Job management device

Abstract

A job management device manages a substrate assembly line having multiple substrate assembly machines that perform substrate assembly operations. The job management device includes: a problem detection unit that detects a problem occurring in one of the multiple substrate assembly machines; a response method database that stores response methods for the problem; an update unit that updates the response methods for the problem in real time; and a job instruction unit that, when the problem detection unit detects that a problem has occurred, retrieves a response method for the problem from the response method database and instructs the operator accordingly.

Description

[0001] This application is a divisional application of the application filed on February 6, 2017, with application number 201780084796.5 and invention title "Operation Management Device". Technical Field

[0002] This manual discloses the operation management device. Background Technology

[0003] Conventional work management devices are known for managing substrate assembly lines, which have multiple substrate assembly machines that perform operations on substrates. For example, the work management device described in Patent Document 1 determines the operator to perform the support operation when the substrate assembly machine needs to perform a support operation, and notifies the determined operator of the support operation on their portable terminal. The work management device described in Patent Document 2 instructs the operator on the work items that the operator can perform when the operator detection unit detects an operator located near the location where the operator detection unit is installed. Examples of work items that the operator can perform include work items with a difficulty level below the level of difficulty for that operator.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: International Publication No. 2005 / 009101

[0007] Patent Document 2: International Publication No. 2016 / 088266 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] However, in conventional work management devices, when problems occur with the substrate processing machine, the appropriate solution cannot be automatically indicated to the operator. Therefore, operators must resort to trial and error to resolve the problem, which can sometimes take a long time.

[0010] This disclosure was made to solve the above-mentioned problems, and its main purpose is to enable operators to respond appropriately in a short time when problems occur with the substrate processing machine.

[0011] Solution for solving the problem

[0012] The operation management device disclosed herein manages a substrate processing line having multiple substrate processing machines for processing substrates. The operation management device comprises: a problem detection unit that detects a problem occurring in one of the multiple substrate processing machines; a response method database that stores response methods for the problem; an update unit that updates the response methods for the problem at any time; and an operation instruction unit that, when the problem detection unit detects that a problem has occurred, retrieves a response method for the problem from the response method database and instructs the operator accordingly.

[0013] In this job management device, when a problem occurs at one of the multiple substrate plating machines, the job instruction unit retrieves a solution for that problem from the solution database and instructs the operator accordingly. The solution database is updated continuously by the update unit. Therefore, when a new solution for a problem is discovered, it is also stored in the solution database. Thus, if the operator implements the solution instructed by the job instruction unit when a problem occurs at the substrate plating machine, there is a high probability that the problem can be appropriately addressed in a short time. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of component mounting system 1.

[0015] Figure 2 This is a 3D view of the component mounting machine 20.

[0016] Figure 3 This is a flowchart of the job support process.

[0017] Figure 4 This is a flowchart for determining the appropriate method level.

[0018] Figure 5 This is an explanatory diagram showing an example of data stored in the skill database 76.

[0019] Figure 6 This is a flowchart of the maintenance process.

[0020] Figure 7 This is an explanatory diagram showing an example of data stored in the skill database 76.

[0021] Figure 8 This is an explanatory diagram showing an example of data stored in the skill database 76. Detailed Implementation

[0022] Hereinafter, with reference to the accompanying drawings, preferred embodiments of the work management device incorporating the present disclosure will be described. Figure 1 This is a schematic diagram illustrating component mounting system 1. Figure 2This is a perspective view of the component mounting machine 20. It should be noted that in this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as follows: Figure 1 and Figure 2 As shown.

[0023] like Figure 1 As shown, the component mounting system 1 includes a mounting line 10, multiple component mounting machines 20 forming the mounting line 10, a large display device 50 equipped on the mounting line 10, a communication device 52 equipped on the mounting line 10, and a work management device 70 for managing operations on the substrate 12.

