An edge die processing method of a text wafer map and related equipment

Abstract

This invention relates to the field of semiconductor manufacturing and testing data processing technology, specifically disclosing a method and related equipment for edge die processing of text wafer images. The technical solution of this invention identifies the start and end rows of the character matrix in the wafer image through multi-feature scanning and extracts the matrix. It analyzes the column index contiguous blocks of preset characters line by line to accurately locate the left and right edge regions. Candidate die positions are selected from the edge inwards according to a preset number of shrinking circles. Combined with multi-directional neighborhood detection and protected character filtering strategies, replacement targets are screened. This solves the problems in existing technologies, such as difficulties in locating the start and end rows of the matrix due to differences in file header formats, difficulty in identifying physical edges and internal void boundaries due to fixed line-by-line truncation methods leading to misselection or omission of edge dies, and the lack of a character-level protection mechanism for global replacement leading to accidental rewriting of protected information. This improves the accuracy of edge die processing of text wafer images, enhances cross-platform compatibility, and improves the reliability of yield analysis.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing and testing data processing technology, and in particular to a method and related equipment for processing edge dies in a text wafer image. Background Technology

[0002] In wafer probe testing, wafer map files are often stored in text format, encompassing a file header, a wafer map character matrix, and BIN statistics. Before yield analysis, test engineers need to perform a ring-shrinking operation to mark the outermost dies affected by edge effects as invalid, avoiding misjudgments in yield assessment. However, existing technologies have shortcomings. Different probe stations have significantly different file header formats, and the start and end positions of the matrix are not fixed. Existing parsing tools lack universal adaptability and are difficult to process across platforms. Existing ring-shrinking methods often use line-by-line extraction of a fixed number of outer characters, making it difficult to accurately identify the boundaries between physical edges and internal voids, easily leading to misselection or omission of edge dies. The wafer map matrix often contains user-defined markers; existing methods lack a character-level protection mechanism, and global replacement can easily overwrite protected information, causing the loss of critical engineering data.

[0003] Therefore, there is an urgent need to provide a technical solution to address the above problems. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a method and related equipment for edge die processing of text wafer images.

[0005] In a first aspect, the present invention provides a method for edge die processing of a text wafer image, the technical solution of which is as follows: Read the file containing the text wafer image, identify the start and end lines of the wafer image character matrix through multi-feature scanning, and extract the wafer image character matrix; Traverse each row of the wafer image character matrix, extract the column index of all first preset characters in each row, divide the first preset characters with consecutive column indices into the same continuous block, and obtain at least one continuous block in each row; determine the continuous block with the smallest column index in each row as the left block, and determine the continuous block with the largest column index as the right block; From the rightmost edge of the left block of each row, select N column indices of the first preset character inwards; from the leftmost edge of the right block of each row, select N column indices of the first preset character inwards; combine each selected column index with the row number of the corresponding row to form a candidate die position, thus forming a set of candidate die positions; where N is the preset number of shrinking circles; Traverse each candidate die position in the candidate die position set, and check whether there are characters that satisfy the preset test die conditions in multiple directly adjacent positions of the candidate die position. If there are, add the candidate die position to the replacement set; wherein, the preset test die conditions are: the character is a letter or a number, and is not equal to the preset protected character; Replace the character at each candidate die position in the replacement set with a second preset character, and output the replaced wafer image.

[0006] The beneficial effects of the edge die processing method for text wafer images of the present invention are as follows: The method of this invention identifies the start and end rows of the character matrix of a wafer image through multi-feature scanning and extracts the matrix. It analyzes the column index continuous blocks of preset characters line by line to accurately locate the left and right edge regions. It selects candidate die positions from the edge inward according to a preset number of shrinking circles. It combines multi-directional neighborhood detection and protected character filtering strategies to screen replacement targets. This solves the problems in the prior art, such as the difficulty in locating the start and end rows of the matrix due to differences in file header format, the difficulty in identifying physical edges and internal hole boundaries due to fixed line-by-line truncation, resulting in misselection or omission of edge dies, and the failure to establish a character-level protection mechanism for global replacement, which leads to the accidental rewriting of protected information. It improves the accuracy of edge die processing of text wafer images and cross-platform universal adaptability, and enhances the reliability of yield analysis.

[0007] Based on the above solution, the edge die processing method of the text wafer diagram of the present invention can be further improved as follows.

[0008] In one alternative approach, the first preset character is an asterisk character, the second preset character is a dollar sign character or the letter M character, and the preset protected character is a hash character.

[0009] The advantages of adopting the above optional method are: further defining the specific types of the first preset character, the second preset character, and the protected character, making the character replacement rules clearer, avoiding ambiguity in parsing due to differences in character encoding between different platforms or tools, and improving the execution consistency of the method in cross-platform scenarios.

[0010] In one alternative approach, the alphanumeric characters in the preset test die conditions represent tested dies, which include die that passed the test and die that failed the test.

[0011] The advantages of adopting the above-mentioned optional methods are: further defining the tested dies to include dies that have passed the test and dies that have failed the test, making the identification range of valid test data more complete during the neighborhood detection process, avoiding the omission of edge die screening due to only identifying part of the test results, and improving the accuracy of replacement target determination.

