A PCBA one-stop pricing and production coordination system and method

Abstract

The application relates to the technical field of electronic manufacturing services and intelligent manufacturing, and discloses a PCBA one-stop pricing and production cooperation system and method, which comprises a BOM dynamic cracking unit: used for receiving a BOM list uploaded by a user, extracting material codes, and generating a dynamic quotation tree according to a preset procurement cost database and a substitute material strategy; a DFM process mapping module: used for analyzing a PCB graphic file, extracting line width / line spacing, aperture ratio and panel rate, and calculating a process difficulty correction coefficient; one: shortening a traditional 3-5-day quotation cycle to within one hour, realizing second-level analysis and cost accounting of materials through BOM intelligent cracking and substitute material fuzzy matching algorithms; two: realizing a full-process data closed loop of design-quotation-production, and avoiding price increase disputes in the later period by predicting production bottlenecks through the DFM process mapping module in the quotation stage; three: realizing real-time linkage between the quotation system and real production capacity through a production line digital twin scheduling module, and achieving an accuracy rate of 95% or above for a delivery date commitment.

Description

Technical Field

[0001] This invention relates to the technical field of electronic manufacturing services and intelligent manufacturing, and in particular to a one-stop PCBA pricing and production collaboration system and method. Background Technology

[0002] PCBA (Printed Circuit Board Assembly) is a core manufacturing process for electronic products, encompassing multiple technical steps such as PCB bare board manufacturing, electronic component procurement, solder paste printing, surface mount technology (SMT), reflow soldering, wave soldering, through-hole assembly, depaneling, testing, and conformal coating. With the rapid development of consumer electronics, automotive electronics, medical equipment, and communication terminals, PCBA manufacturing demands are characterized by "multiple varieties, small batches, short lead times, and high complexity."

[0003] The existing PCBA pricing relies on manual verification of the BOM list, which has problems such as material errors and omissions, inability to link production capacity in real time, and a disconnect between pricing and production. Summary of the Invention

[0004] In view of the problems existing in the current PCBA one-stop pricing and production collaboration system and method, the present invention is proposed.

[0005] Therefore, the purpose of this invention is to provide a one-stop pricing and production collaboration system for PCBA.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: including, BOM Dynamic Splitting Unit: Used to receive the BOM list uploaded by the user, extract the material codes, and generate a dynamic quotation tree based on the preset procurement cost library and alternative material strategy; DFM process mapping module: used to parse PCB graphic files, extract line width / line spacing, hole diameter ratio and panelization rate, and calculate process difficulty correction coefficient; Production line digital twin scheduling module: Real-time access to the operating status data of the SMT placement machine group to generate usable time slots; Collaborative pricing system: Generates a final fixed price quote based on the dynamic pricing tree, the process difficulty correction coefficient, and the urgency premium of the time slot.

[0007] As a preferred embodiment of the PCBA one-stop pricing and production collaboration system described in this invention, the BOM dynamic splitting unit includes: A component fuzzy matching algorithm based on impedance matching automatically matches alternative materials that meet electrical parameters (capacitance, withstand voltage, and accuracy) when the model provided by the user is not in stock, and marks the price difference.

[0008] As a preferred embodiment of the PCBA one-stop pricing and production collaboration system described in this invention, the DFM process mapping module includes: Bottleneck process early warning submodule: Used to detect the BGA (Ball Grid Array) package pitch. If the pitch is less than 0.4mm, it will automatically trigger the "high-precision placement surcharge" and suggest using the X-RAY inspection path.

[0009] As a preferred embodiment of the PCBA one-stop pricing and production collaboration system described in this invention, the production line digital twin scheduling module adopts a time-axis game theory algorithm; when a new order is inserted, the system automatically calculates whether it encroaches on the capacity of the original order and generates a "queue-jumping premium coefficient" for the user to select.

[0010] As a preferred embodiment of the method for a one-stop PCBA pricing and production collaboration system described in this invention, the method includes the following steps: S1: Input phase, user uploads project package, system performs error-proof verification; S2: The cracking stage breaks down the BOM into materials to be purchased, materials in stock, and materials supplied by customers; S3: In the sand table simulation stage, orders are placed into a virtual production line for batch processing to obtain the earliest completion date; S4: Lock-in phase. After the user pays the deposit, the system automatically generates a material preparation list and locks the inventory.

