Embedded substrate and electronic device

Abstract

The application provides an embedded substrate and an electronic device, and relates to the technical field of electronic devices, and aims to solve the problem of poor heat dissipation performance of the embedded substrate. The embedded substrate provided by the application comprises a base frame, a circuit layer and a first electronic element. The base frame has a first surface and a second surface facing away from each other, the first electronic element is located in the base frame, the first surface of the base frame has a window, the first electronic element is exposed to the window, the circuit layer is located on the second surface, and the conductive circuit in the circuit layer is in conductive connection with the first electronic element. In the embedded substrate provided by the application, the first electronic element is exposed to the window, the heat generated by the first electronic element can be dissipated outward through the exposed surface, the embedded substrate has good heat dissipation performance, and the working performance and reliability of the first electronic element can be effectively improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an embedded substrate and an electronic device. Background Technology

[0002] Embedded substrates, also known as embedded substrates, include a base frame and electronic components such as chips, resistors, capacitors, and inductors, all embedded within the base frame. These embedded components are interconnected and fan-out via conductive lines, forming highly integrated and dense functional modules. Some electronic components, such as chips, generate significant heat during operation, which needs to be transferred to the outside via the base frame for dissipation. In current designs, the electronic components embedded in the substrate typically have multiple layers of dielectric material between them and the outer surface of the base frame. This dielectric material has low thermal conductivity, which is detrimental to ensuring adequate heat dissipation for the electronic components. Therefore, improving the heat dissipation performance of embedded substrates has become a pressing technical challenge. Summary of the Invention

[0003] This application provides an embedded substrate and an electronic device with good heat dissipation performance.

[0004] In a first aspect, this application provides an embedded substrate, including a base frame, a circuit layer, and a first electronic component. The base frame has a first surface and a second surface facing away from each other. The first electronic component is located within the base frame, and the first surface of the base frame has a window through which the first electronic component is exposed. The circuit layer is located on the second surface, and conductive lines in the circuit layer are conductively connected to the first electronic component to meet the power supply requirements or electrical signal transmission requirements of the first electronic component.

[0005] In the embedded substrate provided in this application, the embedded substrate adopts an asymmetrical structural arrangement, which can effectively improve the heat dissipation performance of the first electronic component, thereby ensuring the working performance and reliability of the first electronic component. Specifically, this asymmetrical structural arrangement refers to the fact that a circuit layer is provided on the second surface of the base frame, while no circuit layer is provided on the first surface of the base frame. The first surface of the base frame has a window, and the interior of this window forms a space for placing the first electronic component. The first electronic component can be stably fixed within the window, thereby achieving a fixed connection between the first electronic component and the base frame. The base frame can effectively protect the first electronic component. Furthermore, since the first electronic component is exposed through the window, the heat generated by the first electronic component can be dissipated outwards through the exposed surface, resulting in good heat dissipation performance and effectively improving the working performance and reliability of the first electronic component.

[0006] In one example, the exposed outer surface of the first electronic component is the surface of the first electronic component without pins or electrodes. The surface of the first electronic component with pins faces the circuit layer to facilitate electrical connections between conductive lines in the circuit layer and the pins of the first electronic component.

[0007] In one example, the embedded substrate also includes a thermally conductive layer. This thermally conductive layer is located on the surface of the first electronic component exposed by the window. Heat from the first electronic component can be transferred to the thermally conductive layer for dissipation, resulting in good heat dissipation performance. Furthermore, the area or thermal conductivity of the thermally conductive layer can be appropriately adjusted to further enhance the heat dissipation performance of the first electronic component.

[0008] In one example, the first electronic component is exposed on the window surface flush with the first surface to improve the ease of fabrication of the embedded substrate. Additionally, it facilitates efficient heat dissipation from the first electronic component.

[0009] In one example, the embedded substrate includes a plurality of first electronic components. A first surface of the substrate has a plurality of windows, with each of the first electronic components corresponding to one of the windows. This one-to-one correspondence between the first electronic components and the windows ensures the stability of the connection between the first electronic components and the base frame, and also helps to improve the ease of fabrication of the embedded substrate.

[0010] In one example, the embedded substrate further includes at least one second electronic component. The at least one second electronic component is located within the base frame and is electrically connected to conductive lines in the circuit layer. The first and second electronic components are of different types. Alternatively, the second electronic component may be located inside the base frame, i.e., it may not be exposed. Or, the second electronic component may be exposed on the first surface of the base frame, thus providing better heat dissipation.

