Heat energy storage arrangement for a heat pump system

CN122708415APending Publication Date: 2026-09-08ROBERT BOSCH GMBH
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Patent Information

Application Number
CN202610265330.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-03-05
Filing Date
2026-03-05
Publication Date
2026-09-08

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Abstract

A thermal energy storage (TES) arrangement for a heat pump system includes a phase change material, a TES heat exchanger configured to exchange heat with the phase change material, and a valve manifold. The valve manifold is fluidly connected to the TES heat exchanger and is configured to be fluidly connected to a conditioned space heat exchanger of the heat pump system and an ambient heat exchanger of the heat pump system. The valve manifold is configured to selectively form a refrigerant circuit between at least two of the TES heat exchanger, the conditioned space heat exchanger, and the ambient heat exchanger.
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Description

[0001] Cross-reference of related applications This application relates to U.S. Application Serial No. 18 / 920,102, Christensen et al., U.S. Application Serial No. 18 / 920,114, Mayer et al., U.S. Application Serial No. 18 / 920,124, and Ji et al., U.S. Application Serial No. 18 / 920,132, all of which were filed on October 18, 2024, and the contents of all four applications are expressly incorporated herein by reference in their entirety. Technical Field

[0002] The apparatus and methods disclosed in this document relate to thermal energy storage, and more particularly to thermal energy storage for air conditioning and heat pump systems. Background Technology

[0003] Increased deployment of renewable energy requires energy storage to accommodate the growing mismatch between times of high energy demand (e.g., cooling homes in the late afternoon / evening during the summer) and times of high power generation (e.g., from wind farms that tend to peak at night or photovoltaics that peak at midday).

[0004] Thermal energy storage (“TES”) is a relatively inexpensive, safe, and convenient method of energy storage. It is anticipated that existing heat pump systems will begin to incorporate TES to improve energy efficiency and optimize performance by decoupling heating and cooling demands from fluctuations in energy supply. Such systems can utilize advanced TES technologies, such as phase change materials or high-capacity water tanks, which will allow thermal energy to be stored during off-peak periods and released later when demand peaks. Summary of the Invention

[0005] In some aspects, the technology described herein relates to a thermal energy storage arrangement for a heat pump system. The TES arrangement includes a phase change material, a TES heat exchanger configured to exchange heat with the phase change material, and a valve manifold fluidly connected to the TES heat exchanger and configured to fluidly connect to a regulated space heat exchanger and an ambient heat exchanger of the heat pump system. The valve manifold is configured to selectively form a refrigerant circuit between at least two of the TES heat exchanger, the regulated space heat exchanger, and the ambient heat exchanger.

[0006] In some embodiments, the valve manifold includes a plurality of valves configured to selectively connect the regulated space heat exchanger, the ambient heat exchanger, and the TES heat exchanger to each other.

[0007] In another aspect, the valve manifold also includes a first port and a second port fluidly connected to an ambient heat exchanger, and a third port and a fourth port fluidly connected to a regulated space heat exchanger.

[0008] In another embodiment, the plurality of valves includes a first valve, a second valve, a third valve, and a fourth valve, and each of the first, second, third, and fourth valves is configured as a three-way valve. The first valve is connected to a first port, a fourth port, and a second valve. The second valve is connected to the first, third, and fourth valves. The third valve is connected to the second port, the first side of the TES heat exchanger, and the second valve. The fourth valve is connected to the third port, the second side of the TES heat exchanger, and the third valve.

[0009] The TES arrangement may also include a TES module, in which the phase change material and TES heat exchanger are arranged.

[0010] The valve manifold may also include a fifth port and a sixth port that are fluidly connected to the TES heat exchanger in the TES module.

[0011] In some embodiments, the TES arrangement further includes a reversing valve arrangement configured to reverse the flow direction in the refrigerant circuit.

[0012] In some aspects, the technology described herein relates to a TES arrangement in which a valve manifold includes a directional valve arrangement, and the directional valve arrangement is arranged between a third valve and a fifth port and between a fourth valve and a sixth port.

[0013] In some embodiments, the TES module includes a second compressor and an expansion valve, which are fluidly connected to opposite sides of the TES heat exchanger.

[0014] In another embodiment, the TES module further includes a first pair of valves and a second pair of valves, the first pair of valves being configured to selectively connect or isolate the second compressor from the refrigerant circuit, and the second pair of valves being configured to selectively connect or isolate the expansion valve from the refrigerant circuit.

[0015] In one embodiment, the TES arrangement has a controller operatively connected to and configured to operate the valve manifold to selectively connect the regulated space heat exchanger, the ambient heat exchanger, and the TES heat exchanger to each other.

[0016] The controller can be configured to selectively operate the valve manifold in four modes: a first mode, a second mode, a third mode, and a fourth mode. In the first mode, the controller operates the valve manifold to form a refrigerant circuit between the ambient heat exchanger and the TES heat exchanger. In the second mode, the controller operates the valve manifold to form a refrigerant circuit between the ambient heat exchanger and the regulated space heat exchanger. In the third mode, the controller operates the valve manifold to form a refrigerant circuit between the ambient heat exchanger, the TES heat exchanger, and the regulated space heat exchanger. In the fourth mode, the controller operates the valve manifold to form a refrigerant circuit between the TES heat exchanger and the regulated space heat exchanger.