[0011] As a preferred embodiment of the PCBA one-stop pricing and production collaboration system and method described in this invention, step S2 further includes: determining whether the BOM uploaded by the user is a board modification project by associating with historical transaction data; if so, only the photoplotting fee of the change layer and the material placement fee involved in the board modification are calculated.

[0012] As a preferred embodiment of the PCBA one-stop pricing and production collaboration system and method described in this invention, it further includes a quality backtracking anchor point: the system associates the unique ID of the pricing stage with the file name of the placement machine program in the production stage, realizing one-click reverse lookup from "quotation" to "placement data".

[0013] As a preferred embodiment of the PCBA collaborative pricing terminal described in this invention, it includes a user interface that uses a "slider-type delivery date selector": the closer the delivery date is, the more exponentially the emergency service fee calculated by the system increases and is displayed in real time.

[0014] As a preferred embodiment of the PCBA collaborative pricing terminal described in this invention, the interface further includes a 3D DFM heatmap overlay layer, which is used to highlight areas exceeding the factory's process capabilities (such as areas with too small a spacing) in red on the Gerber graphic, and directly display "the additional cost required to repair this defect" on the right side.

[0015] As a preferred embodiment of the PCBA one-stop pricing and production collaboration system described in this invention, it further includes a blockchain evidence storage module, which is used to put the final negotiated quotation, BOM version and delivery commitment hash value on the blockchain to prevent contract disputes caused by changes in PCB board model or component brand later.

[0016] The beneficial effects of this invention are: First, the traditional 3-5 day quotation cycle is shortened to less than 1 hour. Through the intelligent BOM decomposition and fuzzy matching algorithm for alternative materials, the material analysis and cost accounting are realized in seconds. Second, it achieves a closed-loop data process from design to quotation to production. The DFM process mapping module can predict production bottlenecks during the quotation stage, avoiding disputes over price increases later. Third, through the production line digital twin scheduling module, the quotation system is linked with the actual production capacity in real time, and the delivery date commitment accuracy rate reaches more than 95%. Fourth, the blockchain-based evidence storage module ensures the immutability of the quotation, providing a traceable legal basis for future contract disputes; Fifth, by using quality backtracking anchors, we have achieved full-chain traceability from quotation to patch data, which greatly improves the efficiency of engineering changes and problem investigation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall architecture of the PCBA one-stop pricing and production collaboration system described in this invention.

[0018] Figure 2 This is a flowchart illustrating the workflow of the BOM dynamic fragmentation unit described in this invention.

[0019] Figure 3 This is a schematic diagram of the time axis game algorithm of the production line digital twin scheduling module described in this invention.

[0020] Figure 4This is a schematic diagram of the 3D DFM heatmap and slider-type delivery date selector in the user interface described in this invention. Detailed Implementation

[0021] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0022] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0024] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth. Example 1

[0025] Reference Figure 1-4 This is the first embodiment of the present invention, which provides a one-stop pricing and production collaboration system and method for PCBA. BOM Dynamic Splitting Unit: Used to receive the BOM list uploaded by the user, extract the material codes, and generate a dynamic quotation tree based on the preset procurement cost library and alternative material strategy; DFM process mapping module: used to parse PCB graphic files, extract line width / line spacing, hole diameter ratio and panelization rate, and calculate process difficulty correction coefficient; Production line digital twin scheduling module: Real-time access to the operating status data of the SMT placement machine group to generate usable time slots; Collaborative pricing tool: Generates a final fixed price quote based on the dynamic price tree, process difficulty correction coefficient, and urgency premium of the time slot.

[0026] The BOM dynamic fragmentation unit includes: A component fuzzy matching algorithm based on impedance matching automatically matches alternative materials that meet electrical parameters (capacitance, withstand voltage, and accuracy) when the model provided by the user is not in stock, and marks the price difference.

[0027] The DFM process mapping module includes: Bottleneck process early warning submodule: Used to detect the BGA (Ball Grid Array) package pitch. If the pitch is less than 0.4mm, it will automatically trigger the "high-precision placement surcharge" and suggest using the X-RAY inspection path.

[0028] The production line digital twin scheduling module uses a time-axis game theory algorithm; when a new order is inserted, the system automatically calculates whether it will crowd out the capacity of the original order and generates a "queue-jumping premium coefficient" for the user to choose from.

