Hand-shaped distributed pressure and temperature signal flexible sensor acquisition system and circuit

Abstract

The application discloses a hand-shaped distributed pressure and temperature signal flexible sensor acquisition system and circuit, and relates to the technical field of sensor signal acquisition.The system comprises a sensor module, which is used for acquiring pressure signals and temperature signals of a hand; a signal amplification module, which is used for amplifying and conditioning the pressure signals and the temperature signals, and outputting analog signals that can be recognized by an MCU processing module; the MCU processing module, which is used for converting and filtering the amplified analog signals, and outputting hand pressure values and temperature values; and a serial communication and display module, which is used for receiving the output signals of the MCU processing module, transmitting the output signals to an LCD display module, and displaying pressure and temperature data of each distributed point in real time.The application can realize synchronous and high-precision acquisition of hand-shaped distributed pressure and temperature signal flexible sensors, adapt to piezoresistive and thermistor sensors, simplify the circuit structure, and improve the integration and signal processing efficiency.

Description

Technical Field

[0001] This invention relates to the field of sensor signal acquisition technology, and in particular to a flexible sensor acquisition system and circuit for hand-shaped distributed pressure and temperature signals. Background Technology

[0002] In scenarios such as smart wearables (e.g., hand rehabilitation gloves, virtual interactive gloves), human-computer interaction, medical monitoring (hand physiological parameter monitoring), and electronic skin, it is necessary to accurately acquire distributed pressure and temperature information of the hand. Traditional solutions often use independent acquisition systems for pressure and temperature signals, which suffers from problems such as complex circuitry, low integration, high cost, and poor signal synchronization. Furthermore, the acquisition circuit adapted for flexible hand sensors must take into account the characteristics of flexible sensors (weak signals, susceptibility to interference). Existing general-purpose acquisition circuits cannot meet the requirements for high precision, miniaturization, and synchronous acquisition, thus limiting the application and development of multi-parameter hand sensing systems.

[0003] Therefore, proposing a flexible sensor system and circuit for acquiring hand-shaped distributed pressure and temperature signals to solve the problems existing in the prior art is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0004] In view of this, the present invention provides a hand-shaped distributed pressure and temperature signal flexible sensor acquisition system and circuit, which realizes synchronous and high-precision acquisition of hand-shaped distributed pressure and temperature flexible sensor signals, is compatible with piezoresistive and thermistor type sensors, simplifies the circuit structure, and improves integration and signal processing efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A hand-shaped distributed pressure and temperature signal flexible sensor acquisition system includes a sensor module, a signal amplification module, an MCU processing module, and a serial communication and display module connected in sequence. The sensor module includes a piezoresistive pressure flexible sensor array and a thermistor temperature flexible sensor array distributed along the shape of the hand, used to collect pressure and temperature signals from the hand. The signal amplification module is used to amplify and condition the pressure and temperature signals, and output analog signals that can be recognized by the MCU processing module. The MCU processing module is used to convert the amplified analog signal into a digital signal, and then filter the digital signal to convert it into hand pressure and temperature values. The serial communication and display module includes a serial communication unit and an LCD display unit. The serial communication unit receives the output signal from the MCU processing module and transmits it to the LCD display module to display the pressure and temperature data of each distribution point in real time.

[0006] A flexible sensor acquisition circuit for distributed hand pressure and temperature signals, applied in a flexible hand pressure and temperature signal acquisition system, includes: a power supply unit, an acquisition unit, an MCU processing unit, a serial communication unit, and a display unit. The acquisition unit, MCU processing unit, serial communication unit and display unit are connected in sequence, and each unit is electrically connected to the power supply unit.

[0007] Optionally, the power supply unit of the above circuit includes an LM1117-3.3 chip and a capacitor filter circuit. The capacitor filter circuit is electrically connected to the pins of the LM1117-3.3 chip to achieve multiple voltage outputs and ensure stable voltage.

[0008] Optionally, the acquisition unit of the above-mentioned circuit includes a pressure signal acquisition branch and a temperature signal acquisition branch connected in parallel. The pressure signal acquisition branch and the temperature signal acquisition branch are respectively connected to a piezoresistive pressure flexible sensor array and a thermistor temperature flexible sensor array for acquiring hand pressure signals and temperature signals.

