Terminal structure and HDMI female socket connector

Abstract

The application provides a terminal structure and an HDMI female connector, aiming at improving the problem of large differential mode loop and ground impedance. The terminal structure comprises a plurality of terminal groups arranged along a first direction; each terminal group comprises: a pair of differential signal terminals, the contact portions of the pair of differential signal terminals are arranged at intervals along the first direction; a ground shield terminal, along the first direction, the contact portion of the ground shield terminal is located between the contact portions of the pair of differential signal terminals; along a second direction perpendicular to the first direction, the contact portion of the ground shield terminal is located on one side of the contact portions of the pair of differential signal terminals; wherein the leg portions of the ground shield terminal and the pair of differential signal terminals are arranged along the first direction, and the leg portion of the ground shield terminal is located on one side of the leg portions of the pair of differential signal terminals along the first direction.

Description

Technical Field

[0001] This application relates to the field of HDMI interface technology, and in particular to a terminal structure and an HDMI female connector. Background Technology

[0002] High Definition Multimedia Interface (HDMI) is a fully digital video and audio transmission interface that can transmit uncompressed audio and video signals.

[0003] In related technologies, after the HDMI female connector is connected to the printed circuit board, there are problems such as differential mode loops and large grounding impedance, which affect the quality and reliability of signal transmission. Summary of the Invention

[0004] This application provides a terminal structure and an HDMI female connector, which aims to improve the differential mode loop and high grounding impedance of the HDMI female connector, thereby improving the quality and reliability of signal transmission.

[0005] The specific technical solution is as follows:

[0006] An embodiment of the first aspect of this application provides a terminal structure for an HDMI female connector. The terminal structure includes multiple terminal groups arranged along a first direction. Each terminal group includes: a pair of differential signal terminals, the contact portions of the pair of differential signal terminals being spaced apart along the first direction; a ground shield terminal, the contact portion of the ground shield terminal being located between the contact portions of the pair of differential signal terminals along the first direction; and the contact portion of the ground shield terminal being located on one side of the contact portions of the pair of differential signal terminals along a second direction perpendicular to the first direction. The solder pads of the ground shield terminal and the solder pads of the pair of differential signal terminals are arranged along the first direction, and the solder pads of the ground shield terminal are located on one side of the solder pads of the pair of differential signal terminals along the first direction.

[0007] In each terminal group of this application, the solder pads of the ground shield terminal and the solder pads of a pair of differential signal terminals are arranged along a first direction, and the solder pads of the ground shield terminal are located on one side of the solder pads of the pair of differential signal terminals along the first direction. This arrangement has two advantages: First, there is no grounding terminal between the solder pads of the pair of differential signal terminals in each terminal group, enabling tight coupling and reducing the differential loop area. Second, because the arrangement order of the solder pads of the pair of differential signal terminals and the ground shield terminal changes in each terminal group, the arrangement order of the signal lines on the circuit board changes accordingly. At this time, each ground wire on the circuit board is located on one side of a pair of differential signal lines, and the ground signal line on the circuit board is also located on one side of a pair of differential signal lines. Thus, the ground signal line and the ground wire on the circuit board can be directly connected on the same layer without through-holes, thereby reducing the grounding impedance after the terminal structure is connected to the circuit board. This is beneficial for improving the quality and reliability of signal transmission.

[0008] In some embodiments, the pair of differential signal terminals includes a first signal terminal and a second signal terminal, and along the first direction, the solder pad of the ground shield terminal is located on the side of the first signal terminal opposite to the solder pad of the second signal terminal. This improves the quality and reliability of signal transmission.

[0009] In some embodiments, along the first direction, the solder pad of the ground shield terminal is located on the side of the solder pad of the second signal terminal opposite to the solder pad of the first signal terminal. This is beneficial for improving the quality and reliability of signal transmission.

[0010] In some embodiments, the distance between the solder pads of the first signal terminal and the solder pads of the second signal terminal is less than the distance between the contact portions of the first signal terminal and the contact portions of the second signal terminal. This helps to further reduce the differential mode loop area and improve the quality and reliability of signal transmission.

