Power modules and power conversion devices

Abstract

This application provides a power module and a power conversion device, relating to the field of electronic device technology, for reducing the risk of short-circuit fire within the power module. The power module includes a substrate and one or more power chips disposed on the substrate. The substrate includes an insulating layer, a first metal layer, a second metal layer, and a fuse. The power chips are electrically connected to either the first or second metal layer. The fuse is electrically connected to the first and second metal layers, and the melting point of the fuse is lower than that of the first and second metal layers, respectively. A first groove is formed on the surface of the insulating layer facing the power chips, and the projection of the fuse in the thickness direction of the power module at least partially covers the first groove. After melting, the fuse can flow into the first groove to quickly cut off the circuit, ensuring a fast short-circuit cutoff speed and preventing fire within the power module.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a power module and a power conversion device. Background Technology

[0002] With the continuous development of the new energy industry, power modules need to withstand greater power, increasing the risk of short circuits in the power chips within the modules. If the circuit cannot be switched in time during a short circuit, it may cause the power module to fail, or even lead to a fire.

[0003] Related technologies often employ short-circuit detection and fuse breaking to reduce the risk of short-circuit fires in power modules. Short-circuit detection requires complex circuit design and relies on shutting down the power chip to cut off the circuit. This not only suffers from false triggering and slow response times, but also, if the power chip fails due to thermal runaway, it cannot cut off the circuit, leading to a persistent short circuit and potential fire. Fuses offer fast response times, but the high temperatures during fuse breaking can cause carbonization of encapsulation materials such as silicone gel or molding compound in the power module. Carbonized encapsulation materials can lead to a persistent internal short circuit in the power module, ultimately causing a fire. Summary of the Invention

[0004] This application provides a power module and a power conversion device to reduce the risk of short circuit and fire inside the power module.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A first aspect of this application provides a power module including a substrate and one or more power chips disposed on the substrate. The substrate includes an insulating layer, a first metal layer, a second metal layer, and a fuse. The first and second metal layers are spaced apart on the side of the insulating layer facing the power chips, and the power chips are electrically connected to either the first or second metal layer. The fuse is electrically connected to the first and second metal layers, and the melting point of the fuse is lower than that of the first and second metal layers, respectively. A first groove is formed on the surface of the insulating layer facing the power chips, and the projection of the fuse in the thickness direction of the power module at least partially covers the first groove.

[0007] In the power module provided in this application, in some scenarios, the power chip is electrically connected to the first metal layer, and the current flows sequentially through the second metal layer, the fuse, and the first metal layer to the power chip. Alternatively, the current flowing out of the power chip flows sequentially through the first metal layer and the fuse to the second metal layer.

[0008] In other scenarios, the power chip is electrically connected to the second metal layer, and the current flows sequentially through the first metal layer, the fuse, and the second metal layer to the power chip. Alternatively, the current flowing out of the power chip flows sequentially through the second metal layer and the fuse to the first metal layer.

[0009] When a short circuit occurs in the power chip, the current flowing through the first metal layer, the second metal layer, and the fuse increases sharply. Since the melting point of the fuse is lower than that of the first and second metal layers, the heat generated by the ohmic effect in the fuse reaches its melting point, causing it to melt until the circuit breaks. During melting, the solid fuse gradually transforms into a molten or liquid state and flows along the insulating layer until the electrical connection between the first and second metal layers is broken, thus disconnecting the power circuit.

[0010] The insulating layer has a first groove on its surface facing the power chip, and the projection of the fuse in the thickness direction of the power module at least partially covers the first groove. The molten portion of the fuse can flow into the first groove, which on the one hand enables rapid disconnection of the power circuit, ensuring a fast short-circuit disconnection speed and preventing fire within the power module. On the other hand, receiving the molten fuse in the first groove prevents the fuse from accumulating and causing the fuse gap to become too small, thus preventing the generation of an electric arc.

[0011] By utilizing the insulating properties of the insulating layer, the fuse flowing into the first groove is isolated from other devices, preventing the fuse from being electrically connected to other devices.

[0012] Since the power module includes a package encapsulating the power chip, such as silicone gel or molding compound, the melted fuse flowing into the first groove reduces heat transfer from the fuse to the package, thereby reducing the possibility of carbonization of the package material and consequently lowering the risk of internal short-circuit fire within the power module. Compared to short-circuit detection methods, the technical solution presented in this application offers a faster response speed and reduces the risk of high-temperature carbonization of the package due to melting, thus lowering the risk of internal short-circuit fire within the power module and ensuring its internal safety.

[0013] In one embodiment, the fuse is located between the first metal layer and the second metal layer, with one end of the fuse connected to the first metal layer and the other end connected to the second metal layer.

[0014] This can be understood as the fuse being embedded between the first and second metal layers. This reduces the space occupied by the power module in the thickness direction and also allows for convenient and quick installation of the fuse.

[0015] In some embodiments, the fuse element abuts against the first metal layer and the second metal layer respectively, so that the fuse element is in close contact with the first metal layer and the fuse element is in close contact with the second metal layer, thereby ensuring the reliability of the fuse element's electrical connection to the first metal layer and the second metal layer.

[0016] In one embodiment, the power module further includes a package that encapsulates the power chip, the substrate, and the fuse, wherein the melting point of the fuse is lower than the carbonization temperature of the package.

[0017] The carbonization temperature of the package can be understood as the temperature at which the package decomposes into carbon at high temperatures.

[0018] Because carbon is conductive, the package includes a power chip, a substrate, and a fuse. Carbonization begins when the internal temperature of the power module reaches the carbonization temperature of the package. If the package surrounding the first and second metal layers carbonizes, it may cause an electrical connection between the first and second metal layers.

[0019] To prevent the package from carbonizing and creating a conductive path between the first and second metal layers, the melting point of the fuse is kept below the carbonization temperature of the package. When the power module's temperature rises, the fuse melts first, disconnecting the power module's power circuit. With the power circuit disconnected, the temperature inside the power module stops rising, preventing the package from carbonizing due to the high temperature caused by the fuse. This ensures safe switching of the current circuit and improves the safety of the power module.

[0020] In some embodiments, the encapsulation body includes silicone gel or molding compound.

[0021] In one embodiment, the fuse is placed in the first groove to form a receiving cavity, and the receiving cavity contains an arc-extinguishing medium.

