown, the byproduct adsorption element 5 is connected to an external power source and forms an adsorption electric field after being energized, which is used to adsorb and fix the charged byproduct particles generated by the reaction to the bottom of the byproduct adsorption element 5.

[0027] In some embodiments, such as Figure 1 As shown, the by-product recovery unit 7 includes a rotary drive unit 72 and a recovery scraping unit 71. The top of the recovery scraping unit 71 is slidably contacted with the bottom of the by-product adsorption unit 5, and the recovery scraping unit 71 extends radially. The drive end of the rotary drive unit 72 is connected to the recovery scraping unit 71 to drive the recovery scraping unit 71 to rotate circumferentially and scrape off the by-products adsorbed and fixed on the bottom of the by-product adsorption unit 5.

[0028] This setup enables continuous online cleaning of byproducts. The scraping unit 71 slides in contact with the bottom of the byproduct adsorption unit 5, and during circumferential rotation, it can thoroughly sweep across all areas of the adsorption surface, completely scraping away firmly attached byproducts. This avoids the problem of byproducts accumulating over a long period, which can weaken the adsorption electric field or even cause them to peel off. The radially extended structure adapts to the circular cross-section of the window, allowing for full-area cleaning with a single rotation. This eliminates the need for complex reciprocating motion structures, improving cleaning efficiency and simplifying the complexity of the drive structure. Byproduct recovery can be completed without interrupting the process, balancing process continuity and cleaning reliability.

[0029] In some embodiments, such as Figure 1As shown, the media window structure for preventing byproducts from falling also includes a spray element 4; the air inlet of the spray element 4 is connected to the gas supply pipeline, and its air outlet axially penetrates the media window body 3 and the byproduct adsorption element 5 in sequence and extends into the reaction chamber 1 to deliver plasma into the reaction chamber 1. The spray element 4 is preferably located in the middle of the media window body 3.

[0030] The spray element 4 is integrated into the middle of the medium window body 3. This structure, which axially penetrates the byproduct adsorption element 5, enables the precise delivery of process gas to the center of the reaction chamber 1, ensuring uniform plasma distribution. It also allows the outer periphery of the spray element 4 to be adapted to the rotation path of the recovery and scraping part 71, avoiding additional occupation of the top space of the reaction chamber.

[0031] In some embodiments, such as Figure 1 As shown, the recycling scraping section 71 includes a first end near the inner sidewall of the window and a second end near the spray member 4.

[0032] In some embodiments, such as Figure 1 As shown, the rotary drive unit 72 is disposed on the inner sidewall of the window and connected to the first end, and the second end is slidably contacted with the circumferential outer sidewall of the spray component 4. By integrating the rotary drive unit 72 into the inner sidewall of the window, there is no need to open a drive installation channel inside the medium window body 3 or the spray component 4. This simplifies the processing difficulty and sealing requirements of the core functional components, and also provides stable radial support for the second end of the recycling scraping unit 71 by means of the circumferential outer sidewall of the spray component 4, avoiding the problem of end shaking or uneven scraping caused by the excessive cantilever of the recycling scraping unit 71.

[0033] In some embodiments, such as Figure 1 As shown, the rotary drive unit 72 is disposed on the spray member 4 and connected to the second end, while the first end is slidably contacted with the inner wall of the window. Integrating the rotary drive unit 72 onto the centrally located spray member 4, with the spray member 4 as a rigid support base, can significantly shorten the force transmission path from the drive end to the recycling scraping unit 71, reduce the risk of cantilever deformation under stress, and improve the stability of the scraping process. At the same time, placing the drive structure on the spray member 4 can further compress the annular space occupied by the inner wall of the window, making it easier to adapt to the compact layout of the small-sized reaction chamber 1. It can also prevent the deposited byproducts on the window sidewall from adhering to the drive structure and affecting its operation, reducing the probability of failure. It is also easier to disassemble and maintain the spray module and drive components separately, improving the convenience of operation and maintenance.

[0034] In some embodiments, such as Figure 2 As shown, the rotary drive unit 72 includes a connecting part 722, a first drive unit 723, and a plurality of second drive units 724.