[0012] In one alternative approach, the plurality of directly adjacent positions include four directly adjacent positions: directly above, directly below, directly to the left, and directly to the right of the candidate die position.

[0013] The advantages of adopting the above-mentioned optional method are: further limiting the multi-directional neighborhood detection to four directly adjacent positions: directly above, directly below, directly to the left, and directly to the right, making the neighborhood determination range of the candidate die position clearer, eliminating the interference of non-directly adjacent positions such as diagonals, and improving the accuracy of edge region screening.

[0014] In one alternative approach, the step of dividing the first preset characters of the column index into the same contiguous block includes: If the difference between the column index of the current first preset character and the column index of the previous first preset character is 1, then the current first preset character is assigned to the contiguous block where the previous first preset character is located. If the difference between the column indices is greater than 1, a new contiguous block is created.

[0015] The advantages of adopting the above optional method are: further refine the rules for dividing continuous blocks, determine the character's affiliation by whether the column index difference is 1, so that multiple preset characters distributed at intervals in the same row can be accurately distinguished as independent continuous blocks, avoid confusion between edge areas and non-edge areas, and improve the reliability of left and right side block positioning.

[0016] In one alternative approach, the left block is the contiguous block with the smallest column index among all contiguous blocks in each row, and the right block is the contiguous block with the largest column index among all contiguous blocks in each row.

[0017] The advantages of adopting the above optional method are: it further clarifies that the selection criteria for the left and right blocks are the continuous blocks with the smallest and largest column indices, making the selection logic of the edge area clearer when there are multiple interval areas in each row, avoiding the middle empty area being misjudged as an edge, and improving the accuracy of left and right edge positioning.

[0018] In one alternative approach, it also includes: In the expanded circle operation mode, the character at each candidate die position in the replacement set is replaced with a first preset character; wherein, in the expanded circle operation mode, the second preset character is replaced with the first preset character, and the candidate die positions in the replacement set are re-determined based on the candidate die position set and the determination results of the plurality of directly adjacent positions.

[0019] The advantages of adopting the above optional method are: further increasing the expansion operation mode, supporting the restoration of the replaced character to the first preset character, making the method applicable in both shrinking and expanding scenarios, improving the flexibility and reversibility of the edge die processing process, and meeting the process requirements of different testing stages.

[0020] Secondly, the present invention provides an edge die processing system for text wafer images, the technical solution of which is as follows: The extraction module is used to read a file containing a text wafer image, identify the start and end lines of the wafer image character matrix through multi-feature scanning, and extract the wafer image character matrix. The traversal module is used to traverse each row of the wafer diagram character matrix, extract the column index of all first preset characters in each row, divide the first preset characters with consecutive column indices into the same continuous block, and obtain at least one continuous block in each row; the continuous block with the smallest column index in each row is determined as the left block, and the continuous block with the largest column index is determined as the right block. The selection module is used to select N column indices of the first preset character from the rightmost side of the left block of each row and from the leftmost side of the right block of each row. The selected column indexes are combined with the row number of the corresponding row to form a candidate die position, thus forming a set of candidate die positions. Here, N is the preset number of shrinking circles. The replacement module is used to traverse each candidate die position in the candidate die position set, check whether there are characters that meet the preset test die conditions in multiple directly adjacent positions of the candidate die position, and if so, add the candidate die position to the replacement set; wherein, the preset test die conditions are: the character is a letter or a number, and is not equal to the preset protected character; The output module is used to replace the character at each candidate die position in the replacement set with a second preset character and output the replaced wafer image.

[0021] The beneficial effects of the edge die processing system for text wafer images of the present invention are as follows: The system of this invention identifies the start and end rows of the character matrix of a wafer image through multi-feature scanning and extracts the matrix. It analyzes the column index continuous blocks of preset characters line by line to accurately locate the left and right edge regions. It selects candidate die positions from the edge inward according to a preset number of shrinking circles. Combining multi-directional neighborhood detection and protected character filtering strategies, it filters replacement targets. This solves the problems in the prior art, such as the difficulty in locating the start and end rows of the matrix due to differences in file header format, the difficulty in identifying physical edges and internal hole boundaries due to fixed line-by-line truncation, resulting in misselection or omission of edge dies, and the failure to establish a character-level protection mechanism for global replacement, which leads to the accidental rewriting of protected information. It improves the accuracy of edge die processing of text wafer images and cross-platform universal adaptability, and enhances the reliability of yield analysis.

[0022] Thirdly, the technical solution of an electronic device according to the present invention is as follows: It includes a memory, a processor, and a program stored in the memory and running on the processor, wherein the processor executes the program to implement the steps of the edge die processing method for text wafer diagrams as described in this invention.

[0023] Fourthly, the technical solution of a computer-readable storage medium provided by the present invention is as follows: The computer-readable storage medium stores instructions that, when read, cause the computer-readable storage medium to perform the steps of the edge die processing method for the text wafer diagram of the present invention.

