Substrate processing apparatus

Abstract

A substrate processing apparatus according to the present application includes a chuck table that supports a substrate assembly including a substrate and a ring-shaped frame that surrounds the substrate and supports the substrate, and a ring-shaped frame pressurizing section that pressurizes the ring-shaped frame in a direction in which warping of the substrate is flattened.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus for stably placing a substrate onto a chuck stage. Background Technology

[0002] Typically, semiconductor manufacturing processes include etching processes that etch substrates such as wafers, dicing processes that cut substrates into multiple dies, and cleaning processes that clean substrates. Substrate processing equipment is used in substrate etching or cleaning processes.

[0003] The substrate processing apparatus includes a chuck stage that picks up and rotates a substrate, and a transfer robot that transfers the substrate to the chuck stage. While the substrate is rotating via the chuck stage, a processing liquid for processing the substrate is supplied to the substrate.

[0004] However, in existing substrate processing equipment, due to substrate warpage or warping of the annular frame supporting the substrate via adhesive tape, the substrate cannot be stably placed on the chuck table even with the suction force of the chuck table, which may lead to problems such as poor operation or reduced production efficiency. Summary of the Invention

[0005] Technical issues

[0006] The present invention was created to improve the aforementioned problems, and its purpose is to provide a substrate handling apparatus in which the substrate is stably placed on the chuck stage even if there is warpage of the substrate or the annular frame.

[0007] Solutions for solving technical problems

[0008] The substrate processing apparatus of the present invention includes: a chuck worktable; a substrate support assembly, the substrate assembly having a substrate and an annular frame disposed in a manner surrounding and supporting the substrate; and an annular frame pressing section for pressing the annular frame in a direction of warping and flattening of the substrate.

[0009] Alternatively, the substrate processing apparatus may further include: a transfer unit disposed outside the chuck worktable and capable of lifting and lowering relative to the chuck worktable, the transfer unit having the annular frame pressure unit.

[0010] It may be that a pair of the transfer units are provided, and the pair of transfer units are arranged facing each other across the chuck table.

[0011] Alternatively, the substrate processing apparatus may further include: a substrate transfer robot that supports the substrate assembly and moves the substrate assembly to a position aligned with the chuck stage via a pair of transfer units.

[0012] Alternatively, the substrate processing apparatus may further include: an annular frame support portion disposed below the annular frame pressure portion to support the annular frame, wherein the distance between the annular frame pressure portion and the annular frame support portion is greater than the thickness of the annular frame.

[0013] Alternatively, the substrate processing apparatus may further include: an annular frame support portion disposed below the annular frame pressurizing portion, thereby supporting the annular frame, wherein the annular frame support portion includes an adsorption portion for adsorbing the annular frame.

[0014] Alternatively, the substrate processing apparatus may further include: an annular frame support portion disposed below the annular frame pressure portion, thereby supporting the annular frame, wherein the annular frame pressure portion is movable relative to the annular frame support portion in a horizontal direction.

[0015] Alternatively, the substrate processing apparatus may further include: an annular frame support portion disposed below the annular frame pressure portion to support the annular frame; the chuck stage includes: a substrate support portion supporting the substrate assembly, and a negative pressure is formed on its surface to allow the substrate assembly to be adsorbed; and a clearance portion to avoid collision with the annular frame support portion and being recessed.

[0016] Alternatively, the substrate processing apparatus may further include: an annular frame support portion disposed below the annular frame pressing portion to support the annular frame; in the state where the annular frame is supported by the annular frame support portion, the annular frame pressing portion and the annular frame support portion descend toward the chuck table, thereby supporting the substrate assembly on the chuck table; the annular frame pressing portion and the annular frame support portion descend further, thereby separating the annular frame support portion from the annular frame; and the annular frame pressing portion applies downward pressure to the annular frame.

[0017] Alternatively, the annular frame pressurizing part may include a rotating rod that rotates (pivots) while the base plate assembly is supported on the chuck table, thereby applying pressure to the annular frame on the chuck table side.

[0018] Alternatively, the annular frame pressurizing part may further include: a trigger capable of linear motion in a direction parallel to the substrate assembly; a cam connecting the trigger and the rotating rod, and connecting the trigger and the rotating rod in a manner that converts the linear motion of the trigger into the rotational motion of the rotating rod; and a pressurizing roller connected to the rotating rod and pressurizing the annular frame downward.

[0019] Alternatively, the annular frame pressurizing part may further include: a trigger capable of linear motion in a direction parallel to the substrate assembly. When the annular frame is supported by the annular frame support part, the annular frame pressurizing part and the annular frame support part descend toward the chuck table, thereby supporting the substrate assembly on the chuck table. The trigger moves linearly in one direction, thereby causing the rotating rod to rotate (pivot) to press down on the annular frame.

[0020] Alternatively, the substrate processing apparatus may further include: a substrate transfer robot that supports and moves the substrate assembly so that the substrate assembly is supported on the chuck table.

[0021] Alternatively, the chuck stage may include a plurality of support pins protruding from the surface of the chuck stage to support the substrate assembly.

[0022] Alternatively, the annular frame pressure section may be located above the chuck worktable. When the substrate assembly is supported on the chuck worktable, the substrate transfer robot moves to separate itself from the substrate assembly and the chuck worktable. The chuck worktable rises toward the annular frame pressure section, thereby pressing the annular frame downwards by the annular frame pressure section.

[0023] Alternatively, the annular frame may include a magnetic body, and the pressure section of the annular frame may include an electromagnet that generates a magnetic force to pull the annular frame through the supply of electrical energy.

[0024] Alternatively, the annular frame pressure section can be positioned above the annular frame and magnetically supported to prevent it from falling. With the annular frame supported by the annular frame pressure section, the annular frame pressure section descends toward the chuck table, thereby supporting the base plate assembly on the chuck table. The annular frame pressure section then descends further and applies downward pressure to the annular frame.

[0025] Alternatively, the annular frame pressure section can support the annular frame from below. With the annular frame supported by the annular frame pressure section, the annular frame pressure section descends toward the chuck table, thereby supporting the base plate assembly on the chuck table. The annular frame pressure section further descends and pulls the annular frame downward by the magnetic force, thereby flattening the annular frame.