[0011] In one example, the embedded substrate further includes pads and conductive structures. The pads are located on a first surface of the base frame, and the conductive structures are located within the base frame and connect the pads to conductive lines in the circuit layer. The conductive structures can extend along the thickness direction of the base frame to meet the electrical connection requirements between the first and second surfaces of the base frame. The pads being located on the first surface of the base frame allows the first surface of the base frame to be positioned opposite other modules, enabling electrical connections between the pads and other modules.

[0012] In one example, the conductive structure is any one of a metallized hole, a conductive post, or a wire, offering good flexibility and diversity in structural design.

[0013] In one example, the base frame is an organic dielectric substrate, a glass substrate, or a ceramic substrate. This means the base frame offers good flexibility and versatility in structural design.

[0014] Secondly, this application also provides an electronic device, including a heat sink and the aforementioned embedded substrate. The heat sink is located on a first surface of a base frame and is in thermally conductive contact with a first electronic component. The heat from the first electronic component can be dissipated through the heat sink, effectively improving the heat dissipation performance of the first electronic component.

[0015] In one example, the electronic device also includes a motherboard, with a circuit layer facing the motherboard, and conductive lines in the circuit layer electrically connected to conductive lines in the motherboard. Alternatively, in one implementation, pads located on the first surface of the base frame can also be electrically connected to the motherboard, offering better connectivity. Attached Figure Description

[0016] Figure 1 A schematic cross-sectional view of a conventional embedded substrate provided for an embodiment of this application;

[0017] Figure 2 A cross-sectional structural diagram of an embedded substrate provided in an embodiment of this application;

[0018] Figure 3 A cross-sectional structural diagram of another embedded substrate provided in an embodiment of this application;

[0019] Figure 4 A cross-sectional structural diagram of another embedded substrate provided in an embodiment of this application;

[0020] Figure 5 A cross-sectional structural diagram of another embedded substrate provided in an embodiment of this application;

[0021] Figure 6 A cross-sectional structural diagram of another embedded substrate provided in an embodiment of this application;

[0022] Figure 7 A cross-sectional structural diagram of another embedded substrate provided in an embodiment of this application;

[0023] Figure 8 A cross-sectional structural diagram of another embedded substrate provided in an embodiment of this application;

[0024] Figure 9 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0025] Figure 10 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0026] Figure 11 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0027] Figure 12 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0028] Figure 13 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0029] Figure 14 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0030] Figure 15 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0031] Figure 16 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0032] Figure 17 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0033] Figure 18 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0034] Figure 19 A cross-sectional structural diagram of an embedded substrate during the fabrication process, provided for an embodiment of this application;

[0035] Figure 20 A cross-sectional structural diagram of an electronic device provided in an embodiment of this application;

[0036] Figure 21 This is a cross-sectional structural diagram of another electronic device provided in an embodiment of this application. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0038] To facilitate understanding of the embedded substrate provided in the embodiments of this application, its application scenarios will be introduced first below.

[0039] The embedded substrate provided in this application can be applied to various types of equipment or scenarios, such as power supply modules, power conversion devices, data centers, network equipment, and vehicles. The embedded substrate can include a base frame and various electronic components embedded within the base frame. Depending on the functional type of the electronic components, the embedded substrate can achieve various different functions. For example, the embedded substrate can include electronic components such as power chips, capacitors, resistors, and inductors. Power chips are mainly used to handle various tasks in electronic systems involving high current, high voltage, and high power. They can manage large amounts of energy and convert it into different forms and uses. Power chips can be used to meet the needs of high-power applications, such as in vehicles, industrial equipment, data centers, and other scenarios requiring high-efficiency energy conversion. Power chips typically include multiple power devices, such as transistors, used to switch and control the flow of current in circuits. This application does not limit the specific type of power devices.

[0040] like Figure 1 The diagram shows a cross-sectional structure of a conventional embedded substrate 01. The embedded substrate 01 typically employs a symmetrical structure. In simple terms, the embedded substrate 01 may include a base frame 011 and two circuit layers 012a and 012b located on opposite sides of the base frame. Electronic components 013 are embedded within the base frame 011 and are connected to conductive lines in the circuit layers 012a and 012b. Figure 1 (not shown in the diagram) are connected to each other, thereby achieving interconnection and fan-out through conductive lines.