[0011] In some embodiments, in any two adjacent terminal groups, the contact portion of the ground shield terminal in one terminal group and the contact portion of the pair of differential signal terminals in the other terminal group are arranged along the first direction.

[0012] The solder feet of the ground shield terminal and the solder feet of the differential signal terminal in the plurality of terminal groups are arranged along the first direction.

[0013] This configuration, firstly, ensures that the arrangement of the contacts of multiple pairs of differential signal terminals and multiple ground shield terminals in multiple terminal groups conforms to the standard layout of the HDMI female connector, thereby improving the versatility and standardization of the terminal structure's contacts. Secondly, the solder feet of the ground shield terminals and the solder feet of the differential signal terminals in the multiple terminal groups are arranged along a first direction. This improves the ease of electrical connection between the solder feet of the terminal structure and the circuit board.

[0014] In some embodiments, the ground shield terminals in the plurality of terminal groups are electrically connected to each other. This arrangement has several advantages: First, it improves the convenience and reliability of fixing the multiple ground shield terminals. Second, it increases the grounding area; a larger grounding area can more effectively introduce interference current into the ground, reducing the impact of electromagnetic interference on signal transmission, thereby further improving the reliability and quality of signal transmission. Third, it also improves assembly efficiency and stability, and reduces costs.

[0015] In some embodiments, in different terminal groups, the solder pads of the ground shield terminal are located on the same side of the solder pads of the pair of differential signal terminals along the first direction. This arrangement ensures that in any two adjacent terminal groups, the solder pads of the two pairs of differential signal terminals are isolated from each other by the solder pad of a ground shield terminal, thereby reducing the probability of crosstalk between differential signals in adjacent terminal groups. This further improves the quality and reliability of signal transmission.

[0016] In some embodiments, the terminal structure further includes a conductive connector. The solder pads of the ground shield terminal and the solder pads of the pair of differential signal terminals in each terminal group are arranged sequentially. The conductive connector is electrically connected to the ground shield terminal of the last terminal group, and is located on the side of the solder pads of the pair of differential signal terminals in the last terminal group that faces away from the solder pads of the ground shield terminal. This arrangement ensures that the solder pads of the pair of differential signal terminals in each group are located between the solder pads of the two ground shield terminals, thereby further improving the quality and reliability of signal transmission.

[0017] In some embodiments, the terminal structure further includes a conductive connector. The solder pads of the pair of differential signal terminals and the solder pads of the ground shield terminal in each terminal group are arranged sequentially. The conductive connector is electrically connected to the ground shield terminal of the first terminal group, and is located on the side of the solder pads of the pair of differential signal terminals in the first terminal group that faces away from the solder pads of the ground shield terminal. This ensures that the solder pads of the pair of differential signal terminals in each group are positioned between the solder pads of the two ground shield terminals, thereby further improving the quality and reliability of signal transmission.

[0018] In some embodiments, the number of terminal groups is four, and the four terminal groups are respectively a first terminal group, a second terminal group, a third terminal group, and a fourth terminal group arranged sequentially along the first direction. This arrangement is beneficial to improving the quality and reliability of signal transmission.

[0019] An embodiment of the second aspect of this application provides an HDMI female connector, including the terminal structure described in the first aspect. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1a and Figure 1b This is a schematic diagram of the terminal structure of an HDMI female connector in related technologies;

[0022] Figure 2 This is a circuit layout diagram of a circuit board;

[0023] Figure 3 This is a schematic diagram of a terminal structure according to an embodiment of this application;

[0024] Figure 4 for Figure 3 A schematic diagram of a set of terminal groups shown in the diagram;

[0025] Figure 5 for Figure 3 A schematic diagram of the spatial structure of the terminal arrangement shown in the diagram.

[0026] Figure 6 This is a partial schematic diagram of the circuit layout of a circuit board according to an embodiment of this application;

[0027] Figure 7 This is a schematic diagram of another terminal structure according to an embodiment of this application;

[0028] Figure 8 for Figure 7 A schematic diagram of a terminal group in the terminal structure shown;

[0029] Figure 9 This is a schematic diagram of another terminal structure according to an embodiment of this application;

[0030] Figure 10 for Figure 9 A schematic diagram of the last terminal group in the terminal structure shown;

[0031] Figure 11 for Figure 9 A schematic diagram of another structure for the last terminal group in the terminal structure shown;

[0032] Figure 12 This is another structural schematic diagram of a terminal structure according to an embodiment of this application;

[0033] Figure 13 for Figure 12 A schematic diagram of the first terminal group in the terminal structure shown;

[0034] Figure 14 for Figure 12 A schematic diagram of another structure for the first terminal group in the terminal structure shown.

