Integrated suspended line circuit realized on the basis of advanced packaging technology

Abstract

The application discloses an integrated suspended line circuit realized based on advanced packaging technology, which comprises a suspended line main circuit and a local support structure for realizing suspension of the suspended line main circuit, and gaps are arranged between the local support structures to form a cavity structure, and the suspended line main circuit is arranged inside the cavity structure or outside the cavity structure and shielded by a shielding structure. The integrated suspended line circuit has great potential in application scenes such as higher frequency bands, circuit miniaturization and higher integration, simplifies the structure of the integrated suspended line circuit, provides a reliable scheme for realizing a high-performance heterogeneous integrated circuit and system under the advanced packaging technology, and inherits the advantages of the integrated suspended line platform, such as low loss, high performance and self-packaging.

Description

Technical Field

[0001] This invention relates to the field of radio frequency, microwave, millimeter wave, and terahertz circuit technology, and in particular to an integrated suspension line circuit based on advanced packaging technology. Background Technology

[0002] With the rapid development of 5G / 6G communication technology and radar technology, radio frequency circuit design is gradually moving towards millimeter-wave (mm-Wave) and terahertz (THz) frequency bands, and radio frequency systems are gradually developing towards miniaturization and integration.

[0003] Integrated Suspended Line (ISL) structures have been widely used in various RF passive and active devices and antennas due to their advantages such as low loss, high performance, and self-packaging. However, traditional suspension structures require multi-layer printed circuit boards (PCBs) or metal to realize device packaging and internal cavities, making it difficult to manufacture and package heterogeneous integration and miniaturized circuits on integrated suspension line structures.

[0004] With the arrival of the post-Moore's Law era, advanced packaging is gradually replacing traditional packaging technologies, becoming an important technological path to surpass Moore's Law. Therefore, a new solution is needed that combines the advantages of advanced packaging with integrated suspension lines to achieve higher performance, higher density, and smaller area RF circuits and systems. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings and defects of existing technologies and provide an integrated suspended line circuit based on advanced packaging technology. The use of advanced packaging technology with local support structures for the manufacturing and packaging of the integrated suspended line circuit provides a new approach for achieving high-density, miniaturized, heterogeneous integration of integrated suspended line platforms.

[0006] This invention is achieved through the following technical solution:

[0007] An integrated suspended line circuit based on advanced packaging technology includes a suspended line main circuit and local support structures for suspending the suspended line main circuit. There are gaps between the local support structures to form a cavity structure. The suspended line main circuit is located inside the cavity structure or is located outside the cavity structure and then shielded by a shielding structure.

[0008] Preferably, the local support structure adopts a vertical interconnect structure based on advanced technology, including at least one vertical interconnect structure formed by ball grid array, micro bumps, copper pillar bumps, and metal layer hybrid bonding.

[0009] Preferably, the main circuit of the suspension line is composed of at least one metal layer that performs the main circuit function, or is composed of a main circuit wiring layer on at least one surface of at least one dielectric substrate. When wiring is performed on two surfaces of the dielectric substrate to form main circuit wiring layers, the main circuit wiring layers on the two surfaces are interconnected through metal vias; or it is composed of a redistribution layer that is connected to the surface of the dielectric substrate through bumps.

[0010] Preferably, the material of the dielectric layer includes at least one of PCB, quartz, sapphire, alumina ceramic, aluminum nitride ceramic, low-temperature co-fired ceramic, high-temperature co-fired ceramic, or organic material.

[0011] Preferably, a through-hole vertical structure is provided on the dielectric layer near its side to enhance the electromagnetic shielding function of the suspended line circuit. The through-hole vertical structure includes at least one of metal through-hole, silicon through-hole, and glass through-hole, and is connected to the vertical interconnect structure through the vertical structure.

[0012] Preferably, the main circuit of the suspension line is interconnected with N electronic modules, where N≥1, and the electronic module includes at least one of the following: passive circuit, active circuit, chip, or antenna.

[0013] Preferably, in the suspended line integrated circuit, each layer of the plate-shaped package structure other than the suspended line main circuit is a metal plate and / or a dielectric plate with a surface metallized layer.