[0017] In another embodiment according to this disclosure, a valve manifold includes: a first port and a second port configured to be fluidly connected to an ambient heat exchanger of a heat pump system; and a third port and a fourth port configured to be fluidly connected to a regulated space heat exchanger of the heat pump system. A first valve is connected to the first port, the fourth port, and the second valve. A second valve is connected to the first valve, the third valve, and the fourth valve. A third valve is connected to the second port, a first side of the TES heat exchanger, and the second valve. A fourth valve is connected to the third port, a second side of the TES heat exchanger, and the third valve. The valve manifold is configured to selectively form a refrigerant circuit between at least two of the TES heat exchanger, the regulated space heat exchanger via the third and fourth ports, and the ambient heat exchanger via the first and second ports.

[0018] According to some aspects of this disclosure, a heat pump system includes: an outdoor unit including an ambient heat exchanger configured to exchange heat with ambient air; an indoor unit including a conditioned space heat exchanger configured to exchange heat with a conditioned space; and a TES arrangement. The TES arrangement includes: a phase change material; a TES heat exchanger configured to exchange heat with the phase change material; and a valve manifold fluidly connected to the TES heat exchanger, the indoor unit, and the outdoor unit. The valve manifold is configured to selectively form a refrigerant circuit between at least two of the TES heat exchanger, the conditioned space heat exchanger, and the ambient heat exchanger. Attached Figure Description

[0019] Figure 1 This is a schematic depiction of a heat pump system with a thermal energy storage (TES) arrangement according to the present disclosure, wherein a valve manifold is installed between indoor and outdoor units.

[0020] Figure 2 yes Figure 1 A schematic depiction of the valve manifold of the TES arrangement device in a heat pump system.

[0021] Figure 3 yes Figure 1A schematic depiction of the TES module of the TES arrangement device in the heat pump system.

[0022] Figure 4 It is a device with a reversing valve arrangement. Figure 1 A schematic depiction of the TES module of the TES arrangement device in the heat pump system.

[0023] Figure 5 It is a device with a reversing valve arrangement. Figure 1 A schematic depiction of the valve manifold of the TES arrangement device in a heat pump system. Detailed Implementation

[0024] For the purpose of facilitating an understanding of the principles of the embodiments described herein, reference is now made to the accompanying drawings and description in the following written specification. The scope of this subject matter is not intended to be limited by reference. This disclosure also includes any alternatives and modifications to the illustrated embodiments, and includes further applications of the principles of the described embodiments as would normally occur to those skilled in the art to which this document pertains.

[0025] Figure 1 A heat pump system 100 having a TES arrangement 104 is depicted. In exemplary embodiments of this disclosure, the thermal management system is a heat pump system for heating and cooling a building. However, although the features of this disclosure are described primarily with respect to dual-heating and cooling heat pump systems, it should be understood that the thermal management system may similarly include heat pump systems for heating only or cooling only, i.e., air conditioning for cooling a building, thermal management systems for heating or cooling a vehicle compartment, battery, engine, or other vehicle components, or any other thermal management system operating on similar principles, such as a refrigerator or freezer.

[0026] In the illustrated example, the heat pump system 100 also includes an outdoor unit 108 and an indoor unit 112 on opposite sides of the TES arrangement 104. More specifically, the outdoor unit 108 and the indoor unit 112 are connected to each other via the TES arrangement 104 to form a refrigerant circuit 116. In particular, in some embodiments, the TES arrangement 104 is configured as a retrofit to an existing heat pump system to increase the efficiency of the existing system and enable the shift of electricity use to times when electricity is cheaper and / or less CO2-intensive.

[0027] Outdoor unit 108 includes a compressor 120, a reversing valve 124, an ambient heat exchanger called evaporator coil 128, and an expansion valve 132, arranged in series in refrigerant circuit 116. Outdoor unit 108 may also include a check valve 136 connected in parallel with expansion valve 132 to bypass expansion valve 132 when flow is directed from compressor 120 toward expansion valve 132. Outdoor unit 108 is configured similarly to a conventional outdoor unit of a heat pump, such that in a heating cycle, the outdoor unit receives relatively cold refrigerant from first refrigerant line 140 and outputs heated refrigerant to second refrigerant line 144, or in a cooling cycle, receives relatively warm refrigerant from second refrigerant line 144 and outputs relatively cold refrigerant to first refrigerant line 140.

[0028] Evaporator coil 128 is configured to transfer heat between a first environment (i.e., outside air) and the refrigerant circulating through refrigerant circuit 116. Structurally, in at least some embodiments, evaporator coil 128 includes a series of coiled metal tubes or fins (not shown) through which the refrigerant circulates, increasing the surface area for heat exchange and promoting efficient absorption or dissipation of heat. Outdoor unit 108 is disposed outside a regulated space (e.g., climate-controlled building, vehicle, room, appliance, battery, etc.), and in at least some embodiments, outdoor unit 108 is housed within a casing (e.g., a metal enclosure (not shown)) to protect outdoor unit 108 from environmental factors. Additionally, in some embodiments, a fan is mounted inside the casing to blow air across the coiled tubes or fins of evaporator coil 128 to provide greater heat transfer.

[0029] Indoor unit 112 is configured as a conventional indoor unit similar to a conventional heat pump system and includes a regulated space heat exchanger referred to as condenser coil 160 and an expansion valve 164. Similarly, check valve 168 is arranged in parallel with expansion valve 164 so that when flow is in the direction from condenser coil 160 toward expansion valve 164, it can bypass expansion valve 132.