[0026] Invention Effects

[0027] The substrate processing apparatus of the present invention includes an annular frame pressing section that presses the annular frame of the substrate assembly along the warpage flattening direction. Therefore, even in the case of a substrate assembly where the annular frame or the substrate is warped, it can be stably placed on the chuck table, thereby improving, for example, the quality and productivity of substrate processing operations such as cutting, etching, and cleaning, reducing the defect rate, and decreasing operating costs. Attached Figure Description

[0028] Figure 1 This is a plan view showing the configuration of the substrate processing apparatus according to the first embodiment of the present invention.

[0029] Figure 2 It is shown in the figure. Figure 1 A three-dimensional view of the transfer section.

[0030] Figure 3 This is a plan view of the substrate processing apparatus according to the first embodiment of the present invention, and it is a diagram showing the situation where the substrate assembly is moved to a position above the chuck worktable and between a pair of transfer units.

[0031] Figure 4 This is a front view of the substrate processing apparatus according to the first embodiment of the present invention, and it is a diagram showing the substrate assembly being lowered to be supported by the chuck stage.

[0032] Figure 5 Is with Figure 4 This is an enlarged view of the part corresponding to section A, and it is a diagram showing the situation where the transfer section descends to make the pressure section of the annular frame contact the annular frame.

[0033] Figure 6 The diagram shows the ratio of the transfer section. Figure 5 The position is lowered further so that the pressure part of the annular frame pressurizes the annular frame and flattens it.

[0034] Figure 7 This is a plan view of the substrate processing apparatus according to the second embodiment of the present invention, and it is a diagram showing the substrate assembly supported on a pair of transfer sections and lowered for placement on a chuck worktable.

[0035] Figure 8 It is Figure 7 Take a sectional view along VIII-VIII as shown in the figure.

[0036] Figure 9 It is shown in the figure. Figure 8 A cross-sectional view of a ring frame pressure section rotating to apply pressure to the ring frame and flatten it.

[0037] Figure 10 This is a plan view of the substrate processing apparatus according to the third embodiment of the present invention, and is a diagram showing the substrate assembly placed on the chuck worktable.

[0038] Figure 11 It is shown in the figure. Figure 10 A three-dimensional view of the transfer section.

[0039] Figure 12 It is shown in the figure. Figure 10 A front view of the chuck stage and the base plate assembly supported on the chuck stage.

[0040] Figure 13 Is with Figure 12 The enlarged view of the part corresponding to section B is a diagram showing the situation where the chuck table rises so that the annular frame is pressurized and flattened by the annular frame pressurizing part.

[0041] Figure 14 This is a plan view of the substrate processing apparatus according to the fourth embodiment of the present invention, and it is a diagram showing the substrate assembly being adsorbed and supported on the annular frame pressure section on the chuck worktable.

[0042] Figure 15 It is shown in the figure. Figure 14 A three-dimensional view of the transfer section.

[0043] Figure 16 It is shown in the figure. Figure 15 The diagram shows the situation where the annular frame pressure section is pressed downwards and flattened to support the annular frame on the chuck table.

[0044] Figure 17 It is shown in the figure. Figure 15 The diagram shows the situation where the ring frame is flattened by magnetic force pulling the ring frame downwards through the pressure part of the ring frame. Detailed Implementation

[0045] Hereinafter, the substrate processing apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The terminology used in this specification is for the proper expression of preferred embodiments of the present invention and may vary according to the intent of the user or operator or the conventions of the art to which this invention pertains. Therefore, the terminology should be defined based on the entire contents of this specification.

[0046] Figure 1 This is a plan view showing the configuration of the substrate processing apparatus according to the first embodiment of the present invention. Figure 2 It is shown in the figure. Figure 1 A 3D view of the transfer department. Figure 3 This is a plan view of the substrate processing apparatus according to the first embodiment of the present invention, and it illustrates the situation where the substrate assembly is moved to a position above the chuck stage and between a pair of transfer units. Figure 4 This is a front view of the substrate processing apparatus according to the first embodiment of the present invention, and it is a diagram showing the substrate assembly being lowered to be supported by the chuck stage. Figure 5 Is with Figure 4 This is an enlarged view of the part corresponding to section A, and it shows the situation where the transfer section descends to make the pressure section of the annular frame contact the annular frame. Figure 6 The diagram shows the ratio of the transfer section. Figure 5 The position is lowered further so that the pressure part of the annular frame pressurizes the annular frame and flattens it.

[0047] Reference Figures 1 to 6 The substrate processing apparatus 10 according to the first embodiment of the present invention includes a chuck stage 60 and an annular frame pressing section 120. The chuck stage 60 supports the substrate assembly 1. The substrate assembly 1 includes a substrate 2 and an annular frame 5.

[0048] The substrate 2 can be, for example, a silicon wafer. The annular frame 5 is configured to surround the substrate 2. The annular frame 5 is configured to be spaced apart from the substrate 2. The annular frame 5 supports the substrate 2.

[0049] For example, the substrate assembly 1 also includes an adhesive tape 8, and the annular frame 5 can support the substrate 2 via the adhesive tape 8. The adhesive tape 8 adheres to the lower side of the substrate 2 and the lower side of the annular frame 5. The adhesive tape 8 is flexible and has a generally circular planar shape.

[0050] The annular frame 5 is bonded to the outer periphery of the adhesive tape 8 to prevent the adhesive tape 8 from wrinkling or folding. The adhesive tape 8 may have a substrate bonding portion for bonding the substrate supporting the substrate 2, an annular frame bonding portion for bonding the annular frame supporting the annular frame 5, and a connecting portion for connecting the substrate bonding portion and the annular frame bonding portion.

[0051] The chuck stage 60 may include a substrate support portion 63 and a clearance portion 65. The substrate support portion 63 supports the substrate assembly 1. A negative pressure can be formed on the surface of the substrate support portion 63 to attract the substrate assembly 1. With the substrate assembly 1 stably supported on the substrate support portion 63 without sliding off or being spaced apart, substrate processing operations such as cutting, etching, and cleaning can be performed. When performing substrate processing operations, the chuck stage 60 can rotate about the vertical rotation axis RX.

