Industrial metal surface measurement method and system based on infrared wave imaging

Abstract

The application provides an industrial metal surface measurement method and system based on infrared wave imaging, which comprises the following steps: obtaining the radiation data of the industrial metal surface under multiple infrared waves by using multiple spectral channels; each spectral channel is used for receiving infrared waves with different wavelength ranges; the radiation data is initial image information of the corresponding radiation intensity and radiation intensity distribution generated under each infrared wave at the same time; each initial image information is preprocessed to generate effective radiation imaging information corresponding to each infrared wave; the radiation intensity in each effective radiation imaging information is fitted to obtain the temperature value and effective emissivity of each pixel point in the effective radiation imaging information; and the temperature values of all pixel points are integrated into a temperature distribution, and the effective emissivities of all pixel points are integrated into an effective emissivity distribution. The problem that the industrial metal surface cannot be stably detected in a complex continuous casting environment is solved.

Description

Technical Field

[0001] This application relates to the field of optical inspection technology, and in particular to a method and system for measuring industrial metal surfaces based on infrared imaging. Background Technology

[0002] In the continuous casting process of steel, the surface temperature of the billet is a crucial process parameter reflecting solidification behavior, internal quality, and subsequent rolling performance. Currently, single-color or dual-color infrared thermometers are commonly used in industrial settings to monitor the surface temperature of the billet. However, in the secondary cooling zone of continuous casting, a high-concentration water vapor environment is formed around the billet due to the large amount of water sprayed for cooling. Simultaneously, the billet surface alternates between bare steel areas and oxide scale-covered areas, resulting in highly uneven radiation characteristics on the billet surface.

[0003] Existing monochromatic temperature measurement methods rely on preset emissivity parameters, making it difficult to adapt to the rapid changes in the surface condition of industrial metals such as billets or steel. While dual-color or colorimetric temperature measurement methods mitigate the influence of emissivity to some extent, they are still susceptible to interference from reflected radiation, water vapor absorption, and surface specular reflection in the short-wavelength band, leading to systematic biases in the measurement results. Furthermore, most existing multicolor or multispectral temperature measurement schemes assume that the measurement band is not affected by selective absorption, or only avoid specific interfering gases by pre-setting fixed bands. However, in the secondary cooling zone of continuous casting, the water vapor concentration dynamically changes with spray intensity, spatial location, and time. The influence of water vapor absorption on different bands exhibits significant non-uniformity and unsteady-state characteristics, making it difficult for temperature measurement methods based on fixed band selection or fixed weights to operate stably for long periods. Existing dual-color and higher-level temperature measurement schemes typically only output a single temperature value, making it difficult to obtain spatial distribution information of industrial metal surface temperature and failing to meet the needs of refined continuous casting process control.

[0004] Therefore, there is an urgent need for a technology that can stably detect the surface condition of industrial metals in complex continuous casting environments. Summary of the Invention

[0005] In view of this, the purpose of this application is to propose an industrial metal surface measurement method and system based on infrared imaging, which solves the problem of the inability to stably detect industrial metal surfaces in complex continuous casting environments.

[0006] To achieve one of the aforementioned objectives, this application provides a method for measuring industrial metal surfaces based on infrared imaging, the method comprising:

[0007] The radiation data of the industrial metal surface under multiple infrared waves is obtained using multiple spectral channels; wherein each spectral channel is used to receive infrared waves of different wavelength ranges; the radiation data is the initial image information of the corresponding radiation intensity and the radiation intensity distribution generated under the action of each segment of infrared waves at the same time. Each of the initial image information is preprocessed to generate effective radiation imaging information corresponding to each segment of the infrared wave; The radiation intensity in each of the effective radiation imaging information is fitted to retrieve the temperature value and effective emissivity of each pixel in the effective radiation imaging information. The temperature values ​​of all the pixels are integrated into the temperature distribution of the industrial metal surface, and the effective emissivity of all the pixels is integrated into the effective emissivity distribution of the industrial metal surface.

