Dual-sided on-demand cooled heat sink

Abstract

This invention provides a heat sink for double-sided on-demand cooling, comprising: a substrate, the upper surface of which has a first flow channel including multiple first branch channels, and the lower surface of which has a second flow channel including multiple second branch channels, wherein the liquid outlet ends of the first and second branch channels are connected to liquid outlet holes; a first spacer, which is disposed inside the first branch channel and extends along the direction of the first branch channel, wherein a first region and a second region are arranged longitudinally spaced apart within the first branch channel, wherein the distribution density of the first spacer in the first region is greater than that in the second region, and the heat generation of the chip in the chipset corresponding to the first region is higher than that of the chip in the chipset corresponding to the second region; an upper cover plate and a lower cover plate, which respectively cover the upper and lower surfaces of the substrate. The heat sink of this invention can provide on-demand cooling for chips of different power on both sides.

Description

Technical Field

[0001] This invention relates to the field of radiators, and particularly to a radiator with double-sided on-demand cooling. Background Technology

[0002] With the development of high-performance computing, artificial intelligence servers, and data centers, the number of chips integrated into a single device has increased dramatically, and the heat dissipation power of different chips (such as CPUs, GPUs, and memory chips) varies significantly. Traditional air cooling is no longer sufficient to meet the heat dissipation requirements of high heat flux density scenarios, and liquid cooling technology is gradually becoming the mainstream.

[0003] Existing liquid cooling heat sinks mostly employ a single-sided cooling structure, meaning that the flow channel is only located on one side of the substrate, while the other side is used to connect chips or serves only as a mounting surface. When it is necessary to cool chips on both the top and bottom sides of the substrate simultaneously, two independent heat sinks or complex piping systems are usually required, resulting in bulky size and high cost. In addition, traditional flow channel designs often use a parallel approach with one independent branch flow channel for each chip, which can easily lead to uneven flow distribution due to differences in flow channel impedance. This results in insufficient cooling of high-heat chip areas and over-cooling of low-heat chip areas, causing energy waste. Summary of the Invention

[0004] To address the aforementioned problems in the prior art, the present invention aims to provide a heat sink with on-demand cooling on both sides, capable of cooling chips with different power ratings on both sides as needed.

[0005] To address the above problems, the present invention provides a double-sided on-demand cooling radiator, the radiator comprising:

[0006] A substrate has liquid inlet holes and liquid outlet holes formed on its side surface. A first flow channel is formed on the upper surface of the substrate, and a second flow channel is formed on its lower surface. The first flow channel includes a plurality of first branch flow channels, and the second flow channel includes a plurality of second branch flow channels. The liquid inlet ends of the first branch flow channels and the second branch flow channels are all connected to the liquid inlet holes, and the liquid outlet ends of the first branch flow channels and the second branch flow channels are all connected to the liquid outlet holes. The first branch flow channels and the second branch flow channels extend longitudinally and are arranged in a serpentine pattern in the transverse direction.

[0007] The first spacer is disposed inside the first branch flow channel and extends along the direction of the first branch flow channel. The first branch flow channel is longitudinally spaced with a first region and a second region. The distribution density of the first spacer in the first region is greater than the distribution density of the first spacer in the second region. The heat generation of the chip in the chipset corresponding to the first region is higher than the heat generation of the chip in the chipset corresponding to the second region.

[0008] An upper cover plate and a lower cover plate, wherein the lower surface of the upper cover plate covers the upper surface of the substrate, and the upper surface of the lower cover plate covers the lower surface of the substrate, and both the upper surface of the upper cover plate and the lower surface of the lower cover plate are used to connect chips.

[0009] Furthermore, the radiator also includes:

[0010] Multiple second spacers are disposed inside the second branch flow channel and extend along the direction of the second branch flow channel. A third region and a fourth region are arranged longitudinally and spaced apart inside the second branch flow channel. The distribution density of the second spacers in the third region is greater than that in the fourth region. The heat generation of the chip in the chipset corresponding to the third region is higher than that of the chip in the chipset corresponding to the fourth region.

[0011] Furthermore, the first region is opposite to the fourth region, the second region is opposite to the third region, the depth of the first region is less than the depth of the second region, and the depth of the third region is less than the depth of the fourth region.