[0041] Electronic components 013 (such as power chips) generate significant heat during operation. This heat needs to be transferred to the outside via circuit layer 012 for heat dissipation. In current designs, circuit layer 012 typically comprises multiple layers of dielectric material stacked along its thickness. This dielectric is generally made of materials with good insulation properties, such as prepreg (PP) or ajinomoto laminate (ABF), with a thermal conductivity typically below 0.5 W / m*K. This low thermal conductivity is detrimental to ensuring the heat dissipation performance of the electronic components. Especially in vertical power supply architectures, high current-carrying, and high-power applications, the heat from electronic component 013 needs to be dissipated quickly; otherwise, it will overheat, reducing its performance. In some cases, excessively high temperatures can also reduce the lifespan and reliability of electronic component 013.

[0042] Therefore, this application provides an embedded substrate with better heat dissipation performance.

[0043] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0044] like Figure 2 As shown, in one example provided in this application, the embedded substrate 10 includes a base frame 11, a circuit layer 12, and a first electronic component 13. The base frame 11 has a first surface facing away from the substrate (e.g., ...). Figure 2 The lower surface and the second surface (e.g.) Figure 2 The first electronic component 13 is located within the base frame 11, and the first surface of the base frame 11 has a window 111 through which the first electronic component 13 is exposed. The circuit layer 12 is located on the second surface, and the conductive lines in the circuit layer 12 are electrically connected to the first electronic component 13 to meet the power supply requirements or electrical signal transmission requirements of the first electronic component 13.

[0045] In the example provided in this application, the embedded substrate 10 adopts an asymmetrical structure, which can effectively improve the heat dissipation performance of the first electronic component 13, thereby ensuring the working performance and reliability of the first electronic component 13.

[0046] Specifically, this asymmetrical structure means that a circuit layer 12 is provided on the second surface of the base frame 11, while no circuit layer 12 is provided on the first surface of the base frame 11. That is, the first surface of the base frame 11 is not covered by the circuit layer 12, so that the first electronic component 13 disposed in the base frame 11 can be exposed, which can effectively improve the heat dissipation performance of the first electronic component 13.

[0047] The base frame 11 has a window 111 on its first surface. The window 111 forms a space for housing a first electronic component 13, which is stably fixed within the window 111, thus achieving a fixed connection between the first electronic component 13 and the base frame 11. The base frame 11 effectively protects the first electronic component 13, preventing it from being impacted when the embedded substrate 10 is subjected to external force, thus providing good safety. Furthermore, the first electronic component 13 is exposed through the window 111, allowing heat generated by it to dissipate outwards through the exposed surface, resulting in good heat dissipation performance and effectively improving the operating performance and reliability of the first electronic component 13. This exposed outer surface is the surface of the first electronic component 13 without pins or electrodes.

[0048] Alternatively, it can be understood that in the currently symmetrical embedded substrate 10, circuit layers 12 are provided on both the first and second surfaces of the base frame 11, so that the first electronic component 13 is wrapped between the two circuit layers 12. The heat generated by the first electronic component 13 needs to be transferred to the outside through the two circuit layers 12 respectively, which has high thermal resistance and is not conducive to ensuring the heat dissipation performance of the first electronic component 13.

[0049] In the example provided in this application, the embedded substrate 10 adopts an asymmetrical structure, which allows the first electronic component 13 located in the base frame 11 to be exposed, thereby effectively improving the heat dissipation performance of the first electronic component 13.

[0050] The first electronic component 13 includes pins (or electrodes) through which electrical energy or electrical signals can be transmitted. For example, in Figure 2 The example provided shows two pins of the first electronic component 13, namely pin 1311 and pin 1312. Pins 1311 and 1312 are both located on the same surface of the first electronic component 13, and this surface faces the circuit layer 12, facilitating the connection between the conductive lines in the circuit layer 12 and pins 1311 and 1312. The surface of the first electronic component 13 without pins is exposed to window 111, so the heat in the first electronic component 13 can be effectively dissipated to the outside through this surface, resulting in good heat dissipation performance.

[0051] The main function of circuit layer 12 is to provide sufficient conductive lines to meet the power supply and electrical signal connection requirements of the embedded substrate 10. In one implementation, the structure of circuit layer 12 can be varied.

[0052] For example, such as Figure 2 As shown, in one example provided in this application, the circuit layer 12 includes a dielectric 121 and conductive lines (such as conductive lines 122a and 122b) located within the dielectric. The dielectric 121 provides sufficient structural strength and insulation performance, and the conductive lines are made of a material with good conductivity. For example, the dielectric 121 can be made of a prepreg or an Ajinomoto film, which have good insulation properties. The conductive lines can be made of copper or aluminum, which have good conductivity. This application does not limit the specific materials of the dielectric 121 and the conductive lines in the circuit layer 12.

