A sealed conductive terminal assembly and stacked boost module

Abstract

The application belongs to the technical field of power supply, and discloses a sealed conductive terminal assembly and a stacked voltage boosting module, which comprise a male terminal body, a through assembly hole is formed in the male terminal body, a first sealing ring is arranged on the outer wall of the male terminal body, and the male terminal body is used for being connected to a module shell to be sealed through the first sealing ring; a movable stud is arranged in the assembly hole and has a movable screw joint part exposed to the module shell, the movable screw joint part is used for being connected to another voltage boosting module; a metal nut is screwed to the assembly hole and is spaced apart from the movable stud by a predetermined distance, so that the movable stud is blocked in the assembly hole, and a connecting cable is welded to the center of the metal nut, the connecting cable is used for connecting internal circuits of the voltage boosting module; and an elastic conductive gasket is sleeved on the metal nut and abuts against the metal nut and the male terminal body respectively. The sealing performance of the connection between the butt joint terminal of the high-voltage voltage boosting module and the shell is poor, and the assembly difficulty is large.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and in particular to a sealed conductive terminal assembly and a stacked boost module. Background Technology

[0002] In semiconductor ion implanter ion acceleration power supply systems, a multi-stage disk cascade boost architecture is commonly used. A single-stage high-voltage disk can achieve a 20kV voltage boost, while a four-stage disk stack can achieve a 0-80kV high-voltage output. The high-voltage disk module integrates a high-voltage multiplier PCB circuit internally and is externally encapsulated in an insulating plastic casing. High-voltage input and output terminals are located at the top and bottom of the casing. In the stacked series connection of high-voltage boost disk modules (boost modules), the terminal interfaces connecting the stacked modules are critical conductive and sealing components. Their sealing performance, conductivity stability, reasonable structural features, and assembly process directly determine the overall reliability and mass production yield.

[0003] Existing traditional high-voltage boost modules have simple terminal designs with limited functionality, making assembly difficult. For example, existing terminals lack dedicated sealing structures and are installed via a through-hole method. In the manufacturing process of high-voltage boost modules, which requires potting with high-flow epoxy resin, deep vacuum negative pressure, and high-frequency vibration, glue leakage and overflow are prone to occur between the terminals and the housing, leading to product scrap. Alternatively, manual sealing can be used, but this method suffers from inconsistent application, easily resulting in glue leakage and overflow, causing external contamination and internal potting defects, also leading to product scrap. Furthermore, conventional structures cannot achieve IP65 dust and water resistance; under long-term high-voltage operation, the equipment is susceptible to moisture, creepage, and partial discharge, ultimately causing insulation failure and breakdown. In addition, the assembly process of mating terminals usually uses interference fit for fixing. The installation method of interference fit requires special pressing tooling equipment during operation, which makes the assembly process cumbersome and the production cycle slow. At the same time, the preload of interference fit has a large dispersion and the overall consistency of the finished product is poor, which leads to problems of high assembly difficulty and poor consistency.

[0004] Therefore, existing technologies still need improvement and development. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a sealed conductive terminal assembly and a stacked boost module to solve the problems of poor sealing performance and difficult assembly of the docking terminals and housing connection of the high voltage boost module in the prior art.

[0006] The technical solution of this application is as follows: On the one hand, this application proposes a sealed conductive terminal assembly for use in the module housing of a boost module. The sealed conductive terminal assembly includes: a male terminal body, an assembly hole through which the male terminal body is formed, and a first sealing ring provided on the outer wall. The male terminal body is used to connect to the module housing to be sealed by the first sealing ring. The movable stud passes through the mounting hole and has a movable threaded part exposed on the module housing. The movable threaded part is used to dock with another boost module. A metal nut is screwed into the assembly hole and spaced a predetermined distance from the movable stud to seal the movable stud inside the assembly hole. A connecting cable is welded to the center of the metal nut. The connecting cable is used to connect to the internal circuit of the boost module. An elastic conductive gasket is fitted onto a metal nut and abuts against both the metal nut and the male terminal body. The movable stud and elastic conductive gasket are integrated into the male terminal body by threading a metal nut into the male terminal body, and then cooperate with the first sealing ring to form an integral terminal assembly for integral assembly with the module housing.

[0007] Optionally, the male terminal body includes: a sealing column, which is used to be embedded in the module housing; The main limiting plate is located at one end of the sealing column and is used to abut against the outer surface of the module shell; An annular sealing groove is provided on the sealing column, and the first sealing ring is set in the annular sealing groove.

[0008] Optionally, the first sealing ring is an O-ring; The compression amount X of the O-ring is related to the diameter E of the mounting hole of the module housing, the inner diameter G of the annular sealing groove, and the wire diameter P. Where X = {P - [(EG) / 2]} / P ± 0.05 100%.

[0009] Optionally, an L-shaped transfer channel is provided inside the male terminal body. One end of the transfer channel is connected to the inner diameter wall of the annular sealing groove, and the other end is vertically turned and connected to the bottom surface of the male terminal body. A first force guide and a second force guide are provided in the transmission channel. The first force guide is arranged radially in the transmission channel, and the second force guide is arranged axially in the transmission channel. The first sealing ring, through its squeezing action during assembly, causes the first guide member to move radially, thereby pushing the second guide member toward the elastic conductive gasket and squeezing the elastic conductive gasket, thus providing pre-tightening force for the metal nut. In addition, the first sealing ring, through the cooperation of the first and second guide members, is also radially pressed outward by the elastic force of the elastic conductive gasket, thereby generating squeezing force on the inner wall of the module housing.