[0024] The mounting line 10 has the following structure: multiple (in this case, four) component mounting machines 20 are arranged in the left-right direction. For the substrate 12 fed in from the upstream side (left side), each component mounting machine 20 mounts the components and sends the substrate 12 with the components mounted to the downstream side (right side).

[0025] like Figure 2 As shown, the component mounting machine 20 includes a substrate conveying device 22, a head unit 30, a component camera 39, a feeder 40, and a mounting controller 48.

[0026] The substrate conveying device 22 includes a pair of conveyor belts 26, 26 (with a front-to-back gap and extending in the left-to-right direction) that are arranged with a front-to-back gap. Figure 2 (Only one side is shown in the figure). The substrate 12 is carried on the upper surface of a pair of conveyor belts 26, 26 and conveyed from left to right. When the substrate 12 reaches a predetermined pick-up position, it is supported by a plurality of support pins 28 erected on the back side. The substrate conveying device 22 is equipped with a pass sensor 25 at a predetermined position through which the substrate 12 passes. The pass sensor 25 outputs a disconnect signal when the substrate 12 is not detected, and outputs a connect signal when the substrate 12 is detected.

[0027] The head unit 30 is detachably mounted on the front surface of the X-axis slider 32. The X-axis slider 32 is slidably mounted on a pair of upper and lower guide rails 34a, 34a provided on the front surface of the Y-axis slider 34 and extending in the left-right direction. The Y-axis slider 34 is slidably mounted on a pair of left and right guide rails 36, 36 extending in the front-back direction. The head unit 30 moves in the left-right direction as the X-axis slider 32 moves in the left-right direction, and moves in the front-back direction as the Y-axis slider 34 moves in the front-back direction. It should be noted that each slider 32, 34 is driven by a drive motor (not shown). The head unit 30 has a head (rotating head) 37 with multiple suction nozzles 38. The suction nozzles 38 use pressure to adsorb components at their tips or to detach components adsorbed at their tips. The height of the suction nozzles 38 can be adjusted by a Z-axis ball screw mechanism (not shown) mounted on the head unit 30. The head 37 and suction nozzles 38 are appropriately replaced according to the type and size of the components.

[0028] The component camera 39 is positioned approximately at the center of the length in the left-right direction between the feeder mounting table 46 and the substrate conveying device 22, with the shooting direction facing upwards. The component camera 39 captures images of the components picked up by the suction nozzle 38 passing overhead, and outputs the captured images to the mounting controller 48.

[0029] Multiple feeders 40 are arranged in a left-right direction on a feeder mounting table 46 mounted in front of the component mounting machine 20. Each feeder 40 has a reel 42 with a belt wound around it. Multiple receiving recesses are provided on the surface of the belt along its length. Components are received in each receiving recess. These components are protected by a film covering the surface of the belt. The belt is unwound from the reel 42 towards the rear, and at a predetermined component feeding position, the film is peeled off, exposing the component. The exposed component is picked up by a suction nozzle 38. The operation of the feeder 40 is controlled by a feeder controller 44.

[0030] The mounting controller 48 is configured as a CPU-centric microprocessor, including a ROM for storing processing programs, an HDD for storing various data, and RAM for use as a work area. These are electrically connected via a bus (not shown). The mounting controller 48 is connected to the feeder controller 44 of the feeder 40 and the work management device 70 in a manner enabling bidirectional communication. Furthermore, the mounting controller 48 is connected to output control signals to the substrate transmission device 22, the X-axis slider 32, the Y-axis slider 34, the Z-axis ball screw mechanism, etc., and is also connected to input images from the part camera 39.

[0031] like Figure 1 As shown, the large display device 50 is, for example, a 100-inch liquid crystal display, connected to the job management device 70. The large display device 50 displays various information sent from the job management device 70.