[0030] The condenser coil 160 is configured to transfer heat between the refrigerant circulating through the refrigerant circuit 116 and a second environment (i.e., the air inside the regulated space). Structurally, in at least some embodiments, the condenser coil 160 includes a series of coiled metal tubes or fins (not shown) through which the refrigerant circulates, which increases the surface area available for heat exchange and promotes efficient absorption or dissipation of heat energy. The indoor unit 112 is arranged inside the building and, in at least some embodiments, within an indoor ventilation system, such that a fan installed in the ventilation system blows air through the coiled tubes or fins of the condenser coil 160 to distribute the regulated air throughout the regulated space.

[0031] Indoor unit 112 is connected to a third refrigerant line 180 and a fourth refrigerant line 184, which, as discussed in more detail below, cross the external boundary 172 of the regulated space (e.g., a building, vehicle, etc.) and are connected to the first refrigerant line 140 and the second refrigerant line 144 via a TES arrangement device 104. Similar to conventional heat pump systems, indoor unit 112 is configured to transfer heat from the refrigerant to the regulated space via the condenser coil 160 during a heating cycle, or to transfer heat from the regulated space back to the refrigerant via the condenser coil 160 during a cooling cycle.

[0032] Refrigerant circuit 116 is a closed, continuous loop system that circulates refrigerant through various components of heat pump system 100, thereby enabling the transfer of heat energy. In some embodiments, refrigerant circuit 116 may more broadly take the form of a heat transfer fluid circuit that circulates a heat transfer fluid, including refrigerants such as R-22, R-32, R-125, R-410A, R-134a, R-290, R-407C and R502, water, ethylene glycol solution (antifreeze), etc. Therefore, references to refrigerant and refrigerant circuit 116 herein should be understood to alternatively incorporate any heat transfer fluid. Refrigerant circuit 116 includes pipes connecting components of heat pump system 100, including outdoor unit 108 and components therein, indoor unit 112 and components therein, and TES arrangement 104 and its associated components. The refrigerant flows through these components during circulation, undergoing a phase change between liquid and gas in some cases as it absorbs or releases heat.

[0033] It should be understood that the illustrated embodiment of heat pump system 100 is in the form of an air-source heat pump. However, in alternative embodiments, heat pump system 100 may take the form of a ground-source (geothermal) heat pump or a water-source heat pump. Ground-source (geothermal) heat pumps transfer heat between a regulated space and ground or groundwater. These systems use an underground refrigerant loop that absorbs heat from the earth or releases heat back to the earth, which maintains a relatively constant temperature throughout the year. Similarly, water-source heat pumps exchange heat with water tanks in buildings or with bodies of water such as lakes, rivers, or wells. These systems extract heat from water for heating or release heat into the water for cooling.

[0034] The TES installation unit 104 is configured for easy retrofitting to existing heat pump systems with limited labor. Specifically, as... Figure 1As shown, the TES arrangement 104 is connected in series between the first refrigerant line 140 and the fourth refrigerant line 184 (which would be a single line in a conventional heat pump system), and between the second refrigerant line 144 and the third refrigerant line 180 (which would also be a single line in a conventional heat pump system). Therefore, in some embodiments, the installation of the TES arrangement 104 is achieved by simply cutting two existing refrigerant lines and connecting these two refrigerant lines to their associated components of the TES arrangement 104.

[0035] The TES (Refrigeration Equipment) placement unit 104 includes a valve manifold 200, a TES module 204 fluidly connected to the valve manifold 200 via a fifth refrigerant line 208 and a sixth refrigerant line 212, and a controller 216. The valve manifold 200 is configured as a structural unit separate from at least the outdoor unit 108 and the indoor unit 112. In some embodiments, the valve manifold 200 may be integrated with the TES module 204, while in other embodiments, the valve manifold 200 may be structurally separate from the TES module 204.

[0036] Valve manifold 200 includes a valve housing 218 ( Figure 2 The heat pump system 100 contains multiple valves, and the valve housing 218 has multiple ports. More specifically, the valve housing 218 has a first port 220, a second port 222, a third port 224, a fourth port 226, a fifth port 228, and a sixth port 230, which are respectively connected to the first through sixth refrigerant lines 140, 144, 180, 184, 208, and 212. The valve manifold 200 is configured to guide refrigerant flow through the refrigerant lines 140, 144, 180, 184, 208, and 212, enabling the heat pump system 100 to perform various heating or cooling modes.

[0037] Figure 2An embodiment of a valve manifold 200 with four three-way valves configured to control flow between refrigerant lines 140, 144, 180, 184, 208, and 212 is depicted. Specifically, the valve manifold 200 includes a first valve 240 fluidly disposed between a first port 220 and a fourth port 226; a second valve 242 fluidly disposed between a second port 222 and a third port 224 and connected to the first valve 240; a third valve 244 fluidly disposed between a second refrigerant line 144, a fifth refrigerant line 208, and the second valve 242; and a fourth valve 246 disposed between the second valve 242, a sixth port 230, and the third port 224. Each of the valves may be an electrically actuated solenoid valve. Alternatively, in some embodiments, the valve manifold 200 may be formed with other valve arrangements capable of controlling the flow of fluid through the valve manifold 200. For example, in one embodiment, the valve manifold 200 may be configured as a single six-port control valve with various valve positions, capable of controlling refrigerant through a desired fluid flow path, or configured as any other suitable number of valves in an arrangement capable of achieving the desired fluid flow path.

[0038] The valve housing 218 can be configured as a metal (e.g., aluminum) block having channels formed therein by drilling, casting, or 3D printing to connect ports and valves to each other. Alternatively, the valve housing 218 can be a housing surrounding the valve and piping or other fluid connections housed within the housing. Valves can be mounted, for example, on the exterior of the valve housing 218, or they can be mounted inside or partially inside the valve housing 218.

