Roller bonding apparatus

Abstract

The application provides a roll bonding device, and belongs to the technical field of bonding devices. The device comprises a vacuum chamber, a first unwinding mechanism, a second unwinding mechanism, a first surface treatment mechanism, a second surface treatment mechanism, a pressing mechanism and a winding mechanism. The first surface treatment mechanism emits a beam to bombard the first material, so that the body atoms of the first material are stripped off and pre-deposited on the surface of the second material; the second surface treatment mechanism arranged upstream bombards and cleans the impurities on the surface of the second material in advance. The two materials after surface modification are roll bonded by the pressing mechanism, and the final product is wound by the winding mechanism. The scheme does not need to additionally add target materials and deposition devices, and can simplify the device structure and reduce the floor space.

Description

Technical Field

[0001] This invention belongs to the field of bonding equipment technology, and particularly relates to a roll bonding device. Background Technology

[0002] Roll bonding (RB) uses a pair of rolls to apply high pressure, enabling the metal sheets to bond at the interface during the rolling process. It can be used for high-strength connections of the same or different metals, and is especially suitable for composite materials that are difficult to weld using traditional fusion welding, such as stainless steel and steel with nickel, titanium, copper and aluminum alloys. It has wide applications in heat dissipation devices, composite materials and electronic packaging.

[0003] Traditional roll bonding suffers from problems such as interface contamination, insufficient bond strength, and material damage due to large deformation. To address these issues, the industry has gradually adopted surface activation and deposition technologies: before roll bonding, the surfaces to be bonded are physically or chemically treated to remove oxide films and organic contaminants, exposing atomically clean surfaces. Roll bonding is then completed in a controlled atmosphere or vacuum environment, thereby achieving atomically close contact and stable bonding under conditions of smaller deformation and lower temperature.

[0004] However, existing technologies require separate surface treatment equipment for the first and second materials, and the deposition process also requires a separate target and deposition apparatus. This significantly increases the overall space occupied by the equipment, resulting in a longer transport distance from the surface treatment completion point to the rolling position. Consequently, the cleaned surface after treatment is susceptible to secondary contamination, affecting the bonding quality. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide a roll bonding device that solves the problems of large equipment space occupation, long material transport distance, and easy secondary surface contamination caused by the need to configure separate surface treatment equipment for two bonding materials and separate target material for the deposition process in existing technologies.

[0006] To achieve this objective, the present invention employs the following technical solution:

[0007] Roller bonding equipment includes:

[0008] A vacuum chamber, and a first unwinding mechanism, a second unwinding mechanism, a winding mechanism, a pressing mechanism, a first surface treatment mechanism, and a second surface treatment mechanism disposed in the vacuum chamber;

[0009] The first unwinding mechanism is used to provide the first material; the second unwinding mechanism is used to provide the second material.

[0010] The first surface treatment mechanism is disposed between the first unwinding mechanism and the second unwinding mechanism, and its working direction is towards the first unwinding mechanism;

[0011] Along the feeding direction, the second surface treatment mechanism is located upstream of the first surface treatment mechanism, and its working direction is towards the second unwinding mechanism;

[0012] The first surface treatment mechanism is used to emit a first beam to bombard the surface of the first material, causing the bulk atoms of the first material to detach and deposit on the surface of the second material before pressing;

[0013] The second surface treatment mechanism is used to fire a second beam to bombard the surface of the second material, removing impurities from the surface of the second material before the bulk atoms of the first material are deposited on the surface of the second material;

[0014] The pressing mechanism is used for roll bonding of the surface-treated first material and the second material;

[0015] The winding mechanism is used to wind up the composite material after roll bonding.

[0016] As an optional solution for roll bonding equipment, it also includes a third surface treatment mechanism, which is located upstream of the first surface treatment mechanism along the feeding direction and has its working direction facing the first unwinding mechanism;

[0017] The third surface treatment mechanism is used to fire a third beam to bombard the surface of the first material and remove impurities from the surface of the first material before the first beam bombards the surface of the first material.

[0018] As an alternative to the roll bonding equipment, a tensioning mechanism is also included, which is disposed between the first unwinding mechanism and the pressing mechanism, and / or between the second unwinding mechanism and the pressing mechanism, and the tensioning mechanism is used to adjust the tension of the first material and / or the second material.

