Wafer edge polishing apparatus and polishing method

Abstract

The application relates to the technical field of polishing of optical waveguide wafers, and discloses a wafer edge polishing device which comprises clamping plates, two groups of guide seats, moving tables, coarse grinding wheels and fine grinding wheels, two groups of V-shaped plates on a box body are respectively provided with the coarse grinding wheels and the fine grinding wheels, leveling mechanisms are arranged on the coarse grinding wheels and the fine grinding wheels, driving pieces three are arranged on the bases, and the driving pieces three are used for driving the four groups of moving tables to move synchronously. The coarse grinding wheels and the fine grinding wheels are arranged on the same moving table, the two can be quickly switched through the driving piece two, the four groups of moving tables are driven to move synchronously through the driving piece three, coarse polishing and fine polishing can be continuously completed on the same device, position conversion and repeated clamping are not needed, the influence of accumulated positioning errors on polishing precision is avoided, the wafer polishing period is greatly shortened, and the production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of optical waveguide wafer polishing technology, specifically to a wafer edge polishing device and polishing method. Background Technology

[0002] Optical waveguide wafers are the core optical components of augmented reality (AR) glasses. As a transparent light-guiding structure embedded inside the lens, they guide images generated by a miniature projection optical engine to the viewer's eye while maintaining the lens's transparency, enabling the overlay display of real-world and virtual information. Optical waveguide wafers are typically square-shaped, and during manufacturing, their four edges require precision polishing to ensure smoothness and flatness, thereby guaranteeing optical performance.

[0003] Currently, there are two main polishing methods: one is to use a polishing wheel that moves along the edge of the waveguide wafer; the other is to fix the polishing wheel and move the waveguide wafer to bring the edge into contact with the polishing wheel. In actual production, to achieve the required surface quality, it is usually necessary to perform rough polishing first, followed by fine polishing. However, existing polishing processes have the following shortcomings: First, rough polishing and fine polishing need to be completed in steps on different polishing equipment, requiring station switching during the process. Station switching not only leads to repeated clamping and positioning of wafers between different devices, which can easily generate cumulative positioning errors and affect the final polishing accuracy and optical performance of the waveguide, but also significantly prolongs the polishing cycle of a single wafer and reduces production efficiency.

[0004] Secondly, during the polishing process, the edges of the waveguide wafer may have microscopic unevenness or shape deviations, resulting in uneven pressure on the upper and lower polishing surfaces of the polishing wheel when they contact the wafer edge. Prolonged operation under uneven pressure can easily cause the polishing wheel axis to shift, leading to inconsistent spacing between the upper and lower polishing surfaces and the wafer edge. This results in different amounts of material removed from the upper and lower sides of the wafer edge, mismatched polishing progress, and ultimately inconsistent polishing results and asymmetrical edge shapes, severely impacting polishing quality. Furthermore, uneven force on the wafer edge can also cause defects such as edge chipping or collapse in the edge area or at the four corners, further reducing product yield. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a wafer edge polishing device and polishing method, so as to achieve both coarse and fine polishing, and avoid polishing wheel axis misalignment and wafer edge chipping and collapse.

[0006] The objective of this invention can be achieved through the following technical solutions: A wafer edge polishing apparatus includes a base, a support, and a processing table, the apparatus further comprising: The wafer is clamped between two sets of clamps. One set of clamps is fixed to the processing table, which is equipped with a support. A telescopic component is mounted on the support, and the output end of the telescopic component is fitted with the other set of clamps. The processing table is provided with four sets of guide seats, which correspond to the four edges of the wafer. The mobile stage is provided with four sets of mobile stages. The mobile stage includes a housing, which is slidably mounted on a guide seat. A second driving component is installed inside the housing. The output end of the second driving component is provided with a gear. Two sets of through slots are opened on the housing. A U-shaped plate is slidably mounted in the through slot. A toothed plate is provided on one side of the U-shaped plate. The toothed plate meshes with the gear. The housing contains two sets of U-shaped plates on which coarse and fine grinding wheels are respectively installed. A drive unit is installed inside the housing. The output end of the drive unit is equipped with a transmission component, which is connected to the coarse and fine grinding wheels in a transmission manner. A leveling mechanism is provided on both the coarse grinding wheel and the fine grinding wheel; The third driving component is mounted on the base and is used to drive the four sets of moving platforms to move synchronously.

