Energy-saving heat dissipation device and switch cabinet

Abstract

The application relates to an energy-saving heat dissipation device and a switch cabinet, which comprise a cabinet body and a heat dissipation assembly, the cabinet body is used for placing electrical devices, and the heat dissipation assembly is used for cooling the inside of the cabinet body; further comprising a mounting frame and an adjusting mechanism, the mounting frame comprises a mounting base and a base assembly in sliding connection, the heat dissipation assembly is arranged on the mounting base, and the adjusting mechanism is used for adjusting the position of the mounting base on the base assembly; the adjusting mechanism comprises a temperature control assembly, the temperature control assembly realizes transmission control through temperature change, so that the position of the mounting base on the base assembly is adjusted. The heat dissipation assembly on the mounting base can realize flexible position adjustment in the cabinet body through the mounting base and the base assembly in sliding connection; the temperature control assembly is in transmission connection with the mounting base; after the temperature control assembly senses the change of temperature, the mounting base provided with the heat dissipation assembly is slid on the base assembly in the direction of temperature rise; the side with temperature rise in the cabinet body is cooled, so that the heat dissipation of the cabinet body is more efficient and flexible.

Description

Technical Field

[0001] This invention relates to the field of switchgear equipment technology, specifically to an energy-saving heat dissipation device and switchgear. Background Technology

[0002] A switch cabinet is an electrical device in which external power lines first enter the main control switch inside the cabinet, and then enter the branch control switches. Each branch circuit is configured according to its needs. Examples include instruments, automatic control systems, motor magnetic switches, various AC contactors, etc. Some switch cabinets also have high-voltage and low-voltage compartments, and are equipped with high-voltage busbars, such as in power plants. Some also have additional protection mechanisms for key equipment. low cycle load shedding .

[0003] Switchgear operates under load. During operation, the internal circuit breakers, busbars, conductive contacts, and electrical connections generate Joule heat due to the current flow. Poor heat dissipation will cause the internal temperature to rise excessively, accelerating the aging and deterioration of insulation materials, reducing insulation performance, and easily leading to faults such as insulation breakdown and short circuits. At the same time, high temperatures will exacerbate the oxidation and erosion of conductive contacts, increase contact resistance, and create a vicious cycle of increased heating. It will also affect the working stability of secondary components and protection devices, shorten the service life of equipment, and threaten the safe and reliable operation of the power supply and distribution system. Therefore, switchgear must have good heat dissipation conditions during operation.

[0004] During operation, the parts of the switchgear that are prone to overheating are mainly concentrated at the conductive connections and contact points, including busbar lap joints, circuit breaker moving and stationary contacts and stud contacts, disconnector contacts, cable inlet and outlet terminals, transformer and fuse terminals, etc. These locations are prone to overheating due to contact resistance or concentrated current.

[0005] Upper part of the cabinet (busbar compartment): cabinet top and upper cavity, corresponding to busbar lap joints and busbar disconnector contacts;

[0006] The central part of the cabinet (circuit breaker compartment): the core area in the middle of the cabinet, corresponding to the moving and stationary contacts and the Phillips-shaped contact fingers of the circuit breaker;

[0007] Lower part of the cabinet (cable compartment): The bottom of the cabinet and the lower cavity, corresponding to the cable inlet and outlet terminals and the current transformer terminals.

[0008] High-voltage switchgear currently houses high-power electrical equipment, resulting in significant heat generation within the switchgear, necessitating the use of cooling fans for heat dissipation. However, due to the large space within the switchgear, the limited number of cooling fans makes it difficult to achieve balanced and efficient heat dissipation control. Summary of the Invention

[0009] The first objective of this invention is to solve the technical problem that the large space inside the switch cabinet prevents the cooling fan from adequately cooling the heat-generating electrical equipment inside the cabinet. This invention provides an energy-saving heat dissipation device that, by setting a shape memory metal adjustment mechanism, allows the cooling fan to be adaptively adjusted according to the specific heat-generating location inside the switch cabinet, thereby achieving all-round heat dissipation inside the switch cabinet.

[0010] To achieve the above objectives, this invention provides an energy-saving heat dissipation device, including a cabinet and a heat dissipation component. The cabinet houses electrical components, and the heat dissipation component cools the interior of the cabinet. It also includes a mounting frame and an adjustment mechanism. The mounting frame includes a mounting base and a base assembly, which are slidably connected. The heat dissipation component is mounted on the mounting base, and the adjustment mechanism adjusts the position of the mounting base on the base assembly. The adjustment mechanism includes a temperature control component, which is drivenly connected to the mounting base. The temperature control component controls the position of the mounting base on the base assembly by changing the temperature. This design features a slidably connected mounting base and base assembly, allowing the heat dissipation component mounted on the mounting base to be flexibly adjusted within the cabinet. Furthermore, the temperature control component is drivenly connected to the mounting base. When the temperature control component senses a temperature change, it slides the mounting base with the heat dissipation component on the base assembly in the direction of increasing temperature, cooling the side of the cabinet where the temperature is higher, making the heat dissipation of the switch cabinet more efficient and flexible.

