Mini-led display module and preparation method thereof

Abstract

The application relates to a Mini-LED display module and a preparation method thereof, and relates to the technical field of semiconductor display. In the preparation method of the Mini-LED display module, a plurality of first light conversion modules, a plurality of second light conversion modules and a plurality of third light conversion modules are formed in advance, and then the corresponding first light conversion modules, the second light conversion modules and the third light conversion modules are arranged in the first grooves in the first packaging layer of the driving substrate, which greatly reduces the preparation complexity of the light conversion layer, and in turn reduces the manufacturing cost of the light conversion layer, and the light conversion structure and the light scattering structure are arranged in the glass substrate, which greatly improves the conversion efficiency and the light emission uniformity of the corresponding light conversion module.

Description

Technical Field

[0001] This invention relates to the field of semiconductor display technology, specifically to a Mini-LED display module and its fabrication method. Background Technology

[0002] In the existing process of manufacturing Mini-LED display modules, light-emitting epitaxial wafers are cut into Mini-LED chips with a size of 100-300μm. Then, the Mini-LED chips are transferred in batches onto the driving circuit substrate. A protective encapsulation layer is then prepared on the surface of the Mini-LED chip array, and a light conversion layer is prepared on the protective encapsulation layer. Since there are a large number of Mini-LED chips on the driving substrate, the manufacturing cost of the light conversion layer is greatly increased. How to simplify the manufacturing method of the light conversion layer is a technical hotspot that the industry continues to focus on. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a Mini-LED display module and its manufacturing method.

[0004] To achieve the above objectives, the present invention proposes a method for manufacturing a Mini-LED display module, comprising the following steps: A driving substrate is provided, the driving substrate including a plurality of first pixel electrodes and a plurality of second pixel electrodes.

[0005] Multiple Mini-LED chips are provided, each of which includes a first electrode and a second electrode.

[0006] Multiple Mini-LED chips are transferred to the driving substrate such that the first electrode and the second electrode of each Mini-LED chip are electrically connected to a corresponding first pixel electrode and a second pixel electrode, respectively.

[0007] Next, a first encapsulation layer is formed on the driving substrate, and the first encapsulation layer is patterned to form a plurality of first grooves.

[0008] A glass substrate is provided, on which a plurality of first conical holes of the shape smaller at the top and larger at the bottom and a plurality of second conical holes of the shape larger at the top and smaller at the bottom are formed, with a second conical hole between two adjacent first conical holes, dividing the glass substrate into a first region, a second region and a third region.

[0009] A first light conversion structure is formed in each of the first conical holes in the first region, a second light conversion structure is formed in each of the first conical holes in the second region, a third light conversion structure is formed in each of the first conical holes in the third region, and a light scattering structure is formed in each of the second conical holes in each region.

[0010] The glass substrate is cut into different regions to form multiple first light conversion modules, multiple second light conversion modules, and multiple third light conversion modules.

[0011] Next, the first light conversion module, the second light conversion module, and the third light conversion module are respectively installed in the three adjacent first grooves.

[0012] As a preferred technical solution, a plurality of first trenches are provided on the driving substrate, and a first pixel electrode and a second pixel electrode are provided in each first trench.

[0013] As a preferred technical solution, during the process of transferring the multiple Mini-LED chips to the driving substrate, a portion of each Mini-LED chip is embedded in a first trench.

[0014] As a preferred technical solution, the ratio of the diameter of the large hole of the first tapered hole located on the lower surface of the glass substrate to the diameter of the small hole of the second tapered hole located on the lower surface of the glass substrate is 5-10.

[0015] As a preferred technical solution, the ratio of the diameter of the second tapered hole located on the upper surface of the glass substrate to the diameter of the first tapered hole located on the upper surface of the glass substrate is 5-10.

[0016] As a preferred technical solution, before forming the first light conversion structure, the second light conversion structure, the third light conversion structure and the light scattering structure, a transition layer is formed in each of the first conical holes and each of the second conical holes.

[0017] As a preferred technical solution, the first light conversion structure, the second light conversion structure, and the third light conversion structure respectively convert the light emitted by the Mini-LED chip into a first color, a second color, and a third color. The first color, the second color, and the third color are respectively one of red, green, and blue, and the first color, the second color, and the third color are all different.