[0019] As an alternative to a roll bonding apparatus, the first unwinding mechanism is configured to provide a first material having a first width; the second unwinding mechanism is configured to provide a second material having a second width, wherein the first width is greater than the second width.

[0020] As an alternative to roll bonding equipment, it also includes a baffle disposed in the direction of bulk atom detachment of the first material;

[0021] The baffle includes a passage area having a third width, the third width being not less than the second width.

[0022] As an alternative to a roll bonding device, the bonding mechanism includes a first pressure roller and a second pressure roller with adjustable relative positions, and the bonding pressure of the first pressure roller and the second pressure roller is 200-320 MPa.

[0023] As an alternative to roll bonding equipment, both the first unwinding mechanism and the second unwinding mechanism are equipped with a drive unit, which is used to synchronously convey the first material and the second material.

[0024] As an alternative to roll bonding equipment, the first surface treatment mechanism is a fast atom beam generator, a wide-beam ion beam generator, or a grid-type ion beam generator, and the first beam is an ion beam or a neutral atom beam.

[0025] As an alternative to roll bonding equipment, the energy of the first beam emitted by the first surface treatment mechanism is greater than the energy of the second beam emitted by the second surface treatment mechanism.

[0026] As an alternative to roll bonding equipment, the energy of the first beam emitted by the first surface treatment mechanism is greater than the energy of the third beam emitted by the third surface treatment mechanism.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The roll bonding equipment provided by this invention activates the surface of the first material while directly depositing it onto the surface of the second material, eliminating the need for separate deposition targets and deposition devices. This significantly reduces the number of devices, the space occupied, and the material transport distance, effectively avoiding secondary contamination after surface treatment. The two materials, after surface activation and interface deposition, are then roll bonded, making full use of the ductility of the metal itself to ensure that the clean, activated surface and the deposited transition layer are tightly bonded and interlocked, achieving efficient and reliable interface bonding. At the same time, it greatly simplifies the equipment layout and production process. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the roll bonding equipment provided by the present invention.

[0030] Figure 2 A cross-sectional view of the first beam bombardment of the first surface treatment mechanism of the roll bonding equipment provided by the present invention.

[0031] Figure label:

[0032] 101. First material; 102. Second material;

[0033] 1. Vacuum chamber; 11. Vacuum pump;

[0034] 2. First unwinding mechanism; 3. Second unwinding mechanism;

[0035] 4. Rewinding mechanism;

[0036] 5. Pressing mechanism; 51. First pressure roller; 52. Second pressure roller;

[0037] 6. First surface treatment mechanism; 7. Second surface treatment mechanism; 8. Third surface treatment mechanism; 9. Baffle. Detailed Implementation

[0038] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0039] It should be understood that in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0040] It should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0041] The following is combined Figure 1 and Figure 2The present invention describes a roll bonding apparatus comprising a vacuum chamber 1, and a first unwinding mechanism 2, a second unwinding mechanism 3, a winding mechanism 4, a pressing mechanism, a first surface treatment mechanism 6, and a second surface treatment mechanism 7 disposed within the vacuum chamber 1. The first unwinding mechanism 2 provides a first material 101, and the second unwinding mechanism 3 provides a second material 102, both continuously conveying the two materials to be bonded in a roll-to-roll manner. The first surface treatment mechanism 6 is disposed between the first unwinding mechanism 2 and the second unwinding mechanism 3, with its working direction facing the first unwinding mechanism 2, and is used to emit a first beam to bombard the surface of the first material 101. Along the feeding direction, the second surface treatment mechanism 7 is disposed upstream of the first surface treatment mechanism 6, with its working direction facing the second unwinding mechanism 3, and is used to emit a second beam to bombard the surface of the second material 102. When the first beam bombards the surface of the first material 101, it enables the bulk atoms of the first material 101 to gain sufficient kinetic energy to detach from the original surface. These detached bulk atoms move towards and deposit on the surface of the second material 102 in a vacuum environment. Since the second surface treatment mechanism 7 is located upstream, the second beam pre-bombards and cleans the surface of the second material 102, removing the oxide layer on the surface of the second material 102. This allows the bulk atoms of the first material 101 to be deposited on a clean active surface when they reach the surface of the second material 102, thereby significantly improving the bonding strength between the deposited atoms and the surface of the second material 102.