[0035] Explanation of icon numbers:

[0036] 1. Circuit board; d1. Contact part; d2. Solder foot part;

[0037] 10. Terminal structure; 100. Terminal group; 110. A pair of differential signal terminals; 120. Ground shield terminal; a1. Contact part; a2. Solder foot part; a3. Main body part; 20. Circuit board; 111. First signal terminal; 112. Second signal terminal; 120a. Conductor structure; 130. Conductive connector. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0039] In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0042] HDMI is a fully digital video and audio transmission interface that can transmit uncompressed audio and video signals. HDMI female connectors are typically electrically connected to a printed circuit board.

[0043] Figure 1a and Figure 1b This is a schematic diagram of the terminal structure of an HDMI female connector in related technology. The HDMI female connector has 19 pins, numbered pin 1 to pin 19. Figure 1a As shown, viewed from interface end A, the contact portions d1 of pins 1 to 19 are arranged in two rows. The first row consists of pins 1, 3, 19, and 2, and the second row consists of pins 2, 4, 18. Viewed from solder end B, the solder portions d2 of pins 1 to 19 are arranged alternately in the same row. According to the standard specifications of the HDMI interface, pins 2, 5, 8, and 11 are the grounding shield terminals for differential signal terminals. Pins 1 and 3 form a pair of differential signal terminals, pins 4 and 6 form a pair, pins 7 and 9 form a pair, and pins 10 and 12 form a pair.

[0044] like Figure 1b As shown, each terminal extends from the contact portion d1 to the solder foot portion d2. The contact portion d1 is used to connect with an external plug, and the solder foot portion d2 is used to connect with the circuit board 1.

[0045] Figure 2This is a circuit layout diagram of a circuit board. For example... Figure 2 As shown, signal lines for connecting to solder pads d2 of pins 1 to 19 are sequentially arranged on circuit board 1. Figure 2 The following examples only illustrate the connection of signal lines P1 to P12 to the solder pads d2 corresponding to terminals 1 to 12. It is understood that signal lines P2, P5, P8, and P11 are ground signal lines, and the rest are paired differential signal lines. Furthermore, circuit board 1 also includes multiple grounding lines (GND1 to GND5) located on both sides of each pair of differential signal lines (P1 / P3, P4 / P6, P7 / P9, P10 / P12), enabling tight coupling between each pair of differential signal lines and improving signal quality.

[0046] When the solder pad d2 of the terminal structure shown above is connected to the signal line on the circuit board 1, the following problems will occur:

[0047] First, in the arrangement of the solder feet d2 of the above-mentioned terminal structure, the solder feet d2 of the same pair of differential signal terminals (e.g., pin1 terminal, pin3 terminal) are spaced apart by the solder feet d2 of the ground shield terminal (corresponding to pin2 terminal). This will result in the differential signals not being tightly coupled and the differential loop area being large.

[0048] Second, such as Figure 1a As shown, the solder pad d2 of each ground shield terminal (e.g., pin2 terminal) is located between the solder pads d2 of a pair of differential signal terminals (corresponding to pin1 terminal and pin3 terminal), and... Figure 2 In this configuration, ground planes GND1-GND5 are positioned on one side of each pair of differential signal lines (e.g., p1, p3). In this structure, some ground planes on board 1, such as GND2 to GND5, cannot be directly connected to the ground signal lines (p5, p8, p11, etc.) on the same layer. Instead, they need to be connected via vias. This results in a higher grounding impedance after the terminal structure is connected to board 1, and a longer return path to ground. This can easily lead to common-mode noise caused by unequal potentials, resulting in poor eye diagram and EMI (Electromagnetic Interference) performance.

