An optical waveguide wafer surface detection device

Abstract

The application discloses a kind of optical waveguide wafer surface detection devices, it is related to semiconductor wafer detection equipment technical field, including rack and the wafer processing unit being set in rack, wafer processing unit includes center rotating platform, test area adjusting mechanism and swing detection mechanism, center rotating platform is connected with the output shaft of drive motor and is used to carry wafer, test area adjusting mechanism includes mounting base, movable bearing plate being set on mounting base, area limiting frame being set on bearing plate and each is two groups of driving piece, screw and moving piece, each group of driving piece is connected with corresponding screw;By being able to adjust the area limiting frame of two mutually perpendicular horizontal directions outside center rotating platform, and setting test opening in area limiting frame middle part, can be according to the position of test opening of the region to be detected on wafer adjustment, make the actual detection range of detection head be limited by test opening, it is favorable to reduce the detection to non-target area.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer inspection equipment technology, specifically to an optical waveguide wafer surface inspection device. Background Technology

[0002] Optical waveguide wafers are semiconductor devices in which optical waveguide structures are formed on a wafer substrate. The surface processing quality of the wafer affects the subsequent optical signal transmission and device assembly. Therefore, after the optical waveguide wafer has been processed, it is usually necessary to use a vision inspection component or an optical inspection head to inspect the wafer surface in order to obtain information such as wafer surface defects, processing abnormalities or local structural states.

[0003] Existing wafer surface inspection equipment typically includes a wafer gripping structure, a wafer carrier platform, and an inspection head. The wafer gripping structure transfers the wafer to the carrier platform, which then rotates the wafer. The inspection head collects surface information above the wafer. Some equipment also includes wafer positioning, visual monitoring, or inspection head movement mechanisms to facilitate wafer handover and surface inspection at different locations.

[0004] However, the detection range of existing testing equipment is usually determined by the movement of the detection head itself. It lacks a structure that can adjust the position according to the area to be detected and form a clear detection boundary. When the wafer rotation and the movement of the detection head are coordinated, it is not convenient to limit the wafer area in which the detection head actually acts. In addition, the fixed wafer support structure has limited adaptability to wafers of different sizes. The wafer needs to maintain a continuous clamping or bearing state between auxiliary processing, transfer and rotation detection.

[0005] To address this issue, we propose an optical waveguide wafer surface inspection device. Summary of the Invention

[0006] In view of this, and in view of the shortcomings of the prior art, the present invention provides an optical waveguide wafer surface inspection device to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a surface inspection device for optical waveguide wafers, comprising a frame and a wafer processing unit disposed within the frame. The wafer processing unit includes a central rotating platform, a test area adjustment mechanism, and a swing detection mechanism. The central rotating platform is connected to the output shaft of a drive motor and is used to support the wafer. The test area adjustment mechanism includes a mounting base plate, a support plate movably disposed on the mounting base plate, an area defining frame disposed on the support plate, and two sets of driving components, screws, and moving components. Each set of driving components is connected to a corresponding screw, and each set of moving components is in transmission cooperation with a corresponding screw and is connected to the support plate. The system consists of two sets of screws arranged along two intersecting horizontal directions. The area defining frame is located on the periphery of the central rotating platform, and the top surfaces of both are flush. A test opening is provided in the middle of the area defining frame. The swing detection mechanism includes a swing drive, a swing arm, and a detection head mounted on the swing arm. The swing arm is connected to the swing drive. The swing drive drives the swing arm to swing around the fixed axis of the swing drive above the central rotating platform. The drive motor drives the central rotating platform to rotate the wafer. The adjustment of the carrier plate position, the rotation of the wafer, and the swing of the detection head, achieved by the two sets of moving parts, cooperate with each other to allow the detection head to detect the defined area of ​​the wafer through the test opening.

[0008] Preferably, the two sets of screws are arranged along two mutually perpendicular horizontal directions, and each set of moving parts is threadedly connected to the corresponding screw, thereby driving the bearing plate to move along the axial direction of the corresponding screw.

