A high-precision multi-channel digital acquisition device with radial uniform temperature dissipation

Abstract

The application discloses a high-precision multi-channel digital acquisition device with radial temperature equalization and heat dissipation, which comprises a circular platform base and a cluster line mounting plate. The first set of positioning members and the second set of positioning members are arranged on the circular platform base at intervals. The first set of positioning members is composed of first positioning pins and second positioning pins arranged along the circumference of the circular platform base at intervals. The second set of positioning members is composed of two third positioning pins arranged along the circumference of the circular platform base at intervals. Two pin sleeves are also arranged on the cluster line mounting plate at intervals along the circumference, and the third positioning pins are inserted into the pin sleeves. A PCB board is arranged in the circular platform base, and a plurality of cables are also arranged on the cluster line mounting plate. The plurality of cables are connected with the PCB board through SMP connectors. The first set of positioning members and the second set of positioning members solve the problem of over-constraint and ensure the coaxiality of blind insertion. In combination with the SMP connectors, the axial and radial errors are compensated, the connector is fully engaged, and there is no risk of deflection.

Description

Technical Field

[0001] This invention belongs to the field of radio frequency technology, and specifically relates to a high-precision multi-channel digital acquisition device with radial uniform heat dissipation. Background Technology

[0002] The technological iteration of modern active phased array and multi-beam detection equipment focuses on the sampling accuracy and channel amplitude and phase consistency of the PCB (Printed Circuit Board) multi-channel digital processing board. In the digital hardware architecture, the signal processing capability of the PCB board relies entirely on the specifications of the onboard ADC (Analog-to-Digital Converter) and FPGA (Field-Programmable Gate Array) core components to achieve iteration. Without changing the overall mechanical structure, by replacing the CX7443 series acquisition chip and JFM7VX690T main control chip with different parameters, it is possible to achieve a sampling rate ranging from GSPS (Giga Samples Per Second) and flexible switching of RF input frequency bands from shortwave to microwave. Modularization and platformization have become the mainstream development direction of RF digital hardware.

[0003] With the rapid development of radio frequency (RF) systems such as phased array radar, 5G communication, and satellite navigation, the number of RF front-end channels is constantly increasing, and the system integration is becoming more sophisticated. This places higher demands on the convenience, reliability, and space utilization of connections between RF modules. Blind mating technology, due to its ability to complete mating without direct viewing or precise positioning, has become an important development direction in the field of high-density RF interconnects. Currently, direct connection of RF cables to PCB pads and unguided SMP (Sub-Miniature Push-on) adapters are mainly used.

[0004] The above solution has the following problems: When RF cables are directly connected to PCB pads and require mass assembly, manual assembly cannot guarantee that the bending curvature and routing length of each coaxial cable are completely consistent. The transmission delay of RF signals in coaxial cables varies with the cable length. When the same input RF signal reaches the PCB RF pads through cables of different lengths, the phase shifts. Relying solely on SMP adapters without mechanical positioning constraints, coupled with the cumulative tolerances of PCB board processing, base machining, and connector assembly, the error is even greater. Summary of the Invention

[0005] To address the aforementioned problems in the existing technology, this invention provides a high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation. The technical problem to be solved by this invention is achieved through the following technical solution: This invention provides a high-precision multi-channel digital acquisition device with radial uniform heat dissipation, comprising: a circular platform base and a bundled line mounting plate; The circular platform base is provided with a first set of positioning components and a second set of positioning components at intervals. The first set of positioning components consists of a first positioning pin and a second positioning pin spaced apart along the circumference of the circular platform base. The bundled wire mounting plate is located above the circular platform base. The bundled wire mounting plate is provided with pin holes and waist holes spaced apart along the circumference. The first positioning pin and the pin hole are transitionally fitted, and the second positioning pin and the waist hole are clearance fitted. The second set of positioning components consists of two third positioning pins spaced apart along the circumference of the circular platform base. The bundled wire mounting plate is also provided with two pin sleeves spaced apart along the circumference, and the third positioning pins are inserted into the pin sleeves. A PCB board is installed inside the circular platform base, and multiple cables are also installed on the bundled cable mounting plate. All of the cables are connected to the PCB board via SMP connectors.