[0011] Preferably, the temperature control component includes a displacement memory metal and a connector. The displacement memory metal is a memory spring. The displacement memory metal includes a first memory alloy and a second memory alloy. The first memory alloy and the second memory alloy are respectively connected to the two ends of the mounting base through the connector. The displacement memory metal has a critical deformation temperature. When the temperature at the displacement memory metal reaches the critical deformation temperature, the displacement memory metal undergoes contraction deformation. The contracted displacement memory metal applies a tensile force to the mounting base through the connector, and the mounting base slides along the base assembly in the direction of the tensile force. Using a memory spring as the displacement memory metal, it has high temperature sensitivity. Once the temperature sensed by the displacement memory metal exceeds the critical deformation temperature, it will deform rapidly, causing the displacement memory metal to shrink quickly. The first memory alloy and the second memory alloy are respectively connected to the two ends of the mounting base along the extension direction of the base assembly. The first memory alloy and the second memory alloy can be affected by the temperature of different positions inside the cabinet. The deformation tension of the first memory alloy or the second memory alloy is quickly applied to the mounting base through the connector to change the position. The displacement memory metal can achieve a rapid response after the temperature rise without configuring additional electrical control equipment for the heat dissipation component, and quickly cool down the side of the cabinet where the temperature exceeds the critical deformation temperature of the displacement memory metal.

[0012] Preferably, the cabinet includes a first heat dissipation cavity and a second heat dissipation cavity, which are arranged opposite to each other within the cabinet. The base assembly includes a first heat dissipation station and a second heat dissipation station, which respectively act on the first and second heat dissipation cavities. An adjusting mechanism controls the mounting base to reciprocate between the first and second heat dissipation stations, allowing the heat dissipation assembly to cool the first and second heat dissipation cavities. In this design, the first and second heat dissipation cavities are respectively located on both sides of the switch cabinet interior, and different electrical components are placed within each cavity. When the mounting base reaches the two heat dissipation stations of the base assembly, the cooling position of the heat dissipation assembly covers both the first and second heat dissipation cavities, enabling precise and rapid cooling of the electrical components placed in both locations.

[0013] The second aspect of this invention aims to solve the technical problem of large temperature differences detected by temperature control components due to the large distance between the two sides of the heat dissipation cavity inside the cabinet. Further, it includes a steering pulley, which is disposed at both ends of the base assembly and installed in the cabinet. The connecting component includes a flexible connecting rope wound around the outer circumferential groove of the steering pulley, and the flexible connecting rope is wound around the steering pulley and has a sliding limiting engagement. The first shape memory alloy is installed on the side of the first heat dissipation cavity away from the first heat dissipation station, and the second shape memory alloy is installed on the side of the second heat dissipation cavity away from the first heat dissipation station. This solution uses a steering pulley so that the flexible connecting rope of the shape memory alloy can be rotated along the steering pulley. After rotation, the shape memory alloy can be disposed at the other end of the cabinet. When temperature control components at greater distances detect that the temperature has dropped to a safe range, it can be proven that the internal temperature of the switch cabinet has all decreased to a safe range, avoiding the problem that temperature control components can only detect local temperatures and cannot prove that all heat dissipation stations are receiving good heat dissipation.

[0014] The third aspect of this invention aims to solve the technical problem that the temperature control component, in a purely rigid tension state, lacks elastic centering constraint on both sides, causing positioning misalignment. Further, the temperature control component includes two buffer springs, each disposed between the displacement memory alloy and the mounting base. The two ends of the buffer springs are connected to the displacement memory alloy and the mounting base via connectors. The contraction stroke of the displacement memory alloy is equal to the sum of the extension stroke of the buffer spring from the reset state to the ultimate extension state and half the stroke of the mounting base on the base assembly. The extension stroke of the buffer spring from the reset state to the ultimate extension state is greater than half the stroke of the mounting base on the base assembly. When there is no unilateral temperature rise, the temperature control component, after elastic centering constraint by the buffer springs on both sides, cools down by blowing air at the center of the cabinet. After unilateral temperature rise, since only the displacement memory alloy on one side deforms while the displacement memory alloy on the other side remains stationary, the length of movement of the displacement memory alloy pulling the mounting base through the connectors is supplemented by the deformation stroke of the buffer springs. The extension stroke of the buffer springs is greater than half the stroke of the base assembly, ensuring that the mounting base moves from the center of the base assembly to both sides.

