Three-dimensional perspective-based radiographic detection apparatus and method

Abstract

The disclosure provides a three-dimensional perspective-based ray detection device and a detection method using the device. The device includes a ray source, a detector, a conveying device, and a card slot. The conveying device is located between the ray source and the detector. The card slot is arranged on the conveying surface of the conveying device and is used to clamp a detected object. The ray source includes multiple focal points that generate multiple ray beams, respectively. The center lines of the multiple ray beams generated by the multiple focal points intersect at a target point. The conveying device conveys the card slot through the target point along a conveying direction. The multiple ray beams generated by the multiple focal points pass through the target point and are received by a receiving surface of the detector. The areas of the receiving surface of the detector used to receive the multiple ray beams generated by the multiple focal points do not overlap with each other. The device can generate multiple ray beams simultaneously through the multiple focal points of the ray source, and efficiently perform three-dimensional detection on the detected object.

Description

Technical Field

[0001] This disclosure relates to the field of radiographic inspection, and more specifically to a radiographic inspection device based on three-dimensional perspective, an inspection method using the device, and corresponding electronic equipment, media, and software products. Background Technology

[0002] With the development of digital technology, the precision of various high-precision components (such as integrated circuits, sensors, optical components, etc.) is increasing, and the demand is also growing. These high-precision components inevitably encounter various problems during production and processing. Therefore, these components require high-precision testing before being put into use, with testing accuracy reaching the micrometer level. Taking integrated circuits (including but not limited to IC chips) as an example, problems such as broken or deformed leads, potting bubbles, and chip damage are unavoidable during the packaging process. Therefore, non-destructive testing of packaged integrated circuits is necessary to ensure a high yield rate.

[0003] Radiographic testing (such as X-ray inspection), as an effective method of non-destructive testing, has the ability to penetrate the object being inspected. By utilizing the different absorption characteristics of X-rays by different materials within the object, it allows for transmission imaging of the internal structure, thus enabling direct detection of internal defects. This provides a highly effective inspection method for the manufacturing process of these high-precision components. Among these methods, three-dimensional radiographic testing is particularly popular because it can construct the three-dimensional structure of the object by capturing multi-angle X-ray images, achieving more accurate and comprehensive quality inspection.

[0004] In related technologies, three-dimensional X-ray inspection generally uses three-dimensional CT inspection. Three-dimensional CT inspection typically uses a slip-ring CT scanner that rotates 360 degrees around the object being inspected, or mounts the X-ray source and detector on a robotic arm that rotates around the object at multiple positions and angles. This process requires the equipment to move at multiple angles and capture X-ray images at different positions. Therefore, completing a single three-dimensional inspection of the object takes a long time, and the inspection speed is far from meeting the high inspection rate requirements of industrial production lines. Summary of the Invention

[0005] In view of this, this disclosure provides a three-dimensional perspective-based X-ray inspection device, method, and corresponding electronic equipment, media, and program products that can improve inspection speed and capture multi-angle X-ray images to achieve three-dimensional inspection.

[0006] A first aspect of this disclosure provides a three-dimensional perspective-based X-ray inspection device. The device includes a support, an X-ray source, a detector, a conveying device, and at least one slot. The X-ray source, detector, and conveying device are all mounted on the support. The slot is disposed on the conveying surface of the conveying device.

[0007] The radiation source includes multiple focal points, each of which generates a radiation beam. The centerlines of the radiation beams from these focal points intersect at a target point. The receiving surface of the detector faces the radiation source. A transmission device is located between the radiation source and the detector, with its transmission surface passing through the target point. The transmission device transmits the slot along a transmission direction through the target point; the slot is capable of holding the object to be detected. After passing through the object to be detected in the slot located at the target point, the radiation beams generated by the multiple focal points are received by the receiving surface of the detector, where the areas on the receiving surface of the detector used to receive the radiation beams generated by the multiple focal points do not overlap.

[0008] According to some embodiments of this disclosure, the apparatus further includes a controller, wherein the controller is configured to control the plurality of focal points to simultaneously generate ray beams.

[0009] According to some embodiments of this disclosure, the controller is further configured to segment the ray projection detected by the detector into multiple projection images according to the correspondence with the multiple focal points, and perform tomographic reconstruction based on the multiple projection images to obtain the three-dimensional structural information of the detected object.

[0010] According to some embodiments of this disclosure, the detector is composed of multiple sub-flat panel detectors spliced ​​together, wherein each sub-flat panel detector receives a beam of radiation generated by one of the multiple focal points.

[0011] According to some embodiments of this disclosure, the conveying device conveys the slot to the target point in a step-by-step manner.

[0012] According to some embodiments of this disclosure, the device further includes a position detection device, wherein the position detection device is disposed on the bracket or the radiation source, and is used to detect whether the center of the card slot coincides with the target point after the conveying device conveys the card slot to the target point and stops, and output the detection result.

[0013] According to some embodiments of this disclosure, the plurality of focal points are located on a first plane.

[0014] According to some embodiments of this disclosure, the plurality of focal points are arranged in a two-dimensional manner within the first plane.

[0015] According to some embodiments of this disclosure, the plurality of focal points are distributed on an arc, and the line connecting the center of the arc and the target point is perpendicular to the first plane.

[0016] According to some embodiments of this disclosure, the plurality of focal points are evenly distributed on the arc.

[0017] According to some embodiments of this disclosure, the receiving surface of the detector is located on a second plane, and the first plane and the second plane are parallel; and the transmitting surface of the transmitting device is located in a third plane that is parallel to the first plane and the second plane.

[0018] According to some embodiments of this disclosure, the radiation source further includes a collimator, which includes a plurality of collimating holes, the position of each collimating hole corresponding to the position of each focal point.

[0019] According to some embodiments of this disclosure, the apparatus further includes a collimator adjustment mechanism. The collimator adjustment mechanism, connected to the collimator, is used to adjust the position and / or size of the collimation aperture in the collimator.

[0020] According to some embodiments of this disclosure, the at least one card slot includes a plurality of card slots, wherein the plurality of card slots are the same or different in size; or, the card slot includes at least one sub-card slot.

[0021] According to some embodiments of this disclosure, the plurality of card slots are arranged in a one-dimensional linear array along the conveying direction of the conveying device.

