A multi-point detection tooling applied to an optical waveguide wafer cutting machine

Abstract

The application relates to the technical field of wafer cutting machine detection, in particular to a multi-point detection tool applied to an optical waveguide wafer cutting machine, which comprises a bottom mounting seat and an optical detection module. Through the cooperative matching of an arc-shaped guide rail, an electrically-controlled regulation seat, a transverse regulation arm and an externally-hung electrically-controlled material guide arm, multi-angle displacement regulation of the optical detection module on the arc-shaped guide rail and automatic wafer feeding, screening and discharging operations are realized, and the automation degree and detection efficiency of surface defect detection after optical waveguide wafer cutting are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of wafer dicing machine inspection technology, and in particular to a multi-point inspection fixture for optical waveguide wafer dicing machines. Background Technology

[0002] Optical waveguide wafers are the core basic components of optical communication and optoelectronic integrated devices. Wafer dicing is a key process in its manufacturing process. The surface quality after dicing directly determines the optoelectronic performance and yield of subsequent devices. Therefore, surface defect detection after dicing is an indispensable quality control link in the production process of optical waveguide wafers.

[0003] Currently, the industry commonly uses a manual loading and unloading inspection mode for surface inspection of diced optical waveguide wafers. This involves operators placing the wafers to be inspected one by one onto the inspection equipment station, and then manually removing and storing them after inspection. This traditional method has many technical drawbacks. First, the entire loading and unloading process is manually involved, which is cumbersome and repetitive, consuming a large amount of manual labor and taking a long time, greatly reducing the overall inspection efficiency of wafers and making it difficult to adapt to the needs of large-scale, batch production.

[0004] Secondly, manual operation suffers from poor consistency, and human factors such as placement misalignment and uneven handling can easily affect the detection accuracy, leading to missed detections and false detections. Furthermore, the traditional manual adaptation mode can only adapt to the inspection of wafers of a single specification, and cannot be compatible with the inspection of optical waveguide wafers of different sizes and models, resulting in poor equipment adaptability and versatility.

[0005] In addition, the optical inspection modules of existing inspection equipment are usually fixedly installed at a single inspection station, which can only inspect a specific area or angle on the wafer surface. They cannot achieve all-round inspection coverage from multiple angles, positions, and points, resulting in blind spots in the inspection of defects in critical parts such as wafer edge areas and irregularly shaped cut surfaces, which further reduces the reliability of finished product inspection.

[0006] Therefore, how to achieve automated loading and unloading, multi-angle and multi-point inspection of optical waveguide wafers after dicing, and improve the versatility and accuracy of inspection equipment are technical problems that urgently need to be solved in this field. Summary of the Invention

[0007] The technical problem to be solved by this invention is that current inspection methods for optical waveguide wafers after dicing suffer from low efficiency due to manual loading and unloading, limited inspection positions, and inability to adapt to the inspection of wafers of various specifications.

[0008] The technical solution adopted by the present invention to solve its technical problem is: a multi-point inspection fixture for an optical waveguide wafer dicing machine, including a bottom mounting base and an optical inspection module. The upper surface of the bottom mounting base has an integral arc-shaped guide rail. An electrically controlled adjustment seat is provided on the inner arc surface of the arc-shaped guide rail. A transverse adjustment arm for installing the optical inspection module is movably mounted on the outer side of the electrically controlled adjustment seat. External electrically controlled material guide arms for removing screened material are symmetrically installed on both sides of the arc-shaped guide rail.

[0009] Furthermore, the electronically controlled control seat includes a control seat that is movably mounted on the inner side of the arc-shaped guide rail via guide wheels on both sides, and an external control support rod that is movably mounted on the outer side of the control seat.

[0010] Furthermore, external brackets are installed on the outer surface of the control seat and the upper end of the arc-shaped guide rail, and the two ends of the external control support rod are connected to the external brackets on the outer surface of the control seat and the arc-shaped guide rail, respectively.

[0011] Furthermore, the lateral adjustment arm consists of a lateral guide rail, a sliding adjustment arm slidably mounted on the lateral guide rail, and a translational support rod fixed to the outside of the lateral guide rail.