[0015] The fourth aspect of this invention aims to solve the technical problem of poor overall heat dissipation within the cabinet due to the large space on one side of the cabinet and the heat dissipation component providing localized heat dissipation in a single direction within the relatively open cabinet. Further, the heat dissipation component includes a fan and an airflow control structure. The airflow control structure is used to change the airflow direction of the fan outlet. The airflow control structure includes a mounting frame, a linkage, and multiple guide vanes. The mounting frame is connected to the fan outlet, and the multiple guide vanes are evenly arranged inside the mounting frame. A positioning shaft is provided on the inner wall of the mounting frame. The two ends of each guide vane are rotatably connected to the mounting frame via the positioning shaft, forming an airflow opening between adjacent guide vanes. The ends of the guide vanes are connected to the linkage, which controls the rotation of the guide vanes, thereby changing the direction of the airflow opening. This solution, by setting an airflow control structure, allows for the adjustment of the direction of the cooling air output by the fan. The adjusted cooling air can achieve uniform heat dissipation from multiple directions within the switch cabinet, effectively cooling the relatively open first or second heat dissipation chamber within the cabinet from multiple directions, thus improving overall heat dissipation efficiency.

[0016] Preferably, the linkage includes a connecting rope and a driving part acting on both ends of the connecting rope. The guide vanes have perforations, and the connecting rope passes through all the perforations of the guide vanes sequentially. The connecting rope has a deflecting part with an outer diameter larger than the diameter of the perforation. The driving part pulls the connecting rope in two directions, and the deflecting part drives multiple guide vanes to rotate synchronously in both the forward and reverse directions around the positioning axis. The deflecting part acts on the two end faces of the perforations on the guide vanes. Since the guide vanes rotate along the axis on the mounting frame, the positioning part on the guide vanes does not move linearly along the initial perforation axis. Therefore, this solution uses a connecting rope as the linkage component, with a positioning hole through which the connecting rope passes on the guide vanes, and a deflecting part on the connecting rope. To accommodate the rotation of the guide vanes, the deflecting part is positioned on the two end faces of the positioning hole. The deflecting part abuts against the side wall of the guide vane. When the connecting rope moves axially, the abutting part and the guide vane abut against each other, causing the guide vanes to deflect.

[0017] Preferably, the drive unit is mounted on the mounting frame. The drive unit includes a third memory alloy and an elastic element. The third memory alloy and the elastic element are in a transmission fit. The third memory alloy is a memory spring. The third memory alloy and the elastic element are respectively connected to the two ends of the series rope. The third memory alloy has a critical deformation temperature. When the recognition temperature of the third memory alloy exceeds the critical deformation temperature, the third memory alloy contracts and pulls the series rope, causing the air guide of the guide vane to rotate in the direction of the third memory alloy. A single-pass spring-type shape memory alloy is selected, with a preset critical deformation temperature approximately equal to the fan's normal outlet temperature. At room temperature, the third shape memory alloy automatically contracts and retracts, providing tension to the connecting rope, while the return spring is in a stretched state. This causes the air guide vane's air outlet to rotate towards the third shape memory alloy. Under the air guiding action, the heat dissipation component's outlet cools the third shape memory alloy. After cooling, the third shape memory alloy returns to its original position. Under the return spring's reset action, the connecting rope pulls the air guide vane's guide vane to rotate away from the third shape memory alloy, causing the heat dissipation component to cool the other direction under the air guide's rotation. This cycle repeats, driving the air guide vane to rotate in both directions, achieving automatic cyclic switching of the fan's air outlet direction.

[0018] Preferably, the elastic element is a tension spring or elastic rope, and the axis of rotation of the air guide vane is parallel to the direction of movement of the mounting base on the base assembly. This design allows the mounting base to move on the base assembly and the heat dissipation assembly to reciprocate through the airflow control structure, ensuring that the heat dissipation assembly fully covers the horizontal and vertical heat dissipation areas of the cabinet.

[0019] Preferably, a switch cabinet includes an energy-saving heat dissipation device and an exhaust assembly. The exhaust assembly is installed on the side wall of the cabinet, and the side wall of the cabinet has airflow guiding ventilation holes. The exhaust assembly is used to exhaust air from inside the cabinet to the outside of the cabinet. The arrangement of the airflow guiding ventilation holes and the exhaust assembly allows for air circulation between the inside and outside of the switch cabinet.

[0020] The beneficial effects of this invention are as follows: the mounting base and base assembly are provided with a sliding connection, which allows the heat dissipation component on the mounting base to be flexibly adjusted in position within the cabinet. Furthermore, a temperature control component is provided and is connected to the mounting base for transmission. When the temperature control component senses a temperature change, it slides the mounting base with the heat dissipation component on the base assembly in the direction of rising temperature, thereby cooling the side of the cabinet where the temperature is rising. This makes the heat dissipation of the switch cabinet more efficient and flexible. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 .

[0022] Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 .

[0023] Figure 3 This is a schematic diagram of the structure of the present invention. Figure 3 .

[0024] Figure 4 This is a schematic diagram of the wind direction control structure of the present invention.