[0039] Figure 3 An embodiment of TES module 204 is illustrated. TES module 204 includes phase change material 260, TES heat exchanger 264, compressor 268, and expansion valve 272. TES module 204 is configured such that refrigerant flows from a first module port 276 through a pair of valves 278, 280 connected to or bypassing expansion valve 272, through TES heat exchanger 264 exchanging heat with phase change material 260, through another pair of valves 282, 284 connected to or bypassing compressor 268, and through a second module port 288, or vice versa.

[0040] Phase change material 260 is stored in one or more isolated storage tanks (not shown) and includes a heat storage medium such as water, phase change material, or a mixture of water and phase change material. The phase change material 260 in the thermal energy storage module 130 includes one or more substances that store and release thermal energy through a phase change (typically from solid to liquid or vice versa). Specifically, the phase change material 260 may have a relatively high heat capacity and / or phase change specific heat (i.e., specific heat or enthalpy of fusion and / or enthalpy of vaporization). It should be understood that the phase change material 260 may include, for example, water, which has a high heat capacity and specific heat during a phase change between liquid water and ice. When the heat pump system 100 generates excess heat energy, the phase change material 260 is energized by absorbing heat energy, causing the phase change material 260 to undergo a phase change, thereby effectively storing thermal energy at a constant temperature. Conversely, when thermal energy is needed in the system, the phase change material 260 can be energized by releasing the stored thermal energy when the phase change material 260 returns to a different phase.

[0041] The TES heat exchanger 264 is configured to transfer heat between the refrigerant circulating through the refrigerant loop 116 and the phase change material 260. Structurally, in at least some embodiments, the TES heat exchanger 264 includes a series of coiled metal tubes or fins (not shown) through which the refrigerant circulates. The phase change material 260 may be arranged within or adjacent to the phase change material 260 to maximize the contact surface area and ensure efficient heat exchange.

[0042] Specifically, as discussed in detail below, valves 278, 280, 282, and 284 allow compressor 268 and expansion valve 272 to be bypassed or activated, depending on whether the outdoor unit 108, including compressor 120 and expansion valve 132, is in an activated refrigerant circuit. Therefore, compressor 268 can be smaller than compressor 120, and thus compressor 268 consumes less power than compressor 120 during operation.

[0043] The controller 216 performs the operation and control of various components and functions of the system. The controller 216 is implemented using a general-purpose or special-purpose programmable processor that executes programming instructions. The instructions and data required to perform the programming functions are stored in memory units associated with the controller 216. The processor, memory, and interface circuitry system configures the controller 216 to perform the functions described above and the processes described below. These components can be mounted on a printed circuit card or configured as circuits in an application-specific integrated circuit (ASIC). Each of the circuits can be implemented using a separate processor, or multiple circuits can be implemented on the same processor. Alternatively, the circuits can be implemented using discrete components or circuits provided in a VLSI circuit. Furthermore, the circuits described herein can be implemented using a combination of processors, ASICs, discrete components, or VLSI circuits. The controller 216 can be a discrete control unit added to the heat pump system 100 during retrofitting, or alternatively, the controller 216 can be implemented within the existing controller of the heat pump system 100 via software and / or hardware updates. Furthermore, in some embodiments, the controller 216 may be located remotely from the heat pump system 100, for example, implemented in a cloud computing setup, and connected to the heat pump system 100 via the Internet, cellular connection, or other suitable connection.

[0044] The controller 216 is configured to monitor various parameters, including, for example, internal and external temperatures, the temperature of the refrigerant or phase change material 260 entering and leaving the TES module 204, the refrigerant flow rate at different points in the refrigerant circuit 116, the compressor frequency of the compressor 120, the density of the phase change material 260, and the electrical or magnetic properties of the phase change material 260. By continuously monitoring these parameters, the controller 216 makes real-time adjustments to the operation of the heat pump system 100, such as adjusting the speed of the compressor 120 or regulating the operation of valves in the system, to store or release heat energy in or from the TES module 204.

[0045] In some embodiments, the controller 216 is operatively connected to various temperature sensors configured to measure different temperatures within the heat pump system 100. These temperature sensors may include thermocouples or thermistors strategically positioned to measure corresponding temperatures. In one embodiment, an indoor temperature sensor measures one or both of the ambient indoor temperature (e.g., at a thermostat) and the temperature of the air entering the indoor unit 112. In one embodiment, an outdoor temperature sensor measures one or both of the ambient outdoor temperature and the temperature of the air entering the third refrigerant line 180. In one embodiment, one or more TES temperature sensors measure multiple temperatures of the refrigerant entering and / or leaving the TES module 204.

[0046] In some embodiments, controller 216 is operatively connected to one or more refrigerant flow rate sensors configured to measure different refrigerant flow rates within heat pump system 100. The refrigerant flow rate sensors may include variable area flow meters or similar devices designed to detect changes in refrigerant flow rate. In some embodiments, one or more refrigerant flow rate sensors include corresponding refrigerant flow rate sensors that measure the flow rate through each of the heat exchangers in heat pump system 100. Specifically, the TES refrigerant flow rate sensor may measure the flow rate of refrigerant circulating through TES module 204, the external refrigerant flow rate sensor may measure the flow rate of refrigerant circulating through outdoor unit 108, and / or the internal refrigerant flow rate sensor may measure the flow rate of refrigerant circulating through indoor unit 112.