[0010] Optionally, the male terminal body also includes a potting mating post extending into the module housing. The potting mating post has multiple axially distributed embedding grooves, which are used to accommodate the liquid epoxy resin in the module housing during the potting process and lock it in place after curing.

[0011] Optionally, the inner diameters of the multiple axially distributed adhesive recesses are different; The depth of the adhesive groove gradually increases in the outward direction along the axial direction of the module housing.

[0012] Optionally, the assembly hole includes an exposed hole, a stop hole, and a screw hole that are connected in sequence. The inner diameter of the exposed hole is smaller than the inner diameter of the stop hole, the inner diameter of the stop hole is smaller than the inner diameter of the screw hole, and the screw hole is screwed into a metal nut. The movable stud includes: a base, which is movably disposed within the stop hole; The movable column is fixed to the base and has an exposed hole. The movable screw connection is located on the side of the movable column away from the base.

[0013] Optionally, a contact ring is fitted on the movable column, and both the contact ring and the movable column are provided with adjustment docking holes. The adjustment docking holes are used to insert a wrench to turn the movable column so that the movable screw connection part rotates to bring another boost module abut against the contact ring.

[0014] Optionally, the metal nut has a locking hole at its center, and a welding part is provided in the locking hole. One end of the connecting cable is fixed in the locking hole through the welding part. The other end of the connecting cable is oriented in the same direction as the orientation marking inside the module housing.

[0015] On the other hand, this application also proposes a stacked boost module, including: a module housing, a first side surface of the module housing having at least one sealed conductive terminal assembly as described above, and a second side surface of the module housing having at least one mating female connector; When multiple module housings are stacked, a sealed conductive terminal assembly on one module housing is used to connect and conduct with a mating female on another module housing.

[0016] Optionally, the female connector includes: a female terminal body, on which a female threaded hole is provided, the female threaded hole being used to screw into the movable stud of the sealed conductive terminal assembly of another stacked boost module; The second sealing ring is disposed on the outer wall of the female terminal body, which is used to connect to the module housing for sealing by the second sealing ring.

[0017] The beneficial effects of the sealed conductive terminal assembly and stacked boost module provided in this application are at least as follows: By setting a first sealing ring on the male terminal body to form a pure mechanical seal, better sealing performance can be ensured under the working conditions of high vacuum, high frequency vibration, and high flowability epoxy resin potting inside the module shell, achieving zero glue seepage, zero glue overflow, and zero air bubble encapsulation inside the module. This allows the boost module to maintain an IP66 dustproof and waterproof rating stably for a long time, significantly improving the high-voltage insulation reliability. Furthermore, the metal nut and male terminal body are locked together by threads, replacing the traditional interference fit structure, eliminating the need for dedicated pressing tooling, and relaxing tolerance control requirements; the locking torque is controllable and uniform, significantly improving the consistency of the boost module; by locking the metal nut and male terminal body by threads, the movable stud and elastic conductive gasket are integrated and cooperate with the first sealing ring to form an integral terminal assembly for integral assembly with the module shell, achieving integrated pre-assembly, greatly simplifying the on-site assembly process, adapting to mass industrial production, and improving the overall production efficiency of the boost module. An elastic conductive gasket is used between the metal nut and the male terminal body, which serves to fill gaps, provide elastic compensation, and increase the conductive contact surface. It can withstand temperature cycles and mechanical vibrations, ensuring the threads remain secure over a long period, maintaining constant contact resistance, and completely eliminating problems such as high-voltage overheating, arcing, and output drift. This extends the equipment's lifespan, achieves long-term anti-loosening conductivity, and eradicates high-voltage operation faults. A connecting cable is welded to the center of the metal nut, allowing for pre-welding at any angle (360°). During assembly, it can be quickly aligned with the orientation markings inside the module housing, overcoming the angle limitations of traditional structures. This results in a high process error tolerance rate and effectively improves production yield and assembly efficiency. Therefore, this sealed conductive terminal assembly achieves structural integration, standardized sealing, anti-loosening connections, and simplified assembly, comprehensively improving the operational reliability and mass production yield of high-voltage disc-type (stacked) boost modules. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a stacked boost module in use according to an embodiment of this application; Figure 2 This is a cross-sectional view of a stacked boost module according to an embodiment of this application; Figure 3 This is a schematic diagram of the structural assembly of a sealed conductive terminal assembly according to an embodiment of this application; Figure 4This is a cross-sectional view of a sealed conductive terminal assembly according to an embodiment of this application; Figure 5 This is a schematic diagram of the bottom structure of a sealed conductive terminal assembly according to an embodiment of this application; Figure 6 This is a schematic diagram of a sealed conductive terminal assembly installed inside a module housing according to an embodiment of this application; Figure 7 This is a schematic diagram of a sealed conductive terminal assembly applied to a boost module according to an embodiment of this application; Figure 8 This is a cross-sectional view of the female connector of a stacked boost module according to an embodiment of this application; Figure 9 This is a cross-sectional view of a stacked boost module according to an embodiment of this application when it is stacked and connected; Figure 10 yes Figure 9 Enlarged view of point A; Figure 11 yes Figure 9 Enlarged view of point B.