[0012] Furthermore, the sliding adjustment arm consists of a sliding assembly arm that is slidably mounted on a transverse guide rail and a separate assembly arm that is bolted to the outside of the sliding assembly arm. The assembly surfaces of the sliding assembly arm and the separate assembly arm are provided with a plurality of arc-shaped mounting slots for mounting optical detection modules.

[0013] Furthermore, LED fill lights are installed on the curved surface of the curved guide rail.

[0014] Furthermore, the external electrically controlled guide arm includes a lateral mounting seat fixedly installed on the outer side of the arc-shaped guide rail, a transverse rotating arm movably installed on the lateral mounting seat, an end adjustment seat movably installed at the end of the transverse rotating arm, an arc-shaped rotating arm movably installed on the end adjustment seat, an angle guide seat movably installed at the outer end of the arc-shaped rotating arm, and an electrically controlled telescopic end suction cup installed inside the angle guide seat.

[0015] Furthermore, an external motor is also fixedly mounted on the outer side of the lateral mounting base and the outer side of the end adjustment base.

[0016] Furthermore, the electrically controlled telescopic end suction cup includes an internal adjustment tube movably inserted into the angle guide seat, a vacuum suction cup fixed to the adsorption end of the internal adjustment tube, and an adjustment support rod for controlling the position of the internal adjustment tube.

[0017] Furthermore, a bottom rotating disk is mounted on one side of the arc-shaped guide rail via a bracket, and two electrically controlled conveyor belts with opposite running directions are mounted on the other side of the bottom mounting base via a bracket.

[0018] The beneficial effects of the present invention are: (1) The present invention achieves multi-angle displacement adjustment of the optical detection module on the arc-shaped guide rail by the cooperation of the arc-shaped guide rail, the electric control adjustment seat and the horizontal adjustment arm, breaking through the limitations of traditional single-station detection, and can fully cover the defect detection needs of various areas on the surface of the optical waveguide wafer and the irregular cutting surface; (2) The external electric control guide arm is used to realize the automatic feeding and screening of the wafer, replacing the manual feeding and unloading operation, greatly improving the detection efficiency and consistency, and reducing the labor intensity of manual labor; (3) The bottom rotating disk and the electric control conveyor belt are set to realize the continuous conveying and position conversion of the wafer to be inspected, adapting to the batch and large-scale detection needs, and solving the pain points of low efficiency, incomplete detection and inability to adapt to multi-specification wafers in the traditional detection method. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the structure of the present invention.

[0021] Figure 2 This is a schematic diagram of the lateral adjustment arm in this invention.

[0022] Figure 3 This is a schematic diagram of the externally mounted electrically controlled material guide arm in this invention.

[0023] Figure 4 This is the front view of the present invention.

[0024] Figure 5 This is a schematic diagram of the sliding adjustment arm in this invention.

[0025] Explanation of reference numerals in the attached drawings: 100. Bottom mounting base; 110. Bottom rotating disk; 120. Electrically controlled conveyor belt; 200. Arc-shaped guide rail; 210. Electrically controlled adjustment base; 211. Guide wheel; 212. Adjustment base; 213. Externally mounted adjustment support rod; 214. External bracket; 220. LED supplementary light; 300. Lateral adjusting arm; 310. Lateral guide rail; 320. Sliding adjusting arm; 321. Sliding assembly arm; 322. 323. Assembly arm; 330. Arc-shaped mounting slot; 400. Translation strut; 410. External electrically controlled guide arm; 420. Lateral mounting seat; 430. End adjustment seat; 440. Arc-shaped rotating arm; 450. Angle guide seat; 460. Electrically controlled telescopic end suction cup; 461. Internal adjustment tube; 462. Vacuum suction cup; 463. Adjustable strut; 470. External motor; 500. Optical inspection module. Detailed Implementation

[0026] Figure 1 , Figure 2 , Figure 3 , Figure 4and Figure 5 The multi-point inspection fixture shown is applied to an optical waveguide wafer dicing machine and includes a bottom mounting base 100 and an optical inspection module 500. The upper surface of the bottom mounting base 100 has an integral arc-shaped guide rail 200. An electrically controlled adjustment seat 210 is provided on the inner arc surface of the arc-shaped guide rail 200. A transverse adjustment arm 300 for mounting the optical inspection module 500 is movably mounted on the outer side of the electrically controlled adjustment seat 210. External electrically controlled guide arms 400 for removing screened material are symmetrically installed on both sides of the arc-shaped guide rail 200.