[0047] In some embodiments, the controller 216 is operatively connected to a compressor frequency sensor (e.g., a tachometer) integrated into the compressor 120. The compressor frequency sensor measures the rotational speed of the compressor 120 and / or the operating current frequency of the compressor 120.

[0048] Finally, in some embodiments, the controller 216 is operatively connected to one or more PCM sensors, which may be integrated with the TES module 204 and configured to directly measure one or more properties of the phase change material 260. In some embodiments, the PCM sensors include an ultrasonic sensor that uses ultrasonic measurements to measure the density of the phase change material 260, an electrical sensor that measures the electrical properties (e.g., resistance or impedance) of the phase change material 260, and / or a magnetic sensor that measures the magnetic properties of the phase change material 260.

[0049] The controller 216 is configured to selectively operate the heat pump system 100 in any of the following modes: heating mode, cooling mode, or standby mode. In standby mode, the heat pump system 100 does not actively heat or cool, but remains ready to engage when needed.

[0050] More specifically, controller 216 is operatively connected to outdoor unit 108, specifically to at least compressor 120, reversing valve 124, and optionally to expansion valve 132; optionally to indoor unit 112, specifically to at least expansion valve 132, and to TES module 204; specifically to at least compressor 268 and valves 278, 280, 282, 284, and optionally to expansion valve 272; and to valve manifold 200, specifically to valves 240, 242, 244, 246. Controller 216 is configured to operate various valves and compressors to selectively operate in one of several modes to charge or de-energize phase change material 260 and / or heat or cool the regulated space via indoor unit 112.

[0051] Figure 2 The operation of valves 240-246 via controller 216 in various heating modes is also depicted, with each mode identified by the letters AD. In the first heating mode (A), controller 216 operates valves 240-246 to energize the phase change material 260 of TES module 204 from outdoor unit 108. It should be understood that, as discussed herein, energizing the phase change material 260 means adding heat energy to the phase change material 260, which can, for example, evaporate or melt a portion of the phase change material 260, while de-energizing the phase change material 260 means removing heat energy from the phase change material 260, which can, for example, condense or freeze a portion of the phase change material 260. In the first heating mode, compressor 120 of outdoor unit 108 is activated to increase the heat and pressure of the refrigerant, and the heated and pressurized refrigerant is moved via second refrigerant line 144 to the second port 222 of valve manifold 200. In the valve manifold, the third valve 244 directs flow to the fifth port 228 and the fifth refrigerant line 208. The refrigerant is transferred to the TES module 204 via the first module port 276, passing through valves 278 and 280, and transferring heat to the phase change material 260 at the TES heat exchanger 264. The now-cooled refrigerant is then output from the TES module 204 via the second module port 288, flowing through the refrigerant line 212 to the sixth port 230 of the valve manifold 200, where it flows through valves 246, 242, and 240, exiting the first port 220, and returning to the outdoor unit 108 via the first refrigerant line 140. Therefore, the first heating mode (A) energizes the phase change material 260 by increasing the heat in it, so that the heat in the phase change material 260 can subsequently be used to heat the indoor unit 112 as needed.

[0052] In the second heating mode (B), the indoor unit 112 is heated in a conventional manner via the outdoor unit 108. Specifically, valves 244, 242, and 246 are opened to allow direct flow from the second refrigerant line 144 to the third refrigerant line 180, and the first valve 240 is opened to allow backflow from the fourth refrigerant line 184 to the first refrigerant line 140. In the second heating mode, the TES module 204 is not used.

[0053] In the third heating mode (C), outdoor unit 108 heats both phase change material 260 and indoor unit 112. As in the first heating mode, compressor 120 of outdoor unit 108 is activated to increase the heat and pressure of the refrigerant, and moves the heated and pressurized refrigerant via second refrigerant line 144 to second port 222 of valve manifold 200. Third valve 244 connects the incoming refrigerant to fifth refrigerant line 208 via fifth port 228, and the refrigerant passes through TES module 204, energizing (heating) the phase change material 260 therein. In the third heating mode, valves 282, 284 may optionally connect to compressor 268, which is activated to increase the heat of the refrigerant to compensate for some heat loss in the phase change material 260. After returning to valve manifold 200 via second module port 288, sixth refrigerant line 212, and sixth port 230, fourth valve 246 directs fluid to third port 224 and third refrigerant line 180, allowing the refrigerant to then heat the regulated space via condenser coil 160 of indoor unit 112. The refrigerant returns through valve manifold 200 and flows through first valve 240 back to outdoor unit 108 to complete the loop.

[0054] In a variant (C') of the third heating mode, the third valve 244 and the fourth valve 246 can be flow-splitting and combining valves. In the C' variant, the flow from the second port 222 is split by the third valve 244, such that a portion travels through the second valve 242 while the other portion flows to the TES module 204 via the fifth refrigerant line 208. The refrigerant is then combined via the fourth valve 246 before leaving the valve manifold 200 via the third refrigerant line 180 to heat the indoor unit 112. In this embodiment, only a portion of the refrigerant flowing from the valve manifold 200 to the indoor unit 112 via the third refrigerant line 180 is used to energize the phase change material 260, leaving a larger amount of refrigerant with more heat to heat the indoor unit 112. Flow diversion can occur by using a valve that partially opens to divert flow between two outlets, or by switching between outlets, for example by PWM operation on a short timescale of less than one second, or on a longer timescale of more than one second or more than one minute, to proportionally divert flow between the two outlets over a defined time period.