[0025] The reference numerals in the attached drawings include: 1. Cabinet; 11. First heat dissipation cavity; 12. Second heat dissipation cavity; 13. Airflow guide vent; 14. Electrical component; 2. Base assembly; 21. First heat dissipation station; 22. Second heat dissipation station; 23. Limiting baffle; 3. Mounting seat; 4. Adjustment mechanism; 41. First shape memory alloy; 42. Second shape memory alloy; 43. Connecting component; 5. Steering pulley; 6. Buffer spring; 7. Heat dissipation assembly; 8. Airflow control structure; 81. Air guide vane; 82. Mounting frame; 821. Positioning shaft; 83. Connecting rope; 831. Actuating part; 84. Driving component; 841. Third shape memory alloy; 842. Elastic component; 85. Air vent. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure.

[0027] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" are defined based on the contours of the corresponding components. Terms such as "first" and "second" used in this disclosure are for distinguishing one element from another and do not imply sequence or importance.

[0028] Example 1

[0029] like Figures 1-4 As shown, the present invention provides an energy-saving heat dissipation device, including a cabinet 1 and a heat dissipation component 7. The cabinet 1 is used to house electrical components 14, and the heat dissipation component 7 is used to cool the interior of the cabinet 1. It also includes a mounting frame and an adjustment mechanism 4. The mounting frame includes a mounting base 3 and a base assembly 2. The mounting base 3 and the base assembly 2 are slidably connected. The heat dissipation component 7 is disposed on the mounting base 3. The adjustment mechanism 4 is used to adjust the position of the mounting base 3 on the base assembly 2. The adjustment mechanism 4 includes a temperature control component, which is drivenly connected to the mounting base 3. The temperature control component achieves transmission control by changing the temperature, so that the position of the mounting base 3 on the base assembly 2 can be adjusted.

[0030] The mounting base 3 and base assembly 2 are provided with a sliding connection, which allows the heat dissipation component 7 on the mounting base 3 to be flexibly adjusted in position within the cabinet 1. A temperature control component is also provided and is connected to the mounting base 3. When the temperature control component senses a temperature change, it slides the mounting base 3 with the heat dissipation component 7 on the base assembly 2 in the direction of rising temperature, thereby cooling the side of the cabinet 1 where the temperature is rising. This makes the heat dissipation of the switch cabinet 1 more efficient and flexible.

[0031] The temperature control component includes a displacement memory metal and a connector 43. The displacement memory metal is a memory spring. The displacement memory metal includes a first memory alloy 41 and a second memory alloy 42. The first memory alloy 41 and the second memory alloy 42 are respectively connected to the two ends of the mounting base 3 through the connector 43. The displacement memory metal has a critical deformation temperature. When the temperature at the displacement memory metal reaches the critical deformation temperature, the displacement memory metal undergoes contraction deformation. The contracted displacement memory metal applies a tensile force to the mounting base 3 through the connector 43, and the mounting base 3 slides along the base assembly 2 in the direction of the tensile force.

[0032] Using a memory spring as the displacement memory metal, it has high temperature sensitivity. Once the temperature sensed by the displacement memory metal exceeds the critical deformation temperature, it will deform rapidly, causing the displacement memory metal to shrink quickly. The first memory alloy 41 and the second memory alloy 42 are respectively connected to the two ends of the mounting base 3 along the extension direction of the base assembly 2. The first memory alloy 41 and the second memory alloy 42 can be affected by the temperature of different positions inside the cabinet 1. The deformation tension of the first memory alloy 41 or the second memory alloy 42 is quickly applied to the mounting base 3 through the connector 43 to change the position. The displacement memory metal can achieve a rapid response after the temperature rise without configuring additional electrical control equipment for the heat dissipation assembly 7, and quickly cool down the side of the cabinet 1 where the temperature exceeds the critical deformation temperature of the displacement memory metal.

[0033] The cabinet 1 includes a first heat dissipation cavity 11 and a second heat dissipation cavity 12, which are arranged opposite to each other inside the cabinet 1. The base assembly 2 includes a first heat dissipation station 21 and a second heat dissipation station 22, which act on the first heat dissipation cavity 11 and the second heat dissipation cavity 12 respectively. The mounting base 3 is controlled to reciprocate in the first heat dissipation station 21 and the second heat dissipation station 22 by the adjustment mechanism 4, so that the heat dissipation assembly 7 dissipates heat from the first heat dissipation cavity 11 and the second heat dissipation cavity 12.

[0034] In this embodiment, the first heat dissipation cavity 11 and the second heat dissipation cavity 12 are respectively located on both sides inside the switch cabinet 1. Different electrical components 14 are placed in the first heat dissipation cavity 11 and the second heat dissipation cavity 12 respectively. When the mounting base 3 reaches the two heat dissipation positions of the base assembly 2, the cooling position of the heat dissipation assembly 7 can cover the first heat dissipation cavity 11 and the second heat dissipation cavity 12, so as to accurately and quickly cool down the electrical components 14 placed in the two locations.