[0019] The following are the labels in the diagram: 1. Boost module; 10. Sealed conductive terminal assembly; 100. Male terminal body; 110. Assembly hole; 111. Exposed hole; 112. Stop hole; 113. Screw hole; 120. Sealing column; 121. Annular sealing groove; 130. First sealing ring; 140. Transmission channel; 141. First force guide; 142. Second force guide; 150. Main body limiting plate; 160. Glue-filled butt post; 161. Glue-embedding groove; 200. Movable stud; 210. Movable screw connection; 220. Base platform; 2 30. Movable column; 231. Adjustment docking hole; 300. Metal nut; 310. Connecting cable; 311. Welding part; 320. Locking hole; 400. Elastic conductive gasket; 500. Contact ring; 20. Module shell; 21. Mounting hole; 22. PCB assembly; 23. Glue funnel; 24. Orientation mark; 30. Connecting female; 31. Female terminal body; 32. Female threaded hole; 33. Second sealing ring; 34. Cable hole; 40. Positive terminal; 41. Screw; 42. Spring; 50. Negative terminal. Detailed Implementation

[0020] This application provides a sealed conductive terminal assembly. To make the objectives, technical solutions, and effects of this application clearer and more explicit, the following detailed description is provided with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0021] It should be noted that in annotations, leader lines with arrows represent non-solid areas such as holes and slots, or non-specific solid features such as higher-level features, or specific directions. Leader lines without arrows represent solid features or specific lower-level features.

[0022] When a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or position based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality of" means two or more, unless otherwise explicitly defined.

[0023] In existing technologies, high-voltage booster disk modules (stacked booster modules) in this field not only suffer from the aforementioned problems of poor sealing and difficult assembly, but also have other issues. The components of existing mating terminals are scattered, and the conductive, locking, and clamping accessories of traditional mating terminals are independent, making pre-integration and pre-assembly impossible. Each component must be assembled onto the housing individually during the booster module assembly process, resulting in numerous on-site assembly steps and significant alignment difficulties, making it difficult to meet the mass production requirements of modern products. Furthermore, in some mating terminal structures, the internal threaded terminals are through-hole threads, requiring additional plugging components to further increase process complexity. Furthermore, the angle of traditional terminal welding of copper wires (connecting cables) is limited, resulting in low process error tolerance. Traditional external thread terminals require welding copper wires (connecting cables) to connect to the PCB board. The clamping force point (central axis) of the traditional terminal is offset from the welding center of the copper wire, and the welded copper wire needs to have a fixed extension direction. Therefore, during welding and assembly, it is necessary to consider the problem of fixed angle requirements caused by eccentricity. The welding position of the copper wire is strictly required. Usually, it is assembled on the shell first and then welded in a fixed position, which makes it impossible to weld before assembly, resulting in high production difficulty and low product yield. Moreover, the bonding force between the terminal and the potting compound is weak, and there is a risk of tip discharge under high voltage. The outer wall of the traditional terminal extending into the potting area is smooth, and it only relies on surface adhesion to the epoxy resin. After high and low temperature alternation and continuous vibration, the interface is prone to delamination and the generation of micro-gaps. Moisture intrusion exacerbates the insulation hazard. At the same time, the root of the terminal has a right-angled angular structure, which is prone to electric field concentration under high voltage environment, causing tip discharge and corona phenomena, breaking down the epoxy resin potting compound. In addition, there is no shielding structure, and the high voltage electric field is prone to radiating outward, generating electromagnetic interference. In summary, existing mating terminals have significant deficiencies in terms of sealing, limiting assembly process, anti-loosening reliability, integrated assembly, welding compatibility, potting bond strength, high-voltage insulation, and electromagnetic compatibility. They cannot meet the requirements of zero-bubbling, zero-leakage, high protection, high reliability, and high-efficiency production for high-voltage boost modules. To address these issues, this embodiment proposes the following specific implementation.

[0024] like Figure 1 , Figure 2 , Figure 9 As shown, this embodiment proposes a sealed conductive terminal assembly 10, which is applied to a boost module 1. In use, the boost modules 1 are stacked in multiple layers. Taking the stacking in the top and bottom direction as an example, the module shell 20 of the boost module 1 has a first side surface facing upward and a second side surface facing downward. The sealed conductive terminal assembly 10 is disposed on the first side surface, and a docking female head 30 is disposed on the second side surface. When the boost modules 1 are stacked, the sealed conductive terminal assembly 10 of the lower boost module 1 docks with the docking female head 30 of the upper boost module 1 to realize the series conduction between the two.