[0052] The clearance portion 65 may be a downwardly recessed portion to avoid collision with the annular frame support portion 110 described later. The clearance portion 65 can form a step with the substrate support portion 63. The substrate support portion 63 can be provided at the center of the chuck stage 60, and the clearance portion 65 can be provided at the outer periphery of the chuck stage 60. Figure 1 In the illustrated embodiment, the clearance portion 65 has an annular planar shape, but in contrast, the clearance portion may be a recessed planar groove in an area that is only able to clear the annular frame support portion 110.

[0053] In contrast, in other embodiments, the chuck stage 60 may not have a clearance portion 65, but may only include a base plate support portion 63.

[0054] When the substrate assembly 1 is supported on the chuck stage 60, the annular frame pressing section 120 applies pressure to the annular frame 5 in the direction of warpage flattening of the substrate 2. The substrate processing apparatus 10 may also include a transfer section 100.

[0055] The transfer unit 100 is disposed outside the chuck table 60 and can be raised and lowered relative to the chuck table 60. The transfer unit 100 may include a main body 101 and a lifting drive unit 105 for raising and lowering the main body 101.

[0056] The annular frame pressurizing part 120 can be provided in the transfer part 100. The annular frame pressurizing part 120 can include a neck 121 extending horizontally from the main body 101, and a curved extension 124 connected to the neck 121 and extending along a curved path to overlap with the annular frame 5 vertically. Figures 1 to 3 The neck 121 extends parallel to the X-axis.

[0057] The substrate processing apparatus 10 may also include an annular frame support portion 110. The annular frame support portion 110 is disposed below the annular frame pressing portion 120, thereby supporting the annular frame 5. The annular frame support portion 110 may be provided in the transfer portion 100. The annular frame support portion 110 may extend horizontally from the main body portion 101. Figures 1 to 3The annular frame support 110 extends parallel to the X-axis.

[0058] The annular frame support portion 110 and the neck 121 can extend parallel to each other. The annular frame support portion 110 may include an adsorption portion for adsorbing the annular frame 5 at its end remote from the main body portion 101. The adsorption portion may include an adsorption pad 112. For example... Figure 5 and Figure 6 As shown in the figure, the gap D1 between the annular frame pressure part 120 and the annular frame support part 110 can be greater than the thickness of the annular frame 5.

[0059] The annular frame support 110 is movable relative to the main body 101 in a horizontal direction, specifically along the length of the annular frame support 110. When the annular frame support 110 moves horizontally, the annular frame pressing part 120 can move together with it. For example, the annular frame pressing part 120 can move a distance equal to the distance the annular frame support 110 moves in the same direction as the direction in which the annular frame support 110 moves relative to the main body 101.

[0060] The annular frame pressure section 120 is movable horizontally relative to the annular frame support section 110. For example, when the annular frame support section 110 moves horizontally in the direction protruding from the main body section 101 to support the annular frame 5, the annular frame pressure section 120 moves horizontally together with the annular frame support section 110 in the direction protruding from the main body section 101. In other words, according to... Figures 1 to 3 The ring frame pressure section 120 moves parallel to the X-axis.

[0061] After the annular frame 5 is supported by the annular frame support portion 110, and the annular frame support portion 110 does not move in the horizontal direction, the annular frame pressurizing portion 120 can move further in the direction protruding from the main body portion 101 in order to press down on the annular frame 5.

[0062] It can be equipped with a pair of transfer parts 100. Therefore, the annular frame support part 110 and the annular frame pressurizing part 120 provided in the transfer part 100 can each be provided in a pair. Figure 1 , Figure 3 as well as Figure 4 As illustrated, a pair of transfer units 100 can be arranged facing each other across the chuck table 60. In other words, a pair of annular frame support units 110 and a pair of annular frame pressurizing units 120 can be arranged facing each other across the chuck table 60.

[0063] The substrate processing apparatus 10 may also include a substrate transfer robot 50 that supports and moves the substrate assembly 1. The substrate transfer robot 50 may include a plurality of fingers 52 spaced apart from each other and extending parallel to each other at the same height. The substrate transfer robot 50 may move the substrate assembly 1 to a position aligned vertically with the chuck table 60 via a pair of transfer units 100.

[0064] The process of using the substrate transfer device 10 to support the substrate assembly 1 on the chuck table 60 without slipping or wobbling is as follows. First, a pair of annular frame support portions 110 are made to protrude horizontally from the main body portion 101 so that the ends 112 of the pair of annular frame support portions 110 are vertically aligned with the clearance portion 65 of the chuck table 60.

[0065] At this time, the pair of annular frame pressurizing parts 120 and the pair of annular frame supporting parts 110 move together in the direction protruding from the main body part 101, but if Figure 1 As shown in the figure, it may not be vertically aligned with the clearance portion 65 of the chuck table 60.

[0066] Next, as Figure 1 and Figure 3 As illustrated, with multiple finger sections 52 supporting the substrate assembly 1, the substrate transfer robot 50 enters between a pair of annular frame support sections 110, aligning the substrate assembly 1 vertically with the chuck table 60. Figure 3 The substrate transfer robot 50 can move and enter along the negative (-) direction of the Y-axis while supporting the substrate assembly 1.

[0067] The substrate transfer robot 50 is capable of moving the substrate assembly 1 so that the substrate assembly 1 is positioned at a height higher than the pair of annular frame supports 110.

[0068] At this time, since the width FD of the substrate transfer robot 50, for example, the maximum distance between the plurality of fingers 52 is less than the interval SD between a pair of annular frame support portions 110, the substrate transfer robot 50 and the annular frame support portion 110 can avoid collision.

[0069] Next, as the substrate transfer robot 50 descends, that is, when it moves along the negative (-) direction of the Z-axis, the annular frame 5 is supported by a pair of annular frame support portions 110, and the substrate transfer robot 50 can be spaced apart from the substrate assembly 1. The substrate transfer robot 50, which is spaced apart from the substrate assembly 1, can move along the positive (+) direction of the Y-axis, thereby moving to a standby position that does not overlap with the chuck table 60.