[0032] like Figure 1 As shown, the communication device 52 is a device that can communicate with wireless tags 60 within a communication range (e.g., a range of several meters to tens of meters) via Bluetooth (registered trademark). The wireless tag 60 is attached to the worker. When communicating with the wireless tag 60 within the communication range, the communication device 52 obtains the worker ID from the wireless tag 60 and sends it to the work management device 70. It should be noted that, in addition to the wireless tag 60, the worker is also equipped with a headset 62 integrating an earpiece and microphone, and a portable terminal 64 with a display screen. The headset 62 and portable terminal 64 are wirelessly connected to the work management device 70. The communication device 52 is not only installed on the installation line 10, but also in areas near the worker (such as rest areas).

[0033] like Figure 1 As shown, the job management device 70 is a microprocessor centered on a CPU 71, and includes a ROM 72 for storing processing programs, RAM 73 for use as a work area, etc. These are electrically connected via a bus (not shown). The job management device 70 is connected to a production information database 74, a worker information database 75, and a skills database 76 in an accessible manner. The production information database 74 stores the production program and progress of the substrate 12 and is updated continuously. The worker information database 75 stores worker IDs and worker information (worker location, assigned task, skills, work status, work schedule) in a corresponding manner and is updated continuously. The skills database 76 stores solutions to problems occurring in the component mounting machines 20 of the mounting line 10 and is updated continuously. The job management device 70 communicates bidirectionally with the mounting controllers 48 of each component mounting machine 20 and the communication devices 52 equipped on the mounting line 10, etc. Furthermore, the job management device 70 outputs image signals to the display screen of a large display device 50 and the worker's portable terminal 64, or outputs sound signals to the headphones of the worker's headset 62.

[0034] Next, the operation of each component mounting machine 20 constituting the mounting line 10 will be explained. The mounting controller 48 of the component mounting machine 20 controls the substrate conveyor 22, X-axis slider 32, Y-axis slider 34, Z-axis ball screw mechanism, part camera 39, etc., based on the production program received from the work management device 70. Specifically, the mounting controller 48 causes the nozzle 38 to pick up components supplied by each feeder 40, and the part camera 39 to photograph the component. Based on the photographed image, it determines whether there is a component error, and then controls the sequential mounting of the components picked up by the nozzle 38 onto the substrate 12. Here, the presence or absence of a component error is determined by whether the nozzle 38 has picked up a component, and whether the shape, size, and picking position of the component are appropriate. If it determines that there is no component error, the mounting controller 48 controls the mounting of the component picked up by the nozzle 38 onto the substrate 12; however, if it determines that there is a component error, it controls the mounting to discard the component and re-pick up the same component (i.e., to retry). The controller 48 is installed to control the process so that if the component is not attracted by the nozzle 38 due to adsorption failure or falling, the process can be retried.

[0035] Next, the work support processing performed by the work management device 70 will be explained. Figure 3This is a flowchart of the job support process. When the CPU 71 of the job management device 70 starts the job support process, it first determines whether a problem has occurred on the mounting line 10 (S100). If the CPU 71 determines in S100 that no problem has occurred, it ends the job support process. Here, a problem refers to a situation where production on the mounting line 10 stops or production operation on the mounting line 10 decreases significantly. For example, when a device error (such as a substrate transfer error) occurs in the component mounting machine 20, the mounting controller 48 stops production and sends an error code indicating that a device error has occurred to the job management device 70. The error code is set in a way that indicates which device in the component mounting machine 20 has malfunctioned. Moreover, when retrying component pick-up occurs continuously in the component mounting machine 20, the mounting controller 48 stops production and sends an error code indicating that a component error has occurred to the job management device 70. Therefore, when the CPU 71 receives an error code from the component mounting machine 20, it determines that a problem has occurred. Furthermore, the CPU 71 of the job management device 70 continuously calculates the cycle time required for component mounting on each substrate in the mounting line 10. When the cycle time exceeds a predetermined threshold, it is determined that production has significantly decreased due to component errors, and a problem has occurred. For example, if the retry of component adsorption does not occur continuously but occurs frequently, the cycle time exceeds the threshold.