[0035] In some embodiments, such as Figure 2 As shown, the inner wall of the window has a recessed annular storage groove 721 extending circumferentially, and the connecting part 722 is provided at the first end of the recycling scraping part 71; or the outer wall of the spray member 4 has a recessed annular storage groove 721 extending circumferentially, and the connecting part 722 is provided at the second end of the recycling scraping part 71.

[0036] In some embodiments, such as Figure 2 As shown, the connecting portion 722 extends radially and extends into the annular receiving groove 721. The first driving portion 723 is disposed on the connecting portion 722, and a plurality of second driving portions 724 are arranged circumferentially at intervals within the annular receiving groove 721. The first driving portion 723 and the plurality of second driving portions 724 are respectively connected to an independent power supply. By controlling the on and off of power to each of the second driving portions 724, the first driving portion 723 is attracted, thereby causing the recycling scraping portion 71 to rotate circumferentially through the connecting portion 722.

[0037] This embodiment employs a non-contact magnetic drive structure, avoiding the sealing problems caused by the need for opening holes and passing shafts in traditional mechanical transmissions. This prevents leakage of process gases in the reaction chamber and blocks the passage of by-products into the drive unit. By independently controlling the on / off timing of each second drive unit 724, the magnitude and direction of the attraction force on the first drive unit 723 can be precisely adjusted, enabling fine-grained control of the rotation speed and start / stop position of the recycling and scraping unit 71. It can also switch between forward / reverse or intermittent rotation modes as needed to adapt to the by-product cleaning requirements of different process stages. At the same time, the non-contact transmission method reduces mechanical wear, and the closed annular collection tank 721 layout significantly reduces the risk of plasma and by-product erosion, improving the service life and operational stability of the drive system.

[0038] It is worth noting that the connecting part 722 is slidably contacted with the side wall of the annular receiving groove 721. The sliding cooperation between the connecting part 722 and the annular receiving groove 721 forms a dynamic sealing barrier. On the one hand, it can prevent by-product particles in the reaction chamber 1 from entering the interior of the annular receiving groove 721, avoiding the accumulation of particles in the gap of the drive structure and causing jamming. On the other hand, the groove structure can physically shield the driving magnetic field generated by the first drive part 723 and the second drive part 724, reducing the leakage of the magnetic field into the reaction chamber 1 and avoiding interference with the electric field distribution of the plasma discharge area. At the same time, it can also prevent the external high-frequency process magnetic field from invading the drive unit in the reverse direction and affecting the stability of the magnetic drive control, thus taking into account both the operational reliability of the drive system and the magnetic field purity of the process environment.

[0039] In some embodiments, the first drive unit 723 and the second drive unit 724 can be electromagnets or permanent magnets, respectively. The two work together to generate a controllable attractive force through the switching of magnetic poles and polarity, which can achieve power transmission without physical contact. This avoids the wear and sealing problems of mechanical transmission. Furthermore, by independently controlling the current switching and timing of the second drive unit 724, the magnitude and direction of the traction force on the first drive unit 723 can be precisely adjusted, and the rotation speed, direction and start / stop position of the recycling scraping unit 71 can be flexibly controlled to adapt to the cleaning needs under different by-product loads. At the same time, the magnetic drive components are encapsulated in the annular storage groove 721, which can effectively isolate the plasma erosion in the reaction chamber and improve the reliability and service life of the drive system.

[0040] In some embodiments, the shape of the connecting part 722 is preferably an arc-shaped block structure adapted to the annular storage groove 721. Its curvature matches the circumferential extension trajectory of the storage groove, which can not only slide smoothly in the groove to ensure the stability of the rotation process, but also fully embed itself in the groove to obtain radial limit, avoiding swaying when the recycling scraping part 71 rotates; at the same time, the arc-shaped structure can increase the relative interaction area with the first driving part 723 and the second driving part 724, improve the magnetic driving force transmission efficiency, and reduce the adhesion and accumulation of by-products at the structural corners, reduce the risk of jamming, and take into account both transmission reliability and operational stability.

[0041] In some embodiments, such as Figure 3 As shown, the recycling scraping part 71 includes a contact surface and a scraping cleaning surface. The contact surface is slidably contacted with the by-product adsorption member 5. The scraping cleaning surface is located on the side of the recycling scraping part 71 facing away from the by-product adsorption member 5 and forms an acute angle structure with the contact surface. The scraping cleaning surface is an arc-shaped structure and is bent toward the by-product adsorption member 5.