[0006] Preferably, a locking pin sleeve flange fastener is connected to the third positioning pin.

[0007] Preferably, the SMP connector includes: an SMP-KK type plug and an SMP-J type socket; A base is fixed on the PCB board, and the top of the base passes through the wall of the circular platform base and connects to the SMP-KK type plug. The bundled cable mounting plate is provided with interconnected wire holes and mounting holes. The diameter of the mounting holes is larger than the diameter of the wire holes. An SMP-J type socket is provided in the mounting holes. The upper end of an SMP-KK type plug is inserted into the lower end of the SMP-J type socket. The upper end of the SMP-J type socket is connected to the cable. The cable passes through the wire holes. A spring is fitted on the upper end of the SMP-J type socket. The spring is located in the mounting holes.

[0008] Preferably, the lower end of the SMP-J type socket is provided with a flared guide opening.

[0009] Preferably, a washer is provided at the top of the spring, and the washer is fitted onto the upper end of the SMP-J type socket.

[0010] Preferably, a locking nut is fitted at the lower end of the SMP-J type socket, and the locking nut is located inside the mounting hole.

[0011] Preferably, the bottom of the circular platform base is provided with a bottom heat dissipation component, which includes a shell and heat dissipation fins; The outer shell is disc-shaped, and multiple radially distributed heat dissipation fins are provided inside the outer shell. A heat-conducting boss is provided between adjacent heat dissipation fins, and the heat-conducting boss abuts against the PCB board. An air inlet and an air outlet are provided at the bottom of the outer shell.

[0012] Preferably, the bottom wall of the outer casing has a plurality of air inlets arranged circumferentially in the region away from the center.

[0013] Preferably, a mounting platform is provided in the central area of ​​the bottom wall of the outer shell, and a plurality of air outlets are provided on the mounting platform. The air outlets penetrate the walls of the outer shell and the mounting platform, and a centrifugal fan is provided inside the air outlets.

[0014] Preferably, the outer shell is connected to the circular platform base by screws.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: In the high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided by this invention, the first positioning pin and pin hole transition fit serve as guides and positions, determining the installation center reference of the bundled wire mounting plate and the circular platform base. The second positioning pin and waist hole have a clearance fit, utilizing the small amount of play reserved in the waist hole to release dimensional tolerances introduced during the machining of the bundled wire mounting plate and the circular platform base. This ensures high positioning accuracy while avoiding the problems of over-constraint jamming and forced misalignment of local connectors that occur with conventional double-circle hole full-constraint positioning. The third positioning pin is inserted into the pin sleeve to fix the circular platform base and the bundled wire mounting plate, eliminating assembly gaps after docking. The over-constraint problem is solved by the first and second sets of positioning components, ensuring blind mating coaxiality. Combined with the SMP connector, axial and radial errors are compensated simultaneously, ensuring full connector engagement and eliminating the risk of misalignment.

[0016] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the separation state of a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the engagement state of a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of a bundled line mounting plate in a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of a circular platform base in a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention; Figure 5 This is a cross-sectional view of the circular platform base in a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the PCB board in the circular platform base of a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention; Figure 7 yes Figure 5 Enlarged view of point A; Figure 8 This is a schematic diagram of the SMP-KK type plug and SMP-J type socket in the circular platform base of a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention before they are inserted. Figure 9 This is a schematic diagram of the SMP-KK type plug and SMP-J type socket being inserted in a circular platform base of a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention. Figure 10 This is a schematic diagram showing the SMP-KK type plug and SMP-J type socket in the circular platform base of a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention. Figure 11 This is a schematic diagram of the bottom heat dissipation component in the circular platform base of a high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of the air inlet and outlet in the circular platform base of a high-precision multi-channel digital acquisition device with radial uniform heat dissipation provided in an embodiment of the present invention.

[0018] Reference numerals: 1-Circular platform base, 2-Bulk cable mounting plate, 3-First set of positioning components, 4-Second set of positioning components, 5-PCB board, 6-Cable, 7-SMP connector, 8-Bottom heat dissipation assembly, 201-Pin hole, 202-Waist hole, 203-Pin sleeve, 301-First positioning pin, 302-Second positioning pin, 401-Third positioning pin, 701-SMP-KK type plug, 702-SMP-J type socket, 703-Base, 704-Wire hole, 705-Mounting hole, 706-Spring, 707-Washer, 708-Locking nut, 801-Housing, 802-Heat dissipation fins, 803-Heat-conducting boss, 804-Air inlet, 805-Air outlet, 806-Mounting platform, 807-Centrifugal fan. Detailed Implementation

[0019] The present invention will be further described in detail below with reference to specific embodiments, but the implementation of the present invention is not limited thereto.