[0027] A bottom mounting base 100 is located on one side of the arc-shaped guide rail 200, and a bottom rotating disk 110 is mounted on it via a bracket. On the other side of the bottom mounting base 100, two electrically controlled conveyor belts 120 with opposite running directions are mounted via a bracket. The bottom rotating disk 110 is used to carry the wafers to be inspected and can be rotated to adjust its direction. The electrically controlled conveyor belts 120 are used to transport or classify the wafers that have completed inspection to the next process. The two electrically controlled conveyor belts 120 run in opposite directions, which can transport qualified and unqualified products to different workstations respectively.

[0028] The arc-shaped guide rail 200 has an integral arc-shaped structure, with its inner arc surface being a smooth guide surface. The electrically controlled adjustment base 210 includes an adjustment base 212 movably mounted on the inner side of the arc-shaped guide rail 200 via guide wheels 211 on both sides, and an externally mounted adjustment support rod 213 movably mounted on the outer side of the adjustment base 212. The adjustment base 212 slides along the inner arc surface of the arc-shaped guide rail 200 via the guide wheels 211 on both sides, achieving position adjustment of the optical detection module 500 along the arc trajectory. External brackets 214 are mounted on the outer surface of the adjustment base 212 and the upper end of the arc-shaped guide rail 200, respectively. The two ends of the externally mounted adjustment support rod 213 are connected to the external brackets 214 on the outer surface of the adjustment base 212 and the arc-shaped guide rail 200. The external adjustment support rod 213 is an electrically controlled telescopic rod. Its telescopic movement assists in precisely positioning the adjustment seat 212 on the arc-shaped guide rail 200. It can also work with the guide wheel 211 to achieve fine-tuning of the adjustment seat 212's angle. Furthermore, an LED supplementary light 220 is installed on the arc-shaped surface of the arc-shaped guide rail 200 to provide uniform and sufficient illumination for the optical inspection module 500 during the inspection process, ensuring the quality of the acquired inspection images.

[0029] The lateral adjustment arm 300 is fixedly installed on the outside of the control base 212 and moves along the arc-shaped guide rail 200 together with the control base 212. The lateral adjustment arm 300 consists of a lateral guide rail 310, a sliding adjustment arm 320 slidably installed on the lateral guide rail 310, and a translational support rod 330 fixed on the outside of the lateral guide rail 310. The sliding adjustment arm 320 consists of a sliding assembly arm 321 slidably installed on the lateral guide rail 310 and a separate assembly arm 322 bolted to the outside of the sliding assembly arm 321. The sliding assembly arm 321 can slide along the lateral guide rail 310 to adjust the lateral detection position of the optical detection module 500; the separate assembly arm 322 is used to install the optical detection module 500, and it is bolted to the sliding assembly arm 321, and can be replaced or adjusted according to different models of optical detection modules 500. The sliding assembly arm 321 and the separating assembly arm 322 have a plurality of arc-shaped mounting slots 323 on their assembly surfaces. These arc-shaped mounting slots 323 are arranged in an arc shape and are used to mount the optical inspection module 500. The mounting angle and position of the optical inspection module 500 can be adjusted on the arc-shaped mounting slots 323 according to the inspection requirements, achieving inspection coverage of different angles and areas on the wafer surface. The translation support rod 330 is fixed to the outside of the transverse guide rail 310 and is an electrically controlled telescopic rod. By extending and retracting, it can drive the sliding adjustment arm 320 to translate on the transverse guide rail 310, realizing the adjustment of the transverse inspection position of the optical inspection module 500. The translation support rod 330 works in conjunction with the external adjustable support rod 213 to complete the multi-degree-of-freedom positioning of the optical inspection module 500 on the arc trajectory.

[0030] The optical inspection module 500 can use a CCD camera or a CMOS camera, along with appropriate lenses and filters, to acquire image data of the cut surface of the optical waveguide wafer, and to analyze the images to determine surface defects such as scratches, cracks, and chipping on the cut surface.