[0036] If CPU 71 determines that a problem has occurred in S100, it determines the operator responsible for handling the problem (the assigned operator) based on the operator information stored in the operator information database 75 (S110). CPU 71 retrieves currently available operators from the operator information database 75 based on the work status, work schedule, etc., and determines the assigned operator to handle the problem. It should be noted that CPU 71 identifies the assigned operator's location based on the communication results between the assigned operator's wireless tag 60 and the communication device 52. When the assigned operator is located away from the installation line 10 where the problem occurred, a movement instruction is displayed on the display device of the assigned operator's portable terminal 64. Simultaneously, CPU 71 outputs a sound-based movement instruction to the headset 62 of the assigned operator. Furthermore, CPU 71 also displays a movement instruction on the large display device 50 located near the assigned operator. Thus, the assigned operator moves towards the installation line 10 where the problem occurred.

[0037] Next, CPU71 checks whether there is an operator for the problematic installation line 10 (S120). Specifically, CPU71 checks whether there is an operator for the problematic installation line 10 based on the communication results between the operator's wireless tag 60 and the communication device 52 equipped with the problematic installation line 10.

[0038] Next, CPU71 determines whether the problem is caused by a device error or a component error (S130). Specifically, CPU71 determines whether the problem is caused by a component error or a device error based on the information used in S100.

[0039] If the cause of the problem is a device error in S130, then CPU71 executes the response method level determination process (S140). The flowchart for the response method level determination process is as follows: Figure 4 As shown. When CPU71 begins processing to determine the method level, it first obtains device information at the time of the error (S142), obtains maintenance information for the device (S144), and obtains warning information obtained through data mining (S146). Device information at the time of the error indicates the state of the device at the time of the error. Examples of device information at the time of the error include, for example, whether the output signal of a certain sensor is still on or off. Maintenance information includes past maintenance records, the next maintenance period, etc. Based on the maintenance information, it is predicted that a component should be replaced if maintenance is frequently performed, or that a component should be replaced if its replacement period is approaching, or that its maintenance should be performed earlier if its maintenance period is approaching. Warning information obtained through data mining includes information obtained by analyzing data from various sensors prior to the current error in a time sequence. For example, the warning information may be the time sequence of the output signals of various sensors obtained from the logs of various sensors prior to the current error, or the time sequence of other errors that occurred prior to the current error. Furthermore, based on the device information, maintenance information, and warning information obtained through data mining at the time of the error, CPU71 extracts the corresponding response method for this device error from the skill database 76 and determines its priority level (S148). At this time, when assigning response performance to the response method, the higher the response performance, the higher the priority level.

[0040] For example, in the case of a substrate transport error, the device information of the substrate transport device 22 is obtained to determine the state of the substrate transport device 22 when the error occurs. Here, we will take the case where the output of the sensor 25 changes to an on signal but does not change to an off signal even after a predetermined time (the substrate 12 is not picked up completely) as an example. Possible causes include loose or damaged conveyor belts 26, 26, or a faulty sensitivity setting of the sensor 25. If the cause is loose or damaged conveyor belts 26, 26, the possible solutions are to re-tighten or replace the conveyor belts 26, 26 (solution A). If the cause is a faulty sensitivity setting of the sensor 25, the possible solutions are to adjust the sensitivity of the sensor 25 (solution B). The data stored in the skill database 76 at this time is, for example... Figure 5 As shown in (A). Figure 5 The data in (A) represents the initial state, the error code is a substrate transfer error, and the assembly information at the time of the error indicates that the output of sensor 25 is still on. As a response, corresponding actions A and B will be established. This time, the maintenance information indicates that the replacement period for conveyor belts 26 is approaching, and the warning information indicates that before this error occurs, the regular and periodic switching of the on / off state of sensor 25 should be observed according to the time sequence. CPU71 writes this maintenance information and warning information into the acquired information column. Figure 5 The data for (A) is updated to Figure 5 The data in (B). Furthermore, based on this maintenance information, CPU71 determines that the loosening or damage of conveyor belts 26 is highly likely the cause, and therefore prioritizes response A over response B as its corresponding countermeasure. It should be noted that... Figure 5 In (A) and (B), the actual performance of responding to A and B is set to "None" (initial value).