[0018] As a preferred technical solution, the first light conversion structure, the second light conversion structure and the third light conversion structure respectively include a resin matrix and light conversion particles distributed in the resin matrix.

[0019] As a preferred technical solution, during the process of setting the first light conversion module, the second light conversion module and the third light conversion module in three adjacent first grooves respectively, each light conversion module has a gap with the corresponding first groove, and a second encapsulation layer is formed on the first encapsulation layer, with a part of the second encapsulation layer embedded in the gap.

[0020] The present invention also proposes a Mini-LED display module, which is prepared by the above-described method for preparing a Mini-LED display module.

[0021] The beneficial effects of this invention are as follows: In the method for fabricating a Mini-LED display module of the present invention, a glass substrate is provided, and a plurality of first conical holes with a shape smaller at the top and larger at the bottom and a plurality of second conical holes with a shape larger at the top and smaller at the bottom are formed on the glass substrate. A second conical hole is located between two adjacent first conical holes, dividing the glass substrate into a first region, a second region, and a third region. A first light conversion structure is formed in each first conical hole in the first region, a second light conversion structure is formed in each first conical hole in the second region, and a third light conversion structure is formed in each first conical hole in the third region. A second conical hole is formed in each of the second conical holes in each region. A light scattering structure is formed in the aperture, and each region of the glass substrate is cut to form multiple first light conversion modules, multiple second light conversion modules, and multiple third light conversion modules. Then, the corresponding first light conversion modules, second light conversion modules, and third light conversion modules are set in the first groove of the first encapsulation layer of the driving substrate. By pre-preparing the first light conversion modules, second light conversion modules, and third light conversion modules, the fabrication complexity of the light conversion layer is greatly reduced, thereby reducing the manufacturing cost of the light conversion layer. Furthermore, setting the light conversion structure and light scattering structure in the glass substrate greatly improves the conversion efficiency and light emission uniformity of the corresponding light conversion modules. Attached Figure Description

[0022] Figure 1 The diagram shown is a schematic representation of the structure of the driving substrate in an embodiment of the present invention.

[0023] Figure 2 The diagram shows a structure in which multiple Mini-LED chips are transferred to a driving substrate in an embodiment of the present invention.

[0024] Figure 3The diagram shows a structure in which a first encapsulation layer and a plurality of first grooves are formed on a driving substrate in an embodiment of the present invention.

[0025] Figure 4 The diagram shows a structure in which a plurality of first conical holes with a smaller top and a larger bottom and a plurality of second conical holes with a larger top and a smaller bottom are formed on a glass substrate in an embodiment of the present invention.

[0026] Figure 5 The diagram shows a schematic representation of the first light conversion structure, the second light conversion structure, the third light conversion structure, and the light scattering structure in an embodiment of the present invention.

[0027] Figure 6 The diagram shows a structural schematic of cutting different regions of a glass substrate in an embodiment of the present invention.

[0028] Figure 7 The diagram shows a structure in an embodiment of the present invention in which the first light conversion module, the second light conversion module, and the third light conversion module are respectively arranged in three adjacent first grooves. Detailed Implementation

[0029] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0030] like Figures 1 to 7 As shown, this embodiment provides a method for manufacturing a Mini-LED display module, including the following steps: like Figure 1 As shown, a driving substrate 100 is provided, the driving substrate 100 including a plurality of first pixel electrodes 101 and a plurality of second pixel electrodes 102.

[0031] In a specific embodiment, a plurality of first trenches 103 are provided on the driving substrate 100, and each first trench 103 is provided with a first pixel electrode 101 and a second pixel electrode 102.

[0032] In a specific embodiment, multiple first trenches 103 are formed by wet etching or dry etching, and then a metal layer is formed by thermal evaporation, magnetron sputtering, electroplating or chemical plating. Then, patterning is performed to form the first pixel electrode 101 and the second pixel electrode 102. The material of the first pixel electrode 101 and the second pixel electrode 102 is one or more of copper, aluminum, silver, titanium, gold and palladium.

[0033] like Figure 2 As shown, a plurality of Mini-LED chips 200 are provided, each of the Mini-LED chips 200 including a first electrode 201 and a second electrode 202.