[0049] Through in-depth research, the applicant of this application discovered that by changing the arrangement order of the solder pads in the terminal structure, tight coupling can be achieved between differential signal terminals of the same pair. Simultaneously, direct connection between the ground plane and the ground wire on the same layer can be achieved during circuit board routing. This reduces signal crosstalk, decreases differential-mode loop area, and lowers grounding impedance, thereby improving the quality and reliability of signal transmission.

[0050] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0051] like Figure 3 , Figure 4 and Figure 5 As shown, an embodiment of the first aspect of this application provides a terminal structure 10 for an HDMI female connector. The terminal structure 10 includes multiple terminal groups 100 arranged along a first direction X. Each terminal group 100 includes a pair of differential signal terminals 110 and a ground shield terminal 120. The contact portions a1 of the pair of differential signal terminals 110 are spaced apart along the first direction X. Along the first direction X, the contact portion a1 of the ground shield terminal 120 is located between the contact portions a1 of the pair of differential signal terminals 110. Along a second direction Y perpendicular to the first direction X, the contact portion a1 of the ground shield terminal 120 is located on one side of the contact portions a1 of the pair of differential signal terminals 110. The solder pads a2 of the ground shield terminal 120 and the solder pads a2 of the pair of differential signal terminals 110 are arranged along the first direction X, and the solder pads a2 of the ground shield terminal 120 are located on one side of the solder pads a2 of the pair of differential signal terminals 110 along the first direction X.

[0052] The terminal structure 10 in this application includes multiple terminal groups 100, each terminal group 100 including a pair of differential signal terminals 110 and a ground shield terminal 120. The pair of differential signal terminals 110 refers to a pair of terminals, i.e., two terminals, used to transmit differential signals. These two terminals transmit signals with equal amplitude and opposite phase, i.e., positive signals and negative signals, respectively.

[0053] The grounding shield terminal 120 is a terminal that provides grounding shielding for a pair of differential signal terminals 110, in order to achieve stability and anti-interference of differential signal transmission.

[0054] Contact portion a1 refers to the part of each terminal used for connection with an external plug, and solder pad portion a2 refers to the part of each terminal used for connection with the circuit board. For example... Figure 4 and Figure 5 As shown, each terminal typically also has a main body portion a3 located between the contact portion a1 and the solder foot portion a2. The main body portion a3 of each terminal can be bent so that the solder foot portion a2 and the contact portion a1 of the terminal are in corresponding preset positions.

[0055] In each terminal group 100, the arrangement of the contact portion a1 of a pair of differential signal terminals 110 and the contact portion a1 of a ground shield terminal 120 conforms to the arrangement pattern of the standard HDMI female connector interface, thereby achieving the universality and standardization of the contact portion a1 of the terminal structure 10. For example, as Figure 3 As shown, in one terminal group 100, a pair of differential signal terminals 110 are pin1 and pin3, and the ground shield terminal 120 is pin2. The contact portion a1 of pin2 is located between the contact portions a1 of pin1 and pin3 in the first direction X, and on one side of the contact portions a1 of pin1 and pin3 in the second direction Y. This makes the contact portion a1 of the terminal group 100 universal and standardized.

[0056] Further, please refer to Figure 4 and Figure 5 In this terminal group 100, the solder pads a2 of the ground shield terminal 120 and the solder pads a2 of a pair of differential signal terminals 110 are arranged along a first direction X, and the solder pads a2 of the ground shield terminal 120 are located on one side of the solder pads a2 of the pair of differential signal terminals 110 along the first direction X. With this arrangement, firstly, there is no grounding terminal between the solder pads a2 of a pair of differential signal terminals 110 within each terminal group 100, achieving tight coupling and thus reducing the differential mode loop area. Secondly, as... Figure 6 As shown, because the arrangement order of the solder pads a2 of a pair of differential signal terminals 110 and the solder pads a2 of the ground shield terminal 120 changes in each terminal group 100, the arrangement order of the signal lines (taking p1, p2, p3 as an example) on the circuit board 20 will change accordingly. At this time, each ground wire GND on the circuit board 20 is located on one side of a pair of differential signal lines (p1, p3), and each ground signal line on the circuit board 20 is also located on one side of a pair of differential signal lines (p1, p3). In this way, the ground signal line (e.g., p2 signal line) and the ground wire (e.g., GND2) on the circuit board 20 can be directly connected on the same layer without the need for through holes, thereby reducing the grounding impedance after the terminal structure 10 is connected to the circuit board 20. This is beneficial to improving the quality and reliability of signal transmission.