[0007] As a further embodiment of the present invention: the output end of the driving component three is provided with four push rods, the bottom of the housing is provided with a driving rod, four sets of guide grooves are provided on the processing table, the driving rod passes through the guide grooves, the driving rod is covered with a connecting sleeve, the connecting sleeve includes two sets of mutually perpendicular sleeves, and the driving rod and push rod are respectively fitted into the two sleeves.

[0008] As a further embodiment of the present invention: the leveling mechanism includes a connecting plate, a guide frame, a support plate, and a guide rod. The connecting plate is provided in two sets, and a guide frame is provided on one side of the connecting plate. A slider is slidably installed in the guide frame. Two sets of rotating shafts are symmetrically installed on the U-shaped plate. Vertical bars are provided around the rotating shafts. Leveling rollers are sleeved on the rotating shafts. Vertical grooves for embedding vertical bars are opened on the inner side of the leveling rollers. The leveling rollers are rotatably installed in the sliders. A guide rod is provided on the connecting plate. The support plate is fixed to the side of the box body, and the guide rod passes through the support plate.

[0009] As a further aspect of the present invention: the top and bottom of the slider are provided with a plurality of balls, which abut against the inner surface of the leveling roller.

[0010] As a further aspect of the present invention: a mounting plate is provided on one side of the guide frame, and several rollers are mounted on the mounting plate.

[0011] As a further aspect of the present invention: the clamping plate is provided with a U-shaped pressure pad around its periphery, and four sets of T-shaped grooves are formed on the pressure pad along the four sides of the clamping plate. The mounting plate extends into the T-shaped grooves, and the upper and lower sets of rollers abut against the inner and outer sides of the T-shaped grooves, respectively.

[0012] As a further aspect of the present invention: an elastic element is connected between the support plate and the connecting plate, and the two sets of elastic elements cause the two sets of connecting plates to always tend to move toward each other.

[0013] A polishing method for a wafer edge polishing apparatus, the method being applied to the wafer edge polishing apparatus as described above, the method comprising the following steps: Step S1: Fix the wafer by placing it between the two sets of clamps; Step S2: Rough grinding feed, start drive component two to make the rough grinding wheel contact the edge of the wafer; Step S3: Rough polishing. Start drive component one to make the rough grinding wheel and fine grinding wheel rotate synchronously. At the same time, start drive component three to drive the moving stage to move the rough grinding wheel along the edge of the wafer for rough polishing. Step S4: After fine grinding and coarse polishing are completed, start drive unit two again to move the coarse grinding wheel away from the wafer edge and the fine grinding wheel into contact with the wafer edge. Step S5: Fine polishing. Start the three-way reverse drive moving stage to move the fine grinding wheel along the edge of the wafer for fine polishing. Step S6: Leveling and holding. During the coarse and fine polishing processes, the axis of the coarse grinding wheel and the fine grinding wheel are kept vertical by the leveling mechanism.

[0014] The beneficial effects of this invention are: (1) The present invention sets coarse grinding wheel and fine grinding wheel on the same moving platform and uses drive component two to realize the rapid switching between the two. With drive component three driving four sets of moving platforms to move synchronously, coarse polishing and fine polishing can be completed continuously on the same device without the need for station conversion and repeated clamping. This avoids the impact of cumulative positioning error on polishing accuracy, and at the same time greatly shortens the wafer polishing cycle and improves production efficiency.

[0015] (2) By setting a leveling mechanism on the coarse grinding wheel and the fine grinding wheel, the present invention utilizes the sliding slider in the guide frame to cooperate with the leveling roller and the vertical strip and groove structure on the rotating shaft to keep the axis of the grinding wheel vertical during the polishing process. This effectively avoids the problem of grinding wheel axis offset caused by uneven wafer edge, ensures that the polishing amount on the upper and lower sides of the wafer edge is consistent, and improves the polishing quality.

[0016] (3) By setting the roller to roll into the T-groove on the outer edge of the clamping plate and combining it with the elastic element, the connecting plates always tend to move towards each other, so that the roller presses the upper and lower surfaces of the wafer edge in real time during polishing, effectively preventing edge chipping or collapse defects caused by uneven force on the wafer edge, and further improving the product yield. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the mobile station structure in this invention; Figure 3 This is a schematic diagram of the internal structure of the mobile station in this invention; Figure 4 This is a schematic diagram of the leveling mechanism in this invention; Figure 5 This is a schematic diagram of the three-structure drive component in this invention; Figure 6 This is a schematic diagram of the guide frame and leveling roller structure in this invention; Figure 7 This is a schematic diagram of the roller and T-slot structure in this invention.