[0008] As a further improvement to one embodiment of this application, the acquisition of radiation data of the industrial metal surface under multiple infrared waves includes: The initial image information and radiation intensity of each segment of the infrared wave are obtained in real time on the industrial metal surface; The initial image information and the radiation intensity are combined with the pixel coordinates of the industrial metal surface to form the radiation data in the form of a three-dimensional data cube.

[0009] As a further improvement to one embodiment of this application, the preprocessing of each initial image information to generate effective radiation imaging information corresponding to each segment of infrared wave includes: Select at least one segment of infrared wave initial image information from the plurality of initial image information; A threshold for distinguishing between high temperature and non-high temperature images is set based on the grayscale distribution characteristics of the selected initial image information; Based on the threshold, the non-high temperature portion of each initial image information is extracted as an invalid region; Based on the threshold, the portion of each initial image information that belongs to high temperature is extracted as an effective temperature measurement area, and the initial image information within the effective temperature measurement area is used as the effective radiation imaging information.

[0010] As a further improvement to one embodiment of this application, the preprocessing of each initial image information to generate effective radiation imaging information corresponding to each segment of infrared wave includes: For each of the initial image information, perform at least one of the following: dark current correction processing, non-uniformity correction processing, channel registration processing, and scene interference recognition processing to generate the effective radiation imaging information corresponding to each segment of the infrared wave.

[0011] As a further improvement to one embodiment of this application, the step of fitting the radiation intensity in each of the effective radiation imaging information to invert the temperature value and effective emissivity of each pixel in the effective radiation imaging information includes: By using logarithmic linearization or least squares fitting, the radiation intensity in each of the effective radiation imaging information is fitted to generate the temperature value and effective emissivity of each pixel in the effective radiation imaging information.

[0012] As a further improvement to one embodiment of this application, the step of using the least squares fitting method to fit the radiation intensity in each of the effective radiation imaging information to generate a temperature value includes: Each of the stated radiation intensities is constructed as follows: I(λ)=ε(λ)×B(λ,T); Where I(λ) is the radiation intensity, λ is the band of the infrared wave, ε(λ) is the true emissivity value in the λ band, B(λ,T) is the Planck blackbody radiation function, and T is the temperature value. The multiple models corresponding to the multiple radiation intensities are combined into an overdetermined set of equations, and the temperature value is calculated using the overdetermined set of equations.

[0013] As a further improvement to one embodiment of this application, the effective emissivity is calculated according to the following power model: ε(λ)=a0+a1λ+a2λ 2 ; Where a0, a1, and a2 are the coefficients of the power model; The spectral channels are configured with at least four, and at least four power models are established using the wavelengths received by the at least four spectral channels to calculate the coefficients of the power models and the temperature value.

[0014] As a further improvement of one embodiment of this application, at least nine spectral channels are provided, and at least nine bands of infrared waves are provided.

[0015] As a further improvement to one embodiment of this application, the step of fitting the radiation intensity in each of the effective radiation imaging information to invert the temperature value and effective reflectivity of each pixel in the effective radiation imaging information includes: Compare the radiation data corresponding to each segment of the infrared wave; If it is found that the consistency of one of the radiation data with the other radiation data does not meet the preset requirements, the spectral channel corresponding to the discovered radiation data is an abnormal channel; When fitting the radiation intensity in each of the effective radiation imaging information, the computational weight of the abnormal channel is reduced, and the temperature value of each pixel is retrieved.

[0016] Based on the same inventive concept, this application also provides an industrial metal surface measurement system based on infrared imaging, comprising: The acquisition module is used to acquire radiation data of the industrial metal surface under multiple infrared waves using multiple spectral channels; wherein each spectral channel is used to receive infrared waves of different wavelength ranges; the radiation data is the initial image information of the corresponding radiation intensity and the radiation intensity distribution generated under the action of each segment of infrared waves at the same time. The preprocessing module is used to preprocess each of the initial image information to generate effective radiation imaging information corresponding to each segment of the infrared wave; The inversion module is used to fit the radiation intensity in each of the effective radiation imaging information to invert the temperature value and effective emissivity of each pixel in the effective radiation imaging information; An integration module is used to integrate the temperature values ​​of all the pixels into the temperature distribution of the industrial metal surface, and to integrate the effective emissivity of all the pixels into the effective emissivity distribution of the industrial metal surface.

