A soldering tank assembly for a wave solder machine

Abstract

This invention provides a solder bath assembly for a wave soldering machine, belonging to the technical field of wave soldering equipment. It includes a melting cylinder, a guide channel, and a power unit. The melting cylinder has an exhaust hood and a draft hood installed on its top two sides. The exhaust hood is connected to an external gas supply device to output protective gas; the draft hood is connected to an external fan to generate negative pressure to guide the protective gas output from the exhaust hood, thereby forming a directional protective airflow between the exhaust hood and the draft hood that covers the molten solder, isolating air and reducing the oxidation rate of the molten solder. A heating unit is installed on the side of the melting cylinder near the exhaust hood to heat the air, generating an upward hot airflow on the side of the exhaust hood away from the draft hood. This forms an air curtain that prevents external air from intruding into the exhaust hood, avoiding a decrease in the purity of the protective gas. Simultaneously, the upward hot airflow generated by the heating unit can dry the flux on the circuit board.

Description

Technical Field

[0001] This invention belongs to the technical field of wave soldering equipment, specifically referring to a solder bath assembly for a wave soldering machine. Background Technology

[0002] A wave soldering machine is a device that automates the soldering of through-hole components by forming a wave peak with molten solder. The core unit is the wave soldering furnace (soldering furnace). Its working principle involves an internal mechanical pump that sprays molten liquid solder from the furnace, forming a precise and controllable stable wave peak. When a circuit board with mounted components passes through this wave peak at a specific angle and speed, the molten solder fully wets and fills the through-hole between the component leads and the PCB pads, forming a strong electrical connection solder joint after cooling.

[0003] In existing wave soldering processes, the solder pot, as the core component for holding and heating liquid solder, typically requires the solder inside to remain molten for extended periods at temperatures around 250°C to 300°C. However, this high-temperature environment accelerates the chemical reaction between the liquid solder and oxygen in the air, forming a layer of dross containing a large amount of metal oxides. This leads to solder waste, soldering defects, and frequent downtime for maintenance, impacting production efficiency. Summary of the Invention

[0004] In view of the above situation and to overcome the defects of the prior art, the purpose of the present invention is to provide a solder bath assembly for a wave soldering machine, so as to at least partially solve the problems mentioned in the background art.

[0005] The technical solution adopted by this invention is as follows: This invention proposes a solder bath assembly for a wave soldering machine, comprising: The solder melting cylinder has two guide channels inside for solder spraying; The power unit is installed at one end of the solder melting cylinder; The top of the molten solder cylinder is equipped with an exhaust hood and an air duct on both sides. The exhaust hood is connected to an external gas supply device to output protective gas. The air duct is connected to an external fan to generate negative pressure at the air duct, so as to draw the protective gas output by the exhaust hood, thereby forming a directional airflow covering the molten solder between the exhaust hood and the air duct.

[0006] Furthermore, a heating unit is installed on the side of the solder melting cylinder near the exhaust hood, and the heating unit is located outside the exhaust hood and the draft hood. It is used to heat the air to generate an upward hot airflow on the side of the exhaust hood away from the draft hood, so as to form an air curtain that blocks the intrusion of external air into the exhaust hood.

[0007] Furthermore, the heating unit includes a mounting box and a heating tube. The mounting box is a rectangular shell with an opening at the top. The mounting box is fixed on the solder melting cylinder. The heating tube is installed inside the mounting box and arranged parallel to the exhaust hood. The length of the heating tube is greater than the length of the exhaust hood, so that the width of the air curtain is greater than the length of the exhaust hood. An air inlet groove is provided on one side of the bottom of the mounting box.

[0008] Furthermore, the opening of the mounting box is fitted with a cover plate, and the cover plate is provided with an elongated airflow channel.

[0009] Furthermore, the interior of the exhaust hood is provided with a first air distribution plate and a second air distribution plate distributed sequentially from bottom to top, so as to ensure uniform airflow distribution.

[0010] Furthermore, the opening of the exhaust hood is provided with multiple horizontal and parallel grille plates, so that multiple airflow gaps are formed between the grille plates facing the exhaust hood.

[0011] Furthermore, a gas heater is fixed to the outside of the solder melting cylinder. The outlet of the gas heater is connected to the exhaust hood through a connecting pipe, and the inlet of the gas heater is connected to an external gas supply device. The gas supplied to the exhaust hood can be heated by the gas heater.

[0012] Furthermore, a serpentine heat exchange tube is installed on one side of the outer wall of the molten solder cylinder. One end of the heat exchange tube is connected to the air inlet of the gas heater, and the other end of the heat exchange tube is connected to an external gas supply device.