[0070] Next, a pair of annular frame pressure portions 120 move horizontally in a direction that further protrudes from the main body portion 101, so as to overlap with the annular frame 5 above the annular frame 5.

[0071] Next, the pair of transfer units 100 descend. Specifically, the main body 101 of the transfer unit 100 moves and descends along the negative (-) direction of the Z-axis. Thus, as... Figure 4 and Figure 5 As shown in the figure, with the annular frame 5 supported by a pair of annular frame support portions 110, the pair of annular frame pressing portions 120 and the pair of annular frame support portions 110 descend toward the chuck table 60, thereby enabling the substrate assembly 1 to be supported on the substrate support portion 63 of the chuck table 60.

[0072] During the descent of the pair of transfer sections 100, a vacuum pump (not shown) is able to operate to create a negative pressure on the base plate support section 63 of the chuck stage 60.

[0073] Next, the pair of transfer units 100 move further and descend along the negative (-) direction of the Z-axis. Thus, as... Figure 6 As shown in the figure, a pair of annular frame pressure portions 120 and a pair of annular frame support portions 110 are further lowered, thereby separating the pair of annular frame support portions 110 from the annular frame 5, and the pair of annular frame pressure portions 120 apply downward pressure to the annular frame 5.

[0074] When the negative pressure of the substrate support 63 is within the range of the reference pressure, it is determined that the substrate assembly 1 is stably adsorbed and supported on the substrate support 63, a pair of annular frame support parts 110 and a pair of annular frame pressurizing parts 120 move in the direction of insertion into the corresponding main body part 101, and a pair of transfer parts 100 can be moved up and down to a standby position that does not obstruct the substrate processing operation at the chuck worktable 60.

[0075] Next, a predetermined substrate processing process can be performed on the substrate 2 of the substrate assembly 1, which is stably supported on the substrate support portion 63 of the chuck stage 60.

[0076] In the substrate processing apparatus 10 described above, the annular frame pressing section 120 presses the annular frame 5 of the substrate assembly 1 along the warping and flattening direction. Therefore, even if the annular frame 5 or the substrate 2 is warped, the substrate assembly 1 can be stably placed on the chuck table 60. This can improve the quality and productivity of substrate processing operations such as cutting, etching, and cleaning, reduce the defect rate, and decrease operating costs.

[0077] exist Figure 5 and Figure 6 In the illustrated annular frame pressing part 120, when the substrate assembly 1 is warped downwards, the annular frame pressing part 120 presses down on the outer peripheral end 6 of the annular frame 5 to flatten the warped annular frame 5.

[0078] On the other hand, when the substrate assembly 1 is warped upwards, when the substrate assembly 1 is supported on the substrate support portion 63, the central portion of the substrate assembly 1, which is spaced apart from the substrate support portion 63, is pulled along the direction attached to the substrate support portion 63 by the negative pressure formed on the substrate support portion 63, thereby flattening the substrate assembly 1.

[0079] Figure 7 This is a plan view of the substrate processing apparatus according to the second embodiment of the present invention, and it illustrates the case where the substrate assembly is supported on a pair of transfer sections and lowered for placement on a chuck worktable. Figure 8 It is Figure 7 Take a sectional view along line VIII-VIII as shown in the figure. Figure 9 It is shown in the figure. Figure 8 A cross-sectional view of a ring frame pressure section rotating to apply pressure to the ring frame and flatten it.

[0080] With reference Figures 1 to 6 The situation is the same as that of the substrate processing apparatus described in the first embodiment of the present invention. Figures 7 to 9 In the second embodiment of the present invention illustrated, the direction of horizontal movement of the annular frame pressure section can also be parallel to the X-axis, the direction of lifting and lowering of the annular frame, the annular frame pressure section, and the transfer section can also be parallel to the Z-axis, and the direction of horizontal movement of the substrate transfer robot in a manner intersecting the X-axis can also be parallel to the Y-axis.

[0081] Reference Figures 7 to 9 The substrate processing apparatus 20 according to the second embodiment of the present invention can include a substrate transfer robot 50 (see reference 1). Figure 1 The system comprises a chuck table 60, a transfer section 200, an annular frame support section 210, and an annular frame pressurizing section 220. The substrate transfer robot 50 and the chuck table 60 are compared with a reference... Figures 1 to 6 The substrate transfer robot 50 and the chuck worktable 60 included in the substrate processing apparatus 10 of the first embodiment of the present invention are the same and are indicated by the same reference numerals, so repeated descriptions are omitted.

[0082] The substrate processing apparatus 20 may include a pair of transfer units 200. The pair of transfer units 200 are disposed outside the chuck table 60 and are capable of being raised and lowered relative to the chuck table 60. Each transfer unit 200 may include a main body 201 and a lifting drive unit (not shown) for raising and lowering the main body 201.

[0083] Each transfer unit 200 may also include an annular frame support unit 210 and multiple annular frame pressurizing units 220. For example... Figure 7As illustrated, a pair of transfer units 200 can be arranged facing each other across the chuck table 60. In other words, a pair of annular frame support units 210 and multiple pairs of annular frame pressurizing units 220 can be arranged facing each other across the chuck table 60.

[0084] The annular frame support portion 210 is disposed below the annular frame pressure portion 220, thereby supporting the annular frame 5. The annular frame support portion 210 may include a neck 211 protruding horizontally from the main body portion 201, and a curved extension portion 214 connected to the neck 211 and extending along a curved path to overlap vertically with the annular frame 5.

[0085] The annular frame support 210 can move in a direction that protrudes horizontally relative to the main body 201 and in a direction that is horizontally inserted into the main body 201. Furthermore, the annular frame support 210 can move in a direction toward the rotation axis RX of the chuck table 60 and in a direction away from the rotation axis RX.

[0086] Each annular frame pressurizing part 220 may include a rotating rod 225, a rotating rod support 221, a trigger 240, and a cam part 237. The rotating rod 225 rotates (pivots) while the base plate assembly 1 is supported on the chuck table 60, thereby applying pressure to the annular frame 5 on the annular frame support part 210 side.