[0034] In a specific embodiment, the Mini-LED chip 200 is cut from a light-emitting epitaxial wafer, which is an N-type semiconductor layer, a light-emitting layer, and a P-type semiconductor layer grown on a sapphire substrate. The N-type semiconductor layer and the P-type semiconductor layer are respectively an n-type gallium nitride layer and a p-type gallium nitride layer, and the light-emitting layer is an alternately grown InGaN quantum well layer and a GaN quantum barrier layer.

[0035] In a specific embodiment, the first electrode 201 and the second electrode 202 are formed by thermal evaporation, magnetron sputtering, electroplating or chemical plating processes, and the materials of the first electrode 201 and the second electrode 202 are one or more of copper, aluminum, silver, titanium, gold and palladium.

[0036] like Figure 2 As shown, a plurality of Mini-LED chips 200 are transferred to the driving substrate 100, such that the first electrode 201 and the second electrode 202 of each Mini-LED chip 200 are electrically connected to a corresponding first pixel electrode 101 and a second pixel electrode 102, respectively.

[0037] In a specific embodiment, during the process of transferring the plurality of Mini-LED chips 200 to the driving substrate 100, a portion of each Mini-LED chip 200 is embedded in a first trench 103.

[0038] In a specific embodiment, the first electrode 201 and the first pixel electrode 101, as well as the second electrode 202 and the second pixel electrode 102, are electrically connected by tin-based solder, low-temperature indium metal bonding material, anisotropic conductive film, or conductive silver paste.

[0039] In a specific embodiment, the ratio of the depth of the first trench 103 to the thickness of the Mini-LED chip 200 is 0.3-0.6.

[0040] like Figure 3 As shown, a first encapsulation layer 300 is then formed on the driving substrate 100, and the first encapsulation layer 300 is patterned to form a plurality of first grooves 301.

[0041] In a specific embodiment, the specific process for forming the first encapsulation layer 300 is as follows: an inorganic dense passivation layer is deposited on the driving substrate 100, the inorganic dense passivation layer covering the upper surface of the driving substrate 100 and the upper and side surfaces of the Mini-LED chip 200, the inorganic dense passivation layer being silicon nitride, silicon oxide, or aluminum oxide deposited by PECVD or ALD process, the inorganic dense passivation layer being provided to prevent water, oxygen, and moisture from invading the Mini-LED chip 200; then an organic resin layer is formed on the inorganic dense passivation layer, and silicone or epoxy resin is formed by spin coating, spraying, slot coating, printing, or transfer molding process, and then the organic resin layer is formed by curing treatment.

[0042] In a specific embodiment, the first encapsulation layer 300 is patterned by laser irradiation to form a plurality of first grooves 301.

[0043] like Figure 4 As shown, a glass substrate 400 is provided, on which a plurality of first conical holes 401 with a shape smaller at the top and larger at the bottom and a plurality of second conical holes 402 with a shape larger at the top and smaller at the bottom are formed. A second conical hole 402 is provided between two adjacent first conical holes 401, dividing the glass substrate 400 into a first region 4001, a second region 4002 and a third region 4003.

[0044] In a specific embodiment, the glass substrate 400 is subjected to laser modification treatment. More specifically, by adjusting the irradiation mode of the modification laser, a first conical hole pre-forming area and a second conical hole pre-forming area are formed. Then, the glass substrate 400 is etched by a wet etching process. The etching solution can be a sodium hydroxide solution or a hydrofluoric acid solution to form a plurality of first conical holes 401 with a shape smaller at the top and larger at the bottom, and a plurality of second conical holes 402 with a shape larger at the top and smaller at the bottom.

[0045] In a specific embodiment, the ratio of the diameter of the large hole of the first tapered hole 401 located on the lower surface of the glass substrate 400 to the diameter of the small hole of the second tapered hole 402 located on the lower surface of the glass substrate 400 is 5-10, and the ratio of the diameter of the small hole of the second tapered hole 402 located on the upper surface of the glass substrate 400 to the diameter of the small hole of the first tapered hole 401 located on the upper surface of the glass substrate 400 is 5-10. Through the above settings, the light conversion structure and light scattering structure formed subsequently can be adjusted, thereby facilitating the improvement of its light conversion function and light scattering function, and thus improving the conversion efficiency and light output uniformity of the light conversion module.