[0014] Preferably, the local support structure forms multiple cavity structures between one of the suspended main circuits and at least one layer of plate-shaped packaging structure, and the suspended main circuit is arranged in each cavity structure.

[0015] Preferably, structural adhesive is used to fix the local support structure to each layer of the integrated suspension line connected thereto.

[0016] Preferably, when the main circuit of the suspended wire is located outside the cavity structure, a metal shield is provided above the main circuit of the suspended wire to shield it inside, and the main circuit of the suspended wire is supported on the carrier plate by a local support structure.

[0017] The integrated suspension line circuit of this invention achieves higher precision integrated suspension line processing and assembly through a local support structure based on advanced packaging technology. It has great potential in application scenarios such as higher frequency bands, circuit miniaturization, and higher integration. It simplifies the construction of integrated suspension line structures and provides a reliable solution for realizing high-performance heterogeneous integrated circuits and systems under advanced packaging technology. At the same time, the integrated suspension line circuit inherits the advantages of integrated suspension line platforms such as low loss, high performance, and self-packaging.

[0018] In the integrated suspended line circuit described in this application, the main circuit of the suspended line can be a single-sided or double-sided wiring of a dielectric substrate, or a main circuit directly composed of metal layers. It can also be a combination of single-sided or double-sided wiring of multi-layer dielectric substrates and multi-layer metal layers, and a vertical interconnect structure is used to provide local support for the integrated suspended line main circuit, with cavities formed between adjacent vertical interconnect structures.

[0019] The integrated suspended line circuit described in this application may not be self-packaged. Instead, it may be an integrated suspended line structure formed by adding a metal shell to the main circuit and fixing it to the carrier board through a local support junction. Attached Figure Description

[0020] Figure 1 This is a schematic cross-sectional view of the basic structure of the integrated suspension line circuit of the present invention.

[0021] Figure 2 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention.

[0022] Figure 3 This is a cross-sectional view of a typical two-layer integrated suspension line of the present invention.

[0023] Figure 4 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention.

[0024] Figure 5 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention.

[0025] Figure 6 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention.

[0026] Figure 7 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention.

[0027] Figure 8 This is a cross-sectional view of the typical five-layer integrated suspension line of the present invention.

[0028] Figure 9 This is a cross-sectional view of the typical four-layer integrated suspension line structure of the present invention.

[0029] Figure 10 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention.

[0030] Figure 11 This is a cross-sectional view of a typical integrated suspension wire surface mount package of the present invention.

[0031] Figure 12 A cross-sectional view showing the addition of an antenna to the integrated suspension line of this invention.

[0032] Figure 13A cross-sectional view showing the addition of passive components and circuitry to the integrated suspension line of this invention.

[0033] Figure 14 A cross-sectional view showing the addition of active devices and circuits to the integrated suspension line of the present invention.

[0034] Figure 15 A cross-sectional view of the chip is added to the integrated suspension line of the present invention.

[0035] Figure 16 A cross-sectional view of the components added to the integrated suspension line of the present invention.

[0036] Figure 17 This is a cross-sectional view of the typical four-layer integrated suspension line structure of the present invention.

[0037] Figure 18 This is a cross-sectional view of the typical five-layer integrated suspension line of the present invention.

[0038] Figure 19 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention.

[0039] Figure 20 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention.

[0040] Figure 21 This is a cross-sectional view of a typical multi-layer structure 3D integrated suspension line of the present invention. Detailed Implementation

[0041] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0042] Figure 1 This is a cross-sectional schematic diagram of the basic structure of the integrated suspended line circuit based on advanced packaging technology of the present invention. The top and bottom dielectric substrates are double-sided plated with metal, and the integrated suspended line main circuit is located on the middle dielectric substrate. The multilayer board structure is interconnected and stacked through ball-mounting / soldering, and cavities are formed above and below the suspended line main circuit. Figure 1 As shown, the entire suspension line structure consists of three layers of dielectric substrates. The top and bottom dielectric substrates serve to encapsulate and form cavities. The main circuit of the suspension line is located on the middle dielectric substrate. The suspension structure is formed by ball-planting / soldering on the top and bottom sides. The main circuit of the suspension line is located in the cavity of electromagnetic shielding.