[0022] According to some embodiments of this disclosure, the device further includes a conveying device lifting structure movably disposed on the support, wherein the conveying device lifting structure is movable in a direction perpendicular to the conveying surface, and the conveying device is connected to the support through the conveying device lifting structure.

[0023] According to some embodiments of this disclosure, the device further includes a detector lifting structure movably disposed on the bracket, wherein the detector lifting structure is movable in a direction perpendicular to the conveying surface, and the detector is connected to the bracket through the detector lifting structure.

[0024] According to some embodiments of this disclosure, the plurality of slots are arranged in a two-dimensional rectangular array on the transmission surface, wherein the first dimension of the two-dimensional rectangular array is parallel to the transmission direction and the second dimension is perpendicular to the transmission direction; wherein the radiation source and the detector are movably disposed on the bracket, and the movement direction of the radiation source and the detector relative to the bracket is parallel to the second dimension.

[0025] A second aspect of this disclosure provides a ray inspection method based on three-dimensional perspective, applied to the aforementioned ray inspection device based on three-dimensional perspective. The method includes: with an object to be inspected held in a slot, controlling a conveying device to convey the object to be inspected toward a target point; in response to the slot reaching the target point, controlling the conveying device to stop conveying, and controlling multiple focal points in the ray source to simultaneously generate ray beams; acquiring the detection results of the detector on the received ray beams, wherein the detection results include multiple projected images corresponding one-to-one with the multiple focal points; and constructing three-dimensional structural information of the object to be inspected based on the detection results.

[0026] According to some embodiments of this disclosure, constructing the three-dimensional structural information of the detected object based on the detection results includes: segmenting the ray projection detected by the detector into multiple projection images according to the correspondence with the multiple focal points; and performing tomographic reconstruction based on the multiple projection images to obtain the three-dimensional structural information of the detected object.

[0027] According to some embodiments of this disclosure, a plurality of the objects to be detected are held in the card slot, and the plurality of objects to be detected are laid out flat or stacked in center alignment in the card slot. The step of constructing the three-dimensional structural information of the objects to be detected based on the detection results further includes: constructing the overall three-dimensional structural information of the plurality of objects to be detected based on the detection results; and extracting the three-dimensional structural information of each object to be detected from the overall three-dimensional structural information based on the positional relationship of the plurality of objects to be detected in the card slot.

[0028] A third aspect of this disclosure provides an electronic device. The electronic device includes: one or more processors; and a memory for storing one or more computer programs. The one or more processors execute the one or more computer programs to implement the steps of the method described above.

[0029] A fourth aspect of this disclosure provides a computer-readable storage medium having a computer program or instructions stored thereon. When executed by a processor, the computer program or instructions implement the steps of the method described above.

[0030] A fifth aspect of this disclosure provides a computer program product, including a computer program or instructions. When executed by a processor, the computer program or instructions implement the steps of the method described above.

[0031] The above-described one or more embodiments have the following advantages or benefits: The object to be inspected, fixed in the slot, is delivered to the target point below the X-ray source via a conveying device. Then, multiple focal points in the X-ray source simultaneously generate X-ray beams from different angles to irradiate the object. A detector receives the projected images of the X-ray beams passing through the object, and these projected images do not overlap. Therefore, the three-dimensional structural information of the object can be constructed based on these projected images. In this way, multi-angle perspective images of the object can be acquired with a single X-ray emission from the X-ray source. Compared to three-dimensional CT detection technology, the speed of three-dimensional detection of the object is significantly reduced, and the detection efficiency is greatly improved. Attached Figure Description

[0032] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0033] Figure 1 The schematic diagram illustrates the structure of a three-dimensional perspective-based ray inspection device according to an embodiment of the present disclosure;

[0034] Figure 2 The illustration schematically shows the spatial relationship between the X-ray source, the transmission device, and the detector in a three-dimensional perspective-based X-ray detection apparatus according to an embodiment of the present disclosure.

[0035] Figure 3 The diagram illustrates the spatial geometry of multiple focal points, integrated circuits, and detectors in a three-dimensional perspective-based X-ray inspection device according to an embodiment of the present disclosure.

[0036] Figure 4 The illustration schematically shows the process of a focal point generating X-ray beam detection integrated circuit in a three-dimensional perspective-based X-ray inspection apparatus according to an embodiment of the present disclosure;

[0037] Figure 5 The illustration schematically depicts the process of a focal point generation X-ray beam detection integrated circuit in a three-dimensional perspective-based X-ray inspection apparatus according to another embodiment of the present disclosure.

[0038] Figure 6 The schematic diagram illustrates the structure of a three-dimensional perspective-based ray inspection device according to another embodiment of the present disclosure;

[0039] Figure 7 A flowchart illustrating a 3D perspective-based ray detection method according to an embodiment of the present disclosure is shown schematically; and

[0040] Figure 8 A block diagram schematically illustrates an electronic device suitable for implementing a three-dimensional perspective-based ray inspection method according to embodiments of the present disclosure.

[0041] Figure label:

[0042] X-ray source 1, detector 2, integrated circuit 3, transmission device 4, slot 5, bracket 6, controller 7, cable 8, collimator 9, position detection device 10, transmission device lifting structure 11, detector lifting structure 12, focal point 101, focal point 202, focal point 303, focal point 404, focal point 505, focal point 606, projection area 101, projection area 202, projection area 303, projection area 404, projection area 505, projection area 606. Detailed Implementation

[0043] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the invention. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the invention for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concept of the invention.

[0044] This disclosure provides a three-dimensional perspective-based X-ray inspection device and corresponding inspection method. While achieving three-dimensional perspective inspection of high-precision components, it can significantly improve inspection speed, meeting the rapid inspection requirements of high-precision components across all dimensions. Here, "high-precision components" refers to components with high inspection accuracy requirements (e.g., requiring inspection accuracy to reach the micrometer level, such as 5 micrometers).

[0045] Specifically, the X-ray inspection device based on three-dimensional perspective according to this disclosure embodiment may include: a support, an X-ray source, a detector, a conveying device, and at least one slot. The support is used to fix the positional relationship between the X-ray source, the detector, and the conveying device. The slot is disposed on the conveying surface of the conveying device and is used to fix the object to be inspected.