[0041] After executing the response method level determination process (S140), CPU71 displays the response methods for this problem according to priority level on the large display device 50 equipped on the assembly line 10 (S150). Specifically, it instructs the operator to implement the response method with the highest priority among the response methods for this problem. The operator performs the work according to the displayed instructions, and resumes production on the assembly line 10 upon completion of the work. Next, CPU71 determines whether the problem has been resolved (S160). Specifically, CPU71 determines whether the same problem has not occurred during the period from the resumption of production until the predetermined time has elapsed. If the same problem has not occurred in S160, CPU71 considers the problem resolved, updates the skill database 76 (S170), and ends the work support process. In S170, CPU71 increments the response performance of the response method actually implemented for this problem by 1.

[0042] On the other hand, if the same problem occurs in S160, i.e., the problem remains unresolved, CPU71 returns to S150 and displays the corresponding solutions for this problem on the large display device 50 equipped on assembly line 10, according to their priority levels. Specifically, the operator is instructed to implement the second-highest priority solution for this problem. The operator performs the work according to the displayed instructions, and resumes production on assembly line 10 upon completion of the work. Next, CPU71 determines whether the problem has been resolved (S160). CPU71 repeatedly executes S150 and S160 until the problem is resolved in S160. When the problem is resolved, S170 is executed to end the work support process. It should be noted that when repeatedly executing S150 and S160, CPU71 instructs the operator in S150 to implement a solution with a priority level one place lower than the previous one.

[0043] For example, as previously explained, if the replacement period for conveyor belts 26, 26 is approaching based on past maintenance performance, priority level for response A is set higher than that for response B. In this case, CPU71 displays "Please retighten or replace the conveyor belts" (response A) on the large display device 50. Following this instruction, the operator retightens conveyor belts 26, 26. Then, if the problem is resolved, CPU71 increments the response performance of response A (the response method for this board conveyor error) by 1 (see reference). Figure 5(C)). Therefore, the next time the same error occurs (i.e., the device error is a substrate delivery error, the assembly information at the time of the error is that the output of sensor 25 is still on, the maintenance information is that the replacement period of conveyor belts 26 is approaching, and the warning information is the regular and periodic switching of sensor 25 on / off), CPU 71 instructs the operator to prioritize response A, which has the highest response performance. On the other hand, if the same error occurs again immediately after production resumes, CPU 71 displays "Please adjust the sensitivity of the sensor" (response B) on the large display device 50. Following this instruction, the operator adjusts the sensitivity of sensor 25 this time. Then, if the problem is resolved, CPU 71 increments the response performance of response B for this substrate delivery error by 1 (see reference). Figure 5 (D) Therefore, if the same error occurs again, CPU71 instructs the operator to prioritize response B, which has a higher response performance.

[0044] If the problem is caused by a component error in S130, CPU71 performs statistical analysis (S180) to determine whether the component error is caused by a problem with the equipment related to component adsorption or by a component data error (step S190). Problems with the equipment related to component adsorption include malfunctions of the head 37, nozzle 38, and feeder 40. In the case of a malfunctioning head 37, the adsorption rate of all components mounted on the component mounting machine 20 with the malfunctioning head decreases. In the case of a malfunctioning nozzle 38, the adsorption rate of all components adsorbed by the malfunctioning nozzle decreases. In the case of a malfunctioning feeder 40, the adsorption rate of all components on all reels 42 mounted on the malfunctioning feeder decreases. Furthermore, in the case of a component data error, the adsorption rate of components of the same type decreases regardless of the equipment related to component adsorption. Therefore, by statistically analyzing which phenomenon occurs, it is possible to determine whether the component error is caused by a problem with the equipment related to component adsorption or by a component data error.

