Power module

Abstract

This invention discloses a power module, relating to the field of power module technology, comprising: a housing, a substrate, a terminal structure, a first snap-fit ​​device, a second snap-fit ​​device, and a top cover; the substrate is fixedly connected to the bottom of the housing via the first snap-fit ​​device; the terminal structure includes an elastic portion and a rigid portion, the top of the elastic portion snapping into the housing, and the rigid portion connecting to the top of the elastic portion and penetrating the housing; the top cover is connected to the top of the housing via the second snap-fit ​​device, causing the housing to press against the bottom of the elastic portion of the terminal structure against the substrate. Based on the strong positioning of the terminal structure, this invention ensures that the tops of the terminal structure are on the same horizontal plane. The curved terminal structure ensures that the terminal structure is fixed to the IMS substrate, reducing the possibility of cold solder joints during solder paste soldering, eliminating the need for reflow soldering and clamping rings, and reducing product manufacturing time. Epoxy molding compound encapsulation reduces water absorption and increases strength.

Description

Technical Field

[0001] This invention relates to the field of power module technology, and more specifically to power modules. Background Technology

[0002] Currently, the existing Easy 1B terminals are soldered to the DBC using solder paste, and the outer casing and DBC are glued together. Silicone is then injected into the gaps. The existing Easy 4B terminals are soldered to the DBC using solder paste, the DBC is soldered to the base plate using solder pads, and the base plate is fixed to the outer casing using glue and retaining rings. Silicone is then injected into the gaps. Both methods require reflow soldering, which can cause changes in the curvature of the DBC and base plate, and the precision of reflow soldering cannot be guaranteed. Furthermore, the existing silicone absorbs moisture when damp.

[0003] Therefore, how to propose a power module that overcomes the shortcomings of existing technologies is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] In view of this, the present invention provides a power module that ensures the top ends of the terminal structure are on the same horizontal plane. The curved terminal structure ensures that the terminal structure is fixed to the IMS substrate, reducing the possibility of cold solder joints during solder paste soldering, eliminating the need for reflow soldering and clamping rings, and reducing product manufacturing time. Epoxy molding compound encapsulation prevents water absorption and increases strength. To achieve the above objectives, the present invention adopts the following technical solution: The power module includes: The outer casing, substrate, terminal structure, first snap-fit ​​device, second snap-fit ​​device, and top cover; The substrate is fixedly connected to the bottom of the outer casing via a first snap-fit ​​device; The terminal structure includes an elastic part and a rigid part. The top of the elastic part is snapped into the outer shell, and the rigid part is connected to the top of the elastic part and penetrates the outer shell. The top cover is connected to the top of the outer shell via a second snap-fit ​​device, so that the bottom of the elastic part of the outer shell presses against the substrate.

[0005] Optionally, the substrate is an IMS substrate.

[0006] Optionally, it also includes encapsulating the inside of the housing with epoxy molding compound, and encapsulating the corresponding position of the terminal structure with a hollow inverted conical structure.

[0007] Optionally, the substrate includes a copper layer, an aluminum layer, and an iron layer connected in sequence.

[0008] Optionally, the first snap-fit ​​device includes a first snap fastener, which is fixedly connected to the inner wall of the housing, and the substrate is snapped to the bottom of the housing via the first snap fastener.

[0009] Optionally, the second snap-fit ​​device includes a second snap and a first groove. The second snap is fixedly connected to the top cover, the first groove is formed on the inner side wall of the outer shell, and the second snap fits the first groove with a clearance.

[0010] Optionally, it also includes a sealing component, which is an elastic cylindrical structure. The outer shell array is provided with a through-hole, and the sealing component is sealed to the through-hole. The rigid part passes through the sealing component and penetrates the outer shell, and the rigid part is sealed to the sealing component.

[0011] Optionally, the terminal structure may be provided in multiple forms.

