Tolerance alignment method for blind via press contact hole, through via press contact hole and pattern during multiple press and PCB board

Abstract

The application relates to a PCB manufacturing technology field, and relates to a PCB and a tolerance alignment method for blind hole crimping holes, through hole crimping holes and patterns, which comprises the following steps: different copper PAD sizes and different reference positioning methods are adopted to drill through holes, the through holes comprise blind hole crimping holes, through hole crimping holes, laser holes, mechanical blind holes and through holes, first, different size copper PADs are arranged at the four corners of the second layer pattern of the upper and lower BV CORE, a first group of pipe position holes are drilled, laser holes, blind hole crimping holes and mechanical blind holes are processed, after total pressing, a plurality of groups of pipe position holes and dry film holes are drilled, through holes and through hole crimping holes are drilled, and patterns are made, the position tolerance between the blind hole crimping holes and the through hole crimping holes, the position tolerance between the patterns and the two types of crimping holes, and the position tolerance between the same type of crimping holes are all less than 2 mil, and the problem that blind and through holes are not considered together is solved.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and more specifically, to a tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns used in multiple lamination processes, and to a PCB board thereof. Background Technology

[0002] As PCB manufacturing technology advances towards higher density, higher precision, and ultra-micro integrated design requirements, the application of high-multilayer circuit boards is becoming increasingly widespread, especially in industries with extremely high demands for circuit integration and performance, such as 5G communication, artificial intelligence, and high-end computers. The design of high-multilayer circuit boards involves more and more multiple lamination processes, requiring increasingly higher precision, as detailed in the attached manual. Figure 1 As shown, taking a 32-layer PCB as an example, it is required that blind vias be drilled on L1-16 and through-holes be drilled on L1-32. Not only is the positional tolerance between any two blind vias or any two through-holes required to be less than 2mil, but the positional tolerance between blind vias and through-holes is also required to be less than 2mil. Furthermore, the positional tolerance between the pattern and the blind vias or through-holes is required to be less than 2mil. This is extremely difficult to control for multi-layer, multi-laminated boards.

[0003] In existing technologies, a unified benchmark is used for positioning through-hole crimping holes. Positioning holes drilled from through-holes are used for alignment in the fabrication of top and bottom layer patterns. Specifically, both through-hole crimping holes and patterns are aligned using a master target, which is the average value of targets from all layers. As the number of layers increases, the number of targets inevitably leads to significant differences. For through-hole crimping holes, the alignment method differs from that of blind hole crimping holes positioned according to a single layer, easily causing the positional tolerance between the blind hole crimping hole and the through-hole crimping hole to exceed 2 mil. For top and bottom layer patterns, not only is the positional tolerance between the blind hole crimping hole and the through-hole crimping hole greater than 2 mil, but there is also a risk of blind hole breakage. Due to the differences in expansion and contraction coefficients between layers and the poor alignment of multiple laminations, if the current alignment method fully considers the positional tolerances of the top layer graphic and via positions, then blind vias on the bottom layer will not be taken into account, resulting in hole breakage. If the blind vias on the bottom layer are taken into account, then the positional tolerances of the top layer graphic and via positions will exceed 2mil, resulting in poor PCB quality that cannot meet actual requirements and cannot be shipped.

[0004] Therefore, the existing tolerance alignment method has the defects of not taking into account blind through holes and having a positional tolerance greater than 2mil, which leads to the problem of hole breakage and positional tolerance exceeding 2mil in the finished board, reducing product quality and affecting product delivery. There is an urgent need for a tolerance alignment method that can solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing tolerance alignment methods, such as blind vias not being taken into account and positional tolerances exceeding 2 mil, which lead to hole breakage and positional tolerances exceeding 2 mil in the finished board. This invention provides a tolerance alignment method and PCB board for blind via crimping holes, through-hole crimping holes, and patterns during multiple lamination processes, thereby solving the technical problems of hole breakage and positional tolerances exceeding 2 mil in the PCB board.

[0006] This invention provides a tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple lamination processes. Specifically, it includes drilling through holes in the multiple lamination plate using different copper PAD sizes and different reference positioning methods. The through holes include at least blind hole crimping holes and through hole crimping holes. The positional tolerance between the blind hole crimping holes and the through hole crimping holes, the positional tolerance between the pattern and the blind hole crimping holes or the through hole crimping holes, and the positional tolerance between any two blind hole crimping holes or any two through hole crimping holes are all less than 2 mil.