[0042] This layout allows the first material 101 and the second material 102 to directly enter the pressing mechanism for roll bonding after surface treatment without long-distance transport. There is no need to separately configure a target and deposition device for the second material 102, significantly reducing equipment space requirements. The surface of the first material 101, after surface treatment, reaches atomic-level cleanliness and is in an activated state, while the surface of the second material 102 has a bulk atomic layer of the same composition as the first material 101. Upon entering the pressing mechanism, the two achieve atomic-level close contact under roll pressure. Because the deposited layer has the same composition as the bulk of the first material 101, there are no metallurgical incompatibility issues introduced by dissimilar materials at the interface, resulting in a significant improvement in bonding strength. The winding mechanism 4 winds the bonded composite material into a roll, facilitating subsequent processing and storage.

[0043] In a further embodiment, the roll bonding apparatus also includes a third surface treatment mechanism 8. Along the feed direction, the third surface treatment mechanism 8 is positioned upstream of the first surface treatment mechanism 6, with its working direction facing the first unwinding mechanism 2, and is used to fire a third beam to bombard the surface of the first material 101. The first beam needs to detach bulk atoms from the surface of the first material 101, which requires the first beam to have high energy. However, if impurities exist on the surface of the first material 101 during the bombardment process, the high-energy beam can cause impurities to be embedded in the matrix or generate unintended sputtering products, contaminating the deposition environment. The third beam is fired in the third surface treatment mechanism 8, and its energy is set lower than that of the first beam, specifically for removing impurities from the surface of the first material 101 before the first beam bombardment. Through the pre-cleaning by the third beam, the surface of the first material 101 reaches an atomically clean state. When the first beam subsequently bombards, the detached bulk atoms have higher purity, resulting in a higher quality atomic layer deposited on the surface of the second material 102, reducing the introduction of interface defects and contaminants, thereby further improving the bonding quality and long-term reliability of the composite material.

[0044] In this embodiment, the first material 101 and / or the second material 102 undergo pretreatment to remove the surface oxide layer before entering the vacuum chamber 1. The pretreatment includes at least one of acid washing, alkaline washing, or electrochemical polishing. The second and third beams mainly remove the trace oxide layer regenerated after pretreatment and adsorbed contaminants. The oxide layer thickness of the first material 101 and the second material 102 is only on the nanometer scale, and the total amount of oxygen atoms contained is far lower than the atomic density of its surface monolayer. Under the bombardment of the beams, the oxide layer material is preferentially removed by the vacuum pump 11.

[0045] The first surface treatment unit 6 is a fast atom beam generator, a wide-beam ion beam generator, or a grid-type ion beam generator, and the first beam is the corresponding neutral atom beam or ion beam. One of these three generators is selected in the first surface treatment unit 6 according to the properties of the oxide layer on the surface of the first material 101 and the production cycle requirements.

[0046] In one optional embodiment, the fast atom beam generator includes a plasma source, a particle acceleration system, and a charge exchange chamber. The plasma source introduces process gas and excites it to generate process gas plasma. This process gas plasma is extracted by the particle acceleration system and accelerated to form an ion beam. The ion beam enters the charge exchange chamber and undergoes a charge exchange reaction with the atoms in the exchange gas introduced into the chamber. The high-energy ions capture electrons and transform into uncharged neutral atoms, forming a neutral atom beam. The effect of this generator is to eliminate the charge effect of the incident particles. When bombarding the first material 101 with an oxide layer on its surface, it will not repel subsequent incident particles due to surface charge accumulation, nor will it trigger micro-arc discharge, ensuring spatial uniformity and process stability during the bombardment process. The gas pressure in the charge exchange chamber is controlled at 10... -2The pressure ranges from 1 Pa to 1 Pa to ensure that ions collide fully with the atoms of the exchange gas to achieve efficient neutralization, while avoiding excessively high pressure that could cause neutral atoms to scatter and lose directionality.

[0047] In another optional embodiment, the wide-beam ion beam generator includes a plasma source and a particle acceleration system. The particle acceleration system is a wide-aperture ion extraction and acceleration system, where process gas plasma is directly extracted and accelerated via a large-area grid or aperture electrode to form a uniform ion beam covering a width of several hundred millimeters. The advantage of this generator is that a single bombardment can cover the entire width of a wide-width material, improving the reliability and throughput of roll-to-roll continuous production. The wide-beam ion beam has a uniform beam current density distribution, making it suitable for surface cleaning and atomic deposition of large-area thin film materials, ensuring consistency in sputtering yield or cleaning efficiency across the entire width.