[0046] The X-ray source includes multiple focal points, such as three or more. Each focal point in the X-ray source can generate a separate X-ray beam, wherein the centerlines of the X-ray beams generated by the multiple focal points intersect at a target point. In embodiments of this disclosure, the X-ray beams generated by the multiple focal points of the X-ray source may intersect in space at a point below the X-ray source (referred to herein as the target point). In some embodiments, the spatial position of the intersection point (target point) of the centerlines of the X-ray beams generated by the multiple focal points can be adjusted by adjusting the tilt angle of the X-ray beams generated by the multiple focal points on the X-ray source, to adapt to the detection needs of objects of different sizes, etc.

[0047] The detector's receiving surface faces the radiation source. The detector is positioned opposite the radiation source, with its receiving surface pointing towards it, allowing it to receive radiation beams generated by multiple focal points within the source.

[0048] The transmission device is located between the radiation source and the detector. The transmission surface of the device passes through the target point P.

[0049] A slot is disposed on the conveying surface of a conveying device, which can transport the slot past the target point P along the conveying direction. The slot is capable of holding the object being inspected. Thus, when the object is fixed in the slot, and the slot is transported to the target point P and held there, the X-ray beams generated by multiple focal points in the X-ray source can all pass through the object being inspected.

[0050] In this embodiment of the disclosure, the X-ray beams generated by multiple focal points pass through the object being detected in the slot located at the target point and can be received by the receiving surface of the detector. Moreover, the areas on the receiving surface of the detector used to receive the X-ray beams generated by multiple focal points do not overlap. Thus, the X-ray beams generated by multiple focal points of the X-ray source, after penetrating the same object being detected, are projected onto different areas of the detector, and the projections of X-ray beams generated by different focal points on the detector do not overlap.

[0051] The X-ray inspection device based on three-dimensional perspective according to embodiments of this disclosure may further include a controller. The controller can be connected to the X-ray source via a cable to control multiple focal points to simultaneously generate X-ray beams. Since the projections of the X-ray beams generated by the multiple focal points on the detector do not overlap, multiple focal points can generate X-ray beams simultaneously without affecting the signal acquisition of the detector. Thus, X-ray beams can be generated at one time through multiple focal points to illuminate the object under inspection from different angles, thereby obtaining perspective images of the object under inspection from different angles.

[0052] The controller can also be connected to the detector via a cable to divide the ray projection detected by the detector into multiple projection images according to the correspondence with multiple focal points in the ray source, and then perform tomographic reconstruction on the multiple projection images to obtain the three-dimensional structural information of the object being detected.

[0053] According to embodiments of this disclosure, the controller can control the conveying device to deliver the object to be inspected, fixed thereon, to the target location below the X-ray source via a slot. Then, the controller can control multiple focal points in the X-ray source to simultaneously generate X-ray beams. The direct portion of the X-ray beams after penetrating the object to be inspected can be received by the detector. The detector transmits the received signal to the controller, which processes the signal. Specifically, the controller can segment the corresponding relationship between the projections of the X-ray beams generated by different focal points obtained by the detector. Then, based on the spatial relationship between the focal point positions, the position of the object to be inspected, and the projection position on the detector, the segmented image information from different angles is tomographically reconstructed to form the three-dimensional structural information of the object to be inspected. Based on this three-dimensional structural information, the quality of the object to be inspected is determined, and the internal fine structure of the object to be inspected can be displayed, such as as a three-dimensional image. In this way, multi-angle perspective images of the object to be inspected can be acquired with a single X-ray emission, thereby quickly constructing the three-dimensional structural information of the object to be inspected. The detection speed is significantly reduced compared to three-dimensional CT detection technology, and the detection efficiency is greatly improved.

[0054] The following will describe in detail the X-ray inspection device and method based on three-dimensional perspective according to embodiments of this disclosure, taking integrated circuits as the object to be inspected and in conjunction with the accompanying drawings. It should be noted that the object to be inspected in this invention can be any type of high-precision component, and is not limited to integrated circuits.

[0055] The following is combined with Figures 1-6 This document provides a detailed description of the 3D perspective-based ray inspection device according to embodiments of the present disclosure. It should be understood that the structures of the 3D perspective-based ray inspection devices illustrated below are merely examples and do not constitute a limitation of the present solution.

[0056] refer to Figures 1-2 According to an embodiment of the present disclosure, a three-dimensional perspective-based X-ray inspection device may include an X-ray source 1, a detector 2, an integrated circuit 3, a transmission device 4, a card slot 5, a bracket 6, a controller 7, and a cable 8, etc.

[0057] The radiation source 1 is a multifocal radiation source that can generate radiation beams from multiple different positions. For example, the emission source 1 may include four focal points, specifically focal point 101, focal point 102, focal point 103, and focal point 104.

[0058] Detector 2 can be a high-resolution, small-pixel, large-size flat panel detector.

[0059] The conveying device 4 is provided with a slot 5, and the integrated circuit 3 is fixed in the slot 5.

[0060] like Figure 2As shown, the four focal points in the X-ray source 1 can be located on the same plane, i.e., distributed within the first plane. Correspondingly, the receiving surface of the detector 2 can be located on the second plane, with the first and second planes parallel. The transmitting surface of the transmitting device 4 is located within a third plane parallel to the first and second planes. The integrated circuit 3, fixed by the slot 5, is located on the third plane between the first and second planes and parallel to the first plane.

[0061] Multiple focal points of the X-ray source 1 can be arranged in two dimensions in the first plane. The line connecting the geometric center O of the multiple focal points and the geometric center M of the detector 2 is defined as the axis. The axis is perpendicular to the first plane, and each focal point of the X-ray source 1 is arranged centripetally, that is, the center lines of the X-ray beams generated by each focal point intersect at a point on the axis, which is the target point P.

[0062] Through the transport device 4, the geometric center of the integrated circuit 3 can reach the axis and coincide with the target point P. The transport device 4 can have multiple slots 5, which can form a linear array. The transport device 4 can move in a step-by-step manner; that is, one movement delivers one integrated circuit 3 below the ray source 1 to coincide with the target point P on the axis, and the next movement delivers the next integrated circuit 3 to the target point P below the ray source 1.