[0012] Furthermore, the first branch channel includes a first flow segment, a second flow segment, a third flow segment, and a fourth flow segment that are spaced apart laterally and extend longitudinally. The rear end of the second flow segment is connected to the liquid inlet, the front end of the second flow segment is connected to the front end of the third flow segment, the rear end of the third flow segment is connected to the rear end of the fourth flow segment, the front end of the fourth flow segment is connected to the front end of the first flow segment, and the rear end of the first flow segment is connected to the liquid outlet.

[0013] Furthermore, the second branch flow channel includes a fifth, a sixth, a seventh, and an eighth flow segment that are spaced apart laterally and extend longitudinally. The rear end of the sixth flow segment is connected to the liquid inlet, the front end of the sixth flow segment is connected to the front end of the seventh flow segment, the rear end of the seventh flow segment is connected to the rear end of the eighth flow segment, the front end of the eighth flow segment is connected to the front end of the fifth flow segment, and the rear end of the fifth flow segment communicates with the liquid outlet.

[0014] Wherein, the first flow segment faces away from the eighth flow segment, the second flow segment faces away from the seventh flow segment, the third flow segment faces away from the sixth flow segment, and the fourth flow segment corresponds to the fifth flow segment.

[0015] Furthermore, the heat sink includes:

[0016] Liquid inlet channel, wherein the liquid inlet hole is connected to the liquid inlet end of the first branch channel through the liquid inlet channel;

[0017] A flow divider hole is disposed in the liquid inlet channel and penetrates the substrate in the thickness direction. The liquid inlet end of the second branch channel is connected to the liquid inlet hole through the flow divider hole.

[0018] A manifold is provided at the liquid outlet end of the first flow section, penetrates the substrate in the thickness direction, and connects to the liquid outlet end of the fifth flow section.

[0019] The liquid outlet channel is provided, and the confluence hole is disposed in the liquid outlet channel. The liquid outlet ends of the first branch channel and the second branch channel are connected to the liquid outlet hole through the liquid outlet hole and the liquid outlet channel.

[0020] Furthermore, the liquid outlet channel also includes:

[0021] The first strip-shaped flow channel, wherein the liquid inlet end of the first strip-shaped flow channel is connected to the manifold;

[0022] The third branch flow channel, wherein the liquid inlet end of the third branch flow channel is connected to the first strip flow channel;

[0023] The second strip-shaped flow channel has its inlet end connected to the third branch flow channel, and its outlet end connected to the outlet hole.

[0024] Furthermore, a first pore is formed on the sidewall of the first strip-shaped flow channel near the liquid outlet end of the liquid inlet flow channel, and the first strip-shaped flow channel is connected to the liquid inlet flow channel through the first pore.

[0025] Furthermore, the radiator also includes:

[0026] A baffle is disposed within the first strip channel and close to the first aperture; moving the baffle can partially block the first aperture.

[0027] Furthermore, the sidewall of the first strip channel has a second pore formed near each of the diversion holes, and the first strip channel connects to each of the diversion holes through the second pore, the diameter of the second pore being smaller than the diameter of the first pore.

[0028] Due to the above technical solution, the present invention has the following beneficial effects:

[0029] According to the present invention, a double-sided on-demand cooling heat sink can simultaneously and on-demand cool chips with different power ratings arranged on both sides. After entering through the inlet, the coolant is simultaneously distributed to various branch channels on the upper and lower surfaces. In each serpentine branch channel, when the coolant flows through the first region corresponding to a high-heat chip, the high-density first spacers induce strong turbulence and boundary layer disruption, carrying away a large amount of heat; when flowing through the second region corresponding to a low-heat chip, the low-density spacers reduce flow resistance while maintaining basic heat exchange. Thus, chips with different power ratings can obtain cooling capabilities matching their heat output, avoiding localized overheating or overcooling, and achieving efficient and uniform heat dissipation.

[0030] The coolant achieves enhanced heat transfer through multiple "hot and cold alternations" throughout its flow path: whenever it flows through the first high-heat region, the high-density spacers generate strong fluid turbulence and segmentation, significantly increasing the local heat transfer coefficient and carrying away a large amount of heat; while when it flows through the second low-heat region, the sparse spacers maintain a certain heat transfer capacity while reducing flow resistance. This design avoids the problem of concentrating all the high-heat chips in the first half of the flow, which would lead to excessively rapid coolant temperature rise and insufficient heat transfer capacity in the second half. Instead, by alternating high-heat and low-heat chips along the longitudinal direction, the coolant temperature is kept within a relatively reasonable range, achieving a synchronous and uniform cooling effect.