[0017] Compared to existing technologies, the technical advantages of this invention are as follows: By setting multiple spectral channels to receive infrared waves of various wavelengths, non-contact radiation measurement is performed on industrial metal surfaces. After obtaining and processing the radiation data, the temperature value and temperature distribution of the industrial metal surface can be derived by fitting the radiation intensity under multiple infrared waves. The temperature can be stably measured under conditions where the emissivity of the industrial metal surface varies with space and time, avoiding the influence of changes in the emissivity of the industrial metal surface on the temperature measurement results. Furthermore, when processing the radiation data, abnormal or invalid data is removed, avoiding the influence of complex environments on the results. The invention can stably measure the temperature in complex environments and also realizes the spatial distribution measurement of industrial metal surfaces, providing richer information. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the implementation methods or related technologies will be briefly introduced below. Obviously, the drawings described below are only the implementation methods of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A flowchart illustrating an industrial metal surface measurement method based on infrared imaging, provided in one embodiment of this application; Figure 2 Initial image information in another infrared imaging-based industrial metal surface measurement method provided in another embodiment of this application; Figure 3 Temperature distribution in another method for measuring industrial metal surfaces based on infrared imaging, provided in another embodiment of this application; Figure 4Effective emissivity distribution in another infrared imaging-based industrial metal surface measurement method provided in another embodiment of this application; Figure 5 A schematic diagram of an industrial metal surface measurement system based on infrared imaging, provided for another embodiment of this application; Figure 6 This is a schematic diagram of the hardware structure of an electronic device provided for another embodiment of this application. Detailed Implementation

[0020] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the scope of protection of the present invention.

[0021] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by those skilled in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0022] This application provides an industrial metal surface measurement method based on infrared imaging, such as... Figure 1 As shown, the method includes the following steps: Step S100: Use multiple spectral channels to acquire radiation data of industrial metal surfaces under multiple infrared waves; wherein, each spectral channel is used to receive infrared waves of different wavelength ranges; the radiation data is the initial image information of the corresponding radiation intensity and radiation intensity distribution generated under the action of each infrared wave at the same time.

[0023] Specifically, this method utilizes a multispectral channel infrared detector to detect the radiation of an industrial metal surface under the influence of infrared waves. The radiation intensity reflected by the industrial metal surface varies at different temperatures. In subsequent steps, the temperature of the industrial metal surface can be deduced based on these different radiation intensities, enabling non-contact radiation measurement. By acquiring the radiation intensity of the industrial metal surface at different wavelengths at the same time, the distribution of the infrared radiation intensity is displayed as an image. Each infrared wave segment generates a corresponding initial image, and multiple initial image information can be obtained from multiple infrared wave segments.

[0024] It should be noted that the aforementioned multispectral channel infrared detection device employs various implementation methods for spectral channels, including but not limited to absorption filter layers, interference filter layers, induced transmission filter layers, linearly graded filter layers, and metasurface structure filter layers. These filter layers can be implemented using various micro / nano structures, including but not limited to metal / dielectric nanowire arrays, metal nanoparticle / nanopore arrays, FP interferometer cavities, waveguide layers, quantum dots, dyes, and metasurfaces. Each spectral channel is fixed in front of the detector in an array arrangement. In the multispectral short-wave infrared detection device, each independent spectral channel is presented by a corresponding independent microlens array. These microlens arrays can be implemented using methods including but not limited to metasurface lens arrays, single-lens stitching, nanoimprinting, and whole-piece grinding and milling.

[0025] In a specific implementation, the emitted infrared wave is shortwave infrared, which is suitable for imaging in subsequent steps and facilitates observation and processing.

[0026] In specific implementation methods, the wavelength of short-wave infrared is within the range of 0.8 micrometers to 2.5 micrometers.

[0027] In specific feasible implementations, the infrared wave bands are at least three.

[0028] In a specific feasible implementation, the infrared wave bands are discrete into six to twelve segments.