[0063] Detector 2 can be composed of multiple sub-flat panel detectors spliced ​​together, where each sub-flat panel detector can receive the X-ray beam generated by a focal point and passing through the integrated circuit 3, so that different sub-flat panel detectors can obtain the transmission projection image of the same integrated circuit 3 after being irradiated by different focal points.

[0064] The X-ray source 1, detector 2, and transmission device 4 are fixed to the support 6, thereby ensuring that the multiple focal points of the X-ray source 1 are located in the first plane, the detector 2 in the second plane, and the integrated circuit 3 in the third plane, wherein the first, second, and third planes are parallel. Furthermore, the line connecting the geometric center O of the multiple focal points of the X-ray source 1 and the geometric center M of the detector 2 (the axis) is perpendicular to the first, second, and third planes. The four focal points of the X-ray source 1 can be evenly distributed on an arc within the first plane, with the center of the arc at O. The four focal points are arranged concentrically, meaning that the X-ray beams emitted from the four focal points are inclined towards the axis when emitted from below, and the centerlines of the X-ray beams intersect at a point on the axis (i.e., the target point P). After transmission by the transmission device 4, the geometric center of the integrated circuit 3 can reach the target point P.

[0065] Multiple focal points in the X-ray source 1, fixed above the support 6, can simultaneously generate X-ray beams downwards. The detector 2, fixed below the support 6, has its receiving surface facing upwards, receiving X-ray beams generated from the multiple focal points and passing through the integrated circuit 3. This arrangement is called a relative arrangement between the detector 2 and the X-ray source 1. A conveying device 4, fixed in the middle of the support 6, can deliver one integrated circuit 3 at a time to the target point P below the X-ray source 1 to receive X-ray irradiation via a linear array of slots 5.

[0066] The radiation source 1, detector 2, and transmission device 4 are connected to the controller 7 via cable 8 and operate under the control of the controller 7.

[0067] The X-ray beam generated by the first focal point 101 penetrates the integrated circuit 3 and is projected onto the first projection area 201 of the detector 2. The X-ray beam generated by the second focal point 102 penetrates the integrated circuit 3 and is projected onto the second projection area 202 of the detector 2. The X-ray beam generated by the third focal point 103 penetrates the integrated circuit 3 and is projected onto the third projection area 203 of the detector 2. The X-ray beam generated by the fourth focal point 104 penetrates the integrated circuit 3 and is projected onto the fourth projection area 204 of the detector 2. That is, the projections of the X-ray beams generated by different focal points onto the detector 2 do not overlap.

[0068] By generating four beams at four different angles from four focal points to irradiate the same integrated circuit 3, and projecting the beams through the integrated circuit 3 onto different areas of the detector 2, the generation of beams by each focal point to penetrate the integrated circuit and the acquisition of signals to the detector are relatively independent. Specifically, because the four focal points are located at different positions, the imaging angles irradiating the integrated circuit 3 are different, meaning that the information acquisition at each angle is independent. At the same time, this structure allows the four focal points to generate beams simultaneously, achieving simultaneous detection and information acquisition of the integrated circuit 3, which significantly shortens the multi-angle detection time and greatly improves the detection efficiency. Moreover, after acquiring the transmission information of the integrated circuit 3 from four different angles at once, the three-dimensional structural information of the integrated circuit 3 can be constructed using software algorithms to achieve three-dimensional imaging.

[0069] The four focal points of X-ray source 1 can be evenly distributed on the circumference, making the information acquired from different angles more uniform and effective, which is beneficial for 3D image reconstruction. This structure, with the axis perpendicular to the three planes and the four focal points concentric, allows the entire system to be tightly arranged around the axis, resulting in a compact and small overall size. The projection of the X-ray beam also revolves around the axis, thus maximizing the utilization of the detector area. Since detectors are expensive, a smaller system size leads to higher detector area utilization and lower costs.

[0070] In this embodiment, the X-ray source 1, detector 2, and transmission device 4 are connected to the controller 7 via cable 8. The controller 7 controls the movement of the transmission device 4 to transport an integrated circuit 3 to a fixed position in the third plane below the X-ray source 1 (i.e., the center of the integrated circuit 3 reaches the target point P). The controller 7 controls the four focal points of the X-ray source 1 (focal point 101, focal point 102, focal point 103, and focal point 104) to simultaneously generate X-ray beams. The four X-ray beams simultaneously pass through the integrated circuit 3 and are projected onto the first projection area 201, the second projection area 202, the third projection area 203, and the fourth projection area 204 on the detector 2, respectively. The detector 2 simultaneously collects the projection signals of the four X-ray beams, converts them into four transmission signals corresponding to the internal structure of the integrated circuit 3 but with different transmission angles, and outputs them to the controller 7. The controller 7 processes the four different angle transmission information of the integrated circuit 3 to obtain three-dimensional information of the internal structure of the integrated circuit 3, and then displays or performs quality judgment.

[0071] In this embodiment, the four focal points of the X-ray source 1 operate simultaneously, and the detector 2 simultaneously acquires and outputs transmission information from four different angles, improving the imaging and detection efficiency by four times compared to traditional single-focal-point imaging. After obtaining the perspective information from the integrated circuit 3 at four different angles, the controller 7 can reconstruct the layered three-dimensional structural information of the integrated circuit 3 along the axial direction using a tomographic imaging algorithm, thereby achieving high-precision three-dimensional imaging.

[0072] In this embodiment, the positions of the X-ray source 1 and detector 2 remain stationary; only the transmission device 4 drives the integrated circuit 3 in one-dimensional motion. According to the results of an actual test, the motion positioning time is approximately 0.5 seconds, and the simultaneous imaging time of the four micro-focal points is approximately 0.5 seconds, thus a single 3D inspection only requires 1 second. In comparison, a traditional slip-ring CT system requires several minutes for the X-ray source and detector to rotate around the integrated circuit for imaging; similarly, a 3D inspection system using a robotic arm to drive the X-ray source and detector to take multiple angle images around the integrated circuit requires several seconds for each angle's rotation and imaging, with the overall time also on the order of minutes. The comparison shows that the X-ray inspection device based on 3D perspective in this embodiment has the significant advantages of simple structure and fast 3D imaging inspection speed.

