Method for detecting interlayer bonding strength of multilayer component layer and application thereof

Abstract

The application relates to a detection method for the interlayer bonding strength of a multilayer electronic component and application thereof, and belongs to the technical field of multilayer electronic component quality detection. The detection method for the anti-electroplating delamination capability of the multilayer electronic component comprises the following steps: S1, performing statistics on an initial internal delamination of a to-be-detected sample, and calculating an initial failure rate; S2, performing electroplating liquid heat treatment on the to-be-detected sample after the statistics in the step S1; S3, performing drying treatment on the to-be-detected sample after the treatment in the step S2, and then performing internal delamination failure statistics. The semi-finished or finished multilayer electronic component after sintering, burning or electroplating is placed in an electroplating liquid for high-temperature heat treatment to accelerate internal delamination appearance, and then the internal crack occurrence rate is confirmed by ultrasonic sound scanning. The method is practical and simple to operate, and provides guidance for quantitatively and acceleratedly evaluating the anti-delamination capability of the multilayer electronic component.

Description

Technical Field

[0001] This application relates to the field of quality inspection technology for multilayer electronic components, and in particular to a method for testing the interlayer bonding strength of multilayer components and its application. Background Technology

[0002] The development of various multilayer electronic components based on ceramic film stacking technology is rapid. Taking multilayer ceramic capacitors (MLCCs) as an example, they are manufactured by stacking multiple ceramic films with printed metal internal electrodes in a staggered manner, followed by multiple processes such as voltage equalization, cutting, adhesive removal, sintering, end sealing, and electroplating. During the processing of multilayer electronic components and in the use of the finished product, sufficient bonding force between the ceramic films with printed metal electrodes is required; otherwise, the product is prone to delamination and cracking, rendering it unusable. For sintered, end-sealed, or electroplated products, assessing their resistance to delamination by electroplating solutions is crucial. Currently, there are few methods for assessing the delamination resistance of sintered, end-sealed, or electroplated products; commonly used methods such as interlayer tensile testing have poor applicability and low efficiency.

[0003] There are few existing methods for evaluating the anti-delamination ability of sintered, calcined, or electroplated products. Commonly used methods such as interlayer tensile testing have poor applicability and low efficiency. Summary of the Invention

[0004] In view of this, this application provides a method for detecting the interlayer bonding strength of multilayer electronic components and its application. This method involves placing sintered, calcined, or electroplated semi-finished or finished multilayer electronic components in an electroplating solution for high-temperature heat treatment to accelerate the appearance of internal delamination. Then, ultrasonic scanning is used to confirm the incidence of internal cracks. This method is highly practical and easy to operate, providing guidance for quantitatively and rapidly evaluating the delamination resistance of multilayer electronic components, and effectively overcoming the shortcomings of the existing technologies.

[0005] The first aspect of this application provides a method for testing the anti-delamination ability of multilayer components, comprising the following steps:

[0006] S1. Statistical analysis of the test samples with initial internal stratification, and calculation of the initial defect rate;

[0007] S2. Perform electroplating heat treatment on the test samples after the statistics in step S1.

[0008] S3. Dry the sample after step S2 and then perform internal stratification defect statistics.

[0009] Preferably, in step S1, the specific process of the statistics is as follows: a certain number of samples to be tested are extracted from each batch of samples to be tested, the samples to be tested are neatly arranged on a plastic sheet with an adhesive surface, the sheet is then placed flat in a water tank and its position is fixed with a pressure strip, an ultrasonic scanner is used to perform acoustic scanning to confirm the number of samples with internal delamination defects, and the initial defect rate is calculated.

[0010] Preferably, in step S2, the specific process of the electroplating solution heat treatment is as follows: the sample to be tested and the tin balls after the statistics in step S1 are placed in a beaker, and gently shaken to distribute the sample to be tested and the tin balls evenly. Then, the electroplating solution is added, and the electroplating solution should completely cover the sample to be tested. The mouth of the beaker is completely sealed with tin foil. After setting the test temperature according to the test requirements, the sealed beaker is placed in an oven and heat-treated at 70~90℃ for 10~60 minutes.

[0011] Preferably, the diameter of the solder ball is comparable to the width of the sample to be tested, and the number of solder balls is 1 to 3 times the mass of the sample to be tested.

[0012] Preferably, in step S3, the specific drying process is as follows: after the heat treatment is completed, the beaker is taken out and cooled to room temperature in the air. Then, the tin foil on the beaker is removed, the electroplating solution is disposed of in a special place, and the sample to be tested and the tin balls in the beaker are repeatedly washed with pure water more than three times. Finally, the beaker containing the sample to be tested and the tin balls is placed in an oven for drying treatment. The drying temperature is 120~150℃ and the drying time is 30~60 minutes.