[0029] Includes the following steps: S1: Input phase, user uploads project package, system performs error-proof verification; S2: The cracking stage breaks down the BOM into materials to be purchased, materials in stock, and materials supplied by customers; S3: In the sand table simulation stage, orders are placed into a virtual production line for batch processing to obtain the earliest completion date; S4: Lock-in phase. After the user pays the deposit, the system automatically generates a material preparation list and locks the inventory.

[0030] Scenario: User A needs to manufacture 1000 IoT smart home control boards. Each control board contains 187 components, including a main control chip, power management chip, Wi-Fi module, memory chip, resistors, and capacitors. User A has uploaded a Bill of Materials (BOM) in Excel format and PCB design files in Gerber RS-274X format.

[0031] Specific implementation steps: Step 1: Data Access and Foolproof Verification User A uploads the project package via the web interface or API. The system's data access layer first performs a foolproof verification: checking whether the file format is compliant and whether the BOM list contains the necessary fields (material number, package, quantity, and tag number). After the verification is successful, the system generates a unique 32-bit order fingerprint ID for the order: PCBA-20251022-0001.

[0032] Step 2: Dynamic Fragmentation of BOM The BOM dynamic decomposition unit is started. This unit has a built-in natural language processing-based material parser that can recognize non-standard descriptions such as "10uF / 16V / X7R / 0603" and standardize them into EIA-724 standard package codes.

[0033] During the analysis, the system found that item 37, the main control chip "STM32F103C8T6" (STMicroelectronics, LQFP-48 package), was marked as "out of stock - lead time 20 weeks" in the procurement cost database.

[0034] At this point, the BOM dynamic decomposition unit invokes a component fuzzy matching algorithm based on impedance matching. The core mathematical model of this algorithm is as follows: MatchScore=α⋅Simelec+β⋅Simpkg+γ⋅Simcost Simelec is the electrical parameter similarity (considering core architecture, clock speed, FLASH capacity, number of pins, and operating voltage). Simpkg scores package compatibility (taking into account pin pitch, body size, and thermal pad location). Simcost represents the cost-effectiveness score. α, β, and γ are weighting coefficients, which are set to 0.6, 0.3, and 0.1 respectively in this embodiment. Through algorithm matching, the system found that "GD32F303CBT6" (GigaDevice, domestically compatible) has an electrical compatibility of 98%, is fully packaged (both are LQFP-48, pin pitch 0.5mm), and is currently in stock.

[0035] Technical Results: This embodiment implements a collaborative mechanism of "quoting and locking in materials simultaneously," completely resolving the deadlock problem of "no materials available after quotation approval" caused by the shortage of original manufacturer chips in the traditional model. Simultaneously, by proactively recommending alternative material solutions, it saves users 39% on material costs and shortens delivery time by 72%. Example 2

[0036] Reference Figure 3 This is the second embodiment of the present invention, which differs from the first embodiment in that it focuses on the collaborative method for emergency order insertion scheduling based on digital twin and time axis game theory algorithm.

[0037] Scenario: User B is a medical equipment manufacturer. The main control boards of its portable electrocardiographs are experiencing batch failures at end-user sites. Investigation reveals the cause to be a faulty solder joint on a certain batch of surface-mount capacitors. User B urgently needs to repair and re-install 500 high-frequency microwave boards, requiring delivery within 24 hours to replace hospital equipment.

[0038] At this time, the factory's SMT production line was already running at full capacity - the day shift (8:00-20:00) had scheduled production for three customers' orders totaling 150,000 SMT placements, and the night shift (20:00-8:00 the next day) was normally scheduled for equipment maintenance. Example 3

[0039] Reference Figure 4 This is the third embodiment of the present invention, which focuses on the price locking, engineering collaboration and blockchain evidence storage methods based on DFM heatmap.

[0040] Step S2 further includes: determining whether the BOM uploaded by the user is a redesign project by associating with historical transaction data; if so, only the photoplotting fee of the change layer and the material patching fee involved in the redesign are calculated.

[0041] It also includes a quality backtracking anchor: the system associates the unique ID of the pricing stage with the file name of the pick-and-place machine program in the production stage, enabling one-click reverse lookup from "quotation" to "pick-and-place data".

[0042] It includes a user interface that uses a "slider-style delivery date selector": the closer the delivery date is, the more exponentially the emergency service fee calculated by the system will increase and be displayed in real time.

[0043] The interface also includes a 3D DFM heatmap overlay, which highlights areas that exceed the factory's process capabilities (such as areas with too small a spacing) in red on the Gerber graph and displays "Additional cost to fix this defect" directly on the right.