[0020] Please see Figure 1-6 The present invention provides a high-precision multi-channel digital acquisition device with radial uniform heat dissipation, comprising: a circular platform base 1 and a bundled line mounting plate 2; A first set of positioning components 3 and a second set of positioning components 4 are spaced apart on a circular platform base 1. The first set of positioning components 3 consists of a first positioning pin 301 and a second positioning pin 302 spaced apart along the circumference of the circular platform base 1. A bundled wire mounting plate 2 is located above the circular platform base 1. The bundled wire mounting plate 2 has pin holes 201 and waist holes 202 spaced apart along the circumference. The first positioning pin 301 and the pin hole 201 are transitionally fitted, and the second positioning pin 302 and the waist hole 202 are clearance-fitted. The diameter of the waist hole 202 is larger than the diameter of the second positioning pin 302. The second set of positioning components 4 consists of two... The circular platform base 1 consists of a third positioning pin 401 spaced circumferentially. Two pin sleeves 203 are also spaced circumferentially on the bundled line mounting plate 2, and the third positioning pins 401 are inserted into the pin sleeves 203. During multi-channel synchronous blind mating, the pin holes 201 lock the lateral and longitudinal reference positions, and the waist holes 202 compensate for minor assembly deviations in multiple directions, ensuring that the entire SMP connector array is coaxially aligned. This guarantees that the physical lengths of each RF feeder connected to the PCB board are basically the same from the assembly source, avoiding the deformation of the pads caused by individual channel connector misalignment squeezing the PCB board's RF interface. This positioning structure directly reduces the RF path dispersion at the PCB board input end caused by connector eccentricity and is a crucial pre-construction structure for ensuring phase consistency across multiple channels on the PCB board.

[0021] A PCB board 5 is housed within the circular platform base 1. This PCB is a multi-channel digital processing board, on which components such as the CX7443 and FM7VX690T chips are mounted. Multiple cables 6 are mounted on the bundled cable mounting plate 2, and all cables 6 are connected to the PCB board 5 via SMP connectors 7. These cables 6 connect to multiple RF signals, and the circular platform base 1 serves as the mounting carrier for the entire RF interface. Optionally, the circular platform base 1 is divided into four groups along its circumference, totaling 128 SMP blind-mating interfaces. These interfaces utilize SMP-J and SMP-KK connectors for connection, with the insertion and extraction friction being half that of a semi-escapement connector, ensuring complete disengagement of the SMP-KK connector when the module is separated. In some embodiments of the present invention, during the installation of the high-precision multi-channel digital acquisition device with radial uniform heat dissipation, the first set of positioning parts 3 and the second set of positioning parts 4 are aligned in one step to complete the positioning and installation of the circular platform base 1 and the bundled wire mounting plate 2. Multiple cables and the PCB board 5 are also aligned and connected through the SMP connector 7, resulting in high positioning accuracy and high installation efficiency. The first positioning pin 301 and the pin hole 201 are transitionally fitted to guide and position the installation center reference of the bundled wire mounting plate 2 and the circular platform base 1. The second positioning pin 302 and the waist hole 202 are clearance fitted, and the small amount of play reserved in the waist hole 202 is used to release the dimensional tolerances brought about by the processing of the bundled wire mounting plate 2 and the circular platform base 1. This ensures high positioning accuracy and avoids the problems of over-constraint jamming and forced eccentricity of local connectors that occur in conventional double circular hole full constraint positioning. The third positioning pin 401 is inserted into the pin sleeve 203 to fix the circular platform base 1 and the bundled wire mounting plate 2, eliminating the assembly gap after docking. The over-constraint problem is solved by the first and second sets of positioning parts, ensuring the coaxiality of blind mating. Combined with the SMP connector, it simultaneously compensates for axial and radial errors, ensuring full connector engagement and eliminating the risk of misalignment.