[0013] Preferably, in step S3, the specific process of the internal delamination defect statistics is as follows: after drying, the sample to be tested and the solder balls are separated by a vibrating screen. The separated sample to be tested is neatly arranged on a plastic sheet with an adhesive surface. Then, the sheet is placed flat in a water tank and its position is fixed with a pressure strip. An ultrasonic scanner is used for acoustic scanning confirmation.

[0014] The second aspect of this application also provides the application of the above-mentioned method for detecting the anti-delamination ability of multilayer components in the fabrication of multilayer components.

[0015] Compared with the prior art, this application has the following advantages:

[0016] 1. This application applies to multilayer electronic components (such as ceramic capacitors, ceramic inductors, etc.) that are semi-finished or finished products after sintering, sintering, or electroplating.

[0017] 2. The process of this application is simple, and batch processing and testing can be carried out. It can quantitatively evaluate the anti-delamination ability of multilayer electronic components. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of this application or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 These are schematic diagrams of the sintered sample before and after heat treatment.

[0020] Figure 2 This is a schematic diagram of the sample before and after heat treatment after burning.

[0021] Figure 3 This is a schematic diagram of the sample before and after heat treatment following electroplating.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Electrode; 2. Ceramic layer; 3. Electroplating solution erosion and delamination; 4. Glass material; 5. Copper; 6. Nickel; 7. Tin. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] Unless otherwise specified, the experimental methods used in the embodiments of this application are all conventional methods.

[0026] In the following examples, unless otherwise specified, all raw materials can be obtained by commercial purchase or conventional methods.

[0027] The method for detecting the anti-delamination ability of multilayer components in this embodiment includes the following steps:

[0028] 1. Statistics on poor internal stratification in the initial stage of the sample

[0029] A certain number of test samples (e.g., 1000) are drawn from each batch of test samples. The test samples are neatly arranged on a plastic sheet with an adhesive surface. The sheet is then placed flat in a water tank and fixed in place with a pressure strip. An ultrasonic scanner is used to scan and confirm the number of samples with internal delamination defects. The initial defect rate is calculated.

[0030] 2. Statistics on internal delamination defects in the sample electroplating solution after heat treatment

[0031] Prepare the test samples (e.g., 1000 pieces) and solder balls for electroplating stirring. The diameter of the solder balls should be approximately the same as the width of the test samples, and the number of solder balls should be 1 to 3 times the mass of the test samples, preferably 2 times. Place the test samples and solder balls (as measured in step 1) into a beaker, and gently shake to distribute the product and solder balls evenly, avoiding sample buildup that prevents contact with the electroplating solution. Pour the electroplating solution into the beaker containing the test samples and solder balls, ensuring that the electroplating solution completely covers the test samples.

[0032] As shown in Table 1, different types and concentrations of electroplating solutions were selected for the samples at different stages of testing. Tin electroplating solution is recommended for samples without sintered ends and for samples after electroplating, while nickel electroplating solution is recommended for samples after sintering. If the nickel electroplating solution concentration is too low or the pH value is too high, the accelerating effect will be insufficient. If the tin and nickel electroplating solution concentrations are too high or the pH value is too low, the delamination rate will be too high.

[0033] Table 1

[0034]

[0035] Completely seal the mouth of the beaker with aluminum foil, ensuring the foil is intact; otherwise, the water in the electroplating solution will evaporate, and the solution will solidify. Set the oven temperature to 70-90℃ according to the experimental requirements, then place the sealed beaker inside for heat treatment. The heat treatment time should be controlled between 10-60 minutes as needed. Too low an oven temperature or too short a heat treatment time will result in insufficient acceleration of the plating process. Too high an oven temperature or too long a heat treatment time will lead to an excessively high rate of delamination.

[0036] After heat treatment, remove the beaker from the oven and cool it to room temperature in air. Remove the foil from the beaker, discard the electroplating solution in a designated area, and rinse the sample and solder balls in the beaker repeatedly with pure water at least three times. Then, place the beaker in an oven for drying at 120-150℃ for 30-60 minutes. After drying, separate the sample and solder balls using a vibrating screen. The separated samples are then neatly arranged on an adhesive plastic sheet, which is then placed flat in a water bath and secured in place with pressure strips. An ultrasonic scanner is used for confirmation. The defect rate is calculated based on the number of samples with internal delamination defects. As shown in Table 2 below, the severity of cracks can be judged based on the size of the internal delamination area.