[0012] As can be seen from the above technical solution, compared with the prior art, the present invention discloses a power module with the following beneficial effects: This invention utilizes a strong positioning system based on the terminal structure, ensuring that the top edges of the terminal structures are on the same horizontal plane. The curved terminal structure ensures that the terminal structure is fixed to the IMS substrate, reducing the possibility of cold solder joints during solder paste soldering, eliminating the need for reflow soldering and clamping rings, and reducing product manufacturing time. The epoxy molding compound encapsulation prevents water absorption and increases strength. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0014] Figure 1 This invention provides an internal structural diagram of a power module.

[0015] Figure 2 This is a front view of a power module provided by the present invention.

[0016] Figure 3 A side view of a power module provided for this invention.

[0017] Figure 4 This is a schematic diagram of the terminal structure provided by the present invention.

[0018] Figure 5 This is a schematic diagram of the epoxy molding compound encapsulation structure provided by the present invention.

[0019] Figure 6 The structural framework diagram of the first snap-fit ​​device and the second snap-fit ​​device provided by the present invention.

[0020] Figure 7This is a terminal structure installation diagram provided by the present invention.

[0021] Figure 8 A bottom view of a power module provided by the present invention.

[0022] Figure 9 A top view of a power module provided by the present invention.

[0023] Among them, 1-shell, 2-substrate, 3-terminal structure, 4-first buckle, 5-second buckle, 6-first groove, 7-epoxy molding compound encapsulation, and 8-top cover. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] This invention discloses a power module, such as... Figures 1-3 , Figures 8-9 As shown, it includes: 1. Outer shell; 2. Substrate; 3. Terminal structure; 4. First snap-fit ​​device; 5. Second snap-fit ​​device; and 6. Top cover; The substrate 2 is fixedly connected to the bottom of the outer casing 1 via a first snap-fit ​​device; The terminal structure 3 includes an elastic part and a rigid part. The top of the elastic part is snapped into the outer shell 1, and the rigid part is connected to the top of the elastic part and passes through the outer shell 1. The top cover 8 is connected to the top of the outer shell 1 through a second snap-fit ​​device, so that the bottom of the elastic part of the outer shell 1 presses against the substrate 2.

[0026] Furthermore, the substrate 2 is an IMS substrate 2.

[0027] Furthermore, it also includes epoxy molding compound encapsulation 7 inside the outer shell 1, and encapsulation of the corresponding position of the terminal structure 3 into a hollow inverted conical structure.

[0028] Furthermore, the substrate 2 includes a copper layer, an aluminum layer, and an iron layer connected in sequence.

[0029] Furthermore, such as Figure 6 As shown, the first snap-fit ​​device includes a first snap-fit ​​4, which is fixedly connected to the inner wall of the outer shell 1, and the substrate 2 is snapped to the bottom of the inner shell 1 through the first snap-fit ​​4.

[0030] Furthermore, such as Figure 6As shown, the second snap-fit ​​device includes a second snap-fit ​​5 and a first groove 6. The second snap-fit ​​5 is fixedly connected to the upper cover 8, and the first groove 6 is formed on the inner side wall of the outer shell 1. The second snap-fit ​​5 and the first groove 6 are in clearance fit.

[0031] Specifically, substrate 2 is a single-piece structure, distinct from the previous DBC and base plate soldered together, which eliminates the need for soldering steps and reduces the risk of soldering defects. Substrate 2 is connected to outer shell 1 via the first clip 4 on outer shell 1, as shown below. Figures 6-7 The triangular structure on the outer shell 1 shown has a base plate inserted from top to bottom to hold the outer shell 1 in place. This engagement is achieved through the elastic deformation of the plastic shell. Then, using a special mold, an epoxy molding compound 7 is created, unlike other structural modules that also encapsulate the pins. Figure 5 As shown, the green part is the encapsulation. The terminal structure 3 is inverted conical in shape. This structure leaves space for the terminal structure 3 to be adjusted. Then, the terminal structure 3 and the top cover 8 are put in. The pin pushes against the top cover 8 through elastic deformation. The top cover 8 and the outer shell 1 are connected by the second buckle 5.

