A film wrapping system and method for dust-free ceramic dry abrasive paper

Abstract

The present application belongs to the technical field of abrasive paper production, and particularly relates to a film-coating packaging system and method for dust-free ceramic dry abrasive paper. The system is provided with a pre-assembly mechanism, an abrasive paper feeding mechanism, an isolation pad feeding mechanism and a film-coating packaging mechanism which work cooperatively. The abrasive paper feeding mechanism and the isolation pad feeding mechanism respectively realize precise single-layer and non-adhesion quantitative feeding of materials, and the precise alignment of materials is completed through a positioning structure. The pre-assembly mechanism uses vacuum adsorption and mechanical pressure to complete the pre-assembly of double abrasive paper clamping isolation pads, thereby avoiding direct frictional damage of the abrasive layer. The film-coating packaging mechanism adopts circumferential annular glue coating and solidification forming to form a ring-shaped film. The present application can effectively solve the problems of sand dropping, scratching and dust staining during the packaging process of high-hardness ceramic abrasive paper, thereby ensuring the use performance of the dust-free abrasive paper and greatly reducing the cost of film-coating packaging consumables. The automatic assembly and film-coating operation has high efficiency and high alignment precision, and is suitable for batch standardized packaging production of high-precision dust-free ceramic dry abrasive paper.

Description

Technical Field

[0001] This invention belongs to the field of sandpaper production technology, specifically relating to a film-coating packaging system and method for dust-free ceramic dry sandpaper. Background Technology

[0002] Traditional ceramic dry sandpaper suffers from problems such as excessive sanding dust and short lifespan. To address these issues, our company has developed a dust-free ceramic dry sandpaper, which consists of a flocked backing layer, a resin bonding layer, and an abrasive layer. The abrasive layer uses sintered microcrystalline alumina, which is self-sharpening; as the abrasive becomes dull, the microcrystalline particles automatically break down, continuously creating new cutting edges, resulting in sustained cutting power and a long lifespan. This dust-free ceramic dry sandpaper is widely used in high-precision, dust-free processing scenarios such as automotive bodywork and painting, precision paint polishing, and high-end wood sanding.

[0003] In the aforementioned production process of dust-free ceramic dry sandpaper, due to the high hardness and sharp edges of ceramic abrasives, the sandpaper stacking and friction can easily cause abrasive shedding and scratches on the dust-free coating. Finished products must be completely isolated from workshop dust and metal shavings before leaving the factory; once exposed and contaminated with impurities, they directly lose their dust-free sanding value. Therefore, packaging is necessary.

[0004] The existing coating and packaging system for dry ceramic sandpaper has some shortcomings. First, its abrasive layer is hard and sharp, and directly coating the surface of the abrasive layer is prone to wear and cannot provide effective protection for the abrasive layer. Second, its coating area is large, resulting in high overall coating costs.

[0005] In view of this, the inventors aim to provide an improved coating packaging system and method for dust-free dry ceramic sandpaper. Summary of the Invention

[0006] The purpose of this invention is to overcome the above-mentioned problems in the prior art and provide a film-coating packaging system and method for dust-free ceramic dry sanding paper.

[0007] To achieve the above-mentioned technical objectives and effects, the present invention is implemented through the following technical solution: This invention provides a film-coating packaging system for dust-free ceramic dry sanding paper, comprising: A pre-assembly mechanism for filling a spacer between two pressed clean ceramic dry sandpapers, the two clean ceramic dry sandpapers and the spacer together forming a pre-assembly; A sandpaper feeding mechanism is provided at the front of the pre-assembly mechanism and is used to provide dust-free ceramic dry sandpaper to the pre-assembly mechanism. The dust-free ceramic dry sandpaper includes a sandpaper body and a chip removal groove is formed on the sandpaper body. An isolation pad feeding mechanism is provided on the rear side of the pre-assembly mechanism for providing isolation pads to the pre-assembly mechanism. The isolation pad includes an isolation pad body with a ring of positioning protrusions on the isolation pad body. The outer diameter of the positioning protrusions matches the diameter of the chip removal groove. The positioning protrusions protrude from both sides of the isolation pad body, and the height of the protrusions is equal to half the depth of the chip removal groove. A film-coating packaging mechanism is located above the pre-assembly mechanism and is used to apply adhesive to the periphery of the pre-assembled parts. The adhesive cures at room temperature to form a ring-shaped film.

[0008] Furthermore, in the above-mentioned dust-free ceramic dry sandpaper coating and packaging system, the sandpaper body is composed of a flocked backing layer, a resin bonding layer and an abrasive layer in sequence, wherein the abrasive layer is made of sintered microcrystalline ceramic alumina.

[0009] Furthermore, in the above-mentioned dust-free ceramic dry sandpaper film packaging system, the isolation pad is made of injection molding material through an injection molding process.

[0010] Furthermore, in the aforementioned dust-free ceramic dry sanding paper coating packaging system, the pre-assembly mechanism includes a base plate, a rotary driver, a turntable, a central lifting push rod, a carrier block, a positioning shaft, a side lifting push rod, a lower ear plate, a support plate, an upper ear plate, a support sleeve, a vertical flip motor, a carrier plate, a positioning ring, and an annular suction cup. The base plate is supported by the rotary driver on the turntable. A central lifting push rod is installed at the center of the upper side of the turntable. The movable end of the central lifting push rod is supported by the positioning shaft via the carrier block. Side lifting push rods are symmetrically installed on the upper side of the turntable about the central lifting push rod. The movable end of the side lifting push rod supports the lower ear plate. An upper ear plate is installed on the lower side of the support plate and hinged to the corresponding lower ear plate. The inner end of the support plate is provided with a support sleeve sleeved outside the positioning shaft. The outer end of the support plate is supported by the vertical flip motor on the carrier plate. An annular suction cup is installed on one side of the carrier plate. The other side of the carrier plate is provided with a positioning ring that matches the position of the chip removal groove and several suction holes communicating with the suction cavity of the annular suction cup.