[0029] In specific feasible methods, industrial metals include continuously cast steel billets or hot-rolled steel products.

[0030] In one possible implementation of this application, step S100 includes: Step S110: Obtain the initial image information and radiation intensity of each infrared wave on the industrial metal surface in real time.

[0031] Step S120 combines the initial image information and radiation intensity with the pixel coordinates of the industrial metal surface to form radiation data in the form of a three-dimensional data cube.

[0032] Specifically, during the production process, the surface temperature of industrial metals changes in real time, and the initial radiation image information is different at each moment. A multispectral channel infrared imaging device performs real-time imaging of the industrial metal surface, acquiring the radiation intensity data of the steel billet in the infrared band, forming three-dimensional data coordinates, which are represented as: I(x, y, λ) i Where x and y are pixel coordinates, λ i Let i be the i-th infrared wave.

[0033] Step S200: Preprocess each initial image information to generate effective radiation imaging information corresponding to each infrared wave segment.

[0034] Specifically, the surface shape of industrial metals is uncertain or irregular, and the initial radiation image information formed by infrared waves may contain other equipment or background, as well as areas with low signal-to-noise ratio, which need to be removed before inversion calculation.

[0035] In one possible implementation of this application, step S200 includes: Step S210: Select at least one segment of infrared initial image information from multiple initial image information.

[0036] Step S220: Set a threshold to distinguish between high temperature and non-high temperature based on the grayscale distribution characteristics of the selected initial image information.

[0037] Step S230: Based on the threshold, extract the non-high temperature parts of each initial image information as invalid regions.

[0038] Step S240: Based on the threshold, extract the high-temperature portion of each initial image information as the effective temperature measurement area, and use the initial image information within the effective temperature measurement area as the effective radiation imaging information.

[0039] Specifically, all infrared waves in all bands target the same image area, and the invalid parts that need to be removed are also the same. Therefore, one of the multiple initial image information is selected to divide the effective temperature measurement area and the invalid area. A threshold is chosen based on the grayscale distribution in the selected initial image information, dividing the area on either side of the threshold into high-temperature and non-high-temperature regions. The selected initial image information becomes the partition mask, removing background, other equipment structures, and low signal-to-noise ratio areas from all other initial image information, leaving the effective temperature measurement area as the effective radiation imaging information. Subsequent inversion calculations are limited to the effective temperature measurement area.

[0040] In a specific implementation, the initial image information corresponding to the infrared wave with the highest signal-to-noise ratio is selected for threshold setting.

[0041] In one possible implementation of this application, step S200 includes: For each initial image information, perform at least one of the following processing methods: dark current correction, non-uniformity correction, channel registration, and scene interference recognition, to generate effective radiation imaging information corresponding to each infrared wave segment.

[0042] Specifically, after the above processing, abnormal parts of the initial image information may be removed, abnormal parts of the initial image information may be corrected, or the entire initial image information corresponding to abnormal spectral channels may be removed, avoiding complex continuous casting environment image inversion results. Temperature values ​​and effective reflectivity are calculated only on normal and valid imaging data, increasing robustness to environmental interference.

[0043] Step S300: Fit the radiation intensity in each effective radiation imaging information to retrieve the temperature value and effective emissivity of each pixel in the effective radiation imaging information.

[0044] Specifically, the effective radiation imaging information corresponding to each infrared wave can be used to calculate the temperature value. After obtaining multiple temperature values ​​calculated from multiple infrared waves, the final temperature value can be determined, which can reduce the influence of unstable or uneven environment on the measurement results and keep the measurement results accurate in complex environments.

[0045] In one possible implementation of this application, step S300 includes: Step S310: Using logarithmic linearization or least squares fitting, the radiation intensity in each effective radiation imaging information is fitted to generate temperature value and effective emissivity.

[0046] In one possible implementation of this application, step S310, which generates the temperature value using the least squares fitting method, includes: Step S311, construct each radiation intensity as follows: I(λ)=ε(λ)×B(λ,T); Where I(λ) is the radiation intensity, λ is the infrared band, ε(λ) is the true emissivity value in the λ band, B(λ,T) is the Planck blackbody radiation function, and T is the temperature value.