[0022] In some embodiments of the present invention, a locking pin flange fastener is connected to the third positioning pin 401. The locking pin flange fastener can rigidly lock the circular platform base 1 and the bundled line mounting plate 2, fixing the relative position of the bundled line mounting plate 2 and the PCB board 5, preventing the SMP connector from slowly shifting under vehicle-mounted and airborne vibration and impact conditions. Without a rear-mounted locking structure, long-term vibration of the equipment will cause the SMP connector to slowly shift, the feeder length to change slowly, and the input phase of each CX7443 on the PCB board to gradually drift over the service time, resulting in the overall PCB board performance deteriorating year by year. After the locking structure locks the overall relative position, the RF link size remains constant throughout the entire life cycle, and the RF electrical parameters at the input end of the PCB board remain in the factory calibration state, significantly improving the long-term stability of the PCB board channel parameters.

[0023] In some embodiments of the present invention, see Figure 7-10 The SMP connector 7 includes: an SMP-KK type plug 701 and an SMP-J type socket 702; A base 703 is fixed on the PCB board 5. The top of the base 703 passes through the wall of the circular platform base 1 and is connected to the SMP-KK type plug 701. The bundled cable mounting plate 2 has interconnected wire holes 704 and mounting holes 705. The diameter of the mounting hole 705 is larger than the diameter of the wire hole 704. An SMP-J type socket 702 is installed inside the mounting hole 705. The upper end of an SMP-KK type plug 701 is inserted into the lower end of the SMP-J type socket 702. The upper end of the SMP-J type socket 702 is connected to a cable 6, which passes through the wire hole 704. A spring 706 is fitted onto the upper end of the SMP-J type socket 702, and the spring 706 is located inside the mounting hole 705. Optionally, the 128 SMP connectors are arranged in sections along the circumference of the circular platform base 1. The sockets of the SMP-J type sockets adopt a smooth hole design to reduce insertion and removal friction, ensuring that the connectors completely disengage during disconnection and avoiding interface damage.

[0024] In some embodiments of the present invention, the spring 706 provided inside the SMP connector 7 compensates for the height difference of the base 703 soldered on the PCB board 5, ensuring that the compression amount of each SMP-KK type plug is consistent, preventing overpressure on some channels, damage to the RF pads of the PCB board 5, and avoiding faults such as open circuits in some channels. There is a gap between the upper end of the SMP-J type socket 702 and the inner wall of the mounting hole 705, so that the SMP-J type socket 702 can radially adaptively compensate for a slight centering deviation within 0.311mm. The SMP-KK type plug 701 can meet a maximum angular offset of 3°, so as to cooperate with the positioning structure to control the offset of all SMP connectors 7 within the device tolerance. The transmission loss and delay of each RF signal fed into the CX7443 on the PCB board are highly uniform, and finally, the PCB multi-channel sampling consistency is solidified from the interconnect hardware end.

[0025] In some embodiments of the present invention, see Figure 7 The SMP-J type socket 702 has a flared guide opening at its lower end. During blind insertion of the circular platform base 1 and the bundled cable mounting plate 2, the SMP-KK type plug 701 and the SMP-J type socket 702 may experience radial misalignment. The flared guide opening of the SMP-J type socket 702 guides the SMP-KK type plug 701, causing it to deflect radially by a certain angle before insertion into the SMP-J type socket 702, thus improving installation efficiency.

[0026] In some embodiments of the present invention, see Figure 7 A washer 707 is provided at the top of the spring 706, and the washer 707 is fitted onto the upper end of the SMP-J type socket 702. The washer 707 itself is an elastic element that can provide secondary cushioning when the spring is compressed or extended, absorbing impact energy. The washer 707 provides a flat support platform for the spring, making the pressure distribution more even and preventing the spring from bending laterally or becoming unstable under compression.

[0027] In some embodiments of the present invention, see Figure 7The lower end of the SMP-J type socket 702 is fitted with a locking nut 708, which is located inside the mounting hole 705. The locking nut 708 is used to lock the SMP-J type socket 702 inside the mounting hole 705 to prevent it from moving out.