[0031] It has the following advantages: First, compared to the parallel scheme where each chip has its own branch, this scheme uses a single branch flow channel to cover the entire chipset in series, completely eliminating the problem of uneven flow distribution in parallel schemes. This results in stable and reliable flow distribution and lower overall flow resistance. Second, the serpentine flow channel's bent structure, combined with alternating high-density and low-density spacers along the longitudinal direction, ensures that the coolant undergoes multiple alternating processes of enhanced heat transfer and drag reduction in each flow section. This guarantees sufficient cooling of high-heat chip areas while avoiding unnecessary energy loss, achieving on-demand cooling. This allows chips with different power ratings to be simultaneously cooled to similar temperatures on the same heatsink. Third, the overall structure is compact, highly integrated, and easy to manufacture and install. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0033] Figure 1 It is a heat sink with double-sided on-demand cooling according to an embodiment of the present invention;

[0034] Figure 2This is a structural diagram of the upper surface of the substrate and the first spacer according to an embodiment of the present invention;

[0035] Figure 3 yes Figure 2 A plan view of the upper surface of the substrate and the first spacer in the embodiment;

[0036] Figure 4 This is a structural diagram of the lower surface of the substrate and the second spacer according to an embodiment of the present invention;

[0037] Figure 5 yes Figure 4 A plan view of the lower surface of the substrate and the second spacer in the embodiment;

[0038] Figure 6 This is a structural diagram of a substrate according to another embodiment of the present invention.

[0039] Figure label:

[0040] 100. Top cover plate;

[0041] 200, Substrate; 211, Liquid inlet; 212, Liquid outlet; 220, Liquid inlet channel; 230, First branch channel; 231, First section; 232, Second section; 233, Third section; 234, Fourth section; 240, Second branch channel; 241, Fifth section; 242, Sixth section; 243, Seventh section; 244, Eighth section; 251, Confluence hole; 252, Divider hole; 260, Liquid outlet channel; 261, First strip channel; 262, Third branch channel; 263, Second strip channel; 271, First pore; 272, Baffle; 273, Second pore;

[0042] 300. Lower cover plate;

[0043] 410. First spacer; 420. Second spacer. Detailed Implementation

[0044] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0046] The following describes a double-sided on-demand cooling radiator according to an embodiment of the present invention.

[0047] like Figures 1 to 6 As shown, this embodiment provides a heat sink with double-sided on-demand cooling, which includes a substrate 200, a first spacer 410, an upper cover plate 100 and a lower cover plate 300.

[0048] The substrate 200 is the main structure of the heat sink and is typically made of a metal material with high thermal conductivity (such as copper, copper alloy, aluminum, or aluminum alloy). The substrate 200 is generally flat, with an upper surface and a lower surface opposite it. Inlet holes 211 and outlet holes 212 are formed on the sides of the substrate 200 (e.g., one or more sidewalls perpendicular to the upper surface) for allowing coolant to enter and exit the heat sink, respectively. The number of inlet holes 211 and outlet holes 212 can be one or more, and their positions can be flexibly set according to the external piping layout. A first flow channel is formed on the upper surface of the substrate 200 by machining, etching, or casting. A second flow channel is formed on the lower surface of the substrate 200 in the same manner. The first flow channel includes multiple independent first branch flow channels 230, and the second flow channel includes multiple independent second branch flow channels 240. The inlet end of each first branch channel 230 and each second branch channel 240 is connected to the inlet hole 211, and the outlet end is connected to the outlet hole 212. This allows the coolant to flow from the inlet hole 211 into each branch channel, complete heat exchange, and then converge to the outlet hole 212 for discharge. All branch channels extend longitudinally and are arranged laterally, with each branch channel itself having a serpentine shape to increase the flow path length and heat exchange area within a limited area.