[0055] In the fourth heating mode (D), the regulated space is heated only from the TES module 204. The refrigerant circuit is manufactured to begin at the fourth refrigerant line 184, via the first valve 240, the second valve 242, and the third valve 244, and via the fifth refrigerant line 208 to the TES module 204. The circuit continues via valve 278, which directs the refrigerant flow through the expansion valve 272 and back to valve 280, and then to the TES heat exchanger 264 to absorb heat from the phase change material 260 by releasing energy from it. The refrigerant then flows through valve 282, is further heated by the compressor 268, and is output from the TES module 204 via valve 284 and the sixth refrigerant line 212. The heated refrigerant then flows via the fourth valve 246 and the third refrigerant line 180 to the indoor unit 112 to heat the regulated space. Therefore, in this heating mode, the heat pump system 100 forms a refrigerant circuit similar to that of a normal heating mode, except that the TES module 204 is used to replace the outdoor unit 108 to perform expansion, heat exchange and compression.

[0056] In the fifth heating mode, the indoor unit 112 is heated by both the outdoor unit 108 and the TES module 204. The fifth heating mode is essentially the same as the third heating mode (C) or (C'), except that the phase change material 260 is fully energized, so that the phase change material 260 releases heat into the refrigerant passing through the TES heat exchanger 264, rather than absorbing heat from it.

[0057] The heat pump system 100 is also configured to cool or air-condition the regulated space. Each of the heating modes has a corresponding cooling mode, wherein the valve operation is substantially the same as the corresponding heating mode, but the flow is reversed via, for example, a reversing valve 124. For example, in the first cooling mode, the valve operates in the same manner as in the first heating mode (A) with counterflow, such that the phase change material 260 is released or cooled via the outdoor unit 108. Similarly, in the second and third cooling modes, respectively, the valve operates in the same manner as in the second heating mode (B) and the third heating mode (C) or (C'), but the flow is reversed via the reversing valve 124. Thus, in the second cooling mode, the regulated space is cooled from the outdoor unit 108, and in the third cooling mode, the regulated space is cooled from both the TES module 204 and the outdoor unit 108. There is also a fifth cooling mode, which corresponds to the opposite mode of the fifth heating mode, wherein the indoor unit 112 is cooled by both the outdoor unit 108 and the TES module 204.

[0058] In the fourth cooling mode, which is the opposite of the fourth heating mode (D), the first valve 240 and the third valve 244 isolate the outdoor unit 108 from the cooling cycle. Therefore, in the fourth cooling mode, the reversing valve 124 is not in the refrigerant circuit. In embodiments configured for cooling using only the TES arrangement unit 104, the positions of the compressor 268 and expansion valve 272 can be determined from... Figure 3 The configuration switching is shown. Alternatively, to achieve both the fourth heating and cooling modes, compressor 268 can be configured as a bidirectional compressor. In another embodiment, the reversing valve arrangement devices 300, 300A can be arranged in TES module 204, such as... Figure 4 As shown, or arranged in the valve manifold 200, such as Figure 5 As shown, this allows the flow through the refrigerant circuit 116 to be reversed when the outdoor unit 108 is isolated from the refrigerant circuit 116.

[0059] Now for reference Figure 4 The reversing valve arrangement 300 in the TES module 204 is, for example, arranged between two valves 278, 284 and the first module port 276 and the second module port 288. The reversing valve arrangement 300, as depicted, includes four three-way valves 302, 304, 306, 308, which are configured to selectively reverse the flow direction through the TES module 204, such that when reversed in the fourth cooling mode, refrigerant flows from the second module port 288 through valves 308, 304 and 278, expansion valve 272, TES heat exchanger 264, valve 282, compressor 268, valves 284, 306, 302, and exits from the TES module 204 via the first module port 276.

[0060] Similarly, such as Figure 5 As depicted, the reversing valve arrangement 300A in the valve manifold 200 is configured such that, in the fourth cooling mode, refrigerant from the indoor unit 112 enters through the fourth port 226, passes through the fourth valve 246, valves 318 and 314, and flows to the TES module 204 via the fifth refrigerant line 208 in the direction opposite to the fourth heating mode. Refrigerant returning from the TES module 204 to the valve manifold 200 flows through the sixth refrigerant line 212, the sixth port 230, valves 316 and 312, the third valve 244, the second valve 242, and the first valve 240, and returns to the indoor unit 112 via the fourth port 226 and the fourth refrigerant line 184.

[0061] Therefore, the reversing valve arrangement 300, 300A in the valve manifold 200 or TES module 204 allows the refrigerant to flow in the fourth cooling mode in the opposite direction to that in the fourth heating mode, even though the reversing valve 124 is isolated from the refrigerant circuit. Additionally, the reader should understand that although the reversing valve arrangement 300, 300A is shown as having four three-way valves, the reversing valve arrangement 300, 300A can be implemented with any suitable reversing valve configuration, for example via a similar... Figure 1 The directional valve 124 shown is a single solenoid-operated valve.

[0062] In some embodiments, controller 216 incorporates a smart algorithm that determines the optimal time to charge and discharge TES module 204 based on predictive analysis of energy demand, weather forecasts, and electricity rates. Controller 216 uses multiple valves to regulate the operation of compressor 120 and adjust the flow path of refrigerant circuit 116 to store or release heat energy in phase change material 260, thereby minimizing energy costs, maximizing efficiency, and extending the lifespan of heat pump system 100.