[0011] Furthermore, in the above-mentioned dust-free ceramic dry sandpaper coating and packaging system, the specifications of the adsorption area of ​​the carrier disk are matched with the specifications of the sandpaper body, the outer diameter of the positioning ring is matched with the diameter of the chip removal groove, the positioning ring protrudes from the side of the carrier disk, and the height of the protruding part is equal to half the depth of the chip removal groove; the inner diameter of the positioning ring is matched with the outer diameter of the positioning protrusion tube.

[0012] Furthermore, in the aforementioned dust-free ceramic dry sandpaper coating and packaging system, both the sandpaper feeding mechanism and the isolation pad feeding mechanism include a material cylinder, a lead screw support, a lead screw motor, a lead screw, a movable support plate, a positioning rod, and an anti-adhesion scraper. One side of the material cylinder has an axial groove, and a lead screw support is installed on the outer side of the axial groove. A lead screw motor is installed at the top of the lead screw support, and a lead screw is installed at the output end of the lead screw motor. A movable support plate with restricted rotation is sleeved on the outer side of the lead screw. A positioning rod is fixed to the inner side of the bottom plate of the material cylinder, and the top surface of the positioning rod is flush with the opening surface of the material cylinder. An annular anti-adhesion scraper is installed on the inner side of the opening surface of the material cylinder, and the annular width of the anti-adhesion scraper is 2–4 mm.

[0013] Furthermore, in the above-mentioned dust-free ceramic dry sanding paper coating packaging system, the movable pallet is composed of a circular plate portion and a convex plate portion located at its outer edge. The convex plate portion is provided with a lead screw groove that cooperates with a lead screw, and the circular plate portion is provided with a sliding hole that cooperates with a positioning rod.

[0014] Furthermore, in the aforementioned film packaging system for dust-free ceramic dry sandpaper, in the sandpaper feeding mechanism, the diameter of the cylindrical inner cavity of the barrel matches the outer diameter of the sandpaper body, the diameter of the positioning rod matches the diameter of the chip removal groove, and the pitch of the lead screw is equal to the thickness of a single layer of dust-free ceramic dry sandpaper; in the isolation pad feeding mechanism, the diameter of the cylindrical inner cavity of the barrel matches the outer diameter of the isolation pad body, the diameter of the positioning rod matches the inner diameter of the positioning protrusion, and the pitch of the lead screw is equal to the thickness of the isolation pad.

[0015] Furthermore, in the aforementioned dust-free ceramic dry sanding paper laminating and packaging system, the laminating and packaging mechanism includes a base plate, a height adjustment push rod, a carrier frame, a horizontal flipping motor, a drive gear, a driven gear, a central suspension shaft, a rotating plate, an end suspension shaft, a nozzle, a glue-applying roller, a glue tank, a pumping hose, and a guide pipe. The carrier frame is supported on the lower side of the base plate via the height adjustment push rod. The carrier frame internally supports a meshing drive gear and a driven gear. A horizontal flipping mechanism for driving the drive gear to rotate is installed on the lower side of the carrier frame. The motor has a frame with a rotary joint installed inside the driven gear. The rotating ring of the rotary joint is connected to a central suspension shaft fixed to the driven gear. The fixed ring of the rotary joint is connected to a glue tank fixed to the lower side of the base plate via a pumping hose. The inner end of the rotating plate is fixed to the outer side of the central suspension shaft. The outer end of the rotating plate is movably supported by an end suspension shaft. A nozzle with a glue-applying roller is installed at the bottom end of the end suspension shaft. A guide pipe connecting the inner cavities of the central suspension shaft and the end suspension shaft is connected.

[0016] This invention also provides a method for laminating and packaging dust-free dry ceramic sanding paper, based on the aforementioned dust-free dry ceramic sanding paper laminating and packaging system, comprising the following steps: S1. Dust-free ceramic dry sandpaper is fed through the sandpaper feeding mechanism. The positioning rod inside the barrel and the chip removal groove of the sandpaper body are used to complete the precise positioning. At the same time, the isolation pad is fed through the isolation pad feeding mechanism. The positioning rod and the inner diameter of the positioning convex tube of the isolation pad are used to achieve alignment and limit. During the feeding process, the anti-sticking scraper is used to prevent the material from sticking and ensure that the material is fed one layer at a time. S2. The pre-assembly mechanism drives the carrier tray to rotate vertically via a vertical flip motor, so that the positioning ring faces downwards. The rotary drive is activated, so that the two carrier trays are positioned above the sandpaper feeding mechanism in sequence. The dust-free ceramic dry sandpaper is adsorbed and fixed by the annular suction cups on the carrier trays. The rotary drive is activated, so that one of the carrier trays is positioned above the isolation pad feeding mechanism. An isolation pad is received on the outside of the dust-free ceramic dry sandpaper, and the positioning protrusion of the isolation pad is inserted into the chip removal groove. Then, the carrier tray is rotated vertically again by the vertical flip motor. The two carrier trays are pressed against each other by the lifting of the central lifting push rod and the side lifting push rod. After the pre-assembled parts are aligned and assembled, the annular suction cup on one of the carrier trays is released, so that the pre-assembled parts are adsorbed on the carrier tray located below the film packaging mechanism. S3. The film-coating packaging mechanism adjusts the glue application height by adjusting the push rod to match the specifications of the pre-assembled parts. The glue is delivered to the nozzle through the glue tank, pump hose and guide pipe. At the same time, the horizontal flipping motor drives the drive gear and driven gear to mesh and drive the central suspension shaft, rotating plate and end suspension shaft to rotate around the pre-assembled parts. The glue application roller is used to evenly apply glue to the periphery of the pre-assembled parts to form a closed ring film around the periphery of the pre-assembled parts.