[0047] Step S312: Multiple models corresponding to multiple radiation intensities are combined into an overdetermined equation set, and the temperature value is calculated using the overdetermined equation set.

[0048] Specifically, an industrial metal surface radiation model is constructed, and the above formula is the industrial metal surface radiation model. Under the constraints of the industrial metal surface radiation model, a unique solution is obtained through an overdetermined set of equations.

[0049] In one possible implementation of this application, step S310, generating the effective emissivity, further includes: The effective emissivity is calculated according to the following power model: ε(λ)=a0+a1λ+a2λ 2 ; Where a0, a1, and a2 are the coefficients of the power model; Specifically, after substituting the power model into the model for calculating radiation intensity, the entire model has four unknowns: temperature T, coefficients a0, a1, and a2. Therefore, at least four spectral channels must be set, and at least four power models must be established using the wavelengths received by at least four spectral channels to calculate the coefficients of the power model and the unique solution for the temperature value, that is, to obtain the unique solution for the temperature value and the effective emissivity.

[0050] In one possible implementation of this application, at least nine spectral channels are provided, and at least nine infrared wave bands are provided.

[0051] Specifically, although the four wavelengths received by the four spectral channels can mathematically yield a unique solution for the temperature value and effective emissivity, four spectral channels are not sufficient. This is because the fitting of polynomials or smooth functions is very sensitive to noise; fewer spectral channels result in weaker decoupling ability between temperature and emissivity; in actual measurements, atmospheric absorption, water vapor, and instrument noise all introduce systematic errors. More spectral channels can improve the robustness and accuracy of measurements when performing least squares fitting calculations.

[0052] When calculating the temperature value, the least squares fitting representation is as follows: ; Where T is the temperature value, L(λ)(T) is the blackbody radiation intensity at wavelength λ and temperature T, and R(λ) is the observed radiation intensity.

[0053] When there are at least 9 spectral channels, there are 4 unknowns, i.e., M >> N. unknown This yields robust and accurate temperature values ​​and effective emissivity.

[0054] In one possible implementation of this application, step S300 further includes: Step S301: Compare the radiation data corresponding to each infrared wave segment.

[0055] In step S302, if it is found that the consistency between one of the radiation data and other radiation data does not meet the preset requirements, the spectral channel corresponding to the found radiation data is an abnormal channel.

[0056] Step S303: When fitting the radiation intensity in each valid radiation imaging information, reduce the calculation weight of the abnormal channel and retrieve the temperature value of each pixel.

[0057] Specifically, by comparing the relative changes between each infrared wave signal, abnormal channels affected by environmental interference such as water vapor and dust are automatically identified, and the data of abnormal channels are removed or their weights reduced, thereby achieving stable temperature measurement under environmental interference conditions.

[0058] In a specific implementation, the abnormal channel is affected by the absorption of infrared waves from the environment, causing the data to become abnormal. The environmental absorption includes water vapor absorption and / or smoke and dust absorption.

[0059] Step S400: Integrate the temperature values ​​of all pixels into the temperature distribution of the industrial metal surface, and integrate the effective emissivity of all pixels into the effective emissivity distribution of the industrial metal surface.

[0060] Specifically, based on the preceding steps, the temperature value and effective emissivity of each pixel in the effective radiation imaging information are calculated. By integrating the coordinates of each pixel and the temperature value and effective emissivity at that pixel, the temperature value and effective emissivity distribution of the industrial metal surface can be obtained. The beneficial effects of the infrared imaging-based industrial metal surface measurement method disclosed in this application are as follows: By setting multiple spectral channels to receive infrared waves of various wavelengths, non-contact radiation measurement of the industrial metal surface is performed. After obtaining and processing the radiation data, the temperature of the industrial metal surface can be jointly inverted, avoiding the influence of changes in the emissivity of the industrial metal surface on the temperature measurement results and improving the accuracy of temperature measurement. Furthermore, the infrared waves of multiple wavelengths are fitted to the temperature distribution of the industrial metal surface, avoiding the influence of changes in the emissivity of the industrial metal surface on the temperature measurement results. When processing the radiation data, abnormal or invalid data is removed. It can work stably in the water vapor environment of the continuous casting secondary cooling zone, enhancing robustness against water vapor interference. It can also realize the spatial distribution measurement of the industrial metal surface, providing richer information. This method is suitable for online, non-contact measurement and has good prospects for industrial applications.