[0042] By ensuring a tight sliding fit between the contact surface and the bottom of the by-product adsorption component 5, scraping is achieved without any dead corners. The acute angle structure formed by the contact surface and the arc-shaped scraping and cleaning surface that bends towards the adsorption component is equivalent to forming a sharp scraping edge at the front end of the scraping section, which can efficiently peel off firmly adsorbed by-products. At the same time, the scraping and cleaning surface can gather and guide the scraped particles, preventing by-products from splashing and scattering in all directions, and causing them to concentrate and collect in the inner side of the recovery scraping section 71. This not only improves the scraping efficiency, but also creates conditions for the centralized suction and recovery of by-products in the future, and reduces the risk of debris falling onto the wafer during the scraping process, thus balancing the cleaning effect and process cleanliness.

[0043] In some embodiments, such as Figure 3As shown, the recycling scraping section 71 is provided with a collection cavity 711 connected to the by-product suction component 8. The arc-shaped structure is provided with a plurality of collection channels 712 communicating with the collection cavity 711, so that the scraped by-products are collected into the collection cavity 711 through the collection channels 712 and then extracted.

[0044] This design allows for the simultaneous collection and discharge of byproducts during the scraping process. The collection channel 712 on the arc-shaped structure uses the negative pressure of the suction component to directly draw the scraped-off byproducts into the collection chamber 711, preventing the scraped-off particles from accumulating again at the bottom of the byproduct adsorption component 5 or even falling onto the wafer surface. The integrated design of the collection chamber 711 and the collection channel 712 allows the scraping and collection actions to be completed simultaneously, eliminating the need for additional transfer steps and significantly improving the thoroughness of byproduct cleaning. At the same time, byproducts can be directly discharged from the reaction chamber 1, blocking the path for byproducts to fall back into the reaction chamber 1 from the source. This reduces particle contamination inside the reaction chamber 1, extends the continuous operating time of the equipment, and reduces the maintenance frequency.

[0045] In some embodiments, such as Figure 2 As shown, the connecting part 722 is provided with a first channel communicating with the collecting chamber 711; the side wall of the reaction chamber 1 near the window or the spray member 4 is provided with a second channel for communicating with the first channel and the by-product suction member 8, so that the scraped by-products are sequentially extracted through the collecting chamber 711, the first channel, the second channel and the by-product suction member 8.

[0046] This configuration integrates the extraction channel into the connection part 722 and the interior of the chamber side wall or spray component 4, eliminating the need for additional external exposed suction pipes. This avoids the pipes occupying the internal space of the reaction chamber and interfering with the plasma distribution. Furthermore, the rotating connection part 722 enables the docking of the first channel with the fixed second channel, achieving seamless connection between the rotating component and the static suction system.

[0047] In some embodiments, such as Figure 2 As shown, the first channel includes a first conductive cavity 7221 and a second conductive cavity 7222; the first conductive cavity 7221 is disposed at the end of the connecting portion 722 near the recycling scraping portion 71, and the first conductive cavity 7221 communicates with the collection cavity 711; the top of the connecting portion 722 has a second conductive cavity 7222 that communicates with the first conductive cavity 7221, and the second conductive cavity 7222 communicates with the second channel, wherein the radial length of the cavity of the first conductive cavity 7221 is greater than the radial length of the cavity of the second conductive cavity 7222.

[0048] By designing the large radial length of the first guiding cavity 7221, a large-volume transition cavity can be formed at the position of the connecting part 722 near the recycling scraping part 71. This cavity can not only receive the byproducts sucked in by the collection channel 712 and buffer the instantaneous suction flow fluctuations, thus preventing the suction negative pressure from directly acting on the cleaning scraping surface and causing the scraped particles to scatter, but also reduce the airflow velocity and allow the byproducts to initially settle in the cavity, reducing the number of fine particles that directly enter the second guiding cavity 7222 with the airflow and cause blockage. Meanwhile, the small radial length of the second guiding cavity 7222 is adapted to the narrow space in the annular collection groove 721, ensuring stable docking with the second channel while avoiding radial interference when the connecting part 722 rotates.