[0073] Figure 3 The schematic diagram illustrates the spatial geometry of multiple focal points, integrated circuits, and detectors in a three-dimensional perspective-based ray inspection device according to an embodiment of the present disclosure.

[0074] refer to Figures 1-3The first plane containing the four focal points of X-ray source 1, the second plane containing detector 2, and the third plane containing integrated circuit 3 are parallel to each other. The line connecting the geometric center O of the multiple focal points and the center M of detector 2 (i.e., the axis) is perpendicular to the first plane. The distance from the second plane to the first plane is defined as D1, and the distance from the third plane to the first plane is defined as D2. For each focal point, taking the first focal point 101 as an example, the distance to the geometric center O is defined as R, and the size of integrated circuit 3 is defined as S. Then, the spatial position settings of the multiple focal points, integrated circuit 3, and detector 2 in X-ray source 1 should satisfy the relationship shown in the following formula (1):

[0075] (1)

[0076] in Figure 3 Part (A) shows the spatial arrangement of the three components, namely the first focus 101, the integrated circuit 3, and the detector 2, which satisfies the relationship shown in equation (2).

[0077] (2)

[0078] In this case, the area of ​​detector 2 can be minimized, but the edges of the ray projections are adjacent, which poses a risk that images at different angles are not easy to segment in actual engineering implementation.

[0079] in Figure 3 Part (B) shows the spatial arrangement of the three components, namely the first focus 101, the integrated circuit 3, and the detector 2, which satisfies the relationship shown in equation (3).

[0080] (3)

[0081] In this case, the detector area is slightly larger, but the edges of the ray projections are not adjacent, making it easy to segment images from different angles in actual engineering implementation.

[0082] Understandable. Figure 3 The example shown is based on focus 101. According to the embodiments of this disclosure, the position of each focus in the X-ray source 1 satisfies the condition in equation (4) below.

[0083] (4)

[0084] refer to Figure 4 According to another embodiment of this disclosure, the X-ray inspection device based on three-dimensional perspective may further include a collimator 9, wherein the collimator 9 is installed below the X-ray source 1. The collimator 9 is provided with the same number of collimation holes as the focal points in the X-ray source 1, and the positions of the collimation holes correspond to the positions of each focal point.

[0085] In some embodiments, the X-ray inspection device based on three-dimensional perspective may further include a collimator adjustment mechanism. This collimator adjustment mechanism may be connected to the collimator 9 and used to adjust the position and / or size of the collimation aperture in the collimator 9.

[0086] The X-ray source 1 has four focal points, which are evenly distributed on a circle with center O. The four focal points correspond to the four corner points of the integrated circuit 3, and the line connecting each focal point to the corresponding corner point of the integrated circuit 3 intersects at a point N on the axis. N is located between the second plane and the third plane, that is, between point M and target point P.

[0087] The size and shape of the collimation aperture ensure that the beams generated by the four focal points are collimated and then obliquely directed from below to the target point P on the axis. The beams are just large enough to cover the integrated circuit 3 located at the target point P. They then pass through the integrated circuit 3 and are projected onto the detector 2 to form four non-overlapping projection areas, namely projection area 1 201, projection area 202, projection area 3 203, and projection area 4 204.

[0088] Figure 4 The image shows the state where the ray beam generated by the first focal point 101 is collimated by the collimator 9 to just cover the integrated circuit 3. The shape of the collimated ray beam (the four corners of a square) is represented by solid lines. Figure 4 As shown, detector 2 can be composed of four small flat panel detectors, each of which can receive and output the projection of the X-ray beam at exactly one angle. This embodiment illustrates the specific geometric structure design scheme for imaging at four focal points in the X-ray source. It specifically demonstrates the aforementioned centripetal arrangement of multiple focal points, the uniform arrangement of multiple focal points on the circumference, the axis perpendicular to three parallel planes, the arrangement of collimator 9, and the relationship between the focal point position and the size of integrated circuit 3 and the spatial position of detector 2. This achieves a compact overall structure, a small overall detector area, simultaneous beam detection at four focal points, a reasonable layout of four different transmission angles, and the effect that four different image information are received and synchronously output by small-sized detectors. This facilitates the controller to reconstruct the three-dimensional structural information of integrated circuit 3 through tomography algorithms, and has the advantages of low cost, high detection efficiency, and high detection speed.

[0089] refer to Figure 5According to another embodiment of this disclosure, the X-ray source 1 in the three-dimensional perspective-based X-ray detection device can have six focal points, namely, focal point 101, focal point 102, focal point 103, focal point 104, focal point 105, and focal point 106. These six focal points can be distributed on a circle with center O. Each focal point is arranged concentrically, meaning that the X-ray beams generated by each focal point are emitted downwards and all pass through the target point P. The X-ray beams generated by these six focal points, after being collimated by collimator 9, can cover the integrated circuit 3 centered at the target point P. After penetrating the integrated circuit 3, the X-ray beams at different angles form six non-overlapping projection areas on the detector 2, which has a large area, namely, projection area 201, projection area 202, projection area 203, projection area 204, projection area 205, and projection area 206. In this embodiment, the detector 2 has a large area, allowing it to receive a large area of ​​X-ray projection. With more focal points in X-ray source 1, more perspective imaging angles are obtained, and richer information from different directions is acquired in a single imaging session. Therefore, the 3D image obtained through tomographic imaging algorithms has richer detail information, which is beneficial for more accurate 3D imaging. Similarly, it is feasible to further increase the number of focal points in X-ray source 1 to obtain X-ray beam projection data from more angles.

[0090] refer to Figure 6 According to another embodiment of this disclosure, the X-ray detection device based on three-dimensional perspective may further include a position detection device 10, a conveying device lifting structure 11, and a detector lifting structure 12.

[0091] The position detection device 10 is mounted on the bracket 6 and connected to the controller 7 via the cable 8.