[0009] Preferably, the wafer processing unit further includes a processing housing, a side support, a limiting ring, a rod-shaped actuator, and a side lifting mechanism. The central rotating platform, the test area adjustment mechanism, and the swing detection mechanism are all disposed within the processing housing. The side support is fixedly disposed at the internal center of the processing housing. The limiting ring is fixedly disposed at the center of the top surface of the side support and is correspondingly disposed to the output shaft of the drive motor. The limiting ring is used to limit the position of the output shaft of the drive motor and keep it stationary during the rotation of the output shaft of the drive motor. One end of the rod-shaped actuator is rotatably connected to the edge surface of the side support, and the other end constitutes a wafer edge support end. The wafer edge support end moves relative to the center of the side support as the rod-shaped actuator rotates to adapt to the edge support of wafers of different sizes. The side lifting mechanism is disposed on the side of the processing housing and closes the notch on the surface of the processing housing by lifting. The swing drive is disposed on one side of the central rotating platform, and the swing arm extends from the swing drive to the top of the central rotating platform.

[0010] Preferably, the fixed axis of the swing drive is spaced apart from the rotation axis of the central rotating platform, and the detection head is located on the side of the swing arm away from the swing drive. The projection of the swing trajectory of the detection head onto the top surface of the central rotating platform passes through the test opening.

[0011] Preferably, the optical waveguide wafer surface inspection device further includes an auxiliary unit disposed above the wafer processing unit. The auxiliary unit includes a mounting frame, an electrically controlled telescopic unit, a limiting component, a curved limiting frame plate, and a visual monitoring component. The electrically controlled telescopic unit, the limiting component, and the visual monitoring component are all disposed on the mounting frame.

[0012] Preferably, the electrically controlled telescopic unit has output shaft ends located on both sides thereon, and the two output shaft ends are respectively connected to the corresponding curved limiting frame plates, and each curved limiting frame plate can move horizontally within the corresponding limiting member.

[0013] Preferably, the two curved limiting frame plates are arranged opposite to each other, and the two output shaft ends of the electronically controlled telescopic unit extend and retract synchronously to drive the two curved limiting frame plates to switch between a contact position where they move towards each other and contact the wafer and a release position where they move away from each other and release the wafer.

[0014] Preferably, the visual monitoring component is fixed relative to the mounting frame and remains stationary during the movement and bonding of the two curved limiting frame plates to the wafer.

[0015] Preferably, the optical waveguide wafer surface inspection device further includes a wafer clamping structure, which can transfer the wafer between the auxiliary unit and the central rotating platform and hold the wafer as the two curved limiting frame plates move toward the wafer.

[0016] Preferably, after the two curved limiting frame plates release the wafer, the wafer clamping structure transfers the wafer to the central rotating platform. After the central rotating platform carries the wafer, the wafer clamping structure releases the wafer and exits. The drive motor then drives the central rotating platform to rotate the wafer.

[0017] Compared with the prior art, the present invention provides an optical waveguide wafer surface inspection device, which has the following advantages: By setting an area limiting frame that can be adjusted along two mutually perpendicular horizontal directions around the central rotating platform, and setting a test opening in the middle of the area limiting frame, the position of the test opening can be adjusted according to the area to be detected on the wafer, so that the actual detection range of the detection head is limited by the test opening, which helps to reduce the detection of non-target areas.

[0018] The central rotating platform and wafer are rotated by a drive motor, and the inspection head is swung above the wafer by a swing arm driven by a swing drive component. This allows the rotation path of the wafer to match the swing path of the inspection head, so that the inspection head passes through different positions within the area defined by the test opening, thereby meeting the surface inspection requirements of the wafer's defined area.

[0019] By rotatably connecting one end of the rod-shaped actuator to the side support and making its other end form a wafer edge support end, the position of the wafer edge support end can be adjusted by rotating the rod-shaped actuator, so that the wafer edge support end corresponds to the edge of wafers of different sizes, thereby improving the adaptability of the wafer edge support structure to wafers of different sizes.

[0020] The two curved limiting frame plates are driven to move towards each other or away from each other by the electronically controlled telescopic unit. This allows for the auxiliary bonding and release of the wafer while it is held in place by the wafer clamping structure. After the wafer is released, it continues to be transferred from the wafer clamping structure to the central rotating platform. This ensures that the wafer is held or carried continuously between auxiliary processing, transfer and rotation detection, which is beneficial for maintaining the continuity of the wafer handover process. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 This is a schematic diagram of the internal structure of the frame of the present invention.

[0023] Figure 3 This is a schematic diagram of the wafer processing unit structure from a first-view perspective of the present invention.

[0024] Figure 4 This is a schematic diagram of the wafer processing unit structure from a second perspective of the present invention.

[0025] Figure 5 This is a schematic diagram of the bottom structure of the wafer processing unit of the present invention.