[0031] External electrically controlled guide arms 400 are symmetrically mounted on both sides of the arc-shaped guide rail 200 for automatic wafer feeding and screening removal. The external electrically controlled guide arms 400 include a lateral mounting base 410 fixedly mounted on the outer surface of the arc-shaped guide rail 200, a transverse rotating arm 420 movably mounted on the lateral mounting base 410, an end adjusting seat 430 movably mounted at the end of the transverse rotating arm 420, an arc-shaped rotating arm 440 movably mounted on the end adjusting seat 430, an angle guide seat 450 movably mounted at the outer end of the arc-shaped rotating arm 440, and an electrically controlled telescopic end suction cup 460 mounted inside the angle guide seat 450. External motors 470 are also fixedly mounted on the outer sides of the lateral mounting base 410 and the end adjusting seat 430, respectively driving the rotation of the transverse rotating arm 420 and the arc-shaped rotating arm 440.

[0032] The lateral mounting base 410 serves as the fixed base for the externally mounted electrically controlled guide arm 400, providing support for the entire arm. The transverse rotating arm 420 can rotate horizontally around the lateral mounting base 410, allowing for angle adjustment of the guide arm in the horizontal plane. The end adjustment seat 430 is mounted at the end of the transverse rotating arm 420 and can rotate with it, while also providing a mounting base for the arc-shaped rotating arm 440. The arc-shaped rotating arm 440 can rotate vertically around the end adjustment seat 430, allowing for angle adjustment of the guide arm in the vertical plane, thus cooperating with the electrically controlled telescopic end suction cup 460 to grip wafers from different angles. The angle guide seat 450 is mounted on the outer end of the arc-shaped rotating arm 440 and is used to position and guide the extension direction of the electrically controlled telescopic end suction cup 460.

[0033] The electrically controlled telescopic end suction cup 460 includes an internal adjustment tube 461 movably inserted into an angle guide seat 450, a vacuum suction cup 462 fixed to the adsorption end of the internal adjustment tube 461, and a control rod 463 for controlling the position of the internal adjustment tube 461. The internal adjustment tube 461 can slide telescopically within the angle guide seat 450, causing the vacuum suction cup 462 to move closer to or away from the wafer surface. The vacuum suction cup 462 grips the wafer using negative pressure adsorption, causing no damage to the wafer surface. The control rod 463 is an electrically controlled telescopic rod, with its telescopic end connected to the internal adjustment tube 461. By telescopically controlling the extension length of the internal adjustment tube 461, the precise positioning of the vacuum suction cup 462 is achieved.

[0034] The working process of the two externally mounted electrically controlled guide arms 400 is as follows: The operator stacks the wafers to one side. The externally mounted electrically controlled guide arm 400 on the same side adjusts the electrically controlled telescopic end suction cup 460 to the position corresponding to the wafer to be inspected through the linkage of the horizontal rotating arm 420 and the arc rotating arm 440. The control rod 463 drives the internal adjustment tube 461 to extend, and the vacuum suction cup 462 contacts the wafer surface and generates negative pressure adsorption. Then, the control rod 463 retracts to lift the wafer. The wafer is transferred to the bottom rotating disk 110 by the rotation of the arm body. After the vacuum is released, the wafer is placed on the bottom rotating disk 110. After the inspection is completed, when unloading, the other externally mounted electrically controlled guide arm 400 removes the wafer from the bottom rotating disk 110 in the same way. According to the inspection results, the wafer is placed on the corresponding electrically controlled conveyor belt 120 to realize the automatic screening and classification of qualified and unqualified products.

