A positioning seat for chip burn-in test

Abstract

The application relates to the chip testing technical field, in particular to a positioning seat for chip aging test, which comprises a positioning seat body, the positioning seat body is provided with a containing groove, the outer periphery of the containing groove is formed with a stepped surface for placing a chip, the stepped surface is provided with a positioning groove, the positioning groove is used for cooperating with tin balls of an outer ring part of the chip for positioning, the containing groove is used for containing the remaining tin balls of the chip, the positioning seat body is provided with a through hole for a probe to pass through, the through hole is communicated with the containing groove and the positioning groove so that the probe is electrically connected with the tin balls. According to the application, only a small amount of tin balls are used for positioning, most of the tin balls are in the free space of the containing groove, hard contact with the positioning seat body is not needed, even if a slight deviation occurs, only a small amount of tin balls can be in contact with the positioning groove, the probability of tin ball damage caused by collision is greatly reduced, meanwhile, the containing groove can provide a gas flow space, and heat can be evenly dissipated.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to a positioning base for chip aging testing. Background Technology

[0002] Chip aging test refers to placing the chip in an accelerated aging environment such as high temperature and high voltage and running it continuously for a period of time to simulate the performance degradation process of the chip during long-term use, and to screen out chips with potential defects in advance. The aging test relies on the aging test socket to complete the clamping and electrical conduction. During the test, the chip is placed on the positioning seat inside the socket with the solder ball at the bottom of the chip facing down. The probe inside the socket passes upward through the positioning seat and presses against the solder ball. The solder ball and the probe form a stable electrical connection. The external aging equipment applies voltage to the chip through the probe and collects operating parameters to complete the long-term high temperature load aging test.

[0003] Existing positioning bases generally have independent positioning holes that correspond one-to-one with the solder balls on the bottom of the chip. When placing the chip, each solder ball is embedded in the corresponding positioning hole. The probe extends upward from the bottom of the positioning hole and abuts against the solder ball. The inner wall of the positioning hole limits the solder ball and restricts the horizontal displacement of the chip. Since the positioning hole and the solder ball are precisely matched, there is no guide error margin. If a slight displacement occurs during chip placement, all solder balls will hit the opening of the positioning hole, damaging the solder balls and affecting the contact reliability between the solder balls and the probe in subsequent tests. Summary of the Invention

[0004] In order to increase the fault tolerance margin for chip placement and avoid hard collisions between solder balls and positioning base when the chip is slightly offset, and to ensure the reliability of contact between solder balls and probes, this application provides a positioning base for chip aging test.

[0005] This application provides a positioning holder for chip aging testing, which adopts the following technical solution: A positioning base for chip aging testing includes a positioning base body, the positioning base body having a receiving groove, the outer periphery of the receiving groove having a stepped surface for placing the chip, the stepped surface having a positioning groove for positioning with a portion of the solder balls on the outer ring of the chip, the receiving groove for accommodating the remaining solder balls of the chip, and the positioning base body having a through hole for probes to pass through, the through hole communicating with the receiving groove and the positioning groove to electrically connect the probes with the solder balls.

[0006] By adopting the above technical solution, when placing the chip, the solder balls on the outer ring of the chip fall into the positioning groove, while the remaining solder balls enter the receiving groove. The edge of the chip rests on the stepped surface, which provides support for the chip. The solder balls in the positioning groove are matched with the positioning groove, thereby achieving overall positioning constraint of the chip. After the probe passes through the through hole, it extends upward from the bottom of the positioning groove and the receiving groove, and abuts against the corresponding solder ball to form an electrical connection. Compared with the prior art, this application only has a small number of solder balls of the chip participating in positioning, while most solder balls are in the free space of the receiving groove. They do not need to make hard contact with the positioning base body. Even if there is a slight displacement during the chip placement process, only a small number of solder balls participating in positioning may come into contact with the opening of the positioning groove, which greatly reduces the probability of solder ball collision damage. At the same time, the receiving groove keeps most of the solder balls in a free state. When the chip is subjected to aging test, the receiving groove provides gas flow space for the solder balls and the chip, which is conducive to uniform heat dissipation.

[0007] Optionally, the positioning groove is arranged around the receiving groove, the groove opening width is greater than the diameter of the solder ball, and the side wall of the positioning groove is provided with a centering slope, which gradually narrows from the groove opening to the bottom of the groove to guide the solder ball to be centered within the positioning groove.