[0024] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0025] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 This is a schematic flowchart illustrating an embodiment of a text wafer pattern edge die processing method according to the present invention. Figure 2 This is a schematic diagram of the character content in the original wafer image character matrix. Figure 3 This is a schematic diagram of the character content in the replaced wafer image character matrix; Figure 4 This is a schematic diagram of an embodiment of the edge die processing system for a text wafer image according to the present invention; Figure 5 This is a schematic diagram of an embodiment of an electronic device according to the present invention. Detailed Implementation

[0026] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0027] Figure 1This diagram illustrates a flowchart of an embodiment of a text wafer image edge die processing method provided by the present invention. This method can be executed by an electronic device such as a terminal device or a server. The terminal device can be any fixed or mobile terminal, such as a user equipment (UE), mobile device, user terminal, terminal, cellular phone, cordless phone, personal digital assistant (PDA), handheld device, computing device, in-vehicle device, or wearable device. The server can be a single server or a server cluster consisting of multiple servers. Any electronic device can implement the text wafer image edge die processing method by having its processor call computer-readable instructions stored in memory. Figure 1 As shown, it includes the following steps: S1. Read the file containing the text wafer image, identify the start and end lines of the wafer image character matrix through multi-feature scanning, and extract the wafer image character matrix.

[0028] The text wafer diagram refers to wafer probe test result data stored in text file format, which includes file header information, a wafer diagram character matrix, and BIN statistics. For example, the file name is "A072721-2026-05-01.txt". The beginning of the file records the wafer size as 8 inches, with the flat edge direction as LEFT. This is followed by a matrix of multiple lines of characters of equal length. In the matrix, asterisks indicate untested dies, the letter P indicates dies that passed the test, the letter F indicates dies that failed the test, and hash marks indicate user markings. The end of the file contains a line of BIN statistics.

[0029] Multi-feature scanning recognition refers to simultaneously detecting multiple features such as line length changes, key character occurrences, and whether a line contains BIN statistical information, to automatically determine the starting and ending lines of the wafer chart character matrix. For example, when scanning file content, if a line is found to have multiple asterisks starting from column index 2, and the line length is the same as the subsequent line length, then that line is identified as the starting line of the wafer chart character matrix. When a line starting with "BIN" is scanned, the line preceding that line is identified as the ending line.

[0030] The wafer image character matrix refers to a two-dimensional array composed of multiple rows of characters of equal length. Each character in the matrix represents the test status or marker of a die. For example, there are 337 rows from the start line to the end line, with each row containing 80 characters. The character sequence of the 22nd row is "::PPPPPPPPFPPPPPPPP...", where asterisks, P, F, etc., are arranged in column alignment. The start and end lines refer to the start and end line numbers of the wafer image character matrix in the text file. For example, if the start line is line 21 and the end line is line 357, the wafer image character matrix contains all lines from line 21 to line 357.

[0031] S2. Traverse each row of the wafer image character matrix, extract the column index of all first preset characters in each row, divide the first preset characters with consecutive column indices into the same continuous block, and obtain at least one continuous block in each row; determine the continuous block with the smallest column index in each row as the left block, and determine the continuous block with the largest column index as the right block.

[0032] The first preset character refers to a pre-defined symbol used to characterize untested dies or boundary fill characters; for example, the first preset character is an asterisk character, in which an asterisk in the wafer map character matrix indicates that there is no test data at that position or that it belongs to an area outside the physical edge of the wafer. The column index refers to the horizontal position number of the character in a certain row of the wafer map character matrix, and the numbering starts from 0 and is counted sequentially; for example, in the string in the 22nd row, the leftmost colon is located at column index 0, the first asterisk is located at column index 2, and the column index of each character increases by 1 from left to right.

[0033] In this context, a contiguous block refers to a set of column indexes in the same row whose column indexes are consecutive and whose characters are all the first preset character, and these column indexes are not separated by other characters; for example, in row 22, the four asterisks corresponding to column indices 2, 3, 4, and 5 form a contiguous block because the difference between column indexes 2 and 3 is 1, the difference between 3 and 4 is 1, and the difference between 4 and 5 is 1, and there are no other characters in between.

[0034] In this context, the left block refers to the contiguous block with the smallest column index among all contiguous blocks in a row, representing the first predefined character region near the left physical edge of the wafer diagram. For example, in row 22, there are two contiguous blocks, one located at column indices 2 to 5 and the other at column indices 30 to 40. The block with column indices 2 to 5 has a smaller column index and is therefore identified as the left block. The right block refers to the contiguous block with the largest column index among all contiguous blocks in a row, representing the first predefined character region near the right physical edge of the wafer diagram. For example, in row 22, the contiguous block with column indices 30 to 40 has a larger column index and is therefore identified as the right block.

[0035] S3. Select N column indices of the first preset character from the rightmost side of the left block of each row inwards, and select N column indices of the first preset character from the leftmost side of the right block of each row inwards. Combine each selected column index with the row number of the corresponding row to form a candidate die position, thus forming a set of candidate die positions; where N is the preset number of shrinking circles.

