Optical waveguide wafer cutting device with multi-angle cooling and chip removal functions

Abstract

The present application relates to the technical fields of optical waveguide wafer cutting, especially to a kind of optical waveguide wafer cutting device with multi-angle cooling and chip removal function, comprising main outer frame and laser cutting device body, the main outer frame is annular structure, and the upper surface of main outer frame is installed with upper annular guide rail by fixed support.The present application realizes 360-degree omnidirectional uniform cooling to processing area by the uniform arrangement of annular flow chamber and multiple electrically-controlled liquid injection nozzles on the inner wall of annular structure, effectively prevents high temperature caused by laser cutting from leading to wafer thermal deformation and optical layer burn, avoids molten debris adhering to wafer surface to affect product quality, realizes the integration of stable cutting, uniform cooling and immediate chip removal, and improves the processing efficiency and product yield of optical waveguide wafer.

Description

Technical Field

[0001] This invention relates to the field of optical waveguide wafer dicing technology, and in particular to an optical waveguide wafer dicing device with multi-angle cooling and chip removal functions. Background Technology

[0002] Optical waveguide wafers are a type of high-precision optical substrate material, possessing extremely high optical uniformity, surface flatness, and low optical loss characteristics. They enable directional light transmission and are widely used in high-end optoelectronic fields such as AR smart glasses, optical communication chips, and precision optical sensors. Their processing precision directly determines the imaging quality and transmission performance of optoelectronic devices. The final stage of optical waveguide wafer processing requires dicing. Currently, the mainstream dicing methods in the industry are mechanical dicing and laser dicing. However, both processes have significant technical drawbacks and are difficult to adapt to the demands of high-precision, high-yield mass production. Mechanical dicing relies on the physical grinding of diamond blades. Its advantages include a smooth cut surface and lower cost, but its disadvantages are prominent. The dicing process easily generates mechanical stress, leading to wafer chipping, microcracks, and significant debris residue and processing loss, making it unsuitable for ultra-thin optical waveguide wafer processing. Laser cutting is a non-contact processing method that eliminates mechanical stress damage, offers high cutting efficiency and excellent precision. However, it generates localized high temperatures during cutting, which can easily cause wafer thermal deformation and optical layer burns. Furthermore, the high-temperature molten debris easily adheres to the wafer surface, making it difficult to remove quickly and severely impacting the product's optical performance. Currently available cutting equipment only performs the cutting function and lacks integrated devices for stable cutting, rapid cooling, and immediate chip removal. This fails to simultaneously address the physical damage and debris accumulation issues of mechanical cutting and the high-temperature burns and thermal deformation problems of laser cutting. Consequently, it suffers from poor processing stability, low product yield, and cumbersome subsequent cleaning processes, hindering the development of high-precision, high-efficiency mass production of optical waveguide wafers. Summary of the Invention

[0003] The technical problem to be solved by this invention is that existing optical waveguide wafer dicing equipment suffers from numerous processing defects, significant thermal damage, and difficulty in debris removal.

[0004] The technical solution adopted by the present invention to solve its technical problem is: a waveguide wafer dicing device with multi-angle cooling and chip removal function, including a main outer frame and a laser dicing device body. The main outer frame is a ring structure. An upper ring guide rail is installed on the upper surface of the main outer frame through a fixed bracket. A top control frame for installing and adjusting the laser dicing device body is movably assembled on the upper ring guide rail. An arc-shaped slag discharge port is provided on the inner bottom surface of the inner side of the main outer frame. An annular flow guiding chamber is provided inside the main outer frame. A plurality of electrically controlled liquid spray nozzles are installed on the inner outer wall of the main outer frame. An electrically controlled flipping stabilizing arm is hinged inside the arc-shaped slag discharge port.

[0005] Furthermore, the top control frame includes a top control ring movably mounted on the upper annular guide rail, a top crossbeam fixed on both sides of the upper end of the top control ring, an electrically controlled translational adjustment guide rail mounted on the upper end of the top crossbeam, and a movable mounting base movably mounted on the electrically controlled translational adjustment guide rail. The laser cutting device body is assembled on the movable mounting base.

[0006] Furthermore, an external guide pipe that communicates with the interior of the annular guide chamber is fixedly installed on the outer wall of the main outer frame.

[0007] Furthermore, an upwardly protruding strip guide rail is fixedly installed on the upper surface of the top crossbeam. The electrically controlled translation adjustment guide rail includes a horizontal adjustment frame that is sleeved on the strip guide rail by the bottom slider, an external motor fixed on the outside of the bottom slider, and a transmission gear that drives the strip guide rail and the external motor. The external motor drives the bottom slider to slide and translate along the strip guide rail by driving the transmission gear.