[0035] Example 2

[0036] like Figures 1-3 As shown, in order to solve the technical problem that the large distance between the two sides of the heat dissipation cavity inside the cabinet 1 leads to a large temperature difference recognized by the temperature control component, based on embodiment 1, this embodiment also includes a steering pulley 5. The steering pulley 5 is disposed at both ends of the base assembly 2 and installed on the cabinet 1. The connecting member 43 includes a flexible connecting rope, which is wound around the outer circumferential groove of the steering pulley 5 and is slidably limited and engaged with the steering pulley 5. The first shape memory alloy 41 is installed on the side of the first heat dissipation cavity 11 away from the first heat dissipation station 11, and the second shape memory alloy 42 is installed on the side of the second heat dissipation cavity 12 away from the first heat dissipation station 12.

[0037] In this embodiment, a fixed guide pulley 5 is provided so that the flexible connecting rope of the displacement memory alloy can be turned along the fixed guide pulley 5. After the displacement memory alloy is turned, it can be placed at the other end of the cabinet 1. When the temperature control components at a greater distance all detect that the temperature has dropped to a safe range, it can be proven that the internal temperature of the switch cabinet 1 has been reduced to a safe range. This avoids the problem that the temperature control components can only detect local temperature and cannot prove that the heat dissipation station has been well cooled.

[0038] In one embodiment, the heat dissipation assembly 7 is needed to cool down the switch cabinet in both the left and right directions. Therefore, the base assembly 2 is set on the top of the cabinet 1. The first heat dissipation cavity 11 and the second heat dissipation cavity 12 are respectively the left and right sides of the extension direction of the base assembly 2 inside the cabinet 1. The mounting seat 3 with the heat dissipation assembly 7 is installed and reciprocates along the base assembly in the horizontal direction. The bottom of the first shape memory alloy 41 and the second shape memory alloy 42 is set on the bottom surface of the cabinet 1, and two steering and positioning pulleys 5 are set on both sides of the extension direction of the base assembly 2.

[0039] In another embodiment, the heat dissipation assembly 7 is required to dissipate heat and cool the switch cabinet in both the upper and lower directions. Therefore, the base assembly 2 is set on the side wall of the cabinet. The first heat dissipation cavity 11 and the second heat dissipation cavity 12 are the upper and lower ends of the extension direction of the base assembly 2 in the cabinet 1, respectively. The mounting seat 3 with the heat dissipation assembly 7 is installed and reciprocates along the base assembly in the vertical direction. The bottom of the first shape memory alloy 41 and the second shape memory alloy 42 is set on the side of the cabinet 1, and the two steering positioning pulleys 5 are still set on both sides of the extension direction of the base assembly 2.

[0040] Another implementation method is, such as Figure 3 As shown, in this embodiment, the first memory alloy 41 and the second memory alloy 42 are both disposed on the top surface of the electrical device, so that the displacement memory metal can not only identify the temperature of the space, but also directly contact the electrical device to conduct temperature; the heat dissipation assembly is disposed on the top of the cabinet through the mounting base and the base assembly to dissipate heat from the electrical devices disposed in the first heat dissipation station and the second heat dissipation station. In order to make the displacement memory metal arranged laterally on the surface of the electrical device, two fixed pulleys need to be set on one side for directional adjustment.

[0041] To address the technical problem of positioning misalignment caused by the lack of elastic centering constraint on both sides when the temperature control component is in a purely rigid tension state, this embodiment of the temperature control component also includes two buffer springs 6. The two buffer springs 6 are respectively disposed between the displacement memory alloy and the mounting base 3. The two ends of the buffer springs 6 are respectively connected to the displacement memory alloy and the mounting base 3 through connectors 43. The contraction stroke of the displacement memory alloy is equal to the sum of the extension stroke of the buffer spring 6 from the reset state to the ultimate tension state and half the stroke of the mounting base on the base assembly. The extension stroke of the buffer spring 6 from the reset state to the ultimate tension state is greater than half the stroke of the base assembly 2.

[0042] like Figure 1 As shown, when there is no temperature rise on one side, the temperature control component is elastically centered and constrained by the buffer springs 6 on both sides, and then the temperature control component blows air to cool down in the middle position of the cabinet 1.

[0043] After heating on one side, since only the displacement memory metal on one side deforms while the displacement memory metal on the other side remains stationary, the length of movement of the displacement memory metal pulling the mounting base 3 through the connector 43 is supplemented by the deformation stroke of the buffer spring 6. The stretching stroke of the buffer spring 6 is greater than half the stroke of the base assembly 2, which ensures that the mounting base 3 can reach both sides of the base assembly 2 from the middle.

[0044] like Figure 2 As shown, the initial length of the displacement memory metal is set to c, and the length of the displacement memory metal after reaching the critical deformation temperature is set to d; the initial length of the buffer spring is set to a, the maximum tensile length of the buffer spring is set to b, and the normal length of the buffer spring after being stretched is set to b0; the travel length of the mounting base from the middle position of the base assembly to the side is e, and the total displacement travel from the first heat dissipation station to the second heat dissipation station of the base assembly 2 is 2a. Therefore, when adjusting the position of the heat dissipation component, the contraction stroke of the displacement memory alloy is (cd), and the extension stroke of the buffer spring is (ba); since the heat dissipation component on the mounting base has a certain weight, if the mounting base slides on the base assembly, a certain pulling force needs to be applied.

