An assembly apparatus for processing a circuit board

Abstract

The application discloses a kind of equipment for assembling circuit board processing, comprising: base, multiple support mechanism, assembly gun and paragraph control mechanism, the rear side of the top of base is equipped with display, and the right side of display is provided with suction air pump;Multiple support mechanism is arranged on the top of base, and multiple support mechanism is used to support circuit board;The assembly gun is slidably arranged on the base, and the outer side of assembly gun is provided with limiting mechanism for controlling force to prevent damage to electronic components.The equipment for assembling circuit board processing can multiple limit and support circuit board, make the position of circuit board accurate, avoid deviation in the assembly process, and limit the assembly gun during assembly process, can play a protective role to the assembled electronic components, and can be prompted in paragraph during rotation, avoid manual adjustment to cause rotation angle not accurate enough, can be quickly positioned, ensure the accurate landing point of electronic components.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, specifically to an assembly device for circuit board processing. Background Technology

[0002] Circuit boards are the core components of electronic devices. They are usually composed of a substrate, conductive layer, silkscreen layer and solder mask layer. During processing, steps such as pattern transfer, etching, drilling, electroplating and soldering are performed. Soldering assembly includes surface mount or through-hole mounting. There are various types of assembly equipment for circuit board processing on the market. Assembly methods are divided into automatic and manual. Manual assembly equipment is usually low in cost and simple to operate, and is suitable for prototype development, small batch production and electronic manufacturing.

[0003] As disclosed in patent application CN115529743A, this invention discloses a circuit board assembly method for fixing pinned plug-in components to a substrate by soldering. The method includes the following sequential steps: applying solder to the pins of the components; inserting the solder-coated pins into solder holes in the substrate; and heating the solder on the pins to fix the components to the substrate. This circuit board assembly method effectively solves the problem of poor solder penetration by pre-applying solder to the pins of the plug-in components before assembly and simplifies the soldering process for assembling circuit boards. This disclosure also relates to a circuit board assembly system that can be used to perform the above-described circuit board assembly method.

[0004] However, current circuit board processing assembly equipment is inconvenient for multiple limit and support circuit boards in actual use. The circuit boards are not accurately positioned during processing and are prone to displacement during assembly. Furthermore, it is inconvenient to control the height and speed when the assembly gun falls, which can easily cause impact to the assembled electronic components and circuit boards, or cause incomplete assembly due to insufficient force. Manual adjustment can lead to inaccurate rotation angle and inaccurate landing point of electronic components.

[0005] Therefore, we propose an assembly device for circuit board processing to solve the problems mentioned above. Summary of the Invention

[0006] The purpose of this invention is to provide an assembly device for circuit board processing, in order to solve the problems mentioned in the background art, such as the inconvenience of multiple limiting and supporting circuit boards, the inaccurate positioning of circuit boards during processing, the easy deviation during assembly, the inconvenience of controlling the height and speed when the assembly gun falls, the easy impact on the assembled electronic components and circuit boards, or the incomplete assembly due to insufficient force, and the inaccurate landing point of electronic components due to insufficient rotation angle when manually adjusted.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an assembly device for circuit board processing, comprising:

[0008] A base, on the upper rear side of which a display is mounted, and a suction pump is provided on the right side of the display;

[0009] Also includes:

[0010] A multiple support mechanism is provided above the base and is used to support the circuit board.

[0011] The multiple support mechanism includes a first adjusting rod, a first adjusting block, a second adjusting rod, a second adjusting block, and a first limiting block. The first adjusting rod is threadedly connected to the first adjusting block on its outer side, and the second adjusting rod is installed above the first adjusting block. The first adjusting block is slotted into the base. The second adjusting rod is threadedly connected to the second adjusting block on its outer side, and the second adjusting block is tightly fitted to the base. The first limiting block is integrally provided above the second adjusting block.