[0022] After the fuse blows, the arc-extinguishing medium in the containment cavity can enter the fuse gap from the containment cavity to isolate the fuse gap, thereby extinguishing the arc and preventing the fuse from generating an electric arc during the blowing process, further reducing the risk of short circuit and fire inside the power module.

[0023] In some embodiments, the arc-quenching medium is a gas, such as nitrogen, carbon dioxide, or sulfur hexafluoride.

[0024] In some embodiments, the arc-extinguishing medium is a solid, which is a gas capable of rapidly decomposing under the action of an electric arc and generating arc-extinguishing gas. For example, steel paper.

[0025] In one embodiment, the fuse is placed in the first groove and forms a receiving cavity, which is a vacuum cavity.

[0026] Because the fuse is encapsulated within a vacuum chamber, the arc is difficult to sustain due to the absence of oxygen or other conductive media. Once the fuse melts, the arc extinguishes rapidly, reducing the risk of a short circuit and fire within the power module.

[0027] After the fuse blows, the pressure on one side of the fuse is greater than the pressure in the vacuum chamber. Under the action of the pressure difference, the fuse can quickly enter the receiving cavity to reduce the contact time between the fuse and the package, further reducing the risk of the package carbonizing due to the high temperature of the fuse. This ensures safe switching of the current circuit and improves the safety of the power module.

[0028] In one embodiment, the volume of the first slot is greater than or equal to the volume of the fuse.

[0029] This ensures that after the fuse melts, it can completely enter the first slot, preventing the fuse from accumulating and causing the first and second metal layers to conduct and thus ignite inside the power module. It also prevents the accumulation of fuse from creating small arc overlap gaps that could lead to ignition inside the power module, further ensuring the safety of the power module.

[0030] In one embodiment, the fuse is located in the first groove, and one end of the fuse is connected to the first metal layer and the other end is connected to the second metal layer.

[0031] The fuse is located inside the first groove. Compared to the fuse being located outside the first groove, this reduces the contact area between the fuse and the package, thus reducing the risk of the package carbonizing due to the high temperature caused by the fuse breaking.

[0032] Since the first slot is opened on the insulating layer, the insulating properties of the insulating layer are used to isolate the fuse from other devices, preventing the fuse from being electrically connected to other devices after it melts, thus improving safety.

[0033] In one embodiment, the first groove includes a first opening and a second opening spaced apart, the first opening and the second opening being formed on the surface of the insulating layer facing the power chip. A first metal layer covers the first opening, and a second metal layer covers the second opening, forming a receiving cavity. A fuse is located within the receiving cavity, one end of the fuse being connected to the first metal layer through the first opening, and the other end being connected to the second metal layer through the second opening.

[0034] Since the fuse is located inside the receiving cavity, and the first metal layer covers the first opening and the second metal layer covers the second opening, the receiving cavity can be a closed cavity. The insulating properties of the insulating layer can be used to isolate the fuse from other devices and prevent the fuse from being electrically connected to other devices.

[0035] By placing the fuse in a closed cavity, the fuse and the package can be kept out of contact, thus preventing the high temperature of the fuse from carbonizing the package.

[0036] One end of the fuse is connected to the first metal layer through a first opening, and the other end is connected to the second metal layer through a second opening. Current is transmitted between the first and second metal layers through the fuse.

[0037] In some embodiments, one end of the fuse abuts against the first metal layer and the other end abuts against the second metal layer, so that the fuse is in close contact with the first metal layer and the second metal layer, thereby ensuring the reliability of the fuse's electrical connection between the first metal layer and the second metal layer.

[0038] In one embodiment, a gap exists between the fuse and the inner wall of the receiving cavity.

[0039] This design allows the fuse, after melting, to flow away from the first and second metal layers within the receiving cavity. This ensures the fuse effectively interrupts the short-circuit current, guaranteeing the safety of the power module. It also prevents the fuse from remaining electrically connected to the first and second metal layers after melting, thus reducing the risk of fire within the power module.

[0040] In one embodiment, the cavity contains an arc-extinguishing medium.

[0041] After the fuse blows, the arc-extinguishing medium in the containment cavity can enter the fuse gap to isolate the fuse gap, thus extinguishing the arc and preventing the fuse from generating an electric arc during the blowing process, further reducing the risk of short circuit and fire inside the power module.

[0042] In some embodiments, the arc-quenching medium is a gas, such as nitrogen, carbon dioxide, or sulfur hexafluoride.

[0043] In some embodiments, the arc-extinguishing medium is a solid, which is a gas capable of rapidly decomposing under the action of an electric arc and generating arc-extinguishing gas. For example, steel paper.

[0044] In one embodiment, the receiving cavity is a vacuum cavity.

[0045] Since there is no conductive medium such as oxygen, it is difficult to maintain an electric arc. By setting the containment cavity as a vacuum cavity, the electric arc will be extinguished quickly after the fuse melts, reducing the risk of short circuit and fire inside the power module.

[0046] In one embodiment, the power chip includes multiple power chips, and the multiple power chips include multiple first power chips arranged in parallel. The multiple first power chips are arranged in parallel between the input connection terminal and the output connection terminal of the power module.

[0047] In this configuration, at least one fuse is provided in the current path between the first power chip and the input connection terminal, or at least one fuse is provided in the current path between the first power chip and the output connection terminal.

[0048] Current flows in from the input terminal and is transmitted to the output terminal through multiple first power chips. If one of the first power chips fails due to a short circuit, it can be shut off by the fuse between the chip and the input terminal blowing due to heat, or by the fuse between the chip and the output terminal blowing due to heat. The other first power chips can continue to operate to ensure the normal use of the power module.

[0049] In one embodiment, a power chip is disposed on a second metal layer and electrically connected to the second metal layer. A first metal layer is disposed around the outer periphery of the second metal layer, and the fuse is a ring structure surrounding the second metal layer.

[0050] In this embodiment, the fuse is a ring structure arranged around the second metal layer. After the fuse melts, it can effectively isolate the power chip from other power chips or structures, ensuring that the current loop can be safely cut off and improving the reliability of the power module.

[0051] During the melting process of a fuse, a large amount of heat and pressure are generated. By designing the fuse as a ring structure, the heat and pressure can be distributed more evenly on the ring structure, reducing excessive pressure and heat concentration at a single point and extending the service life of the fuse.

[0052] A ring structure may help to distribute current more evenly, reducing uneven current distribution on the fuse element.

[0053] A second aspect of this application provides a power conversion device, which includes a circuit board and at least one of the aforementioned power modules, wherein the circuit board is electrically connected to the power module.