[0046] like Figure 5As shown, a first light conversion structure 501 is formed in each of the first conical holes 401 in the first region 4001, a second light conversion structure 502 is formed in each of the first conical holes 401 in the second region 4002, a third light conversion structure 503 is formed in each of the first conical holes 401 in the third region 4003, and a light scattering structure 504 is formed in each of the second conical holes 402 in each region.

[0047] In a specific embodiment, before forming the first light conversion structure 501, the second light conversion structure 502, the third light conversion structure 503, and the light scattering structure 504, a transition layer (not shown) is formed in each of the first conical holes 401 and each of the second conical holes 402. More specifically, silicon dioxide, silicon nitride, titanium dioxide, or zinc oxide is deposited as a transition layer on the side of each of the first conical holes 401 and each of the second conical holes 402 using PECVD, ALD, or PVD processes. The provision of this transition layer can increase the bonding tightness between the subsequently formed light conversion structures and light scattering structures and the glass substrate 400, effectively preventing the light conversion structures and light scattering structures from peeling off, thereby improving their stability and service life.

[0048] In a specific embodiment, the first light conversion structure 501, the second light conversion structure 502, and the third light conversion structure 503 respectively convert the light emitted by the Mini-LED chip 200 into a first color, a second color, and a third color. The first color, the second color, and the third color are respectively one of red, green, and blue, and the first color, the second color, and the third color are all different. More specifically, for example, the first light conversion structure 501, the second light conversion structure 502, and the third light conversion structure 503 respectively convert the light emitted by the Mini-LED chip 200 into red, green, and blue.

[0049] In a specific embodiment, the first light conversion structure 501, the second light conversion structure 502, and the third light conversion structure 503 each include a resin matrix and light conversion particles distributed in the resin matrix. The resin matrix can be any suitable material such as photoresist, silicone, or epoxy resin. The light conversion particles can be quantum dots or phosphors. The quantum dots can be any suitable material such as cadmium-based quantum dots, cadmium-free InP quantum dots, or perovskite quantum dots. The phosphor can be green phosphor, red phosphor, or blue phosphor. The light conversion particles in the first light conversion structure 501, the second light conversion structure 502, and the third light conversion structure 503 are selected according to the actual needs.

[0050] In a specific embodiment, the first light conversion structure 501, the second light conversion structure 502, and the third light conversion structure 503 are formed by a scraping coating process, a spin coating process, a slot coating process, or a printing process.

[0051] In a specific embodiment, the light scattering structure 504 includes a resin matrix and light scattering particles distributed in the resin matrix. The light scattering structure 504 is formed by a blade coating process, a spin coating process, a slot coating process, or a printing process. More specifically, the resin matrix can be any suitable material such as photoresist, silicone, or epoxy resin, and the light scattering particles can be any suitable material such as titanium dioxide particles, barium sulfate particles, zinc oxide particles, zinc sulfide particles, silicon dioxide particles, or silver nanoparticles.

[0052] like Figure 6 As shown, each region of the glass substrate 400 is cut to form a plurality of first light conversion modules 601, a plurality of second light conversion modules 602 and a plurality of third light conversion modules 603.

[0053] In a specific embodiment, the glass substrate 400 is cut into various regions using a laser cutting process to form a plurality of first light conversion modules 601, a plurality of second light conversion modules 602, and a plurality of third light conversion modules 603. Each first light conversion module 601 includes a plurality of first light conversion structures 501 and a plurality of light scattering structures 504. Each second light conversion module 602 includes a plurality of second light conversion structures 502 and a plurality of light scattering structures 504. Each third light conversion module 603 includes a plurality of third light conversion structures 503 and a plurality of light scattering structures 504. More specifically, the first light conversion structures 501, the second light conversion structures 502, and the third light conversion structures 503 respectively convert the light emitted by the Mini-LED chip 200 into red, green, and blue light.

[0054] like Figure 7 As shown, the first light conversion module 601, the second light conversion module 602 and the third light conversion module 603 are then respectively disposed in the three adjacent first grooves 301.

[0055] In a specific embodiment, during the process of setting the first light conversion module 601, the second light conversion module 602 and the third light conversion module 603 in three adjacent first grooves 301 respectively, each light conversion module has a gap with the corresponding first groove 301, and a second encapsulation layer 700 is formed on the first encapsulation layer 300, with a portion of the second encapsulation layer 700 embedded in the gap.