[0017] The beneficial effects of this invention are: 1. This invention addresses the characteristics of dust-free ceramic dry sandpaper, such as high abrasive layer hardness, sharp edges, easy sand shedding during stacking, and easy scratching of the sanding surface. It innovatively adopts a pre-assembled structure with a double sandpaper clamping isolation pad. The positioning protrusions of the isolation pad precisely engage with the sandpaper chip removal groove, forming a stable and protective isolation space between the abrasive layers of the two sandpapers. This completely avoids the problems of sand shedding and scratching caused by mutual friction and compression between the abrasive layers during sandpaper stacking, transportation, and coating. Simultaneously, it abandons the existing method of overall coating, adopting a peripheral adhesive coating and curing to form a ring-shaped coating encapsulation structure. This not only completely isolates the sandpaper from workshop dust, metal shavings, and other impurities, ensuring the dust-free grinding performance of the dust-free ceramic dry sandpaper and preventing the finished product from losing its usability due to impurities, but also precisely avoids wear on the abrasive layer surface coating, providing comprehensive and effective protection for the core working layer of the sandpaper and significantly improving the yield rate of the finished product.

[0018] 2. Existing packaging processes require large-area lamination of the entire sandpaper surface, resulting in high consumption of lamination materials and persistently high packaging costs. This invention eliminates the need for lamination of the entire sandpaper, applying adhesive and lamination only to the periphery of the pre-assembled components. This significantly reduces the lamination area, greatly decreasing the consumption of lamination materials such as adhesive, and effectively lowering the packaging production cost per sheet of sandpaper. Simultaneously, the ring-shaped lamination structure simplifies the lamination process, eliminating the need to adapt to complex equipment parameters for large-area lamination. Equipment operating energy consumption and maintenance costs are simultaneously reduced. While ensuring packaging protection and product performance, this significantly optimizes production costs and enhances the efficiency of large-scale production and market competitiveness.

[0019] 3. This invention achieves automated alignment and assembly through a multi-dimensional precision positioning structure. The sandpaper feeding mechanism uses a positioning rod to match and position the sandpaper chip removal groove, while the isolation pad feeding mechanism uses a positioning rod to limit the inner diameter of the isolation pad positioning protrusion. This ensures precise alignment and delivery of the sandpaper and isolation pad, eliminating feeding offset and misalignment issues. Simultaneously, the pre-assembly mechanism's carrier plate positioning ring adapts layer by layer with the sandpaper chip removal groove and the isolation pad positioning protrusion. Combined with the stable adsorption and fixation of the annular suction cup, it can accurately complete the pre-assembly of the double sandpaper and isolation pad under pressure, resulting in uniform assembly gaps and high alignment accuracy. The entire mechanism has precisely matched parameters, enabling standardized and consistent assembly operations. This completely solves the problems of large deviations and inconsistent finished product specifications that exist in manual assembly or simple equipment assembly, significantly improving the standardization of product packaging.

[0020] 4. This invention optimizes the entire process of material feeding, pre-assembly, and lamination. The material feeding mechanism is equipped with an anti-adhesion scraper, which effectively prevents sandpaper and release pad materials from sticking and jamming, ensuring stable, single-layer, one-by-one material delivery with high continuous feeding stability and low failure rate. The pre-assembly mechanism, through the coordinated operation of a rotary drive, multiple sets of lifting push rods, and a tilting motor, can automatically complete the entire process of material adsorption, alignment, assembly, and unloading without manual intervention, achieving a high degree of automation and significantly improving packaging production efficiency. Simultaneously, the lamination packaging mechanism can flexibly adjust the adhesive application height by raising the push rods, adapting to different specifications of dust-free ceramic dry sandpaper pre-assembled parts. Combined with gear meshing transmission, it achieves uniform circumferential rotary adhesive application, resulting in uniform adhesive thickness and good lamination sealing, effectively ensuring the sealing and protective effect of the lamination. Furthermore, the equipment has wide adaptability and strong versatility, meeting the needs of large-scale mass production.

[0021] 5. The annular, sealed film structure formed by this invention, combined with the support and protection of the intermediate isolation pad, makes the overall structure of the packaged sandpaper product stable, significantly improving its resistance to compression, friction, and contamination. During subsequent storage, transportation, and distribution, it can effectively resist contamination from external environmental impurities and mechanical impacts and wear, continuously ensuring the dust-free sanding performance and the integrity of the abrasive layer, greatly extending the shelf life of the finished product, reducing product storage and transportation losses, and further improving product quality and reliability.