[0043] The main circuit of the suspension line can be a single-module circuit, a multi-module system, a single integrated circuit chip, an interconnection of multiple integrated circuit chips, or a circuit system formed by interconnection of multiple integrated circuit chips and multi-layer board-level circuits.

[0044] The dielectric substrate is made of materials such as PCB, quartz, sapphire, alumina ceramic, aluminum nitride ceramic, low temperature co-fired ceramic (LTCC), high temperature co-fired ceramic (HTCC), or organic materials.

[0045] It should be noted that ball placement / soldering is not the only advanced packaging interconnect structure that can be used. Other vertical interconnect structures include micro-bumps, hybrid bonding (HB), etc., or solder balls, gold bumps, etc.

[0046] Figure 2 This is a cross-sectional view of a typical three-layer integrated suspension line structure of the present invention. The top and bottom dielectric substrates are double-sided plated with metal, and through-holes are drilled on the sides and filled with metal. The middle dielectric substrate contains the integrated suspension line main circuit, and through-holes are drilled on the sides and filled with metal. The multi-layer board structure is interconnected and stacked through ball / solder balls, and the upper and lower sections of the integrated suspension line main circuit form electromagnetic shielding cavities. Figure 2 As shown, vias are typically designed on the side of the dielectric substrate and filled with metal to facilitate vertical interconnection of circuits and enhance the electromagnetic shielding effect of the cavity. These vias can be metal vias, through-silicon vias (TSVs), through-glass vias (TGVs), etc., and are not limited to these. The goal is to meet the vertical interconnection requirements of the circuits and systems while strengthening the electromagnetic shielding of the overall suspended line circuitry.

[0047] Figure 3 This is a cross-sectional view of a typical two-layer integrated suspension line of the present invention. The bottom dielectric board is plated with metal on both sides, and the top dielectric board is the flip-chip integrated suspension line main circuit, that is, the integrated suspension line main circuit is located on the lower surface of the top dielectric board. The two-layer board structure is interconnected and stacked by ball-mounting, and a cavity is formed below the suspension line main circuit.

[0048] Figure 4 This is a cross-sectional view of a typical three-layer integrated suspension line structure of the present invention. The top and bottom dielectric boards are plated with metal on both sides, and the integrated suspension line main circuit is arranged on the middle dielectric board. The multi-layer board structure is interconnected and stacked through micro-bumps, and the suspension line main circuit forms cavities above and below.

[0049] Figure 5 This is a cross-sectional view of a typical three-layer integrated suspension line structure of the present invention. The top and bottom dielectric boards are plated with metal on both sides. The main circuit of the integrated suspension line is arranged on the upper surface of the middle dielectric board. The multi-layer board structure is interconnected and stacked through copper pillar bumps. The main circuit of the suspension line forms cavities above and below.

[0050] Figure 6This is a cross-sectional view of a typical three-layer integrated suspension line structure of the present invention. The top and bottom dielectric boards are plated with metal on both sides. The main suspension line circuit is integrated on the upper surface of the middle dielectric board. The multilayer board structure is interconnected and stacked through metal layer hybrid bonding (HB) technology, and cavities are formed above and below the main suspension line circuit.

[0051] Figure 7 This is a cross-sectional view of a typical three-layer integrated suspension line structure of the present invention. The top and bottom dielectric boards are plated with metal on both sides. The suspension line main circuit is integrated with double-sided metal wiring on the middle dielectric board. The double-sided metal wiring is interconnected by drilling and filling metal. The multi-layer board structure is interconnected and stacked by ball-planting. Cavities are formed above and below the suspension line main circuit.

[0052] Figure 8 This is a cross-sectional view of a typical five-layer integrated suspension line structure of the present invention. The top and bottom dielectric boards are plated with metal on both sides. The second and fourth dielectric boards are partially hollowed out. The suspension line main circuit is integrated on the surface of the third dielectric board. The multi-layer board structure is interconnected and stacked through ball-planting. The upper and lower parts of the suspension line main circuit form cavities with further enlarged volume.

[0053] Figure 9 This is a cross-sectional view of a typical four-layer integrated suspension line structure of the present invention. The top and bottom dielectric boards are plated with metal on both sides. The second and third dielectric boards have multi-layer integrated suspension line circuits arranged on their surfaces. The multi-layer board structure is interconnected and stacked by ball-mounting, and the suspension line circuits form cavities above and below.