[0053] In addition, the embedded substrate 10 also includes pads disposed on the surface of the circuit layer 12 opposite to the base frame 11, so as to facilitate electrical connection between the embedded substrate 10 and other devices or circuits.

[0054] Specifically, in Figure 2 The example provided illustrates two pads and two conductive lines in circuit layer 12. The two conductive lines are conductive line 122a and conductive line 122b. The two pads are pad 100a and pad 100b. Conductive line 122a connects pad 100a and pin 1311 to establish an electrical connection between them, and conductive line 122b connects pad 100b and pin 1312 to establish an electrical connection between them.

[0055] It should be noted that, in Figure 2 The examples provided only illustrate some possible configurations of the conductive lines in circuit layer 12. In simple terms, conductive lines 122a and 122b include portions extending along the thickness direction of circuit layer 12, as well as portions extending along the width (or length) direction of circuit layer 12. In other examples, circuit layer 12 may include more segments of conductive lines. Alternatively, circuit layer 12 may include a single layer of conductive lines. Or, circuit layer 12 may include multiple layers of conductive lines stacked along the thickness direction of circuit layer 12, with adjacent layers electrically isolated by dielectric 121.

[0056] In summary, in one implementation, the number of conductive lines contained in circuit layer 12 can be reasonably set according to power supply or electrical signal connection requirements. Furthermore, the number and placement of pads contained in circuit layer 12 can also be reasonably set according to power supply or electrical signal connection requirements. Additionally, the conductive lines in circuit layer 12 can be located on the same layer or on different layers, which will not be elaborated further here.

[0057] The main function of the base frame 11 is to provide better structural strength, so that the entire embedded substrate 10 has better structural performance. When the embedded substrate 10 is subjected to external force, it can prevent the embedded substrate 10 from bending or breaking.

[0058] In one example, the base frame 11 can be a multilayer organic framework or a glass framework, etc. For example, when the base frame 11 is a multilayer organic framework, it can specifically be a printed circuit board (PCB). Simply put, the base frame 11 can include insulating dielectric material and conductive structures or conductive lines. The conductive lines in the base frame 11 refer to conductive lines extending along the width or length direction of the base frame 11, and these conductive lines can be made of materials with good conductivity, such as copper. The conductive structures in the base frame 11 refer to conductive structures extending along the thickness direction of the base frame 11, and these conductive structures can specifically be metallized vias, conductive pillars, through-glass vias (TGV), etc.

[0059] When the base frame 11 is an organic frame such as a printed circuit board, it has the advantages of lower manufacturing cost and better reliability. This helps to reduce the manufacturing cost of the embedded substrate 10 and improve the product yield. When the base frame 11 is a glass frame, it has the advantages of high structural strength and low structural stress, which can effectively prevent defects such as bending and warping of the embedded substrate 10.

[0060] In one example, the base frame 11 may have the conductive lines or conductive structures described above, or it may not include conductive lines or conductive structures.

[0061] For example, such as Figure 2 As shown, in one example provided in this application, the pin 1311 of the first electronic component 13 is connected to the pad 100a via a conductive line 122a in the circuit layer 12, and the pin 1312 of the first electronic component 13 is connected to the pad 100b via a conductive line 122b in the circuit layer 12. Conductive lines or conductive structures may not be included in the base frame 11.

[0062] Or, such as Figure 3 As shown, in another example provided in this application, the embedded substrate 10 further includes pads 100c and 100d. Pads 100c and 100d are disposed on the first surface of the base frame 11 (e.g., ...). Figure 3 The lower surface of the first electronic component 13 is connected to the two pins of the first electronic component 13 respectively to meet the conductivity requirements of the first electronic component 13.

[0063] Specifically, the base frame 11 includes conductive structures 113a and 113b, both extending along the thickness direction of the base frame 11. The circuit layer 12 includes conductive lines 122a and 122b. One end of conductive line 122a is connected to a pin 1311 of the first electronic component 13, and the other end is connected to conductive structure 113a in the base frame 11. Conductive structure 113a is also connected to pad 100c. That is, pin 1311 and pad 100c are connected via conductive lines 122a and conductive structure 113a. Correspondingly, one end of conductive line 122b is connected to a pin 1312 of the first electronic component 13, and the other end is connected to conductive structure 113b in the base frame 11. Conductive structure 113b is also connected to pad 100d. That is, pin 1312 and pad 100d are connected via conductive lines 122b and conductive structure 113b.