[0022] Of course, any product implementing this invention does not necessarily need to achieve all of the above advantages at the same time. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the pre-assembled component in this invention; Figure 3 This is an exploded view of the pre-assembled component in this invention; Figure 4 This is a schematic diagram of the pre-assembly mechanism in the present invention. Figure 1 ; Figure 5 This is a schematic diagram of the pre-assembly mechanism in the present invention. Figure 2 ; Figure 6 This is a schematic diagram of the pre-assembly mechanism in the present invention. Figure 3 ; Figure 7 This is a diagram showing the usage state of the sandpaper feeding mechanism in this invention; Figure 8 This is a schematic diagram of the sandpaper feeding mechanism in this invention; Figure 9 This is a schematic diagram of the movable tray in the present invention; Figure 10 This is a schematic diagram of the isolation pad feeding mechanism in this invention; Figure 11 This is a schematic diagram of the film-coating packaging mechanism in the present invention. Figure 1 ; Figure 12 This is a schematic diagram of the film-coating packaging mechanism in the present invention. Figure 2 ; In the attached diagram, the components represented by each number are as follows: 1-Pre-assembly mechanism, 101-Base plate, 102-Rotary drive, 103-Turntable, 104-Central lifting push rod, 105-Carrier block, 106-Positioning shaft, 107-Side lifting push rod, 108-Lower ear plate, 109-Support plate, 110-Upper ear plate, 111-Support sleeve, 112-Vertical tilting motor, 113-Carrier plate, 114-Positioning ring, 115-Annular suction cup, 116-Suction hole; 2-Sandpaper feeding mechanism, 201-Cylinder, 202-Screw support, 203-Screw motor, 204-Screw, 205-Modible support plate, 2051-Protruding plate, 2052-Circular plate, 2053-Screw groove, 2054-Sliding hole, 206-Positioning rod, 207-Anti-sticking scraper; 3-Isolation mat feeding mechanism; 4-Laminated packaging mechanism, 401-Base plate, 402-Height adjustment push rod, 403-Carrier frame, 404-Horizontal flipping motor, 405-Drive gear, 406-Driven gear, 407-Central suspension shaft, 408-Turn plate, 409-End suspension shaft, 410-Spray nozzle, 411-Glue roller, 412-Glue tank, 413-Pumping hose, 414-Guide pipe; 5-Dust-free ceramic dry sandpaper, 501-Sandpaper body, 502-Chip removal groove; 6-Isolation pad, 601-Isolation pad body, 602-Positioning protrusion tube. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] like Figures 1-3 As shown, this embodiment provides a film-coating packaging system for cleanroom ceramic dry sanding paper, including a pre-assembly mechanism 1, a sanding paper feeding mechanism 2, a spacer pad feeding mechanism 3, and a film-coating packaging mechanism 4. The pre-assembly mechanism 1 is used to fill a spacer pad 6 between two pressed cleanroom ceramic dry sanding papers 5, the two cleanroom ceramic dry sanding papers 5 and the spacer pad 6 together forming a pre-assembled component; the sanding paper feeding mechanism 2 is located at the front of the pre-assembly mechanism 1, and is used to supply the cleanroom ceramic dry sanding paper 5 to the pre-assembly mechanism 1. The cleanroom ceramic dry sanding paper 5 includes a sanding paper body 501, and a ring of chip removal grooves 502 is formed on the sanding paper body 501; the spacer pad feeding mechanism 3 is located at the rear of the pre-assembly mechanism 1, and is used to supply the spacer pad to the pre-assembly mechanism 1. Structure 1 provides an isolation pad 6, which includes an isolation pad body 601. The isolation pad body 601 is provided with a ring of positioning protrusions 602. The outer diameter of the positioning protrusions 602 matches the diameter of the chip removal groove 502. The positioning protrusions 602 protrude from both sides of the isolation pad body 601, and the height of the protrusions is equal to half the depth of the chip removal groove 502. The film-coating packaging mechanism 4 is located above the pre-assembly mechanism 1 and is used to apply adhesive to the periphery of the pre-assembled parts. After the adhesive cures at room temperature, it forms a ring-shaped film.

[0027] In this embodiment, the sandpaper body 501 is composed of a flocked backing layer, a resin bonding layer and an abrasive layer in sequence, wherein the abrasive layer is made of sintered microcrystalline ceramic alumina.

[0028] In this embodiment, the isolation pad 6 is made of injection molding material through an injection molding process.

[0029] like Figures 4-6 As shown, the pre-assembly mechanism 1 includes a base plate 101, a rotary driver 102, a turntable 103, a central lifting push rod 104, a carrier block 105, a positioning shaft 106, a side lifting push rod 107, a lower ear plate 108, a support plate 109, an upper ear plate 110, a support sleeve 111, a vertical tilting motor 112, a carrier plate 113, a positioning ring 114, and an annular suction cup 115. The turntable 103 is supported on the base plate 101 by the rotary driver 102. The central lifting push rod 104 is installed at the upper center of the turntable 103. The movable end of the central lifting push rod 104 is supported by the positioning shaft 106 via the carrier block 105. A side lifting push rod 107 is symmetrically installed on the upper side of the turntable 103 about the central lifting push rod 104. The movable end of the side lifting push rod 107 supports a lower ear plate 108. An upper ear plate 110 is installed on the lower side of the support plate 109 and is hinged to the corresponding lower ear plate 108. The inner end of the support plate 109 is provided with a support sleeve 111 sleeved on the outside of the positioning shaft 106. The outer end of the support plate 109 is supported by a carrier plate 113 via a vertical flipping motor 112. An annular suction cup 115 is installed on one side of the carrier plate 113. The other side of the carrier plate 113 is provided with a positioning ring 114 that matches the position of the chip removal groove 502 and several suction holes 116 that communicate with the suction chamber of the annular suction cup 115.