[0054] Current can be transferred from the circuit board to the power module, which converts the current and then transfers the converted current back to the circuit board. The converted current is then transferred along the current transmission path on the circuit board to power components such as transistors, diodes, or thyristors.

[0055] In some embodiments, the power element is disposed on a circuit board, and the power element and the power module are located on opposite sides of the circuit board in the thickness direction.

[0056] The power conversion device provided in this application includes the power module described above. Therefore, the power conversion device provided in this application and the power module of the above-mentioned technical solution can solve the same technical problem and have the same technical effect, which will not be repeated here. Attached Figure Description

[0057] Figure 1 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0058] Figure 2 This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0059] Figure 3A This is one of the partial structural schematic diagrams of a power module provided in an embodiment of this application;

[0060] Figure 3B This is a second partial structural schematic diagram of a power module provided in an embodiment of this application;

[0061] Figure 3C This is the third partial structural schematic diagram of a power module provided in an embodiment of this application;

[0062] Figure 4 This is a schematic diagram of a fuse in an unfused state, provided in an embodiment of this application.

[0063] Figure 5 This is a schematic diagram of a fuse in a fuse-breaking state provided in an embodiment of this application;

[0064] Figure 6 This is one of the structural schematic diagrams of a fuse provided in an embodiment of this application;

[0065] Figure 7 This is a second schematic diagram of the structure of a fuse provided in an embodiment of this application;

[0066] Figure 8 This is the third schematic diagram of a fuse structure provided in an embodiment of this application;

[0067] Figure 9 This is a schematic diagram of another power module provided in an embodiment of this application;

[0068] Figure 10 This is a schematic diagram of another fuse in an unfused state provided in an embodiment of this application;

[0069] Figure 11 A schematic diagram of another fuse in a fused state provided in an embodiment of this application;

[0070] Figure 12 This is one of the structural schematic diagrams of another fuse provided in the embodiments of this application;

[0071] Figure 13 This is a second schematic diagram of another type of fuse provided in the embodiments of this application;

[0072] Figure 14 This is the fourth partial structural schematic diagram of a power module provided in an embodiment of this application;

[0073] Figure 15 for Figure 14 A schematic diagram of the structure of the power module in which the fuse is in the fused state.

[0074] Figure label:

[0075] 1000 - Power conversion device; 100 - Power module; 200 - Circuit board;

[0076] 1-Power chip; 11-First power chip; 001-Substrate; 2-Insulating layer; 21-First side; 22-Second side; 3-Metal layer; 31-First metal layer; 32-Second metal layer; 33-Insulating connection layer; 4-Third metal layer; 5-Fuse; 6-Package; 7-Mounting substrate; 81-Input connection terminal; 82-Output connection terminal; 9-Housing; 101-First bonding wire; 102-Second bonding wire; 103-Third bonding wire; 104-Fourth bonding wire; 111-First solder layer; 112-Second solder layer; 113-Third solder layer; 114-Fourth solder layer; 115-Fifth solder layer; 12-Arc extinguishing medium;

[0077] 01-First groove; 02-First opening; 03-Second opening; 04-Second groove; 05-Receiving cavity. Detailed Implementation

[0078] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0079] In this application, unless otherwise expressly specified and limited, the terms "upper", "lower", "front", "back", "left", "right", etc., indicating orientation or positional relationship may be defined relative to the orientation of the components schematically placed in the accompanying drawings. These directional terms may be relative concepts, used for relative description and clarification, and may change accordingly depending on the orientation of the components in the accompanying drawings. They should not be construed as limitations on this application.

[0080] In this application, the terms "first," "second," etc., are used for descriptive purposes only to distinguish one element from another, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0081] In this application, unless otherwise expressly stated and limited, "multiple" means two or more.

[0082] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, when describing pipelines or channels, the terms "connection" and "linkage" as used in this application have the meaning of establishing electrical conductivity. The specific meaning needs to be understood in conjunction with the context.

[0083] Furthermore, in this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0084] In the accompanying drawings of the embodiments of this application, solid structures such as parts and components are represented by guide lines; hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with arrows.

[0085] This application provides a power conversion device that can be applied in the photovoltaic field. For example, the power conversion device can be a photovoltaic inverter, a grid inverter, a photovoltaic energy storage inverter, a photovoltaic actuator, a DC-DC converter, and a bidirectional inverter. This application does not impose any special limitations on the specific form of the aforementioned power conversion device.

[0086] In other embodiments of this application, the power conversion device can also be applied in other fields. For example, the power conversion device can be applied in vehicles, charging stations, and other fields.

[0087] Figure 1 This is a schematic diagram of a power conversion device provided in an embodiment of this application. (Refer to...) Figure 1 The power conversion device 1000 includes a circuit board 200 and a power module 100, which are electrically connected.

[0088] Reference Figure 1The power module 100 includes an input connection terminal 81 and an output connection terminal 82, which are electrically connected to the circuit board 200. Current is transmitted from the circuit board 200 to the power module 100 through the input connection terminal 81. The power module 100 converts the current, and the converted current is transmitted back to the circuit board 200 through the output connection terminal 82, and then transmitted along the current transmission path on the circuit board 200 to the power components, such as transistors, diodes, or thyristors.

[0089] In some embodiments, the power element is disposed on the circuit board 200, and the power element and the power module 100 are located in the thickness direction of the circuit board 200. Figure 1 The two opposite sides on the top and bottom of the image.

[0090] In other embodiments of this application, the converted current can also be transmitted along the current transmission path of the circuit board 200 to other electronic components besides the power components, such as capacitors or resistors. This application does not impose any special restrictions on this.

[0091] The power conversion device 1000 can take various forms. For example, in some embodiments, the power conversion device 1000 is a DC / DC converter (Direct Current to Direct Current). The power conversion device accepts DC power transmitted from the circuit board and converts the fixed DC voltage into a variable DC voltage, realizing the conversion between different DC voltage levels to meet the different voltage requirements of the power components.

[0092] For example, in some embodiments, the power conversion device 1000 is an AC / DC converter (Alternating Current to Direct Current). The power conversion device accepts the alternating current transmitted by the circuit board and converts the alternating current into direct current to meet the direct current requirements of the electronic components.

[0093] In other embodiments of this application, the power conversion device 1000 is a DC / AC converter (Direct Current to Alternating Current). The power conversion device accepts the DC power transmitted from the circuit board and converts the DC power into AC power to meet the AC power requirements of the electronic components. This application does not limit the specific form of the power conversion device, and those skilled in the art can selectively design it according to actual needs.