[0036] Here, candidate die positions refer to the row number and column index combination of the die that may require edge die replacement. Each candidate die position corresponds to a character position in the wafer diagram character matrix. For example, selecting two column indices from the rightmost side of the left block in row 22, where the rightmost column index of the left block is 5, and selecting column indices 4 and 5 inward, combined with row number 22, yields two candidate die positions (22,4) and (22,5). The candidate die position set refers to the set of all candidate die positions, which are derived from the combination of column indices selected from the left and right sides of each row and their corresponding row numbers. For example, when the preset number of shrinking circles N=2, the left side of row 22 contributes (22,4) and (22,5), and the right side contributes (22,31) and (22,32). Row 23 similarly contributes four positions, and the positions contributed by all rows together constitute the candidate die position set.

[0037] The number of shrinking circles refers to the number of die layers that need to be processed from the edge of the wafer inward, that is, the number of first preset characters selected from the rightmost side of the left block or the leftmost side of the right block inward; for example, the number of shrinking circles N=2 means that two first preset characters are selected from the inner side of the left and right edges of each row as candidate die positions.

[0038] S4. Traverse each candidate die position in the candidate die position set, and check whether there are characters that meet the preset test die conditions at multiple directly adjacent positions of the candidate die position. If there are, add the candidate die position to the replacement set; wherein, the preset test die conditions are: the character is a letter or a number, and is not equal to the preset protected character.

[0039] Directly adjacent positions refer to the neighboring positions that are directly connected to the given die position in space, excluding diagonally adjacent positions. For example, for the candidate die position (22,4), its directly above position (21,4), directly below position (23,4), directly to the left position (22,3), and directly to the right position (22,5) are four directly adjacent positions.

[0040] The preset test die conditions refer to the pre-defined rules used to determine whether a character belongs to a valid test die. The rules require that the character is a letter or a number and is not equal to the preset protected character. For example, the character P is a letter and meets the preset test die conditions; the character F is a letter and meets the preset test die conditions; the character 9 is a number and meets the preset test die conditions; the character # is neither a letter nor a number and does not meet the preset test die conditions.

[0041] The replacement set refers to the subset of candidate die positions that have at least one directly adjacent position that satisfies the preset test die conditions. These positions will be subject to character replacement. For example, if the character at the directly adjacent position (21,4) of (22,4) is "P", which satisfies the preset test die conditions, then (22,4) is added to the replacement set. However, if the directly adjacent positions of (22,2) are all asterisks or hash symbols, and none of them satisfy the preset test die conditions, then (22,4) is not added to the replacement set. Preset protected characters refer to characters that are pre-defined and not allowed to be replaced, representing important user-defined markers. For example, if the preset protected character is the hash symbol, and the user has marked a specific die with a hash symbol, then all hash symbols will not be modified during processing.

[0042] S5. Replace the character at each candidate die position in the replacement set with the second preset character, and output the replaced wafer image.

[0043] The second preset character refers to the target character used to replace the original characters at the candidate die positions that meet the conditions. It represents die symbols marked as invalid after the shrinking operation. For example, the second preset character is the dollar sign character, and the original asterisk characters at all positions in the replacement set are rewritten as dollar signs. The replaced wafer map refers to the complete wafer map character matrix and its accompanying information obtained after modifying the characters at each candidate die position in the replacement set to the second preset character. For example, the asterisks at column indices 4 and 5 in the original character sequence of row 22 are changed to dollar signs, while the remaining characters remain unchanged. The entire row, together with other unmodified rows, constitutes the replaced wafer map.

[0044] The technical solution of this embodiment identifies the start and end rows of the wafer image character matrix through multi-feature scanning and extracts the matrix. It analyzes the column index continuous blocks of preset characters line by line to accurately locate the left and right edge regions. It selects candidate die positions from the edge inward according to the preset number of shrinking circles. Combined with multi-directional neighborhood detection and protected character filtering strategies, it screens replacement targets. This solves the problems in the prior art, such as the difficulty in locating the start and end rows of the matrix due to differences in file header format, the difficulty in identifying physical edges and internal hole boundaries due to fixed line-by-line truncation, resulting in misselection or omission of edge dies, and the failure to establish a character-level protection mechanism for global replacement, which leads to the accidental rewriting of protected information. It improves the accuracy of edge die processing of text wafer images and cross-platform universal adaptability, and enhances the reliability of yield analysis.

[0045] In one alternative approach, the first preset character is an asterisk character, the second preset character is a dollar sign character or the letter M character, and the preset protected character is a hash character.

[0046] In the above optional methods, the specific types of the first preset character, the second preset character, and the protected character are further defined to make the character replacement rules clearer, avoid parsing ambiguity due to differences in character encoding between different platforms or tools, and improve the execution consistency of the method in cross-platform scenarios.

[0047] In one alternative approach, the alphanumeric characters in the preset test die conditions represent tested dies, which include die that passed the test and die that failed the test.

[0048] Among them, the tested die refers to the die that has actually undergone electrical testing in the wafer probe test and obtained the test results. Its characters are usually letters or numbers; for example, the character P indicates a die that passed the test, the character F indicates a die that failed the test, and the character 1 indicates a die of a certain BIN category. These are all considered tested dies.