[0054] Through the above Figure 8 , Figure 9 It can be seen that the structure of the integrated suspension line circuit in this application is not limited to a three-layer dielectric substrate suspension line structure; it can be a five-layer, seven-layer, or more-layer suspension line structure. The cavity volume can also be increased by using multiple layers with partial hollowing out of some layers, such as... Figure 8 As shown.

[0055] Figure 10 This is a cross-sectional view of a typical three-layer integrated suspension line structure of the present invention. The top and bottom dielectric boards are plated with metal on both sides. The main circuit of the suspension line is integrated on the upper surface of the middle dielectric board. The multi-layer board structure is interconnected and stacked by ball planting, and the ball planting area is locally filled with adhesive to increase the stability of the overall structure while retaining the cavity structure. The main circuit of the suspension line forms cavities above and below.

[0056] Figure 11This is a cross-sectional view of a typical integrated surface-mount main circuit with suspended lines according to the present invention. The main circuit with suspended lines is integrated on the upper surface of the dielectric substrate, a metal shell is placed on the upper side of the dielectric substrate, and the lower side is fixed to the carrier board by ball bearings. Cavities for electromagnetic shielding are formed above and below the suspended lines. This structure is suitable for circuit devices that require surface-mount packaging. A metal shell can be placed on top of the main circuit layer, and the lower side can be connected to the carrier board by ball bearings to form a suspended structure.

[0057] Figure 12 A cross-sectional view of the antenna portion is added to this invention. Figure 13 A cross-sectional view of the passive device and circuit section is added to this invention. Figure 14 A cross-sectional view of the active device and circuit section is provided for this invention. Figure 15 A cross-sectional view of the chip is added to this invention. Figure 16 A cross-sectional view of the components is added to this invention.

[0058] pass Figure 12-16 As can be seen, the integrated suspension line circuit structure of this application has good expansion performance, and different types of circuits, modules, chips and systems can be directly embedded into the main circuit of the suspension line to form the required circuit module or circuit system.

[0059] Figure 17 This is a cross-sectional view of a typical four-layer integrated suspension line structure of the present invention. The top dielectric board, the second dielectric board, and the fourth dielectric board are plated with metal on both sides, and metal is filled through holes drilled on the sides. The second dielectric board is partially hollowed out. The main circuit of the suspension line is integrated on the surface of the third dielectric board, and metal is filled through holes drilled on the sides. The multi-layer board structure is interconnected and stacked through partial balling and partial metal layers and metal through holes. The main circuit of the suspension line forms an electromagnetic shielding cavity above and below.

[0060] Figure 18 The cross-sectional view of a typical five-layer integrated suspension line of this invention is shown. It consists of three metal plates and one carrier plate. The third metal plate is the main circuit of the integrated suspension line. The second metal plate is partially hollowed out. The third metal plate is partially hollowed out except for the main circuit part. The three metal plates are pressed together. The metal layers on both sides of the third metal plate are fixed to the carrier plate by ball implantation. The port of the main circuit of the integrated suspension line is formed by ball implantation to form a support structure. At the same time, the signal is transferred to the carrier plate through the ball implantation. The main circuit of the integrated suspension line forms an electromagnetic shielding cavity above and below, similar to the surface-mount metal integrated suspension line structure (MISL).

[0061] Figure 19 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention. The second layer is a dielectric substrate, on which the main circuit of the suspension line is integrated. The top metal plate, the bottom metal plate and the dielectric substrate are interconnected and stacked through ball-mounted stacks. The main circuit of the suspension line forms an electromagnetic shielding cavity above and below, similar to the hybrid integrated suspension line structure (HISL).

[0062] pass Figures 18 to 19 As shown, the different layer materials of the suspended line integrated circuit structure of this application can be freely combined, and the dielectric layer can be completely or partially replaced with a metal layer with better heat dissipation performance to achieve a flexible cavity structure.