[0012] An assembly gun is slidably mounted on a base, and a limiting mechanism for controlling the force to prevent damage to electronic components is provided on the outside of the assembly gun. An adsorption module sensor is installed at the lower end of the assembly gun.

[0013] The limiting mechanism includes a rubber ring, a first damping block, a second damping block, and a buffer spring. The rubber ring is connected to the lower outer side of the assembly gun, and the first damping block is fixed to the upper outer side of the assembly gun. The buffer spring is wound around the outer side of the assembly gun. The second damping block is connected to the outer side of the first damping block, and the second damping block is fixed inside the second support frame.

[0014] A segmented control mechanism is disposed within the second damping block;

[0015] The segmented control mechanism includes a first damping block, a magnetic block, and a second limiting block. A magnetic block is fixed inside the lower part of the first damping block. The magnetic blocks are evenly distributed inside the first damping block, and the second limiting block is connected to the internal slot of the magnetic block. A second damping block is fixed below the second limiting block.

[0016] Preferably, a material tray is fixed on the upper left side of the base, and the material trays are arranged in an array. A light-transmitting plate is provided below the material trays. The light-transmitting plate is fixed inside the base, and a light is provided below the light-transmitting plate. Fixing frames are symmetrically installed on the upper front and back of the base.

[0017] Preferably, the first adjusting rod is symmetrically arranged front and back, and the first adjusting block is symmetrically arranged left and right on the first adjusting rod, and the thread directions of the left and right ends of the first adjusting rod are opposite. The second adjusting rod is symmetrically arranged left and right, and the second adjusting block is symmetrically arranged front and back on the second adjusting rod, and the thread directions of the front and back ends of the second adjusting rod are opposite.

[0018] Preferably, the multiple support mechanism further includes a support block, a vacuum suction cup, and a hydraulic rod. The support block is fixed to the upper center of the base. The hydraulic rod is installed inside the base and arranged in an array. The output end of the hydraulic rod is equipped with a vacuum suction cup, and the vacuum suction cup is connected to the base through a slot.

[0019] Preferably, the outer slot of the fixing frame is connected to a first support frame, and the lower middle slot of the first support frame is connected to a connecting block. A second support frame is integrally provided below the connecting block, and an installation cylinder is fixed to the lower right side of the second support frame. An installation block is threadedly connected to the installation cylinder, and a lighting lamp is integrally provided below the installation block.

[0020] Preferably, a camera is fixed to the lower left end of the second support frame, and infrared emitters are symmetrically installed at the front and rear of the lower part of the second support frame, and an assembly gun is connected to the internal slot at the left end of the second support frame.

[0021] Preferably, the upper end of the assembled gun is equipped with an adjustment handle, and a control switch is installed on the left side of the adjustment handle. An air guide tube is installed above the adjustment handle, and a suction pump is installed at the rear end of the air guide tube.

[0022] Compared with the prior art, the beneficial effects of the present invention are: the assembly equipment for circuit board processing can limit and support the circuit board in multiple ways, so that the position of the circuit board is accurate and avoids displacement during the assembly process. It can also limit the assembly gun during the assembly process, which can protect the assembled electronic components. Furthermore, it can provide segmented prompts during rotation, avoiding manual adjustment that may result in inaccurate rotation angles. It can quickly position and ensure the accurate landing point of the electronic components.

[0023] 1. The device is equipped with a first limiting block, a support block, and a vacuum suction cup. A first adjusting rod and a second adjusting rod are located below the first limiting block to quickly adjust the position of the first limiting block. The first limiting block is connected to the circuit board slot. A hydraulic rod is installed inside the base, which pushes the vacuum suction cup to rise and fall. The vacuum suction cup adsorbs the circuit board. A support block is fixed in the middle of the upper part of the base to support the circuit board. This device can limit and support the circuit board in multiple ways, so that the circuit board is accurately positioned and avoids displacement during assembly.