[0045] To enable the mounting base to slide on the base assembly after the displacement memory alloy contracts, taking the deformation of the first deformation alloy 41 as an example, when the temperature of the electrical component on one side of the first deformation alloy rises, the first deformation alloy contracts after its temperature exceeds the critical deformation temperature. The contraction stroke of the first deformation alloy first causes the buffer spring on the same side to stretch. Initially, the stretching force of the buffer spring is less than the static friction of the mounting base. After the deformation of the first deformation alloy stretches the buffer spring to the rigid limit (ultimate stretching state), the tension is then transmitted to the mounting base to overcome the static friction. The buffer spring on the first deformation alloy side transmits the tension to the mounting base, and through continuous tension, the mounting base begins to move in the traction direction on the base assembly. Movement; Since the second deformation alloy does not deform and remains unchanged, the buffer spring on the second deformation alloy 42 side is continuously stretched as the mounting seat slides. The stretching deformation of the buffer spring on the second deformation alloy 42 side is the sliding stroke of the mounting seat on the base assembly, then e=(b0-a), (cd)=(ba)+e; In order for the mounting seat to reach the outermost side of the base assembly each time, the stretching stroke of the buffer spring from the reset state to the ultimate stretching state needs to be greater than half the stroke of the base assembly 2, then e<(ba), so that the sliding is formed within the ultimate stretching deformation of the buffer spring, avoiding insufficient stretching deformation of the buffer spring and overstretching, which would affect the life of the buffer spring.

[0046] When the temperature of the first deformed alloy decreases and it resets, the tension is released. The elastic potential energy of the buffer spring on the second deformed alloy side is released, and the mounting base is pulled back to the initial position in the middle of the base assembly by the elastic reset tension, without the need for an additional reset drive mechanism.

[0047] It is worth noting that the ultimate tensile length mentioned in this application for the buffer spring is the limit position for rigid force transmission after the end of the empty stroke of the tension. After reaching the limit, the tension of the spring will no longer increase, and all the new load will be borne by the mounting base. It is a mechanically designed boundary of constraint, not a physical limit of the material. Therefore, there will be no failure state where the spring is stretched to the point of material yielding.

[0048] Example 3

[0049] like Figure 4As shown, to address the technical problem of poor overall heat dissipation within the cabinet 1 due to the large space on one side of the cabinet 1 and the heat dissipation component 7 providing localized heat dissipation in a single direction within the relatively open cabinet 1, based on Embodiment 1, the heat dissipation component 7 in this embodiment includes a fan and an airflow control structure 8. The airflow control structure 8 is used to change the airflow direction of the fan outlet. The airflow control structure 8 includes a mounting frame 82, a linkage component, and multiple air guide blades 81. The mounting frame 82 is connected to the fan outlet, and the multiple air guide blades 81 are evenly arranged inside the mounting frame 82. A positioning shaft 821 is provided on the inner wall of the mounting frame 82. The two ends of the air guide blades 81 are rotatably connected to the mounting frame 82 via the positioning shaft 821, forming an airflow opening 85 between adjacent air guide blades 81. The ends of the air guide blades 81 are connected to the linkage component, which controls the rotation of the air guide blades 81 to change the direction of the airflow opening 85.

[0050] By setting the airflow control structure 8, the direction of the cooling air output by the fan can be adjusted. The adjusted cooling air can achieve uniform cooling in multiple directions inside the cabinet 1 of the switch cabinet, and can fully cool the relatively open first cooling cavity 11 or second cooling cavity 12 inside the cabinet 1 in multiple directions, thereby improving the overall cooling efficiency.

[0051] like Figure 3 As shown, the linkage includes a series rope 83 and a drive unit 84 acting on both ends of the series rope 83. The air guide blades 81 have through holes. The series rope 83 passes through the through holes of all the air guide blades 81 in sequence. The series rope 83 has a deflecting part 831 with an outer diameter larger than the diameter of the through holes. The drive unit 84 pulls the series rope 83 in two directions. The deflecting part 831 drives multiple air guide blades 81 to rotate synchronously in the forward and reverse directions around the positioning shaft 821. The deflecting part 831 acts on the two end faces of the air guide blades 81 with through holes respectively.

[0052] Since the air guide vane 81 rotates along the pivot on the mounting frame 82, the positioning part on the air guide vane 81 does not move linearly along the initial through-hole axis. Therefore, the linkage component of this solution is a linkage rope. A positioning hole for the linkage rope to pass through is opened on the air guide vane 81, and a deflecting part 831 is set on the linkage rope. In order to satisfy the rotation of the air guide vane 81, the undulating part is set at the two end faces of the positioning hole. The deflecting part 831 fits against the side wall of the air guide vane 81. When the linkage rope 83 moves axially, the deflecting part 831 and the air guide vane 81 are driven to deflect through the abutting cooperation between the deflecting part 831 and the air guide vane 81.