[0035] The workflow of this fixture is as follows: First, the wafer to be inspected is transported to the material handling station. The external electrically controlled guide arm 400 automatically picks up the wafer and places it on the bottom rotating disk 110. Then, the electrically controlled adjustment seat 210 slides along the arc-shaped guide rail 200 to adjust the lateral adjustment arm 300 and the optical inspection module 500 to the starting inspection position. At the same time, the translation support rod 330 drives the sliding adjustment arm 320 to move along the lateral guide rail 310 to complete the lateral positioning of the optical inspection module 500. The externally controlled adjustment support rod 213 assists in the fine-tuning of the angle of the adjustment seat 212. During inspection, the LED supplement light 220 is turned on to provide illumination. The optical inspection module 500 collects image data of the wafer surface. The bottom rotating disk 110 can be rotated to adjust the direction of the wafer, and works with the optical inspection module 500 to complete the image acquisition of the wafer at different angles and in different areas. After the inspection is completed, the externally controlled electrically controlled guide arm 400 automatically removes the wafer and places it on the corresponding electrically controlled conveyor belt 120 for classification and output according to the inspection results, completing the entire inspection cycle.

[0036] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical spirit of the present invention. The technical scope of the present invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A multi-point inspection fixture for use in an optical waveguide wafer dicing machine, comprising a bottom mounting base (100) and an optical inspection module (500), characterized in that: The bottom mounting base (100) has an integral arc-shaped guide rail (200) on its upper surface. An electrically controlled adjustment seat (210) is provided on the inner arc surface of the arc-shaped guide rail (200). A horizontal adjustment arm (300) for installing an optical detection module (500) is movably mounted on the outer side of the electrically controlled adjustment seat (210). External electrically controlled material guide arms (400) for removing screened material are symmetrically installed on both sides of the arc-shaped guide rail (200). The electrically controlled control seat (210) includes a control seat (212) movably mounted on the inner side of the arc-shaped guide rail (200) via guide wheels (211) on both sides, and an external control support rod (213) movably mounted on the outer side of the control seat (212). External brackets (214) are installed on the outer side of the control seat (212) and the upper end of the arc-shaped guide rail (200). The two ends of the external control rod (213) are connected to the external brackets (214) on the outer side of the control seat (212) and the arc-shaped guide rail (200), respectively. The lateral adjustment arm (300) consists of a lateral guide rail (310), a sliding adjustment arm (320) slidably mounted on the lateral guide rail (310), and a translational support rod (330) fixed to the outside of the lateral guide rail (310). The sliding adjustment arm (320) consists of a sliding assembly arm (321) slidably mounted on a transverse guide rail (310) and a separate assembly arm (322) bolted to the outside of the sliding assembly arm (321). The assembly surfaces of the sliding assembly arm (321) and the separate assembly arm (322) are provided with a plurality of arc-shaped mounting slots (323) for mounting the optical detection module (500). The external electrically controlled guide arm (400) includes a lateral mounting seat (410) fixedly mounted on the outer side of the arc-shaped guide rail (200), a transverse rotating arm (420) movably mounted on the lateral mounting seat (410), an end adjustment seat (430) movably mounted on the end of the transverse rotating arm (420), an arc-shaped rotating arm (440) movably mounted on the end adjustment seat (430), an angle guide seat (450) movably mounted on the outer end of the arc-shaped rotating arm (440), and an electrically controlled telescopic end suction cup (460) installed inside the angle guide seat (450).

2. The multi-point inspection fixture for an optical waveguide wafer dicing machine according to claim 1, characterized in that: LED fill lights (220) are installed on the arc-shaped surface of the arc-shaped guide rail (200).

3. The multi-point inspection fixture for an optical waveguide wafer dicing machine according to claim 1, characterized in that: An external motor (470) is also fixedly mounted on the outer side of the lateral mounting base (410) and the outer side of the end adjusting base (430).

4. The multi-point inspection fixture for an optical waveguide wafer dicing machine according to claim 1, characterized in that: The electrically controlled telescopic end suction cup (460) includes an internal adjustment tube (461) movably inserted into the angle guide seat (450), a vacuum suction cup (462) fixed to the suction end of the internal adjustment tube (461), and an adjustment support rod (463) for controlling the position of the internal adjustment tube (461).

5. The multi-point inspection fixture for an optical waveguide wafer dicing machine according to claim 1, characterized in that: The bottom mounting base (100) is located on one side of the arc-shaped guide rail (200) and a bottom rotating disk (110) is mounted on it via a bracket. On the other side of the bottom mounting base (100), two electrically controlled conveyor belts (120) with opposite running directions are mounted via a bracket.

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