[0007] It achieves high-precision alignment between blind and through-hole crimping holes, between patterns and the two types of crimping holes, and between crimping holes of the same type, ensuring that all positional tolerances are controlled within 2mil, avoiding product scrap due to excessive tolerances, improving the positional accuracy of each through hole and pattern during multiple crimping processes, increasing the product yield of high-precision boards, and improving product quality.

[0008] Furthermore, the vias also include laser-drilled vias, mechanically blind vias, and through-holes. The different copper PAD sizes and different reference positioning methods specifically include: S1. For the two BV COREs, which are divided into upper BV CORE and lower BV CORE, copper PADs are set at the four corners of their second layer graphics, and the copper PADs have two different sizes; S2. Drill the first set of pipe position holes according to the copper PAD, and drill laser holes and blind crimping holes on the upper BV CORE according to the first set of pipe position holes, and drill laser holes and mechanical blind holes on the lower BV CORE. S3. Press the two BV COREs together into a whole board. The second layer of the upper BV CORE is the second layer of the whole board, and the second layer of the lower BV CORE is the second to last layer of the whole board. S4. Drill the second set of pipe positioning holes and the third set of pipe positioning holes, the first set of dry film alignment holes and the second set of dry film alignment holes according to the copper PAD; S5. Drill through holes according to the second set of pipe positions, drill through holes and crimping holes according to the third set of pipe positions, make the first layer pattern of the whole board according to the second set of dry film alignment holes, and make the last layer pattern of the whole board according to the first set of dry film alignment holes.

[0009] The BV CORE is a sub-board that is processed separately before final lamination. The copper PADs (copper pads) are used for blind vias and laser-drilled vias during the BV CORE stage before final lamination. The copper PADs are used to position and isolate errors before lamination. After lamination, through-holes and patterns are processed in stages using multiple sets of tube-position holes and dry film alignment holes, achieving independent positioning between layers. This staged positioning avoids the error accumulation of traditional global positioning, making it particularly suitable for the fabrication of multilayer boards. From BV CORE preparation, final lamination, drilling of tube-position holes and dry film alignment holes, to the fabrication of the entire board's holes and patterns, a complete technical chain is formed. Without adding more processes or consuming more materials, only two new sets of pattern alignment targets, three sets of tube-position holes, and two sets of dry film alignment holes are used to balance production efficiency and reduce the difficulty of production operations while ensuring both blind vias and high-precision alignment.

[0010] Furthermore, the through holes, through hole crimping holes, and the pattern of the first layer of the entire board are positioned according to the copper PADs of the same layer.

[0011] Through holes, through-hole crimping holes and the first layer of the whole board use the same positioning reference, which can reduce the operation error and positioning deviation caused by reference switching, improve production efficiency and alignment accuracy, effectively avoid the problems of hole breakage and tolerance exceeding the standard, and further improve the processing accuracy and stability of the product.

[0012] Furthermore, the four corners of the second layer pattern of the upper BV CORE are provided with a first copper PAD and a second copper PAD, the size of the first copper PAD being smaller than the size of the second copper PAD. The four corners of the second layer pattern of the lower BV CORE are provided with a third copper PAD, the size of the third copper PAD being the same as the size of the first copper PAD.

[0013] The second layer of the upper BV CORE pattern uses two copper pads of different sizes, one large and one small. The larger one is the second copper pad, and the smaller one is the first copper pad. The third copper pad of the second layer of the lower BV CORE pattern is the same size as the smaller first copper pad. By differentiating the copper pad sizes, the positioning requirements of different hole positions and patterns are matched, while ensuring the consistency of the basic positioning reference between the upper and lower BV COREs. This also avoids the Pluritec machine misidentifying the copper pads during positioning, which could lead to incorrect references. This improves the drilling accuracy and positional precision, thereby ensuring the structural stability of the entire PCB board.

[0014] Furthermore, the first set of pipe holes of the upper BV CORE is drilled according to the first copper PAD, and the first set of pipe holes of the lower BV CORE is drilled according to the third copper PAD.

[0015] Since the first and third copper pads are the same size, they are consistent in positioning. The blind holes of the upper and lower BV COREs are positioned using their own small copper pads, ensuring the independence of the hole positions before total lamination. This avoids the misalignment of blind holes caused by warping or expansion / contraction differences after total lamination of the BV COREs, laying a solid foundation for high-precision alignment of the entire board after total lamination. It ensures that the alignment accuracy of subsequent holes and patterns can meet the tolerance requirements within 2mil, improving the stability of product processing.