[0030] In this embodiment, the specifications of the adsorption area of ​​the carrier disk 113 are matched with the specifications of the sandpaper body 501, the outer diameter of the positioning ring 114 is matched with the diameter of the chip removal groove 502, the positioning ring 114 protrudes from the side of the carrier disk 113, and the height of the protruding part is equal to half the depth of the chip removal groove 502; the inner diameter of the positioning ring 114 is matched with the outer diameter of the positioning protrusion 602.

[0031] The pre-assembly mechanism 1 is the key to achieving precise alignment and pressing of the dust-free ceramic dry sandpaper 5 and the isolation pad 6. Through four core actions—rotational repositioning, vacuum adsorption, precise alignment, and adaptive pressing—it stably assembles two pieces of dust-free ceramic dry sandpaper 5 and the intermediate isolation pad 6 into a single pre-assembled component. This completely solves the problems of sandpaper stacking and sanding, abrasive layer scratches, and alignment deviations in traditional sandpaper manufacturing, providing a neat workpiece for subsequent coating processes. In the initial state of the equipment, the rotary driver 102 can drive the turntable 103 to rotate horizontally, causing the two symmetrically arranged carrier trays 113 on the turntable 103 to sequentially switch to the sandpaper feeding, isolation pad feeding, and coating processing stations, realizing cyclical alternation of workstations and improving assembly efficiency. The vertical flipping motor 112 can drive the carrier tray 113 to complete a 90° vertical flip, switching the orientation of the adsorption surface and positioning surface of the carrier tray 113 to adapt to the different process requirements of material picking, assembly, and unloading. During the material handling stage, the carrier plate 113 is flipped so that the positioning ring 114 faces downwards. The annular suction cup 115 is activated to generate negative pressure adsorption force, accurately picking up the dust-free ceramic dry sandpaper 5 pushed out by the sandpaper feeding mechanism 2. The outer diameter of the positioning ring 114 on the carrier plate 113 matches the diameter of the sandpaper chip removal groove 502, and the protrusion height is half the depth of the chip removal groove 502. During material handling, the positioning ring 114 is embedded inside the chip removal groove 502, achieving secondary precise positioning of the dust-free ceramic dry sandpaper 5 and preventing sandpaper adsorption deviation and loosening. After picking up the sandpaper, the turntable 103 returns to its original position, and the carrier plate 113 carries the dust-free ceramic dry sandpaper 5 to the upper part of the isolation pad feeding mechanism 3. It precisely aligns with the isolation pad 6, so that the positioning protrusions 602 on both sides of the isolation pad 6 are respectively inserted into the chip removal grooves 502 of the upper and lower dust-free ceramic dry sandpaper 5. By utilizing the high-precision matching relationship between the positioning protrusions 602 and the chip removal grooves 502, the dust-free ceramic dry sandpaper 5 and the isolation pad 6 are aligned without deviation. At the same time, the positioning structure supports the abrasive layer of the two sandpapers, avoiding direct contact friction between the abrasive layers and the resulting sand shedding and scratches.

[0032] After alignment, the vertical flipping motor 112 drives the carrier plate 113 to reset again. The central lifting push rod 104 and the symmetrically arranged side lifting push rods 107 extend and retract synchronously, driving the two sets of support plates 109 and the carrier plate 113 to press smoothly against each other, achieving a tight fit between the dust-free ceramic dry sandpaper 5 and the isolation pad 6, forming a structurally stable pre-assembled part. After the pressing assembly is completed, the single-sided annular suction cup 115 releases the negative pressure adsorption, and the pre-assembled part is stably adsorbed on the other side carrier plate 113. It is then transported by the turntable 103 to the bottom of the film packaging mechanism 4, completing the pre-assembly process. The sleeve 111 and the positioning shaft 106 are fitted together to ensure the coaxiality of the lifting and pressing process, prevent pressing deviation, and improve the pre-assembly accuracy.

[0033] like Figures 7-10As shown, both the sandpaper feeding mechanism 2 and the isolation pad feeding mechanism 3 include a material cylinder 201, a screw support 202, a screw motor 203, a screw 204, a movable support plate 205, a positioning rod 206, and an anti-adhesion scraper 207. An axial groove is provided on one side of the material cylinder 201, and a screw support 202 is installed on the outer side of the axial groove. A screw motor 203 is installed at the top of the screw support 202, and a screw 204 is installed at the output end of the screw motor 203. A movable support plate 205 with restricted rotation is sleeved on the outer side of the screw 204. A positioning rod 206 is fixed to the inner side of the bottom plate of the material cylinder 201, and the top surface of the positioning rod 206 is flush with the opening surface of the material cylinder 201. An annular anti-adhesion scraper 207 is installed on the inner side of the opening surface of the material cylinder 201, and the width of the annular anti-adhesion scraper 207 is 2–4 mm.

[0034] In this embodiment, the movable support plate 205 is composed of a circular plate portion 2052 and a convex plate portion 2051 provided at its outer edge. The convex plate portion 2051 has a screw groove 2053 that cooperates with the screw 204, and the circular plate portion 2052 has a sliding hole 2054 that cooperates with the positioning rod 206.

[0035] In the sandpaper feeding mechanism 2, the cylindrical inner diameter of the barrel 201 matches the outer diameter of the sandpaper body 501, the diameter of the positioning rod 206 matches the diameter of the chip discharge groove 502, and the pitch of the lead screw 204 is equal to the thickness of the single-layer dust-free ceramic dry sandpaper 5. In the isolation pad feeding mechanism 3, the cylindrical inner diameter of the barrel 201 matches the outer diameter of the isolation pad body 601, the diameter of the positioning rod 206 matches the inner diameter of the positioning protrusion 602, and the pitch of the lead screw 204 is equal to the thickness of the isolation pad 6.