[0087] The rotating rod support 221 rotatably supports the rotating rod 225 and is supported on the annular frame support 210. The rotating rod support 221 can protrude upward from the neck 211 of the annular frame support 210. For example, the rotating rod 225 can be rotatably supported on the rotating rod support 221 by a hinge pin 223 passing through the rotating rod 225 and the rotating rod support 221.

[0088] The rotating rod 225 can be divided into a first rod portion 226 on one side and a second rod portion 228 on the other side, with the hinge pin 223 serving as the center of rotation. The first rod portion 226 and the second rod portion 228 can be bent at a predetermined angle. A groove 212 can be formed in the neck 211 to avoid collision with the second rod portion 228.

[0089] The trigger 240 is configured to move linearly in the horizontal direction. For example, the trigger 240 can move linearly in the direction toward the rotation axis RX and in the opposite direction. One side of the trigger 240 extends into the main body 201, and the other side of the trigger 240 can be connected to the second lever 228 via the cam portion 237.

[0090] The cam portion 237 connects the trigger 240 and the rotating rod 225, and can connect the trigger 240 and the rotating rod 225 in a way that converts the linear motion of the trigger 240 into the rotational motion of the rotating rod 225.

[0091] For example, the cam portion 237 may include an elongated hole 235 that passes through the second rod portion 228 and extends along the length direction of the second rod portion 228, and a rod connecting pin 236 that protrudes from the other side of the trigger 240 and passes through the elongated hole 235.

[0092] Reference Figure 8 and Figure 9 When the control unit (not shown) of the substrate processing apparatus 20 transmits a control signal to the transfer unit 200, causing the trigger 240 to move linearly in the direction of insertion into the main body 201, the rotating rod 225 can rotate to apply downward pressure to the annular frame 5.

[0093] The annular frame pressure section 220 may also include a pressure roller 230 that applies downward pressure to the annular frame 50 to minimize damage caused by friction. The pressure roller 230 may be rotatably coupled to the first rod section 226 by passing through the end of the first rod section 226 and the roller pin 232 of the pressure roller 230.

[0094] like Figure 8 As illustrated, when the trigger 240 is moved to its maximum position in the opposite direction to the direction toward the main body 201, or in other words, in the direction toward the rotation axis RX, the gap D2 between the annular frame support 210 and the pressure roller 230 in the vertical direction can be greater than the thickness of the annular frame 5. Multiple annular frame pressure sections 220 can be arranged on the annular frame support 210 at intervals between each other.

[0095] The process of using the substrate transfer device 20 to support the substrate assembly 1 on the chuck table 60 without slipping or wobbling is as follows. First, a pair of annular frame support portions 210 are made to protrude horizontally from the main body portion 201, so that the curved extension portions 214 of the pair of annular frame support portions 210 are vertically aligned with the clearance portion 65 of the chuck table 60.

[0096] Next, as Figure 7 As shown in the figure, the substrate transfer robot 50 (refer to) Figure 1 The substrate transfer robot 50 moves the substrate assembly 1 between a pair of annular frame supports 210 while supporting the substrate assembly 1, aligning the substrate assembly 1 vertically with the chuck table 60. The substrate transfer robot 50 can move the substrate assembly 1 so that the substrate assembly 1 is positioned higher than the height of the pair of annular frame supports 210 and lower than the end of the second rod 226, in other words, lower than the height of the pressure roller 230.

[0097] Next, as the substrate transfer robot 50 descends, the annular frame 5 is supported by a pair of annular frame support portions 210, allowing the substrate transfer robot 50 to be spaced apart from the substrate assembly 1. The substrate transfer robot 50, spaced apart from the substrate assembly 1, can move to a standby position that does not overlap with the chuck table 60.

[0098] Next, the pair of transfer units 200 descend. Specifically, the main body 201 of the transfer unit 200 descends. Thus, as... Figure 8 As shown in the figure, with the annular frame 5 supported by a pair of annular frame support portions 210, the annular frame pressing portion 220 and the annular frame support portion 210 descend toward the chuck table 60, thereby enabling the substrate assembly 1 to be supported on the substrate support portion 63 of the chuck table 60.

[0099] During the descent of the pair of transfer sections 200, a vacuum pump (not shown) is able to operate to create a negative pressure on the base plate support section 63 of the chuck stage 60.

[0100] Next, the trigger 240 moves linearly toward the main body 201. The cam 237 converts the linear motion of the trigger 240 into the rotational motion of the rotating rod 225, and the pressure roller 230 supported at the end of the second rod 226 applies downward pressure to the annular frame 5.

[0101] When the negative pressure of the substrate support 63 is within the range of the reference pressure, it is determined that the substrate assembly 1 is stably adsorbed and supported on the substrate support 63, the annular frame support 210 and the annular frame pressurizing part 220 move in the direction of insertion into the corresponding main body 201, and the pair of transfer parts 200 can be raised and lowered to a standby position that does not obstruct the substrate processing operation at the chuck worktable 60.

[0102] Next, a predetermined substrate processing process can be performed on the substrate 2 of the substrate assembly 1, which is stably supported on the substrate support portion 63 of the chuck stage 60.

[0103] exist Figure 7 In the illustrated embodiment, a pair of annular frame pressing portions 220, including the pressing roller 230, are arranged close to each other at the center of the annular frame support portion 210 in the longitudinal direction. However, unlike the illustration, a pair of annular frame pressing portions 220 may also be arranged at each of the two ends in the longitudinal direction of the annular frame support portion 210 to be spaced apart as much as possible.

[0104] Figure 10 This is a plan view of the substrate processing apparatus according to the third embodiment of the present invention, and it is a diagram showing the substrate assembly placed on the chuck worktable. Figure 11 It is shown in the figure. Figure 10 A 3D view of the transfer department. Figure 12 It is shown in the figure. Figure 10 A front view of the chuck stage and the base plate assembly supported on the chuck stage. Figure 13 Is with Figure 12 The enlarged view of the part corresponding to section B is a diagram showing the situation where the chuck table rises so that the annular frame is pressurized and flattened by the annular frame pressurizing part.