[0092] The position detection device 10 is mounted on the bracket 6 or on the X-ray source 1. It is used to detect whether the center position of the integrated circuit 3 in the slot 5 (or the center of the slot 5) is on the target point P or the axis during the pause after the conveyor device 4 has moved. The detection result is fed back to the controller 7. Based on the detection result of the position detection device 10, the controller 7 decides whether to control the conveyor device 4 to adjust its position or how to adjust it, ultimately achieving precise positioning of the integrated circuit 3. This helps reduce positioning errors, minimize false or missed detections, and improve detection efficiency and effectiveness. Furthermore, the precise positioning of the integrated circuit 3 ensures that the X-ray beams generated by each focal point of the X-ray source 1 can effectively pass through the integrated circuit 3 and form non-overlapping projections on the detector 2, which is beneficial for the segmentation of images from different angles and the accurate reconstruction of three-dimensional images.

[0093] The lifting structure 11 of the conveying device is located between the conveying device 4 and the support 6. The lifting structure 11 can be connected to the controller 7 via cable 8. Under the control of the controller 7, the conveying device 4 can move up and down along the axis to adjust the distance between the integrated circuit 3 on the conveying device 4 and the X-ray source 1, such as adjusting the distance D2 between the third plane and the first plane. When the size S of the integrated circuit 3 changes, the controller 7 drives the lifting structure 11 of the conveying device to adjust the position of the conveying device 4 so that the geometric positional relationship between the focal point of the X-ray source 1, the integrated circuit 3, and the detector 2 still meets the requirements in equation (1). While adjusting the distance D2 between the third plane and the first plane, the controller 7 simultaneously controls the emission angle of the X-ray beams generated by multiple focal points in the X-ray source 1 so that the intersection of the X-ray beams generated by multiple focal points is located on the third plane. In this way, when inspecting integrated circuits of different sizes, the optimal geometric relationship can be maintained, so that the X-ray beam can fully cover the integrated circuit, obtain more accurate images, and improve the inspection quality.

[0094] The detector lifting structure 12 is located between the detector 2 and the support 6. The detector lifting structure 12 is connected to the controller 7 via the cable 8. Under the control of the controller 7, the detector 2 can move up and down along the axis, that is, adjust the distance D1 between the second plane and the first plane. In this way, when the size S of the integrated circuit 3 changes, the controller 7 drives the detector lifting structure 12 to adjust the position of the detector 2, so that the geometric positional relationship between the focal point of the X-ray source 1, the integrated circuit 3 and the detector 2 still meets the requirements of equation (1). Therefore, when detecting integrated circuits of different sizes, the optimal geometric relationship can be maintained, more accurate images can be obtained and the detection quality can be improved.

[0095] In some embodiments, the focal spot in the X-ray source 1 can be a micro-focal spot with a size not exceeding 20um*20um. The small focal spot size enables the detection device to have ultra-high resolution and achieve high-precision detection.

[0096] In some embodiments, detector 2 can be a large-size flat panel detector with high resolution and small pixels, with a pixel size not exceeding 50µm*50µm. The small pixel size further enables the detection device to have ultra-high resolution, achieving high-precision detection. In some embodiments, the large-size detector can be composed of multiple smaller-size flat panel detectors spliced ​​together.

[0097] In this embodiment, the conveying device 4 can have multiple slots 5, which can be the same or different in size. When the multiple slots are of different sizes, matching of integrated circuits of different sizes can be achieved. As long as the center of the slot 5 moves through the conveying device 4, the center of the slot 5 can be positioned at the target point P where the center lines of the multiple focal points of the X-ray source 1 converge, thus achieving high-precision and rapid three-dimensional detection.

[0098] According to some embodiments of this disclosure, each card slot 5 may include at least one sub-card slot. Thus, one card slot can also be used to secure integrated circuits of different sizes. Alternatively, when a card slot has multiple sub-card slots, one card slot can secure multiple integrated circuits at once through the sub-card slots.

[0099] When a card slot includes multiple sub-slots, in one embodiment, the multiple sub-slots can be laid flat within the card slot, and the geometric centers of the multiple sub-slots remain at the center of the card slot. Thus, when multiple integrated circuits are fixed in one card slot, they can be arranged in the same plane, and the geometric centers of the multiple integrated circuits remain at the target point P. This allows the ray beam generated by each focal point to simultaneously cover all multiple integrated circuits, and the projections of ray beams generated by different focal points onto the detector do not overlap. In this way, multiple integrated circuits can be simultaneously subjected to three-dimensional high-definition imaging inspection, resulting in higher inspection efficiency.

[0100] When a card slot includes multiple sub-slots, in one embodiment, the multiple sub-slots can be stacked vertically, aligned with the center of the card slot. Another scenario where multiple integrated circuits are fixed in one slot is that multiple integrated circuits are stacked along an axial direction, with the geometric center of each integrated circuit maintained at the target point P, and the ray beam generated by each focal point simultaneously covering all multiple integrated circuits, with no overlap in the projections of the ray beams on the detector. This allows for simultaneous three-dimensional high-definition imaging inspection of multiple integrated circuits, resulting in higher inspection efficiency. For example, the overall three-dimensional structure of the stacked integrated circuits can be reconstructed using tomographic analysis. Based on the reconstructed structural information, defects can be quickly identified among the stacked integrated circuits. If defects are found, their distribution in the three-dimensional structure can pinpoint which integrated circuit is affected, or the stacked integrated circuits can be re-inspected individually.

[0101] In some embodiments, the multiple slots on the transfer surface can also be arranged in a two-dimensional rectangular array, wherein the first dimension of the two-dimensional rectangular array is parallel to the transfer direction, and the second dimension is perpendicular to the transfer direction. Correspondingly, both the X-ray source 1 and the detector 2 are movably mounted on the support 6, and the movement direction of the X-ray source 1 and the detector 2 relative to the support 6 is parallel to the second dimension. In this way, more integrated circuits can be transferred on the transfer device 4 without altering the production line where the transfer device 4 is located, and the detection capability of the three-dimensional perspective-based X-ray inspection device can be expanded by synchronously moving the X-ray source 1 and the detector 2 in the planes of their respective locations along a direction perpendicular to the transfer direction.

[0102] The controller 7 in this embodiment may include human-machine interface hardware, control circuit hardware, signal processing hardware, image processing software, and image display hardware. Through these software and hardware components, the controller enables operators to control the 3D perspective-based X-ray inspection device, manage the logic and coordination of its internal components, analyze and process detector signals, generate high-precision 3D images from integrated circuits, and display 3D images. This ensures correct control logic, smooth workflow, and comprehensive automatic detection and quality diagnosis functions of the integrated circuits, reducing operator intervention, improving automation and work efficiency, reducing user difficulty, and saving costs.