[0009] The circuit described above, optionally, includes a pressure signal acquisition branch comprising a first amplification circuit and a first multi-channel analog selection chip. The output signal of the piezoresistive pressure flexible sensor array is amplified by the first amplification circuit and conditioned into a voltage signal adapted to the MCU processing unit. The first multi-channel analog selection chip manages the matrix channel voltage signals to meet the requirements of hand-shaped distributed multi-channel pressure acquisition and realizes orderly scanning of signals from different pressure sensing points. The temperature signal acquisition branch includes a second amplifier circuit and a second multi-channel analog selection chip. The output signal of the thermistor-type flexible temperature sensor array is amplified by the second amplifier circuit and conditioned into a voltage signal that is compatible with the MCU processing unit. The second multi-channel analog selection chip manages the matrix channel voltage signals to meet the requirements for accurate acquisition of hand-shaped distributed temperature point signals.

[0010] Optionally, the serial communication unit of the above circuit includes an SP485E chip and a working circuit that enables electrical connection to the pins of the MCU processing unit and the display unit. The display unit includes an LCD chip, which receives serial port data and interprets and displays pressure and temperature values ​​in the shape of a hand.

[0011] As can be seen from the above technical solutions, compared with the prior art, the present invention provides a flexible sensor acquisition system and circuit for distributed hand pressure and temperature signals, which has the following beneficial effects: 1) The present invention realizes synchronous acquisition and processing of pressure and temperature signals, simplifies the system structure, improves the integration of multi-parameter hand sensing, ensures data synchronization, and adapts to dynamic hand parameter monitoring scenarios; 2) The present invention, through targeted signal amplification, filtering, and calibration, adapts to the weak signal characteristics of piezoresistive and thermistor sensors, improves the accuracy of pressure and temperature detection, and meets the needs of distributed fine sensing of hand shapes; 3) The circuit design of the present invention takes into account the installation and signal characteristics of flexible sensors, and can be flexibly deployed on flexible hand substrates, supporting wearable and adhesive applications, and expanding the application potential of smart wearables, medical monitoring, and other scenarios; 4) The present invention optimizes the circuit structure, uses general-purpose components (MCU microcontroller, operational amplifier, serial port chip, etc.), reduces costs, and enhances anti-interference through power filtering and signal conditioning, improving the long-term stable operation capability of the system. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0013] Figure 1 This is a circuit architecture diagram of a hand-shaped distributed pressure and temperature signal acquisition flexible sensor disclosed in this invention; Figure 2 This is a diagram of the power supply unit architecture disclosed in this invention; Figure 3a This is a diagram of the pressure signal acquisition branch architecture disclosed in an embodiment of the present invention; Figure 3b This is a diagram of the temperature signal acquisition branch architecture disclosed in an embodiment of the present invention; Figure 4 This is a diagram of the serial communication unit architecture disclosed in an embodiment of the present invention. Detailed Implementation

[0014] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0015] In this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0016] This invention discloses a flexible sensor acquisition system for distributed pressure and temperature signals in hand shapes, comprising a sensor module, a signal amplification module, an MCU processing module, and a serial communication and display module connected in sequence. The sensor module includes a piezoresistive pressure flexible sensor array and a thermistor temperature flexible sensor array distributed along the shape of the hand, used to collect pressure and temperature signals from the hand. The signal amplification module is used to amplify and condition the pressure and temperature signals, and output analog signals that can be recognized by the MCU processing module. The MCU processing module uses a 32-bit ARM core microcontroller to convert the amplified analog signal into a digital signal, and then filters the digital signal to convert it into hand pressure and temperature values. The serial communication and display module includes a serial communication unit and an LCD display unit. The serial communication unit receives the output signal from the MCU processing module and transmits it to the LCD display module to display the pressure and temperature data of each distribution point in real time.

[0017] Furthermore, the sensor is a flexible sensor made using special materials and special processes.

[0018] A flexible sensor acquisition circuit for hand-shaped distributed pressure and temperature signals, applied in a flexible sensor acquisition system for hand-shaped distributed pressure and temperature signals, referenced... Figure 1 As shown, it includes: a power supply unit, a data acquisition unit, an MCU processing unit, a serial communication unit, and a display unit. The acquisition unit, MCU processing unit, serial communication unit and display unit are connected in sequence, and each unit is electrically connected to the power supply unit.

[0019] Furthermore, refer to Figure 2As shown, the power supply unit includes an LM1117-3.3 chip and a capacitor filter circuit. The capacitor filter circuit is electrically connected to the pins of the LM1117-3.3 chip to achieve multiple voltage outputs and ensure stable voltage.