[0008] Furthermore, the upper surface of the horizontal adjustment frame has an upwardly protruding upper guide rail. The movable mounting base is slidably assembled with the electrically controlled translation adjustment guide rail by being sleeved on the upper guide rail through side sliders on both sides. A side motor is installed on the outside of the side slider to control its sliding translation along the upper guide rail.

[0009] Furthermore, the lower surface of the movable mounting base has a downwardly protruding bottom monitoring ring, and the outer side of the bottom monitoring ring has an outwardly protruding integral heat dissipation fin.

[0010] Furthermore, a temperature sensor controller is installed on the bottom monitoring ring.

[0011] Furthermore, a detachable metal filter screen is installed at the outer opening of the arc-shaped slag discharge port.

[0012] Furthermore, the electrically controlled tilting stabilizer arm includes an arc-shaped tilting arm hinged inside the arc-shaped slag discharge port, a synchronous control gear ring for controlling the arc-shaped tilting arm, and an external control strut.

[0013] Furthermore, the end of the arc-shaped flip arm is fitted with a detachable clamping claw for adapting to the optical waveguide wafer.

[0014] The beneficial effects of this invention are as follows: The combination of the top-mounted control frame and the upper-mounted annular guide rail enables flexible multi-angle adjustment of the laser cutting device body, improving the flexibility and adaptability of the cutting process and solving the technical problem of the single cutting angle in existing cutting equipment; the uniform arrangement of the annular flow guiding chamber and multiple electrically controlled liquid spray nozzles on the inner wall of the annular structure achieves 360-degree all-round uniform cooling of the processing area, effectively preventing wafer thermal deformation and optical layer burns caused by the high temperature generated during laser cutting; the arc-shaped slag discharge port and its internal electrically controlled flipping stabilizing arm, combined with a detachable metal filter, achieves immediate guidance and stable discharge of cutting debris, avoiding molten debris adhering to the wafer surface and affecting product quality. This integrates stable cutting, uniform cooling, and immediate chip removal, improving the processing efficiency and product yield of optical waveguide wafers. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0017] Figure 2 This is a top view of the structure of the present invention.

[0018] Figure 3 This is a schematic diagram of the internal flow guiding chamber and the spray nozzle arrangement of the present invention.

[0019] Figure 4 This is a schematic diagram of the arrangement of the electrically controlled tilting stabilizer arm of the present invention.

[0020] Figure 5 This is a schematic diagram of the cross-section of the annular flow guiding chamber of the present invention.

[0021] Figure 6 This is a structural schematic diagram of the mounting position of the laser cutting device body of the present invention.

[0022] Figure 7 This is a schematic diagram of the structure of the horizontal adjustment frame of the present invention in its installed state.

[0023] Explanation of reference numerals in the attached drawings: 100. Main outer frame; 110. Fixed bracket; 120. Upper annular guide rail; 130. Top adjustment frame; 140. Laser cutting device body; 150. Arc-shaped slag discharge port; 160. Annular guide chamber; 170. Electrically controlled spray nozzle; 180. Electrically controlled tilting stabilizing arm; 200. Top adjustment ring; 210. Top crossbeam; 220. Electrically controlled translation adjustment guide rail; 230. Movable mounting base; 240. External guide pipe; 25 0. Strip guide rail; 260. Bottom slider; 270. External motor; 280. Transmission gear; 290. Top guide rail; 300. Side slider; 310. Side motor; 320. Bottom monitoring ring; 330. Heat dissipation fins; 340. Temperature sensor controller; 350. Removable metal filter; 360. Arc-shaped flip arm; 370. Synchronous control gear ring; 380. External control support rod; 390. Removable clamping claw; 400. Horizontal adjustment frame. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0025] like Figures 1-7 As shown, the present invention provides an optical waveguide wafer dicing device with multi-angle cooling and chip removal functions, comprising a main outer frame 100 and a laser dicing device body 140. The main outer frame 100 has an annular structure, and an upper annular guide rail 120 is mounted on the upper surface of the main outer frame 100 via a fixed bracket 110. A top-mounted adjustment frame 130 is movably mounted on the upper annular guide rail 120, and the top-mounted adjustment frame 130 is used to install and adjust the position and angle of the laser dicing device body 140. An arc-shaped slag discharge port 150 is provided on the inner bottom surface of the inner side of the main outer frame 100, and an annular flow guiding chamber 160 is provided inside the main outer frame 100. Six electrically controlled liquid spray nozzles 170 are installed on the inner outer wall of the main outer frame 100, and these electrically controlled liquid spray nozzles 170 are evenly distributed along the annular inner wall of the main outer frame 100. An electrically controlled tilting stabilizing arm 180 is hinged inside the arc-shaped slag discharge port 150. An external guide pipe 240 is fixedly installed on the outer wall of the main outer frame 100. The external guide pipe 240 is connected to the inside of the annular guide chamber 160 and is used to supply coolant to the annular guide chamber 160.