[0064] In some applications, pads 100c and 100d can be connected to circuits in other modules to enable the connection between the embedded substrate 10 and other modules.

[0065] In addition, in the example provided in this application, the embedded substrate 10 adopts an asymmetrical structure, which can effectively reduce the conductive path and thus have higher transmission efficiency.

[0066] In the example provided in this application, the circuit layer 12 is only disposed on the second surface of the base frame 11, while the circuit layer 12 is not disposed on the first surface of the base frame 11. This allows the pads (such as pads 100c and 100d) of the embedded substrate 10 to be disposed on the first surface of the embedded substrate 10. Pad 100c and the pin 1311 of the first electronic component 13 can be connected through the conductive structure 113a in the base frame 11 and the conductive line 122a in the circuit layer 12, resulting in a shorter transmission path. Alternatively, it can be understood that when the embedded substrate 10 adopts a symmetrical structure, a circuit layer is also disposed on the first surface of the base frame 11, which covers the first surface of the base frame 11, preventing pads 100c and 100d from being directly disposed on the first surface of the base frame 11. Therefore, pads 100c and 100d can only be disposed on the surface of this circuit layer, requiring corresponding conductive lines to be disposed in this circuit layer. This conductive line increases the conductive path between the first electronic component 13 and pads 100c and 100d, thus introducing additional resistance and reducing the performance of the embedded substrate 10.

[0067] When setting up the window 111 in the base frame 11, its structure type can be varied.

[0068] For example, such as Figure 2 and Figure 3 As shown, in one example provided in this application, the window 111 extends through the thickness of the base frame 11. That is, the window 111 extends to both the first and second surfaces of the base frame 11. The first electronic component 13 is located within the window 111 and is fixedly connected to the base frame 11. Figure 3 In the example provided, the first electronic component 13 is fixedly connected to the base frame 11 via a medium 112. This medium 112 can be of the same type as or different from the medium 121 in the circuit layer 12. Furthermore, when setting the embedded substrate 10, the medium 112 and the medium 121 in the circuit layer 12 can be prepared using the same process or separately using different processes; this will not be elaborated further here.

[0069] Alternatively, in other examples, the window 111 may not extend to the thickness of the base frame 11. That is, the depth of the window 111 may be smaller than the thickness of the base frame 11, which will not be elaborated here.

[0070] It should be noted that, in Figure 2 and Figure 3 The example provided is exemplified by having pads 100 in the embedded substrate 10 disposed on the surface of the circuit layer 12 and the surface of the base frame 11, respectively. In other examples, pads 100 may be disposed on both the surface of the circuit layer 12 and the surface of the base frame 11.

[0071] For example, such as Figure 4 As shown, in one example provided in this application, the embedded substrate 10 includes pads 100a, 100b, 100c, and 100d. Pads 100a and 100b are located on the surface of the circuit layer 12 opposite to the base frame 11, while pads 100c and 100d are located on the first surface of the base frame 11. Pad 100a is connected to the pin 1311 of the first electronic component 13 via a conductive line 122a in the circuit layer 12. Pad 100b is connected to the pin 1312 of the first electronic component 13 via a conductive line 122b in the circuit layer 12. Additionally, pad 100c is connected to the pin 1311 of the first electronic component 13 via a conductive structure 113a and a conductive line 122a. Pad 100d is connected to the pin 1312 of the first electronic component 13 via a conductive structure 113b and a conductive line 122b.

[0072] In other examples, the embedded substrate 10 may include fewer or more pads, which will not be elaborated here.

[0073] In summary, in one implementation, the pads can be located on the surface of the circuit layer 12 or on the surface of the base frame 11. Alternatively, when the embedded substrate 10 includes multiple pads, all of the pads can be located on the surface of the circuit layer 12; or, all of the pads can be located on the surface of the base frame 11. Alternatively, some pads can be located on the surface of the base frame 11, and others can be located on the surface of the circuit layer 12, which will not be elaborated here.

[0074] Furthermore, in the above example, which is an exemplary description of an embedded substrate 10 including one first electronic component 13, in other examples, the embedded substrate 10 may include more first electronic components 13.