[0008] By adopting the above technical solution, when the chip is placed, the solder ball first enters the opening of the positioning slot, and gradually slides to the bottom of the positioning slot under the guidance of the centering slope, and finally stabilizes at the center position of the bottom of the positioning slot, realizing automatic chip centering. The positioning slot is a continuous surrounding receiving slot, which simultaneously constrains the four sides of the chip, ensuring accurate positioning. The width of the positioning slot opening is greater than the diameter of the solder ball, so that the solder ball has a certain fault tolerance space when entering the positioning slot. Even if there is a slight deviation in the chip, the solder ball can still enter the positioning slot smoothly, further reducing the risk of collision caused by misalignment.

[0009] Optionally, the positioning groove is arranged around the receiving groove. The positioning groove includes a flared section and a limiting section. The flared section is located at the opening of the positioning groove and the width of the flared section is greater than the diameter of the solder ball. The limiting section is located at the bottom of the positioning groove to limit and cooperate with the solder ball.

[0010] By adopting the above technical solution, the positioning groove is set around the receiving groove. The flared section of the positioning groove has a wide opening, which facilitates the entry of solder balls. The limiting section cooperates with the solder ball to ensure accurate chip positioning. When the chip is placed, the solder ball first enters through the flared section to reduce direct collision between the solder ball and the opening of the positioning groove, and then slides into the limiting section to achieve precise alignment. The segmented structure not only ensures the smooth entry of the solder ball, but also ensures the positioning accuracy of the solder ball, further optimizing the reliability of chip placement.

[0011] Optionally, the positioning groove is located at the corner of the stepped surface, the side wall of the positioning groove is provided with a centering slope, the centering slope gradually narrows from the groove opening to the bottom of the groove, and the positioning seat body is provided with a first connecting hole connecting the positioning groove and the receiving groove.

[0012] By adopting the above technical solution, the positioning groove is set at the corner of the stepped surface and is positioned by the solder balls at the four corners of the chip. The centering slope guides the solder balls to slide into the bottom of the positioning groove, realizing the synchronous centering of the four corners of the chip. The first connecting hole connects the positioning groove and the receiving groove, so that a gas flow channel is formed between the positioning groove and the receiving groove, improving the heat uniformity during chip aging test.

[0013] Optionally, the positioning groove is located at the corner of the stepped surface, and the positioning groove is matched with the solder ball for limiting. The side wall of the positioning groove is provided with an annular groove, and the positioning seat body is provided with a second connecting hole and a third connecting hole. The second connecting hole is used to connect the adjacent annular groove, and the third connecting hole is used to connect the annular groove and the receiving groove.

[0014] By adopting the above technical solution, the positioning groove is set at the corner of the stepped surface. Based on the positioning groove and the solder ball limiting cooperation, an annular groove is opened on the inner wall of the positioning groove, and air can flow in the annular groove. The second connecting hole connects the adjacent annular grooves to each other, and the third connecting hole connects the annular groove to the receiving groove, so that the hot air flow in the receiving groove can enter the annular groove through the third connecting hole, and then circulate between the adjacent positioning grooves through the second connecting hole, thereby making the temperature around the chip uniform and improving the temperature consistency during chip aging test.

[0015] Optionally, the inclination angle of the centering ramp is 45° to 90°.

[0016] Optionally, the outer edge of the stepped surface is further provided with a peripheral guide structure for guiding the chip edge. The peripheral guide structure includes a first guide slope and a second guide slope. The inclination angle of the first guide slope is greater than that of the second guide slope. The first guide slope is located outside the second guide slope to initially guide the chip edge into the positioning seat. The second guide slope connects to the first guide slope and extends to the stepped surface for correcting and limiting the chip edge.

[0017] By adopting the above technical solution, in the initial stage of chip placement on the positioning base, the chip edge first contacts the first guide slope. The first guide slope provides coarse guidance to the chip at a large tilt angle, allowing the chip to quickly enter the positioning base. As the chip continues to fall, the chip edge contacts the second guide slope, which provides fine guidance to the chip edge until the chip is stably placed on the stepped surface. Through the two-stage slope guidance structure, segmented guidance of the chip edge is achieved. The first guide slope not only ensures rapid chip positioning but also improves the fault tolerance rate of chip placement, while the second guide slope ensures the accuracy of the chip's final position, thus improving the placement accuracy of the chip on the positioning base.