[0037] Table 2

[0038]

[0039] As shown in Table 3 below, accelerated heat treatment tests were conducted on tin plating solution for both sintered and electroplated samples. Due to the lack of end electrode protection, the sintered samples showed a higher rate of delamination cracking after heat treatment compared to the electroplated samples. In actual testing, appropriate concentrations, heat treatment temperatures, and heat treatment times can be selected based on the specific conditions of the samples for verification.

[0040] Table 3

[0041]

[0042] 1. For samples that were not sealed after sintering, such as Figure 1 As shown:

[0043] Insufficient interlayer bonding force after sintering of ceramic layer 2 → During heat treatment, the electroplating solution accelerates its penetration into the internal electrode 1 through interlayer gaps or micro-cracks → Destructive stress corrosion leads to delamination and cracking (electroplating solution erodes layer 3) → Defect occurs.

[0044] 2. For samples that were not electroplated after firing, such as Figure 2 As shown:

[0045] The glass material 4 enriched in the copper 5 after burning is accelerated to dissolve and form pores during heat treatment in the electroplating solution, or the copper 5 has insufficient density after burning → the electroplating solution penetrates into the internal electrode → destructive stress corrosion leads to delamination and cracking (electroplating solution erodes the delamination 3) → defects occur.

[0046] 3. For samples after electroplating, such as Figure 3 As shown:

[0047] If the tin 7 and nickel 6 electroplating layers are too thin or have poor continuity, the glass material 4 enriched in the copper 5 after burning will dissolve more quickly during heat treatment in the electroplating solution, forming pores, or the copper layer will not be dense enough after burning. The electroplating solution will penetrate into the internal electrode, leading to destructive stress corrosion and delamination cracking (electroplating solution erosion of delamination 3). Defects will occur.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method for testing the anti-delamination ability of multilayer components, characterized in that, Includes the following steps: S1. Statistical analysis of the test samples with initial internal stratification, and calculation of the initial defect rate; S2. Perform electroplating heat treatment on the test samples after the statistics in step S1. S3. Dry the sample after step S2 and then perform internal stratification defect statistics.

2. The method for detecting the anti-delamination ability of multilayer components according to claim 1, characterized in that, In step S1, the specific statistical process is as follows: a certain number of samples to be tested are extracted from each batch of samples to be tested, the samples to be tested are neatly arranged on a plastic sheet with an adhesive surface, the sheet is then placed flat in a water tank and its position is fixed with a pressure strip, an ultrasonic scanner is used to perform acoustic scanning to confirm the number of samples with internal delamination defects, and the initial defect rate is calculated.

3. The method for detecting the anti-delamination ability of multilayer components according to claim 1, characterized in that, In step S2, the specific process of heat treatment of the electroplating solution is as follows: Place the sample to be tested and the solder balls (as measured in step S1) into a beaker, gently shake to distribute them evenly, then add the electroplating solution, ensuring the solution completely covers the sample. Seal the beaker opening completely with aluminum foil to reduce liquid evaporation. After setting the test temperature according to the experimental requirements, place the sealed beaker in an oven and heat-treat at 70-90°C for 10-60 minutes.

4. The method for detecting the anti-delamination ability of multilayer components according to claim 3, characterized in that, The diameter of the solder ball is approximately equal to the width of the sample to be tested, and the number of solder balls is 1 to 3 times the mass of the sample to be tested.

5. The method for detecting the anti-delamination ability of multilayer components according to claim 1, characterized in that, In step S3, the specific drying process is as follows: After the heat treatment is completed, the beaker is taken out and cooled to room temperature in the air. Then, the tin foil on the beaker is removed, the electroplating solution is disposed of in a special place, and the sample to be tested and the tin balls in the beaker are repeatedly washed with pure water more than three times. Finally, the beaker containing the sample to be tested and the tin balls is placed in an oven for drying treatment. The drying temperature is 120~150℃ and the drying time is 30~60 minutes.

6. The method for detecting the anti-delamination ability of multilayer components according to claim 1, characterized in that, In step S3, the specific process of the internal delamination defect statistics is as follows: after drying, the sample to be tested and the solder ball are separated by a vibrating screen. The separated sample to be tested is neatly arranged on a plastic sheet with an adhesive surface. Then, the sheet is placed flat in a water tank and its position is fixed with a pressure strip. An ultrasonic scanner is used for acoustic scanning confirmation.

7. The application of the method for testing the anti-plating delamination ability of multilayer components according to any one of claims 1 to 6 in the preparation of multilayer components.

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