[0061] Another embodiment of this application discloses a different method for measuring the surface of industrial metals based on infrared imaging, applied to a continuous casting production line in a steel plant. A 9-channel shortwave infrared imaging system is used to perform online imaging of the surface of steel billets in the secondary cooling zone. The system selects multiple spectral channels located between 1.1 micrometers and 1.7 micrometers for joint inversion to obtain the temperature distribution results on the steel billet surface. Experimental results show that, compared with traditional two-color temperature measurement results, the temperature results obtained by this method are more stable and have better consistency with contact temperature measurement or process calculation results.

[0062] An experimental subject and application scenario for an industrial metal surface measurement method based on infrared imaging is the secondary cooling area of ​​a continuous casting production line in a steel enterprise. In this area, the steel billet surface is subjected to extensive water spray cooling, accompanied by complex conditions such as high-temperature water vapor, steam mist, and oxide scale peeling. Traditional single-color or dual-color infrared thermometry methods result in large fluctuations and poor stability. The object to be measured is a continuously cast steel billet, made of carbon steel, with a surface temperature range of approximately 600–1200°C.

[0063] The specific steps of the method include: S1 employs a multi-channel short-wave infrared imaging device to perform real-time imaging of the steel billet surface. For example... Figure 2 As shown, the imaging device comprises nine discrete shortwave infrared bands, each with a center wavelength ranging from 1.19 micrometers to 1.7 micrometers, and adjacent bands are spaced less than 0.1 micrometers apart. During the billet's movement, initial image information for all nine bands is acquired simultaneously, and dark current and non-uniformity corrections are applied to the initial image information to form a cube of multi-channel radiation data with dimensions H×W×9.

[0064] S2. From the multi-channel radiation data, a short-wave infrared band with a high signal-to-noise ratio is selected as the reference channel, and threshold segmentation is performed on the image of this channel. The threshold is set as a preset proportion of the maximum radiation intensity of the channel, thereby automatically extracting the high-temperature region of the steel billet and generating an effective temperature measurement mask. Through this masking process, background, equipment structure, and low-temperature interference regions are effectively eliminated, improving the stability and computational efficiency of subsequent inversion calculations.

[0065] S3 automatically identifies abnormal channels affected by water vapor absorption by comparing the relative changes between the radiation signals of each channel, and performs data removal or weight reduction processing on the abnormal channels, thereby achieving stable temperature measurement under water vapor interference conditions.

[0066] S4. Within the high-temperature region of the steel billet defined by the mask, a radiation model is constructed based on Planck's radiation law. For each pixel, radiation data from multiple short-wavelength bands are jointly fitted to obtain the corresponding surface temperature value. To improve noise resistance, only effective bands with radiation intensity greater than zero are selected for calculation during the fitting process, and the temperature parameters are solved using a least-squares fitting method.

[0067] S5. After obtaining the surface temperature distribution of the steel billet, the temperature value of each pixel is fixed. The effective emissivity of the pixel in different wavelength bands is calculated using the ratio of the measured radiation intensity of each shortwave band to the corresponding blackbody radiation intensity. To reduce the influence of accidental factors such as water vapor absorption and specular reflection, the effective emissivity calculated for the same pixel in multiple wavelength bands is fused using a median statistical method to obtain an equivalent emissivity distribution.

[0068] S6. The retrieved temperature distribution map and equivalent emissivity distribution map are processed by median filtering and bilateral filtering, respectively, to eliminate isolated noise points and preserve the boundary structure, such as... Figure 3 and Figure 4 As shown, the final output is a two-dimensional temperature distribution image and an equivalent emissivity distribution image of the billet surface, which are used for temperature monitoring and billet surface condition analysis during continuous casting.