[0018] Optionally, the positioning base body has a through hole running vertically through both the upper and lower sides, and the through hole is located at the bottom of the receiving groove to allow airflow for heat dissipation.

[0019] By adopting the above technical solution, the through hole creates an airflow channel between the inside of the receiving groove and the inside of the aging test structure. When the chip is pressed down on the positioning seat for aging test, the closed air in the receiving groove can also be quickly discharged downward through the through hole, achieving uniform temperature and rapid airflow.

[0020] In summary, this application includes at least one of the following beneficial technical effects: 1. In this application, only a small number of solder balls of the chip are involved in the positioning, while most of the solder balls are in the free space of the receiving groove. They do not need to make hard contact with the positioning base body. Even if there is a slight displacement during the chip placement process, only a small number of solder balls involved in the positioning may come into contact with the opening of the positioning groove, which greatly reduces the probability of solder ball collision damage. At the same time, the receiving groove keeps most of the solder balls in a free state. When the chip is undergoing aging test, the receiving groove provides gas flow space for the solder balls and the chip, which is conducive to the uniform dissipation of heat. 2. When the chip is placed, the solder ball first enters the opening of the positioning slot and gradually slides to the bottom of the positioning slot under the guidance of the centering slope. Finally, it is stabilized at the center of the bottom of the positioning slot, realizing automatic chip centering. The positioning slot is a continuous surrounding receiving slot, which simultaneously constrains the four sides of the chip, ensuring accurate positioning. The width of the positioning slot opening is greater than the diameter of the solder ball, which gives the solder ball a certain margin of error when entering the positioning slot. Even if there is a slight offset of the chip, the solder ball can still enter the positioning slot smoothly, further reducing the risk of collision caused by misalignment. 3. The positioning slot is arranged around the receiving slot. The flared section of the positioning slot has a wide opening to facilitate the entry of solder balls. The limiting section cooperates with the solder ball to ensure accurate chip positioning. When the chip is placed, the solder ball first enters through the flared section to reduce direct collision between the solder ball and the opening of the positioning slot, and then slides into the limiting section to achieve precise alignment. The segmented structure not only ensures the smooth entry of the solder ball, but also ensures the positioning accuracy of the solder ball, further optimizing the reliability of chip placement. Attached Figure Description

[0021] Figure 1 This is a partial structural diagram of the chip in this application, used to show the solder balls on the chip; Figure 2 This is a schematic diagram of the structure of Embodiment 1 of this application, used to show that the positioning groove is trapezoidal and located around the receiving groove; Figure 3 This is a cross-sectional view of Embodiment 1 of this application, used to show the internal structure of the positioning seat; Figure 4 for Figure 3 A magnified view of part A in the middle, used to show the solder balls located in the positioning groove and receiving groove; Figure 5 This is a schematic diagram of Embodiment 2 of this application, used to show that the positioning groove is spherical and located around the receiving groove; Figure 6 This is a cross-sectional view of Embodiment 2 of this application, used to show the internal structure of the positioning seat; Figure 7 for Figure 6 A magnified view of part B in the middle section, used to show the location of the flared section and the limiting section; Figure 8 This is a structural schematic diagram of Embodiment 3 of this application, used to show that the positioning groove is trapezoidal and located at the four corners of the receiving groove; Figure 9 for Figure 8 A partially enlarged schematic diagram of section C shows the location of the first connecting hole between the positioning slots; Figure 10 This is a schematic diagram of the structure of Embodiment 4 of this application, used to show that the positioning groove is spherical and located at the four corners of the receiving groove; Figure 11 This is a partial cross-sectional view of Embodiment 4 of this application, used to show the positions of the annular groove, the second connecting hole, and the third connecting hole.

[0022] Reference numerals in the attached drawings: 1. Positioning seat body; 111. Receiving groove; 121. Stepped surface; 131. Positioning groove; 132. Flared section; 133. Limiting section; 134. Annular groove; 141. Through hole; 151. Through hole; 161. First connecting hole; 171. Second connecting hole; 181. Third connecting hole; 191. Centering slope; 2. Chip; 211. Solder ball; 3. Peripheral guide structure; 311. First guide slope; 321. Second guide slope. Detailed Implementation

[0023] The following is in conjunction with the appendix Figure 1-11 This application will be described in further detail.