[0075] For example, such as Figure 5 As shown, in another example provided in this application, the embedded substrate 10 includes two first electronic components, namely first electronic component 13a and first electronic component 13b, both of which are disposed in the base frame 11.

[0076] Specifically, the base frame 11 includes two spaced windows, window 111a and window 111b. First electronic component 13a is disposed within window 111a, and first electronic component 13b is disposed within window 111b. Furthermore, the pin 1311a of first electronic component 13a is connected to pad 100a via a conductive line, and the pin 1312a of first electronic component 13a is connected to pad 100b and pin 1311b of first electronic component 13b via a conductive structure 122b. The pin 1312b of first electronic component 13b is connected to pad 100c via conductive line 122b. That is, first electronic component 13a and first electronic component 13b can be connected via conductive lines in circuit layer 12. Alternatively, in other examples, first electronic component 13a and first electronic component 13b may not be connected. In addition, when the embedded substrate 10 includes multiple first electronic components, the multiple first electronic components may be located in the same window in the base frame 11 or in different windows, which will not be elaborated here.

[0077] In summary, in one example, the embedded substrate 10 may include one or more first electronic components. When the embedded substrate 10 includes multiple first electronic components, the multiple first electronic components may be independent of each other, or at least two first electronic components may be connected by conductive lines or conductive structures in the circuit layer 12 or the base frame 11, which will not be elaborated here.

[0078] In addition, in some examples, the embedded substrate 10 may include other types of electronic components besides the first electronic components described above.

[0079] For example, such as Figure 6 As shown, in another example provided in this application, the embedded substrate 10 further includes a second electronic component 14, which is of a different type from the first electronic component 13. For example, the second electronic component 14 can also be a resistor, inductor, or other types of electronic component. To facilitate understanding of the technical solution of this application, the following will exemplify the second electronic component 14 as a capacitor.

[0080] like Figure 6 As shown, in one example provided in this application, the second electronic component 14 is disposed in the base frame 11. Furthermore, the second electronic component 14 and the first electronic component 13 can be connected via conductive lines 122b in the circuit layer 12. Additionally, the second electronic component 14 is also connected to pads 100c disposed on the first surface of the base frame 11 to meet the electrical connection requirements of the second electronic component 14.

[0081] In other examples, the base frame 11 may include one or more second electronic components 14, and this application does not limit the specific type of the second electronic component 14. Additionally, in some examples, when the base frame 11 includes a first electronic component 13 and a second electronic component 14, the first electronic component 13 and the second electronic component 14 can be independent of each other. Alternatively, the first electronic component 13 and the second electronic component 14 can also be connected through the circuit layer 12 or conductive lines in the base frame 11, which will not be elaborated further here.

[0082] It should be noted that when configuring the second electronic component 14, a window for accommodating the second electronic component 14 may also be provided in the base frame 11. The second electronic component 14 may be located inside the base frame 11, or it may be exposed on the first surface of the base frame 11. Alternatively, in some cases, the first electronic component and the second electronic component 14 may be located within the same window.

[0083] In some examples, the relative positional relationship between the first electronic element 13 and the base frame 11 can be varied.

[0084] For example, such as Figure 7 As shown, in one example provided in this application, the surface of the first electronic component 13 exposed on the window 111 is substantially flush with the first surface of the base frame 11.

[0085] Alternatively, in other examples, the surface of the first electronic component 13 may be slightly lower than the first surface of the base frame 11. In specific applications, the relative positional relationship between the first electronic component 13 and the base frame 11 can be reasonably set according to actual needs.

[0086] like Figure 8 As shown, in another example provided in this application, the embedded substrate 10 further includes a thermally conductive layer 15. The thermally conductive layer 15 is located on the surface of the first electronic component 13 exposed in the window 111.

[0087] In one example, the thermally conductive layer 15 may be made of a material with good thermal conductivity, such as copper or aluminum. Alternatively, in some examples, the thermally conductive layer 15 may also be made of a material with good thermal conductivity and good insulation properties, such as silicon carbide or thermally conductive silicone.

[0088] By configuring the heat-conducting layer 15, the heat dissipation performance of the first electronic component 13 can be effectively improved. The heat generated by the first electronic component 13 can be transferred to the heat-conducting layer through thermal conduction, which can achieve rapid cooling of the first electronic component 13, and is beneficial to improving the instantaneous power of the first electronic component 13.

[0089] In one example, the area of ​​the heat-conducting layer 15 can also be set to be relatively large in order to increase the heat dissipation area of ​​the heat-conducting layer 15, thereby further improving the heat dissipation performance of the first electronic component 13.