[0049] The first spacer 410 is an elongated protrusion disposed inside the first branch channel 230. The first spacer 410 extends along the direction (i.e., a serpentine path) of the first branch channel 230. Inside the first branch channel 230, first regions (such as...) are arranged at intervals along the longitudinal direction. Figure 2 Region B in the middle) and the second region (such as Figure 2(Region A in the diagram). The distribution density of the first spacer 410 in the first region is greater than that in the second region. Here, "distribution density" can refer to the number of spacers per unit flow channel length, the proportion of the total cross-sectional area of ​​the spacers, or the density of the spacers in the flow channel width direction. The first region is positioned to correspond to chips with higher heat generation in the chipset, and the second region is positioned to correspond to chips with lower heat generation in the chipset. Through this density difference, in high-heat regions, dense spacers can divide the fluid, increase the heat transfer area, and enhance turbulence, thereby significantly improving the local heat transfer coefficient; in low-heat regions, sparse spacers maintain lower flow resistance.

[0050] The upper cover plate 100 is a flat plate component whose lower surface seals over the upper surface of the substrate 200, enclosing the first flow channel into a closed coolant channel. The lower cover plate 300 is a flat plate component whose upper surface seals over the lower surface of the substrate 200, enclosing the second flow channel. Both the upper surface of the upper cover plate 100 and the lower surface of the lower cover plate 300 are used to directly or indirectly connect the chip to be cooled. The chip can be bonded or pressed onto these surfaces using a thermally conductive interface material.

[0051] This heatsink design enables simultaneous, on-demand cooling of chips with varying power ratings arranged on both sides. After entering through the inlet 211, the coolant is simultaneously distributed to various branch channels on the upper and lower surfaces. In each serpentine branch channel, when the coolant flows through the first region corresponding to a high-heat chip, the high-density first spacer 410 induces strong turbulence and boundary layer disruption, carrying away a significant amount of heat. When flowing through the second region corresponding to a low-heat chip, the low-density spacer reduces flow resistance while maintaining basic heat exchange. Thus, chips with different power ratings can receive cooling capacity matching their heat output, avoiding localized overheating or overcooling, and achieving efficient and uniform heat dissipation.

[0052] The coolant achieves enhanced heat transfer through multiple "hot and cold alternations" throughout its flow path: whenever it flows through the first high-heat region, the high-density spacers generate strong fluid turbulence and segmentation, significantly increasing the local heat transfer coefficient and carrying away a large amount of heat; while when it flows through the second low-heat region, the sparse spacers maintain a certain heat transfer capacity while reducing flow resistance. This design avoids the problem of concentrating all the high-heat chips in the first half of the flow, which would lead to excessively rapid coolant temperature rise and insufficient heat transfer capacity in the second half. Instead, by alternating high-heat and low-heat chips along the longitudinal direction, the coolant temperature is kept within a relatively reasonable range, achieving a synchronous and uniform cooling effect.

[0053] It has the following advantages: First, compared to the parallel scheme where each chip has its own branch, this scheme uses a single branch flow channel to cover the entire chipset in series, completely eliminating the problem of uneven flow distribution in parallel schemes. This results in stable and reliable flow distribution and lower overall flow resistance. Second, the serpentine flow channel's bent structure, combined with alternating high-density and low-density spacers along the longitudinal direction, ensures that the coolant undergoes multiple alternating processes of enhanced heat transfer and drag reduction in each flow section. This guarantees sufficient cooling of high-heat chip areas while avoiding unnecessary energy loss, achieving on-demand cooling. This allows chips with different power ratings to be simultaneously cooled to similar temperatures on the same heatsink. Third, the overall structure is compact, highly integrated, and easy to manufacture and install.

[0054] In some embodiments of the present invention, such as Figure 4 and Figure 5 As shown, the radiator also includes a plurality of second spacers 420. The second spacers 420 are disposed inside the second branch flow channel 240 and extend along the direction of the second branch flow channel 240. Similar to the first flow channel, third regions (such as...) are arranged longitudinally at intervals within the second branch flow channel 240. Figure 5 Region C in the middle) and the fourth region (such as Figure 5 The distribution density of the second spacer 420 in the third region is greater than that in the fourth region. The third region is configured to correspond to the chip with higher heat generation in the chipset, and the fourth region is configured to correspond to the chip with lower heat generation in the chipset. The second spacer 420 can be the same as or different in shape, size, and material from the first spacer 410, such as a long strip with a rectangular or trapezoidal cross-section. This design enables the second flow channel on the lower surface of the substrate 200 to also have the ability to enhance heat transfer on demand, thereby making the double-sided cooling performance of the heat sink more balanced and able to independently adapt to the different chip power distributions on the upper and lower sides.