[0049] In some embodiments, such as Figure 2 As shown, the second channel includes a connecting channel 42, a buffer chamber 41, and a discharge channel 43 connected in sequence; the chambers of the connecting channel 42 and the buffer chamber 41 both extend circumferentially in an annular structure, and the radial length of the discharge channel 43 is between the radial length of the connecting channel 42 and the radial length of the buffer chamber 41; the connecting channel 42 is connected to the second conductive cavity 7222, and the discharge channel 43 is connected to the by-product suction element 8.

[0050] The annular connecting channel 42 forms a stable circumferential interface with the rotating second conductive cavity 7222. Even if the scraping section 71 continues to rotate, the suction passage can always be kept connected. There is no need to set up an additional rotary sealing joint, which simplifies the structure and avoids the risk of seal failure. The annular large-volume design of the buffer cavity 41 can stabilize and decelerate the suction airflow, allowing the by-product particles to settle and be temporarily stored, and preventing the high-speed airflow from directly carrying particles to impact the discharge channel 43 and causing blockage. The radial length of the discharge channel 43 between the two plays a transitional narrowing role, which ensures that the settled by-products can smoothly enter the external suction pipeline, while avoiding excessive loss of suction negative pressure, thus taking into account the reliability of the connection under the rotating condition, the by-product buffering capacity and the suction efficiency.

[0051] In some embodiments, such as Figure 4 As shown, the medium window structure for preventing by-products from falling also includes a shielding ring 13; the shielding ring 13 is disposed circumferentially in the annular storage groove 721 and is slidably contacted with the side wall of the annular storage groove 721; the connecting part 722 is fixedly inserted into the shielding ring 13 so that the shielding ring 13 rotates in the annular storage groove 721 as the connecting part 722 rotates.

[0052] In this embodiment, the shielding ring 13 rotates synchronously with the connecting part 722 within the annular receiving groove 721, forming a dynamic circumferential sealing barrier with the side wall of the groove. On one hand, it fills the gap between the connecting part 722 and the annular receiving groove 721, preventing byproduct particles in the reaction chamber 1 from entering the interior of the annular receiving groove 721 and avoiding blockage; on the other hand, the shielding ring 13, made of metal, forms a closed-loop shield for the magnetic drive magnetic field of the first driving part 723 and the second driving part 724, preventing the driving magnetic field from leaking into the reaction chamber 1 and interfering with the uniformity of plasma discharge, and preventing the high-frequency electromagnetic field in the process area from invading the driving unit in the reverse direction and affecting the magnetic control accuracy. At the same time, it can also block the active components in the plasma from corroding the driving components in the groove, thus taking into account the anti-blocking of the pumping system, the purity of the magnetic field environment, and the operational stability of the driving unit.

[0053] It is worth noting that the orthographic projection of the shielding ring 13 on the top of the annular receiving groove 721 covers the by-product inlet end of the connecting channel 42, forming a continuous physical shielding barrier at the inlet end of the connecting channel 42. This not only further prevents by-product particles in the reaction chamber 1 from falling directly into the connecting channel 42 and causing blockage, but also enhances the magnetic field shielding effect, preventing the magnetic circuit of the drive unit from leaking through the inlet end and interfering with the process plasma. At the same time, it can also reduce the plasma from intruding into the annular receiving groove 721 along the gap and eroding the drive components. With the rotation of the shielding ring 13, dynamic dust prevention and magnetic field isolation are achieved at the pumping inlet, further improving the operational reliability of the system.

[0054] This can be understood as the scraped byproducts only entering the collection chamber 711 through the collection channel 712, and then entering the connecting channel 42 through the first channel.

[0055] In some embodiments, such as Figure 3 As shown, the medium window structure for preventing by-products from falling also includes an insulating component 9; the insulating component 9 is disposed on the side of the by-product recovery component 7 near the by-product adsorption component 5.

[0056] An insulating component 9 is added to the side of the by-product recovery component 7 near the by-product adsorption component 5. This effectively blocks the conduction of the adsorption electric field formed by the energized by-product adsorption component 5 to the recovery scraping section 71, preventing the energized recovery scraping section 71 from causing distortion of the adsorption electric field and weakening the adsorption effect on by-products. It also prevents the adsorbed charged by-products from transferring and adhering to the by-product recovery component 7 during the scraping process, ensuring the thoroughness of the scraping process. In addition, the insulating component 9 also plays a physical isolation role, preventing micro-discharge or arcing between the by-product recovery component 7 and the by-product adsorption component 5 due to contact friction. This protects the delicate dielectric window and adsorption component structure, and also avoids the interference of abnormal discharge on the stability of the plasma process in the chamber, further improving the reliability of equipment operation and process consistency.