[0026] The top-mounted control frame 130 includes a top control ring 200 movably mounted on an upper annular guide rail 120, a top crossbeam 210 fixed to both sides of the upper end of the top control ring 200, an electrically controlled translational adjustment guide rail 220 mounted on the upper end of the top crossbeam 210, and a movable mounting base 230 movably mounted on the electrically controlled translational adjustment guide rail 220. The laser cutting device body 140 is mounted on the movable mounting base 230. By sliding the top control ring 200 along the upper annular guide rail 120, the angle of the laser cutting device body 140 can be adjusted; by moving the movable mounting base 230 along the electrically controlled translational adjustment guide rail 220, the radial position of the laser cutting device body 140 can be adjusted, thereby achieving precise multi-angle and multi-position cutting of the optical waveguide wafer.

[0027] A raised strip guide rail 250 is fixedly mounted on the upper surface of the top crossbeam 210. The electrically controlled translational adjustment guide rail 220 includes a horizontal adjustment frame 400 fitted onto the strip guide rail 250 via a bottom slider 260, an external motor 270 fixed to the outside of the bottom slider 260, and a transmission gear 280 connecting the strip guide rail 250 and the external motor 270. The external motor 270 drives the transmission gear 280, causing the bottom slider 260 to slide and translate along the strip guide rail 250, thereby moving the horizontal adjustment frame 400. The upper surface of the horizontal adjustment frame 400 has an upwardly raised upper guide rail 290. A movable mounting base 230 is fitted onto the upper guide rail 290 via side sliders 300 on both sides, and is slidably assembled with the electrically controlled translational adjustment guide rail 220. A side motor 310 is mounted on the outside of the side sliders 300 to control the sliding and translational movement of the movable mounting base 230 along the upper guide rail 290. Driven by the combined action of the external motor 270 and the side-mounted motor 310, the movable mounting base 230 can achieve precise two-dimensional movement in the horizontal plane.

[0028] The main outer frame 100 has an annular flow guiding chamber 160 inside, which is connected to the outside through multiple electrically controlled spray nozzles 170 on the inner outer wall of the main outer frame 100. An external flow guiding pipe 240 supplies coolant to the annular flow guiding chamber 160. After being evenly distributed within the annular flow guiding chamber 160, the coolant is sprayed onto the processing area through the electrically controlled spray nozzles 170. By using multiple electrically controlled spray nozzles 170 evenly arranged along the annular inner wall of the main outer frame 100, 360-degree omnidirectional uniform cooling of the laser cutting processing area can be achieved, effectively preventing wafer thermal deformation and optical layer burns caused by the high temperatures generated during laser cutting; it can also accelerate the removal of impurities through a single-sided fan-shaped area spraying method.

[0029] The lower surface of the movable mounting base 230 has a downwardly protruding bottom monitoring ring 320, and the outer side of the bottom monitoring ring 320 has an outwardly protruding integrated heat dissipation fin 330. The heat dissipation fin 330 can increase the heat dissipation area and assist the heat dissipation of the laser cutting device body 140. A temperature sensor controller 340 is installed on the bottom monitoring ring 320 to monitor the temperature of the processing area in real time. When the temperature sensor controller 340 detects that the temperature of the processing area exceeds a set threshold, it controls the electrically controlled spray nozzle 170 to open and spray coolant into the processing area for cooling; when the temperature drops to a safe range, it controls the electrically controlled spray nozzle 170 to close. Through the feedback control of the temperature sensor controller 340, precise regulation of the processing temperature is achieved.