[0055] Furthermore, such as Figure 3 and Figure 5 As shown, the relative positional relationship between the high-heat and low-heat regions on the upper and lower surfaces, as well as the flow channel depth, were optimized.

[0056] Specifically, in the vertical projection direction, the first region (high-heat area on the upper surface) and the fourth region (low-heat area on the lower surface) are arranged back-to-back, meaning their projections in the thickness direction of the substrate 200 do not overlap or are substantially offset; simultaneously, the second region (low-heat area on the upper surface) and the third region (high-heat area on the lower surface) are arranged back-to-back. Furthermore, the flow channel depth of the first region is less than that of the second region, and the flow channel depth of the third region is less than that of the fourth region. Here, "depth" refers to the vertical distance from the bottom surface of the flow channel to the lower or upper surface of the cover plate.

[0057] By staggering the high-heat regions on the upper and lower surfaces, excessively high local heat flux density can be avoided, allowing heat to diffuse more evenly within the substrate 200, reducing peak temperature and thermal stress, and improving the long-term reliability of the heat sink. Simultaneously, shallower flow channels in high-heat regions can further increase the local coolant flow rate, enhancing the heat transfer coefficient; while deeper flow channels in low-heat regions help reduce overall flow resistance. This combined design achieves a better balance between heat transfer capacity and flow pumping power.

[0058] In some embodiments of the present invention, such as Figure 3 As shown, the specific meandering structure of the first branch channel 230 is defined.

[0059] The first branch channel 230 includes a first flow segment 231, a second flow segment 232, a third flow segment 233, and a fourth flow segment 234, which are spaced apart laterally and extend longitudinally. These four flow segments are approximately parallel and connected in the order of second, third, fourth, and first. Specifically, the connection relationship is as follows: the rear end of the second flow segment 232 is connected to the inlet port 211; the front end of the second flow segment 232 is connected to the front end of the third flow segment 233 (e.g., the two are connected at the front side of the channel via a U-shaped bend); the rear end of the third flow segment 233 is connected to the rear end of the fourth flow segment 234 (e.g., the two are connected at the rear side of the channel via a U-shaped bend); the front end of the fourth flow segment 234 is connected to the front end of the first flow segment 231; and the rear end of the first flow segment 231 is connected to the outlet port 212. In this way, the coolant enters the second flow section 232 from the inlet 211, flows to the front end and then turns back into the third flow section 233 to flow backward. After flowing to the rear end, it turns back into the fourth flow section 234 to flow forward, flows to the front end again and then turns back into the first flow section 231 to flow backward, finally flowing into the outlet 212 from the rear end of the first flow section 231. This four-segment serpentine structure achieves a longer flow path in a compact space, and the inlet and outlet are located on the same side (rear end) of the substrate 200, which facilitates pipe connection. At the same time, the coolant flows back and forth multiple times in the longitudinal direction, which can make the temperature distribution more uniform.

[0060] Furthermore, such as Figure 5 As shown, the specific meandering structure of the second branch channel 240 and its correspondence with the first branch channel 230 are defined.

[0061] The second branch channel 240 includes a fifth flow segment 241, a sixth flow segment 242, a seventh flow segment 243, and an eighth flow segment 244, which are spaced apart laterally and extend longitudinally. Their connection method is as follows: the rear end of the sixth flow segment 242 is connected to the inlet port 211; the front end of the sixth flow segment 242 is connected to the front end of the seventh flow segment 243; the rear end of the seventh flow segment 243 is connected to the rear end of the eighth flow segment 244; the front end of the eighth flow segment 244 is connected to the front end of the fifth flow segment 241; and the rear end of the fifth flow segment 241 is connected to the outlet port 212.