[0025] like Figure 2As shown, the sealed conductive terminal assembly 10 of this embodiment mainly includes: a male terminal body 100, a first sealing ring 130, a movable stud 200, a metal nut 300, and an elastic conductive gasket 400. The male terminal body 100 has a through-hole 110 and a first sealing ring 130 on its outer wall. The male terminal body 100 is used to connect to the module housing 20 for sealing via the first sealing ring 130. Specifically, a through-hole 21 is formed in the module housing 20, and the male terminal body 100 passes through the mounting hole 21, with its exposed end serving as an electrical contact surface for electrical connection with the female connector 30. When the male terminal body 100 is inserted into the mounting hole 21, it is pressed between the mounting hole 21 and the outer wall of the male terminal body 100 by the first sealing ring 130, achieving a seal. By setting a first sealing ring 130 on the male terminal body 100 to form a pure mechanical seal, better sealing performance can be ensured under conditions of high vacuum, high frequency vibration, and high-flow epoxy resin potting inside the module housing 20, achieving zero glue seepage, zero glue overflow, and zero air bubble encapsulation inside the module. There is no leakage, and an IP65 or higher dustproof and waterproof rating can be maintained for a long time without the need for auxiliary sealant. For example, after testing the processed products, the boost module 1 can be shown to maintain a stable IP66 dustproof and waterproof rating for a long time, significantly improving the reliability of high-voltage insulation.

[0026] like Figure 2 , Figure 3 As shown, the movable stud 200 passes through the mounting hole 110 and has a movable threaded portion 210 protruding from the module housing 20. The movable stud 200 can move axially a certain distance and rotate 360° within the mounting hole 110. The movable threaded portion 210 is used to mate with the docking female head 30 of another boost module 1. By connecting the docking female head 30 with a thread, the docking female head 30 can be stably abutted against the male terminal body 100. The metal nut 300 is screwed into the mounting hole 110 and spaced a predetermined distance from the movable stud 200 to seal the movable stud 200 within the mounting hole 110, thereby allowing the movable stud 200 to move. The metal nut 300 and the male terminal body 100 are locked together via threads, replacing the traditional interference fit structure. This eliminates the need for dedicated pressing fixtures and relaxes tolerance control requirements. The threaded locking structure replaces the aluminum sheet interference fit limiting structure, eliminating the need for dedicated pressing fixtures and stringent interference tolerance control. The locking torque is quantitatively controlled using a torque wrench, improving batch consistency. With controllable and uniform locking torque, the consistency of the boost module 1 is significantly improved.

[0027] like Figure 2 , Figure 3As shown, the elastic conductive gasket 400 is fitted onto the metal nut 300 and abuts against both the metal nut 300 and the male terminal body 100. The elastic conductive gasket 400 can be a 0.2mm thin copper gasket. After the metal nut 300 is tightened, the thin copper gasket undergoes plastic deformation under compression, filling the gap between the lower end face of the male terminal body 100 and the metal nut 300. Relying on its own elasticity, it forms a continuous pre-tightening force, counteracting the loosening tendency caused by temperature cycling and mechanical vibration, thus stabilizing the high-voltage conductive contact performance. Therefore, using the elastic conductive gasket 400 combines gap filling, elastic compensation, and increased conductive contact surface, resisting temperature cycling and mechanical vibration, ensuring the threads remain secure for a long time, maintaining constant contact resistance, completely eliminating problems such as high-voltage overheating, arcing, and output drift, extending equipment lifespan, achieving long-term anti-loosening conductivity, and eradicating high-voltage operation faults.

[0028] like Figure 2 , Figure 3 As shown, a connecting cable 310 is welded to the center of the bottom surface of the metal nut 300. The connecting cable 310 is used to connect to the internal circuit of the boost module 1. By welding the connecting cable 310 to the center of the metal nut 300, the connecting cable 310 can be pre-welded at any angle of 360°. During assembly, it can be quickly aligned and installed with the orientation mark 24 inside the module housing 20. This breaks through the angle limitations of traditional structures, has a high process error tolerance, and effectively improves production yield and assembly efficiency.

[0029] In this embodiment, the movable stud 200 and the elastic conductive gasket 400 are integrated into the male terminal body 100 by threading the metal nut 300 to the male terminal body 100, and cooperate with the first sealing ring 130 to form an integral terminal assembly for integral assembly with the module housing 20. This achieves integrated pre-assembly, greatly simplifies the on-site assembly process, adapts to mass industrial production, and improves the production efficiency of the entire boost module 1.

[0030] like Figure 2 , Figure 3 As shown, the male terminal body 100 further includes a sealing column 120 and a main body limiting plate 150. The sealing column 120 is used to be embedded in the mounting hole 21 of the module housing 20. The main body limiting plate 150 is disposed at one end of the sealing column 120, forming a T-shaped structure, and is used to abut against the outer surface of the module housing 20. The main body limiting plate 150 is exposed on the outer surface of the module housing 20, and its outer diameter is larger than that of the sealing column 120, which can provide a larger electrical contact area. An annular sealing groove 121 is provided on the sealing column 120, and a first sealing ring 130 is disposed in the annular sealing groove 121. In this embodiment, the first sealing ring 130 is an O-ring. The O-ring is used for radial compression sealing during assembly. The compression amount is scientifically calculated and fully verified by physical testing, thereby improving the sealing performance.