[0013] Furthermore, the power unit includes a motor and an impeller. The impeller is located in the guide groove and connected to the output shaft of the motor. The motor is mounted on the solder melting cylinder via a support frame.

[0014] Furthermore, a sliding bracket is installed at the bottom of the solder melting cylinder.

[0015] Beneficial effects: 1. By installing an exhaust hood and an air intake hood on both sides of the top of the solder melting tank, the exhaust hood outputs inert protective gas, and the air intake hood generates negative pressure to guide the protective gas output by the exhaust hood. This creates a directional protective airflow that covers the molten solder between the exhaust hood and the air intake hood, which is used to isolate air and reduce the oxidation rate of the molten solder.

[0016] 2. By installing a heating unit on the side of the solder melting cylinder near the exhaust hood, the air is heated to generate an upward hot airflow on the side of the exhaust hood away from the exhaust fan. This forms an air curtain that prevents external air from entering the exhaust hood, thus avoiding a decrease in the purity of the protective gas. At the same time, the upward hot airflow generated by the heating unit can dry the flux on the circuit board. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the solder bath assembly of a wave soldering machine according to an embodiment of the present invention; Figure 2 This is a schematic diagram showing the installation position of the heat exchange tube in the solder bath assembly of a wave soldering machine according to an embodiment of the present invention. Figure 3 This is a top view of a solder bath assembly for a wave soldering machine according to an embodiment of the present invention; Figure 4 This is a schematic diagram showing the positional distribution of the exhaust hood, draft hood, gas heater, and heat exchanger tubes in the solder bath assembly of a wave soldering machine according to an embodiment of the present invention. Figure 5 This is a schematic diagram of the structure of the first air distribution plate and the second air distribution plate in the solder bath assembly of a wave soldering machine according to an embodiment of the present invention; Figure 6 This is a schematic diagram showing the installation position of the grid plate in the solder bath assembly of a wave soldering machine according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the heating unit in the solder bath assembly of a wave soldering machine according to an embodiment of the present invention.

[0018] Among them, 1. Solder melting cylinder; 11. Guide channel; 12. Motor; 13. Sliding bracket; 14. Support frame; 2. Exhaust hood; 21. First air distribution plate; 22. Second air distribution plate; 3. Air duct; 31. Grille plate; 301. Guide gap; 4. Gas heater; 41. Connecting pipe; 5. Heat exchange pipe; 6. Heating unit; 61. Mounting box; 62. Heating pipe; 63. Cover plate; 601. Air inlet slot.

[0019] The accompanying drawings are provided to further understand the embodiments and form part of the specification. They are used together with the embodiments for explanation and do not constitute a limitation on the embodiments. Detailed Implementation

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection.

[0021] In the description of the embodiments, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments.

[0022] Combination Figure 1 As shown, an embodiment of the present invention provides a solder bath assembly for a wave soldering machine, including a solder melting cylinder 1, a flow guide trough 11, and a power unit.

[0023] The solder melting cylinder 1 has a built-in heating module that can heat to a specified temperature to melt the solder raw material, turning solid solder into liquid solder with good fluidity. There are two guide channels 11, and both guide channels 11 are placed inside the solder melting cylinder 1. The guide channels 11 are equipped with upward nozzles. By installing corresponding nozzle covers on the nozzles, they can form corresponding shapes and be higher than the peak of the liquid solder in the solder melting cylinder 1, so as to realize the soldering of the circuit board.

[0024] Furthermore, the power unit includes a motor 12 and an impeller. The impeller is located at one end inside the guide channel 11 and is connected to the output shaft of the motor 12. The motor 12 is mounted on the solder melting cylinder 1 via a support frame 14. Correspondingly, the guide channel 11 is provided with a solder inlet at one end of the impeller. The impeller is driven to rotate by the motor 12 to pump the liquid solder, so that the liquid solder can be sprayed upward through the guide channel 11 and the nozzle cover. The spray height of the liquid solder can be adjusted by adjusting the power of the motor 12.

[0025] Furthermore, a sliding bracket 13 is installed at the bottom of the solder melting cylinder 1. The sliding bracket 13 includes a fixed bracket and rollers installed at the bottom. Therefore, the position of the solder melting cylinder 1 can be adjusted by the sliding bracket 13, which facilitates the installation and maintenance of the solder melting cylinder 1.