[0024] 2. It is equipped with a second damping block, a first damping block and a buffer spring. The first damping block is fixed to the outside of the assembly gun. The first damping block falls into the slot of the second damping block and connects. The buffer spring is wound around the outside of the assembly gun to slow down the descent speed of the assembly gun. It limits the assembly gun during the assembly process and can protect the assembled electronic components.

[0025] 3. It is equipped with a magnetic block, a second damping block, and a second limiting block. The magnetic block is fixed at an equal angle below the first damping block. The magnetic block and the second limiting block are connected by a slot inside the second damping block. When the assembly gun is rotated, the second limiting block and the different magnetic blocks are magnetically connected. It can provide segmented prompts during rotation, avoid manual adjustment that may lead to inaccurate rotation angle, and quickly position the electronic components to ensure accurate placement. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the invention from the left side;

[0027] Figure 2 This is a schematic diagram of the overall front structure of the invention from the right side.

[0028] Figure 3 This is a schematic diagram of the overall structure connecting the base and the first adjusting rod of the present invention;

[0029] Figure 4 This is a schematic diagram of the overall structure connecting the second adjusting rod and the second adjusting block of the present invention;

[0030] Figure 5 This is a schematic diagram of the overall structure connecting the vacuum suction cup and the hydraulic rod of the present invention;

[0031] Figure 6 This is a schematic diagram of the overall structure connecting the fixing frame and the first support frame of the present invention;

[0032] Figure 7 This is a schematic diagram of the overall structure connecting the connecting block and the first support frame of the present invention;

[0033] Figure 8 This is a schematic diagram of the overall structure of the assembled gun and rubber ring connection of the present invention;

[0034] Figure 9 This is a schematic diagram of the overall structure connecting the adjustment handle and the assembly gun of the present invention;

[0035] Figure 10 This is a schematic diagram of the overall structure connecting the first damping block and the magnetic block of the present invention;

[0036] Figure 11 This is a schematic diagram of the overall structure connecting the second damping block and the second limiting block of the present invention;

[0037] Figure 12This is a schematic diagram of the working process of the suction air pump of the present invention.

[0038] In the diagram: 1. Base; 2. Display; 3. Material tray; 4. Light-transmitting plate; 5. Fixing frame; 6. First support frame; 7. First adjusting rod; 8. First adjusting block; 9. Second adjusting rod; 10. Second adjusting block; 11. First limiting block; 12. Support block; 13. Vacuum suction cup; 14. Hydraulic rod; 15. Connecting block; 16. Second support frame; 17. Mounting cylinder; 18. Mounting block; 19. Lighting lamp; 20. Infrared transmitter; 21. Camera; 22. Assembly gun; 23. Adjusting handle; 24. Air guide tube; 25. Suction air pump; 26. Control switch; 27. Adsorption module sensor; 28. Rubber ring; 29. ​​First damping block; 30. Magnetic block; 31. Second damping block; 32. Second limiting block; 33. Buffer spring. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Please see Figure 1-12 The present invention provides a technical solution: an assembly device for circuit board processing, comprising:

[0041] A base 1 is provided, and a monitor 2 is mounted on the upper rear side of the base 1. A suction air pump 25 is provided on the right side of the monitor 2.

[0042] Also includes:

[0043] Multiple support mechanisms are provided above the base 1 and are used to support the circuit board.

[0044] Assembly gun 22 is slidably mounted on base 1, and a limiting mechanism for controlling the force to prevent damage to electronic components is provided on the outside of assembly gun 22. Adsorption module sensor 27 is installed at the lower end of assembly gun 22.

[0045] A segmented control mechanism is located inside the second damping block 31.

[0046] By adopting the above technical solution, the circuit board can be effectively supported and limited by the multiple support mechanisms set above the base 1. The assembly gun 22 is provided with a limiting mechanism on the outside to control the force and prevent damage to the electronic components, which can conveniently limit the movement of the assembly gun 22. The segmented control mechanism is set inside the assembly gun 22 to indicate the rotation angle.