[0019] In the picture: 1. Base; 11. Support column; 2. Machining table; 21. Bracket; 22. Telescopic component; 23. Guide groove; 3. Clamping plate; 31. Pressure pad; 311. T-slot; 4. Guide seat; 5. Moving table; 51. Box body; 511. Through groove; 52. Drive rod; 521. Connecting sleeve; 53. Drive component one; 531. Transmission component; 54. Drive component two; 541. Gear; 55. Tooth plate; 56. U-shaped plate; 57. Rotating shaft; 571. Vertical bar; 58. Leveling roller; 581. Vertical groove; 6. Coarse grinding wheel; 7. Fine grinding wheel; 8. Leveling mechanism; 81. Connecting plate; 82. Guide frame; 83. Slider; 831. Ball bearing; 84. Mounting plate; 85. Roller; 86. Support plate; 87. Guide rod; 88. Elastic component; 9. Drive component three; 91. Push rod. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] like Figures 1-7 As shown, a wafer edge polishing apparatus includes a base 1, a support column 11, and a processing table 2. The apparatus further includes: The clamping plate 3 has two sets. One set of clamping plates 3 is fixed on the processing table 2. The processing table 2 is equipped with a bracket 21, and a telescopic component 22 is installed on the bracket 21. The output end of the telescopic component 22 is equipped with the other set of clamping plates 3. The wafer is clamped between the two sets of clamping plates 3. Guide seat 4, the processing table 2 is provided with four sets of guide seats 4, the four sets of guide seats 4 correspond to the four sides of the wafer; The movable stage 5 has four sets of movable stages. The movable stage 5 includes a housing 51, which is slidably mounted on the guide seat 4. A second drive component 54 is installed inside the housing 51. A gear 541 is provided at the output end of the second drive component 54. Two sets of through slots 511 are opened on the housing 51. A U-shaped plate 56 is slidably mounted in the through slots 511. A toothed plate 55 is provided on one side of the U-shaped plate 56. The toothed plate 55 meshes with the gear 541. Coarse grinding wheel 6 and fine grinding wheel 7 are respectively installed on two sets of U-shaped plates 56 on the housing 51. A drive component 53 is installed inside the housing 51. A transmission component 531 is provided at the output end of the drive component 53. The transmission component 531 is connected to the coarse grinding wheel 6 and fine grinding wheel 7. Leveling mechanism 8 is provided on both the coarse grinding wheel 6 and the fine grinding wheel 7; Drive component 39 is mounted on base 1 and is used to drive the four sets of moving platforms 5 to move synchronously.

[0022] The output end of the drive unit 3 9 is provided with four push rods 91, the bottom of the housing 51 is provided with a drive rod 52, and four sets of guide grooves 23 are provided on the processing table 2. The drive rod 52 passes through the guide grooves 23, and the drive rod 52 is covered with a connecting sleeve 521. The connecting sleeve 521 includes two sets of mutually perpendicular sleeves, and the drive rod 52 and the push rod 91 are respectively fitted into the two sleeves.

[0023] In practical application, the wafer to be polished is placed on the lower clamping plate 3 and positioned so that the wafer is located at the center of the clamping plate 3. Then, the telescopic component 22 is activated to move the upper clamping plate 3 downward so that the two sets of clamping plates 3 clamp the wafer and fix it. During polishing, the second drive unit 54 is activated to rotate the gear 541. Through the engagement of two sets of toothed plates 55, the coarse grinding wheel 6 is brought closer to the wafer. Then, the first drive unit 53 is activated, and through the transmission component 531, the coarse grinding wheel 6 and the fine grinding wheel 7 rotate simultaneously. Next, the third drive unit 9 is activated, and through the engagement of several push rods 91, connecting sleeves 521, and drive rods 52, the drive rods 52 drive the housing 51 to move along the guide groove 23. First, the four sets of coarse grinding wheels 6 move along the edge of the wafer to perform rough polishing on the wafer edge. After the coarse grinding wheel 6 has moved completely along one edge of the wafer once, the second drive unit 54 is activated to move the coarse grinding wheel 6 away from the wafer and the fine grinding wheel 7 closer to the wafer. At this time, the third drive unit 9 is activated to reverse, causing the housing 51 to move in its initial direction, thereby moving the four sets of fine grinding wheels 7 along the edge of the wafer to perform fine polishing on the edge of the wafer. In this way, the wafer can be finely polished immediately after coarse polishing without switching stations, thus avoiding the positioning error caused by repeated clamping that affects the polishing accuracy, and also improving the polishing efficiency. During the polishing process of the wafer edge by the coarse grinding wheel 6 and the fine grinding wheel 7, the horizontal position of the coarse grinding wheel 6 and the fine grinding wheel 7 is leveled by the leveling mechanism 8, so that the axis of the coarse grinding wheel 6 and the fine grinding wheel 7 always remains vertical. This avoids the axis of the coarse grinding wheel 6 and the fine grinding wheel 7 from being offset, which would affect the polishing quality. At the same time, it also avoids uneven force on the wafer edge, which could cause chipping or collapse of the edge area or the four corners.