[0026] Thus, the solder melting cylinder 1 is placed inside the wave soldering machine. According to the soldering requirements, a corresponding nozzle cover is installed on the nozzle of the guide channel 11. After the solid solder in the solder melting cylinder 1 melts into liquid solder, the impeller is driven by the motor 12 to rotate and pump the liquid solder, so that the liquid solder can be sprayed upward through the guide channel 11 and the nozzle cover. The circuit board is transported by the conveying mechanism of the wave soldering machine and passes over the solder melting cylinder 1. The bottom of the circuit board contacts the sprayed liquid solder to complete the soldering.

[0027] Combination Figure 1 , Figure 3 and Figure 4As shown, an exhaust hood 2 and an air duct 3 are respectively installed on the top two sides of the solder melting cylinder 1. The exhaust hood 2 and the air duct 3 are arranged parallel to the length direction of the solder melting cylinder 1, and their length is sufficient to cover the nozzle length of the guide groove 11. The exhaust hood 2 is connected to an external gas supply device, which can supply protective gas into the exhaust hood 2 and output it outward from the exhaust hood 2. The protective gas is an inert gas. The air duct 3 is connected to an external fan. Under the action of the fan, a negative pressure can be generated at the air duct 3 to guide the protective gas output outward from the exhaust hood 2. Specifically, the protective gas output outward from the exhaust hood 2 can cross the solder melting cylinder 1 and flow to the air duct 3, forming a directional protective airflow that can cover the molten solder between the exhaust hood 2 and the air duct 3.

[0028] Thus, during the soldering process, liquid tin can be sprayed upward through the guide channel 11 and the nozzle cover plate, forming corresponding peaks. At the same time, the exhaust hood 2 outputs inert protective gas, and the air duct 3 generates negative pressure, so that there is always an airflow of inert protective gas above the molten tin, which is used to isolate the air and reduce the oxidation rate of the molten tin.

[0029] In an optional embodiment, nitrogen is used as the protective gas.

[0030] Combination Figure 5 As shown, the interior of the exhaust hood 2 is provided with a first air distribution plate 21 and a second air distribution plate 22 arranged sequentially from bottom to top. Both the first air distribution plate 21 and the second air distribution plate 22 are provided with a plurality of evenly distributed holes. The protective gas input into the exhaust hood 2 can be dispersed and output through the plurality of holes so that the airflow is evenly distributed.

[0031] Combination Figure 6 As shown, the opening of the air hood 3 is provided with multiple horizontal and parallel grid plates 31, so that multiple flow gaps 301 are formed between the grid plates 31 toward the exhaust hood 2. The flow gaps 301 can generate a negative pressure zone toward the exhaust hood 2, so that the protective gas output from the exhaust hood 2 can be flowed into the air hood 3.

[0032] Combination Figure 1 , Figure 3 and Figure 7 As shown, a heating unit 6 is installed on the side of the solder melting cylinder 1 near the exhaust hood 2, and the heating unit 6 is located outside the exhaust hood 2 and the draft hood 3. It is used to heat the air to generate an upward hot airflow on the side of the exhaust hood 2 away from the draft hood 3, so as to form an air curtain that blocks the intrusion of external air into the exhaust hood 2.

[0033] Since the protective gas output from the exhaust hood 2 can be drawn by the negative pressure of the ventilator 3, the air on the side of the exhaust hood 2 away from the ventilator 3 will also be drawn by the negative pressure, thus mixing with the protective gas and reducing the purity of the protective gas. Therefore, by setting the heating unit 6, a rising air curtain can be formed on the side of the exhaust hood 2 away from the ventilator 3, thereby blocking the intrusion of air into the exhaust hood 2 and preventing the purity of the protective gas from decreasing.

[0034] In a specific embodiment, the heating unit 6 includes a mounting box 61 and a heating tube 62. The mounting box 61 is a rectangular shell with an opening at the top. The mounting box 61 is fixed on the solder melting cylinder 1. The heating tube 62 is installed inside the mounting box 61 and arranged parallel to the exhaust hood 2. The length of the heating tube 62 is greater than the length of the exhaust hood 2, so that the width of the air curtain is greater than the length of the exhaust hood 2. An air inlet groove 601 is provided on one side of the bottom of the mounting box 61.

[0035] When the heating tube 62 is powered on, the air inside the mounting box 61 is heated and rises, while cold air is supplied through the air inlet 601, so that a continuous rising hot airflow can be generated above the mounting box 61, thereby forming an air curtain.

[0036] Furthermore, the opening of the mounting box 61 is fitted with a cover plate 63, and the cover plate 63 is provided with a long strip airflow groove. Through the cover plate 63 and the long strip airflow groove, the exhaust passage of the mounting box 61 can be reduced, thereby increasing the gas flow rate and playing a better isolation role.