[0024] Example 1: A positioning holder for chip aging testing, reference Figure 1 and Figure 2 The system includes a positioning base body 1, which has a receiving groove 111 located in the middle of the positioning base body 1 to provide an independent receiving space. The chip 2 is placed inside the positioning base body 1. The receiving groove 111 can accommodate most of the solder balls 211 of the chip 2, and the depth of the receiving groove 111 is greater than the height of the solder balls 211 of the chip 2 to avoid rigid collision between the solder balls 211 and the positioning base body 1. A stepped surface 121 is formed on the outer periphery of the receiving groove 111 to provide support for the chip 2. A positioning groove 131 is formed on the stepped surface 121. Some of the solder balls 211 on the outer ring of the chip 2 are inserted into the positioning groove 131. The inner wall of the positioning groove 131 constrains a small number of solder balls 211, thereby achieving overall positioning of the chip 2 and preventing the chip 2 from shifting during testing. Figure 3 and Figure 4 The positioning base body 1 has a through hole 141 that extends vertically through the positioning base body 1. The bottom of the positioning groove 131 and the bottom of the receiving groove 111 are connected to the through hole 141, providing a test channel for the probe. This allows the probe to contact the solder ball 211 from the bottom of the positioning base upwards, thus enabling the conduction of electrical signals. In this application, only a small number of solder balls 211 participate in the positioning, while most of the solder balls 211 are in a free state, effectively reducing the risk of damage to the solder balls 211 during the positioning process. At the same time, the receiving groove 111 provides an airflow channel for the solder balls 211 and the chip 2, facilitating gas flow and ensuring the temperature uniformity of the chip 2 during aging tests.

[0025] refer to Figure 2 and Figure 4 The positioning groove 131 is continuously arranged around the receiving groove 111 to form a ring positioning structure. The solder balls 211 on the outer ring of the four sides of the chip 2 enter the positioning groove 131 and abut against the inner wall of the positioning groove 131. The chip 2 is constrained on all four sides to ensure that the chip 2 is stable on the positioning base body 1. The vertical cross-sectional shape of the positioning groove 131 is trapezoidal. The width of the groove opening of the positioning groove 131 is greater than the diameter of the solder balls 211. When the chip 2 is lowered and there is a deviation, the solder balls 211 can still enter the positioning groove 131 smoothly, which increases the fault tolerance space and reduces the collision damage between the solder balls 211 and the edge of the groove opening of the positioning groove 131.

[0026] refer to Figure 2 and Figure 4 The sidewall of the positioning groove 131 gradually narrows from the opening to the bottom, forming a centering slope 191. The solder ball 211 automatically adjusts its position as it slides down the centering slope 191, and finally falls into the bottom of the positioning groove 131 and is held by the sidewall, achieving a self-centering effect. This ensures that the solder ball 211 is coaxially aligned with the corresponding through hole 141, thereby ensuring that the probe can accurately contact the solder ball 211 and improve the stability and reliability of the test signal.

[0027] refer to Figure 2 and Figure 4 In this embodiment, the inclination angle of the centering slope 191 is 45° to 90°, preferably 10°. The slope is gentle, the guide stroke is long, and the tolerance space for the solder balls 211 is large. The specific inclination angle can be adjusted according to the actual diameter and spacing of the solder balls 211 to ensure that the solder balls 211 gradually slide into the bottom of the positioning groove 131 along the centering slope 191 during the process of entering the positioning groove 131. The bottom width of the positioning groove 131 is greater than the diameter of the through hole 141, and the depth of the positioning groove 131 is greater than the height of the solder balls 211, so that the solder balls 211 are completely... After falling into the positioning groove 131, the bottom of the solder ball 211 will not contact the bottom of the positioning groove 131, but will be suspended above the through hole 141, reducing the contact friction between the solder ball 211 and the bottom of the positioning groove 131, and avoiding additional damage to the solder ball 211. The depth of the receiving groove 111 is also greater than the height of the solder ball 211. When the chip 2 is placed in the receiving groove 111, the solder ball 211 inside the receiving groove 111 will also not contact the bottom of the receiving groove 111, and will remain suspended, further reducing the risk of the solder ball 211 being deformed by pressure.