[0047] As attached Figure 3 As shown, a material tray 3 is fixed on the upper left side of the base 1, and the material trays 3 are arranged in an array. A light-transmitting plate 4 is arranged below the material trays 3. The light-transmitting plate 4 is fixed inside the base 1, and a light is arranged below the light-transmitting plate 4. A fixing frame 5 is symmetrically installed on the upper front and back of the base 1.

[0048] Using the above technical solution, a material tray 3 is fixed on the upper left side of the base 1, and a light-transmitting plate 4 is set below the material tray 3 to facilitate material retrieval.

[0049] As attached Figure 3 and attached Figure 4 As shown, the multi-support mechanism includes a first adjusting rod 7, a first adjusting block 8, a second adjusting rod 9, a second adjusting block 10, and a first limiting block 11. The first adjusting rod 7 is threadedly connected to the first adjusting block 8, and the second adjusting rod 9 is installed above the first adjusting block 8. The first adjusting block 8 is slotted into the base 1. The second adjusting rod 9 is threadedly connected to the second adjusting block 10, and the second adjusting block 10 and the base 1 are tightly fitted together. The first limiting block 11 is integrally provided above the second adjusting block 10.

[0050] Using the above technical solution, a first adjusting block 8 is connected to the outer side of the first adjusting rod 7 by a thread, and a second adjusting block 10 is connected to the outer side of the second adjusting rod 9 by a thread. A first limiting block 11 is integrally provided above the second adjusting block 10 to facilitate adjustment of the position of the first limiting block 11.

[0051] As attached Figure 3 and attached Figure 4 As shown, the first adjusting rod 7 is symmetrically arranged front and back, and the first adjusting block 8 is symmetrically arranged left and right on the first adjusting rod 7, and the thread directions of the left and right ends of the first adjusting rod 7 are opposite. The second adjusting rod 9 is symmetrically arranged left and right, and the second adjusting block 10 is symmetrically arranged front and back on the second adjusting rod 9, and the thread directions of the front and back ends of the second adjusting rod 9 are opposite.

[0052] Using the above technical solution, the first adjusting block 8 is symmetrically arranged on the first adjusting rod 7, and the thread directions of the left and right ends of the first adjusting rod 7 are opposite. The second adjusting block 10 is symmetrically arranged on the second adjusting rod 9, and the thread directions of the front and rear ends of the second adjusting rod 9 are opposite, which facilitates quick adjustment of the spacing of the first limiting block 11.

[0053] As attached Figure 3 and attached Figure 5As shown, the multi-support mechanism also includes a support block 12, a vacuum suction cup 13, and a hydraulic rod 14. The support block 12 is fixed to the upper center of the base 1. The hydraulic rod 14 is installed inside the base 1 and is arranged in an array. The output end of the hydraulic rod 14 is equipped with a vacuum suction cup 13, and the vacuum suction cup 13 is connected to the base 1 by a slot.

[0054] Using the above technical solution, a multi-support mechanism is formed by combining the support block 12, the vacuum suction cup 13 and the hydraulic rod 14. The output end of the hydraulic rod 14 is equipped with the vacuum suction cup 13, which facilitates the adsorption and fixation of the circuit board and ensures stability.

[0055] As attached Figure 6 and attached Figure 7 As shown, the outer slot of the fixing frame 5 is connected to the first support frame 6, and the slot below the middle of the first support frame 6 is connected to the connecting block 15. The lower part of the connecting block 15 is integrally provided with the second support frame 16, and the lower right side of the second support frame 16 is fixed with the mounting cylinder 17. The mounting cylinder 17 is internally threaded with the mounting block 18, and the lower part of the mounting block 18 is integrally provided with the lighting lamp 19.

[0056] Using the above technical solution, a connecting block 15 is connected to the slot at the lower center of the first support frame 6, and an mounting block 18 is connected to the internal thread of the mounting cylinder 17. An integrated lighting lamp 19 is provided below the mounting block 18 to illuminate the circuit board, facilitating installation and disassembly.