[0037] It should be noted that the length of the elongated airflow channel is greater than the length of the exhaust hood 2, so that the width of the airflow rising from the elongated airflow channel is greater than the length of the exhaust hood 2, thus playing a good role in blocking air.

[0038] Furthermore, since the circuit board needs to be sprayed with flux and dried before it comes into contact with the solder, the board material first passes through the heating unit 6 and then is conveyed to the top of the solder melting cylinder 1. Therefore, the rising hot airflow generated by the heating unit 6 can dry the flux on the circuit board.

[0039] Combination Figure 2 and Figure 4 As shown, a gas heater 4 is fixed on the outside of the solder melting cylinder 1. The outlet of the gas heater 4 is connected to the exhaust hood 2 through a connecting pipe 41. The inlet of the gas heater 4 is connected to an external gas supply device. The gas supplied by the external gas supply device to the exhaust hood 2 can be heated by the gas heater 4 to increase the temperature of the protective gas and prevent the low-temperature gas from affecting the high-temperature solder liquid.

[0040] Furthermore, a serpentine heat exchange tube 5 is installed on one side of the outer wall of the solder melting cylinder 1. One end of the heat exchange tube 5 is connected to the air inlet of the gas heater 4, and the other end of the heat exchange tube 5 is connected to an external gas supply device. The protective gas supplied by the external gas supply device first passes through the heat exchange tube 5 and preheats the gas in the heat exchange tube 5 by the residual heat of the outer wall of the solder melting cylinder 1, thereby increasing the gas temperature and reducing the power of the gas heater 4 and reducing energy consumption.

[0041] In this way, the protective gas supplied by the external gas supply equipment first passes through the heat exchange tube 5, and the gas in the heat exchange tube 5 is preheated by the residual heat of the outer wall of the molten solder cylinder 1 to increase the gas temperature. Then the gas is delivered to the gas heater 4, where it is reheated to raise the gas temperature to the specified value. Finally, it is delivered to the exhaust hood 2 and discharged from the exhaust hood 2. This avoids the low-temperature gas from affecting the high-temperature molten solder. In addition, the gas is preheated by the residual heat of the outer wall of the molten solder cylinder 1, thereby reducing the power of the gas heater 4 and reducing energy consumption.

[0042] The working principle of this invention: The solder melting cylinder 1 is placed inside the wave soldering machine. According to the soldering requirements, corresponding nozzle covers are installed on the nozzles of the guide channel 11. After the solid solder in the solder melting cylinder 1 melts into liquid solder, the impeller is driven to rotate by the motor 12 to pump the liquid solder, so that the liquid solder can be sprayed upward through the guide channel 11 and the nozzle covers, forming corresponding waves. At the same time, the external gas supply equipment delivers protective gas into the heat exchange tube 5, and the residual heat of the outer wall of the solder melting cylinder 1 preheats the gas in the heat exchange tube 5. The gas temperature is increased, and then the gas is sent to the gas heater 4 for reheating to raise the gas temperature to the specified value. Finally, the gas is sent to the exhaust hood 2 and output from the exhaust hood 2. The external fan is started, and a negative pressure is generated at the exhaust hood 3. The protective gas output from the exhaust hood 2 can cross the solder melting cylinder 1 and flow to the exhaust hood 3, forming a directional protective airflow between the exhaust hood 2 and the exhaust hood 3 that can cover the molten solder, isolating air and reducing the oxidation rate of the molten solder.

[0043] The heating tube 62 is energized and heats up the air inside the mounting box 61. The air inside rises due to the heat, while cold air is supplied through the air inlet 601. This allows a continuous upward flow of hot air to be generated above the mounting box 61, forming an air curtain that prevents air from entering the exhaust hood 2. The circuit board is transported by the conveying mechanism of the wave soldering machine. It first passes through the heating unit 6, where the rising hot airflow dries the flux sprayed on the bottom of the circuit board. Then, it passes over the solder melting cylinder 1, and the bottom of the circuit board comes into contact with the sprayed liquid solder, completing the soldering process.

[0044] In summary, by setting an exhaust hood 2 and an air duct 3 on the top two sides of the solder melting cylinder 1, an external gas supply device can deliver inert protective gas into the exhaust hood 2 and output it outward from the exhaust hood 2. The air duct 3 is connected to an external fan. Under the action of the fan, a negative pressure can be generated at the air duct 3 to divert the protective gas output outward from the exhaust hood 2, thereby forming a directional protective airflow that can cover the solder melt between the exhaust hood 2 and the air duct 3, which is used to isolate air and reduce the oxidation rate of the solder melt.