[0036] The working principle of the sandpaper feeding mechanism 2: Stacked dust-free ceramic dry sandpaper 5 is placed inside the cylinder 201. The inner diameter of the cylinder 201 is precisely matched with the outer diameter of the sandpaper body 501, achieving overall radial limiting of the sandpaper and preventing radial offset during transportation. The positioning rod 206 fixed at the bottom of the cylinder 201 is precisely aligned with the chip removal groove 502 of the sandpaper body 501. The circumferential positioning of each piece of dust-free ceramic dry sandpaper 5 is completed through physical insertion, completely eliminating the problem of sandpaper angle deflection and misalignment, and ensuring the subsequent docking accuracy of the isolation pad 6. The lead screw motor 203 is the core power output component, driving the lead screw 204 to rotate at a constant speed. The movable support plate 205, which cooperates with the lead screw 204, can only perform vertical linear lifting and lowering movements due to the limitation of the positioning structure, without rotational offset. Based on the structural design where the pitch of the lead screw 204 is equal to the thickness of a single layer of dust-free ceramic dry sanding paper 5, the movable support plate 205 precisely rises the distance of a single layer of sanding paper with each rotation of the lead screw 204, achieving quantitative ejection of a single sheet of dust-free ceramic dry sanding paper 5 at a time, eliminating the situation of multiple sheets being fed together. The annular anti-sticking scraper 207 set at the opening of the material cylinder 201 has a width controlled between 2 and 4 mm, which can flexibly scrape off the edges of the ejected dust-free ceramic dry sanding paper 5, breaking the electrostatic adsorption and slight adhesion force caused by the stacking of sanding paper, preventing sanding paper from sticking and remaining at the port of the material cylinder 201, ensuring that only a single sheet of dust-free ceramic dry sanding paper 5 is successfully removed each time, continuously and stably supplying the pre-assembly mechanism 1, and ensuring the continuity and consistency of the production line feeding.

[0037] The working principle of the isolation mat feeding mechanism 3 is the same as that of the sandpaper feeding mechanism 2.

[0038] like Figures 11-12 As shown, the film-coating packaging mechanism 4 includes a base plate 401, a height adjustment push rod 402, a carrier frame 403, a horizontal tilting motor 404, a drive gear 405, a driven gear 406, a central suspension shaft 407, a rotating plate 408, an end suspension shaft 409, a nozzle 410, an adhesive roller 411, an adhesive tank 412, a pumping hose 413, and a guide pipe 414. The carrier frame 403 is supported on the lower side of the base plate 401 by the height adjustment push rod 402. The drive gear 405 and the driven gear 406 are movably supported inside the carrier frame 403. A horizontal tilting motor for driving the drive gear 405 to rotate is installed on the lower side of the carrier frame 403. Machine 404, frame 403 is located inside driven gear 406 and a rotary joint is installed. The rotating ring of the rotary joint is connected to a central suspension shaft 407 fixed to driven gear 406. The fixed ring of the rotary joint is connected to a glue tank 412 fixed to the lower side of base plate 401 via pump hose 413. The inner end of rotating plate 408 is fixed to the outer side of central suspension shaft 407. The outer end of rotating plate 408 is movably supported by end suspension shaft 409. The bottom end of end suspension shaft 409 is equipped with a nozzle 410 with glue-applying roller sleeve 411. A guide pipe 414 connects the inner cavities of central suspension shaft 407 and end suspension shaft 409.

[0039] The lamination packaging mechanism 4 abandons the traditional full-surface lamination mode and adopts a circumferential ring-shaped adhesive coating process. Through the coordinated operation of height adaptive adjustment, gear rotation, and uniform adhesive application, a closed ring-shaped protective film is formed on the outer periphery of the pre-assembled parts. This not only seals the ends of the sandpaper to prevent dust, sandpaper shedding, and scratches, but also significantly reduces the cost of lamination consumables, making it suitable for the packaging needs of high-hardness ceramic abrasive sandpaper. In the initial stage of operation, the height adjustment push rod 402 can adjust the vertical height of the carrier frame 403 according to the overall thickness and specifications of the pre-assembled parts, precisely matching the adhesive application position, adapting to sandpaper pre-assembled parts of different sizes and specifications, and ensuring accurate adhesive application and uniform film thickness. The adhesive tank 412 is the core component for storing room-temperature curing special adhesive. The adhesive is delivered to the fixed ring of the rotary joint via the pump hose 413, then guided through the moving ring of the rotary joint into the internal flow channel of the central suspension shaft 407, and then diverted through the guide pipe 414 to the end suspension shaft 409, finally being delivered to the nozzle 410 and the coating roller 411, forming a complete and sealed adhesive delivery channel. During the coating operation, the horizontal tilting motor 404 drives the drive gear 405 to rotate, which in turn drives the meshing driven gear 406 to rotate at a constant speed. Relying on the precise synchronization of the gear transmission, the central suspension shaft 407, the rotating plate 408, and the end suspension shaft 409 are driven to rotate in a circular motion around the periphery of the pre-assembled part. During the rotation, the coating roller 411 flexibly fits against the peripheral wall of the pre-assembled part, evenly rolling the adhesive output from the nozzle 410 onto the peripheral end face of the pre-assembled part, avoiding problems such as adhesive accumulation, missed coating, and uneven thickness. The entire rotary coating structure enables 360° circumferential coating without blind spots. After the adhesive cures autonomously at room temperature, it forms a sealed and tough annular film. This film completely seals the end gaps of the assembled dust-free ceramic dry sandpaper 5 and the isolation pad 6, preventing the intrusion of workshop dust, metal shavings, and other impurities. At the same time, it fixes the assembly structure of the double-layer dust-free ceramic dry sandpaper 5 and the middle isolation pad 6, preventing loosening of the stack and friction loss. It eliminates the need for full-surface coating of the sandpaper abrasive layer and the flocked backing layer, effectively reducing coating costs while ensuring protective effect.