[0057] As attached Figure 7 As shown, a camera 21 is fixed to the lower left end of the second support frame 16, and infrared emitters 20 are symmetrically installed at the lower front and rear of the second support frame 16. An assembly gun 22 is connected to the internal slot at the left end of the second support frame 16.

[0058] Using the above technical solution, a camera 21 is fixed at the lower left end of the second support frame 16, and infrared transmitters 20 are symmetrically installed at the lower front and rear of the second support frame 16, which can ensure the accurate landing point of the assembled gun 22.

[0059] As attached Figure 1 As shown, an adjustment handle 23 is installed at the upper end of the assembled gun 22, and a control switch 26 is installed on the left side of the adjustment handle 23. An air guide tube 24 is installed above the adjustment handle 23, and a suction air pump 25 is installed at the rear end of the air guide tube 24.

[0060] Using the above technical solution, a control switch 26 is installed on the left side of the adjustment handle 23, an air guide tube 24 is installed above the adjustment handle 23, and a suction pump 25 is installed at the rear end of the air guide tube 24, which facilitates the control of the adsorption and release electronic components.

[0061] As attached Figure 8 and attached Figure 9 As shown, the limiting mechanism includes a rubber ring 28, a first damping block 29, a second damping block 31, and a buffer spring 33. The rubber ring 28 is connected to the lower outer side of the assembly gun 22, and the first damping block 29 is fixed to the upper outer side of the assembly gun 22. The buffer spring 33 is wound around the outer side of the assembly gun 22. The second damping block 31 is connected to the outer side of the first damping block 29, and the second damping block 31 is fixed inside the second support frame 16.

[0062] By adopting the above technical solution, a limiting mechanism is formed by combining a rubber ring 28, a first damping block 29, a second damping block 31 and a buffer spring 33. The outer side of the assembly gun 22 is wrapped with a buffer spring 33, and the outer side of the first damping block 29 is connected to the second damping block 31 through a slot. This can effectively prevent damage to electronic components caused by improper control of the landing point of the assembly gun 22.

[0063] As shown in the attached figure, the segmented control mechanism includes a first damping block 29, a magnetic block 30, and a second limiting block 32. The magnetic block 30 is fixedly located inside the lower part of the first damping block 29. The magnetic blocks 30 are evenly distributed within the first damping block 29, and the second limiting block 32 is connected to the internal slot of the magnetic block 30. The second damping block 31 is fixedly located below the second limiting block 32.

[0064] Using the above technical solution, the segmented control mechanism includes a first damping block 29, a magnetic block 30, and a second limiting block 32. The magnetic blocks 30 are evenly distributed within the first damping block 29, and the second limiting block 32 is connected to the internal slot of the magnetic blocks 30, which facilitates the control of the rotation angle of the assembly gun 22.

[0065] First, as attached Figure 1 Appendix Figure 3 and attached Figure 4As shown, a multi-support mechanism is set above the base 1. The circuit board is placed on the multi-support mechanism, which fixes the circuit board. A material tray 3 is fixed on the upper left side of the base 1. The material trays 3 are arranged in an array. Electronic components to be assembled are placed on the material trays 3. A light-transmitting plate 4 is set below the material trays 3. The light-transmitting plate 4 is fixed inside the base 1. A light is set below the light-transmitting plate 4. The light illuminates the light-transmitting plate 4, allowing the components to be seen for easy identification. Fixing frames 5 are symmetrically installed on the upper front and back of the base 1. The outer slot of the fixing frame 5 is connected to the first support frame 6. Pushing the first support frame 6 makes the first support frame 6... The assembly gun 22 is mounted on the left side of the first support frame 6 and slides on the fixed frame 5. The left and right positions of the assembly gun 22 are adjusted, and the assembly gun 22 slides on the left side of the first support frame 6 through the buffer spring 33. The height of the assembly gun 22 is adjusted. An adjustment handle 23 is mounted on the upper end of the assembly gun 22. A control switch 26 is mounted on the left side of the adjustment handle 23. When the control switch 26 is turned on, an air guide tube 24 is mounted above the adjustment handle 23. A suction air pump 25 is mounted at the rear end of the air guide tube 24. The suction air pump 25 is controlled by the control switch 26 to make the assembly gun 22 suck or release air to adsorb electronic components for easy assembly.