[0090] When manufacturing the embedded substrate 10, a variety of different process flows can be used.

[0091] For example, such as Figures 9 to 19 As shown in the figure, this application embodiment also provides a fabrication process for an embedded substrate 10.

[0092] like Figure 9 As shown, a base frame 11 is first provided, which has a window 111, a conductive structure 113a, and a conductive structure 113b. The window 111, conductive structure 113a, and conductive structure 113b all penetrate the thickness of the base frame 11. Wherein, in Figure 9 The example provided illustrates the concept of a base frame 11 including one window 111 and two conductive structures. In other examples, the base frame 11 may include more windows 111 or conductive structures, which will not be elaborated here.

[0093] like Figure 10 As shown, on the first surface of the base frame 11 (e.g. Figure 10 An auxiliary tape 30 is attached to the lower surface of the base frame 11. Specifically, the auxiliary tape 30 can be an adhesive tape. The auxiliary tape 30 includes a tape body and an adhesive body. The adhesive body is located on the surface of the tape body facing the base frame 11 to achieve adhesive bonding and fixation between the tape body and the base frame 11. The adhesive body can be a type of thermally degradable adhesive, photodegradable adhesive, mechanically release adhesive, etc.

[0094] like Figure 11 As shown, the first electronic component 13 can be placed inside the window 111 and bonded to the auxiliary strip 30 to ensure the relative positional stability between the first electronic component 13 and the base frame 11. It should be noted that... Figure 11 In the example provided, only one first electronic component 13 is shown. In other examples, there may be multiple first electronic components 13, or other types of electronic components may be included, which will not be elaborated here.

[0095] like Figure 12 As shown, the medium 121 can be filled into the window 111 and covered on the second surface of the base frame 11 by processes such as lamination and filling, so as to achieve the encapsulation of the first electronic component 11.

[0096] like Figure 12 and Figure 13 As shown, remove the auxiliary band 30.

[0097] like Figure 14As shown, a substrate 31 is disposed on the first surface of the base frame 11. The substrate 31 can be a metal plate or a glass substrate. The substrate 31 provides sufficient structural strength to ensure the safety and structural stability of the base frame 11 in subsequent fabrication processes.

[0098] like Figure 15 As shown, several through holes 1210 can be formed in the dielectric 121 to expose conductive structures 113a, conductive structures 113b, pins 1311 and 1312. For example, laser etching or other processes can be used to remove some of the material from the dielectric 121.

[0099] like Figure 16 As shown, conductive lines are formed on the surface of dielectric 121 facing away from the base frame 11. For example, conductive materials can be formed on the surfaces of through-hole 1210 and dielectric 121 using processes such as electroplating, filling, and patterning to prepare conductive lines 122a and 122b. Conductive line 122a is connected to conductive structure 113a and pin 1311, and conductive line 122b is connected to conductive structure 113b and pin 1312.

[0100] like Figure 17 and Figure 18 As shown, the dielectric and conductive lines are fabricated again. In simple terms, a through-hole is first formed in the dielectric 121a, and then conductive lines are fabricated on the surface of the through-hole and the dielectric 121a to form conductive lines 122c and 122d. Conductive line 122c is connected to conductive line 122a, and conductive line 122d is connected to conductive line 122b.

[0101] like Figure 19 As shown, the substrate 31 can be removed and pads 100a, 100b, 100c and 100d can be prepared.

[0102] It should be noted that, in Figures 9 to 19 The example provided is an illustrative example of one possible structural type of the embedded substrate 10. In other examples, other processes may be used to fabricate the embedded substrate 10, which will not be elaborated here.

[0103] The embedded substrate 10 can be used in a variety of different types of equipment or scenarios.

[0104] For example, such as Figure 20 As shown, this application embodiment also provides an electronic device 20, including a heat sink 21 and an embedded substrate 10.

[0105] The heat sink 21 is located on the first surface of the base frame 11 and makes thermal contact with the first electronic component 13 to improve the heat dissipation performance of the first electronic component 13. The heat sink 21 can be of various types, such as an air-cooled heat sink or a liquid-cooled heat sink; this application does not limit the specific type of heat sink 21. Furthermore, when the embedded substrate 10 includes multiple first electronic components 13, the multiple first electronic components 13 can make thermal contact with the same heat sink 21. Alternatively, the electronic device may also include multiple heat sinks 21, and different first electronic components 13 can make thermal contact with their respective heat sinks 21.