[0045] By setting up heat exchange tube 5, the residual heat of the molten solder cylinder 1 is used to heat the protective gas, which is then heated again by the gas heater 4 to raise the gas temperature to a specified value. Finally, the gas is delivered to the exhaust hood 2 and output from the exhaust hood 2, thus avoiding the impact of low-temperature gas on high-temperature molten solder. In addition, the gas is preheated by the residual heat of the outer wall of the molten solder cylinder 1, thereby reducing the power of the gas heater 4 and reducing energy consumption.

[0046] By setting a heating unit 6 on the side of the solder melting cylinder 1 near the exhaust hood 2, the air is heated to generate an upward hot airflow on the side of the exhaust hood 2 away from the exhaust hood 3. This forms an air curtain that blocks external air from entering the exhaust hood 2, preventing the purity of the protective gas from decreasing. At the same time, the upward hot airflow generated by the heating unit 6 can dry the flux on the circuit board.

[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0048] The embodiments have been described above, and such description is not restrictive. The figures shown are only one embodiment, and the actual structure is not limited to this. In short, if a person skilled in the art is inspired by this description and designs a similar structure and embodiment without departing from the inventive spirit, such design should fall within the scope of protection.

Claims

1. A solder bath assembly for a wave soldering machine, characterized in that, include: The solder melting cylinder (1) has two guide channels (11) inside for solder spraying. A power unit is installed at one end of the solder melting cylinder (1); Among them, an exhaust hood (2) and an air duct (3) are respectively installed on the top two sides of the molten solder cylinder (1). The exhaust hood (2) is connected to an external gas supply device and is used to output protective gas. The air duct (3) is connected to an external fan so that a negative pressure can be generated at the air duct (3) to guide the protective gas output by the exhaust hood (2), thereby forming a directional airflow covering the molten solder between the exhaust hood (2) and the air duct (3).

2. The solder bath assembly of the wave soldering machine according to claim 1, characterized in that: A heating unit (6) is installed on the side of the molten solder cylinder (1) near the exhaust hood (2), and the heating unit (6) is located outside the exhaust hood (2) and the air duct (3) to heat the air so as to generate an upward hot airflow on the side of the exhaust hood (2) away from the air duct (3) to form an air curtain that blocks external air from entering the exhaust hood (2).

3. The solder bath assembly of the wave soldering machine according to claim 2, characterized in that: The heating unit (6) includes a mounting box (61) and a heating tube (62). The mounting box (61) is a rectangular shell with an opening at the top. The mounting box (61) is fixed on the solder melting cylinder (1). The heating tube (62) is installed inside the mounting box (61) and arranged parallel to the exhaust hood (2). The length of the heating tube (62) is greater than the length of the exhaust hood (2) so that the width of the air curtain is greater than the length of the exhaust hood (2). An air inlet groove (601) is provided on one side of the bottom of the mounting box (61).

4. The solder bath assembly of the wave soldering machine according to claim 3, characterized in that: The opening of the mounting box (61) is fitted with a cover plate (63), and the cover plate (63) is provided with a long strip-shaped airflow groove.

5. The solder bath assembly of the wave soldering machine according to claim 1, characterized in that: The exhaust hood (2) is provided with a first air distribution plate (21) and a second air distribution plate (22) arranged from bottom to top to ensure uniform airflow distribution.

6. The solder bath assembly of the wave soldering machine according to claim 1, characterized in that: The opening of the air hood (3) is provided with a plurality of horizontal and parallel grid plates (31) so that a plurality of airflow gaps (301) are formed between the grid plates (31) facing the exhaust hood (2).

7. The solder bath assembly of the wave soldering machine according to claim 1, characterized in that: A gas heater (4) is fixed on the outside of the molten solder cylinder (1). The outlet of the gas heater (4) is connected to the exhaust hood (2) through a connecting pipe (41). The inlet of the gas heater (4) is connected to an external gas supply device. The gas supplied to the exhaust hood (2) can be heated by the gas heater (4).

8. The solder bath assembly of the wave soldering machine according to claim 7, characterized in that: The outer wall of one side of the tin melting cylinder (1) is equipped with a serpentine heat exchange tube (5). One end of the heat exchange tube (5) is connected to the air inlet of the gas heater (4), and the other end of the heat exchange tube (5) is connected to an external gas supply device.

9. The solder bath assembly of the wave soldering machine according to claim 1, characterized in that: The power unit includes a motor (12) and an impeller. The impeller is located in the guide groove (11) and connected to the output shaft of the motor (12). The motor (12) is mounted on the solder melting cylinder (1) via a support frame (14).

10. The solder bath assembly of the wave soldering machine according to claim 1, characterized in that: The bottom of the solder melting cylinder (1) is equipped with a sliding bracket (13).

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