[0066] As attached Figure 3 and attached Figure 4 As shown, the multi-support mechanism includes a first adjusting rod 7, a first adjusting block 8, a second adjusting rod 9, a second adjusting block 10, and a first limiting block 11. The first adjusting rod 7 is threadedly connected to the first adjusting block 8. Rotating the first adjusting rod 7 moves the first adjusting block 8. The second adjusting rod 9 is mounted above the first adjusting block 8, and the second adjusting rod 9 is threadedly connected to the second adjusting block 10. Rotating the second adjusting rod 9 moves the second adjusting block 10. The first limiting block 11 is integrally set above the second adjusting block 10. Adjusting the position of the second adjusting block 10 allows for the adjustment of the position of the second adjusting block 10. The first adjusting rod 7 is symmetrically arranged front and rear. The first adjusting block 8... The first adjusting rod 7 is symmetrically arranged on the left and right. Since the thread directions at the left and right ends of the first adjusting rod 7 are opposite, when the first adjusting rod 7 is rotated, the two first adjusting blocks 8 on the left and right move simultaneously. The second adjusting rod 9 is symmetrically arranged on the left and right. The second adjusting blocks 10 are symmetrically arranged on the front and back of the second adjusting rod 9. Since the thread directions at the front and back ends of the second adjusting rod 9 are opposite, when the second adjusting rod 9 is rotated, the two second adjusting blocks 10 on the front and back move simultaneously. The spacing of the first limiting block 11 above the second adjusting block 10 is adjusted to accommodate different types of circuit boards. The circuit board is placed in the first limiting block 11. The first limiting block 11, which has a "U" shaped longitudinal section, clamps and limits the circuit board.

[0067] As attached Figure 3 and attached Figure 5As shown, the multi-support mechanism also includes a support block 12, a vacuum suction cup 13, and a hydraulic rod 14. The support block 12 is fixed to the upper center of the base 1. The circuit board is placed on the support block 12, and the support block 12 supports the circuit board. The base 1 is equipped with a hydraulic rod 14, which is arranged in an array. When the hydraulic rod 14 is opened, the output end of the hydraulic rod 14 is equipped with a vacuum suction cup 13. The hydraulic rod 14 pushes the vacuum suction cup 13 to move, so that the vacuum suction cup 13 and the circuit board are tightly attached. The vacuum suction cup 13 is connected to an air pump to adsorb the circuit board and ensure the stability of the circuit board. The hydraulic rod 14 drives the vacuum suction cup 13 to descend, so that the vacuum suction cup 13 and the base 1 are connected in a slot, which can prevent the movement of the first adjusting rod 7 and the second adjusting rod 9 from being affected.

[0068] As attached Figure 6 and attached Figure 7 As shown, the outer slot of the fixing frame 5 is connected to the first support frame 6. Sliding the first support frame 6 on the fixing frame 5 adjusts the position of the assembly gun 22. A connecting block 15 is connected to the slot below the middle of the first support frame 6. Pulling the assembly gun 22 adjusts its front-to-back position, causing the connecting block 15 to slide within the first support frame 6. The connecting block 15, with its "T"-shaped longitudinal section, limits the movement of the second support frame 16. The second support frame 16 is integrally formed below the connecting block 15. A mounting cylinder 17 is fixed to the lower right side of the second support frame 16. The lighting lamp 19 is installed below the mounting cylinder 17, allowing the lighting lamp 19 to... The integrated mounting block 18 and mounting cylinder 17 are threaded together to fix the lighting lamp 19 below the second support frame 16. A camera 21 is fixed at the lower left end of the second support frame 16 to monitor the circuit board and assembly status. Infrared emitters 20 are symmetrically installed at the lower front and back of the second support frame 16. The infrared emitters 20 emit infrared rays. Because the infrared emitters 20 are tilted and symmetrical, the light rays emitted by the two infrared emitters 20 intersect and fall on the circuit board. This intersection point is on the same axis as the landing point of the assembly gun 22, indicating the landing point position of the assembly gun 22 and facilitating the control of the position of the assembly gun 22.