[0016] Furthermore, the second set of pipe positioning holes is drilled based on the average of the position coordinates of the first copper PAD and the third copper PAD.

[0017] Since through holes only need to meet the requirements of conductivity and signal connectivity, the accuracy requirements are relatively low. After lamination, the through holes are positioned using the average coordinates of small-sized copper PADs on the upper and lower BV COREs to compensate for lamination deformation. This can balance the offset between upper and lower layers and avoid interlayer hole breakage caused by a single reference positioning. Considering the structural characteristics of through holes penetrating the entire board, an average positioning reference is adopted, which is different from the single reference positioning of through hole crimping holes. This achieves differentiated adaptation of reference positioning, ensures the connectivity accuracy of through holes, and improves the structural integrity and electrical performance of the product.

[0018] Furthermore, the third set of pipe positions is drilled according to the second copper PAD.

[0019] Since through-hole crimping holes require the insertion of metal pins and the crimping of connectors, high precision is required. A single second copper PAD is used as the positioning reference. This single-reference positioning ensures the positioning accuracy of the through-hole crimping holes, while maintaining consistency with the positioning references of blind hole crimping holes and patterns (all based on the second layer). This eliminates deviations caused by reference differences, ensuring that the positional tolerance is less than 2mil. It also simplifies the positioning process of through-hole crimping holes, reduces errors caused by reference switching, improves positioning accuracy, avoids the problem of chipping holes in through-hole crimping holes, and further guarantees high precision requirements and structural stability.

[0020] Furthermore, the first set of dry film alignment holes are drilled based on the average position coordinates of the first copper PAD and the third copper PAD.

[0021] Since the pattern on the last layer only needs to be aligned with the via, the alignment reference (average reference) of the pattern and via on the last layer of the board is kept consistent to ensure the alignment accuracy of the pattern and via, while taking into account the interlayer deviation of the upper and lower BV COREs, and avoiding circuit failures caused by pattern misalignment.

[0022] Furthermore, the second set of dry film alignment holes are drilled according to the second copper PAD.

[0023] To address the alignment requirements between the first layer pattern and the through-hole and blind-hole crimping holes, a second copper PAD is used as the drilling reference for the second set of dry film alignment holes. The core principle is to maintain consistency with the positioning reference (second copper PAD) of the through-hole crimping holes, thereby achieving indirect consistency with the reference (first copper PAD in the same layer) of the blind-hole crimping holes. This ensures accurate alignment between the pattern and the two types of crimping holes, and ensures that the positional tolerance between the pattern and each type of hole is less than 2 mil.

[0024] The present invention also provides a PCB board manufactured using the above-mentioned tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple lamination processes.

[0025] The PCB board manufactured using the above tolerance alignment method has the advantage of high-precision alignment. The tolerance between various vias and between patterns and vias is less than 2mil, eliminating problems such as chipped holes and misalignment, improving product qualification rate and reliability, meeting the needs of high-precision electronic equipment, and enhancing market competitiveness.

[0026] Through the above technical solution, the present invention can achieve at least the following technical effects: without adding more processes and consuming more materials, by only adding two sets of pattern alignment targets, three sets of tube positioning holes and two sets of dry film alignment holes, the positional tolerance between blind hole crimping holes and through hole crimping holes, the positional tolerance between the pattern and the blind hole crimping hole or through hole crimping hole, and the positional tolerance between any two blind hole crimping holes or any two through hole crimping holes are all less than 2mil. It also solves the problem of blind holes and through holes not being compatible, improves the manufacturing precision of PCB boards, increases product yield, improves product quality, and achieves significant technical improvement at a lower cost. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the L1 layer structure of the finished board.

[0028] Figure 2 A schematic diagram of the internal structure of the plate for drilling through holes.

[0029] Figure 3 A schematic diagram of the target design.

[0030] Figure 4 A comparison diagram of different positioning methods for drilling through holes and crimping holes.