[0094] Figure 2 This is a schematic diagram of a power module provided in an embodiment of this application. (Refer to...) Figure 2The power module 100 includes a substrate 001 and a power chip 1 disposed on the substrate 001. The substrate 001 includes an insulating layer 2, which includes a first surface 21 and a second surface 22 disposed opposite to each other. A metal layer 3 is disposed on the first surface 21, and a third metal layer 4 is disposed on the second surface 22.

[0095] During the operation of the power module 100, the heat generated by the power chip 1 can be transferred to the third metal layer 4 through the metal layer 3 and the insulating layer 2, and then transferred out through the third metal layer 4 to ensure the operating temperature of the power chip 1 and prevent heat from accumulating at the power chip 1 and causing it to fail.

[0096] Power chip 1 is disposed on metal layer 3 and is electrically connected to metal layer 3. Power chip 1 needs to carry a large current during operation. The electrical connection between power chip 1 and metal layer 3 can provide a low-impedance current path, which helps to reduce uneven current distribution inside power chip 1, and can reduce power consumption and improve efficiency.

[0097] Metal layer 3, such as a copper layer, is used to achieve electrical interconnection and conduct large currents. Metal layer 3 has excellent thermal conductivity and can quickly conduct away the heat generated by power chip 1 during operation, which helps to ensure that the operating temperature of power chip 1 is within the normal range, prevents overheating of power chip 1 from causing performance degradation or damage, and helps to extend the service life of power chip 1.

[0098] Reference Figure 2 The power chip 1 includes power chip L and power chip R. The power module 100 also includes an input connection terminal 81, an output connection terminal 82, and multiple metal layers 3. The multiple metal layers 3 include metal layer a, metal layer b, metal layer c, and metal layer d. Among them, metal layer c includes two phase-insulated parts (not shown in the figure, but referred to as the first part and the second part for easy distinction).

[0099] The input connection terminal 81 is connected to the metal layer d via the second solder layer 112, and the output connection terminal 82 is connected to the metal layer a via the first solder layer 111. Power chip L( Figure 2 The power chip 1 on the left side is connected to the metal layer b through the fourth bonding layer 114. The power chip R ( Figure 2 The power chip 1 on the right side is connected to the second part of the metal layer c through the third bonding layer 113.

[0100] Metal layer a is connected to power chip L via a first bonding wire 101. Metal layer b is connected to the first part of metal layer c via a second bonding wire 102, and the first part of metal layer c and power chip R are connected via a third bonding wire 103. The second part of metal layer c and metal layer d are connected via a fourth bonding wire 104.

[0101] Current is transmitted from input connection terminal 81 to metal layer d. The current in metal layer d is transmitted through the fourth bonding wire 104 to the second part of metal layer c. The current in the second part of metal layer c is transmitted to power chip R. The current output by power chip R is transmitted through the third bonding wire 103 to the first part of metal layer c. The current in the first part of metal layer c is transmitted through the second bonding wire 102 to metal layer b. The current in metal layer b is transmitted to power chip L. The current output by power chip L is transmitted through the first bonding wire 101 to metal layer a. The current in metal layer a is transmitted to output connection terminal 82 and then transmitted out, for example, to… Figure 1 On the circuit board 200 shown.

[0102] In other embodiments of this application, the number of power chips 1 can be varied. For example, in some embodiments, the power module 100 includes one power chip 1. In other embodiments, the power module 100 may include three or more power chips 1, which can be connected in series, in parallel, or a combination of series and parallel connections. This application does not impose specific limitations on this.

[0103] Other interconnection methods can also be used between the metal layers 3, such as copper busbar connection. Those skilled in the art can selectively design according to actual needs.

[0104] Reference Figure 2 The substrate 001 includes two components: the power chip L and the output connection terminal 82 are disposed on one substrate 001, and the power chip R and the input connection terminal 81 are disposed on the other substrate 001.

[0105] In other embodiments of this application, the number of substrates 001 can be varied. For example, in some embodiments, a single substrate is included, on which a power chip 1, an input connection terminal 81, and an output connection terminal 82 are disposed. In other embodiments, three or more substrates are included, and multiple power chips 1, input connection terminals 81, and output connection terminals 82 can be disposed on corresponding substrates as needed.

[0106] In some embodiments, metal layer 3 and third metal layer 4 are copper layers, substrate 001 is an insulating ceramic substrate, metal layer 3 is covered on the first side 21 of insulating layer 2, and third metal layer 4 is covered on the second side 22 of insulating layer 2 to form a direct bonded ceramic substrate (DBC).

[0107] In this embodiment, the power module 100 further includes a mounting substrate 7. The side of the direct copper-clad ceramic substrate facing away from the power chip 1 is mounted to the mounting substrate 7 via a fifth bonding layer 115. The mounting substrate 7 can be an aluminum plate or a copper plate, which can effectively dissipate the heat conducted from the direct copper-clad ceramic substrate to improve the heat dissipation efficiency of the power chip 1. In addition, it can also provide support for the direct copper-clad ceramic substrate to prevent it from being deformed under pressure, thereby improving the reliability and stability of the power module 100.

[0108] In other embodiments of this application, the metal layer, the third metal layer, the insulating layer, and the mounting substrate may be made of other suitable materials. This application does not impose specific limitations on this, and those skilled in the art can selectively design according to actual needs.

[0109] exist Figure 2 In the illustrated embodiment, the power module 100 further includes a housing 9 and a package 6, with the power chip 1, substrate 001, and mounting substrate 7 located within the housing. The package 6 encapsulates the power chip 1, substrate 001, and mounting substrate 7 to provide insulation for the power chip 1, preventing short circuits around the power chip 1 and thus protecting it from damage.

[0110] In addition, the package 6 can also protect the power chip 1, the substrate 001 and the mounting substrate 7, preventing damage to the power chip 1, the substrate 001 and the mounting substrate 7.

[0111] In some embodiments, the encapsulation body 6 may be formed by curing an encapsulation material such as silicone gel or molding compound.

[0112] In other embodiments of this application, the power module 100 described above can be other types of power modules besides those used in industrial applications, such as automotive modules, ICT (Information and Communication Technology) modules, molded chip modules, ECP (Embedded Chip Package) modules, etc. This application does not specifically limit the specific application scenarios and application forms of the power module 100.