[0053] The drive unit 84 is mounted on the mounting frame 82. The drive unit 84 includes a third memory alloy 841 and an elastic element 842. The third memory alloy 841 and the elastic element 842 are in a transmission cooperation. The third memory alloy 841 adopts a memory spring. The third memory alloy 841 and the elastic element 842 are respectively connected to the two ends of the series rope 83. The third memory alloy 841 has a critical deformation temperature. When the recognition temperature of the third memory alloy 841 exceeds the critical deformation temperature, the third memory alloy 841 contracts and pulls the series rope 83, causing the air guide port 85 of the air guide blade 81 to rotate in the direction of the third memory alloy 841.

[0054] A single-pass spring-type shape memory alloy is selected, with a preset critical deformation temperature approximately equal to the fan's normal outlet temperature. At room temperature, the third shape memory alloy 841 automatically contracts and retracts, providing tension to the series rope 83, and the reset spring is in a stretched state, causing the air guide port 85 of the air guide blade 81 to rotate towards the third shape memory alloy 841. Under the air guiding action, the outlet of the heat dissipation component 7 can cool the third shape memory alloy 841. After cooling, the third shape memory alloy 841 resets, and under the reset action of the reset spring, the series rope 83 pulls the guide port of the air guide blade 81 to rotate away from the third shape memory alloy 841, causing the heat dissipation component 7 to cool the air in the other direction under the rotation of the air guide port 85. This cycle drives the air guide blade 81 to rotate in both directions, realizing the automatic cyclic switching of the fan's air outlet direction.

[0055] The elastic element 842 is a tension spring or elastic rope, and the axis of rotation of the guide vane 81 is parallel to the direction of movement of the mounting base 3 in the base assembly 2.

[0056] This solution enables the mounting base 3 to move on the base assembly 2 and the heat dissipation assembly 7 to be repeatedly blown by the airflow control structure 8, ensuring that the heat dissipation assembly 7 fully covers the heat dissipation position of the cabinet 1 and provides sufficient heat dissipation in both the horizontal and vertical directions.

[0057] After prolonged use, switch cabinets tend to accumulate dust inside. If dust accumulates on the fan housing, it can affect the fan's heat dissipation efficiency. To address this, this embodiment incorporates limit baffles at both ends of the base assembly to prevent the mounting base from sliding off during linear movement. Furthermore, when the mounting base reaches and collides with the limit baffles, both the mounting base and its heat dissipation components are subjected to impact force. Under this impact, the heat dissipation components vibrate, causing dust and sand particles adhering to the fan blades and housing to fall off, thus cleaning the fan.

[0058] In order to ensure that the mounting base can collide with the limiting baffle when it slides back and forth along the base assembly, the limiting baffles on both sides are symmetrically arranged at the elastic center position of the base assembly.

[0059] In addition, the side wall of the cabinet 1 of the switch cabinet in this embodiment is provided with a ventilation hole, and the cabinet is also provided with an exhaust component. The exhaust component is used to exhaust the air inside the cabinet to the outside of the cabinet. This is a design based on common knowledge. In this embodiment, the exhaust component is located at the bottom of the cabinet and the ventilation hole is located at the top of the cabinet. The ventilation hole and the exhaust component allow air to circulate between the inside and outside of the switch cabinet.

[0060] The above descriptions are merely embodiments of the present invention, and common knowledge regarding specific structures and characteristics in the solutions is not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the structure of the present invention, and these should also be considered within the scope of protection of the present invention. These modifications and improvements will not affect the effectiveness of the implementation of the present invention or the practicality of the patent.

Claims

1. An energy-saving heat dissipation device, characterized in that: The device includes a cabinet (1) and a heat dissipation assembly (7). The cabinet (1) is used to place electrical components (14), and the heat dissipation assembly (7) is used to cool the inside of the cabinet (1). The device also includes a mounting frame and an adjustment mechanism (4). The mounting frame includes a mounting base (3) and a base assembly (2). The mounting base (3) is slidably connected to the base assembly (2). The heat dissipation assembly (7) is disposed on the mounting base (3). The adjustment mechanism (4) is used to adjust the position of the mounting base (3) on the base assembly (2). The adjustment mechanism (4) includes a temperature control component. The temperature control component is connected to the mounting base (3) by transmission. The temperature control component achieves transmission control by changing the temperature, so that the mounting base (3) can be adjusted on the base assembly (2).

2. The energy-saving heat dissipation device according to claim 1, characterized in that: The temperature control component includes a displacement memory metal and a connector (43). The displacement memory metal is a memory spring. The displacement memory metal includes a first memory alloy (41) and a second memory alloy (42). The first memory alloy (41) and the second memory alloy (42) are respectively connected to the two ends of the mounting base (3) through the connector (43). The displacement memory metal has a critical deformation temperature. When the temperature at the displacement memory metal reaches the critical deformation temperature, the displacement memory metal undergoes shrinkage deformation. The shrinking displacement memory metal applies a tension force to the mounting base (3) through the connector (43). The mounting base (3) slides along the base assembly (2) in the direction of the tension force.