[0031] Figure 5 To create a comparison chart of different positioning methods for graphics. Detailed Implementation

[0032] The accompanying drawings are for illustrative purposes only and should not be construed as limiting the invention. To better illustrate the following embodiments, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions; it is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0033] Example 1 This embodiment provides a tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing processes, such as... Figure 2 As shown, this embodiment is applicable to the fabrication of multilayer boards. The specific copper PAD placement, the number and position of vias and dry film alignment holes can be adjusted according to the actual number of layers. Taking 32 layers as an example, the specific process is as follows: S1. For the two BV COREs, divided into the upper BV CORE (L1-16) and the lower BV CORE (L17-32), during the stage of making a single BV CORE sub-unit, copper PADs are set at the four corners of the second layer pattern respectively. Specifically, in the second layer (L2) of the upper BV CORE and the second layer (L31) of the lower BV CORE, four copper PADs of the same size of 45mil are set at the four corners respectively. In the four corners of the second layer (L2) of the upper BV CORE, at positions different from the 45mil copper PADs, four copper PADs of size of 80mil are made.

[0034] S2. After each layer inside a single BV CORE is laminated, a Pluritec machine is used to grip a 45mil copper PAD for positioning and drilling the first set of pipe positions. The blind crimping holes of L1-16 and the laser holes of L1-2 are made according to the pipe positions drilled in L2 layer. The mechanical blind holes of L17-32 and the laser holes of L31-32 are made according to the pipe positions drilled in L31 layer. This ensures that the laser layer is used for alignment when BV CORE is installed. This not only ensures a consistent alignment method but also reduces the risk of blind hole breakage.

[0035] S3. Press the two BV COREs together into a single board.

[0036] S4. Use a Pluritec machine to grip a 45mil copper PAD for positioning, and drill the second set of pipe positioning holes and the first set of dry film alignment holes. Since the L2 and L31 layers are designed with 45mil copper PADs of the same size and position, the gripped 45mil copper PAD is drilled by combining the average position coordinates of the copper PADs of the L2 and L31 layers, which can take into account the expansion and contraction coefficients and offsets of the two layers.

[0037] Using a Pluritec machine to grip an 80mil copper PAD for positioning, drill the third set of tube positioning holes and the second set of dry film alignment holes, referencing only the expansion and contraction coefficient and offset of the L2 layer.

[0038] S5. Drill through holes according to the second set of pipe positions, drill through holes and crimping holes according to the third set of pipe positions, make the first layer pattern of the whole board according to the second set of dry film alignment holes, and make the last layer pattern of the whole board according to the first set of dry film alignment holes.

[0039] As mentioned above, the laser-cut holes of L1-2, the blind crimp holes of L1-16, the through-hole crimp holes of L1-32, and the pattern of L1 all use the L2 layer for alignment. This unified alignment not only accommodates both blind and through holes, but also meets the customer's requirement that the positional tolerance between various types of through holes, between similar through holes, and between various through holes and the pattern be less than 2mil. The pattern of the L32 layer is made with reference to the average value of L2 and L31, which also accommodates both blind and through holes in the L32 layer and avoids the risk of hole breakage.

[0040] The second layer of the BV CORE pattern uses two copper pads of different sizes, one large and one small, to avoid misidentification when the Pluritec machine picks up the copper pads for positioning, thus improving the drilling accuracy and positional precision, and ultimately ensuring the structural stability of the entire PCB board.

[0041] Blind holes and laser holes are processed in the BV CORE stage before total lamination. Copper PADs are used to position and isolate errors before lamination. After lamination, through-holes and patterns are processed step by step through multiple sets of tube position holes and dry film alignment holes to achieve independent positioning between layers. By positioning in stages, the error superposition of traditional global positioning is avoided, which is especially suitable for the production of ultra-multilayer boards.

[0042] Through holes, through hole crimping holes and the first layer of the whole board use the same positioning reference, which can reduce the operation error and positioning deviation caused by reference switching, improve production efficiency and alignment accuracy, and effectively avoid problems such as hole breakage and tolerance exceeding the standard.

[0043] The correspondence in this embodiment is as follows: For copper pads: 45mil and 80mil copper pads are fabricated on the L2 layer, and 45mil copper pads are fabricated on the L31 layer.

[0044] For the pipe position hole: First set of pipe positions: Use a 45mil copper PAD on layer L2 for positioning, and drill blind holes and crimp holes on layers L1-16 and laser holes on layers L1-2; Use a 45mil copper PAD on layer L31 for positioning, and drill mechanical blind holes on layers L17-32 and laser holes on layers L31-32. Second set of pipe positions: Use the average value of 45mil copper PADs in layers L2 and L31 as the positioning, and drill through holes in layers L1-32. The third set of pipe positioning holes: use the 80mil copper PAD of layer L2 for positioning, and drill through-hole crimping holes for layers L1-32.