[0048] In another optional embodiment, the grid-type ion beam generator includes a plasma source and a particle acceleration system. The particle acceleration system is a grid-type ion extraction and acceleration system, where process gas plasma is extracted and accelerated by a porous grid electrode to form an ion beam. The aperture and spacing of the grid electrode are optimized to effectively focus the ion beam, improving beam density and directionality. This generator achieves high-density ion beams under high vacuum, with concentrated kinetic energy of the incident ions, resulting in high sputtering yield. It is suitable for processes requiring high deposition rates or precise energy control. The grid structure has high mechanical strength, can withstand large plasma densities and accelerating electric fields, and is suitable for long-term continuous operation.

[0049] Regardless of which of the three generators the first surface treatment unit 6 is configured with, the energy of the first beam is set to 1 keV to 3 keV. This energy range is higher than the sputtering threshold of common metallic materials, ensuring an effective substrate atom sputtering yield. Similarly, the second and third surface treatment units 7 and 8 can be configured as a fast atom beam generator, a wide-beam ion beam generator, or a grid-type ion beam generator, depending on the characteristics of the second material 102 and the first material 101. Their beam energy is set to 1 keV to 2.5 keV, primarily acting on the breaking of chemical bonds in surface oxides and the desorption of impurities. In the same process, the actual set energy of the first beam is always greater than that of the second and third beams, ensuring that the first beam acts on the deep-layer cascade sputtering mechanism, while the second and third beams act on the surface cleaning mechanism.

[0050] In roll-to-roll continuous production, the first material 101 and the second material 102 pass through their respective surface treatment mechanisms at the same speed. The residence time is determined by both the conveyor belt speed and the beam coverage length. If the energy of the second or third beam is selected at a lower value, the desorption yield will decrease accordingly. The bombardment time can be increased by appropriately extending the beam coverage length or reducing the conveyor belt speed to accumulate sufficient cleaning dose. Conversely, if a higher energy value is selected, the desorption yield will increase, and the bombardment time can be shortened or the conveyor belt speed can be increased. The energy selection of the first beam also follows this coupling relationship: at 1 keV, the sputtering yield is near the threshold. If the conveyor belt speed is too fast and the residence time is too short, the energy of the first beam needs to be increased to 2 keV to 3 keV to increase the sputtering yield and ensure that sufficient deposition atomic flux is formed before the material reaches the pressing mechanism.

[0051] Specifically, the energy of the first beam can be 1.1keV, 1.2keV, 1.5keV, 1.8keV, 2keV, 2.2keV, 2.5keV, 2.8keV, or 3keV. The energies of the second and third beams are both lower than that of the first beam, and the specific values ​​are set according to the material properties. The energy ranges of the three beams overlap, and their functions are distinguished by the actual set values ​​in the same process: the first beam is used for bulk atomic sputtering, and the second and third beams are used for surface cleaning.

[0052] The first unwinding mechanism 2 is configured to provide a first material 101 with a first width, and the second unwinding mechanism 3 is configured to provide a second material 102 with a second width, wherein the first width is greater than the second width. This ensures that when the ion beam bombards the first material 101, the sputtered bulk atoms can completely cover the bonding surface of the second material 102 in a lateral distribution, avoiding bonding defects caused by insufficient deposition at the edges of the second material 102.

[0053] Furthermore, the device also includes a baffle 9 disposed in the direction of bulk atom detachment of the first material 101. The baffle 9 includes a passage area, the third width of which is equal to the second width. The baffle 9 is disposed in the space between the first material 101 and the second material 102 or near the second material 102, and is fixedly connected to the wall of the vacuum chamber 1. After the first material 101 is bombarded by the first beam, the bulk atoms are sputtered in all directions. The baffle 9 blocks sputtered atoms that deviate from the area of ​​the second material 102, allowing only atoms within the passage area to reach the surface of the second material 102. By setting the third width to be equal to the second width, the deposition area is precisely matched with the width of the second material 102, avoiding bulk atoms from depositing outside the area of ​​the second material 102, thus preventing material waste and chamber contamination. At the same time, it ensures that the second material 102 obtains uniform atomic deposition coverage throughout its width, improving material utilization and process cleanliness.