[0062] Furthermore, the vertical projection correspondence of the upper and lower flow sections is defined: the first flow section 231 faces away from the eighth flow section 244 (i.e., the eighth flow section 244 is above the first flow section 231, but their longitudinal directions are opposite or their positions are offset); the second flow section 232 faces away from the seventh flow section 243; the third flow section 233 faces away from the sixth flow section 242; and the fourth flow section 234 corresponds to the fifth flow section 241 (i.e., the fourth flow section 234 and the fifth flow section 241 are roughly aligned in the vertical direction). This mirror or misaligned correspondence, combined with the offset design in claim 3, can further optimize the stress distribution and temperature field uniformity inside the substrate 200, avoiding excessive stiffness abrupt changes in the thickness direction of the flow channel structure. Moreover, the coolant first flows into the higher temperature region corresponding to the middle of the chip, and then flows into the lower temperature region corresponding to the edge of the chip, further realizing on-demand cooling.

[0063] Furthermore, such as Figures 2 to 5 As shown, auxiliary flow path structures such as inlet channel 220, diversion hole 252, confluence hole 251 and outlet channel 260 have been added.

[0064] Specifically, a liquid inlet channel 220 is formed on the substrate 200. Liquid inlet holes 211 connect to the inlet ends of each of the first branch channels 230 through this liquid inlet channel 220, serving to distribute the coolant. Within the liquid inlet channel 220, a diversion hole 252 extending along the thickness direction of the substrate 200 is provided. The lower end of the diversion hole 252 connects to the inlet end of the second branch channel 240, thereby guiding a portion of the coolant from the liquid inlet channel 220 to the second branch channel 240 on the lower surface of the substrate 200. Furthermore, a converging hole 251 extending through the thickness direction of the substrate 200 is provided at the outlet end of the first flow section 231 (i.e., the end of the first branch channel 230). This converging hole 251 also connects to the outlet end of the fifth flow section 241, causing the coolant outlets from the first branch channel 230 on the upper surface and the second branch channel 240 on the lower surface to converge here. The manifold 251 is located inside the outlet channel 260, which then guides the collected coolant to the outlet hole 212. Through the combination of the inlet channel 220, the branching hole 252, the manifold 251, and the outlet channel 260, parallel supply and return of coolant through multiple branch channels on the upper and lower surfaces are achieved, resulting in a compact structure and low flow resistance.

[0065] Furthermore, such as Figure 3 and Figure 5 As shown, the specific structure of the liquid outlet channel 260 has been detailed.

[0066] The outlet flow channel 260 includes a first strip flow channel 261, a third branch flow channel 262, and a second strip flow channel 263. The inlet end of the first strip flow channel 261 is connected to the confluence hole 251. The inlet end of the third branch flow channel 262 is connected to the first strip flow channel 261 and is used to receive coolant from the first strip flow channel 261. The inlet end of the second strip flow channel 263 is connected to the third branch flow channel 262, and the outlet end of the second strip flow channel 263 is connected to the outlet hole 212. This multi-stage branching and confluence structure of the outlet flow channel 260 reduces the flow velocity at the outlet end, minimizes local pressure loss, and facilitates further heat exchange or special flow control during the outlet process. A chip is placed in the area corresponding to the third branch flow channel 262 (the area on the outer surface of the upper cover and / or lower cover) for chip heat dissipation.

[0067] Furthermore, such as Figure 6 As shown, a first pore structure 271 was added.

[0068] On the sidewall of the first strip-shaped flow channel (261), a first pore (271) is provided near the liquid outlet end of the inlet flow channel (220). The first strip-shaped flow channel (261) is directly connected to the inlet flow channel (220) through the first pore (271). The first pore (271) can be configured as a slit, a round hole, or an irregular hole, thereby forming an independent bypass path: part of the low-temperature coolant in the inlet flow channel (220) can enter the first strip-shaped flow channel (261) directly through the first pore (271) without passing through the upstream branch flow channel (i.e., the first branch flow channel (230) and the second branch flow channel (240)), and then flow into the section of the outlet flow channel (260) corresponding to the third branch flow channel (262).

[0069] The key advantage of this design lies in achieving temperature regulation through a mixture of hot and cold fluids: the coolant flowing through the upstream branch channels (230, 240) increases in temperature due to absorbing heat from the corresponding chip; while the coolant bypassing through the first aperture (271) remains at a lower temperature. These two portions of coolant mix in the first strip channel (261) and the outlet channel (260), significantly reducing the inlet temperature of the coolant used to dissipate heat from the chip corresponding to the third branch channel (262). This avoids the problem of insufficient heat dissipation capacity of the downstream chip (corresponding to the third branch channel (262)) due to the coolant gradually heating up along the flow direction, thereby greatly improving the heat dissipation uniformity between different chip regions.