[0113] As the performance requirements of electronic devices continue to increase, the power of the power module 100 is also increasing, which increases the risk of short circuits in the power chip 1. If the circuit cannot be switched in time during a short circuit, the power module 100 may fail, or even cause a fire.

[0114] To reduce the risk of short circuit in power chip 1, Figure 3A This is one of the partial structural schematic diagrams of a power module provided in an embodiment of this application. (Refer to...) Figure 3AThe power module 100 also includes a first metal layer 31, a second metal layer 32, and a fuse 5. The first metal layer 31 and the second metal layer 32 are spaced apart, and the fuse 5 is disposed between the first metal layer 31 and the second metal layer 32, and the fuse 5 is electrically connected to the first metal layer 31 and the second metal layer 32.

[0115] In some embodiments, refer to Figure 2 and Figure 3A The first metal layer 31, the second metal layer 32 and the fuse 5 are located on the first surface 21 of the insulating layer 2, and the first metal layer 31, the second metal layer 32 and the fuse 5 together constitute the metal layer d.

[0116] In some embodiments, the first metal layer 31, the second metal layer 32, and the fuse 5 together constitute any metal layer 3 between the input connection terminal 81 and the output connection terminal 82, such as metal layer a, metal layer b, or metal layer c.

[0117] Reference Figure 3A The first metal layer 31 is electrically connected to the input connection terminal 81, and the second metal layer 32 is electrically connected to the power chip R. Along the current direction (e.g.) Figure 3A The current flowing through the fuse 5 (as shown in the diagram) flows through the second metal layer 32 to the power chip R.

[0118] The fuse 5 is a heat-fused structure, and its melting point is lower than that of the first metal layer 31 and the second metal layer 32. When a short circuit occurs in the power chip 1 (e.g., power chip L or power chip R), the current flowing through the first metal layer 31, the second metal layer 32, and the fuse 5 increases sharply. Since the melting point of the fuse 5 is lower than that of the first metal layer 31 and the second metal layer 32, when the heat generated by the Ohmic effect in the fuse 5 reaches its melting point, the fuse 5 begins to melt until it breaks. During the melting process, the solid fuse 5 gradually becomes molten or liquid and flows along the insulating layer 2 until the electrical connection between the first metal layer 31 and the second metal layer 32 is broken, thereby disconnecting the power circuit.

[0119] In other embodiments of this application, the second metal layer 32 is electrically connected to the input connection terminal 81, and the first metal layer 31 is electrically connected to the power chip R. Along the current direction (e.g.) Figure 3A As shown in the diagram, the current flowing through the fuse 5 passes through the first metal layer 31 and flows to the power chip R. The fusing principle of the fuse 5 in this embodiment is similar to... Figure 3A The fuse-breaking principle in the illustrated embodiments is the same, and will not be repeated here.

[0120] Figure 3B This is a second partial structural schematic diagram of a power module provided in an embodiment of this application. (Refer to...) Figure 3BThe metal layer c includes a first part, a second part, and an insulating connection layer 33. The insulating connection layer 33 is disposed between the first part and the second part and connects the first part and the second part. The first part is electrically connected to the metal layer d. The power chip 1 is electrically connected to the second part.

[0121] The first metal layer 31, the second metal layer 32, and the fuse 5 together constitute the second part of metal layer c. The first metal layer 31 is electrically connected to the power chip R, and the second metal layer 32 is electrically connected to the power chip L. Along the current direction (e.g., ...) Figure 3B As shown in the diagram, the current flowing through the fuse 5 flows through the second metal layer 32 to the power chip L.

[0122] The fuse 5 is a heat-fused structure, and its melting point is lower than that of the first metal layer 31 and the second metal layer 32. When a short circuit occurs in the power chip 1 (e.g., power chip L or power chip R), the current flowing through the first metal layer 31, the second metal layer 32, and the fuse 5 increases sharply. Since the melting point of the fuse 5 is lower than that of the first metal layer 31 and the second metal layer 32, when the heat generated by the Ohmic effect in the fuse 5 reaches its melting point, the fuse 5 begins to melt until it breaks. During the melting process, the solid fuse 5 gradually becomes molten or liquid and flows along the insulating layer 2 until the electrical connection between the first metal layer 31 and the second metal layer 32 is broken, thereby disconnecting the power circuit.

[0123] In other embodiments of this application, the second metal layer 32 is electrically connected to the power chip R, and the first metal layer 31 is electrically connected to the power chip L. Along the current direction (e.g.) Figure 3B As shown in the diagram, the current flowing through the fuse 5 passes through the first metal layer 31 and flows to the power chip L. The fusing principle of the fuse 5 in this embodiment is similar to... Figure 3B The fuse-breaking principle in the illustrated embodiments is the same, and will not be repeated here.

[0124] Figure 3C This is the third partial structural schematic diagram of a power module provided in an embodiment of this application. (Refer to...) Figure 3C The first metal layer 31, the second metal layer 32, and the fuse 5 together constitute metal layer a. The first metal layer 31 is electrically connected to the power chip L, and the second metal layer 32 is electrically connected to the output connection terminal 82. Along the current direction (e.g., ...) Figure 3C As shown in the diagram, the current flowing through the power chip L flows through the second metal layer 32 to the fuse 5.

[0125] The fuse 5 is a heat-fused structure, and its melting point is lower than that of the first metal layer 31 and the second metal layer 32. When a short circuit occurs in the power chip 1 (e.g., power chip L or power chip R), the current flowing through the first metal layer 31, the second metal layer 32, and the fuse 5 increases sharply. Since the melting point of the fuse 5 is lower than that of the first metal layer 31 and the second metal layer 32, when the heat generated by the Ohmic effect in the fuse 5 reaches its melting point, the fuse 5 begins to melt until it breaks. During the melting process, the solid fuse 5 gradually becomes molten or liquid and flows along the insulating layer 2 until the electrical connection between the first metal layer 31 and the second metal layer 32 is broken, thereby disconnecting the power circuit.

[0126] In other embodiments of this application, the second metal layer 32 is electrically connected to the power chip L, and the first metal layer 31 is electrically connected to the output connection terminal 82. Along the current direction (e.g.) Figure 3C As shown in the diagram, the current flowing through the fuse 5 passes through the first metal layer 31 and then to the fuse 5. The fusing principle of the fuse 5 in this embodiment is similar to... Figure 3C The fuse-breaking principle in the illustrated embodiments is the same, and will not be repeated here.