[0054] The bonding mechanism includes a first pressure roller 51 and a second pressure roller 52 with adjustable relative positions. The bonding pressure of the first pressure roller 51 and the second pressure roller 52 is 200 to 320 MPa. Below 200 MPa, the interface atoms cannot achieve sufficient plastic deformation and atomic diffusion depth, resulting in insufficient bonding strength; above 320 MPa, excessive deformation may lead to material work hardening, surface cracks, or dimensional deviations. The pressure range of 200-320 MPa, combined with the aforementioned surface activation and deposition treatment, enables high-strength metallurgical bonding with a relatively small total deformation. The adjustable relative positions of the pressure rollers facilitate adaptation to bonding materials of different thicknesses.

[0055] Both the first unwinding mechanism 2 and the second unwinding mechanism 3 are equipped with drive units, which are used to synchronously transport the first material 101 and the second material 102. During continuous roll-to-roll production, if the transport speeds of the first material 101 and the second material 102 are not synchronized, relative sliding or tensile differences will occur at the pressing mechanism, leading to shear stress, wrinkles, or delamination at the bonding interface. The drive units, through precise motor control and feedback mechanisms, ensure that the first material 101 and the second material 102 enter the pressing area at the same speed, remaining relatively stationary during the bonding process. The positive pressure applied by the pressing mechanism can act perpendicularly on the interface, maximizing bonding efficiency. Synchronous transport also ensures that the amount of bulk atoms detached from the bombarded area on the first material 101 matches the amount of deposition in the corresponding area on the second material 102, avoiding uneven deposition caused by asynchronous atomic deposition and material transport.

[0056] The equipment also includes a tensioning mechanism, configured between the first unwinding mechanism 2 and the pressing mechanism, and / or between the second unwinding mechanism 3 and the pressing mechanism. The tensioning mechanism is used to adjust the tension of the first material 101 and / or the second material 102. In roll-to-roll continuous production, the material travels a long path from unwinding to rewinding. If the material tension is unstable, it can cause wrinkles, shifts, or vibrations during transport. These unstable factors, when transmitted to the pressing mechanism, can cause uneven bonding pressure distribution, thus affecting the bonding quality. By adjusting the material tension in real time, the tensioning mechanism ensures that the first material 101 and the second material 102 maintain a constant tension and flatness before reaching the pressing mechanism. This ensures that both materials enter the pressing area in a stable posture, and the bonding pressure applied by the pressing mechanism is evenly distributed across the entire width of the material, avoiding localized unbonded areas or excessive deformation, thereby guaranteeing the consistency of roll bonding and the yield rate.

[0057] Vacuum chamber 1 is equipped with vacuum pump 11 to maintain the vacuum level within vacuum chamber 1. A high vacuum environment is a prerequisite for effective ion beam transmission and the maintenance of clean surfaces. Vacuum pump 11 continuously removes residual gases from the chamber, reduces the partial pressure of oxygen and water vapor, and inhibits the re-oxidation of the treated activated surfaces.

[0058] The first material 101 is one of Al, Cu, Ni, Ag, Au, Pd, Pb, Sn or an alloy, and the second material 102 is one of Al, Cu, Ni, Ag, Au, Pd, Pb, Sn, Ti, Mo or an alloy.

[0059] It should be noted that the specific structure of the first unwinding mechanism 2, the second unwinding mechanism 3, the winding mechanism 4, and the tensioning mechanism is not limited to a specific form. Those skilled in the art can select mature and feasible methods such as air shaft unwinding and swing roller tension adjustment based on existing technologies, as long as the corresponding unwinding, winding, and tension adjustment functions can be achieved.

[0060] Example 1

[0061] The roll bonding equipment was used to prepare copper-aluminum composite plates. The first material 101 was made of pure copper strip, 0.3 mm thick and 300 mm wide; the second material 102 was made of pure aluminum strip, 0.5 mm thick and 200 mm wide. The width of the first material 101 was greater than the width of the second material 102 to ensure that sputtering deposition completely covered the surface of the aluminum strip.