[0026] Figure 6 This is a cross-sectional view of the wafer processing unit of the present invention.

[0027] Figure 7 for Figure 6 A magnified schematic diagram of the structure at point A in the middle.

[0028] Figure 8 This is a schematic diagram of the test area adjustment mechanism of the present invention.

[0029] Figure 9 This is a first-view structural diagram of the auxiliary unit of the present invention.

[0030] Figure 10 This is a schematic diagram of the auxiliary unit structure from a second perspective in this invention.

[0031] In the diagram: 1. Rack; 2. Wafer clamping structure; 3. Wafer processing unit; 6. Auxiliary unit; 31. Processing cabinet; 32. Side support; 33. Limiting ring; 34. Drive motor; 35. Central rotating platform; 36. Rod-shaped actuator; 37. Side lifting mechanism; 41. Mounting base plate; 42. Bearing plate; 43. Area limiting frame; 44. Drive component; 45. Screw; 46. Moving component; 51. Swing drive component; 52. Swing arm; 61. Mounting frame; 62. Electrically controlled telescopic unit; 63. Limiting component; 64. Curved limiting frame plate; 65. Vision monitoring component. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Embodiments of the present invention Reference Figure 1 and Figure 2 This embodiment provides an optical waveguide wafer surface inspection device, including a frame 1, a wafer clamping structure 2, a wafer processing unit 3, and an auxiliary unit 6. The wafer processing unit 3 is disposed within the frame 1, and the auxiliary unit 6 is disposed above the wafer processing unit 3. The wafer clamping structure 2 is used to transfer the wafer between the auxiliary unit 6 and the wafer processing unit 3. The frame 1 provides a mounting base for the above structure, enabling the wafer to sequentially complete auxiliary processing, transfer and bearing, and surface inspection within the frame 1.

[0034] In this embodiment, the wafer clamping structure 2 adopts the wafer clamping component in the existing wafer processing equipment. The drive motor 34, the central rotating platform 35, the swing drive component 51, the electronically controlled telescopic unit 62, the vision monitoring component 65, and the detection head all adopt existing equipment components with corresponding functions. The internal structure and conventional control method of the above components are not the focus of improvement in this embodiment. This embodiment mainly describes the installation position, connection relationship, action sequence, and cooperation relationship between the above components.

[0035] Reference Figures 3 to 7 The wafer processing unit 3 includes a drive motor 34, a central rotating platform 35, a test area adjustment mechanism, and a swing detection mechanism. The central rotating platform 35 is connected to the output shaft of the drive motor 34. The central rotating platform 35 is used to carry the wafer. The drive motor 34 drives the central rotating platform 35 to rotate through the output shaft. The central rotating platform 35 then drives the wafer to rotate, so that different circumferential positions on the wafer can pass through the detection position of the detection head.

[0036] Reference Figure 8 The test area adjustment mechanism includes a mounting base plate 41, a support plate 42, an area limiting frame 43, and two sets of driving components 44, screws 45, and moving components 46. The mounting base plate 41 forms the fixed installation foundation of the test area adjustment mechanism. The support plate 42 is movably mounted on the mounting base plate 41, and the area limiting frame 43 is mounted on the support plate 42. When the support plate 42 moves, it drives the area limiting frame 43 to move synchronously.

[0037] Each set of driving components 44 is connected to the corresponding screw 45, and each set of moving components 46 is set on the corresponding screw 45 and connected to the bearing plate 42. When the driving component 44 drives the screw 45 to rotate, the moving component 46 moves along the screw 45 and drives the bearing plate 42 to move, thereby converting the rotation output by the driving component 44 into the horizontal position adjustment of the area limiting frame 43.

[0038] Two sets of screws 45 are arranged along two mutually perpendicular horizontal directions, and two sets of moving parts 46 are driven by the corresponding screws 45 to finely adjust the position of the carrier plate 42. Through the cooperation of the two sets of driving parts 44, screws 45 and moving parts 46, the position of the area defining frame 43 can be adjusted along two mutually perpendicular horizontal directions, so that the test opening of the area defining frame 43 corresponds to the area to be tested on the wafer.

[0039] Reference Figure 3 , Figure 4 and Figure 6 The region defining frame 43 is located on the periphery of the central rotating platform 35. The top surface of the region defining frame 43 is flush with the top surface of the central rotating platform 35. A test opening is formed in the middle of the region defining frame 43. After the region defining frame 43 completes the position adjustment, it remains stationary, so that the test opening forms a stable detection area boundary during the wafer inspection process. The detection head inspects the defined area of ​​the wafer through the test opening.