[0045] For dry film alignment holes: The first set of dry film alignment holes: use the average value of the 45mil copper PADs of layers L2 and L31 for positioning, and create the pattern of layer L32; The second set of dry film alignment holes: use an 80mil copper PAD on layer L2 for positioning, and create the pattern for layer L1.

[0046] Since through holes only need to meet the requirements of conductivity and signal connectivity, the accuracy requirements are relatively low. After lamination, the through holes are positioned using the average value of the 45mil copper PAD coordinates of the upper and lower BV COREs to compensate for lamination deformation. This can balance the offset between the upper and lower layers and avoid interlayer hole breakage caused by a single reference positioning. Considering the structural characteristics of through holes penetrating the entire board, an average positioning reference is used, which is different from the single reference positioning of through hole crimping holes. This achieves differentiated adaptation of reference positioning and ensures the connectivity accuracy of through holes.

[0047] Since through-hole crimping holes require the insertion of metal pins and the crimping of connectors, high precision is required. A single 80mil copper PAD is used as the positioning reference. Single-reference positioning ensures the positioning accuracy of through-hole crimping holes, while maintaining consistency with the positioning reference of blind hole crimping holes and patterns (all based on the second layer). This eliminates deviations caused by reference differences, ensures that the positional tolerance is less than 2mil, simplifies the positioning process of through-hole crimping holes, reduces errors caused by reference switching, and improves positioning accuracy.

[0048] To address the alignment requirements of the first layer pattern with through-hole and blind-hole crimping holes, an 80mil copper PAD is used as the drilling reference for the second set of dry film alignment holes. The core is to maintain consistency with the positioning reference of the through-hole crimping holes (80mil copper PAD), thereby achieving indirect consistency with the blind-hole crimping hole reference (45mil copper PAD in the same L2 layer). This ensures accurate alignment of the pattern with the two types of crimping holes and ensures that the positional tolerance between the pattern and each type of hole is less than 2mil.

[0049] Since the pattern on the last layer only needs to be aligned with the through-hole, the alignment reference (average reference) of the pattern and through-hole on the last layer of the board is kept consistent to ensure the alignment accuracy of the pattern and through-hole, while taking into account the interlayer deviation of the upper and lower BV COREs.

[0050] Optionally, a target design schematic can be created before fabricating the copper PAD, such as... Figure 3As shown, the dimensions, quantity, and distribution of copper PADs in layers L2 and L31 are displayed, providing a visual basis for target fabrication, ensuring the accuracy of target position and size, avoiding fabrication deviations, and clarifying the alignment logic between targets and blind holes, through holes, and patterns. This provides accurate reference for subsequent drilling and pattern fabrication, ensuring smooth connection between each process, and providing clear guidance for positioning and drilling operations during production, avoiding construction errors.

[0051] In summary, the embodiments of the present invention have the following advantages over the prior art: like Figure 4 As shown, in existing manufacturing techniques, the positioning holes for through-hole crimping holes are drilled directly according to the overall target. The overall target is derived from the average value of targets across all layers L2-L31. Since there are 30 overall targets across layers L2-L31, the differences between the targets are inevitable. Using positioning holes made according to the average value for through-hole crimping holes, because they are not aligned using the same system as blind hole crimping holes, easily leads to a positional tolerance exceeding 2 mil between the blind hole crimping hole and the through hole crimping hole. According to the method of this invention, the blind hole crimping holes and through hole crimping holes are drilled using the same alignment method on the same layer, thus avoiding a positional tolerance exceeding 2 mil between the blind hole crimping hole and the through hole crimping hole.

[0052] like Figure 5 As shown, when fabricating the L1 and L32 layers using existing technology, the dry film alignment holes drilled from the overall target are used to simultaneously expose the patterns of both layers. Using this method, the L1 layer not only has a positional tolerance greater than 2 mil from the blind via crimp holes and through-hole crimp holes to the pattern, but also carries the risk of blind via breakage. The L32 layer also faces the same risk of blind via breakage. According to the present invention, the L1 layer pattern is exposed using the second set of dry film alignment holes drilled from the 80 mil copper PAD of the L2 layer, and the L32 layer pattern is exposed using the first set of dry film alignment holes drilled from the average of the 45 mil copper PADs of the L2 and L31 layers. This solves the problem of the positional tolerance greater than 2 mil from the blind via crimp holes and through-hole crimp holes to the pattern in the L1 layer, as well as the risk of blind via breakage in both layers.