[0056] In a specific embodiment, silicone or epoxy resin is formed by spin coating, spraying, slot coating, printing or transfer molding, and then cured to form the second encapsulation layer 700.

[0057] like Figure 7 As shown, the present invention also proposes a Mini-LED display module, which is prepared by the above-described method for preparing a Mini-LED display module.

[0058] In other preferred technical solutions, the present invention proposes a method for manufacturing a Mini-LED display module, which includes the following steps: A driving substrate is provided, the driving substrate including a plurality of first pixel electrodes and a plurality of second pixel electrodes.

[0059] Multiple Mini-LED chips are provided, each of which includes a first electrode and a second electrode.

[0060] Multiple Mini-LED chips are transferred to the driving substrate such that the first electrode and the second electrode of each Mini-LED chip are electrically connected to a corresponding first pixel electrode and a second pixel electrode, respectively.

[0061] Next, a first encapsulation layer is formed on the driving substrate, and the first encapsulation layer is patterned to form a plurality of first grooves.

[0062] A glass substrate is provided, on which a plurality of first conical holes of the shape smaller at the top and larger at the bottom and a plurality of second conical holes of the shape larger at the top and smaller at the bottom are formed, with a second conical hole between two adjacent first conical holes, dividing the glass substrate into a first region, a second region and a third region.

[0063] A first light conversion structure is formed in each of the first conical holes in the first region, a second light conversion structure is formed in each of the first conical holes in the second region, a third light conversion structure is formed in each of the first conical holes in the third region, and a light scattering structure is formed in each of the second conical holes in each region.

[0064] The glass substrate is cut into different regions to form multiple first light conversion modules, multiple second light conversion modules, and multiple third light conversion modules.

[0065] Next, the first light conversion module, the second light conversion module, and the third light conversion module are respectively installed in the three adjacent first grooves.

[0066] In a more preferred technical solution, a plurality of first trenches are provided on the driving substrate, and each first trench is provided with a first pixel electrode and a second pixel electrode.

[0067] In a more preferred technical solution, during the process of transferring multiple Mini-LED chips to the driving substrate, a portion of each Mini-LED chip is embedded in a first trench.

[0068] In a more preferred embodiment, the ratio of the diameter of the large hole of the first tapered hole located on the lower surface of the glass substrate to the diameter of the small hole of the second tapered hole located on the lower surface of the glass substrate is 5-10.

[0069] In a more preferred embodiment, the ratio of the diameter of the second tapered hole located on the upper surface of the glass substrate to the diameter of the first tapered hole located on the upper surface of the glass substrate is 5-10.

[0070] In a more preferred technical solution, before forming the first light conversion structure, the second light conversion structure, the third light conversion structure, and the light scattering structure, a transition layer is formed in each of the first conical apertures and each of the second conical apertures.

[0071] In a more preferred technical solution, the first light conversion structure, the second light conversion structure, and the third light conversion structure respectively convert the light emitted by the Mini-LED chip into a first color, a second color, and a third color, wherein the first color, the second color, and the third color are respectively one of red, green, and blue, and the first color, the second color, and the third color are all different.

[0072] In a more preferred technical solution, the first light conversion structure, the second light conversion structure, and the third light conversion structure each include a resin matrix and light conversion particles distributed in the resin matrix.

[0073] In a more preferred technical solution, during the process of setting the first light conversion module, the second light conversion module and the third light conversion module in three adjacent first grooves respectively, each light conversion module has a gap with the corresponding first groove, and a second encapsulation layer is formed on the first encapsulation layer, with a portion of the second encapsulation layer embedded in the gap.

[0074] In other preferred technical solutions, the present invention also proposes a Mini-LED display module, which is prepared by the above-mentioned method for preparing a Mini-LED display module.