[0063] The controller 216 may be configured to operate the heat pump system 100 in one of five heating modes, five cooling modes, or a standby (off) mode based on the external ambient temperature, the internal ambient temperature in the regulated space, and the temperature, state, or density of the phase change material 260. In some embodiments, the controller 216 is configured to implement a method similar to that described in U.S. Patent Application Serial No. 18 / 920,132, the contents of which are incorporated herein by reference in their entirety.

[0064] The TES arrangement 104 disclosed herein is designed for easy retrofitting to existing air conditioning or heat pump refrigerant circuits without requiring the installer to worry about valve placement, piping and wiring, or the control logic that must be implemented for each valve. Installation of the TES arrangement 104 in an existing air conditioning or heat pump system is achieved by first discharging and collecting refrigerant in the existing system, and then cutting two sections of piping from the existing system (i.e., in the piping formed by the first refrigerant line 140 and the fourth refrigerant line 184, and in the piping formed by the second refrigerant line 144 and the third refrigerant line 180). The installer then makes four new connections from the existing piping to the valve manifold 200, specifically at the four valve ports 220-226, and two connections from the valve manifold 200 to the TES module 204 at the fifth port 228 and the sixth port 230 if the valve manifold 200 and the TES module 204 were not already connected prior to installation. The copper or metal pipes forming refrigerant lines 140, 144, 180, 184, 208, and 212 can be connected to each other and to the existing system via, for example, brazing, welding, soldering, and / or using leak-free quick-connect devices. Once all connections have been made, the installer refills the refrigerant circuit 116. The installer also connects the valve manifold 200 and TES module 204 to the building's electrical panel, connects the TES arrangement 104 to the existing AC / HP controller 216 and / or thermostat, updates the controller 216 software as needed, and finally tests and validates the complete heat pump system 100.

[0065] The TES arrangement 104 disclosed herein can be integrated into various refrigeration systems, including heat pumps, air conditioners, stationary energy storage systems, and other thermal management systems, including electric vehicle thermal management systems and vehicle air conditioning systems. Furthermore, when used in commercial or residential heat pump or air conditioning systems, the TES arrangement 104 provides a simple yet effective way to time-transfer the energy consumption of the heat pump system 100 by storing energy in the phase change material 260 during low-demand times (i.e., off-peak times) and then using the energy stored in the phase change material 260 to heat or cool the conditioned space during high-demand times when peak electricity tariffs may apply. Moreover, since the compressor 268 in the TES module 204 is smaller (i.e., uses less energy) than the compressor 120 in the outdoor unit 108, heating or cooling the conditioned space using only the TES arrangement 104 in the fourth heating and cooling mode can be achieved with reduced energy consumption compared to conventional air conditioning or heat pump systems.

[0066] It should be understood that variations or alternatives to the above and other features and functions can be expected to be combined into many other different systems, applications, or methods. Various alternatives, modifications, variations, or improvements that are not currently foreseen or anticipated can then be made by those skilled in the art, which are also intended to be covered by the foregoing disclosure.

Claims

1. A thermal energy storage (TES) arrangement for a heat pump system, the TES arrangement comprising: Phase change materials; A TES heat exchanger, wherein the TES heat exchanger is configured to exchange heat with the phase change material; as well as A valve manifold fluidly connected to the TES heat exchanger and configured to fluidly connect to the regulated space heat exchanger and the ambient heat exchanger of the heat pump system, the valve manifold being configured to selectively form a refrigerant circuit between at least two of the TES heat exchanger, the regulated space heat exchanger, and the ambient heat exchanger.

2. The TES arrangement device according to claim 1, wherein, The valve manifold includes a plurality of valves configured to selectively connect the regulated space heat exchanger, the ambient heat exchanger, and the TES heat exchanger to each other.

3. The TES arrangement device according to claim 2, wherein, The valve manifold also includes a first port and a second port fluidly connected to the ambient heat exchanger, and a third port and a fourth port fluidly connected to the regulated space heat exchanger.

4. The TES arrangement device according to claim 3, wherein: The plurality of valves includes a first valve, a second valve, a third valve, and a fourth valve, each of the first valve, the second valve, the third valve, and the fourth valve being configured as a three-way valve. The first valve is connected to the first port, the fourth port, and the second valve. The second valve is connected to the first valve, the third valve, and the fourth valve. The third valve is connected to the second port, the first side of the TES heat exchanger, and the second valve, and The fourth valve is connected to the third port, the second side of the TES heat exchanger, and the third valve.

5. The TES arrangement device according to claim 4, further comprising: The TES module, wherein the phase change material and the TES heat exchanger are arranged in the TES module.

6. The TES arrangement apparatus according to claim 5, wherein, The valve manifold also includes a fifth port and a sixth port, which are fluidly connected to the TES heat exchanger in the TES module.

7. The TES arrangement according to claim 6, further comprising a reversing valve arrangement configured to reverse the flow direction in the refrigerant circuit.

8. The TES arrangement apparatus according to claim 7, wherein, The valve manifold includes the reversing valve arrangement, which is arranged between the third valve and the fifth port, and between the fourth valve and the sixth port.

9. The TES arrangement apparatus according to claim 5, wherein, The TES module includes a second compressor and an expansion valve, which are fluidly connected to opposite sides of the TES heat exchanger.

10. The TES arrangement apparatus according to claim 9, wherein, The TES module further includes a first pair of valves and a second pair of valves, the first pair of valves being configured to selectively connect or isolate the second compressor from the refrigerant circuit, and the second pair of valves being configured to selectively connect or isolate the expansion valve from the refrigerant circuit.