[0028] refer to Figure 2 and Figure 3 The positioning base body 1 also has an integrally formed peripheral guide structure 3, which is set along the edge of the stepped surface 121 to guide the periphery of the chip 2, and then combined with Figure 4 The positioning structure forms a dual positioning structure with the solder balls 211 in the positioning groove 131. The outer guide structure 3 includes a first guide slope 311 and a second guide slope 321. The first guide slope 311 is closer to the edge of the positioning base body 1 than the second guide slope 321. The inclination angle of the first guide slope 311 is greater than that of the second guide slope 321, making the opening of the positioning base body 1 more outward. This allows the chip 2 to pass through the coarse guidance of the first guide slope 311 during placement, and the chip 2 slides down a certain distance before contacting the second guide slope 321. The guide ramp 321 connects at the bottom of the first guide ramp 311 at its upper end and extends to the step surface 121 at its lower end, smoothly guiding the chip 2 onto the step surface 121. The bottom surface of the chip 2 fits against the step surface 121. Through the segmented guidance of the first guide ramp 311 and the second guide ramp 321, the chip 2 gradually adjusts its posture during placement, improving the positioning accuracy and placement smoothness of the chip 2, and providing a reliable pre-positioning basis for the subsequent limiting cooperation between the solder ball 211 and the positioning groove 131 on the chip 2.

[0029] refer to Figure 2 and Figure 3The positioning base body 1 has a through hole 151, which is located at the center of the receiving groove 111 and communicates with it. The through hole 151 connects the receiving groove 111 to the inside of the socket, facilitating uniform temperature distribution in the bottom heating area of ​​the chip 2 during testing. Combined with... Figure 4 The circulating airflow continuously passes through the through hole 151 and enters the receiving groove 111, continuously carrying away the heat generated by the chip 2 and solder ball 211 during operation, avoiding local overheating that could affect the test accuracy. At the same time, when the chip 2 is placed on the positioning base body 1, the airflow in the receiving groove 111 can be discharged downward through the through hole 151, which plays a role in pressure relief.

[0030] The implementation principle of Embodiment 1 of this application is as follows: When performing the aging test of chip 2, chip 2 is placed downward from above the positioning seat. The edge of chip 2 first contacts the first guide slope 311. After chip 2 continues to slide down a certain distance, it cooperates with the second guide slope 321 to gradually correct its posture and is placed smoothly on the step surface 121. At this time, the solder balls 211 around the outer ring of chip 2 fall into the positioning groove 131. The solder balls 211 will automatically adjust to the center position along the centering slope 191 and finally be suspended above the bottom through hole 141 of the positioning groove 131 to complete the limit. Only a small number of solder balls 211 on the outer ring constrain the entire chip 2 to prevent translation and deflection during the test. Most of the remaining solder balls 211 of chip 2 are contained in the receiving groove 111 and kept in a suspended state to reduce the rigid compression and impact damage of solder balls 211. The test probe passes through the through hole 141 from below the positioning seat and abuts against all solder balls 211 to achieve complete electrical conduction for aging detection.

[0031] Example 2: A positioning holder for chip 2 aging test, reference Figure 5 and Figure 6 The difference from Embodiment 1 is that the shape of the positioning groove 131 is different from that in Embodiment 1. In this embodiment, the positioning groove 131 is also arranged continuously around the perimeter of the stepped surface 121, but the positioning groove 131 is a spherical groove structure, combined with... Figure 7 The positioning groove 131 is divided into a flared section 132 and a limiting section 133 along the vertical direction, and then combined with Figure 1The flared section 132 is located at the upper part of the positioning groove 131, and the inner diameter of the flared section 132 is larger than the diameter of the solder ball 211, providing a larger entrance space for the solder ball 211 to enter the positioning groove 131. When the chip 2 is slightly offset, the solder ball 211 can smoothly enter the positioning groove 131. The limiting section 133 is located at the lower part of the positioning groove 131. The flared section 132 and the limiting section 133 are connected by an arc. The inner diameter of the limiting section 133 is adapted to the diameter of the solder ball 211, so that the solder ball 211 can be accurately locked by the limiting section 133 after falling into the positioning groove 131, limiting the horizontal displacement of the solder ball 211. The inner wall of the limiting section 133 is in contact with the surface of the solder ball 211, forming a stable limiting fit, ensuring that the position of the chip 2 does not shift during the test.