[0031] The compression amount X of the O-ring is related to the diameter E of the mounting hole 21 of the module housing 20, the inner diameter G of the annular sealing groove 121, and the wire diameter P, where X = {P - [(EG) / 2]} / P ± 0.05 100%. In the specific structure, the diameter E of the mounting hole 21 of the module housing 20 is 23.95±0.05mm, the outer diameter F of the sealing column 120 is 23.9±0.05mm, the inner diameter G of the annular sealing groove 121 is 22.5±0.05mm, the inner diameter K of the O-ring is 22mm, the outer diameter M is 24mm, and the wire diameter P is 1±0.05mm. The O-ring is installed into the sealing post 120. The inner diameter of the O-ring, K=22mm, is smaller than the inner diameter of the annular sealing groove 121, G=22.5mm. An interference fit is used to ensure that the O-ring is securely installed and there is no problem of displacement or falling off. In addition, when the sealing post 120 with the O-ring is installed into the mounting hole 21 of the module housing 20, the reasonable interference fit can provide sufficient friction force between the O-ring and the inner wall of the annular sealing groove 121, preventing the O-ring from being pulled out by the friction force generated between the sealing ring and the inner wall of the mounting hole 21 during the process of the male terminal body 100 with the O-ring being installed into the module housing 20.

[0032] This embodiment achieves effective compression sealing through a reasonable and scientific design of the compression amount X, combined with the selected O-ring hardness (Shore A=50±5A). The compression amount X is calculated as follows: X={P-[(EG) / 2]} / P={1-[(23.95±0.05-22.5±0.05) / 2]} / 1±0.05 100% = 0.275 ± 0.1 / 1 ± 0.05 100%. Theoretical compression calculation: Maximum value Xmax = 0.375 / 1.05 100% = 35.7%; Minimum value Xmin = 0.175 / 0.95 100% = 18.4%. After airtightness testing (inflation at 10 kPa, pressure holding for 60 seconds, testing for 30 seconds, leakage less than 0.5 kPa), the equivalent IP65 sealing effect is achieved.

[0033] like Figure 4As shown, in another embodiment, in a structure that enhances the sealing performance of the first sealing ring 130, an L-shaped transmission channel 140 can be formed within the male terminal body 100. One end of the transmission channel 140 is connected to the inner diameter wall of the annular sealing groove 121, and the other end is vertically turned and connected to the bottom surface of the male terminal body 100. The opening on the bottom surface faces the elastic conductive gasket 400. A first force guide 141 and a second force guide 142 are provided within the transmission channel 140. The first force guide 141 is radially disposed in the transmission channel 140, and the second force guide 142 is axially disposed in the transmission channel 140. The two force guides abut against each other at the bend of the transmission channel 140. During assembly, the first sealing ring 130 exerts a squeezing action, causing the first guide member 141 to move radially. This pushes the second guide member 142 towards the elastic conductive gasket 400, compressing the elastic conductive gasket 400. The pressure on the elastic conductive gasket 400 then compresses the metal nut 300, providing a more stable preload force to the metal nut 300. Furthermore, through the cooperation of the first guide member 141 and the second guide member 142, the first sealing ring 130 is also radially pressed outward by the elastic force of the elastic conductive gasket 400, thereby generating greater compressive force on the inner wall of the mounting hole 21 and improving the sealing effect. The first guide member 141 has a wedge at its end, and the second guide member has a spherical head at its end. The spherical head abuts against the inclined surface of the wedge, causing the first guide member 141 and the second guide member 142 to engage and convert axial pressure into radial pressure. This not only ensures the sealing performance of the first sealing ring 130 but also guarantees the stability of the preload applied by the elastic conductive gasket 400 to the metal nut 300. Multiple such engaging structures are provided, symmetrically or around the central axis of the male terminal body 100.

[0034] like Figure 2 , Figure 4 As shown, in some embodiments, the male terminal body 100 also includes a potting mating post 160 extending into the module housing 20. The potting mating post 160 is located at the lower end of the sealing post 120 and is integrally formed with the sealing post 120. Multiple axially distributed embedding grooves 161 are formed on the outer wall of the potting mating post 160. The embedding grooves 161 are used to accommodate the liquid epoxy resin in the module housing 20 during the potting process and, after curing, engage and lock. The root annular embedding groove 161 is used for epoxy resin embedding and filling, forming a mechanical engagement and locking structure after curing, improving the bonding strength between the terminal body and the epoxy resin potting compound, and preventing moisture penetration along the interface. The cross-section of the embedding groove 161 can be of various shapes, such as serrated, semi-circular, etc. All can engage and lock with the internal potting layer after potting and curing within the module housing.

[0035] like Figure 2 , Figure 4 As shown, furthermore, the inner diameters of the multiple axially distributed embedding grooves 161 can be the same, or in some embodiments, the inner diameters of the multiple axially distributed embedding grooves 161 can be different. Using different inner diameters serves two purposes: firstly, it makes it easier for liquid epoxy resin to enter the embedding grooves 161 at different heights during the potting process; secondly, it makes the fixed connection between the male terminal body 100 and the entire module housing 20 more stable. Specifically, in the outward direction along the axial direction of the module housing 20, the inner diameter of the embedding groove 161 gradually decreases. For example, if the upper part of the module housing 20 is in the outward direction of the protruding movable stud 200, then in the direction from bottom to top, the inner diameter of the embedding groove 161 gradually decreases, while the depth gradually increases. Therefore, when the liquid epoxy resin in the upper embedding groove 161 cures to form a cured adhesive layer, the deeper the cured adhesive ring extends into the embedding groove 161, the more firmly and stably it is fixed. Furthermore, the embedding groove 161 structure, which deepens from bottom to top, makes the overall shape of the glued docking post 160 resemble a cone structure that is larger at the bottom and smaller at the top. When it is engaged with the internal cured adhesive layer, it is less likely to be pulled out, thereby improving the connection stability of the entire male terminal body 100.