[0045] In S190, if the component error is due to a faulty part of the machine related to component adsorption, CPU71 instructs the operator to continue production by replacing the machine with another machine (a machine that functions normally). The instruction to the operator is given via text output to the large display device 50. After confirming that the machine has been replaced, CPU71 ends the work support process. The disassembled machine is moved to a maintenance area (not shown) for maintenance. The flowchart of the maintenance process performed by CPU71 at this time is as follows: Figure 6As shown. When the CPU71 begins maintenance processing, it first executes the response method level determination process (S300). This response method level determination process is the same as the response method level determination process in S140, which has already been described, so its description is omitted. This determines the priority level of the response method (maintenance method) for the disassembled machine. Examples of response methods include grease injection (response P), component cleaning (response Q), and component replacement (response R). The CPU71 instructs the operator on the response method according to its priority level (S310). The operator performs the work according to the displayed instructions, and production on the assembly line 10 resumes. The CPU71 monitors the component error rate (number of component errors / number of component pick-ups) of the component mounting machine 20 and determines whether the component error rate after a predetermined period of operation is less than a predetermined threshold (S320). If it is above the predetermined threshold, it returns to S310 and instructs the operator to disassemble the machine and execute the response method (maintenance method) of the second priority level. The CPU71 repeats this operation until the component error rate is less than the predetermined threshold. Furthermore, if the component error rate is less than a predetermined threshold, the CPU 71 increments the response score of the current response method by 1 and updates the skill database 76 (S330), ending the maintenance process. This is the same as S170 described above. For example, the data in the skill database 76 at this time... Figure 7 As shown.

[0046] return Figure 3In the flowchart below, if the component error in S190 is due to a component data error, CPU71 executes a data correction level determination process (S210). This process obtains device information at the time of the error (e.g., information that the component is not reflected in the image captured by the part camera 39, or that it is reflected but discarded), and component data correction record information. Based on this information, it determines the priority level of the data correction method. The component data includes shape information such as the component's external dimensions and allowable range, as well as processing conditions during processing in the component mounting machine 20 (nozzle size, horizontal operating speed, vertical operating speed, etc.). For example, if the nozzle size is too small, the component cannot be picked up by the nozzle 38 or falls off during transport, thus the component is not reflected in the image. In this case, sometimes resetting the nozzle size to a larger value can eliminate the problem. Furthermore, if the allowable range of the external dimensions is too small, the component is determined to be unsuitable and discarded, but the component is reflected in the image. In this situation, increasing the allowable range of external dimensions can sometimes eliminate the problem. Therefore, the CPU71 can determine the priority of the component data correction method based on the device information at the time the error occurred. Furthermore, the CPU71 can identify a recently implemented correction method based on the component data correction record information, and thus lower the priority of that correction method. This is because, although the correction method has been implemented, it has not eliminated the component error.

[0047] Next, CPU 71 instructs the operator on the data correction method according to priority (S220). Furthermore, when the operator executes the data correction method and restarts component installation, CPU 71 determines whether the problem has been resolved (S230), repeating steps S220 and S230 until the problem is resolved. If the problem is resolved, CPU 71 increments the response score of the data correction method actually implemented for this problem by 1 and updates the skill database 76 (S240), ending the job support process. At this time, the data in the skill database 76 is as follows: Figure 8 As shown.

[0048] Here, the correspondence between the constituent elements of the job management device 70 of this embodiment and the constituent elements of the job management device of this disclosure will be explained. In this embodiment, the CPU 71 corresponds to the problem detection unit, the update unit, and the job instruction unit, and the skill database 76 corresponds to the solution database.

[0049] In the job management device 70 of this embodiment described in detail above, when a problem occurs in one of the multiple component mounting machines 20, the CPU 71 retrieves a solution for the problem from the skill database 76 and instructs the operator. The skill database 76 is updated by the CPU 71 at any time. Therefore, when a new solution for a problem is discovered, it is also stored in the skill database 76. Thus, when a problem occurs in the component mounting machine 20, if the operator implements the solution instructed by the job management device 70, there is a high probability that the problem can be appropriately addressed in a short time.