[0028] In some embodiments of the present invention, see Figure 11-12 The bottom of the circular platform base 1 is provided with a bottom heat dissipation component 8, which includes a shell 801 and heat dissipation fins 802. The outer casing 801 is disc-shaped, and multiple radially distributed heat dissipation fins 802 are arranged inside the casing 801. Thermally conductive protrusions 803 are provided between adjacent heat dissipation fins 802, and the thermally conductive protrusions 803 abut against the PCB board 5. An air inlet 804 and an air outlet 805 are provided at the bottom of the casing 801. The PCB board 5 is disc-shaped, and multiple heat-generating devices are arranged in zones according to power level. The central area contains high-power devices, and the outer periphery contains medium- and low-power devices, forming a power density distribution with a high center and low periphery. The heat dissipation fins 802 are made of aluminum alloy, and the heat dissipation fins are evenly divided at equal angles along the circumference. Optionally, the outer diameter of the heat dissipation fins is 510mm, the height is 22mm, and the thickness is 1.2mm. The structure is integrally milled, and the root smoothly transitions to the chassis to reduce interface thermal resistance. Four JFM7VX690T chips are positioned at the center of PCB 5. This high-heat-generating area features densely packed heatsink fins, enhancing forced convection cooling by increasing the heat exchange area per unit area, rapidly dissipating concentrated heat, and suppressing the formation of localized hotspots. The outer ring houses CX7443 chips, a low-heat-power area with sparsely spaced fins. This reduces overall airflow resistance while meeting cooling requirements, ensuring airflow is prioritized for high-heat areas. The variable-density design achieves precise matching between cooling capacity and PCB heat flux density, overcoming the shortcomings of traditional equal-density fins that result in insufficient central cooling and wasted airflow at the periphery. This reduces the overall temperature gradient across the PCB from an airflow design perspective. All thermally conductive 803 bumps are uniformly fitted with 1mm thick high-thermal-conductivity silicone pads between them and the chips. The controllable compression deformation of these pads compensates for assembly height errors within 0-0.3mm, completely eliminating air gaps between the chips and the heatsink, and stably controlling the interface contact thermal resistance at 0.20℃ / W. The flexible buffer structure avoids damage to PCB components and pads caused by rigid compression, and achieves low-resistance thermal conductivity connection between all chips and heat dissipation structures on the board, ensuring stable heat dissipation from components at different locations on the PCB board and providing a heat conduction path to ensure uniform temperature across the entire board.

[0029] In some embodiments of the present invention, by directly providing a heat-conducting protrusion 803 in the inner cavity of the outer shell 801 that abuts against the PCB board, an additional adapter substrate or heat pipe is eliminated. The thermal resistance of heat from the heat source to the heat dissipation fins is minimized. Heat is directly conducted to the radial heat dissipation fins 802 via the heat-conducting protrusion 803 and is quickly carried away by the forced airflow, effectively controlling the temperature rise of high-power components on the PCB board. Utilizing the circular bottom feature of the circular platform base 1, a disc-shaped outer shell 801 is used in conjunction with radial heat dissipation fins 802, fitting the internal space of the circular structure and expanding the heat dissipation area within a limited thickness. Integrating the heat dissipation structure with the bottom shell does not increase the volume of the device, which is conducive to the development of a thinner device. Multiple heat dissipation fins 802 are radially distributed, naturally forming multiple uniform air channels radiating from the center to the periphery. Combined with the convection structure of central air outlet and peripheral air intake, the airflow can sweep evenly across each fin without obstruction, avoiding the uneven airflow distribution and local vortex dead zones in traditional rectangular heat sinks, and improving the convective heat transfer coefficient. The thermally conductive bosses 803 are positioned between adjacent heat dissipation fins 802, resulting in a discrete distribution of the contact surface. This method can avoid numerous tiny components on the back of the PCB board and facilitates flexible compensation of the PCB board's flatness error and assembly tolerance through the thermally conductive interface material. The contact stress is uniform, preventing excessive bending or damage to the circuit board and ensuring long-term reliability.