[0040] Reference Figures 4 to 7 The wafer processing unit 3 also includes a processing box 31, a side support 32, a limiting ring 33, a rod-shaped actuator 36, and a side lifting mechanism 37. The central rotating platform 35, the test area adjustment mechanism, and the swing detection mechanism are all located inside the processing box 31. The processing box 31 is used to accommodate the above structures and form a working space for wafer surface inspection.

[0041] The side support 32 is fixedly installed at the center of the interior of the processing box 31. The limiting ring 33 is fixedly installed at the center of the top surface of the side support 32 and is correspondingly installed to the output shaft of the drive motor 34. The limiting ring 33 is used to limit the position of the output shaft of the drive motor 34. The output shaft of the drive motor 34 rotates at the position limited by the limiting ring 33. The limiting ring 33 remains stationary during the rotation of the output shaft of the drive motor 34, thereby reducing the impact of the change in the position of the output shaft of the drive motor 34 on the rotation position of the central rotating platform 35.

[0042] Reference Figure 6 and Figure 7 One end of the rod-shaped actuator 36 is rotatably connected to the surface at the edge of the side support 32, and the other end forms a wafer edge support end. The rod-shaped actuator 36 can rotate around its connection position with the side support 32 on the surface of the side support 32. When the rod-shaped actuator 36 rotates, the position of the wafer edge support end relative to the center of the side support 32 changes accordingly. This allows the position of the wafer edge support end to be adjusted according to the wafer size, so that the edges of wafers of different sizes can be supported.

[0043] After the rod-shaped actuator 36 rotates to a position corresponding to the size of the wafer to be inspected, the wafer edge support end is located at the support position of the wafer edge. The wafer edge support end provides auxiliary support for the wafer edge and retains the state of the wafer rotating with the central rotating platform 35. By changing the rotation position of the rod-shaped actuator 36, the support range of the wafer edge can be adjusted, thereby adapting to the inspection operation of wafers of different sizes.

[0044] The side lifting mechanism 37 is located on the side of the processing box 31 and corresponds to the notch on the surface of the processing box 31. The side lifting mechanism 37 moves between the position of closing the notch and the position of leaving the notch by lifting. When the side lifting mechanism 37 moves to the closed position, it closes the notch on the surface of the processing box 31, so that the notch of the processing box 31 remains closed during wafer inspection.

[0045] Reference Figure 3 The swing detection mechanism includes a swing drive 51, a swing arm 52 and a detection head. The swing drive 51 is located on one side of the central rotating platform 35. The swing arm 52 is connected to the swing drive 51 and extends from the swing drive 51 to the top of the central rotating platform 35. The detection head is located on the side of the swing arm 52 away from the swing drive 51.

[0046] The fixed axis of the swing drive 51 is spaced apart from the rotation axis of the central rotating platform 35. When the swing drive 51 drives the swing arm 52 to swing around the fixed axis of the swing drive 51, the detection head moves above the central rotating platform 35 with the swing arm 52. The projection of the swing trajectory of the detection head on the top surface of the central rotating platform 35 passes through the test opening of the area limiting frame 43.

[0047] As the wafer rotates with the central rotating platform 35, the inspection head swings with the swing arm 52. Through the coordination of the wafer rotation path and the inspection head swing path, the inspection head can pass through different positions within the area defined by the test opening, and perform surface inspection on the defined area of ​​the wafer while the area definition frame 43 remains stationary.

[0048] Reference Figure 9 and Figure 10 The auxiliary unit 6 includes a mounting frame 61, an electrically controlled telescopic unit 62, a limiting member 63, a curved limiting frame plate 64, and a visual monitoring component 65. The electrically controlled telescopic unit 62, the limiting member 63, and the visual monitoring component 65 are all fixedly mounted on the mounting frame 61. The mounting frame 61 provides a common mounting foundation for the above structures, so that the relative mounting positions of the electrically controlled telescopic unit 62, the limiting member 63, and the visual monitoring component 65 remain stable.

[0049] The electrically controlled telescopic unit 62 has output shaft ends on both sides, and the two output shaft ends are respectively connected to the corresponding curved limiting frame plates 64. Each curved limiting frame plate 64 is set in the corresponding limiting member 63. When the output shaft ends of the electrically controlled telescopic unit 62 extend and retract, they drive the curved limiting frame plates 64 to move horizontally within the limiting member 63, thereby making the two curved limiting frame plates 64 approach or move away from the wafer located between them.