[0050] In addition, by trying the solutions with the highest priority in sequence, the likelihood of resolving the problem in a short time increases.

[0051] Furthermore, the higher the actual performance of the response methods that have solved the problem, the higher the priority of the response method. Therefore, the likelihood of solving the problem is further increased when implementing the high-priority response method.

[0052] Furthermore, when the cause of the problem is a device malfunction, the work management device 70 extracts a solution from the skill database 76 based on the device information at the time of the malfunction, maintenance information, and warning information obtained through data mining. Therefore, more appropriate solutions for device malfunctions can be extracted from the skill database 76. Here, the maintenance information includes past maintenance records and next maintenance schedule information for the devices equipped in the component mounting machine 20. The warning information includes timing information related to the devices equipped in the component mounting machine 20 prior to the current device malfunction. Therefore, the reliability of the extracted solution is increased.

[0053] Furthermore, when the cause of the problem is component data, the work management device 70 extracts a solution from the skill database 76 based on the device information at the time the error occurred and the component data correction record information. Therefore, it is possible to extract a more appropriate solution for component errors from the skill database 76.

[0054] It should be noted that the present invention is not limited to any of the above-described embodiments. As long as it falls within the technical scope of the present invention, it can be implemented in various forms.

[0055] For example, in the above embodiment, a case was illustrated where one job management device 70 updates the skill database 76. Update results from other job management devices 70 (storage of new response methods, updates to the performance of known response methods) can also be merged and reflected in the skill database 76. In this way, since the update results from multiple job management devices 70 are merged and reflected in the skill database 76, the reliability of the response methods is improved.

[0056] In the above embodiments, a component mounting machine 20 is exemplified as a substrate mounting machine, but it is not specifically limited to a component mounting machine 20. For example, as a substrate mounting machine arranged upstream of the component mounting machine 20, examples include a solder printing machine for printing solder paste onto the substrate and a printing inspection machine for checking the quality of the solder printing. Furthermore, as a substrate mounting machine arranged downstream of the component mounting machine 20, examples include an appearance inspection machine for inspecting the appearance of the substrate with components mounted, and a reflow soldering machine for melting the solder on the substrate with components mounted and performing soldering.

[0057] In the above embodiments, the portable terminal 64 is illustrated as a portable device for the operator to carry. However, an eyeglass-type display that uses eyeglass lenses as a display can also be installed instead of the portable terminal 64. The portable terminal 64 needs to be taken out of a pocket or bag, while the eyeglass-type display does not have this need, thus offering superior convenience.

[0058] In the above implementation, the CPU71 extracts the response method based on the device information, maintenance information, and warning information when the error occurs during the response method level determination process. However, it can also extract the response method based on one of these three pieces of information, or it can extract the response method based on two pieces of information (e.g., the assembly information and maintenance information when the error occurs, or the assembly information and warning information when the error occurs).

[0059] The operation management device disclosed herein can be configured as follows.

[0060] In the work management device disclosed herein, when the problem detection unit detects that a problem has occurred, the work instruction unit may prioritize and instruct the operator to respond to the solution method with the highest probability of resolving the problem. In this way, the operator can try the solutions sequentially from the highest priority, thereby increasing the likelihood of resolving the problem in a short time.

[0061] In this scenario, after the problem is resolved by instructing the operator to use the corresponding method through the work instruction unit, the update unit updates the response method database by increasing the performance record of the response method that actually solved the problem. The higher the performance record, the higher the priority level of the response method. Thus, the higher the performance record of the response method that actually solved the problem, the higher its priority level. Therefore, the likelihood of resolving the problem when a high-priority response method is implemented is further increased.

[0062] In the job management device disclosed herein, the updating unit may merge update results from other job management devices and reflect them in the response method database. In this way, the actual effects of multiple job management devices are reflected in the response method database, thus increasing the reliability of the response methods.