11. The TES arrangement apparatus according to claim 1, further comprising: A controller operably connected to the valve manifold and configured to operate the valve manifold to selectively connect the regulated space heat exchanger, the ambient heat exchanger, and the TES heat exchanger to each other.

12. The TES arrangement apparatus according to claim 11, wherein: The controller is configured to selectively operate the valve manifold in a first mode, a second mode, a third mode, and a fourth mode. In the first mode, the controller operates the valve manifold to form the refrigerant circuit between the ambient heat exchanger and the TES heat exchanger. In the second mode, the controller operates the valve manifold to form the refrigerant circuit between the ambient heat exchanger and the regulated space heat exchanger. In the third mode, the controller operates the valve manifold to form the refrigerant circuit between the ambient heat exchanger, the TES heat exchanger, and the regulated space heat exchanger. In the fourth mode, the controller operates the valve manifold to form the refrigerant circuit between the TES heat exchanger and the regulated space heat exchanger.

13. A valve manifold, comprising: A first port and a second port are configured to be fluidly connected to the ambient heat exchanger of the heat pump system. The third and fourth ports are configured to be fluidly connected to the regulated space heat exchanger of the heat pump system. A first valve, which is connected to the first port, the fourth port, and the second valve. The second valve is connected to the first, third, and fourth valves. The third valve is connected to the second port, the first side of the TES heat exchanger, and the second valve. The fourth valve is connected to the third port, the second side of the TES heat exchanger, and the third valve. The valve manifold is configured to selectively form a refrigerant circuit between at least two of the TES heat exchanger, the regulated space heat exchanger via the third and fourth ports, and the ambient heat exchanger via the first and second ports.

14. The valve manifold according to claim 13, further comprising: Fluidly connected to the fifth and sixth ports of the TES heat exchanger.

15. The valve manifold according to claim 14, further comprising: A reversing valve arrangement is configured to reverse the flow direction in the refrigerant circuit and is connected between the third valve, the fourth valve and the TES heat exchanger.

16. The valve manifold according to claim 15, further comprising: A controller operably connected to the first valve, the second valve, the third valve, and the fourth valve, and configured to selectively operate the first valve, the second valve, the third valve, and the fourth valve in a first mode, a second mode, a third mode, and a fourth mode, wherein: In the first mode, the controller is configured to operate the first valve, the second valve, the third valve, and the fourth valve to form the refrigerant circuit between the ambient heat exchanger and the TES heat exchanger. In the second mode, the controller is configured to operate the first valve, the second valve, the third valve, and the fourth valve to form the refrigerant circuit between the ambient heat exchanger and the regulated space heat exchanger. In the third mode, the controller is configured to operate the first valve, the second valve, the third valve, and the fourth valve to form the refrigerant circuit between the ambient heat exchanger, the TES heat exchanger, and the regulated space heat exchanger. In the fourth mode, the controller is configured to operate the first valve, the second valve, the third valve, and the fourth valve to form the refrigerant circuit between the TES heat exchanger and the regulated space heat exchanger.

17. A heat pump system, comprising: An outdoor unit, the outdoor unit including an ambient heat exchanger configured to exchange heat with ambient air; An indoor unit, the indoor unit including an adjustable space heat exchanger configured to exchange heat with an adjustable space; as well as Thermal energy storage ("TES") arrangement, comprising: Phase change materials; A TES heat exchanger is configured to exchange heat with the phase change material; and A valve manifold fluidly connected to the TES heat exchanger, the indoor unit, and the outdoor unit, the valve manifold being configured to selectively form a refrigerant circuit between at least two of the TES heat exchanger, the regulated space heat exchanger, and the ambient heat exchanger.

18. The heat pump system according to claim 17, wherein, The valve manifold includes: Multiple valves configured to selectively connect the regulated space heat exchanger, the ambient heat exchanger, and the TES heat exchanger to each other; A first port and a second port, the first port and the second port being fluidly connected to the ambient heat exchanger; and The third and fourth ports are fluidly connected to the regulated space heat exchanger.

19. The heat pump system according to claim 18, wherein: The plurality of valves includes a first valve, a second valve, a third valve, and a fourth valve, each of the first valve, the second valve, the third valve, and the fourth valve being configured as a three-way valve. The first valve is connected to the first port, the fourth port, and the second valve. The second valve is connected to the first valve, the third valve, and the fourth valve. The third valve is connected to the second port, the first side of the TES heat exchanger, and the second valve, and The fourth valve is connected to the third port, the second side of the TES heat exchanger, and the third valve.

20. The heat pump system according to claim 17, further comprising: A controller, operably connected to the valve manifold and configured to operate the valve manifold to selectively connect the regulated space heat exchanger, the ambient heat exchanger, and the TES heat exchanger to each other, the controller being configured to selectively operate the valve manifold in a first mode, a second mode, a third mode, and a fourth mode, wherein: In the first mode, the controller operates the valve manifold to form the refrigerant circuit between the ambient heat exchanger and the TES heat exchanger. In the second mode, the controller operates the valve manifold to form the refrigerant circuit between the ambient heat exchanger and the regulated space heat exchanger. In the third mode, the controller operates the valve manifold to form the refrigerant circuit between the ambient heat exchanger, the TES heat exchanger, and the regulated space heat exchanger. In the fourth mode, the controller operates the valve manifold to form the refrigerant circuit between the TES heat exchanger and the regulated space heat exchanger.

Citation Information

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