[0050] Two curved limiting frame plates 64 are arranged opposite each other. When the two output shaft ends of the electrically controlled telescopic unit 62 extend synchronously, the two curved limiting frame plates 64 move towards each other and fit the wafer. When the two output shaft ends of the electrically controlled telescopic unit 62 retract synchronously, the two curved limiting frame plates 64 move away from each other and release the wafer. Through the synchronous movement of the two curved limiting frame plates 64, the fitting and releasing actions on both sides of the wafer are coordinated with each other.

[0051] The visual monitoring component 65 is fixed relative to the mounting frame 61 and remains stationary while performing visual monitoring during the movement, contact, and release of the wafer by the two curved limiting frame plates 64. The horizontal movement of the curved limiting frame plates 64 does not cause the visual monitoring component 65 to move, thereby keeping the visual monitoring component 65 in a fixed mounting position.

[0052] The overall working process and principle of the above embodiments are as follows: When the device starts working, the wafer clamping structure 2 clamps the wafer and sends it between the two curved limiting frame plates 64. The wafer clamping structure 2 continues to hold the wafer, and the electronically controlled telescopic unit 62 drives the two curved limiting frame plates 64 to move towards each other and fit the wafer. The vision monitoring component 65 performs vision monitoring at a fixed position. During the process of the curved limiting frame plates 64 moving and fitting the wafer, the wafer is always held by the wafer clamping structure 2.

[0053] After the bonding and visual monitoring are completed in the auxiliary unit 6, the electronically controlled telescopic unit 62 drives the two curved limiting frame plates 64 to move back to back and release the wafer. After the curved limiting frame plates 64 are released, the wafer is still held by the wafer clamping structure 2. The wafer clamping structure 2 then transfers the wafer from the auxiliary unit 6 to the central rotating platform 35, thereby avoiding the wafer from being in a state of no load when it is transferred between the auxiliary unit 6 and the central rotating platform 35.

[0054] After the wafer reaches the bearing position of the central rotating platform 35, the central rotating platform 35 receives the wafer, and the wafer clamping structure 2 then releases the wafer and exits the rotation range of the central rotating platform 35, thereby forming a wafer handover path in which the wafer clamping structure 2 holds, the central rotating platform 35 receives, and the wafer clamping structure 2 releases and exits.

[0055] After the central rotating platform 35 carries the wafer, the two sets of driving components 44 drive the corresponding screws 45 to rotate. The moving component 46 drives the carrier plate 42 and the area limiting frame 43 to adjust their positions along two mutually perpendicular horizontal directions. The area limiting frame 43 moves to the position corresponding to the test opening and the area to be tested on the wafer, then stops moving and remains stationary, thereby determining the wafer area that the detection head can detect before the wafer rotates.

[0056] During testing, the side lifting mechanism 37 closes the notch on the surface of the enclosure 31 by lifting, the limiting ring 33 remains stationary and restricts the position of the output shaft of the drive motor 34, the drive motor 34 drives the central rotating platform 35 to rotate the wafer through the output shaft, the wafer edge support end formed by the rod-shaped actuator 36 provides auxiliary support for the wafer edge, the swing drive 51 drives the swing arm 52 to swing around the fixed axis, the detection head moves with the swing arm 52 and detects the limited area of ​​the wafer through the test opening of the area limiting frame 43.

[0057] After the inspection is completed, the swing drive 51 stops driving the swing arm 52, the drive motor 34 stops driving the central rotating platform 35, the wafer stops rotating, the wafer clamping structure 2 enters the position of the central rotating platform 35 and holds the wafer again, and then the wafer is taken out from the central rotating platform 35 to complete one wafer surface inspection cycle.