[0036] like Figure 2 , Figure 4 As shown, in addition, to facilitate the smooth entry of liquid epoxy resin into each embedding groove 161, the opening width of the embedding groove 161 gradually increases from bottom to top. The larger opening facilitates the entry of liquid epoxy resin, ensuring a uniform distribution of the cured adhesive layer throughout the embedding groove 161 and preventing hollow areas.

[0037] Furthermore, the openings of each embedding groove 161 are rounded, and this smooth transition eliminates the electric field concentration effect under high voltage, reducing the risk of tip discharge and corona breakdown of the epoxy resin. Additionally, the inner wall of the embedding groove 161 is also rounded, allowing the liquid epoxy resin to completely fill the inner wall of the embedding groove 161. The rounded corners on the inner wall also effectively eliminate the risk of tip discharge.

[0038] like Figure 2 , Figure 4 As shown, in addition, the entire male terminal body 100 of this embodiment adopts a multi-layer stepped structure to form a closed Faraday cage structure, which avoids the epoxy resin from being broken down by high voltage and the electric field from radiating outward and interfering with the circuit, thus meeting the safety regulations and EMC requirements of high-voltage equipment. Furthermore, since the depth of the multiple embedding grooves 161 gradually increases, this not only improves the connection stability with the cured epoxy resin, but also effectively increases the outer surface area of ​​the male terminal body 100 (closed Faraday cage structure), thereby improving the shielding of the internal high-voltage electric field of the entire male terminal body 100 and further enhancing the overall EMC electromagnetic compatibility performance of the device.

[0039] like Figure 2 , Figure 4 As shown, in some embodiments, the assembly hole 110 includes an exposed hole 111, a stop hole 112, and a threaded hole 113 connected in sequence. The exposed hole 111 is located above the stop hole 112, and the threaded hole 113 is located below the stop hole 112. The inner diameter of the exposed hole 111 is smaller than the inner diameter of the stop hole 112, and the inner diameter of the stop hole 112 is smaller than the inner diameter of the threaded hole 113. The threaded hole 113 is threaded to a metal nut 300. The movable stud 200 in this embodiment mainly includes a base 220 and a movable stud 230. The base 220 is movably disposed within the stop hole 112; the movable stud 230 is fixed to the base 220 and passes through the exposed hole 111. The movable threaded part 210 is disposed on the side of the movable stud 230 away from the base 220. This design replaces the traditional interference fit structure with a threaded locking structure for limiting the movable stud 200 of the boost module 1, eliminating the need for dedicated pressing tooling and relaxing tolerance control requirements. Furthermore, the locking torque of the metal nut 300 is controllable and uniform, significantly improving product consistency. The metal nut 300 can be pre-assembled as an integrated unit, greatly simplifying the on-site assembly process and making it suitable for large-scale industrial mass production.

[0040] like Figure 4 As shown, a deeper adhesive recess 161 is provided on the male terminal body 100 in the area corresponding to the stop hole 112, and a shallower adhesive recess 161 is provided on the male terminal body 100 in the area corresponding to the screw hole 113. The distance between the inner diameter wall of the deepest adhesive recess 161 (the uppermost adhesive recess 161) and the inner wall of the stop hole 112 is the first distance D1, and the distance between the inner diameter wall of the shallowest adhesive recess 161 (the lowermost adhesive recess 161) and the inner wall of the screw hole 113 is the second distance D2. The first distance D1 is equal to or greater than the second distance D2. This arrangement can achieve stable fixation through the distribution of the adhesive recesses 161, while also ensuring that the conductive cross-sectional area of ​​the entire male terminal body 100 is not reduced, thus ensuring the stability of the electrical conduction process.

[0041] like Figure 7 , Figure 10 As shown, in some embodiments, a contact ring 500 is fitted on the movable column 230. Both the contact ring 500 and the movable column 230 are provided with adjustment docking holes 231. The adjustment docking holes 231 are used to insert a wrench to turn the movable column 230 so that the movable screw connection 210 rotates to bring another boost module 1 abut against the contact ring 500.

[0042] like Figure 2 , Figure 5 , Figure 6As shown, in some embodiments, the metal nut 300 has a locking hole 320 at its center (e.g., an internal hexagonal hole where the end face center aligns with an internal hexagonal wrench). A welding part 311 is provided inside the locking hole 320, and one end of the connecting cable 310 is fixed inside the locking hole 320 through the welding part 311. The orientation of the other end of the connecting cable 310 is the same as the orientation mark 24 inside the module housing 20. This allows for 360° pre-welding of the connecting cable 310 (copper wire) at any angle. During assembly, it only needs to be aligned and installed quickly by matching the orientation mark 24 on the inner wall of the module housing 20, breaking the angle limitations of traditional structures, increasing the process error tolerance, adapting to the production process of welding before assembly, and effectively improving production yield and assembly efficiency.