[0063] In the work management device disclosed herein, when the cause of the problem lies with the apparatus equipped on the substrate mounting machine, the work instruction unit receives at least one of the following information from the substrate mounting machine: apparatus information, maintenance information, and warning information obtained through data mining at the time the problem occurs. Based on the information received from the component mounting machine, it extracts a solution for the problem from the solution database and instructs the operator accordingly. In this way, it is possible to more appropriately extract solutions for problems caused by the apparatus equipped on the substrate mounting machine from the solution database.

[0064] The maintenance information may include past maintenance records and the next maintenance schedule for the equipment on the substrate processing machine. By taking this maintenance information into account, a solution can be developed, thus increasing the reliability of the solution. For example, if there is equipment that has been frequently maintained in the past, its product lifespan is nearing its end, so it is preferable to replace it with a new one. Furthermore, if there is equipment whose next maintenance period is approaching, it is preferable to perform maintenance on that equipment earlier.

[0065] The precursory information obtained through data mining may include timing information related to the devices equipped in the substrate processing machine prior to the occurrence of the problem. By considering such precursory information and extracting corresponding solutions, the reliability of the solutions is increased. For example, the timing stream of the output signals of various devices prior to the occurrence of this problem can be used as precursory information, or the timing sequence of other problems that occurred prior to this problem can be used as precursory information.

[0066] In the job management device disclosed herein, when the cause of the problem lies in component data, the job instruction unit receives at least one of the following information from the substrate mounting machine: device information of the substrate mounting machine at the time the problem occurred and correction record information of the component data. Based on the information received from the component mounting machine, it extracts a solution for the problem from the solution database and instructs the operator accordingly. This allows for more appropriate extraction of solutions from the solution database when the cause of the problem lies in component data.

[0067] Industrial applicability

[0068] This invention enables the management of substrate processing machines that perform operations on substrates.

[0069] Explanation of reference numerals in the attached figures

[0070] 1 Component mounting system, 10 Mounting line, 12 Substrate, 20 Component mounting machine, 22 Substrate conveyor, 25 Through sensor, 26 Conveyor belt, 28 Support pin, 30 Head unit, 32 X-axis slider, 34 Y-axis slider, 34a Guide rail, 36 Guide rail, 37 Head, 38 Nozzle, 39 Part camera, 40 Feeder, 42 Reel, 44 Feeder controller, 46 Feeder mounting platform, 48 Mounting controller, 50 Large display device, 52 Communication equipment, 60 Wireless tag, 62 Headset, 64 Portable terminal, 70 Job management device, 71 CPU, 72 ROM, 73 RAM, 74 Production information database, 75 Operator information database, 76 Skills database.

Claims

1. A job management device for managing a substrate processing line having multiple substrate processing machines, wherein, The job management device includes: The acquisition unit acquires the precursor information obtained through data mining from the substrate processing machine, the precursor information including timing information related to the device; The determination unit determines, based on the warning information, that one of the head, nozzle, and feeder included in the substrate processing machine needs maintenance. The prediction unit, when the determination unit determines that the maintenance period for the identified part is approaching, predicts that the maintenance should be performed earlier to prevent production stoppage or decline in production operation of the substrate production line; and The work instruction unit provides instructions to the operator based on the results of the prediction unit.

2. The operation management device according to claim 1, wherein, The determination unit determines the parts that need maintenance by performing statistical analysis on the operating status of the plurality of substrate processing machines.

3. The operation management device according to claim 1 or 2, wherein, The timing information includes at least one of the timing stream of the output signals of the various devices in the substrate fabrication machine prior to the occurrence of the problem and the timing sequence of other problems that occurred prior to the occurrence of the problem.

4. The operation management device according to any one of claims 1 to 3, wherein, The prediction unit also obtains maintenance information and predicts whether the maintenance should be performed earlier based on the maintenance information. The maintenance information includes past maintenance performance information of the device equipped on the substrate processing machine and the next maintenance period information.

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