[0057] It is understandable that, while maintaining the same arrangement order of the contact portions a1 of the pair of differential signal terminals 110 and the contact portions a1 of the ground shield terminal 120, the arrangement order of the solder feet a2 of the pair of differential signal terminals 110 and the solder feet a2 of the ground shield terminal 120 can be changed by bending at least one of the main body portion a3 of the pair of differential signal terminals 110 and the main body portion a3 of the ground shield terminal 120. For example, one implementation is as follows: Figure 11 As shown, the main body a3 of the ground shield terminal 120 is bent toward the solder pad a2 of the pair of differential signal terminals 110, while the main body a3 of the pair of differential signal terminals 110 is bent toward each other; or, as shown... Figure 4 As shown, only the main body a3 of one of the pair of differential signal terminals 110 and the main body a3 of the ground shield terminal 120 are bent, so that the positions of the terminal and the solder foot a2 of the ground shield terminal 120 are interchanged. This application does not limit the implementation method.

[0058] In some embodiments, such as Figure 3 and Figure 4 As shown, a pair of differential signal terminals 110 includes a first signal terminal 111 and a second signal terminal 112. Along the first direction X, the solder pad a2 of the ground shield terminal 120 is located on the side of the solder pad a2 of the first signal terminal 111 that is opposite to the solder pad a2 of the second signal terminal 112. Alternatively, as... Figure 7 and Figure 8 As shown, along the first direction X, the solder pad a2 of the ground shield terminal 120 is located on the side of the solder pad a2 of the second signal terminal 112 that is away from the solder pad a2 of the first signal terminal 111.

[0059] This configuration allows for variations in the arrangement of the solder pads a2 of a pair of differential signal terminals 110 and the solder pads a2 of the ground shield terminal 120. On one hand, it enables tight coupling of the solder pads a2 of a pair of differential signal terminals 110 within each terminal group 100, thereby reducing the differential mode loop area. On the other hand, it allows the ground signal line and the ground shield GND on the circuit board to be directly connected on the same layer of the circuit board 20, thus reducing the grounding impedance after the terminal structure 10 is connected to the circuit board 20. This improves the quality and reliability of signal transmission.

[0060] In some embodiments, the distance between the solder foot a2 of the first signal terminal 111 and the solder foot a2 of the second signal terminal 112 is less than the distance between the contact portion a1 of the first signal terminal 111 and the contact portion a1 of the second signal terminal 112.

[0061] Since the solder pad a2 of the ground shield terminal 120 is located on one side of the solder pad a2 of the first signal terminal 111 and the solder pad a2 of the second signal terminal 112, at least one of the main body a3 of the first signal terminal 111 and the main body a3 of the second signal terminal 112 can be bent to achieve tight coupling of their solder pad a2. In this case, the distance between the solder pad a2 of the first signal terminal 111 and the solder pad a2 of the second signal terminal 112 will be smaller than the distance between the contact portion a1 of the first signal terminal 111 and the contact portion a1 of the second signal terminal 112. This is beneficial for further reducing the differential mode loop area and improving the quality and reliability of signal transmission.

[0062] In some embodiments, such as Figure 3 and Figure 7 As shown, in any two adjacent terminal groups 100, the contact portion a1 of the ground shield terminal 120 in one terminal group 100 and the contact portion a1 of a pair of differential signal terminals 110 in the other terminal group 100 are arranged along the first direction X. The solder feet a2 of the ground shield terminal 120 and the solder feet a2 of the pair of differential signal terminals 110 in the multiple terminal groups 100 are arranged along the first direction X.