[0106] The thermally conductive contact between the heat sink 21 and the first electronic component 13 means that the heat sink 21 can directly contact the first electronic component 13, allowing the heat generated by the first electronic component 13 to be directly transferred to the heat sink via thermal transfer. Alternatively, the heat sink 21 and the first electronic component 13 can also be indirectly in contact. For example, a thermally conductive material such as thermal grease can be applied between the contact surfaces of the heat sink 21 and the first electronic component 13 to reduce the contact thermal resistance between them, thereby improving the thermal conductivity between them.

[0107] Alternatively, in some examples, when the surface of the first electronic component 13 is provided with the aforementioned heat-conducting layer, the heat sink 21 can also make thermal contact with the heat-conducting layer, which will not be elaborated here.

[0108] In one example, the electronic device 20 may also include other components.

[0109] For example, such as Figure 21 As shown, in another example provided in this application, the electronic device 20 may also include a motherboard 22 (or system board). Various types of processors 23, such as a central processing unit (CPU) or a graphics processing unit (GPU), can be mounted on the motherboard 22. Pads (such as pads 100a and 100b) on the embedded substrate 10 can be connected to conductive structures such as pads on the surface of the motherboard 23 to achieve electrical connection between electronic components (such as the first electronic component 13) in the embedded substrate 10 and the motherboard 23.

[0110] In addition, Figure 21 In the example provided, the electronic device 20 also includes a heat dissipation structure 24. This heat dissipation structure 24 is in thermal contact with the processor 23, and is used to improve the heat dissipation performance of the processor 23. The heat dissipation structure 24 can be an air-cooled heat sink or a liquid-cooled heat sink, etc., and this application does not limit this.

[0111] It is understood that the electronic device 20 may specifically be a power supply module, power conversion device, network device, etc. Alternatively, it may be some functional module in a vehicle or data center. This application does not limit the specific type of the electronic device 20.

[0112] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions of different embodiments are consistent and can be referenced by each other. The technical features of different embodiments can be combined to form new embodiments according to their inherent logical relationship.

[0113] In this application, "multiple" means two or more. "And / or" describes the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, or B exists alone, where A and B can be singular or plural.

[0114] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application. The order of the process numbers described above does not imply the order of execution; the execution order of each process should be determined by its function and internal logic.

Claims

1. An embedded substrate, characterized in that, Includes the base frame, circuit layer, and first electronic components; The base frame has a first surface and a second surface that are opposite to each other; The first electronic component is located within the base frame, and the first surface of the base frame has a window through which the first electronic component is exposed. The circuit layer is located on the second surface, and the conductive lines in the circuit layer are conductively connected to the first electronic component.

2. The embedded substrate according to claim 1, characterized in that, The embedded substrate also includes a thermally conductive layer; The thermally conductive layer is located on the surface of the first electronic component exposed in the window.

3. The embedded substrate according to claim 1 or 2, characterized in that, The surface of the first electronic component exposed in the window is flush with the first surface.

4. The embedded substrate according to any one of claims 1 to 3, characterized in that, The embedded substrate includes a plurality of the first electronic components; The first surface of the substrate has a plurality of windows, and the plurality of first electronic components correspond one-to-one with the plurality of windows.

5. The embedded substrate according to any one of claims 1 to 4, characterized in that, The embedded substrate also includes at least one second electronic component; The at least one second electronic component is located within the base frame and is electrically connected to the conductive lines in the circuit layer.

6. The embedded substrate according to any one of claims 1 to 5, characterized in that, The embedded substrate also includes solder pads and conductive structures; The conductive layer is located on the first surface of the base frame, and the conductive structure is located inside the base frame and connected between the conductive layer and the conductive lines in the circuit layer.

7. The embedded substrate according to claim 6, characterized in that, The conductive structure is any one of a metallized hole, a conductive post, or a wire.

8. The embedded substrate according to any one of claims 1 to 7, characterized in that, The base frame is an organic dielectric substrate, a glass substrate, or a ceramic substrate.

9. An electronic device, characterized in that, Includes a heat sink and an embedded substrate as described in any one of claims 1 to 8; The heat sink is located on the first surface of the base frame and is in thermal contact with the first electronic component.

10. The electronic device according to claim 9, characterized in that, The electronic device also includes a motherboard; The circuit layer faces the motherboard, and the conductive lines in the circuit layer are electrically connected to the conductive lines in the motherboard.

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