[0020] Specifically, the multi-voltage outputs include -3V, +5V, and +3.3V, used to power modules such as sensors, operational amplifiers, and MCUs.

[0021] Furthermore, refer to Figure 3a and 3b As shown, the acquisition unit includes a pressure signal acquisition branch and a temperature signal acquisition branch connected in parallel. The pressure signal acquisition branch and the temperature signal acquisition branch are respectively connected to a piezoresistive pressure flexible sensor array and a thermistor temperature flexible sensor array to acquire hand pressure signals and temperature signals.

[0022] Furthermore, the pressure signal acquisition branch includes a first amplification circuit and a first multi-channel analog selection chip. The output signal of the piezoresistive pressure flexible sensor array is amplified by the first amplification circuit and conditioned into a voltage signal that is compatible with the MCU processing unit. The first multi-channel analog selection chip manages the matrix channel voltage signals to meet the requirements of hand-shaped distributed multi-channel pressure acquisition and realizes orderly scanning of signals from different pressure sensing points. The temperature signal acquisition branch includes a second amplifier circuit and a second multi-channel analog selection chip. The output signal of the thermistor-type flexible temperature sensor array is amplified by the second amplifier circuit and conditioned into a voltage signal that is compatible with the MCU processing unit. The second multi-channel analog selection chip manages the matrix channel voltage signals to meet the requirements for accurate acquisition of hand-shaped distributed temperature point signals.

[0023] Furthermore, the amplifier circuit is built based on the operational amplifier circuit to adapt to the signal variation range of piezoresistive and thermistor signals. For example, the resistance change of the piezoresistive signal with pressure change is small, so high gain amplification is required; the resistance change of the thermistor signal with temperature change is stable amplification, which is used to amplify and condition the weak pressure and temperature sensor signals so that the pressure and temperature signals reach the voltage range of 0V to 3.3V when they change, so that the microcontroller can sample the pressure and temperature change values.

[0024] Furthermore, refer to Figure 4 As shown, the serial communication unit includes an SP485E chip and a working circuit that enables electrical connection to the pins of the MCU processing unit and the display unit; The display unit includes an LCD chip, which receives serial port data and interprets and displays pressure and temperature values ​​in the shape of a hand.

[0025] In one specific embodiment, the MCU unit scans the matrix sequentially through a multiplexer chip according to a set timing sequence to acquire pressure and temperature signals. Then, the analog signals are amplified, converted into digital quantities by an ADC, and filtered to remove noise. Finally, combined with sensor calibration parameters, namely pressure-resistance and temperature-resistance calibration curves, the obtained digital quantities are converted into actual pressure and actual temperature values, which are then sent to the display unit and the host computer in real time through a serial communication unit.

[0026] In another specific embodiment, the hardware comprising a power module, an operational amplifier circuit, an MCU minimum system, a serial port circuit, and a multiplexer circuit is soldered using the present application, and the pressure and temperature sensor array is connected to the acquisition circuit through an FPC interface; Test the gain and bandwidth of the operational amplifier circuit to make it suitable for the range of sensor signals, such as amplifying the pressure sensor signal by 100 to 500 times and the temperature sensor signal by 50 to 200 times. Fine-tune the gain by adjusting the feedback resistor and then adjust the power supply voltage to ensure that each module is powered normally. An ADC acquisition program was written based on the STM32 development environment, and the control logic of the multi-channel selection chip was configured to realize time-division acquisition of pressure and temperature matrix channels. Digital filtering and calibration algorithms were then added to convert the ADC values ​​into pressure (unit: kPa) and temperature (unit: ℃) physical quantities. A serial communication program was written to send data according to the agreed protocol (e.g., custom frame format: frame header + pressure data + temperature data + check bit). The serial communication unit receives serial port data, parses it, and displays the pressure and temperature values ​​of the hand shape distribution on the screen. A visual interface can be designed, such as displaying real-time data in the area corresponding to the hand shape outline, and finally completes the flexible sensor acquisition system for distributed hand shape pressure and temperature signals.

[0027] The system was subjected to static and dynamic testing, specifically: Static testing: Apply standard pressure (0 kPa, 50 kPa, etc.) to the pressure sensor in a constant temperature environment (e.g., 25℃) to verify the pressure acquisition accuracy; use a standard heat source (e.g., a constant temperature heating platform, 30℃, 40℃, etc.) to the temperature sensor to verify the temperature acquisition accuracy, record the error and calibrate. Dynamic testing: Simulate hand movements (clenching fist, extending fist), collect dynamic data on pressure and temperature changes, verify the system's synchronization and response speed; test the stability of signal acquisition under different environmental interferences (such as electromagnetic interference, power fluctuations).