[0032] In a specific embodiment, the outer shell 1 and the upper cover 8 are integrated, and the substrate 2 enters the outer shell 1 from the top and can also be fixed by screws and bolts.

[0033] In specific embodiments, terminal structure 3 can adopt different spring pin structures, with copper material integrally processed to construct a bent structure pin.

[0034] Furthermore, it also includes a sealing component, which is an elastic cylindrical structure. The outer shell 1 is provided with through-holes, and the sealing component is sealed to the through-holes. The rigid part passes through the sealing component and penetrates the outer shell 1, and the rigid part is sealed to the sealing component.

[0035] Furthermore, a plurality of terminal structures 3 may be provided, and the terminal structures 3 may also be arranged in an array.

[0036] In specific implementation methods, such as Figure 4 As shown, terminal structure 3 is a spring-loaded bent structure. As shown in orange, its upper end clips onto housing 1. As shown in blue, housing 1 clips onto the IMS substrate 2. As shown in yellow, housing 1 is attached to the IMS substrate 2 without soldering terminals or using adhesive. Housing 1 presses down on terminal structure 3, allowing the bent terminal structure 3 to be firmly pressed onto the IMS substrate 2. Because the pins and layout can be freely arranged, the inductance can be reduced through adjustment. As shown in gray, the epoxy molding compound 7 encapsulates the structure, preventing water absorption and increasing strength.

[0037] Specifically, methods to reduce inductance include: allowing the pin positions to be freely placed, which can reduce the DC+ / DC- distance, increase mutual inductance, and reduce parasitic inductance. Allowing the pin positions to be freely placed can increase the trace area for DC+ / DC- mutual inductance, reduce the length of DC+ / AC and AC / DC-, and further reduce parasitic inductance.

[0038] Specifically, the IMS substrate 2 can be made of Cu / AL / Fe or related alloys, and adopts a single-layer trace architecture.

[0039] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0040] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power module, characterized in that, include: The outer casing, substrate, terminal structure, first snap-fit ​​device, second snap-fit ​​device, and top cover; The substrate is fixedly connected to the bottom of the outer casing via a first snap-fit ​​device; The terminal structure includes an elastic part and a rigid part. The top of the elastic part is snapped into the outer shell, and the rigid part is connected to the top of the elastic part and penetrates the outer shell. The top cover is connected to the top of the outer shell via a second snap-fit ​​device, so that the bottom of the elastic part of the outer shell presses against the substrate.

2. The power module according to claim 1, characterized in that, The substrate is an IMS substrate.

3. The power module according to claim 1, characterized in that, It also includes epoxy molding compound encapsulation inside the housing, and encapsulation of the corresponding terminal structure into a hollow inverted conical structure.

4. The power module according to claim 1, characterized in that, The substrate comprises a copper layer, an aluminum layer, and an iron layer connected in sequence.

5. The power module according to claim 1, characterized in that, The first snap-fit ​​device includes a first snap-fit, which is fixedly connected to the inner wall of the outer shell, and the substrate is snapped to the bottom of the inner shell through the first snap-fit.

6. The power module according to claim 1, characterized in that, The second snap-fit ​​device includes a second snap-fit ​​and a first groove. The second snap-fit ​​is fixedly connected to the top cover, and the first groove is formed on the inner side wall of the outer shell. The second snap-fit ​​is in clearance fit with the first groove.

7. The power module according to claim 1, characterized in that, It also includes a sealing component, which is an elastic cylindrical structure. The outer shell array is provided with a through-hole. The sealing component is sealed to the through-hole. The rigid part passes through the sealing component and penetrates the outer shell. The rigid part is sealed to the sealing component.

8. The power module according to claim 1, characterized in that, The terminal structure is provided in several parts.

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