[0049] In this context, a "test-passed die" refers to a die whose electrical parameters meet specifications after probe testing and are therefore deemed a good product. In a wafer diagram, this is typically represented by the letter "P." For example, a "P" in a wafer diagram matrix indicates that the die at that location has passed the test. Conversely, a "test-failed die" refers to a die whose electrical parameters do not meet specifications after probe testing and are therefore deemed a defective product. In a wafer diagram, this is typically represented by the letter "F." For example, an "F" in a wafer diagram matrix indicates that the die at that location has failed the test.

[0050] Among the above-mentioned optional methods, the tested dies are further defined to include dies that have passed the test and dies that have failed the test. This makes the identification range of valid test data more complete during the neighborhood detection process, avoids the omission of edge die screening due to only identifying part of the test results, and improves the accuracy of replacement target determination.

[0051] In one alternative approach, the plurality of directly adjacent positions include four directly adjacent positions: directly above, directly below, directly to the left, and directly to the right of the candidate die position.

[0052] Among the above-mentioned optional methods, the multi-directional neighborhood detection is further limited to four directly adjacent positions: directly above, directly below, directly to the left, and directly to the right. This makes the neighborhood determination range of the candidate die position clearer, eliminates interference from non-directly adjacent positions such as diagonals, and improves the accuracy of edge region screening.

[0053] In one alternative approach, the step of dividing the first preset characters of the column index into the same contiguous block includes: If the difference between the column index of the current first preset character and the column index of the previous first preset character is 1, then the current first preset character is assigned to the contiguous block where the previous first preset character is located.

[0054] The difference in column indices refers to the difference between the column indices of two adjacent first preset characters in the same row, used to determine whether the two characters belong to the same contiguous block. For example, if the current first preset character column index is 5 and the previous first preset character column index is 4, the difference in column indices d = 5 - 4 = 1, then the two characters belong to the same contiguous block. If the current column index is 7 and the previous one is 5, the difference is 2, then they do not belong to the same contiguous block.

[0055] If the difference between the column indices is greater than 1, a new contiguous block is created.

[0056] A new contiguous block refers to a situation where, when the difference between column indices is greater than 1, the current first preset character cannot be included in the previous contiguous block, so a new contiguous block is created, starting from the current column index. For example, if the column indices of the first preset character in a row are 2, 3, 4, 7, 8, and 9, then 2, 3, and 4 form a contiguous block. The difference between column indices 4 and 7 is 3, which is greater than 1, so column indices 7, 8, and 9 form a new contiguous block.

[0057] In the above optional methods, the rules for dividing continuous blocks are further refined. The character's affiliation is determined by whether the difference between the column indices is 1, so that multiple preset characters distributed at intervals in the same row can be accurately distinguished as independent continuous blocks, avoiding confusion between edge areas and non-edge areas, and improving the reliability of left and right side block positioning.

[0058] In one alternative approach, the left block is the contiguous block with the smallest column index among all contiguous blocks in each row, and the right block is the contiguous block with the largest column index among all contiguous blocks in each row.

[0059] Among the above optional methods, the selection criteria for the left and right blocks are further clarified as the contiguous blocks with the smallest and largest column indices. This makes the selection logic of the edge region clearer when there are multiple interval regions in each row, avoids the middle empty region being misjudged as an edge, and improves the accuracy of left and right edge positioning.

[0060] In one alternative approach, it also includes: In the expanded circle operation mode, the character at each candidate die position in the replacement set is replaced with a first preset character.

[0061] In the expanded circle operation mode, the second preset character is replaced with the first preset character, and the candidate die positions in the replacement set are re-determined based on the candidate die position set and the determination results of the multiple directly adjacent positions.

[0062] Among them, the expansion circle operation mode refers to the processing mode opposite to the shrink circle operation mode. In this mode, the die that was originally marked as invalid or edge is restored to the first preset character, or the second preset character is changed back to the first preset character. For example, after the edge asterisk is replaced with a dollar sign in the shrink circle mode, the expansion circle operation mode will replace the dollar signs in the replacement set back to asterisks. At the same time, the judgment logic of the replacement set is the same as that of the shrink circle mode, but the replacement target becomes the first preset character.

[0063] Among the above optional methods, an expansion operation mode is further added, which supports restoring the replaced character to the first preset character, so that the method can be applied in both shrinking and expanding circle scenarios, improving the flexibility and reversibility of the edge die processing process and meeting the process requirements of different testing stages.

[0064] This embodiment uses a specific example of a shrinking circle. The test data is a text wafer image file named "A072721-20.txt". The wafer size is 8 inches. In the coordinate system, the maximum X value is 395, the maximum Y value is 357, the flat edge direction is 270 degrees, and the flat edge direction is LEFT. The user-defined symbol is the hash symbol. The data characteristics are: the wafer image is circular, with a large number of asterisk characters (representing untested dies) and dot characters (representing external blank areas) distributed around the perimeter. Inside the wafer image are test dies composed of letters or numbers, where the letter P represents a die that passed the test, and the letter F represents a die that failed the test.

[0065] When applying the processing method provided in this embodiment, the processing parameters are set as follows: the operation mode is the shrinking operation mode, the number of shrinking circles N is 2, and the replacement character is the dollar sign character.