[0103] The controller 7 in this embodiment may further include a storage device and AI software. In addition to storing images of integrated circuits, the storage device may also store theoretical structural data of various integrated circuits and standard X-ray inspection image information. The AI ​​software can intelligently segment the X-ray images obtained from each inspection. For example, the AI ​​software can acquire perspective images from four angles obtained in a single inspection, and reconstruct three-dimensional image information based on these four perspective images using a tomographic imaging algorithm. The AI ​​software can also compare and analyze the three-dimensional image information with the theoretical structural data of the integrated circuit and automatically provide quality result judgments, including marking abnormal locations and quality defect points. Thus, by integrating a storage device and AI software into the controller 7, the X-ray inspection device based on three-dimensional perspective can further improve automatic detection and intelligent diagnosis capabilities, reduce worker intervention, increase intelligence and work efficiency, reduce user difficulty, and save costs.

[0104] This disclosure also provides embodiments applicable to the above. Figures 1-6 For details regarding the radiation detection method of the described device, please refer to [link / reference]. Figure 7 To illustrate.

[0105] Figure 7A flowchart illustrating a 3D perspective-based ray inspection method according to an embodiment of the present disclosure is shown. This method can be applied to a 3D perspective-based ray inspection apparatus according to an embodiment of the present disclosure, and for example, can be executed by a controller 7.

[0106] like Figure 7 As shown, combined with Figures 1-6 This method may include operations S701 to S704.

[0107] When operating S701, with the integrated circuit 3 held in the card slot 5, the control transfer device 4 transfers the integrated circuit 3 to the target point.

[0108] In operation S702, in response to the card slot 5 reaching the target point, the control transmission device 4 stops transmission and controls multiple focal points in the radiation source 1 to generate radiation beams simultaneously.

[0109] In operation S703, the detection results of the detector 2 on the received ray beam are acquired, wherein the detection results include multiple projection images corresponding one-to-one with multiple focal points.

[0110] In operation S704, the three-dimensional structural information of integrated circuit 3 is constructed based on the detection results. For example, the ray projection detected by detector 2 can be divided into multiple projection images according to the correspondence with multiple focal points, and then tomographic reconstruction can be performed based on multiple projection images to obtain the three-dimensional structural information of integrated circuit 3.

[0111] According to the embodiments of this disclosure, when multiple integrated circuits are held in the card slot 5, and the multiple integrated circuits are laid out flat or stacked in center alignment in the card slot 5, in the above-mentioned operation S704, the overall three-dimensional structure information of the multiple integrated circuits can be constructed based on the detection results. Then, based on the positional relationship of the multiple integrated circuits in the card slot 5, the three-dimensional structure information of each integrated circuit can be extracted from the overall three-dimensional structure information.

[0112] As can be seen, the detection method of this embodiment can simultaneously emit multiple focal points in the X-ray source 1 to acquire multi-angle perspective images of the integrated circuit at one time. Then, based on the tomographic reconstruction of the multi-angle perspective images, the three-dimensional structural information of the integrated circuit can be quickly constructed. The detection speed is significantly shortened compared with the three-dimensional CT detection technology, and the detection efficiency is greatly improved.

[0113] Figure 8 A block diagram schematically illustrates an electronic device 800 suitable for implementing a three-dimensional perspective-based ray inspection method according to embodiments of the present disclosure.

[0114] like Figure 8As shown, an electronic device 800 according to an embodiment of the present invention includes a processor 801, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 802 or a program loaded from a storage portion 808 into a random access memory (RAM) 803. The processor 801 may include, for example, a general-purpose microprocessor (e.g., a CPU), an instruction set processor and / or an associated chipset and / or a special-purpose microprocessor (e.g., an application-specific integrated circuit (ASIC)), etc. The processor 801 may also include onboard memory for caching purposes. The processor 801 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present invention.

[0115] RAM 803 stores various programs and data required for the operation of electronic device 800. Processor 801, ROM 802, and RAM 803 are interconnected via bus 804. Processor 801 executes various operations of the method flow according to embodiments of the present invention by executing programs in ROM 802 and / or RAM 803. It should be noted that programs may also be stored in one or more memories other than ROM 802 and RAM 803. Processor 801 may also execute various operations of the method flow according to embodiments of the present invention by executing programs stored in one or more memories.

[0116] According to an embodiment of the present invention, the electronic device 800 may further include an input / output (I / O) interface 805, which is also connected to a bus 804. The electronic device 800 may also include one or more of the following components connected to the I / O interface 805: an input section 806 including a keyboard, mouse, etc.; an output section 807 including a cathode ray tube (CRT), liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 808 including a hard disk, etc.; and a communication section 809 including a network interface card such as a LAN card, modem, etc. The communication section 809 performs communication processing via a network such as the Internet. A drive 810 is also connected to the I / O interface 805 as needed. A removable medium 811, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., is installed on the drive 810 as needed so that computer programs read from it can be installed into the storage section 808 as needed.

[0117] The present invention also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments; or it may exist independently and not assembled into the device / apparatus / system. The computer-readable storage medium carries one or more programs, which, when executed, implement the method according to the embodiments of the present invention.

[0118] According to embodiments of the present invention, a computer-readable storage medium may be a non-volatile computer-readable storage medium, such as including, but not limited to: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In the present invention, a computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. For example, according to embodiments of the present invention, a computer-readable storage medium may include ROM 802 and / or RAM 803 and / or one or more memories other than ROM 802 and RAM 803 described above.

[0119] Embodiments of the present invention also include a computer program product comprising a computer program containing program code for performing the methods shown in the flowchart. When the computer program product is run on a computer system, the program code is used to cause the computer system to implement the methods provided in the embodiments of the present invention.

[0120] When the computer program is executed by the processor 801, it performs the functions defined in the system / apparatus of this invention. According to embodiments of the invention, the systems, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0121] In one embodiment, the computer program may rely on a tangible storage medium such as an optical storage device or a magnetic storage device. In another embodiment, the computer program may also be transmitted and distributed in the form of signals over a network medium, and may be downloaded and installed via the communication section 809, and / or installed from a removable medium 811. The program code contained in the computer program can be transmitted using any suitable network medium, including but not limited to: wireless, wired, etc., or any suitable combination thereof.