[0044] It also includes a blockchain evidence storage module, which is used to put the final negotiated quotation, BOM version and delivery commitment hash value on the blockchain to prevent contract disputes caused by changes in PCB board model or component brand later.

[0045] Scenario: User C is a hardware engineer at a startup hardware company. The team designed an LED light board with an extremely narrow bezel for a high-end stage lighting control system. The PCB design includes numerous fine traces with a line width of 0.09mm and a spacing of 0.1mm, and contains BGA-packaged LED driver chips with a 0.35mm pitch. User C uploaded the design to a platform seeking rapid prototyping.

[0046] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims. Furthermore, for the purpose of providing a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features not relevant to the currently considered best mode for carrying out the invention, or those features not relevant to implementing the invention) may be omitted.

[0047] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A one-stop pricing and production collaboration system for PCBA, characterized in that: include, BOM Dynamic Splitting Unit: Used to receive the BOM list uploaded by the user, extract the material codes, and generate a dynamic quotation tree based on the preset procurement cost library and alternative material strategy; DFM process mapping module: used to parse PCB graphic files, extract line width / line spacing, hole diameter ratio and panelization rate, and calculate process difficulty correction coefficient; Production line digital twin scheduling module: Real-time access to the operating status data of the SMT placement machine group to generate usable time slots; Collaborative pricing system: Generates a final fixed price quote based on the dynamic pricing tree, the process difficulty correction coefficient, and the urgency premium of the time slot.

2. The PCBA one-stop pricing and production collaboration system according to claim 1, characterized in that: The BOM dynamic fragmentation unit include: A component fuzzy matching algorithm based on impedance matching automatically matches alternative materials that meet electrical parameters (capacitance, withstand voltage, and accuracy) when the model provided by the user is not in stock, and marks the price difference.

3. The PCBA one-stop pricing and production collaboration system according to claim 1, characterized in that: The DFM process mapping module includes: Bottleneck process early warning submodule: Used to detect the BGA (Ball Grid Array) package pitch. If the pitch is less than 0.4mm, it will automatically trigger the "high-precision placement surcharge" and suggest using the X-RAY inspection path.

4. The PCBA one-stop pricing and production collaboration system according to claim 1, characterized in that: The production line digital twin scheduling module adopts a time-axis game theory algorithm; when a new order is inserted, the system automatically calculates whether it will squeeze the capacity of the original order and generates a "queue-jumping premium coefficient" for the user to choose.

5. The method for a one-stop PCBA pricing and production collaboration system according to claims 1-4, characterized in that: Includes the following steps: S1: Input phase, user uploads project package, system performs error-proof verification; S2: The cracking stage breaks down the BOM into materials to be purchased, materials in stock, and materials supplied by customers; S3: In the sand table simulation stage, orders are placed into a virtual production line for batch processing to obtain the earliest completion date; S4: Lock-in phase. After the user pays the deposit, the system automatically generates a material preparation list and locks the inventory.

6. The PCBA one-stop pricing and production collaboration system and method according to claim 5, characterized in that: Step S2 further includes: determining whether the BOM uploaded by the user is a modification project by associating with historical transaction data; if so, only the photoplotting fee of the change layer and the material patching fee involved in the modification are calculated.

7. The PCBA one-stop pricing and production collaboration system and method according to claim 5, characterized in that: It also includes a quality backtracking anchor: the system associates the unique ID of the pricing stage with the file name of the pick-and-place machine program in the production stage, enabling one-click reverse lookup from "quotation" to "pick-and-place data".

8. A PCBA collaborative pricing terminal according to claim 7, characterized in that: It includes a user interface that uses a "slider-style delivery date selector": the closer the delivery date is, the more exponentially the emergency service fee calculated by the system will increase and be displayed in real time.

9. A PCBA collaborative pricing terminal according to claim 8, characterized in that: The interface also includes a 3D DFM heatmap overlay layer, which highlights areas that exceed the factory's process capabilities (such as areas with too small a spacing) in red on the Gerber graphic and displays "Additional cost required to repair this defect" directly on the right.

10. A PCBA one-stop pricing and production collaboration system according to claim 9, characterized in that: It also includes a blockchain evidence storage module, which is used to put the final negotiated quotation, BOM version and delivery commitment hash value on the blockchain to prevent contract disputes caused by changes in PCB board model or component brand later.

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