[0032] The implementation principle of Embodiment 2 of this application is as follows: When the chip 2 is subjected to aging test, the solder balls 211 on the outer ring of the chip 2 enter the spherical groove positioning groove 131. The inner diameter of the flared section 132 at the top of the positioning groove 131 is larger than the diameter of the solder balls 211. Even if there is a slight offset when the chip 2 is lowered, the solder balls 211 can still smoothly enter the positioning groove 131. The inner wall of the limiting section 133 fits against the spherical surface of the solder balls 211 to achieve precise engagement, constrain the horizontal displacement of the solder balls 211, and thus fix the chip 2 as a whole, so as to prevent the chip 2 from shifting during the test.

[0033] Example 3: A positioning holder for chip 2 aging test, reference Figure 8 and Figure 9 The difference from Embodiment 1 is that the positioning grooves 131 are located at different positions. In this embodiment, the positioning grooves 131 are only located at the four corners of the stepped surface 121, with four positioning grooves 131 at each corner. Figure 1 Only the solder balls 211 on the outer ring of the four corners of chip 2 are used for positioning, while the solder balls 211 in the central area of ​​chip 2 are not used for positioning, reducing the risk of solder balls 211 being bumped or knocked. The vertical cross-sectional shape of the positioning groove 131 is also trapezoidal, and the sidewall of the positioning groove 131 is also provided with a centering slope 191. In this embodiment, the inclination angle of the centering slope 191 is also 45° to 90°, preferably 10°. The centering slope 191 guides the solder balls 211 to slide towards the center of the positioning groove 131, realizing the positioning of the four corners of chip 2. The solder ball 211 is automatically aligned. A circular hole is provided on the positioning seat body 1 between two adjacent positioning slots 131 to realize airflow communication between adjacent positioning slots 131. A first connecting hole 161 is provided between the positioning slot 131 near the receiving slot 111 and the receiving slot 111. Through the circular hole and the first connecting hole 161, the airflow forms a circulation channel between the receiving slot 111 and each positioning slot 131, which further improves the temperature uniformity of the chip 2 and the solder ball 211 and avoids the deviation of test results caused by local temperature difference.

[0034] The implementation principle of Embodiment 3 of this application is as follows: When chip 2 is subjected to aging test, the limiting is achieved by only using the four corner solder balls 211 of chip 2 and the trapezoidal positioning grooves 131 at the four corners of the stepped surface 121. This greatly reduces the number of solder balls 211 involved in positioning, effectively reducing the risk of damage to the solder balls 211 due to collision or squeezing. The circular holes between adjacent positioning grooves 131 and the first connecting hole 161 between positioning groove 131 and receiving groove 111 cooperate with each other to form a through-circulation airflow channel inside each positioning groove 131 and receiving groove 111. During the test, the airflow can flow smoothly and exchange heat, uniformly removing the heat generated by chip 2 and solder balls 211, avoiding the problem of excessive local temperature difference, effectively improving the overall temperature uniformity, and ensuring the accuracy and stability of the chip 2 aging test results.

[0035] Example 4: A positioning holder for chip 2 aging test, reference Figure 10 and Figure 11 The difference from Embodiment 3 is that the shape of the positioning groove 131 is different from that of Embodiment 3. The positioning groove 131 is also set at the four corners of the stepped surface 121, combined with Figure 1 In this embodiment, only the solder balls 211 at the four corners of the chip 2 are used for positioning. The positioning groove 131 is hemispherical and the positioning groove 131 and the solder balls 211 are matched in a limiting manner, thereby constraining the horizontal displacement of the chip 2. The side wall of the positioning groove 131 is provided with an annular groove 134, which forms an airflow gap between the solder balls 211 and the side wall of the positioning groove 131. The positioning base body 1 is provided with a second connecting hole 171 and a third connecting hole 181. The second connecting hole 171 is used to connect the annular groove 134 on the adjacent positioning groove 131, so that the airflow can flow along the annular groove 134 between each positioning groove 131. The third connecting hole 181 is used to connect the annular groove 134 on the positioning groove 131 near the receiving groove 111 with the receiving groove 111, so that the airflow forms a circulating flow between the receiving groove 111 and each positioning groove 131, which further enhances the airflow exchange in the four corner areas of the chip 2 and ensures that the temperature of the solder balls 211 in each positioning groove 131 is uniform.