[0127] Figure 4 This is a schematic diagram of a fuse in an unfused state, provided as an embodiment of this application. (Refer to...) Figure 4 The first surface 21 of the insulating layer 2 is provided with a first groove 01. The fuse 5 is located in the thickness direction of the power module (e.g., Figure 4 The projection on the Z-direction (as shown) at least partially covers the first slot 01.

[0128] Figure 5 This is a schematic diagram of a fuse in a fused state, provided as an embodiment of this application. (Refer to...) Figure 5 After the fuse 5 melts, it can flow into the first groove 01.

[0129] In this way, on the one hand, the power circuit can be quickly cut off, ensuring the short-circuit cut-off speed and preventing fire inside the power module 100. On the other hand, by receiving the molten fuse 5 through the first slot 01, it is possible to prevent the fuse 5 from accumulating and causing the fuse 5 to have too small a melting gap, thus preventing the generation of an electric arc.

[0130] By utilizing the insulating properties of the insulating layer 2, the fuse 5 flowing into the first groove 01 is isolated from other devices, preventing the fuse 5 from being electrically connected to other devices.

[0131] Since the power module 100 includes a package 6 that encapsulates the power chip 1, such as silicone gel or molding compound, the melted fuse 5 flows into the first groove 01, which reduces heat transfer from the fuse 5 to the package 6, thereby reducing the possibility of carbonization of the package material and thus reducing the risk of short circuit and fire inside the power module.

[0132] In some embodiments, the projection of the fuse 5 in the Z direction completely covers the first groove 01 to ensure that the fuse 5 can completely enter the first groove 01 after melting, thereby further reducing the risk of fire inside the power module.

[0133] exist Figure 4 In the embodiment shown, the fuse 5 is located between the first metal layer 31 and the second metal layer 32, and one end of the fuse 5 is connected to the first metal layer 31 and the other end is connected to the second metal layer 32.

[0134] This can be understood as the fuse 5 being embedded between the first metal layer 31 and the second metal layer 32. This reduces the space occupied by the power module in the thickness direction and also allows for convenient and quick installation of the fuse 5.

[0135] In some embodiments, the fuse 5 abuts against the first metal layer 31 and the second metal layer 32 respectively, so that the fuse 5 is in close contact with the first metal layer 31 and the fuse 5 is in close contact with the second metal layer 32, thereby ensuring the reliability of the fuse 5's electrical connection to the first metal layer 31 and the second metal layer 32.

[0136] In some embodiments, slots can be cut into the metal layer 3 of the power module 100 to form a first metal layer 31 and a second metal layer 32. Then, a fuse 5 can be embedded between the first metal layer 31 and the second metal layer 32, which, while satisfying current transmission and short-circuit breaking, makes more efficient use of the internal space of the power module 100, and can reduce the weight and size of the power module 100.

[0137] Reference Figure 2 and Figure 4 The package 6 encapsulates the power chip 1, the substrate 001, and the fuse 5. The melting point of the fuse 5 is lower than the carbonization temperature of the package 6.

[0138] The carbonization temperature of package 6 can be understood as the temperature at which package 6 decomposes into carbon at high temperatures.

[0139] Because carbon is conductive, the package 6 begins to carbonize when the internal temperature of the power module 100 reaches the carbonization temperature of the package 6. If the package 6 around the first metal layer 31 and the second metal layer 32 carbonizes, it may cause the first metal layer 31 and the second metal layer 32 to become electrically connected.

[0140] To prevent the package 6 from carbonizing and creating a conductive path between the first metal layer 31 and the second metal layer 32, the melting point of the fuse 5 is kept below the carbonization temperature of the package 6. When the temperature of the power module 100 rises, the fuse 5 melts first, disconnecting the power circuit of the power module 100. With the power circuit disconnected, the temperature inside the power module 100 no longer rises, preventing the package 6 from carbonizing due to high temperature after melting. This ensures safe switching of the current circuit and improves the safety of the power module 100.

[0141] Figure 6 This is one of the structural schematic diagrams of a fuse provided in an embodiment of this application. (Refer to...) Figure 6 The fuse 5 is placed on the first groove 01 and forms a receiving cavity 05, which contains an arc-extinguishing medium 12.

[0142] After the fuse 5 melts, the arc-extinguishing medium 12 in the receiving cavity 05 can enter the melting gap of the fuse 5 from the receiving cavity 05 to isolate the melting gap of the fuse 5, thereby playing an arc-extinguishing role and preventing the fuse 5 from generating an electric arc during the melting process. This further reduces the risk of short circuit fire inside the power module 100, which is conducive to quickly cutting off the power circuit and ensuring the short circuit cutting speed.

[0143] In some embodiments, the arc-quenching medium 12 is a gas, such as nitrogen, carbon dioxide, or sulfur hexafluoride.

[0144] In some embodiments, the arc-extinguishing medium 12 is a solid, which is a gas capable of rapidly decomposing under the action of an electric arc and generating arc-extinguishing gas. For example, steel paper.

[0145] Figure 7 This is a second schematic diagram of a fuse provided in an embodiment of this application. (Refer to...) Figure 7 The fuse 5 is placed on the first groove 01 and forms a receiving cavity 05, which is a vacuum cavity.

[0146] Because the fuse 5 is surrounded by an encapsulation body 6, the receiving cavity 05 is set as a vacuum cavity. Since there is no conductive medium such as oxygen, it is difficult for the electric arc to be maintained. When the fuse 5 melts, the electric arc will be extinguished quickly, reducing the risk of short circuit and fire inside the power module.

[0147] After the fuse 5 melts, the pressure on one side of the fuse 5 is greater than the pressure in the vacuum chamber. Under the action of the pressure difference, the fuse 5 can quickly enter the receiving cavity 05 to reduce the contact time between the fuse 5 and the package 6, further reducing the risk of the package 6 carbonizing due to the high temperature of melting, ensuring safe switching of the current circuit and improving the safety of the power module.

[0148] exist Figures 4 to 7In the embodiment shown, the volume of the first groove 01 is greater than or equal to the volume of the fuse 5.

[0149] This ensures that after the fuse 5 melts, it can completely enter the first groove 01, preventing the fuse 5 from accumulating and causing the first metal layer 31 and the second metal layer 32 to conduct and cause a fire inside the power module 100. It also prevents the accumulation of the fuse 5 from creating a small arc overlap gap that could cause a fire inside the power module 100, further ensuring the safety of the power module 100.

[0150] In this embodiment, the volume of the first slot 01 can be selectively designed according to the volume of the fuse 5.