[0057] In some embodiments, the insulating element 9 can be made of dielectric materials such as ceramics, polytetrafluoroethylene, or high-temperature resistant silicone rubber. These materials not only have excellent electrical insulation properties, which can stably block the conduction path of the adsorption electric field and prevent the charging of the recycling element from affecting the adsorption effect, but also have good resistance to plasma corrosion and high temperature resistance. They can adapt to the harsh process environment in the reaction chamber 1 and are not prone to aging, deformation, or gas release and contamination of the chamber due to long-term exposure. At the same time, the surface friction coefficient is low, which can reduce wear when sliding contacting the by-product adsorption element 5, thus taking into account insulation performance, environmental tolerance, and operational stability.

[0058] To address the problems existing in the prior art, embodiments of the present invention also provide a semiconductor processing apparatus, such as... Figure 1 As shown, the semiconductor processing device includes a reaction chamber 1, a chamber cover 2, an induction coil 10, a shield 11, and a second power supply 12, as well as a dielectric window structure to prevent by-products from falling. The chamber cover 2 is located on the top of the reaction chamber 1 and is connected to the dielectric window body 3 within the dielectric window structure to prevent by-products from falling. The induction coil 10 is located on the top of the dielectric window body 3 and is connected to the second power supply 12. The shield 11 is located on the top of the reaction chamber 1 and forms a sealed chamber that encloses the induction coil 10.

[0059] In some embodiments, the second power supply 12 can be a radio frequency power supply, which can match the conventional excitation frequency of inductively coupled plasma and provide stable high-frequency energy to the induction coil 10. This ensures the stable generation and uniform maintenance of plasma in the reaction chamber 1, and can also reduce electromagnetic leakage in conjunction with the shielding design of the shield 11. At the same time, the power supply technology in this frequency band is mature and has a wide power adjustment range, which can adapt to the discharge power requirements of different process steps.

[0060] In some embodiments, the semiconductor processing equipment can be an inductively coupled plasma etching equipment, a resist stripping equipment, or a chemical vapor deposition equipment. These types of equipment all rely on the transmission of radio frequency electromagnetic fields through a dielectric window to maintain the plasma reaction in the reaction chamber 1. During the reaction process, a large number of charged byproducts are easily generated and deposited at the bottom of the dielectric window body 3. The structure of the present invention can be directly adapted to the top layout of the reaction chamber 1 of the above-mentioned equipment. Without interfering with the original process flow field and electromagnetic field distribution, it can achieve active adsorption and online cleaning of byproducts, effectively solve the wafer contamination problem caused by byproduct peeling under different process scenarios, and improve the yield of various plasma processes and the stability of continuous equipment operation.

[0061] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the present invention. Furthermore, the present invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A medium window structure for preventing byproducts from falling, characterized in that, include: The medium window body is a window located at the top of the reaction chamber; A byproduct adsorbent is disposed at the bottom of the medium window body. The orthographic projection structure of the byproduct adsorbent on the bottom of the medium window body covers the orthographic projection structure of the window on the bottom of the medium window body. The byproduct adsorbent is connected to an external power source and forms an adsorption electric field after being energized, which is used to adsorb and fix the charged byproduct particles generated by the reaction to the bottom of the byproduct adsorbent. The by-product recovery unit includes a rotary drive unit and a recovery scraping unit. The top of the recovery scraping unit is slidably contacted with the bottom of the by-product adsorption unit, and the recovery scraping unit extends radially. The drive end of the rotary drive unit is connected to the recovery scraping unit to drive the recovery scraping unit to rotate circumferentially and scrape off the by-products adsorbed and fixed on the bottom of the by-product adsorption unit. The recycling scraping section includes a scraping and cleaning surface, which has an arc structure and is bent toward the by-product adsorption element; The scraping section is provided with a collection chamber connected to the by-product suction component. The arc-shaped structure is provided with a number of collection channels communicating with the collection chamber, so as to collect the scraped by-products into the collection chamber through the collection channels and then extract them.