[0070] Furthermore, such as Figure 6 As shown, a baffle 272 structure has been added.

[0071] The baffle (272) is disposed inside the first strip-shaped flow channel (261) and located near the first aperture (271). The baffle (272) is a movable sheet-like component. By adjusting the position of the baffle (272), the degree of obstruction of the first aperture (271) can be changed, thereby continuously and precisely controlling the effective flow area of ​​the first aperture (271).

[0072] The core of this design lies in precisely controlling the flow rate of the bypass cryogenic coolant, thereby regulating the temperature of the mixed coolant. Specifically: increasing the obstruction of the first orifice (271) by the baffle (272) reduces the flow rate of the bypass cryogenic coolant, allowing more coolant to flow through the upstream branch channels (230, 240) to absorb heat and increase its temperature, thus raising the temperature of the coolant entering the corresponding area of ​​the third branch channel (262) after mixing; conversely, decreasing the obstruction increases the flow rate of the bypass cryogenic coolant, causing the temperature of the mixed coolant to decrease. By continuously adjusting the opening of the baffle (272), the temperature value of the mixed coolant can be set arbitrarily within the required range, achieving stepless temperature regulation from "completely unmixed (high temperature)" to "maximum bypass (low temperature)".

[0073] This adjustability allows the heat sink to dynamically and precisely adjust the temperature of the coolant supplied to the area based on the actual power, heat load distribution, or real-time temperature feedback of the chip corresponding to the third branch channel (262). This avoids thermal stress caused by excessively cold coolant or insufficient heat dissipation caused by overheating, thereby achieving on-demand and refined temperature control and significantly improving the system's adaptability and heat dissipation consistency under different operating conditions.

[0074] Furthermore, such as Figure 6 As shown, the second pore 273 is defined.

[0075] The upstream branch channels (i.e., the first branch channel (230) and the second branch channel (240)) are provided with multiple (e.g., two, four or more). On the side wall of the first strip channel (261), a second pore (273) is provided near each branch hole (252). The first strip channel (261) is connected to each branch hole (252) through these second pores (273). In particular, the diameter of the second pore (273) is set to be smaller than the diameter of the first pore (271). The function of the second pore (273) is to guide the coolant that has been mixed with cold and hot fluid in the first strip channel (261) back to the vicinity of each branch hole (252), thereby producing local and fine regulation of the pressure and flow distribution at the branch holes (252). Since the diameter of the second pore (273) is small, its effect is localized; while the diameter of the first pore (271) is larger and is responsible for the main bypass mixing regulation. In the case of multiple third branch channels (262) (each third branch channel (262) corresponds to a set of chips), multiple second pores (273) enable the mixed low-temperature coolant to be more evenly distributed laterally to different sections of the first strip channel (261), thereby ensuring that the temperature of the coolant flowing into each third branch channel (262) tends to be consistent. Ultimately, this structure not only achieves cooling by mixing hot and cold fluids, but also ensures the temperature uniformity of the cooled coolant among the downstream chips, further enhancing the heat dissipation consistency of the chips corresponding to the third branch channel (262).

[0076] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A radiator with double-sided on-demand cooling, characterized in that, The heat sink includes: A substrate has liquid inlet holes and liquid outlet holes formed on its side surface. A first flow channel is formed on the upper surface of the substrate, and a second flow channel is formed on its lower surface. The first flow channel includes a plurality of first branch flow channels, and the second flow channel includes a plurality of second branch flow channels. The liquid inlet ends of the first branch flow channels and the second branch flow channels are all connected to the liquid inlet holes, and the liquid outlet ends of the first branch flow channels and the second branch flow channels are all connected to the liquid outlet holes. The first branch flow channels and the second branch flow channels extend longitudinally and are arranged in a serpentine pattern in the transverse direction. The first spacer is disposed inside the first branch flow channel and extends along the direction of the first branch flow channel. The first branch flow channel is longitudinally spaced with a first region and a second region. The distribution density of the first spacer in the first region is greater than the distribution density of the first spacer in the second region. The heat generation of the chip in the chipset corresponding to the first region is higher than the heat generation of the chip in the chipset corresponding to the second region. An upper cover plate and a lower cover plate, wherein the lower surface of the upper cover plate covers the upper surface of the substrate, and the upper surface of the lower cover plate covers the lower surface of the substrate, and both the upper surface of the upper cover plate and the lower surface of the lower cover plate are used to connect chips.