[0069] As attached Figure 6 Appendix Figure 7 Appendix Figure 8 and attached Figure 9As shown, the assembly gun 22 is connected to the internal slot at the left end of the second support frame 16. The assembly gun 22 is then pushed downwards to pick up materials. A limiting mechanism is provided on the outer side of the assembly gun 22 to control the force and prevent damage to electronic components. This limiting mechanism includes a rubber ring 28, a first damping block 29, a second damping block 31, and a buffer spring 33. The buffer spring 33 is wound around the outer side of the assembly gun 22. When the assembly gun 22 is pushed downwards, the buffer spring 33 cushions the assembly gun. The first damping block 29 is fixed on the upper outer side of the assembly gun 22 to withstand the impact force. The second damping block 31 is connected to the internal slot of the second support frame 16. When the assembly gun 22 is pushed to a suitable height, the first damping block 29 and the second damping block 31 are connected to the slot to increase resistance and prevent the assembly gun 22 from falling too fast. After the material is taken out, the force is released, and the elastic action of the buffer spring 33 pushes the assembly gun 22 to reset. The rubber ring 28 is connected to the slot on the lower outer side of the assembly gun 22 to prevent the assembly gun 22 from rebounding too much.

[0070] As attached Figure 9 Appendix Figure 10 and attached Figure 11 As shown, when it is necessary to rotate the assembly gun 22 to adjust the angle of the electronic components, the rotation angle is controlled by a segmented control mechanism. The segmented control mechanism is located inside the second damping block 31. The second limiting block 32 is fixed inside the second damping block 31. The second limiting block 32 is symmetrically arranged on the left and right. When the first damping block 29 enters the second damping block 31, the height is indicated. The assembly gun 22 is pushed down to make the first damping block 29 and the second limiting block 32 connect in the slot. The magnetic suction block 30 is fixed at the same angle inside the first damping block 29. The magnetic suction block 30 and the second limiting block 32 are connected in the slot and magnetically attracted to each other, indicating the angle. When the assembly gun 22 is rotated, there will be a certain resistance. The assembly gun 22 drives the first damping block 29 to rotate. The different magnetic suction blocks 30 and the second limiting block 32 are magnetically connected, indicating the rotation angle.

[0071] As attached Figure 1 Appendix Figure 8 and 12 As shown, an adsorption module sensor 27 is installed at the lower end of the assembly gun 22 to identify the material adsorption state. Pressing the control switch 26 will cause the suction pump 25 to draw air when there is no material at the bottom of the assembly gun 22 and to release air when the bottom of the assembly gun 22 adsorbs material, thus facilitating the control of the material state.

[0072] This is the entire working process of the assembly equipment for circuit board processing. Any content not described in detail in this specification belongs to the prior art known to those skilled in the art.