[0151] The dimensions of fuse element 5 can be selectively designed according to actual needs, for example, in... Figure 4 In the illustrated embodiment, the first metal layer 31, the second metal layer 32, and the fuse 5 have the same dimensions in the Z-direction. Figure 7 In the embodiment shown, the dimension of the fuse 5 in the Z direction is smaller than the dimension of the first metal layer 31 in the Z direction and the dimension of the second metal layer 32 in the Z direction, respectively.

[0152] Figure 8 This is the third schematic diagram of a fuse provided in an embodiment of this application. (Refer to...) Figure 8 The dimensions of the fuse element 5 in the X direction are smaller than those of the first metal layer 31 and the second metal layer 32 in the X direction, respectively. The dimensions of the fuse element 5 in the Y direction are also smaller than those of the first metal layer 31 and the second metal layer 32 in the Y direction, respectively.

[0153] The dimensions of the fuse element 5 in the X, Y, and Z directions can be selectively designed based on the short-circuit energy of the power module. This application does not impose specific limitations on the dimensions of the fuse element 5.

[0154] The shape of the first slot 01 can be varied, for example, in Figure 4 In the illustrated embodiment, the first groove 01 is a rectangular groove. Figure 6 In the embodiment shown, the first groove 01 is a wedge-shaped groove.

[0155] In other embodiments of this application, the first groove 01 can also be a groove of other shapes, such as a U-shaped groove or a T-shaped groove. Additionally, the first groove 01 can also be a non-closed groove. This application does not impose special limitations on the shape and specific arrangement of the first groove 01; those skilled in the art can selectively design it according to actual needs.

[0156] Figure 9 This is one of the structural schematic diagrams of another power module provided in an embodiment of this application. (Refer to...) Figure 9The first metal layer 31 and the second metal layer 32 are spaced apart to form the second groove 04.

[0157] There are various ways to form the first metal layer 31 and the second metal layer 32. For example, a second slot 04 can be formed in any metal layer 3 (e.g., metal layer a, metal layer b, metal layer c, or metal layer d) between the input connection terminal 81 and the output connection terminal 82 to form the first metal layer 31 and the second metal layer 32. In addition, the positions of the first metal layer 31 and the second metal layer 32 can be selectively designed according to actual needs, and this application does not impose specific restrictions on this.

[0158] Figure 10 This is a schematic diagram of another fuse in an unfused state, provided in an embodiment of this application. Figure 11 This is a schematic diagram of another fuse in a fuse-breaking state provided in an embodiment of this application.

[0159] Reference Figure 10 and Figure 11 The first groove 01 includes a first opening 02 and a second opening 03, which are formed on the first surface 21 of the insulating layer 2. A first metal layer 31 covers the first opening 02, and a second metal layer 32 covers the second opening 03, forming a receiving cavity 05. A fuse 5 is located in the receiving cavity 05, with one end of the fuse 5 connected to the first metal layer 31 and the other end connected to the second metal layer 32.

[0160] Since the fuse 5 is located inside the receiving cavity 05, and the first metal layer 31 covers the first opening 02 and the second metal layer 32 covers the second opening 03, the receiving cavity 05 can be a closed cavity. By utilizing the insulating properties of the insulating layer 2, the fuse 5 is isolated from other devices, preventing the fuse 5 from being electrically connected to other devices.

[0161] By placing the fuse 5 in the closed receiving cavity 05, the fuse 5 can be kept out of contact with the package 6, thus preventing the high temperature of the fuse 5 from carbonizing the package 6.

[0162] One end of the fuse 5 is connected to the first metal layer 31 through the first opening 02, and the other end is connected to the second metal layer 32 through the second opening 03. Current is transmitted between the first metal layer 31 and the second metal layer 32 through the fuse 5.

[0163] In some embodiments, one end of the fuse 5 abuts against the first metal layer 31 and the other end abuts against the second metal layer 32, so that the fuse 5 is in close contact with the first metal layer 31 and the second metal layer 32, thereby ensuring the reliability of the fuse 5's electrical connection to the first metal layer 31 and the second metal layer 32.

[0164] exist Figure 10 In the embodiment shown, there is a gap between the fuse 5 and the inner wall of the receiving cavity 05.

[0165] This allows the fuse 5 to flow away from the first metal layer 31 and the second metal layer 32 in the receiving cavity 05 after melting, effectively cutting off the short-circuit current and ensuring the safety of the power module 100. It also prevents the fuse 5 from remaining electrically connected to the first metal layer 31 and the second metal layer 32 after melting, thus reducing the risk of fire inside the power module 100.

[0166] Figure 12 This is a schematic diagram of another type of fuse provided in an embodiment of this application. (Refer to...) Figure 12 The cavity 05 contains an arc-extinguishing medium 12.

[0167] After the fuse 5 melts, the arc-extinguishing medium 12 in the receiving cavity 05 can enter the melting gap of the fuse 5 to isolate the melting gap of the fuse 5, play an arc-extinguishing role, prevent the fuse 5 from generating an electric arc during the melting process, and further reduce the risk of short circuit and fire inside the power module.

[0168] In some embodiments, the arc-quenching medium 12 is a gas, such as nitrogen, carbon dioxide, or sulfur hexafluoride.

[0169] In some embodiments, the arc-extinguishing medium 12 is a solid, which is a gas capable of rapidly decomposing under the action of an electric arc and generating arc-extinguishing gas. For example, steel paper.

[0170] Figure 13 This is a second schematic diagram of another type of fuse provided in an embodiment of this application. (Refer to...) Figure 13 The first groove 01 is a wedge-shaped groove, which facilitates the installation of the fuse 5 in the first groove 01.

[0171] The shape of the first groove 01 can also be in various ways, for example, in Figure 12 In the embodiment shown, the first groove 01 is a rectangular groove.

[0172] In other embodiments of this application, the first groove 01 can also be a groove of other shapes, such as a U-shaped groove or a T-shaped groove. Additionally, the first groove 01 can also be a non-closed groove. This application does not impose special limitations on the shape and specific arrangement of the first groove 01; those skilled in the art can selectively design it according to actual needs.

[0173] exist Figure 13 In the illustrated embodiment, the receiving cavity 05 is a vacuum cavity.

[0174] Since there is no conductive medium such as oxygen, the electric arc is difficult to maintain. By setting the receiving cavity 05 as a vacuum cavity, the electric arc will be quickly extinguished after the fuse 5 melts, reducing the risk of internal short circuit and fire in the power module 100.