2. The double-sided on-demand cooling radiator according to claim 1, characterized in that, The radiator also includes: Multiple second spacers are disposed inside the second branch flow channel and extend along the direction of the second branch flow channel. A third region and a fourth region are arranged longitudinally and spaced apart inside the second branch flow channel. The distribution density of the second spacers in the third region is greater than that in the fourth region. The heat generation of the chip in the chipset corresponding to the third region is higher than that of the chip in the chipset corresponding to the fourth region.

3. The double-sided on-demand cooling radiator according to claim 2, characterized in that, The first region faces away from the fourth region, the second region faces away from the third region, the depth of the first region is less than the depth of the second region, and the depth of the third region is less than the depth of the fourth region.

4. The double-sided on-demand cooling radiator according to claim 1, characterized in that, The first branch channel includes a first flow segment, a second flow segment, a third flow segment, and a fourth flow segment that are spaced apart laterally and extend longitudinally. The rear end of the second flow segment is connected to the liquid inlet, the front end of the second flow segment is connected to the front end of the third flow segment, the rear end of the third flow segment is connected to the rear end of the fourth flow segment, the front end of the fourth flow segment is connected to the front end of the first flow segment, and the rear end of the first flow segment is connected to the liquid outlet.

5. The double-sided on-demand cooling radiator according to claim 4, characterized in that, The second branch flow channel includes a fifth, a sixth, a seventh, and an eighth flow segment that are spaced apart laterally and extend longitudinally. The rear end of the sixth flow segment is connected to the liquid inlet, the front end of the sixth flow segment is connected to the front end of the seventh flow segment, the rear end of the seventh flow segment is connected to the rear end of the eighth flow segment, the front end of the eighth flow segment is connected to the front end of the fifth flow segment, and the rear end of the fifth flow segment communicates with the liquid outlet. Wherein, the first flow segment faces away from the eighth flow segment, the second flow segment faces away from the seventh flow segment, the third flow segment faces away from the sixth flow segment, and the fourth flow segment corresponds to the fifth flow segment.

6. The double-sided on-demand cooling radiator according to claim 5, characterized in that, The heat sink includes: Liquid inlet channel, wherein the liquid inlet hole is connected to the liquid inlet end of the first branch channel through the liquid inlet channel; A flow divider hole is disposed in the liquid inlet channel and penetrates the substrate in the thickness direction. The liquid inlet end of the second branch channel is connected to the liquid inlet hole through the flow divider hole. A manifold is provided at the liquid outlet end of the first flow section, penetrates the substrate in the thickness direction, and connects to the liquid outlet end of the fifth flow section. The liquid outlet channel is provided, and the confluence hole is disposed in the liquid outlet channel. The liquid outlet ends of the first branch channel and the second branch channel are connected to the liquid outlet hole through the liquid outlet hole and the liquid outlet channel.

7. The double-sided on-demand cooling radiator according to claim 6, characterized in that, The liquid outlet channel further includes: The first strip-shaped flow channel, wherein the liquid inlet end of the first strip-shaped flow channel is connected to the manifold; The third branch flow channel, wherein the liquid inlet end of the third branch flow channel is connected to the first strip flow channel; The second strip-shaped flow channel has its inlet end connected to the third branch flow channel, and its outlet end connected to the outlet hole.

8. The double-sided on-demand cooling radiator according to claim 7, characterized in that, The sidewall of the first strip-shaped flow channel has a first pore formed near the liquid outlet end of the liquid inlet flow channel, and the first strip-shaped flow channel is connected to the liquid inlet flow channel through the first pore.

9. The double-sided on-demand cooling radiator according to claim 8, characterized in that, The radiator also includes: A baffle is disposed within the first strip channel and close to the first aperture; moving the baffle can partially block the first aperture.

10. The double-sided on-demand cooling radiator according to claim 9, characterized in that, The sidewall of the first strip-shaped flow channel has a second pore formed near each of the flow branches. The first strip-shaped flow channel connects to each of the flow branches through the second pore, and the diameter of the second pore is smaller than the diameter of the first pore.

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