[0028] Therefore, this application demonstrates that the robotic arm can simultaneously acquire pressure and temperature signals during operation, sensing the pressure and temperature of an object. It not only displays the pressure and temperature data but also transmits this data to a host computer via serial communication. This overcomes the limitations of traditional robotic arms, which cannot acquire or sense the pressure and temperature of objects, and cannot accurately determine the state of deformation, breakage, or temperature fluctuations. This not only increases the stability of the robotic arm during operation but also improves its reliability and safety. It provides a solid foundation for the reliability of smart wearable products, human-computer interaction, and medical monitoring products, offering robust protection for intelligent products.

[0029] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and relevant parts can be referred to the descriptions in the method embodiments. The systems and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0030] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A hand-shaped distributed pressure and temperature signal flexible sensor acquisition system, characterized in that, It includes a sensor module, a signal amplification module, an MCU processing module, and a serial communication and display module connected in sequence. The sensor module includes a piezoresistive pressure flexible sensor array and a thermistor temperature flexible sensor array distributed along the shape of the hand, used to collect pressure and temperature signals from the hand. The signal amplification module is used to amplify and condition the pressure and temperature signals, and output analog signals that can be recognized by the MCU processing module. The MCU processing module is used to convert the amplified analog signal into a digital signal, and then filter the digital signal to convert it into hand pressure and temperature values. The serial communication and display module includes a serial communication unit and an LCD display unit. The serial communication unit receives the output signal from the MCU processing module and transmits it to the LCD display module to display the pressure and temperature data of each distribution point in real time.

2. A flexible sensor acquisition circuit for hand-shaped distributed pressure and temperature signals, applied in a flexible sensor acquisition system for hand-shaped distributed pressure and temperature signals, characterized in that... include: The system includes a power supply unit, a data acquisition unit, an MCU processing unit, a serial communication unit, and a display unit. The acquisition unit, MCU processing unit, serial communication unit and display unit are connected in sequence, and each unit is electrically connected to the power supply unit.

3. The hand-shaped distributed pressure and temperature signal flexible sensor acquisition circuit according to claim 2, characterized in that, The power supply unit includes an LM1117-3.3 chip and a capacitor filter circuit. The capacitor filter circuit is electrically connected to the pins of the LM1117-3.3 chip to achieve multiple voltage outputs and ensure stable voltage.

4. The hand-shaped distributed pressure and temperature signal flexible sensor acquisition circuit according to claim 2, characterized in that, The acquisition unit includes a pressure signal acquisition branch and a temperature signal acquisition branch connected in parallel. The pressure signal acquisition branch and the temperature signal acquisition branch are respectively connected to a piezoresistive pressure flexible sensor array and a thermistor temperature flexible sensor array to acquire hand pressure signals and temperature signals.

5. The hand-shaped distributed pressure and temperature signal flexible sensor acquisition circuit according to claim 4, characterized in that, The pressure signal acquisition branch includes a first amplification circuit and a first multi-channel analog selection chip. The output signal of the piezoresistive pressure flexible sensor array is amplified by the first amplification circuit and conditioned into a voltage signal that is compatible with the MCU processing unit. The first multi-channel analog selection chip manages the matrix channel voltage signals to meet the requirements of hand-shaped distributed multi-channel pressure acquisition and realizes orderly scanning of signals from different pressure sensing points. The temperature signal acquisition branch includes a second amplifier circuit and a second multi-channel analog selection chip. The output signal of the thermistor-type flexible temperature sensor array is amplified by the second amplifier circuit and conditioned into a voltage signal that is compatible with the MCU processing unit. The second multi-channel analog selection chip manages the matrix channel voltage signals to meet the requirements for accurate acquisition of hand-shaped distributed temperature point signals.

6. The hand-shaped distributed pressure and temperature signal flexible sensor acquisition circuit according to claim 2, characterized in that, The serial communication unit includes an SP485E chip and a working circuit that enables electrical connection to the pins of the MCU processing unit and the display unit; The display unit includes an LCD chip, which receives serial port data and interprets and displays pressure and temperature values ​​in the shape of a hand.

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