[0069] Another embodiment of this application discloses an industrial metal surface measurement system based on infrared imaging, such as... Figure 5 As shown, it includes: The acquisition module is used to acquire radiation data of industrial metal surfaces under multiple infrared waves using multiple spectral channels; wherein each spectral channel is used to receive infrared waves of different wavelength ranges; the radiation data is the initial image information of the corresponding radiation and radiation intensity distribution generated under the action of each infrared wave at the same time.

[0070] The preprocessing module is used to preprocess each initial image information to generate effective radiation imaging information corresponding to each infrared wave segment.

[0071] The inversion module is used to fit the radiation intensity in each of the effective radiation imaging information to invert the temperature value and effective emissivity of each pixel in the effective radiation imaging information.

[0072] An integration module is used to integrate the temperature values ​​of all the pixels into the temperature distribution of the industrial metal surface, and to integrate the effective emissivity of all the pixels into the effective emissivity distribution of the industrial metal surface.

[0073] Figure 6 This diagram illustrates a more specific hardware structure of an electronic device provided in this embodiment. The device may include: a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0074] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0075] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0076] The input / output interface 1030 is used to connect input / output modules to realize information input and output. The input / output modules can be configured as components in the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touch screens, microphones, various sensors, etc., and output devices may include displays, speakers, vibrators, indicator lights, etc.

[0077] The communication interface 1040 is used to connect the communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, radio (shortwave / ultra-shortwave) communication, satellite communication, data link communication, etc.).

[0078] Bus 1050 includes pathways for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0079] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments described in this specification, and need not include all the components shown in the figures.

[0080] The electronic device described above is used to implement the corresponding infrared imaging-based industrial metal surface measurement method in any of the foregoing embodiments, and has the beneficial effects of the corresponding method implementation, which will not be elaborated here.

[0081] Based on the same inventive concept, corresponding to any of the above-described embodiments, this application also provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to execute the industrial metal surface measurement method based on infrared imaging as described in any of the above embodiments.

[0082] The computer-readable medium in this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0083] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the industrial metal surface measurement method based on infrared imaging as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0084] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; this manner of description is merely for clarity, and those skilled in the art should consider the specification as a whole. Within the framework of this application, the above embodiments or the technical features of different embodiments can also be appropriately combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0085] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be entirely within the understanding of those skilled in the art). While specific details (e.g., circuits) are set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0086] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0087] The embodiments described herein are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and principles of the embodiments described herein should be included within the protection scope of this application.

Claims

1. A method for measuring industrial metal surfaces based on infrared imaging, characterized in that, The method includes: The radiation data of the industrial metal surface under multiple infrared waves is obtained using multiple spectral channels; wherein each spectral channel is used to receive infrared waves of different wavelength ranges; the radiation data is the initial image information of the corresponding radiation intensity and the radiation intensity distribution generated under the action of each segment of infrared waves at the same time. Each of the initial image information is preprocessed to generate effective radiation imaging information corresponding to each segment of the infrared wave; The radiation intensity in each of the effective radiation imaging information is fitted to retrieve the temperature value and effective emissivity of each pixel in the effective radiation imaging information. The temperature values ​​of all the pixels are integrated into the temperature distribution of the industrial metal surface, and the effective emissivity of all the pixels is integrated into the effective emissivity distribution of the industrial metal surface.

2. The method for measuring industrial metal surfaces based on infrared imaging according to claim 1, characterized in that, The method of acquiring radiation data of the industrial metal surface under multiple infrared waves using multiple spectral channels includes: The initial image information and radiation intensity of each segment of the infrared wave are obtained in real time on the industrial metal surface; The initial image information and the radiation intensity are combined with the pixel coordinates of the industrial metal surface to form the radiation data in the form of a three-dimensional data cube.