[0062] Both copper and aluminum strips underwent pretreatment before entering vacuum chamber 1. Copper strips were acid-washed with dilute sulfuric acid (10% by volume, room temperature, 30 seconds) to remove the original oxide layer, followed by rinsing with deionized water and drying with cold air. Aluminum strips were degreased with alkali (50g / L NaOH solution, 50°C, 60 seconds) to remove surface oil and the original oxide layer, followed by brightening with nitric acid (30% by volume, room temperature, 15 seconds) to neutralize residual alkali and obtain a bright surface, and finally rinsed with deionized water and dried with cold air. After pretreatment, only an extremely thin oxide layer (<2nm) was regenerated on the surface.

[0063] Copper strip is installed on the first unwinding mechanism 2, and aluminum strip is installed on the second unwinding mechanism 3. After the tension of both is adjusted by the tensioning mechanism, they enter the vacuum chamber 1, and the vacuum level is evacuated to 2×10⁻⁶. -3 Pa.

[0064] The first surface treatment unit 6 employs a fast atom beam generator. Argon gas is introduced into the plasma source, and argon plasma is formed through radio frequency excitation. A particle acceleration system applies an accelerating voltage of 2keV to extract an argon ion beam. After entering the charge exchange chamber, the argon ion beam undergoes charge exchange with the argon exchange gas inside, forming a first neutral atom beam with an energy of 2keV and a neutralization efficiency of approximately 95%. The third surface treatment unit 8 employs a fast atom beam generator with an accelerating voltage of 1keV to form a third neutral atom beam for pre-cleaning the surface of the copper strip. The second surface treatment unit 7 employs a fast atom beam generator with an accelerating voltage of 1.2keV to form a second neutral atom beam for cleaning the surface of the aluminum strip. The fast atom beam avoids charge accumulation during the stripping of the insulating oxide layer, ensuring stable cleaning. The charge exchange chamber pressure is 0.1 Pa, and the background vacuum degree of the processing chamber is 5 × 10⁻⁶. -4 Pa.

[0065] The first surface treatment mechanism 6 is 100 mm away from the surface of the copper strip, and the distance between the surfaces of the copper strip and the aluminum strip to be bonded is 100 mm. A baffle 9 is positioned in the direction of copper atom detachment, with a passing area width of 200 mm, matching the width of the aluminum strip, to screen the copper atom deposition area. Copper atoms are sputtered and detached under bombardment by a 2 keV first neutral atom beam, depositing on the surface of the aluminum strip with a deposition layer thickness of approximately 5 nm. The bonding mechanism uses a 250 MPa pressure roller to bond the copper atom, with a synchronous conveying speed of 1 m / min. The bonded composite material is then wound up by a winding mechanism 4.

[0066] Example 2

[0067] This roll bonding equipment is used to prepare stainless steel-copper composite plates to solve the problem of difficulty in welding copper and stainless steel due to their large difference in melting points and mismatch in thermal expansion coefficients. The first material 101 is stainless steel strip with a thickness of 0.4 mm and a width of 300 mm; the second material 102 is pure copper with a thickness of 0.6 mm and a width of 200 mm.

[0068] Stainless steel strip and copper strip are respectively installed on the first unwinding mechanism 2 and the second unwinding mechanism 3, and enter the vacuum chamber 1 after the tension is adjusted by the tensioning mechanism. Vacuum pump 11 evacuates the chamber to a vacuum level of 1×10⁻⁶. -3 Pa ensures a highly clean environment.

[0069] The first surface treatment unit 6 employs a grid-type ion beam generator. Argon gas is introduced into the plasma source, and argon plasma is formed by DC discharge. A grid-type ion extraction and acceleration system applies an accelerating voltage of 3keV, and a high-density argon ion beam is extracted through a porous molybdenum grid electrode as the first beam. The third surface treatment unit 8 employs a grid-type ion beam generator with an accelerating voltage of 1.5keV to form a third ion beam that cleans the surface of stainless steel strip and removes the chromium oxide passivation film. The second surface treatment unit 7 employs a grid-type ion beam generator with an accelerating voltage of 1keV to form a second ion beam that cleans the surface of copper strip and removes the cuprous oxide layer. Stainless steel and copper are both highly conductive metals, and surface charges can be rapidly discharged. The high beam current density of the grid-type ion beam ensures cleaning and sputtering efficiency. The background vacuum of the processing chamber is 2×10⁻⁶. -4 Pa.