[0063] This embodiment proposes a specific arrangement of multiple pairs of differential signal terminals 110 and multiple ground shield terminals 120 in the contact portion a1 and solder pad portion a2 of multiple terminal groups 100. First, the arrangement of the contact portions a1 of the multiple pairs of differential signal terminals 110 and multiple ground shield terminals 120 in the multiple terminal groups 100 conforms to the arrangement rules of the standard HDMI female connector interface, thereby improving the versatility and standardization of the contact portions a1 of the terminal structure 10. Second, the solder pad portions a2 of the ground shield terminals 120 and the solder pad portions a2 of the differential signal terminals 110 in the multiple terminal groups 100 are arranged along the first direction X. This improves the convenience of electrical connection between the solder pad portions a2 of the terminal structure 10 and the circuit board.

[0064] In some embodiments, such as Figure 5 As shown and referenced Figure 3 The ground shield terminals 120 in the multiple terminal groups 100 are electrically connected to each other. That is, the multiple ground shield terminals 120 can form a conductor structure 120a that is grounded as a whole.

[0065] This design offers several advantages. First, by limiting the conductor structure 120a, multiple ground shield terminals 120 can be secured within the female connector, improving the convenience and reliability of their placement. Second, it increases the grounding area, allowing for more effective diversion of interference current to the ground and reducing the impact of electromagnetic interference on signal transmission, thus further enhancing signal reliability and quality. Third, by connecting the multiple ground shield terminals 120 into a single unit, only one limiting operation on the overall conductor structure 120a is needed during connector assembly, effectively securing all ground shield terminals 120 and improving assembly efficiency and stability while reducing costs.

[0066] In some embodiments, such as Figure 3 and Figure 7 As shown, in different terminal groups 100, the solder pads a2 of the ground shield terminal 120 are located on the same side of the solder pads a2 of a pair of differential signal terminals 110 along the first direction X. That is, in each terminal group 100, the solder pads a2 of the ground shield terminal 120 and the solder pads a2 of a pair of differential signal terminals 110 are arranged in the same order along the first direction X. This arrangement, firstly, allows for tight coupling of the solder pads a2 of a pair of differential signal terminals 110 within each terminal group 100, thereby reducing the differential mode loop area. Secondly, it allows the ground signal line and the grounding line GND on the circuit board 20 to be directly connected on the same layer of the circuit board 20, thereby reducing the grounding impedance after the terminal structure 10 is connected to the circuit board 20. Thirdly, in any two adjacent terminal groups 100, the solder pads a2 of one pair of differential signal terminals 110 and the solder pads a2 of another pair of differential signal terminals 110 are isolated by the solder pads a2 of a ground shield terminal 120, which can further reduce the probability of crosstalk between differential signals in two adjacent terminal groups 100. This is beneficial for further improving the quality and reliability of signal transmission.

[0067] In some embodiments, such as Figure 9 , Figure 10 and Figure 11As shown, the terminal structure 10 also includes a conductive connector 130. The solder pads a2 of the ground shield terminal 120 and the solder pads a2 of a pair of differential signal terminals 110 of each terminal group 100 are arranged sequentially. The conductive connector 130 is electrically connected to the ground shield terminal 120 of the last terminal group 100. The conductive connector 130 is located on the side of the solder pads a2 of the pair of differential signal terminals 110 of the last terminal group 100 that faces away from the solder pads a2 of the ground shield terminal 120. The conductive connector 130 is used for electrical connection with the ground shield terminal 120 of the last terminal group 100; that is, the conductive connector 130 also corresponds to a ground shield terminal 120.

[0068] This configuration ensures that the solder pads a2 of a pair of differential signal terminals 110 in each group are located between the solder pads a2 of two ground shield terminals 120, thereby further improving the quality and reliability of signal transmission.

[0069] It should be noted that, Figure 10 and Figure 11 The difference in the illustrated embodiments is that, Figure 10 In this terminal group 100, among a pair of differential signal terminals 110, only the main body a3 of one differential signal terminal 110 (e.g., the first signal terminal 111) and the main body a3 of the ground shield terminal 120 are bent. This allows the positions of the solder feet a2 of the first signal terminal 111 and the solder feet a2 of the ground shield terminal 120 to be interchanged. The bending state of the other differential signal terminal 110 (e.g., the second signal terminal 112) remains unchanged compared to related technologies. That is, the second signal terminal 112 is essentially interchangeable and requires no modification, thereby improving signal transmission quality and reliability while reducing costs and development costs.