[0058] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0059] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A surface inspection device for optical waveguide wafers, comprising a frame (1) and a wafer processing unit (3) disposed within the frame (1), characterized in that, The wafer processing unit (3) includes a central rotating platform (35), a test area adjustment mechanism, and a swing detection mechanism. The central rotating platform (35) is connected to the output shaft of the drive motor (34) and is used to carry the wafer. The test area adjustment mechanism includes a mounting base plate (41), a support plate (42) movably mounted on the mounting base plate (41), an area limiting frame (43) mounted on the support plate (42), and two sets of drive components (44), screws (45), and moving components (46). Each set of drive components (44) is connected to the corresponding screw (45), and each set of moving components (46) is driven by the corresponding screw (45) and connected to the support plate (42). The two sets of screws (45) are arranged along two intersecting horizontal directions. The limiting frame (43) is located on the periphery of the central rotating platform (35) and the top surfaces of the two are flush. The area limiting frame (43) has a test opening in the middle. The swing detection mechanism includes a swing drive (51), a swing arm (52) and a detection head set on the swing arm (52). The swing arm (52) is connected to the swing drive (51). The swing drive (51) drives the swing arm (52) to swing around the fixed axis of the swing drive (51) above the central rotating platform (35). The drive motor (34) drives the central rotating platform (35) to rotate the wafer. The position adjustment of the carrier plate (42), the rotation of the wafer and the swing of the detection head achieved by the two sets of moving parts (46) cooperate with each other so that the detection head detects the limited area of ​​the wafer through the test opening. The wafer processing unit (3) also includes a processing housing (31), a side support (32), a limiting ring (33), a rod-shaped actuator (36), and a side lifting mechanism (37). The central rotating platform (35), the test area adjustment mechanism, and the swing detection mechanism are all located inside the processing housing (31). The side support (32) is fixedly located at the center of the processing housing (31). The limiting ring (33) is fixedly located at the center of the top surface of the side support (32) and is correspondingly located to the output shaft of the drive motor (34). One end of the component (36) is rotatably connected to the edge surface of the side support component (32), and the other end is provided with a wafer edge support end. The wafer edge support end moves relative to the center of the side support component (32) as the rod-shaped actuator (36) rotates. The side lifting mechanism (37) is located on the side of the processing box (31) and corresponds to the notch on the surface of the processing box (31). The swing drive component (51) is located on one side of the central rotating platform (35), and the swing arm (52) extends from the swing drive component (51) to the top of the central rotating platform (35). The fixed axis of the swing drive (51) is spaced apart from the rotation axis of the central rotating platform (35). The detection head is located on the side of the swing arm (52) away from the swing drive (51). The projection of the swing trajectory of the detection head onto the top surface of the central rotating platform (35) passes through the test opening.

2. The optical waveguide wafer surface inspection device according to claim 1, characterized in that, Two sets of screws (45) are arranged along two mutually perpendicular horizontal directions. Each set of moving parts (46) is threadedly connected to the corresponding screw (45) and drives the bearing plate (42) to move along the axial direction of the corresponding screw (45).

3. The optical waveguide wafer surface inspection device according to claim 1, characterized in that, It also includes an auxiliary unit (6) disposed above the wafer processing unit (3). The auxiliary unit (6) includes a mounting frame (61), an electrically controlled telescopic unit (62), a limiting member (63), a curved limiting frame plate (64), and a visual monitoring component (65). The electrically controlled telescopic unit (62), the limiting member (63), and the visual monitoring component (65) are all disposed on the mounting frame (61).

4. The optical waveguide wafer surface inspection device according to claim 3, characterized in that, The electrically controlled telescopic unit (62) has output shaft ends on both sides, and the two output shaft ends are respectively connected to the corresponding curved limiting frame plate (64). Each curved limiting frame plate (64) can move horizontally within the corresponding limiting member (63).

5. The optical waveguide wafer surface inspection device according to claim 4, characterized in that, Two curved limiting frame plates (64) are arranged opposite each other, and the two output shaft ends of the electronically controlled telescopic unit (62) extend and retract synchronously to drive the two curved limiting frame plates (64) to switch between a mating position that moves towards each other and a releasing position that moves away from each other.

6. The optical waveguide wafer surface inspection device according to claim 5, characterized in that, The visual monitoring component (65) is fixed relative to the mounting frame (61) and remains stationary during the movement of the two curved limiting frame plates (64).

7. The optical waveguide wafer surface inspection device according to claim 6, characterized in that, It also includes a wafer clamping structure (2) that can move between the auxiliary unit (6) and the central rotating platform (35) and hold the wafer in place when the two curved limiting frame plates (64) move toward each other.

8. The optical waveguide wafer surface inspection device according to claim 7, characterized in that, The wafer clamping structure (2) has a first working position located within the auxiliary unit (6) and a second working position located at the central rotating platform (35). When the two curved limiting frame plates (64) are in the release position, the wafer clamping structure (2) can move from the first working position to the second working position.

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