[0030] In some embodiments of the present invention, the heat dissipation fins 802 extend radially along the PCB board 5, and are radially distributed, extending uniformly from the center to the circumference. Each heat-generating device on the PCB board 5 corresponds one-to-one with each heat-conducting protrusion 803. The height of the protrusions can be adjusted according to the height difference of the devices to ensure close contact with the devices. The density of the heat dissipation fins 802 is positively correlated with the power density of each heat-generating device, with a higher density of heat dissipation fins in the central area to match the heat dissipation requirements of high-power devices. Through the radial heat dissipation fins 802 and the differentiated heat-conducting protrusions 803, close contact and heat conduction with all heat-generating devices on the PCB board 5 are achieved. The fin density matches the power distribution, solving the problem of local hot spots in the central area. The temperature difference of the devices inside the outer casing 801 is less than 5°C, and the junction temperature of the core device is reduced by 20°C.

[0031] In some embodiments of the present invention, see Figure 12Multiple air inlets 804 are arranged circumferentially on the bottom wall of the outer casing 801, away from the center. This allows ambient air to enter the air duct uniformly in a 360° circumference. All CX7443 chips arranged in a ring around the perimeter are cooled in the same temperature and airflow environment, eliminating the problem of inconsistent cooling conditions between front and rear devices caused by traditional one-sided air intake. After entering the air duct, the airflow flows from the outside to the center along the radial heat dissipation fins 802. The flow path coincides with the radial distribution of heat sources on the PCB board. The airflow gradually absorbs heat during the flow process, without eddies, dead zones, or short-circuit airflow. The circumferential air intake and radial heat exchange flow channel design ensures that the airflow flows evenly through all heat dissipation fin areas, improving heat dissipation efficiency by 40% compared to traditional side intake, and is suitable for the heat source distribution of a circular platform.

[0032] In some embodiments of the present invention, see Figure 12 A mounting platform 806 is located at the center of the bottom wall of the outer casing 801. Multiple air outlets 805 are located on the mounting platform 806, penetrating the walls of both the outer casing 801 and the mounting platform 806. A centrifugal fan 807 is installed inside each air outlet 805. Four centrifugal fans 807 are symmetrically arranged at the bottom center of the outer casing 801. All the hot air after heat absorption converges at the center and is uniformly extracted by the fans. Each fan has a wind pressure of 499.16 Pa and an airflow of 0.061 m³ / s. The four fans are connected in parallel to balance the back pressure inside the air duct, avoiding localized airflow loss caused by single-fan deflection. The air duct is physically isolated from the upper blind-insertion structure, ensuring that disassembly and maintenance will not compromise the air duct's airtightness, and maintaining a constant cooling flow field throughout the PCB board's lifespan.

[0033] In some embodiments of the present invention, multiple heat dissipation fins 802 extend from near the center of the inner cavity of the outer shell 801 to the outer edge, forming fan-shaped channels radiating outward from the center. This layout matches the "flow from all sides to the center" suction characteristic of a centrifugal fan. The centrifugal fan is located precisely at the confluence point of all the fan-shaped channels, enabling it to efficiently draw air flowing between the heat dissipation fins 802 with low resistance, ensuring uniform flow velocity in each channel. The centrifugal fan 807 is positioned at the center, drawing air evenly from all sides, matching the geometry of the radial heat dissipation fins. This ensures that each fan-shaped channel bears almost the same heat load, with uniform airflow distribution, eliminating heat dissipation dead zones. Compared to the deflection-flow cooling method with a fan installed on one side, efficiency is significantly improved. The air inlet is located on the outermost ring of the bottom surface of the device, away from the central heat source concentration area and the air outlet, isolating hot and cold airflows, ensuring that only unheated ambient cold air is drawn in, increasing the average heat exchange temperature difference between the heat dissipation fins and the air, and improving heat dissipation efficiency. Centrifugal fan 807 is installed in the central area, drawing away the heated gas that has already undergone heat exchange. The heat generated by the centrifugal fan 807 itself is also discharged along with the main airflow, preventing additional heating of the PCB board from the centrifugal fan. Simultaneously, the central air outlet structure creates a low-pressure zone below the PCB board inside the device, guiding the hot air on the guide plate downwards and enhancing internal air circulation. After the hot air is discharged from the center, a guide shroud can be installed at the bottom of the device as needed to guide the hot air in a specific direction, preventing it from being re-drawn into the air inlet or accumulating at the bottom of the equipment.