[0070] and Figure 11 In this process, both the main body a3 (first signal terminal 111 and second signal terminal 112) of a pair of differential signal terminals 110 and the main body a3 of the ground shield terminal 120 are bent, thereby achieving the interchange of the positions of the solder feet a2. Then, the conductive connector 130 is connected to the ground shield terminal 120. The advantages of this arrangement are twofold: first, it allows for tighter coupling of the solder feet a2 of the pair of differential signal terminals 110, improving signal transmission efficiency; second, as... Figure 11 As shown, space can be reserved for the installation of the conductive connector 130, so that the solder feet a2 of the conductive connector 130 and the ground shield terminal 120 can be designed to be roughly symmetrical. The bending angle of the conductive connector 130 will not be too large, which will help improve the convenience and reliability of the process.

[0071] In other embodiments, such as Figure 12 , Figure 13 and Figure 14 As shown, the solder pads a2 of a pair of differential signal terminals 110 and the solder pads a2 of ground shield terminals 120 of each terminal group 100 are arranged in sequence. The conductive connector 130 is electrically connected to the ground shield terminal 120 of the first terminal group 100. The conductive connector 130 is located on the side of the solder pads a2 of a pair of differential signal terminals 110 of the first terminal group 100 that is away from the solder pads a2 of the ground shield terminal 120.

[0072] This embodiment proposes another arrangement of the conductive connector 130, thereby ensuring that the solder feet a2 of a pair of differential signal terminals 110 in each group are located between the solder feet a2 of the two ground shield terminals 120, which can further improve the quality and reliability of signal transmission.

[0073] It should be noted that, Figure 13 and Figure 14 The difference, with Figure 10 and Figure 11 The differences are similar. Figure 13 The implementation shown can improve signal transmission quality and reliability while reducing costs and development costs. Figure 14 The implementation shown allows for tighter coupling of the solder pads a2 of the differential signal terminals 110, improving signal transmission efficiency. Furthermore, the solder pads a2 of the conductive connector 130 and the ground shield terminal 120 can be designed approximately symmetrically, preventing excessive bending angles in the conductive connector 130 and thus enhancing the convenience and reliability of the manufacturing process.

[0074] In some embodiments, the number of terminal groups 100 is four, namely a first terminal group, a second terminal group, a third terminal group, and a fourth terminal group arranged sequentially along a first direction X. Each terminal group 100 is used to transmit a differential signal.

[0075] Specifically, such as Figure 3As shown, the first terminal group includes pin1, pin2 and pin3, the second terminal group includes pin4, pin5 and pin6, the third terminal group includes pin7, pin8 and pin9, and the fourth terminal group includes pin10, pin11 and pin12. Pin2, pin5, pin8 and pin11 are ground shielded terminals 120. The contact portions a1 of pin1, pin3, pin5, pin7, pin9 and pin11 are arranged in a first row at intervals, and the contact portions a1 of pin2, pin4, pin6, pin8, pin10 and pin12 are arranged in a second row at intervals.

[0076] like Figure 7 As shown, the solder pads a2 of pin1, pin3, pin2, pin4, pin6, pin5, pin7, pin9, pin8, pin10, pin12, and pin11 are arranged sequentially at intervals. Alternatively, as shown... Figure 3 As shown, the solder feet a2 of pin2, pin1, pin3, pin5, pin4, pin6, pin8, pin7, pin9, pin11, pin10 and pin12 are arranged alternately.

[0077] This configuration helps improve the quality and reliability of signal transmission.

[0078] It should be noted that pins 1 through 12 conform to the terminal standard definitions in the HDMI female connector. Optionally, as... Figure 3 As shown, terminal structure 10 also includes pins 13 to 19. Pin 13 is a consumer electronics control channel pin, pin 14 is a reserved pin, pin 15 is a serial clock line pin for the display data channel, pin 16 is a serial data line pin for the display data channel, pin 17 is a ground pin for both the display data channel and the consumer electronics control channel, pin 18 is a power supply pin, and pin 19 is a hot-plug detection pin.

[0079] The contact portions a1 of pin13, pin15, pin17, and pin19 are arranged in a first row at intervals along the first direction X, and the contact portions a1 of pin14, pin16, and pin18 are arranged in a second row at intervals along the first direction X. Thus, the arrangement structure of the entire contact portion a1 of the terminal structure 10 can be formed.