[0122] In such an embodiment, the computer program can be downloaded and installed from a network via communication section 809, and / or installed from removable medium 811. When the computer program is executed by processor 801, it performs the functions defined in the system of this embodiment of the invention. According to embodiments of the invention, the systems, devices, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0123] According to embodiments of the present invention, program code for executing the computer programs provided in the embodiments of the present invention can be written in any combination of one or more programming languages. Specifically, these computational programs can be implemented using high-level procedural and / or object-oriented programming languages, and / or assembly / machine languages. Programming languages ​​include, but are not limited to, languages ​​such as Java, C++, Python, "C", or similar programming languages. The program code can be executed entirely on the user's computing device, partially on the user's device, partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0124] Those skilled in the art will understand that the features described in the various embodiments and / or claims of the present invention can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments and / or claims of the present invention can be combined or combined in various ways without departing from the spirit and teachings of the present invention. All such combinations and / or combinations fall within the scope of the present invention.

[0125] The embodiments of the present invention have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of the invention. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of the invention is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the invention, and all such substitutions and modifications should fall within the scope of the invention.

Claims

1. A ray inspection device based on three-dimensional perspective, characterized in that, The device includes: support; A radiation source is mounted on the support. The radiation source includes multiple focal points, each of which generates a radiation beam. The centerlines of the radiation beams generated by the multiple focal points intersect at the target point. A detector is mounted on the bracket, wherein the receiving surface of the detector faces the radiation source; A transmission device is mounted on the support and located between the radiation source and the detector, wherein the transmission surface of the transmission device passes through the target point; At least one card slot is disposed on the conveying surface of the conveying device, wherein the conveying device conveys the card slot past the target point along the conveying direction; wherein the card slot is capable of holding the object to be detected. The ray beams generated by the multiple focal points pass through the object being detected in the slot located at the target point and are received by the receiving surface of the detector. The areas on the receiving surface of the detector used to receive the ray beams generated by the multiple focal points do not overlap.

2. The X-ray inspection device based on three-dimensional perspective according to claim 1, characterized in that, The device further includes a controller, wherein the controller is used to control the plurality of focal points to simultaneously generate a beam of light.

3. The X-ray inspection device based on three-dimensional perspective according to claim 2, characterized in that, The controller is also used to segment the ray projection detected by the detector into multiple projection images according to the correspondence with the multiple focal points, and to perform tomographic reconstruction based on the multiple projection images to obtain the three-dimensional structural information of the detected object.

4. The X-ray inspection device based on three-dimensional perspective according to claim 1, characterized in that, The detector is composed of multiple sub-flat panel detectors spliced ​​together, wherein each sub-flat panel detector receives the X-ray beam generated by one of the multiple focal points.

5. The X-ray inspection device based on three-dimensional perspective according to claim 1, characterized in that, The conveying device conveys the card slot to the target point in a step-by-step manner.

6. The X-ray inspection device based on three-dimensional perspective according to claim 5, characterized in that, The device further includes a position detection device, wherein... The position detection device is mounted on the bracket or the X-ray source and is used to detect whether the center of the card slot coincides with the target point after the conveying device conveys the card slot to the target point and stops, and output the detection result.

7. The X-ray inspection device based on three-dimensional perspective according to claim 1, characterized in that, The plurality of focal points are located on the first plane.

8. The X-ray inspection device based on three-dimensional perspective according to claim 7, characterized in that, The receiving surface of the detector is located on the second plane, and the first plane and the second plane are parallel; and The conveying surface of the conveying device is located in a third plane that is parallel to the first plane and the second plane.

9. The X-ray inspection device based on three-dimensional perspective according to claim 1, characterized in that, The radiation source also includes a collimator, which includes multiple collimation holes, the position of which corresponds to the position of each focal point.

10. The X-ray inspection device based on three-dimensional perspective according to claim 1, characterized in that, The device further includes: A lifting structure for the conveying device is movably mounted on the support, wherein the lifting structure for the conveying device is capable of moving in a direction perpendicular to the conveying surface, and the conveying device is connected to the support through the lifting structure for the conveying device.

11. The X-ray inspection device based on three-dimensional perspective according to claim 1, characterized in that, The device further includes: A detector lifting structure is movably mounted on the bracket, wherein the detector lifting structure is capable of moving in a direction perpendicular to the conveying surface, and the detector is connected to the bracket through the detector lifting structure.

12. The X-ray inspection device based on three-dimensional perspective according to claim 1, characterized in that, The at least one card slot includes multiple card slots, which are arranged in a two-dimensional rectangular array on the transmission surface, wherein the first dimension of the two-dimensional rectangular array is parallel to the transmission direction and the second dimension is perpendicular to the transmission direction; Both the radiation source and the detector are movably mounted on the support, and the direction of movement of the radiation source and the detector relative to the support is parallel to the second dimension.

13. A ray inspection method based on three-dimensional perspective, applied to the ray inspection device based on three-dimensional perspective according to any one of claims 1 to 12, characterized in that, The method includes: With the object to be detected held in the slot, the conveying device is controlled to convey the object to be detected to the target point; In response to the slot reaching the target point, the transmission device is controlled to stop transmission, and multiple focal points in the radiation source are controlled to generate radiation beams simultaneously. The detector acquires the detection results of the received X-ray beam, wherein the detection results include multiple projected images corresponding one-to-one with the plurality of focal points; and Based on the detection results, the three-dimensional structural information of the detected object is constructed.

14. The ray detection method based on three-dimensional perspective according to claim 13, characterized in that, The construction of the three-dimensional structural information of the detected object based on the detection results includes: The ray projection detected by the detector is divided into multiple projection images according to the correspondence with the multiple focal points; and Tomographic reconstruction is performed based on the multiple projected images to obtain the three-dimensional structural information of the detected object.

15. An electronic device comprising: One or more processors; Memory, used to store one or more computer programs. The characteristic feature is that the one or more processors execute the one or more computer programs to implement the steps of the method according to claim 13 or 14.

Images