[0043] like Figure 7 , Figure 9 As shown, in some embodiments, a stacked boost module is also proposed, including: a module housing 20, a first side surface of the module housing 20 having at least one sealed conductive terminal assembly 10 as described above, and a second side surface of the module housing 20 having at least one mating female connector 30. When multiple module housings 20 are stacked, the sealed conductive terminal assembly 10 on one module housing 20 is used to connect and conduct with the mating female connector 30 on another module housing 20. This allows the individual boost modules 1 to be stacked and boost voltage, adaptable to single-stage 20kV, multi-stage stacking to 300kV or even higher high-voltage power supply equipment.

[0044] like Figure 7 , Figure 8 As shown, in some embodiments, the female connector 30 specifically includes: a female terminal body 31 and a second sealing ring 33. The female terminal body 31 has a female threaded hole 32, which is used to screw into the movable stud 200 of the sealed conductive terminal assembly 10 of another stacked boost module (e.g., ...). Figure 10 (As shown); the second sealing ring 33 is disposed on the outer wall of the female terminal body 31. The female terminal body 31 is used to connect to the module housing 20 for sealing by the second sealing ring 33. The use of the second sealing ring 33 also improves the waterproof performance of the entire module housing 20. The female terminal body 31 is also eccentrically provided with a cable hole 34, and the connecting wire is soldered to the female terminal body 31 through the cable hole 34.

[0045] like Figure 7 , Figure 9 , Figure 11As shown, in some embodiments, positive terminals 40 and negative terminals 50 are also provided on the upper and lower outer walls of the module housing 20. The positive terminal 40 is disposed on the module housing 20 via a third sealing ring, and the negative terminal 50 is disposed on the module housing 20 via a fourth sealing ring, thereby improving the sealing performance of the module housing 20. When multiple module housings 20 are stacked, the positive terminal 40 on one module housing 20 is used to connect and conduct with the negative terminal 50 on another module housing 20. The positive terminal 40 and the negative terminal 50 are connected and conducted using a flexible connector.

[0046] like Figure 7 , Figure 9 , Figure 11 As shown, the positive terminal 40 includes a positive terminal base with a groove. A screw 41 is locked into the groove of the positive terminal base, and a spring 42 is assembled onto the screw 41. The protrusion of the negative terminal sinks into the groove of the positive terminal 40, compressing the spring 42 in the groove to achieve the function of contact and current conduction.

[0047] In a boost module 1, three sealed conductive terminal assemblies 10 and a positive terminal 40 are disposed on the upper surface of the module housing 20. Three female connectors 30 and a negative terminal 50 are disposed on the lower surface of the module housing 20. This enables different electrical signal or power transmission functions.

[0048] The specific manufacturing process of the stacked boost module in this embodiment is as follows: The module housing 20 includes an upper plastic housing and a lower plastic housing, both of which are shared mold components. The upper plastic housing uses CNC post-machined annular sealing grooves for the inner and outer rings. The assembly sequence is as follows: Step 1.1: Adhere the outer ring double-peak sealing strip with its own adhesive backing into the outer ring groove of the upper plastic housing, and install the corresponding inner ring double-peak sealing strip into the inner ring groove of the upper plastic housing. This action is pre-processed before final assembly.

[0049] Step 1.2: Assemble the sealed conductive terminal assembly 10. Weld the connecting cable 310 (copper wire) to the locking hole 320 of the metal nut 300. There are no requirements for the welding angle of the copper wire to the metal nut 300; welding can be done within a 360° range. This action is completed in the pre-processing before final assembly.

[0050] Step 1.3: The large-sized first sealing ring 130 is pre-installed on the sealed conductive terminal assembly 10; the second sealing ring 33 is pre-installed on the corresponding mating female 30, the small-sized third sealing ring is pre-installed on the positive terminal 40, and the fourth sealing ring is pre-installed on the negative terminal 50. This action is pre-processed before final assembly.

[0051] Step 1.4: Solder copper wires at the corresponding positions on the internal PCB assembly 22. This action is completed in the pre-processing before final assembly.

[0052] Step 2.1: Press the sealed conductive terminal assembly 10 and the positive terminal 40 into the upper plastic housing. The installation requires that the copper wire (connecting cable 310) of the sealed conductive terminal assembly 10 be aligned with the orientation mark 24 on the raised part of the upper plastic housing. This completes the orientation installation. The orientation of the orientation mark 24 on the raised part of the upper plastic housing corresponds to the soldering hole on the PCB assembly 22 for the copper wire.

[0053] Step 2.2: The PCB assembly 22 is installed into the upper plastic housing, and the connecting cable 310 (copper wire) of the sealed conductive terminal assembly 10 passes through the soldering hole on the PCB board.

[0054] Step 2.3: Solder the copper wires of the sealed conductive terminal assembly 10 on the PCB board, and use screws 41 to fasten the plug-in copper busbar of the PCB assembly 22 to the positive terminal 40.

[0055] Step 3.1: Close the lower plastic housing. At this time, the female connector 30 and the negative terminal 50 pass through the terminal mounting holes of the lower plastic housing, and the corresponding solder copper wires pass through their respective positions.

[0056] Step 3.2: Press the female connector 30 and the negative terminal 50 into the lower plastic housing.

[0057] Step 4.1: Use the module pressing tool to press and clamp each terminal and the upper and lower plastic housings.

[0058] Step 4.2: Trim off any excess copper wire and then solder it to the corresponding female connector 30 and negative terminal 50.