[0080] Furthermore, such as Figure 3 As shown, the solder pads a2 of terminals pin13 to pin19 are arranged sequentially at intervals along the first direction X. Thus, the entire arrangement structure of the solder pads a2 of terminal structure 10 can be formed.

[0081] Secondly, this application proposes an HDMI female connector including the terminal structure 10 described in the first aspect. With this configuration, firstly, there is no grounding terminal between the solder pads a2 of a pair of differential signal terminals 110 within each terminal group 100, enabling tight coupling and reducing the differential mode loop area. Secondly, the ground signal line (e.g., p2 signal line) and the grounding line (e.g., GND2) on the circuit board 20 can be directly connected on the same layer of the circuit board 20 without the need for through-holes, thereby reducing the grounding impedance after the terminal structure 10 is connected to the circuit board 20. This improves the quality and reliability of signal transmission.

[0082] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A terminal structure for an HDMI female connector, characterized in that, The terminal structure includes multiple terminal groups, and the multiple terminal groups are arranged along a first direction; Each of the terminal groups includes: A pair of differential signal terminals, wherein the contact portions of the pair of differential signal terminals are spaced apart along the first direction; A ground shield terminal, with its contact portion located between the contacts of the pair of differential signal terminals along a first direction; and with its contact portion located on one side of the contacts of the pair of differential signal terminals along a second direction perpendicular to the first direction. The solder feet of the ground shield terminal and the solder feet of the pair of differential signal terminals are arranged along the first direction, and the solder feet of the ground shield terminal are located on one side of the solder feet of the pair of differential signal terminals along the first direction.

2. The terminal structure according to claim 1, characterized in that, The pair of differential signal terminals includes a first signal terminal and a second signal terminal; Along the first direction, the solder pad of the ground shield terminal is located on the side of the solder pad of the first signal terminal that is away from the solder pad of the second signal terminal; Alternatively, along the first direction, the solder pad of the ground shield terminal is located on the side of the solder pad of the second signal terminal that is away from the solder pad of the first signal terminal.

3. The terminal structure according to claim 2, characterized in that, The distance between the solder pad of the first signal terminal and the solder pad of the second signal terminal is less than the distance between the contact portion of the first signal terminal and the contact portion of the second signal terminal.

4. The terminal structure according to claim 1, characterized in that, In any two adjacent terminal groups, the contact portion of the ground shield terminal in one terminal group and the contact portion of the pair of differential signal terminals in the other terminal group are arranged along the first direction. The solder feet of the ground shield terminal and the solder feet of the differential signal terminal in the plurality of terminal groups are arranged along the first direction.

5. The terminal structure according to claim 4, characterized in that, The ground shield terminals in the plurality of terminal groups are electrically connected to each other.

6. The terminal structure according to claim 4, characterized in that, In different terminal groups, the solder pads of the ground shield terminal are located on the same side of the solder pads of the pair of differential signal terminals along the first direction.

7. The terminal structure according to claim 6, characterized in that, The terminal structure also includes conductive connectors; The solder feet of the ground shield terminal and the solder feet of the pair of differential signal terminals in each terminal group are arranged in sequence. The conductive connector is electrically connected to the ground shield terminal of the last terminal group. The conductive connector is located on the side of the solder feet of the pair of differential signal terminals in the last terminal group that is away from the solder feet of the ground shield terminal.

8. The terminal structure according to claim 6, characterized in that... The first group of terminals further includes conductive connectors; The solder feet of the pair of differential signal terminals and the solder feet of the ground shield terminal of each terminal group are arranged in sequence. The conductive connector is electrically connected to the ground shield terminal of the first terminal group. The conductive connector is located on the side of the solder feet of the pair of differential signal terminals of the first terminal group that is away from the solder feet of the ground shield terminal.

9. The terminal structure according to claim 1, characterized in that, The number of terminal groups is four, and the four terminal groups are respectively the first terminal group, the second terminal group, the third terminal group and the fourth terminal group arranged in sequence along the first direction.

10. An HDMI female connector, characterized in that, Includes the terminal structure as described in any one of claims 1 to 9.

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