[0075] In the method for fabricating a Mini-LED display module of the present invention, a glass substrate is provided, and a plurality of first conical holes with a shape smaller at the top and larger at the bottom and a plurality of second conical holes with a shape larger at the top and smaller at the bottom are formed on the glass substrate. A second conical hole is located between two adjacent first conical holes, dividing the glass substrate into a first region, a second region, and a third region. A first light conversion structure is formed in each first conical hole in the first region, a second light conversion structure is formed in each first conical hole in the second region, and a third light conversion structure is formed in each first conical hole in the third region. A second conical hole is formed in each of the second conical holes in each region. A light scattering structure is formed in the aperture, and each region of the glass substrate is cut to form multiple first light conversion modules, multiple second light conversion modules, and multiple third light conversion modules. Then, the corresponding first light conversion modules, second light conversion modules, and third light conversion modules are set in the first groove of the first encapsulation layer of the driving substrate. By pre-preparing the first light conversion modules, second light conversion modules, and third light conversion modules, the fabrication complexity of the light conversion layer is greatly reduced, thereby reducing the manufacturing cost of the light conversion layer. Furthermore, setting the light conversion structure and light scattering structure in the glass substrate greatly improves the conversion efficiency and light emission uniformity of the corresponding light conversion modules.

[0076] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for manufacturing a Mini-LED display module, characterized in that: Includes the following steps: A driving substrate is provided, the driving substrate including a plurality of first pixel electrodes and a plurality of second pixel electrodes; A plurality of Mini-LED chips are provided, each of the Mini-LED chips including a first electrode and a second electrode; The Mini-LED chips are transferred to the driving substrate such that the first electrode and the second electrode of each Mini-LED chip are electrically connected to a corresponding first pixel electrode and a second pixel electrode, respectively. Next, a first encapsulation layer is formed on the driving substrate, and the first encapsulation layer is patterned to form a plurality of first grooves; A glass substrate is provided, on which a plurality of first conical holes of a shape smaller at the top and larger at the bottom and a plurality of second conical holes of a shape larger at the top and smaller at the bottom are formed, wherein a second conical hole is provided between two adjacent first conical holes, thereby dividing the glass substrate into a first region, a second region and a third region; A first light conversion structure is formed in each of the first conical holes in the first region, a second light conversion structure is formed in each of the first conical holes in the second region, a third light conversion structure is formed in each of the first conical holes in the third region, and a light scattering structure is formed in each of the second conical holes in each region. Each region of the glass substrate is cut to form multiple first light conversion modules, multiple second light conversion modules, and multiple third light conversion modules; Next, the first light conversion module, the second light conversion module, and the third light conversion module are respectively installed in the three adjacent first grooves.

2. The method for preparing a Mini-LED display module according to claim 1, characterized in that: A plurality of first trenches are provided on the driving substrate, and each first trench is provided with a first pixel electrode and a second pixel electrode.

3. The method for preparing a Mini-LED display module according to claim 2, characterized in that: During the process of transferring the plurality of Mini-LED chips to the driving substrate, a portion of each Mini-LED chip is embedded in a first trench.

4. The method for preparing a Mini-LED display module according to claim 1, characterized in that: The ratio of the diameter of the large hole of the first tapered hole located on the lower surface of the glass substrate to the diameter of the small hole of the second tapered hole located on the lower surface of the glass substrate is 5-10.

5. The method for preparing a Mini-LED display module according to claim 4, characterized in that: The ratio of the diameter of the second conical hole located on the upper surface of the glass substrate to the diameter of the first conical hole located on the upper surface of the glass substrate is 5-10.

6. The method for preparing a Mini-LED display module according to claim 1, characterized in that: Before forming the first light conversion structure, the second light conversion structure, the third light conversion structure, and the light scattering structure, a transition layer is formed in each of the first conical apertures and each of the second conical apertures.

7. The method for preparing a Mini-LED display module according to claim 1, characterized in that: The first light conversion structure, the second light conversion structure, and the third light conversion structure respectively convert the light emitted by the Mini-LED chip into a first color, a second color, and a third color. The first color, the second color, and the third color are respectively one of red, green, and blue, and the first color, the second color, and the third color are all different.

8. The method for preparing a Mini-LED display module according to claim 6, characterized in that: The first light conversion structure, the second light conversion structure, and the third light conversion structure each include a resin matrix and light conversion particles distributed in the resin matrix.

9. The method for preparing a Mini-LED display module according to claim 1, characterized in that: During the process of setting the first light conversion module, the second light conversion module and the third light conversion module in the three adjacent first grooves respectively, each light conversion module has a gap with the corresponding first groove, and a second encapsulation layer is formed on the first encapsulation layer, with a part of the second encapsulation layer embedded in the gap.

10. A Mini-LED display module, characterized in that: The Mini-LED display module is prepared using the method described in any one of claims 1-9.

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