[0105] With reference Figures 1 to 6 The situation is the same as that of the substrate processing apparatus described in the first embodiment of the present invention. Figures 10 to 13 In the case of the third embodiment of the present invention illustrated, the direction of horizontal movement of the annular frame pressure section can also be parallel to the X-axis, the direction of lifting and lowering of the annular frame, the annular frame pressure section, and the transfer section can also be parallel to the Z-axis, and the direction of horizontal movement of the substrate transfer robot in a manner intersecting the X-axis can also be parallel to the Y-axis.

[0106] Reference Figures 10 to 13 The substrate processing apparatus 30 according to the third embodiment of the present invention can include a substrate transfer robot 50 (see reference 50). Figure 1 ), chuck worktable 70, transfer unit 300, and ring frame pressurizing unit 320. Due to the substrate transfer robot 50 and the reference... Figures 1 to 6 The substrate transfer robot 50 included in the substrate processing apparatus 10 of the first embodiment of the present invention is the same as that described herein, so repeated descriptions are omitted.

[0107] The chuck stage 70 may include a substrate support portion 73 for supporting the substrate assembly 1, and a plurality of support pins 75 that protrude from the surface of the chuck stage 70, for example from the substrate support portion 73, to avoid the fingers 52 of the substrate transfer robot 50 and to support the substrate assembly 1. The plurality of support pins 75 may be arranged in a spaced-apart manner. The plurality of support pins 75 may support the substrate assembly 1 at three or more points.

[0108] With multiple support pins 75 inserted into the substrate support portion 73 and the substrate assembly 1 supported on the substrate support portion 73, a negative pressure can be formed on the surface of the substrate support portion 73 so that the substrate assembly 1 is adsorbed onto the substrate support portion 73.

[0109] The substrate processing apparatus 30 may include a pair of transfer units 300. The pair of transfer units 300 are disposed outside the chuck table 70 and are capable of lifting and lowering relative to the chuck table 70. Each transfer unit 300 may include a main body 301 and a lifting drive unit 305 for lifting and lowering the main body 301.

[0110] Each transfer unit 300 may also include a ring-shaped frame pressurization unit 320. For example... Figure 10As illustrated, a pair of transfer units 300 can be arranged facing each other across the chuck table 70. In other words, a pair of annular frame pressurizing units 320 can be arranged facing each other across the chuck table 70.

[0111] The annular frame pressurizing part 320 may include a neck 321 that protrudes horizontally from the main body part 301, and a straight extension part 324 that is connected to the neck 321 and extends along a straight path so as to overlap vertically with the annular frame 5.

[0112] The annular frame pressure unit 320 can move in a direction that protrudes horizontally relative to the main body 301 and in a direction that is horizontally inserted into the main body 301. Furthermore, the annular frame pressure unit 320 can move in a direction toward the rotation axis RX of the chuck table 70 and in a direction away from the rotation axis RX.

[0113] The process of using the substrate transfer device 30 to support the substrate assembly 1 on the chuck table 70 without slipping or wobbling is as follows.

[0114] First, such as Figure 10 and Figure 12 As shown in the figure, the substrate transfer robot 50 (refer to) Figure 1 The substrate assembly 1 is moved while being supported, so that the substrate assembly 1 is transferred and supported on the chuck stage 70.

[0115] Furthermore, multiple support pins 75 protrude from the substrate support portion 73, allowing the substrate transfer robot 50 to move horizontally in a manner aligned vertically with the chuck table 70. This ensures that multiple fingers 52 avoid the multiple support pins 75. When the substrate transfer robot 50 descends, the substrate assembly 1 is supported by the multiple support pins 75, and the substrate transfer robot 50 can be spaced apart from the substrate assembly 1. The substrate transfer robot 50, spaced apart from the substrate assembly 1, can move to a standby position that does not overlap with the chuck table 70.

[0116] Next, the pair of annular frame pressing portions 320 are moved horizontally in the direction protruding from the main body portion 301, so that the straight extensions 324 of the pair of annular frame pressing portions 320 overlap vertically with the annular frame 5. Figure 12 As shown in the figure, a pair of annular frame pressure units 320 can be located above the chuck table 70.

[0117] Next, the plurality of support pins 75 are lowered to be inserted into the interior of the substrate support portion 73, and as... Figure 12 As indicated by the arrow, the chuck stage 70 is raised to approach the pair of annular frame pressurization sections 320. During the rise of the chuck stage 70, a vacuum pump (not shown) is activated to create a negative pressure on the base plate support section 63 of the chuck stage 70.

[0118] With the annular frame pressure section 320 stopped, the chuck table 70 rises, thus... Figure 13 As shown in the figure, with the substrate assembly 1 supported on the substrate support portion 73, the annular frame 5 is pressed downward by a pair of annular frame pressing portions 120.

[0119] When the negative pressure of the substrate support 73 is within the range of the reference pressure, it is determined that the substrate assembly 1 is stably adsorbed and supported on the substrate support 73, a pair of annular frame pressure parts 320 move along the direction of insertion into the corresponding main body 301, and a pair of transfer parts 300 can be raised and lowered to a standby position that does not obstruct the substrate processing operation at the chuck worktable 60.

[0120] Next, a predetermined substrate processing process can be performed on the substrate 2 of the substrate assembly 1, which is stably supported on the substrate support portion 63 of the chuck stage 60.

[0121] On the other hand, with Figure 12 As shown in the diagram, instead of raising the chuck table 70, the pair of annular frame pressure parts 320 can be lowered to approach the chuck table 70, thereby applying downward pressure to the annular frame 5.

[0122] Figure 14 This is a plan view of the substrate processing apparatus according to the fourth embodiment of the present invention, and it illustrates the situation where the substrate assembly is adsorbed and supported on the annular frame pressure section on the chuck worktable. Figure 15 It is shown in the figure. Figure 14 A 3D view of the transfer department. Figure 16 It is shown in the figure. Figure 15 The diagram shows the situation where the annular frame pressure section is pressed downwards and flattened to support the annular frame on the chuck table. Figure 17 It is shown in the figure. Figure 15 The diagram shows the situation where the ring frame is flattened by magnetic force pulling the ring frame downwards through the pressure part of the ring frame.