[0040] This embodiment also provides a method for laminating and packaging dust-free dry ceramic sandpaper, including the following steps: S1. Dust-free ceramic dry sandpaper 5 is fed through the sandpaper feeding mechanism 2. The positioning rod 206 inside the material cylinder 201 cooperates with the chip discharge groove 502 of the sandpaper body 501 to achieve precise positioning. At the same time, the isolation pad 6 is fed through the isolation pad feeding mechanism 3. The positioning rod 206 cooperates with the inner diameter of the positioning protrusion 602 of the isolation pad 6 to achieve alignment and limit. During the feeding process, the anti-sticking scraper 207 prevents the material from sticking and ensures that the material is fed one layer at a time. S2. The pre-assembly mechanism 1 drives the carrier plate 113 to rotate vertically via the vertical flipping motor 112, so that the positioning ring 114 faces downward. The rotary drive 102 is activated, so that the two carrier plates 113 are positioned above the sandpaper feeding mechanism 2 in sequence. The dust-free ceramic dry sandpaper 5 is adsorbed and fixed by the annular suction cup 115 on the carrier plate 113. The rotary drive 102 is activated, so that one of the carrier plates 113 is positioned above the isolation pad feeding mechanism 3, and is engaged with the outside of the dust-free ceramic dry sandpaper 5. A piece of isolation pad 6 is received, and the positioning protrusion 602 of the isolation pad 6 is inserted into the chip removal groove 502. Then, the vertical flipping motor 112 drives the carrier 113 to flip vertically again. The two carriers 113 are pressed against each other by the lifting of the central lifting push rod 104 and the side lifting push rod 107. After the alignment and assembly of the pre-assembled parts are completed, the annular suction cup 115 on one of the carriers 113 is released, so that the pre-assembled parts are adsorbed on the carrier 113 located below the film packaging mechanism 4. S3. The film-coating packaging mechanism 4 adjusts the glue application height by adjusting the push rod 402 to match the specifications of the pre-assembled parts. The glue liquid is delivered to the nozzle 410 through the glue tank 412, pump hose 413 and guide pipe 414. At the same time, the horizontal flip motor 404 drives the drive gear 405 and driven gear 406 to mesh and drive the central suspension shaft 407, rotating plate 408 and end suspension shaft 409 to rotate around the pre-assembled parts. The glue application roller 411 is used to evenly apply glue to the periphery of the pre-assembled parts to form a closed ring film around the periphery of the pre-assembled parts.

[0041] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to specific implementations. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A film-coating packaging system for dust-free ceramic dry sanding paper, characterized in that, include: A pre-assembly mechanism is used to fill a spacer between two pressed pieces of cleanroom ceramic dry sandpaper, the two pieces of cleanroom ceramic dry sandpaper and the spacer together forming a pre-assembled part; the pre-assembly mechanism includes a base plate, a rotary driver, a turntable, a central lifting push rod, a carrier block, a positioning shaft, a side lifting push rod, a lower ear plate, a support plate, an upper ear plate, a support sleeve, a vertical flipping motor, a carrier plate, a positioning ring and an annular suction cup, the base plate is supported by the rotary driver on the turntable, and a central lifting push rod is installed at the upper center of the turntable. The movable end of the turntable is supported by a positioning shaft via a carrier block. Side lifting push rods are symmetrically installed on the upper side of the turntable about the central lifting push rod. The movable end of the side lifting push rod is supported by a lower ear plate. An upper ear plate is installed on the lower side of the support plate and hinged to the corresponding lower ear plate. The inner end of the support plate is provided with a support sleeve sleeved on the outside of the positioning shaft. The outer end of the support plate is supported by a carrier plate via a vertical flipping motor. An annular suction cup is installed on one side of the carrier plate. The other side of the carrier plate is provided with a positioning ring that matches the position of the chip removal groove and several suction holes that communicate with the suction cavity of the annular suction cup. A sandpaper feeding mechanism is provided at the front of the pre-assembly mechanism and is used to provide dust-free ceramic dry sandpaper to the pre-assembly mechanism. The dust-free ceramic dry sandpaper includes a sandpaper body and a chip removal groove is formed on the sandpaper body. An isolation pad feeding mechanism is provided on the rear side of the pre-assembly mechanism for providing isolation pads to the pre-assembly mechanism. The isolation pad includes an isolation pad body with a ring of positioning protrusions on the isolation pad body. The outer diameter of the positioning protrusions matches the diameter of the chip removal groove. The positioning protrusions protrude from both sides of the isolation pad body, and the height of the protrusions is equal to half the depth of the chip removal groove. A film-coating packaging mechanism is positioned above the pre-assembly mechanism and is used to apply adhesive to the periphery of the pre-assembled parts. The adhesive cures at room temperature to form a ring-shaped film. The film-coating packaging mechanism includes a base plate, a height adjustment push rod, a carrier frame, a horizontal tilting motor, a drive gear, a driven gear, a central suspension shaft, a rotating plate, an end suspension shaft, a nozzle, an adhesive roller, an adhesive tank, a pumping hose, and a guide pipe. The carrier frame is supported on the lower side of the base plate via the height adjustment push rod. The carrier frame internally houses meshing drive and driven gears. The lower side of the carrier frame is equipped with... A horizontally rotating motor is provided to drive the drive gear to rotate. The frame is located inside the driven gear and a rotary joint is installed. The rotating joint's moving ring is connected to a central suspension shaft fixed to the driven gear. The rotating joint's stationary ring is connected to a glue tank fixed to the lower side of the base plate via a pumping hose. The inner end of the rotating plate is fixed to the outer side of the central suspension shaft. The outer end of the rotating plate is movably supported by an end suspension shaft. A nozzle with a glue-applying roller is installed at the bottom end of the end suspension shaft. A guide pipe connecting the inner cavities of the central suspension shaft and the end suspension shaft is connected between them.