[0073] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0074] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An assembly device for circuit board processing, comprising: A base (1) is provided with a display (2) mounted on the upper rear side of the base (1), and a suction pump (25) is provided on the right side of the display (2). Its characteristic is that it further includes: A multi-support mechanism is provided above the base (1) and is used to support the circuit board. A fixing frame (5) is symmetrically installed on the upper part of the base (1). A first support frame (6) is connected to the outer side of the fixing frame (5). A connecting block (15) is connected to the lower middle part of the first support frame (6). A second support frame (16) is integrally provided below the connecting block (15). An assembly gun (22) is connected to the inner left end of the second support frame (16). The multi-support mechanism includes a first adjusting rod (7), a first adjusting block (8), a second adjusting rod (9), a second adjusting block (10), and a first limiting block (11). The first adjusting rod (7) is threadedly connected to the first adjusting block (8), and the second adjusting rod (9) is installed above the first adjusting block (8). The first adjusting block (8) is slotted in the base (1). The second adjusting rod (9) is threadedly connected to the second adjusting block (10), and the second adjusting block (10) and the base (1) are tightly fitted. The first limiting block (11) is integrally provided above the second adjusting block (10). The first adjusting rod (7) is symmetrically arranged front and back, and the first adjusting block (8) is symmetrically arranged left and right on the first adjusting rod (7), and the thread directions of the left and right ends of the first adjusting rod (7) are opposite. The second adjusting rod (9) is symmetrically arranged left and right, and the second adjusting block (10) is symmetrically arranged front and back on the second adjusting rod (9), and the thread directions of the front and back ends of the second adjusting rod (9) are opposite. Assembly gun (22), which is slidably mounted on base (1), and a limiting mechanism for controlling the force to prevent damage to electronic components is provided on the outside of the assembly gun (22), and an adsorption module sensor (27) is installed at the lower end of the assembly gun (22). The limiting mechanism includes a rubber ring (28), a first damping block (29), a second damping block (31), and a buffer spring (33). The rubber ring (28) is connected to the lower outer side of the assembly gun (22), and the first damping block (29) is fixed to the upper outer side of the assembly gun (22). The buffer spring (33) is wound around the outer side of the assembly gun (22). The second damping block (31) is connected to the outer side of the first damping block (29), and the second damping block (31) is fixed inside the second support frame (16). A segmented control mechanism is disposed on the outside of the assembled gun (22); The segmented control mechanism includes a magnetic block (30) and a second limiting block (32). The magnetic block (30) is fixed inside the lower part of the first damping block (29). The magnetic blocks (30) are evenly distributed inside the first damping block (29), and the second limiting block (32) is connected to the slot inside the magnetic block (30). The second damping block (31) is fixed below the second limiting block (32).

2. The assembly equipment for circuit board processing according to claim 1, characterized in that: A material tray (3) is fixed on the upper left side of the base (1), and the material trays (3) are arranged in an array. A light-transmitting plate (4) is arranged below the material trays (3). The light-transmitting plate (4) is fixed inside the base (1), and a light is arranged below the light-transmitting plate (4).

3. The assembly equipment for circuit board processing according to claim 1, characterized in that: The multiple support mechanism also includes a support block (12), a vacuum suction cup (13) and a hydraulic rod (14). The support block (12) is fixed in the upper middle part of the base (1). The hydraulic rod (14) is installed inside the base (1) and the hydraulic rod (14) is arranged in an array. The output end of the hydraulic rod (14) is equipped with a vacuum suction cup (13) and the vacuum suction cup (13) is connected to the base (1) by a slot.

4. The assembly equipment for circuit board processing according to claim 1, characterized in that: Furthermore, a mounting cylinder (17) is fixed on the lower right side of the second support frame (16), and a mounting block (18) is connected to the internal thread of the mounting cylinder (17), and a lighting lamp (19) is integrally provided on the lower part of the mounting block (18).

5. The assembly equipment for circuit board processing according to claim 1, characterized in that: A camera (21) is fixed at the lower left end of the second support frame (16), and infrared emitters (20) are symmetrically installed at the lower front and rear of the second support frame (16).

6. The assembly equipment for circuit board processing according to claim 1, characterized in that: An adjustment handle (23) is installed at the upper end of the assembled gun (22), and a control switch (26) is installed on the left side of the adjustment handle (23). An air duct (24) is installed above the adjustment handle (23), and a suction pump (25) is installed at the rear end of the air duct (24).

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