[0066] To visually demonstrate the changes in characters before and after processing, representative rows 22 to 26 (i.e., matrix row indices 21 to 25) were selected from the wafer image character matrix for comparison. Figure 2 The text shows the character content from rows 22 to 26 of the original wafer image character matrix. Figure 2 In the middle, each line of character sequence has consecutive asterisk characters distributed on the left and right sides. The asterisk characters are directly adjacent to the internal test die characters (P or F), and the outer blank area is filled with dot characters.

[0067] After the shrinking process (N=2 shrinking circles, and the replacement character is the dollar sign character), the replaced wafer image is output. Figure 3 The text shows the character content in rows 22 to 26 of the replaced wafer diagram.

[0068] Taking line 22 as an example, a difference analysis was performed on the character changes before and after processing, and the results are shown in Table 1.

[0069] Table 1:

[0070] In Table 1, the original characters at the left edge position (the innermost two asterisks in the asterisk block immediately adjacent to the test die character P) are two asterisks, and after processing, they become two dollar signs. This indicates that the two first preset characters selected from the rightmost side of the left block were correctly replaced with the second preset characters, achieving precise circle reduction. Similarly, the original characters at the right edge position (the innermost two asterisks in the asterisk block immediately adjacent to the test die character P) are two asterisks, and after processing, they also become two dollar signs. This indicates that the two first preset characters selected from the leftmost side of the right block were correctly replaced with the second preset characters, also achieving precise circle reduction. The original characters of the internal test dies (including the letters P and F) remain unchanged before and after processing, both being either P or F. This indicates that the internal test dies were not modified, and data integrity is guaranteed. The original characters of the external asterisk characters far from the edge are asterisks, and after processing, they remain asterisks. This indicates that no over-replacement occurred; only the characters at the candidate die positions selected into the replacement set were modified.

[0071] The verification of key technical points in this embodiment can be viewed from three aspects.

[0072] First, the contiguous block segmentation and positioning are precise. The algorithm automatically identifies the two consecutive asterisk blocks on the left and right sides of each line, and selects two candidate die positions from the innermost edge of each block inwards. In the processing results, character changes are strictly limited to the edge asterisks immediately adjacent to the character P on the test die; the outer blank areas (dot character areas) and the outermost asterisks are unaffected.

[0073] Second, the four-neighbor cross method is valid. Only the asterisk character immediately adjacent to the test die character (P or F) is added to the replacement set and replaced with a dollar sign. In the upper and lower edge areas of the wafer map, if there is no test die character in the four directly adjacent positions above, below, to the left, or to the right of a candidate die position, the candidate die position will not be replaced, thus forming a broken loop effect that conforms to the physical outline of the wafer.

[0074] Third, special symbols protect security. Throughout the entire process, all user-marked hash symbols were not modified. This is because the preset test die conditions limit the characters to letters or numbers that are not equal to the preset protected characters (hash symbols). The hash symbols do not meet this condition, thus preventing accidental modification of protected characters at the source.

[0075] This example demonstrates that the edge die processing method for text wafer images provided in this embodiment can automatically and accurately complete the edge shrinking processing of irregular text wafer images, achieving the technical effects of accurately locating the inner edge die, safely protecting user-marked characters, and adaptively parsing different format files.

[0076] Figure 4 This diagram illustrates a structural schematic of an embodiment of an edge die processing system 200 for text wafer diagrams provided by the present invention. (See attached diagram.) Figure 4 As shown, the edge die processing system 200 for the text wafer diagram includes: Extraction module 201 is used to read a file containing a text wafer image, identify the start and end lines of the wafer image character matrix through multi-feature scanning, and extract the wafer image character matrix; The traversal module 202 is used to traverse each row in the wafer diagram character matrix, extract the column index of all first preset characters in each row, divide the first preset characters with consecutive column indices into the same continuous block, and obtain at least one continuous block in each row; the continuous block with the smallest column index in each row is determined as the left block, and the continuous block with the largest column index is determined as the right block. The selection module 203 is used to select N column indices of the first preset character from the rightmost side of the left block of each row and from the leftmost side of the right block of each row, and to combine each selected column index with the row number of the corresponding row to form a candidate die position, thereby forming a candidate die position set; where N is the preset number of shrinking circles. The replacement module 204 is used to traverse each candidate die position in the candidate die position set, check whether there are characters that meet the preset test die conditions in multiple directly adjacent positions of the candidate die position, and if so, add the candidate die position to the replacement set; wherein, the preset test die conditions are: the character is a letter or a number, and is not equal to a preset protected character; The output module 205 is used to replace the character at each candidate die position in the replacement set with a second preset character and output the replaced wafer image.

[0077] In one alternative approach, the first preset character is an asterisk character, the second preset character is a dollar sign character or the letter M character, and the preset protected character is a hash character.

[0078] In one alternative approach, the alphanumeric characters in the preset test die conditions represent tested dies, which include die that passed the test and die that failed the test.

[0079] In one alternative approach, the plurality of directly adjacent positions include four directly adjacent positions: directly above, directly below, directly to the left, and directly to the right of the candidate die position.