2. The film packaging system for dust-free ceramic dry sanding paper according to claim 1, characterized in that, The sandpaper body is composed of a flocked backing layer, a resin bonding layer and an abrasive layer, wherein the abrasive layer is made of sintered microcrystalline ceramic alumina.

3. The film-coating packaging system for dust-free ceramic dry sanding paper according to claim 2, characterized in that, The isolation pad is made of injection-molded material using an injection molding process.

4. The film-coating packaging system for dust-free ceramic dry sanding paper according to claim 3, characterized in that, The specifications of the adsorption area of ​​the carrier disk are matched with the specifications of the sandpaper body. The outer diameter of the positioning ring is matched with the diameter of the chip removal groove. The positioning ring protrudes from the side of the carrier disk, and the height of the protruding part is equal to half the depth of the chip removal groove.

5. The film-coating packaging system for dust-free ceramic dry sanding paper according to claim 4, characterized in that, Both the sandpaper feeding mechanism and the isolation pad feeding mechanism include a material cylinder, a lead screw support, a lead screw motor, a lead screw, a movable support plate, a positioning rod, and an anti-adhesion scraper. The material cylinder has an axial groove on one side, and a lead screw support is installed on the outer side of the axial groove. A lead screw motor is installed at the top of the lead screw support, and a lead screw is installed at the output end of the lead screw motor. A movable support plate with restricted rotation is sleeved on the outer side of the lead screw. A positioning rod is fixed to the inner side of the bottom plate of the material cylinder, and the top surface of the positioning rod is flush with the opening surface of the material cylinder. An annular anti-adhesion scraper is installed on the inner side of the opening surface of the material cylinder, and the annular width of the anti-adhesion scraper is 2–4 mm.

6. The film packaging system for dust-free ceramic dry sanding paper according to claim 5, characterized in that, The movable support plate is composed of a circular plate portion and a convex plate portion located at its outer edge. The convex plate portion has a screw groove that cooperates with a screw rod, and the circular plate portion has a sliding hole that cooperates with a positioning rod.

7. The film-coating packaging system for dust-free ceramic dry sanding paper according to claim 6, characterized in that, In the sandpaper feeding mechanism, the cylindrical inner diameter of the barrel matches the outer diameter of the sandpaper body, the diameter of the positioning rod matches the diameter of the chip removal groove, and the pitch of the lead screw is equal to the thickness of a single layer of dust-free ceramic dry sandpaper; in the isolation pad feeding mechanism, the cylindrical inner diameter of the barrel matches the outer diameter of the isolation pad body, the diameter of the positioning rod matches the inner diameter of the positioning protrusion, and the pitch of the lead screw is equal to the thickness of the isolation pad.

8. A method for laminating and packaging dust-free dry ceramic sanding paper, implemented based on the laminating and packaging system for dust-free dry ceramic sanding paper as described in claim 7, characterized in that... Includes the following steps: S1. Dust-free ceramic dry sandpaper is fed through the sandpaper feeding mechanism. The positioning rod inside the barrel and the chip removal groove of the sandpaper body are used to complete the precise positioning. At the same time, the isolation pad is fed through the isolation pad feeding mechanism. The positioning rod and the inner diameter of the positioning convex tube of the isolation pad are used to achieve alignment and limit. During the feeding process, the anti-sticking scraper is used to prevent the material from sticking and ensure that the material is fed one layer at a time. S2. The pre-assembly mechanism drives the carrier tray to rotate vertically via a vertical flip motor, so that the positioning ring faces downwards. The rotary drive is activated, so that the two carrier trays are positioned above the sandpaper feeding mechanism in sequence. The dust-free ceramic dry sandpaper is adsorbed and fixed by the annular suction cups on the carrier trays. The rotary drive is activated, so that one of the carrier trays is positioned above the isolation pad feeding mechanism. An isolation pad is received on the outside of the dust-free ceramic dry sandpaper, and the positioning protrusion of the isolation pad is inserted into the chip removal groove. Then, the carrier tray is rotated vertically again by the vertical flip motor. The two carrier trays are pressed against each other by the lifting of the central lifting push rod and the side lifting push rod. After the pre-assembled parts are aligned and assembled, the annular suction cup on one of the carrier trays is released, so that the pre-assembled parts are adsorbed on the carrier tray located below the film packaging mechanism. S3. The film-coating packaging mechanism adjusts the glue application height by adjusting the push rod to match the specifications of the pre-assembled parts. The glue is delivered to the nozzle through the glue tank, pump hose and guide pipe. At the same time, the horizontal flipping motor drives the drive gear and driven gear to mesh and drive the central suspension shaft, rotating plate and end suspension shaft to rotate around the pre-assembled parts. The glue application roller is used to evenly apply glue to the periphery of the pre-assembled parts to form a closed ring film around the periphery of the pre-assembled parts.

Images