[0034] In some embodiments of the present invention, see Figure 12 The outer casing 801 is connected to the circular platform base 1 with screws for easy installation and maintenance. A quick-locking mechanism can also be installed to enable tool-free quick assembly and disassembly of the device, while avoiding the impact of disassembly on the heat dissipation structure. The circular platform base 1 is adapted to the phased array radar array layout. Through the coordinated design of PCB board partitioned component arrangement, dual-stage positioning, and radial heat dissipation structure, the overall integration of the module is improved, making it suitable for high-power, highly integrated RF processing scenarios.

[0035] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0040] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation, characterized in that, include: Circular platform base (1) and bundled line mounting plate (2); The circular platform base (1) is provided with a first set of positioning components (3) and a second set of positioning components (4) at intervals. The first set of positioning components (3) consists of a first positioning pin (301) and a second positioning pin (302) at intervals along the circumference of the circular platform base (1). The bundled wire mounting plate (2) is located above the circular platform base (1). The bundled wire mounting plate (2) is provided with pin holes (201) and waist holes (202) at intervals along the circumference. The first positioning pin (301) and the pin hole (201) are in transition fit, and the second positioning pin (302) and the waist hole (202) are in clearance fit. The second set of positioning components (4) consists of two third positioning pins (401) at intervals along the circumference of the circular platform base (1). The bundled wire mounting plate (2) is also provided with two pin sleeves (203) at intervals along the circumference. The third positioning pins (401) are inserted into the pin sleeves (203). The circular platform base (1) is provided with a PCB board (5), and the bundled wire mounting plate (2) is also provided with multiple cables (6), and the multiple cables (6) are connected to the PCB board (5) through SMP connectors (7). The SMP connector (7) includes: an SMP-KK type plug (701) and an SMP-J type socket (702). A base (703) is fixed on the PCB board (5), and the top of the base (703) passes through the wall of the circular platform base (1) and is connected to the SMP-KK type plug (701). The bundled wire mounting plate (2) is provided with a connected wire hole (704) and a mounting hole (705). The diameter of the mounting hole (705) is larger than the diameter of the wire hole (704). The mounting hole (705) is provided with an SMP-J type socket (702). The upper end of the SMP-KK type plug (701) is inserted into the lower end of the SMP-J type socket (702). The upper end of the SMP-J type socket (702) is connected to the cable (6). The cable (6) passes through the wire hole (704). The upper end of the SMP-J type socket (702) is fitted with a spring (706). The spring (706) is located in the mounting hole (705).

2. The high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation according to claim 1, characterized in that, The locking pin sleeve flange fastener is connected to the third positioning pin (401).

3. The high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation according to claim 1, characterized in that, The lower end of the SMP-J type socket (702) is provided with a flared guide opening.

4. A high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation according to claim 1, characterized in that, A washer (707) is provided at the top of the spring (706), and the washer (707) is sleeved on the upper end of the SMP-J type socket (702).

5. A high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation according to claim 1, characterized in that, The lower end of the SMP-J type socket (702) is fitted with a locking nut (708), which is located inside the mounting hole (705).

6. A high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation according to claim 1, characterized in that, The bottom of the circular platform base (1) is provided with a bottom heat dissipation component (8), which includes a shell (801) and heat dissipation fins (802). The outer shell (801) is disc-shaped, and a plurality of radially distributed heat dissipation fins (802) are provided inside the outer shell (801). A heat-conducting boss (803) is provided between adjacent heat dissipation fins (802), and the heat-conducting boss (803) abuts against the PCB board (5). An air inlet (804) and an air outlet (805) are provided at the bottom of the outer shell (801).

7. A high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation according to claim 6, characterized in that, The bottom wall of the outer casing (801) has a plurality of air inlets (804) arranged circumferentially in the region away from the center.

8. A high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation according to claim 6, characterized in that, A mounting platform (806) is provided in the central area of ​​the bottom wall of the outer shell (801). A plurality of air outlets (805) are provided on the mounting platform (806). The air outlets (805) penetrate the walls of the outer shell (801) and the mounting platform (806). A centrifugal fan (807) is provided inside the air outlets (805).

9. A high-precision multi-channel digital acquisition device with radial uniform temperature heat dissipation according to claim 6, characterized in that, The outer shell (801) is connected to the circular platform base (1) by screws.

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