[0080] In an alternative embodiment, the traversal module 202 is specifically used for: If the difference between the column index of the current first preset character and the column index of the previous first preset character is 1, then the current first preset character is assigned to the contiguous block where the previous first preset character is located. If the difference between the column indices is greater than 1, a new contiguous block is created.

[0081] In one alternative approach, the left block is the contiguous block with the smallest column index among all contiguous blocks in each row, and the right block is the contiguous block with the largest column index among all contiguous blocks in each row.

[0082] In an alternative embodiment, the replacement module 204 is further configured to: In the expanded circle operation mode, the character at each candidate die position in the replacement set is replaced with a first preset character; wherein, in the expanded circle operation mode, the second preset character is replaced with the first preset character, and the candidate die positions in the replacement set are re-determined based on the candidate die position set and the determination results of the plurality of directly adjacent positions.

[0083] It should be noted that the beneficial effects of the edge die processing system 200 for text wafer images provided in the above embodiments are the same as those of the edge die processing method for text wafer images described above, and will not be repeated here. Furthermore, the system provided in the above embodiments is only illustrated by the division of the above functional modules. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the system can be divided into different functional modules according to the actual situation to complete all or part of the functions described above. In addition, the system and method embodiments provided in the above embodiments belong to the same concept, and their specific implementation process is detailed in the method embodiments, and will not be repeated here.

[0084] The edge die processing system 200 for text wafer images of the present invention can be a computer program (including program code) running on a computer device. For example, the edge die processing system 200 for text wafer images of the present invention is an application software that can be used to execute the corresponding steps in the edge die processing method for text wafer images of the present invention.

[0085] In some embodiments, the edge die processing system 200 for text wafer images of the present invention can be implemented in a combination of hardware and software. As an example, the edge die processing system 200 for text wafer images of the present invention can be a processor in the form of a hardware decoding processor, which is programmed to execute the edge die processing method for text wafer images of the present invention. For example, the processor in the form of a hardware decoding processor can be one or more application-specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), or other electronic components.

[0086] The modules described in the embodiments of this invention can be implemented in software or hardware. The names of the modules are not, in some cases, limiting the scope of the module itself.

[0087] An electronic device according to an embodiment of the present invention includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements any of the above-described edge die processing methods for text wafer images. That is, an electronic device according to an embodiment of the present invention may include, but is not limited to: a processor and a memory; the memory is used to store the computer program; the processor is used to execute the edge die processing method for text wafer images shown in any embodiment of the present invention by calling the computer program.

[0088] In one alternative embodiment, an electronic device is provided, such as Figure 5 As shown, Figure 5The illustrated electronic device 4000 includes a processor 4001 and a memory 4003. The processor 4001 and the memory 4003 are connected, for example, via a bus 4002. Optionally, the electronic device 4000 may further include a transceiver 4004, which can be used for data interaction between the electronic device and other electronic devices, such as sending and / or receiving data. It should be noted that in practical applications, the transceiver 4004 is not limited to one type, and the structure of the electronic device 4000 does not constitute a limitation on the embodiments of the present invention.

[0089] Processor 4001 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It can implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this invention. Processor 4001 may also be a combination that implements computational functions, such as including one or more microprocessor combinations, a combination of a DSP and a microprocessor, etc.

[0090] Bus 4002 may include a path for transmitting information between the aforementioned components. Bus 4002 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. Bus 4002 can be divided into address bus, data bus, control bus, etc. For ease of representation, Figure 5 The bus 4002 is represented by only one thick line, but this does not mean that there is only one bus or one type of bus.

[0091] The memory 4003 may be ROM (Read Only Memory) or other types of static storage devices capable of storing static information and instructions, RAM (Random Access Memory) or other types of dynamic storage devices capable of storing information and instructions, or EEPROM (Electrically Erasable Programmable Read Only Memory), CD-ROM (Compact Disc Read Only Memory) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto.

[0092] The memory 4003 stores application code (computer program) for executing the present invention, and its execution is controlled by the processor 4001. The processor 4001 executes the application code stored in the memory 4003 to implement the content shown in the foregoing method embodiments.

[0093] Among them, electronic devices can also be terminal devices. A terminal device can be any terminal device that can install applications and access web pages through applications, including at least one of smartphones, tablets, laptops, desktop computers, smart speakers, smartwatches, smart TVs, and smart in-vehicle devices.

[0094] It should be noted that, Figure 5 The electronic device shown is merely an example and should not be construed as limiting the functionality and scope of the embodiments of the present invention.

[0095] An embodiment of the present invention provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements any of the above-described edge die processing methods for text wafer diagrams.

[0096] Alternatively, the computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, a floppy disk, and an optical data storage device, etc.

[0097] In an exemplary embodiment, a computer program product or computer program is also provided, which includes computer instructions stored in a computer-readable storage medium. A processor of an electronic device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the electronic device to perform the described edge die processing method for the text wafer pattern.