2. The medium window structure for preventing by-products from falling as described in claim 1, characterized in that, It also includes spray components; The air inlet of the spray element is connected to the air supply pipeline, and its air outlet axially passes through the medium window body and the by-product adsorption element and extends into the reaction chamber to deliver plasma into the reaction chamber.

3. The medium window structure for preventing by-products from falling according to claim 2, characterized in that, The recycling scraping section includes a first end near the inner wall of the window and a second end near the spray element; The rotary drive unit is disposed on the inner sidewall of the window and connected to the first end, and the second end is slidably contacted with the circumferential outer sidewall of the spray component. Alternatively, the rotary drive unit may be disposed on the spray member and connected to the second end, and the first end may be slidably contacted with the inner sidewall of the window.

4. The medium window structure for preventing by-products from falling according to claim 3, characterized in that, The rotary drive unit includes a connecting part, a first drive unit, and several second drive units; The inner wall of the window has a recessed annular storage groove extending circumferentially, and the connecting part is located at the first end of the recycling and scraping part; or the outer wall of the spray component has a recessed annular storage groove extending circumferentially, and the connecting part is located at the second end of the recycling and scraping part. The connecting part extends radially and extends into the annular storage groove, and is slidably in contact with the side wall of the annular storage groove. The first driving part is located on the connecting part, and a plurality of second driving parts are arranged circumferentially in the annular storage groove. The first driving part and the plurality of second driving parts are respectively connected to an independent power supply. By controlling the power on and off of each second driving part, the first driving part is attracted, thereby causing the recycling scraping part to rotate circumferentially through the connecting part.

5. The medium window structure for preventing by-products from falling according to claim 4, characterized in that, The recycling scraping section also includes a contact surface, which is slidably contacted with the by-product adsorption element. The scraping and cleaning surface is located on the side of the recycling scraping section opposite to the by-product adsorption element and forms an acute angle structure with the contact surface.

6. The medium window structure for preventing by-products from falling according to claim 5, characterized in that, The connecting part is provided with a first channel communicating with the collecting cavity; The reaction chamber is provided with a second channel on the side wall near the window or in the spray component to connect the first channel and the by-product suction component, so that the scraped by-products are sequentially extracted through the collection chamber, the first channel, the second channel and the by-product suction component.

7. The medium window structure for preventing by-products from falling according to claim 6, characterized in that, The first channel includes a first conductive cavity and a second conductive cavity; The first conductive cavity is disposed at the end of the connecting portion near the recycling scraping portion, and the first conductive cavity is in communication with the collection cavity; the top of the connecting portion has a second conductive cavity that is in communication with the first conductive cavity, and the second conductive cavity is in communication with the second channel, wherein the radial length of the first conductive cavity is greater than the radial length of the second conductive cavity.

8. The medium window structure for preventing by-products from falling according to claim 7, characterized in that, The second channel includes a connecting channel, a buffer chamber, and a discharge channel connected in sequence; The chambers of the connecting channel and the buffer chamber both extend circumferentially in a ring-shaped structure, and the radial length of the discharge channel is between the radial length of the connecting channel and the radial length of the buffer chamber. The connecting channel is connected to the second conductive cavity, and the discharge channel is connected to the by-product suction device.

9. The medium window structure for preventing by-products from falling according to claim 4, characterized in that, It also includes shielding rings; The shielding ring is disposed circumferentially within the annular storage groove and is in sliding contact with the side wall of the annular storage groove. The connecting part is fixedly inserted into the shielding ring so that the shielding ring rotates within the annular receiving groove as the connecting part rotates.

10. The medium window structure for preventing by-products from falling according to claim 1, characterized in that, It also includes insulating components; The insulating element is located on the side of the by-product recovery element near the by-product adsorption element.

11. A semiconductor processing apparatus, characterized in that, The device includes a reaction chamber, a chamber cover, an induction coil, a shield, and a second power source, as well as a medium window structure for preventing byproducts from falling, as described in any one of claims 1 to 10. The chamber cover is located on the top of the reaction chamber and connected to the medium window body within the medium window structure for preventing byproducts from falling. The induction coil is located on the top of the medium window body and connected to the second power source. The shield is located on the top of the reaction chamber and forms a sealed chamber that encloses the induction coil.

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