[0053] Without adding more processes or consuming more materials, the positional tolerance between blind and through-hole crimping holes, between the pattern and the two types of crimping holes, and between crimping holes of the same type is less than 2mil, thus solving the problem of blind and through holes not being compatible.

[0054] Example 2 This embodiment provides a PCB board manufactured using the above-mentioned tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple lamination processes.

[0055] The PCB board manufactured using the above tolerance alignment method has the advantage of high-precision alignment. The tolerance between various vias and between patterns and vias is less than 2mil, eliminating problems such as chipped holes and misalignment, improving product qualification rate and reliability, meeting the needs of high-precision electronic equipment, and enhancing market competitiveness.

[0056] The above embodiments are merely preferred embodiments of the present invention and do not constitute a limitation on the scope of protection of the present invention. Those skilled in the art should understand that various modifications, combinations, or substitutions can be made to the above embodiments without departing from the concept of the present invention, and all resulting technical solutions fall within the scope of protection claimed by the present invention.

Claims

1. A tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing processes, characterized in that, Through holes in multi-layer laminated plates are drilled using different copper PAD sizes and different reference positioning methods. The through holes include at least blind crimp holes and through crimp holes. The positional tolerance between the blind crimp holes and the through crimp holes, the positional tolerance between the drawing and the blind crimp holes or the through crimp holes, and the positional tolerance between any two blind crimp holes or any two through crimp holes are all less than 2 mil.

2. The tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing operations, as described in claim 1, is characterized in that... The vias also include laser-cut vias, mechanical blind vias, and through-holes. The different copper PAD sizes and different reference positioning methods specifically include: S1. For the two BV COREs, which are divided into upper BV CORE and lower BV CORE, copper PADs are set at the four corners of their second layer graphics, and the copper PADs have two different sizes; S2. Drill the first set of pipe positions according to the copper PAD, and drill laser holes and blind crimping holes on the upper BV CORE according to the first set of pipe positions, and drill laser holes and mechanical blind holes on the lower BV CORE. S3. Press the two BV COREs together into a whole board. The second layer of the upper BV CORE is the second layer of the whole board, and the second layer of the lower BV CORE is the second to last layer of the whole board. S4. Drill the second set of pipe positioning holes and the third set of pipe positioning holes, the first set of dry film alignment holes and the second set of dry film alignment holes according to the copper PAD; S5. Drill through holes according to the second set of pipe positions, drill through holes and crimping holes according to the third set of pipe positions, make the first layer pattern of the whole board according to the second set of dry film alignment holes, and make the last layer pattern of the whole board according to the first set of dry film alignment holes.

3. The tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing operations, as described in claim 2, is characterized in that... The through holes, through hole crimping holes, and the pattern of the first layer of the entire board are positioned according to the copper PADs of the same layer.

4. The tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing operations, as described in claim 2, is characterized in that... The upper BV CORE's second layer pattern has a first copper PAD and a second copper PAD at its four corners, with the first copper PAD being smaller than the second copper PAD. The lower BV CORE's second layer pattern has a third copper PAD at its four corners, with the third copper PAD being the same size as the first copper PAD.

5. The tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing operations, as described in claim 4, is characterized in that... The first set of pipe holes of the upper BV CORE is drilled according to the first copper PAD, and the first set of pipe holes of the lower BV CORE is drilled according to the third copper PAD.

6. The tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing operations, as described in claim 4, is characterized in that... The second set of pipe holes is drilled based on the average of the position coordinates of the first copper PAD and the third copper PAD.

7. The tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing operations, as described in claim 4, is characterized in that... The third set of pipe positions is drilled according to the second copper PAD.

8. The tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing operations, as described in claim 4, is characterized in that... The first set of dry film alignment holes is drilled based on the average position coordinates of the first copper PAD and the third copper PAD.

9. The tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns during multiple pressing operations, as described in claim 4, is characterized in that... The second set of dry film alignment holes are drilled according to the second copper PAD.

10. A PCB board, characterized in that, It is manufactured using the tolerance alignment method for blind hole crimping holes, through hole crimping holes, and patterns used in multiple pressing processes as described in any one of claims 1-9.

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