[0063] Figure 20 This is a cross-sectional view of a typical three-layer integrated suspension line of the present invention. The top and bottom dielectric boards are plated with metal on both sides. The integrated suspension line circuit on the middle dielectric board has multiple different circuits or modules. The multi-layer board structure and different circuits are interconnected and stacked through ball-mounting. Multiple cavities are formed above and below the main suspension line circuit. Thus, the local support structure formed by the vertical interconnection structure separates multiple cavities through multiple uses of the same layer. The main suspension line circuit is isolated in different cavities.

[0064] Figure 21 This is a cross-sectional view of a typical multi-layer 3D integrated suspension line of the present invention. The lower side of the dielectric substrate contacts the carrier board through ball-mounted elements, and the upper side contacts the redistribution layer (RDL) through smaller bumps. The upper side of the redistribution layer is interconnected with the chip through micro-bumps, forming a multi-layer vertical interconnect structure. A metal shell is placed on top of the overall 3D circuit structure, and the multi-layer vertical interconnect structure forms multiple cavities in the vertical direction.

[0065] The integrated suspension line circuit described in this application can be used in advanced packaging solutions such as 2D, 2.5D, 3D stacking, system-in-package (SiP) or chiplet. For currently popular advanced packaging architectures such as 2.5D, 3D stacking, and chiplet, one or more of the above-mentioned suspension line structures can be fully or partially implemented in the structure to achieve lower loss and higher performance heterogeneous integration technology.

[0066] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention.

[0067] Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of the equivalents of the claims be included within the invention.

[0068] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An integrated suspended line circuit based on advanced packaging technology, characterized in that, It includes a suspended main circuit and a local support structure for suspending the suspended main circuit. There are gaps between the local support structures to form a cavity structure. The suspended main circuit is located inside the cavity structure or is located outside the cavity structure and then shielded by a shielding structure.

2. The integrated suspension line circuit according to claim 1, characterized in that, The local support structure adopts a vertical interconnect structure based on advanced technology, including at least one vertical interconnect structure formed by ball grid array, micro bumps, copper pillar bumps, and metal layer hybrid bonding.

3. The integrated suspension line circuit according to claim 1, characterized in that, The main circuit of the suspension line is composed of at least one metal layer that performs the main circuit function, or is composed of a main circuit wiring layer on at least one surface of at least one dielectric substrate. When wiring is performed on two surfaces of the dielectric substrate to form a main circuit wiring layer, the main circuit wiring layers on the two surfaces are interconnected through metal vias; or it is composed of a redistribution layer that is connected to the surface of the dielectric substrate through bumps.

4. The integrated suspended line circuit according to claim 3, characterized in that, The dielectric layer is made of at least one of the following materials: PCB, quartz, sapphire, alumina ceramic, aluminum nitride ceramic, low-temperature co-fired ceramic, high-temperature co-fired ceramic, or organic material.

5. The integrated suspended line circuit according to claim 2, characterized in that, A through-hole vertical structure is provided near its side on the dielectric layer to enhance the electromagnetic shielding function of the suspended line circuit. The through-hole vertical structure includes at least one of metal through-hole, silicon through-hole, and glass through-hole. The vertical structure is connected to the vertical interconnect structure.

6. The integrated suspended line circuit according to claim 1, characterized in that, The main circuit of the suspension line is interconnected with N electronic modules, where N≥1. The electronic modules include at least one of the following: passive circuit, active circuit, chip, or antenna.

7. The integrated suspended line circuit according to claim 1, characterized in that, In the suspended line integrated circuit, each layer of the plate-shaped package structure other than the suspended line main circuit adopts a metal plate and / or a dielectric plate with a surface metallized layer.

8. The integrated suspension line circuit according to claim 1, characterized in that, The local support structure forms multiple cavity structures between a suspended main circuit and at least one plate-shaped packaging structure, and a suspended main circuit is arranged in each cavity structure.

9. The integrated suspended line circuit according to claim 1, characterized in that, The local support structure is fixed to each layer of the integrated suspension line connected thereto by structural adhesive by filling structural adhesive between them.

10. The integrated suspension line circuit according to claim 1, characterized in that, When the main circuit of the suspended wire is located outside the cavity structure, a metal shield is set above the main circuit of the suspended wire to shield it inside. The main circuit of the suspended wire is supported on the carrier plate by a local support structure.

Images