[0123] With reference Figures 1 to 6 The situation is the same as that of the substrate processing apparatus described in the first embodiment of the present invention. Figures 14 to 17 In the fourth embodiment of the present invention illustrated, the direction of horizontal movement of the annular frame pressure section can also be parallel to the X-axis, the direction of lifting and lowering of the annular frame, the annular frame pressure section, and the transfer section can also be parallel to the Z-axis, and the direction of horizontal movement of the substrate transfer robot in a manner intersecting the X-axis can also be parallel to the Y-axis.

[0124] Reference Figures 14 to 16 The substrate processing apparatus 40 according to the fourth embodiment of the present invention can include a substrate transfer robot 50 (see reference 1). Figure 1The system includes a chuck table 60, a transfer unit 400, and a ring frame pressurizing unit 420. The substrate transfer robot 50 and the chuck table 60 are related to the reference... Figures 1 to 6 The substrate transfer robot 50 and the chuck worktable 60 included in the substrate processing apparatus 10 of the first embodiment of the present invention are the same and are indicated by the same reference numerals, so repeated descriptions are omitted.

[0125] The substrate processing apparatus 40 may include a pair of transfer units 400. The pair of transfer units 400 are disposed outside the chuck table 60 and are capable of lifting and lowering relative to the chuck table 60. Each transfer unit 400 may include a main body 401 and a lifting drive unit 405 for lifting and lowering the main body 401.

[0126] Each transfer unit 400 may also include a ring-shaped frame pressurization unit 420. For example... Figure 14 and Figure 15 As illustrated, a pair of transfer units 400 can be arranged facing each other across the chuck table 60. In other words, a pair of annular frame pressurizing units 420 can be arranged facing each other across the chuck table 60.

[0127] The annular frame pressurizing part 420 may include a neck 421 that protrudes horizontally from the main body part 401, and a curved extension 424 that is connected to the neck 421 and extends along a curved path to overlap with the annular frame 5 vertically.

[0128] The annular frame pressure unit 420 can move in a direction that protrudes horizontally relative to the main body 401 and in a direction that is horizontally inserted into the main body 401. Furthermore, the annular frame pressure unit 420 can move in a direction toward the rotation axis RX of the chuck table 60 and in a direction away from the rotation axis RX.

[0129] The annular frame 5 of the substrate assembly 1 can include a magnetic material. For example, the annular frame 5 can be made of steel. The annular frame pressing part 420 can include an electromagnet 426 that generates a magnetic force to pull the annular frame 5 by the supply of electrical power. Multiple electromagnets 426 can be provided. The multiple electromagnets 426 can be arranged at intervals along the length direction of the curved extension 420.

[0130] The process of using the substrate transfer device 40 to support the substrate assembly 1 on the chuck table 60 without slipping or wobbling is as follows. First, a pair of annular frame pressure portions 420 are made to protrude horizontally from the main body portion 401, so that the curved extension portion 424 of the pair of annular frame pressure portions 420 is vertically aligned with the clearance portion 65 of the chuck table 60.

[0131] Next, the substrate transfer robot 50 (see reference) Figure 1The substrate transfer robot 50 moves the substrate assembly 1 between a pair of annular frame pressure sections 420 while supporting the substrate assembly 1, aligning the substrate assembly 1 vertically with the chuck table 60. The substrate transfer robot 50 can move the substrate assembly 1 so that the substrate assembly 1 is positioned at a height lower than that of the pair of annular frame pressure sections 420.

[0132] Next, the pair of transfer units 400 are lowered so that the pair of annular frame pressing units 420 contact the upper side of the annular frame 5. Specifically, the main body 401 of the transfer unit 400 can be lowered. The pair of annular frame pressing units 420 can magnetically support the annular frame 5 and the substrate assembly 1 from above, preventing them from falling. The substrate transfer robot 50 can move to a standby position that is spaced apart from the substrate assembly 1 and does not overlap with the chuck table 60.

[0133] Next, the pair of transfer units 200 descend. Specifically, the main body 401 of the transfer unit 200 can descend. Thus, as... Figure 16 As shown in the figure, with the annular frame 5 supported by a pair of annular frame pressure portions 420, the substrate assembly 1 descends toward the chuck stage 60, thereby being able to be supported by the substrate support portion 63 of the chuck stage 60.

[0134] During the descent of the pair of transfer sections 400, a vacuum pump (not shown) is able to operate to create a negative pressure on the base plate support section 63 of the chuck stage 60.

[0135] Next, the pair of transfer units 400 descended further. Thus, as... Figure 16 As illustrated, a pair of annular frame pressure sections 420 further descend and pressurize the annular frame 5 downwards to flatten the warped annular frame 5.

[0136] When the negative pressure of the substrate support 63 is within the range of the reference pressure, it is determined that the substrate assembly 1 is stably adsorbed and supported on the substrate support 63, the annular frame pressure part 420 moves along the direction of insertion into the corresponding main body part 401, and the pair of transfer parts 400 can be raised and lowered to a standby position that does not obstruct the substrate processing operation at the chuck worktable 60.

[0137] Next, a predetermined substrate processing process can be performed on the substrate 2 of the substrate assembly 1, which is stably supported on the substrate support portion 63 of the chuck stage 60.

[0138] On the other hand, such as Figure 17 As illustrated, the annular frame pressure section 420, including the electromagnet 426, can also support the annular frame 5 from below. (See reference...) Figure 15 and Figure 17When the annular frame pressure section 420 supports the annular frame 5 from below, when the pair of transfer sections 200 descend, the pair of annular frame pressure sections 420 descend toward the chuck table 60 while the annular frame 5 is supported by the pair of annular frame pressure sections 420, so that the substrate assembly 1 can be supported on the substrate support section 63 of the chuck table 60.

[0139] During the descent of the pair of transfer sections 400, a vacuum pump (not shown) is able to operate to create a negative pressure on the base plate support section 63 of the chuck stage 60.

[0140] Next, the pair of transfer units 400 descended further. For example... Figure 17 As shown in the diagram, a pair of annular frame pressure sections 420 further descend and pull the annular frame 5 downward by magnetic force, thereby enabling the annular frame 5 to flatten.