[0024] Furthermore, the leveling mechanism 8 includes a connecting plate 81, a guide frame 82, a support plate 86, and a guide rod 87. The connecting plate 81 has two sets, and a guide frame 82 is provided on one side of the connecting plate 81. A slider 83 is slidably installed in the guide frame 82. Two sets of rotating shafts 57 are symmetrically installed on the U-shaped plate 56. Vertical bars 571 are provided around the rotating shafts 57. A leveling roller 58 is sleeved on the rotating shaft 57. A vertical groove 581 is opened on the inner side of the leveling roller 58 to embed the vertical bar 571. The rotating shaft 57 is fixedly connected to the end of the coarse grinding wheel 6 or the fine grinding wheel 7. The leveling roller 58 is rotatably installed in the slider 83. A guide rod 87 is provided on the connecting plate 81. The support plate 86 is fixed to the side of the box 51. The guide rod 87 passes through the support plate 86.

[0025] The top and bottom of the slider 83 are provided with a number of balls 831, which abut against the inner surface of the leveling roller 58.

[0026] In practical application, during the rotation of the coarse grinding wheel 6 or the fine grinding wheel 7, the rotating shaft 57 also rotates. Through the vertical groove 581 on the leveling roller 58 and the vertical bar 571 on the rotating shaft 57, while the guide frame 82 remains horizontal, the leveling roller 58 is always in a horizontal state. Through the leveling rollers 58 at both ends, the coarse grinding wheel 6 and the fine grinding wheel 7 are always in a horizontal state during the polishing process, that is, the axis does not deviate, thereby avoiding affecting the polishing quality and avoiding uneven force on the wafer edge, which may cause chipping or collapse of the edge area or the four corners. By setting the ball bearings 831, the leveling roller 58 generates rolling friction with the ball bearings 831 during rotation, thereby reducing the wear on the inner surface of the leveling roller 58, ensuring that the leveling roller 58 is in a horizontal state, and further preventing the axis misalignment of the coarse grinding wheel 6 and the fine grinding wheel 7. In addition, if the wafer edge is uneven, the slider 83 moves along the guide frame 82. Even if the axes of the coarse grinding wheel 6 and the fine grinding wheel 7 are offset, they will immediately return to their original positions under the restraint of the leveling roller 58. This avoids rigid deformation of the rotating shaft 57 and allows the axis offset of the coarse grinding wheel 6 and the fine grinding wheel 7 to be buffered. Compared with long-term axis offset, this short-term axis offset can reduce the impact on polishing quality.

[0027] Furthermore, a mounting plate 84 is provided on one side of the guide frame 82, and several rollers 85 are mounted on the mounting plate 84.

[0028] The clamping plate 3 is provided with a U-shaped pressure pad 31 around its periphery. Four sets of T-shaped grooves 311 are provided on the pressure pad 31 along the four sides of the clamping plate 3. The mounting plate 84 extends into the T-shaped grooves 311, and the upper and lower sets of rollers 85 abut against the inner and outer sides of the T-shaped grooves 311 respectively.

[0029] In practical application, during the polishing process of the coarse grinding wheel 6 and the fine grinding wheel 7, several rollers 85 abut against the inner and outer sides of the T-groove 311. Guided by the guide rod 87, the guide frame 82 is always kept in a horizontal state, which further keeps the leveling roller 58 in a horizontal state. This further avoids long-term deviation of the axes of the coarse grinding wheel 6 and the fine grinding wheel 7, thereby avoiding affecting the polishing quality. At the same time, it avoids uneven force on the wafer edge, which may cause chipping or collapse of the edge area or the four corners.