[0175] Figure 14 This is the fourth partial structural schematic diagram of a power module provided in an embodiment of this application. Figure 15 for Figure 14 A schematic diagram of the structure of the power module in which the fuse is in the fused state.

[0176] To increase the power of the power module, multiple power chips 1 are connected in parallel to handle a larger current. The power module includes multiple power chips 1, which include multiple first power chips 11. In some embodiments, the multiple first power chips 1 are connected in parallel between the input connection terminal 81 and the output connection terminal 82. A fuse 5 is provided in the current path between at least one first power chip 11 and the input connection terminal 81, or a fuse 5 is provided in the current path between at least one first power chip and the output connection terminal 82.

[0177] Current flows in from the input connection terminal 81 and is transmitted to the output connection terminal 82 through multiple first power chips 11. When one of the first power chips 11 fails due to a short circuit, it can be shut off by the fuse 5 between the first power chip 11 and the input connection terminal 81 or by the fuse 5 between the first power chip 11 and the output connection terminal 82, which is caused by heat. The other first power chips 11 can still operate to ensure the normal use of the power module 100.

[0178] For example, refer to Figure 1 , reference Figure 14 and Figure 15 The power module 100 includes a first power chip C1, a second power chip C2, and a third power chip C3. When the first power chip C1 fails due to a short circuit, the current flowing through the first metal layer 31, the second metal layer 32, and the fuse 5 increases sharply. The fuse 5, located in the current path between the first power chip C1 and the input connection terminal 81 / output connection terminal 82, melts, thereby disconnecting the circuit between the first power chip C1 and the input connection terminal 81 and the output connection terminal 82, and the first power chip C1 is turned off. The second power chip C2 and the third power chip C3 are not affected by the first power chip C1 and can continue to be used.

[0179] exist Figure 14 In the illustrated embodiment, the first power chip 11 is disposed on the second metal layer 32. The first power chip 11 is electrically connected to the second metal layer 32, and the first metal layer 31 is disposed around the outer periphery of the second metal layer 32. The fuse 5 is a ring structure surrounding the second metal layer 32.

[0180] In this embodiment, the fuse 5 is a ring structure arranged around the second metal layer 32. After the fuse 5 melts, it can effectively isolate the first power chip 11 from other power chips 1 or structures, ensuring that the current circuit can be safely cut off and improving the reliability of the power module.

[0181] In this embodiment, the fuse 5 is a ring structure arranged around the second metal layer 32. After the fuse 5 melts, it can effectively isolate the first power chip 11 from other power chips 1 or structures, ensuring that the current circuit can be safely cut off and improving the reliability of the power module.

[0182] During the melting process of fuse 5, a large amount of heat and pressure are generated. By designing fuse 5 as a ring structure, the heat and pressure can be more evenly distributed on the ring structure, reducing excessive pressure and heat concentration at a single point and extending the service life of fuse 5.

[0183] The ring structure may help to distribute the current more evenly and reduce the uneven distribution of current on the fuse 5.

[0184] In some embodiments, the power conversion device further includes a control system that monitors the voltage, current, etc., of the power module 100 in real time. When the fuse 5 of the power module 100 blows, the control system receives an abnormal signal from the power module 100, such as an abnormal voltage signal. The control system sends a fault warning signal to the faulty system. The faulty system receives the fault warning signal and issues an alert. Operators can react quickly based on the alert to maintain or replace the power module, ensuring the safety of the power module.

[0185] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power module, characterized in that, The substrate includes a substrate and one or more power chips disposed on the substrate, the substrate comprising: Insulating layer; A first metal layer and a second metal layer are disposed at a distance from each other on the side of the insulating layer facing the power chip, and the power chip is electrically connected to the first metal layer or the second metal layer. A fuse element electrically connected to the first metal layer and the second metal layer, wherein the melting point of the fuse element is lower than the melting point of the first metal layer and the melting point of the second metal layer, respectively. The first slot is formed on the surface of the insulating layer facing the power chip, and the projection of the fuse in the thickness direction of the power module at least partially covers the first slot.

2. The power module according to claim 1, characterized in that, The fuse is located between the first metal layer and the second metal layer, with one end of the fuse connected to the first metal layer and the other end connected to the second metal layer.

3. The power module according to claim 1 or 2, characterized in that, The power module also includes a package that encapsulates the power chip, the substrate, and the fuse, wherein the melting point of the fuse is lower than the carbonization temperature of the package.

4. The power module according to any one of claims 1-3, characterized in that, The fuse is placed over the first groove to form a receiving cavity, and the receiving cavity contains an arc-extinguishing medium.

5. The power module according to any one of claims 1-3, characterized in that, The fuse is placed over the first groove and forms a receiving cavity, which is a vacuum cavity.

6. The power module according to any one of claims 1-5, characterized in that, The volume of the first slot is greater than or equal to the volume of the fuse.

7. The power module according to claim 1, characterized in that, The fuse is located in the first groove, and one end of the fuse is connected to the first metal layer and the other end is connected to the second metal layer.

8. The power module according to claim 7, characterized in that, The first slot includes a first opening and a second opening spaced apart, the first opening and the second opening being formed on the surface of the insulating layer facing the power chip; The first metal layer covers the first opening, the second metal layer covers the second opening, and forms a receiving cavity. The fuse is located in the receiving cavity, and one end of the fuse is connected to the first metal layer through the first opening, and the other end of the fuse is connected to the second metal layer through the second opening.

9. The power module according to claim 8, characterized in that, There is a gap between the fuse and the inner wall of the receiving cavity.

10. The power module according to claim 8 or 9, characterized in that, The cavity contains an arc-extinguishing medium.

11. The power module according to claim 8 or 9, characterized in that, The cavity is a vacuum cavity.

12. The power module according to any one of claims 1-11, characterized in that, The power chip includes multiple power chips, and the multiple power chips include multiple first power chips. The multiple first power chips are connected in parallel between the input connection terminal and the output connection terminal of the power module. The fuse is provided on the current path between at least one of the first power chips and the input connection terminal, or the fuse is provided on the current path between at least one of the first power chips and the output connection terminal.

13. The power module according to any one of claims 1-12, characterized in that, The power chip is disposed on the second metal layer and is electrically connected to the second metal layer. The first metal layer is disposed around the outer periphery of the second metal layer. The fuse is a ring structure that surrounds the second metal layer.

14. A power conversion device, characterized in that, include: At least one power module as described in any one of claims 1-13; A circuit board, which is electrically connected to the power module.

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