3. The method for measuring industrial metal surfaces based on infrared imaging according to claim 1, characterized in that, The step of preprocessing each of the initial image information to generate effective radiation imaging information corresponding to each segment of the infrared wave includes: Select at least one segment of infrared wave initial image information from the plurality of initial image information; A threshold for distinguishing between high temperature and non-high temperature images is set based on the grayscale distribution characteristics of the selected initial image information; Based on the threshold, the non-high temperature portion of each initial image information is extracted as an invalid region; Based on the threshold, the portion of each initial image information that belongs to high temperature is extracted as an effective temperature measurement area, and the initial image information within the effective temperature measurement area is used as the effective radiation imaging information.

4. The method for measuring industrial metal surfaces based on infrared imaging according to claim 1, characterized in that, The step of preprocessing each of the initial image information to generate effective radiation imaging information corresponding to each segment of the infrared wave includes: For each of the initial image information, perform at least one of the following: dark current correction processing, non-uniformity correction processing, channel registration processing, and scene interference recognition processing to generate the effective radiation imaging information corresponding to each segment of the infrared wave.

5. The method for measuring industrial metal surfaces based on infrared imaging according to claim 1, characterized in that, The step of fitting the radiation intensity in each of the effective radiation imaging information to invert the temperature value and effective emissivity of each pixel in the effective radiation imaging information includes: By using logarithmic linearization or least squares fitting, the radiation intensity in each of the effective radiation imaging information is fitted to generate the temperature value and effective emissivity of each pixel in the effective radiation imaging information.

6. The method for measuring industrial metal surfaces based on infrared imaging according to claim 5, characterized in that, The step of using the least squares fitting method to fit the radiation intensity in each of the effective radiation imaging information to generate a temperature value includes: Each of the stated radiation intensities is constructed as follows: I(λ)=ε(λ)×B(λ,T); Where I(λ) is the radiation intensity, λ is the band of the infrared wave, ε(λ) is the true emissivity value in the λ band, B(λ,T) is the Planck blackbody radiation function, and T is the temperature value. The multiple models corresponding to the multiple radiation intensities are combined into an overdetermined set of equations, and the temperature value is calculated using the overdetermined set of equations.

7. The method for measuring industrial metal surfaces based on infrared imaging according to claim 6, characterized in that, The effective emissivity is calculated according to the following power model: e(λ)=a0+a1λ+a2λ 2 ; Where a0, a1, and a2 are the coefficients of the power model; The spectral channels are configured with at least four, and at least four power models are established using the wavelengths received by the at least four spectral channels to calculate the coefficients of the power models and the temperature value.

8. The method for measuring industrial metal surfaces based on infrared imaging according to claim 7, characterized in that, The spectral channels are provided with at least 9 channels, and the infrared wave bands are provided with at least 9 bands.

9. The method for measuring industrial metal surfaces based on infrared imaging according to claim 1, characterized in that, The step of fitting the radiation intensity in each of the effective radiation imaging information to invert the temperature value and effective reflectance of each pixel in the effective radiation imaging information includes: Compare the radiation data corresponding to each segment of the infrared wave; If it is found that the consistency of one of the radiation data with the other radiation data does not meet the preset requirements, the spectral channel corresponding to the discovered radiation data is an abnormal channel; When fitting the radiation intensity in each of the effective radiation imaging information, the computational weight of the abnormal channel is reduced, and the temperature value of each pixel is retrieved.

10. An industrial metal surface measurement system based on infrared imaging, characterized in that, The system includes: The acquisition module is used to acquire radiation data of the industrial metal surface under multiple infrared waves using multiple spectral channels; wherein each spectral channel is used to receive infrared waves of different wavelength ranges; the radiation data is the initial image information of the corresponding radiation intensity and the radiation intensity distribution generated under the action of each segment of infrared waves at the same time. The preprocessing module is used to preprocess each of the initial image information to generate effective radiation imaging information corresponding to each segment of the infrared wave; The inversion module is used to fit the radiation intensity in each of the effective radiation imaging information to invert the temperature value and effective emissivity of each pixel in the effective radiation imaging information; An integration module is used to integrate the temperature values ​​of all the pixels into the temperature distribution of the industrial metal surface, and to integrate the effective emissivity of all the pixels into the effective emissivity distribution of the industrial metal surface.

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