[0070] The first surface treatment unit 6 is 150 mm away from the surface of the stainless steel strip, and the distance between the surfaces of the stainless steel strip and the copper strip to be bonded is 150 mm. The baffle 9 has a passage width of 200 mm, matching the width of the copper strip. Iron, chromium, and nickel atoms in the stainless steel are sputtered off under bombardment by a 3keV first ion beam and deposited on the surface of the copper strip, with a deposition layer thickness of approximately 8 nm. The bonding unit uses a 280 MPa pressure roller to bond the strip, with a synchronous conveying speed of 0.8 m / min. The bonded composite material is then wound up by the winding unit 4.

[0071] It should be noted that the present invention is illustrated through the above embodiments, but the present invention is not limited to the above process steps, that is, it does not mean that the present invention must rely on the above process steps to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions of the raw materials used in the present invention, additions of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A roll bonding machine, characterized in that, include: Vacuum chamber (1), and a first unwinding mechanism (2), a second unwinding mechanism (3), a winding mechanism (4), a pressing mechanism (5), a first surface treatment mechanism (6) and a second surface treatment mechanism (7) disposed in the vacuum chamber (1); The first unwinding mechanism (2) is used to provide the first material (101); the second unwinding mechanism (3) is used to provide the second material (102). The first surface treatment mechanism (6) is disposed between the first unwinding mechanism (2) and the second unwinding mechanism (3), and its working direction is toward the first unwinding mechanism (2). Along the feeding direction, the second surface treatment mechanism (7) is located upstream of the first surface treatment mechanism (6), and its working direction is toward the second unwinding mechanism (3). The first surface treatment mechanism (6) is used to emit a first beam to bombard the surface of the first material (101), causing the bulk atoms of the first material (101) to detach and be deposited on the surface of the second material (102) before pressing; The second surface treatment mechanism (7) is used to emit a second beam to bombard the surface of the second material (102) and remove impurities from the surface of the second material (102) before the bulk atoms of the first material (101) are deposited on the surface of the second material (102); The energy of the first beam emitted by the first surface treatment mechanism (6) is greater than the energy of the second beam emitted by the second surface treatment mechanism (7); The pressing mechanism (5) is used for roll bonding of the surface-treated first material (101) and the second material (102). The winding mechanism (4) is used to wind up the composite material after roll bonding.

2. The roll bonding equipment according to claim 1, characterized in that, It also includes a third surface treatment mechanism (8), which is located upstream of the first surface treatment mechanism (6) along the feeding direction and has its working direction facing the first unwinding mechanism (2). The third surface treatment mechanism (8) is used to fire a third beam to bombard the surface of the first material (101) and remove impurities from the surface of the first material (101) before the first beam bombards the surface of the first material (101).

3. The roll bonding equipment according to claim 1, characterized in that, It also includes a tensioning mechanism disposed between the first unwinding mechanism (2) and the pressing mechanism (5), and / or between the second unwinding mechanism (3) and the pressing mechanism (5), the tensioning mechanism being used to adjust the tension of the first material (101) and / or the second material (102).

4. The roll bonding equipment according to claim 1, characterized in that, The first unwinding mechanism (2) is configured to provide a first material (101) having a first width; the second unwinding mechanism (3) is configured to provide a second material (102) having a second width, wherein the first width is greater than the second width.

5. The roll bonding equipment according to claim 4, characterized in that, It also includes a baffle (9) disposed in the bulk atom detachment direction of the first material (101); The baffle (9) includes a passage area having a third width, the third width being not less than the second width.

6. The roll bonding equipment according to claim 1, characterized in that, The pressing mechanism (5) includes a first pressure roller (51) and a second pressure roller (52) with adjustable relative positions, and the bonding pressure of the first pressure roller (51) and the second pressure roller (52) is 200-320 MPa.

7. The roll bonding equipment according to claim 1, characterized in that, Both the first unwinding mechanism (2) and the second unwinding mechanism (3) are equipped with a drive unit, which is used to synchronously transport the first material (101) and the second material (102).

8. The roll bonding equipment according to claim 1, characterized in that, The first surface treatment mechanism (6) is a fast atomic beam generator, a wide beam ion beam generator or a grid-type ion beam generator, and the first beam is an ion beam or a neutral atomic beam.

9. The roll bonding equipment according to claim 2, characterized in that, The energy of the first beam emitted by the first surface treatment mechanism (6) is greater than the energy of the third beam emitted by the third surface treatment mechanism (8).

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