[0030] The chips and residue generated during the cutting process are discharged through the arc-shaped slag discharge port 150. A removable metal filter 350 is installed at the outer opening of the arc-shaped slag discharge port 150. The removable metal filter 350 can intercept large chips and prevent them from splashing outside the processing area, while allowing coolant and small particles of chips to pass through. An electrically controlled tilting and stabilizing arm 180 is hinged inside the arc-shaped slag discharge port 150. The electrically controlled tilting and stabilizing arm 180 includes an arc-shaped tilting arm 360 hinged inside the arc-shaped slag discharge port 150, a synchronous control gear ring 370 for controlling the arc-shaped tilting arm 360, and an external control support rod 380. The external control support rod 380 drives the arc-shaped tilting arm 360 to rotate through the synchronous control gear ring 370, controlling the unfolding angle of the arc-shaped tilting arm 360. A removable clamping claw 390 is fitted at the end of the arc-shaped tilting arm 360. The removable clamping claw 390 is used to adapt and clamp the optical waveguide wafer. Before dicing, the optical waveguide wafer is placed inside the main outer frame 100. The curved flip arm 360 and the detachable clamping jaws 390 work together to adjust the optical waveguide wafer to the preset processing position. After dicing, the finished wafer is removed.

[0031] In this embodiment, the laser cutting device body 140 employs a laser generator known in the art. The laser generator can be a fiber laser or a CO2 laser. Its specific type and power parameters are reasonably selected and determined by those skilled in the art based on the material and thickness of the optical waveguide wafer being processed. This is a conventional technical method in the art and will not be elaborated further here. The coolant can be deionized water or a special cutting coolant, and its flow rate and jet pressure are conventionally adjusted and determined by those skilled in the art based on the processing conditions.

[0032] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

Claims

1. A waveguide wafer dicing device with multi-angle cooling and chip removal function, comprising a main outer frame (100) and a laser dicing device body (140), characterized in that: The main outer frame (100) is a ring structure. An upper ring guide rail (120) is installed on the upper surface of the main outer frame (100) through a fixed bracket (110). A top control frame (130) for installing and adjusting the laser cutting device body (140) is movably mounted on the upper ring guide rail (120). An arc-shaped slag discharge port (150) is provided on the inner bottom surface of the inner side of the main outer frame (100). An annular flow guiding chamber (160) is provided inside the main outer frame (100). A plurality of electrically controlled liquid spray nozzles (170) are installed on the inner outer wall of the main outer frame (100). An electrically controlled flipping stabilizing arm is hinged inside the arc-shaped slag discharge port (150). The top-mounted control frame (130) includes a top control ring (200) movably mounted on the upper annular guide rail (120), a top crossbeam (210) fixed on both sides of the upper end of the top control ring (200), an electrically controlled translational adjustment guide rail mounted on the upper end of the top crossbeam (210), and a movable mounting seat (230) movably mounted on the electrically controlled translational adjustment guide rail (220). The laser cutting device body (140) is assembled on the movable mounting seat (230). The top beam (210) is fixedly mounted with an upwardly protruding strip rail (250). The electrically controlled translation adjustment rail (220) includes a horizontal adjustment frame (400) that is sleeved on the strip rail (250) by a bottom slider (260), an external motor (270) fixed on the outside of the bottom slider (260), and a transmission gear (280) that drives the strip rail (250) and the external motor (270). The external motor (270) drives the bottom slider (260) to slide and translate along the strip rail (250) by driving the transmission gear (280). The upper surface of the horizontal adjustment frame (400) has an upwardly protruding upper guide rail (290). The movable mounting base (230) is slidably assembled with the electrically controlled translation adjustment guide rail (220) by means of side sliders (300) on both sides on the upper guide rail (290). A side motor (310) for controlling its sliding translation along the upper guide rail (290) is installed on the outside of the side slider (300). The lower surface of the movable mounting base (230) has a bottom monitoring ring that protrudes downwards, and the outer side of the bottom monitoring ring (320) has heat dissipation fins (330) with an integral structure that protrudes outwards; The electrically controlled tilting stabilizer arm (180) includes an arc-shaped tilting arm (360) hinged inside the arc-shaped slag discharge port (150), a synchronous control gear ring (370) for controlling the arc-shaped tilting arm (360), and an external control support rod (380). The end of the arc-shaped flip arm (360) is fitted with a detachable clamping claw (390) for adapting to the optical waveguide wafer.

2. The optical waveguide wafer dicing device with multi-angle cooling and chip removal function according to claim 1, characterized in that: An external guide pipe (240) that communicates with the interior of the annular guide chamber (160) is fixedly installed on the outer wall of the main outer frame (100).

3. The optical waveguide wafer dicing device with multi-angle cooling and chip removal function according to claim 1, characterized in that: A temperature sensor controller (340) is installed on the bottom monitoring ring (320).

4. The optical waveguide wafer dicing device with multi-angle cooling and chip removal function according to claim 1, characterized in that: A detachable metal filter screen (350) is installed at the outer opening of the arc-shaped slag discharge port (150).

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