[0036] The implementation principle of Embodiment 4 of this application is as follows: When chip 2 undergoes aging testing, the limiting is achieved only by using the four corner solder balls 211 of chip 2 in conjunction with the hemispherical positioning grooves 131 at the four corners of the stepped surface 121. This significantly reduces the number of solder balls 211 involved in positioning and lowers the risk of the solder balls 211 being squeezed or bumped. The annular groove 134 opened on the side wall of the positioning groove 131 can reserve an annular airflow gap between the solder balls 211 and the side wall of the positioning groove 131. In conjunction with the second connecting hole 171 and the third connecting hole 181, the second connecting hole 171 can pass through the third connecting hole 181. 1. It enables airflow communication between each positioning groove 131 and the annular groove 134, and can also connect the annular groove 134 and the receiving groove 111 through the third connecting hole 181, so that the airflow forms a circulation flow between the receiving groove 111 and each positioning groove 131 at the four corners, effectively enhancing the airflow exchange efficiency of the positioning area at the four corners of the chip 2, so that all positioning solder balls 211 can be in a uniform heat dissipation airflow environment, avoiding the problems of local heat accumulation and uneven temperature difference, ensuring the overall temperature consistency of the chip 2, and effectively improving the accuracy and stability of aging test.

[0037] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made to the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A positioning holder for chip aging testing, characterized in that: The device includes a positioning base body (1), which has a receiving groove (111). The outer periphery of the receiving groove (111) has a stepped surface (121) for placing a chip (2). A positioning groove (131) is formed on the stepped surface (121). The positioning groove (131) is used to cooperate with the solder balls (211) on the outer ring of the chip (2) for positioning. The receiving groove (111) is used to accommodate the remaining solder balls (211) of the chip (2). The positioning base body (1) has a through hole (141) for the probe to pass through. The through hole (141) is connected to the receiving groove (111) and the positioning groove (131) so that the probe is electrically connected to the solder balls (211).

2. The positioning holder for chip aging test according to claim 1, characterized in that: The positioning groove (131) is arranged around the receiving groove (111). The groove width of the positioning groove (131) is greater than the diameter of the solder ball (211). The side wall of the positioning groove (131) is provided with a centering slope (191). The centering slope (191) gradually narrows from the groove opening to the bottom of the groove to guide the solder ball (211) to be centered and located within the positioning groove (131).

3. The positioning holder for chip aging test according to claim 1, characterized in that: The positioning groove (131) is arranged around the receiving groove (111). The positioning groove (131) includes a flared section (132) and a limiting section (133). The flared section (132) is located at the opening of the positioning groove (131) and the width of the flared section (132) is greater than the diameter of the solder ball (211). The limiting section (133) is located at the bottom of the positioning groove (131) to limit and cooperate with the solder ball (211).

4. A positioning holder for chip aging testing according to claim 1, characterized in that: The positioning groove (131) is located at the corner of the stepped surface (121). The side wall of the positioning groove (131) is provided with a centering slope (191). The centering slope (191) gradually narrows from the groove opening to the bottom of the groove. The positioning seat body (1) is provided with a first connecting hole (161) connecting the positioning groove (131) and the receiving groove (111).

5. A positioning holder for chip aging testing according to claim 1, characterized in that: The positioning groove (131) is located at the corner of the stepped surface (121). The positioning groove (131) is in a limiting fit with the solder ball (211). The side wall of the positioning groove (131) is provided with an annular groove (134). The positioning seat body (1) is provided with a second connecting hole (171) and a third connecting hole (181). The second connecting hole (171) is used to connect the adjacent annular groove (134), and the third connecting hole (181) is used to connect the annular groove (134) and the receiving groove (111).

6. A positioning holder for chip aging testing according to claim 2 or 4, characterized in that: The inclination angle of the centering slope (191) is 45° to 90°.

7. A positioning holder for chip aging testing according to claim 1, characterized in that: The outer edge of the stepped surface (121) is also provided with a peripheral guide structure (3) for guiding the edge of the chip (2). The peripheral guide structure (3) includes a first guide slope (311) and a second guide slope (321). The inclination angle of the first guide slope (311) is greater than the inclination angle of the second guide slope (321). The first guide slope (311) is located outside the second guide slope (321) to initially guide the edge of the chip (2) into the positioning seat. The second guide slope (321) connects to the first guide slope (311) and extends to the stepped surface (121) for correcting and limiting the edge of the chip (2).

8. A positioning holder for chip aging testing according to claim 1, characterized in that: The positioning base body (1) has a through hole (151) that runs vertically through both the upper and lower sides. The through hole (151) is located at the bottom of the receiving groove (111) to allow airflow.

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