[0098] Computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0099] It should be understood that the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of methods and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0100] The computer-readable storage medium provided in this invention can be, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this invention, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0101] The aforementioned computer-readable storage medium carries one or more programs, which, when executed by the electronic device, cause the electronic device to perform the method shown in the above embodiments.

[0102] The above description is merely a preferred embodiment of the present invention and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this invention is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-disclosed concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this invention.

[0103] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and represent a limitation on a specific order or sequence. Where appropriate, the order of use for similar objects can be interchanged so that the embodiments of this application described herein can be implemented in an order other than that shown or described.

[0104] Those skilled in the art will recognize that this invention can be implemented as a system, method, or computer program product. Therefore, this invention can be specifically implemented in the following forms: it can be entirely hardware, entirely software (including firmware, resident software, microcode, etc.), or a combination of hardware and software, generally referred to herein as a "circuit," "module," or "system." Furthermore, in some embodiments, this invention can also be implemented as a computer program product contained in one or more computer-readable media, which includes computer-readable program code.

[0105] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method of edge die processing of a text wafer map, the method comprising: include: Read the file containing the text wafer image, identify the start and end lines of the wafer image character matrix through multi-feature scanning, and extract the wafer image character matrix; Traverse each row of the wafer image character matrix, extract the column index of all first preset characters in each row, divide the first preset characters with consecutive column indices into the same continuous block, and obtain at least one continuous block in each row. The contiguous block with the smallest column index in each row is determined as the left block, and the contiguous block with the largest column index is determined as the right block; From the rightmost edge of the left block of each row, select N column indices of the first preset character inwards; from the leftmost edge of the right block of each row, select N column indices of the first preset character inwards; combine each selected column index with the row number of the corresponding row to form a candidate die position, thus forming a set of candidate die positions; where N is the preset number of shrinking circles; Traverse each candidate die position in the candidate die position set, and check whether there are characters that satisfy the preset test die conditions in multiple directly adjacent positions of the candidate die position. If there are, add the candidate die position to the replacement set; wherein, the preset test die conditions are: the character is a letter or a number, and is not equal to the preset protected character; Replace the character at each candidate die position in the replacement set with a second preset character, and output the replaced wafer image.

2. The edge die processing method for text wafer images according to claim 1, characterized in that, The first preset character is an asterisk character, the second preset character is a dollar sign character or the letter M character, and the preset protected character is a hash character.

3. The edge die processing method for text wafer images according to claim 1, characterized in that, The alphanumeric characters in the preset test die conditions represent the die that has been tested, including die that has passed the test and die that has failed the test.

4. The edge die processing method for text wafer images according to claim 1, characterized in that, The multiple directly adjacent positions include: directly above, directly below, directly to the left, and directly to the right of the candidate die position.

5. The edge die processing method for text wafer images according to claim 1, characterized in that, The steps of dividing a column index into consecutive first preset characters into the same contiguous block include: If the difference between the column index of the current first preset character and the column index of the previous first preset character is 1, then the current first preset character is assigned to the contiguous block where the previous first preset character is located. If the difference between the column indices is greater than 1, a new contiguous block is created.

6. The edge die processing method for text wafer images according to claim 5, characterized in that, The left block is the contiguous block with the smallest column index among all contiguous blocks in each row, and the right block is the contiguous block with the largest column index among all contiguous blocks in each row.

7. The edge die processing method for text wafer images according to claim 1, characterized in that, Also includes: In the expanded circle operation mode, the character at each candidate die position in the replacement set is replaced with a first preset character; wherein, in the expanded circle operation mode, the second preset character is replaced with the first preset character, and the candidate die positions in the replacement set are re-determined based on the candidate die position set and the determination results of the plurality of directly adjacent positions.

8. An edge die processing system for a text wafer image, characterized in that, include: The extraction module is used to read a file containing a text wafer image, identify the start and end lines of the wafer image character matrix through multi-feature scanning, and extract the wafer image character matrix. The traversal module is used to traverse each row of the wafer image character matrix, extract the column index of all first preset characters in each row, divide the first preset characters with consecutive column indices into the same continuous block, and obtain at least one continuous block in each row. The contiguous block with the smallest column index in each row is determined as the left block, and the contiguous block with the largest column index is determined as the right block; The selection module is used to select N column indices of the first preset character from the rightmost side of the left block of each row and from the leftmost side of the right block of each row. The selected column indexes are combined with the row number of the corresponding row to form a candidate die position, thus forming a set of candidate die positions. Here, N is the preset number of shrinking circles. The replacement module is used to traverse each candidate die position in the candidate die position set, check whether there are characters that meet the preset test die conditions in multiple directly adjacent positions of the candidate die position, and if so, add the candidate die position to the replacement set; wherein, the preset test die conditions are: the character is a letter or a number, and is not equal to the preset protected character; The output module is used to replace the character at each candidate die position in the replacement set with a second preset character and output the replaced wafer image.

9. An electronic device, characterized in that, The electronic device includes a processor coupled to a memory storing at least one computer program, which is loaded and executed by the processor to enable the electronic device to implement the edge die processing method for text wafer diagrams as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores at least one computer program, which, when executed by a processor, implements the edge die processing method for a text wafer image as described in any one of claims 1 to 7.

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