[0030] Furthermore, an elastic element 88 connects the support plate 86 and the connecting plate 81, and the two sets of elastic elements 88 make the two sets of connecting plates 81 always tend to move towards each other.

[0031] In one embodiment, the area of ​​the pressure pad 31 that abuts against the wafer surface is made of a flexible material, such as rubber.

[0032] In practical application, the elastic force of the elastic element 88 causes the upper and lower sets of rollers 85 to apply a certain pressure to the upper and lower edge areas of the wafer. The position of the rollers 85 corresponds to the polishing position in real time. In this way, even if the wafer edge is subjected to uneven force during polishing, the upper and lower edges of the wafer polishing position are pressed down, which can further avoid uneven force on the edge causing chipping or collapse of the edge area or the four corners. By using the longitudinal sliding engagement between the vertical groove 581 on the leveling roller 58 and the vertical bar 571 on the rotating shaft 57, the roller 85 will always apply pressure to the edge areas of the upper and lower surfaces of the wafer, even if the upper and lower surfaces of the wafer are not flat.

[0033] Working principle: The wafer to be polished is placed on the lower clamping plate 3 and positioned so that the wafer is centered on the clamping plate 3. Then, the telescopic component 22 is activated to move the upper clamping plate 3 downward, so that the two sets of clamping plates 3 clamp the wafer and fix it. During polishing, the second drive component 54 is activated to rotate the gear 541. Through the cooperation of the two sets of toothed plates 55, the coarse grinding wheel 6 is brought closer to the wafer. Then, the first drive component 53 is activated, and through the transmission component 531, the coarse grinding wheel 6 and the fine grinding wheel 7 rotate simultaneously. Then, the third drive component 9 is activated, and through several pushes... The cooperation of rod 91, connecting sleeve 521 and drive rod 52 causes drive rod 52 to drive housing 51 to move along guide groove 23. First, four sets of coarse grinding wheels 6 move along the edge of the wafer to coarsely polish the edge of the wafer. When the coarse grinding wheel 6 has moved completely along one edge of the wafer once, drive component 2 54 is activated to move the coarse grinding wheel 6 away from the wafer and the fine grinding wheel 7 close to the wafer. At this time, drive component 3 9 is activated to reverse, causing housing 51 to move in its initial direction, thereby causing the four sets of fine grinding wheels 7 to move along the edge of the wafer to finely polish the edge of the wafer.

[0034] A polishing method for a wafer edge polishing apparatus, the method being applied to the wafer edge polishing apparatus as described above, the method comprising the following steps: Step S1: Fix the wafer by placing it between the two sets of clamping plates 3; Step S2: Rough grinding feed, start drive component 54 to make the rough grinding wheel 6 contact the edge of the wafer; Step S3: Rough polishing. Start drive component 53 to make the rough grinding wheel 6 and the fine grinding wheel 7 rotate synchronously. At the same time, start drive component 9 to drive the moving table 5 to move, so that the rough grinding wheel 6 moves along the edge of the wafer for rough polishing. Step S4: After fine grinding and coarse polishing are completed, start drive component 2 54 again to move the coarse grinding wheel 6 away from the wafer edge and the fine grinding wheel 7 into contact with the wafer edge. Step S5: Fine polishing. Start the reverse drive of the moving stage 5 to make the fine grinding wheel 7 move along the edge of the wafer for fine polishing. Step S6: Leveling and holding. During the coarse and fine polishing processes, the axis of the coarse grinding wheel 6 and the fine grinding wheel 7 is kept vertical by the leveling mechanism 8.

Claims

1. A wafer edge polishing apparatus, comprising a base (1), a support (11), and a processing table (2), characterized in that, The device further includes: The clamping plate (3) has two sets. One set of clamping plates (3) is fixed on the processing table (2). The processing table (2) is provided with a bracket (21). A telescopic component (22) is installed on the bracket (21). The output end of the telescopic component (22) is equipped with another set of clamping plates (3). The wafer is clamped between the two sets of clamping plates (3). Guide seat (4), the processing table (2) is provided with four sets of guide seats (4), the four sets of guide seats (4) correspond to the four sides of the wafer; The moving platform (5) is provided with four sets. The moving platform (5) includes a housing (51). The housing (51) is slidably installed on the guide seat (4). The housing (51) is equipped with a second driving component (54). The output end of the second driving component (54) is provided with a gear (541). The housing (51) is provided with two sets of through slots (511). A U-shaped plate (56) is slidably installed in the through slots (511). A toothed plate (55) is provided on one side of the U-shaped plate (56). The toothed plate (55) meshes with the gear (541). Coarse grinding wheel (6) and fine grinding wheel (7) are installed on two sets of U-shaped plates (56) on the housing (51), respectively. A drive component (53) is installed inside the housing (51). The output end of the drive component (53) is provided with a transmission component (531). The transmission component (531) is connected to the coarse grinding wheel (6) and the fine grinding wheel (7) in a transmission connection. The leveling mechanism (8) is provided on both the coarse grinding wheel (6) and the fine grinding wheel (7); Drive component three (9) is mounted on base (1) and is used to drive four sets of moving platforms (5) to move synchronously.