[0141] When the magnitude of the negative pressure on the substrate support portion 63 is within the range of the reference pressure, it is determined that the substrate assembly 1 is stably adsorbed and supported on the substrate support portion 63.

[0142] When the substrate assembly 1 is stably attached to the substrate support portion 63, the supply of electrical energy to the electromagnet 426 can be interrupted to make the magnetic force of the electromagnet 426 disappear. As a result, the annular frame pressure portion 420 separates from the annular frame 5.

[0143] Next, the annular frame pressure section 420 moves along the direction of insertion into the corresponding main body section 401, and the pair of transfer sections 400 can be raised and lowered to a standby position that does not obstruct the substrate processing operation at the chuck worktable 60.

[0144] Next, a predetermined substrate processing process can be performed on the substrate 2 of the substrate assembly 1, which is stably supported on the substrate support portion 63 of the chuck stage 60.

[0145] The invention has been described with reference to one embodiment illustrated in the accompanying drawings. However, it should be understood that these are merely examples, and those skilled in the art can make various modifications or equivalent embodiments based on the above description. Therefore, the true scope of protection of the invention should be defined according to the appended claims.

Claims

1. A substrate processing apparatus, characterized in that, include: A chuck stage and a support substrate assembly, the substrate assembly having a substrate and an annular frame configured to surround and support the substrate. as well as The annular frame pressure section applies pressure to the annular frame along the direction of the warping and flattening of the substrate.

2. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus further includes: The transfer unit is located outside the chuck table and can move up and down relative to the chuck table. The transfer unit includes the annular frame pressurization unit.

3. The substrate processing apparatus according to claim 2, characterized in that, Equipped with a pair of the aforementioned transfer units, The pair of transfer units are arranged facing each other across the chuck table.

4. The substrate processing apparatus according to claim 3, characterized in that, The substrate processing apparatus further includes: A substrate transfer robot supports the substrate assembly and moves the substrate assembly to a position aligned with the chuck table via a pair of transfer units.

5. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus further includes: A ring-shaped frame support is disposed below the ring-shaped frame pressure section, thereby supporting the ring-shaped frame. The distance between the pressure section of the annular frame and the support section of the annular frame is greater than the thickness of the annular frame.

6. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus further includes: A ring-shaped frame support is disposed below the ring-shaped frame pressure section, thereby supporting the ring-shaped frame. The annular frame support includes an adsorption section that adsorbs the annular frame.

7. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus further includes: A ring-shaped frame support is disposed below the ring-shaped frame pressure section, thereby supporting the ring-shaped frame. The annular frame pressurizing part is capable of moving horizontally relative to the annular frame support part.

8. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus further includes: A ring-shaped frame support is disposed below the ring-shaped frame pressure section, thereby supporting the ring-shaped frame. The chuck worktable includes: A substrate support portion supports the substrate assembly, and a negative pressure is formed on the surface of the substrate support portion to attract the substrate assembly; and The avoidance part is designed to prevent it from colliding with the annular frame support and becoming dented.

9. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus further includes: A ring-shaped frame support is disposed below the ring-shaped frame pressure section, thereby supporting the ring-shaped frame. With the annular frame supported by the annular frame support portion, the annular frame pressurizing portion and the annular frame support portion descend toward the chuck table, thereby supporting the base plate assembly on the chuck table. The annular frame pressurizing part and the annular frame support part are further lowered, thereby separating the annular frame support part from the annular frame, and the annular frame pressurizing part applies downward pressure to the annular frame.

10. The substrate processing apparatus according to claim 1, characterized in that, The annular frame pressurization section includes: The rotating rod rotates while the base plate assembly is supported on the chuck table, thereby applying pressure to the annular frame on the chuck table side.

11. The substrate processing apparatus according to claim 10, characterized in that, The annular frame pressurization section also includes: The trigger is capable of linear motion in a direction parallel to the substrate assembly; A cam section connects the trigger and the rotating rod, and connects the trigger and the rotating rod in a manner that converts the linear motion of the trigger into the rotational motion of the rotating rod; and A pressure roller, connected to the rotating rod, applies downward pressure to the annular frame.

12. The substrate processing apparatus according to claim 10, characterized in that, The annular frame pressurization section also includes: The trigger is capable of linear motion in a direction parallel to the substrate assembly. With the annular frame supported by the annular frame support portion, the annular frame pressurizing portion and the annular frame support portion descend toward the chuck table, thereby supporting the base plate assembly on the chuck table. The trigger moves linearly in one direction, causing the rotating rod to rotate and apply downward pressure to the annular frame.

13. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus further includes: A substrate transfer robot supports and moves the substrate assembly so that the substrate assembly is supported on the chuck stage.

14. The substrate processing apparatus according to claim 1, characterized in that, The chuck worktable includes: Multiple support pins protrude from the surface of the chuck stage to support the substrate assembly.

15. The substrate processing apparatus according to claim 13, characterized in that, The annular frame pressurizing section is located above the chuck worktable. When the substrate assembly is supported on the chuck stage, the substrate transfer robot moves to create a gap between itself and the substrate assembly and the chuck stage. The chuck worktable rises toward the annular frame pressure section, thereby pressing the annular frame downwards by the annular frame pressure section.

16. The substrate processing apparatus according to claim 1, characterized in that, The annular frame includes a magnetic material. The annular frame pressurization section includes an electromagnet that generates a magnetic force to pull the annular frame through the supply of electrical energy.

17. The substrate processing apparatus according to claim 16, characterized in that, The annular frame pressure section supports the annular frame from above via magnetic force, preventing the annular frame from falling. With the annular frame supported by the annular frame pressure section, the annular frame pressure section descends toward the chuck stage, thereby supporting the base plate assembly on the chuck stage. The annular frame pressurization section descends further and applies downward pressure to the annular frame.

18. The substrate processing apparatus according to claim 16, characterized in that, The annular frame pressure section supports the annular frame from below. With the annular frame supported by the annular frame pressure section, the annular frame pressure section descends toward the chuck stage, thereby supporting the base plate assembly on the chuck stage. The pressure section of the annular frame descends further and pulls the annular frame downwards by the magnetic force, thereby flattening the annular frame.

Images