3. The energy-saving heat dissipation device according to claim 1, characterized in that: The cabinet (1) includes a first heat dissipation cavity (11) and a second heat dissipation cavity (12), which are arranged opposite to each other inside the cabinet (1). The base assembly (2) includes a first heat dissipation station (21) and a second heat dissipation station (22), which act on the first heat dissipation cavity (11) and the second heat dissipation cavity (12) respectively. The mounting base (3) is controlled to move back and forth between the first heat dissipation station (21) and the second heat dissipation station (22) by the adjustment mechanism (4), so that the heat dissipation assembly (7) dissipates heat from the first heat dissipation cavity (11) and the second heat dissipation cavity (12).

4. The energy-saving heat dissipation device according to claim 1, characterized in that: It also includes a steering pulley (5), which is located at both ends of the base assembly (2) and installed on the cabinet (1). The connector (43) includes a flexible connecting rope, which is wound around the outer circumferential groove of the steering pulley (5) and is wound around the steering pulley (5) and slides and limits the engagement. The first memory alloy (41) is installed on the side of the first heat dissipation cavity (11) away from the first heat dissipation station (11), and the second memory alloy (42) is installed on the side of the second heat dissipation cavity (12) away from the first heat dissipation station (12).

5. The energy-saving heat dissipation device according to claim 1, characterized in that: The temperature control component also includes two buffer springs (6), which are respectively disposed between the displacement memory alloy and the mounting base (3). The two ends of the buffer springs (6) are connected to the displacement memory alloy and the mounting base (3) respectively through connectors (43). The contraction stroke of the displacement memory alloy is equal to the sum of the extension stroke of the buffer spring (6) from the reset state to the ultimate extension state and half the stroke of the mounting base on the base assembly (2). The extension stroke of the buffer spring from the reset state to the ultimate extension state is greater than half the stroke of the mounting base on the base assembly. The extension stroke of the buffer spring (6) from the reset state to the ultimate extension state is greater than half the stroke of the base assembly (2).

6. The energy-saving heat dissipation device according to claim 1, characterized in that: The heat dissipation component (7) includes a fan and an airflow control structure (8). The airflow control structure (8) is used to change the airflow direction of the fan outlet. The airflow control structure (8) includes a mounting frame (82), a linkage component, and multiple air guide blades (81). The mounting frame (82) is connected to the air outlet of the fan. The multiple air guide blades (81) are evenly arranged inside the mounting frame (82). The inner wall of the mounting frame (82) is provided with a positioning shaft (821). The two ends of the air guide blades (81) are rotatably connected to the mounting frame (82) through the positioning shaft (821). An air guide opening (85) is formed between adjacent air guide blades (81). The end of the air guide blades (81) is connected to the linkage component. The linkage component is used to control the rotation of the air guide blades (81) to realize the change of the direction of the air guide opening (85).

7. The energy-saving heat dissipation device according to claim 6, characterized in that: The linkage includes a series rope (83) and a drive unit (84) acting on both ends of the series rope (83). The air guide blade (81) has a through hole. The series rope (83) passes through the through holes of all the air guide blades (81) in sequence. The series rope (83) has a deflecting part (831) with an outer diameter larger than the diameter of the through hole. The drive unit (84) pulls the series rope (83) in two directions. The deflecting part (831) drives multiple air guide blades (81) to rotate synchronously in the forward and reverse directions around the positioning shaft (821). The deflecting part (831) acts on the two end faces of the air guide blade (81) with through holes respectively.

8. An energy-saving heat dissipation device according to claim 6, characterized in that: The drive unit (84) is mounted on the mounting frame (82). The drive unit (84) includes a third memory alloy (841) and an elastic element (842). The third memory alloy (841) and the elastic element (842) are driven together. The third memory alloy (841) adopts a memory spring. The third memory alloy (841) and the elastic element (842) are respectively connected to the two ends of the series rope (83). The third memory alloy (841) has a critical deformation temperature. When the recognition temperature of the third memory alloy (841) exceeds the critical deformation temperature, the third memory alloy (841) contracts and pulls the series rope (83), causing the air guide port (85) of the air guide blade (81) to rotate in the direction of the third memory alloy (841).

9. An energy-saving heat dissipation device according to claim 8, characterized in that: The elastic element (842) is a tension spring or elastic rope, and the axis of rotation of the guide vane (81) is parallel to the direction of movement of the mounting base (3) on the base assembly (2).

10. A switch cabinet, characterized in that: The device includes the energy-saving heat dissipation device according to any one of claims 1 to 9, and further includes an exhaust component. The exhaust component is installed on the side wall of the cabinet (1). The side wall of the cabinet (1) is provided with a flow-guiding ventilation hole. The exhaust component is used to exhaust the air inside the cabinet to the outside of the cabinet. The air inside the switch cabinet can be circulated with the outside air through the flow-guiding ventilation hole and the exhaust component.

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