2. The wafer edge polishing apparatus according to claim 1, characterized in that, The output end of the drive unit three (9) is provided with four push rods (91), the bottom of the housing (51) is provided with a drive rod (52), and four sets of guide grooves (23) are provided on the processing table (2). The drive rod (52) passes through the guide groove (23), and the drive rod (52) is covered with a connecting sleeve (521). The connecting sleeve (521) includes two sets of mutually perpendicular sleeves, and the drive rod (52) and the push rod (91) are respectively fitted into the two sleeves.

3. The wafer edge polishing apparatus according to claim 1, characterized in that, The leveling mechanism (8) includes a connecting plate (81), a guide frame (82), a support plate (86), and a guide rod (87). The connecting plate (81) has two sets, and a guide frame (82) is provided on one side of the connecting plate (81). A slider (83) is slidably installed in the guide frame (82). Two sets of rotating shafts (57) are symmetrically installed on the U-shaped plate (56). A vertical bar (571) is provided around the rotating shaft (57). A leveling roller (58) is sleeved on the rotating shaft (57). A vertical groove (581) is provided on the inner side of the leveling roller (58) to embed the vertical bar (571). The rotating shaft (57) is fixedly connected to the end of the coarse grinding wheel (6) or the fine grinding wheel (7). The leveling roller (58) is rotatably installed in the slider (83). A guide rod (87) is provided on the connecting plate (81). The support plate (86) is fixed on the side of the box (51). The guide rod (87) passes through the support plate (86).

4. The wafer edge polishing apparatus according to claim 3, characterized in that, The top and bottom of the slider (83) are provided with a number of balls (831), which abut against the inner surface of the leveling roller (58).

5. The wafer edge polishing apparatus according to claim 4, characterized in that, The guide frame (82) has a mounting plate (84) on one side, and several rollers (85) are mounted on the mounting plate (84).

6. The wafer edge polishing apparatus according to claim 5, characterized in that, The clamping plate (3) is provided with a U-shaped pressure pad (31) on its periphery. Four sets of T-shaped grooves (311) are provided on the pressure pad (31) along the four sides of the clamping plate (3). The mounting plate (84) extends into the T-shaped groove (311), and the upper and lower sets of rollers (85) abut against the inner and outer sides of the T-shaped groove (311) respectively.

7. The wafer edge polishing apparatus according to claim 6, characterized in that, An elastic element (88) connects the support plate (86) and the connecting plate (81), and the two sets of elastic elements (88) make the two sets of connecting plates (81) always tend to move toward each other.

8. A polishing method for a wafer edge polishing apparatus, characterized in that, The method is applied to the wafer edge polishing apparatus as described in claim 1 above, and the method includes the following steps: Step S1: Fix the wafer and place it between the two sets of clamps (3); Step S2: Rough grinding feed, start drive component two (54) to make the rough grinding wheel (6) contact the edge of the wafer; Step S3: Rough polishing. Start drive component one (53) to make the rough grinding wheel (6) and fine grinding wheel (7) rotate synchronously. At the same time, start drive component three (9) to drive the moving table (5) to move, so that the rough grinding wheel (6) moves along the edge of the wafer for rough polishing. Step S4: After fine grinding and coarse polishing, start the second drive unit (54) again to move the coarse grinding wheel (6) away from the wafer edge and the fine grinding wheel (7) into contact with the wafer edge; Step S5: Fine polishing, start the drive unit three (9) to reverse drive the moving stage (5) so that the fine grinding wheel (7) moves along the edge of the wafer for fine polishing; Step S6: Leveling and holding. During the coarse and fine polishing processes, the axis of the coarse grinding wheel (6) and the fine grinding wheel (7) is kept vertical by the leveling mechanism (8).

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