[0059] Step 4.3, dispensing funnel 23 (e.g.) Figure 2 , Figure 7 Apply a layer of waterproof adhesive around the round head (as shown), and insert it into the assembled upper and lower plastic shells.

[0060] Step 5.1, glue pouring. After glue pouring, cut off the excess glue pouring funnel 23 and polish and correct the cut surface.

[0061] Step 6.1: After potting, install spring 42 onto positive terminal 40, and install contact ring 500 onto movable stud 200 of sealed conductive terminal assembly 10. The high-voltage booster disk module is now complete.

[0062] like Figure 2 , Figure 9 , Figure 10As shown, during docking, the movable threaded part 210 (M10 thread) at the upper end of the movable stud 200 is connected to the female threaded hole 32 of the docking head 30. When the sealed conductive terminal assembly 10 is stacked, a round bar tool (special wrench) is used to tighten the movable threaded part 210 by passing it through the contact ring 500 and the adjustment docking hole 231 of the movable stud 200. During this process, the movable threaded part 210 gradually moves within the female threaded hole 32 until the male terminal body 100, the contact ring 500, and the female terminal body 31 are in tight contact with each other, with local gaps less than 0.1mm and visually obvious good contact over a large area. This completes the stacking connection. By repeating this process, multiple high-voltage booster disc modules can be stacked according to product requirements.

[0063] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A sealed conductive terminal assembly, applied to the module housing of a stacked boost module, characterized in that, The sealed conductive terminal assembly includes: a male terminal body, which has an assembly hole through it and a first sealing ring on its outer wall. The male terminal body is used to connect to the module housing so as to be sealed by the first sealing ring. A movable stud passes through the mounting hole and has a movable threaded portion exposed outside the module housing, the movable threaded portion being used to dock with another stacked boost module; A metal nut is screwed into the mounting hole and spaced at a predetermined distance from the movable stud to seal the movable stud inside the mounting hole. A connecting cable is welded to the center of the metal nut, and the connecting cable is used to connect to the internal circuit of the stacked boost module. An elastic conductive pad is sleeved on the metal nut and abuts against the metal nut and the male terminal body, respectively. The movable stud and the elastic conductive gasket are integrated into the male terminal body by threading the metal nut with the male terminal body, and cooperate with the first sealing ring to form an integral terminal assembly for integral assembly with the module housing; The main body of the male terminal includes a sealing column, which is used to be embedded in the module shell; A main limiting plate is disposed at one end of the sealing column and is used to abut against the outer surface of the module shell; The sealing column has an annular sealing groove, and the first sealing ring is disposed in the annular sealing groove.

2. The sealed conductive terminal assembly according to claim 1, characterized in that, The male terminal body has an L-shaped transmission channel inside. One end of the transmission channel is connected to the inner diameter wall of the annular sealing groove, and the other end is turned vertically and connected to the bottom surface of the male terminal body. A first force guide and a second force guide are provided in the transmission channel. The first force guide is arranged radially in the transmission channel, and the second force guide is arranged axially in the transmission channel. The compression action of the first sealing ring during assembly causes the first guide member to move radially, thereby pushing the second guide member to move toward the elastic conductive gasket and compressing the elastic conductive gasket, providing pre-tightening force for the metal nut. In addition, the first sealing ring is also radially pressed outward by the elastic force of the elastic conductive gasket through the cooperation of the first and second guide members, thereby generating extrusion force on the inner wall of the module housing.

3. The sealed conductive terminal assembly according to claim 1, characterized in that, The male terminal body also includes a potting mating post extending into the module housing. The potting mating post has multiple axially distributed embedding grooves. The embedding grooves are used to accommodate the liquid epoxy resin in the module housing during the potting process and lock it in place after curing.

4. The sealed conductive terminal assembly according to claim 3, characterized in that, The inner diameters of the multiple axially distributed adhesive grooves are different; The depth of the adhesive groove gradually increases in the outward direction along the axial direction of the module housing.

5. The sealed conductive terminal assembly according to claim 1, characterized in that, A contact ring is fitted on the movable stud. Both the contact ring and the movable stud have adjustment docking holes. The adjustment docking holes are used to insert a wrench to turn the movable stud so that the movable threaded part rotates to abut the docking female head of another stacked boost module against the contact ring.

6. The sealed conductive terminal assembly according to any one of claims 1-5, characterized in that, The metal nut has a locking hole at its center, and a welding part is provided in the locking hole. One end of the connecting cable is fixed in the locking hole through the welding part. The other end of the connecting cable is oriented in the same direction as the orientation marking inside the module housing.

7. A stacked boost converter module, characterized in that, Includes: a module housing, wherein a first side surface of the module housing is provided with at least one sealed conductive terminal assembly as described in any one of claims 1-6, and a second side surface of the module housing is provided with at least one mating female connector; When multiple module housings are stacked, a sealed conductive terminal assembly on one module housing is used to connect and communicate with a mating female on another module housing.

8. The stacked boost module according to claim 7, characterized in that, The female connector includes: a female terminal body, on which a female threaded hole is provided, the female threaded hole being used to screw into the movable stud of the sealed conductive terminal assembly of another stacked boost module; The second sealing ring is disposed on the outer wall of the female terminal body, and the female terminal body is used to be connected to the module housing for sealing by the second sealing ring.

Images