Switching system test system

Abstract

The application provides a switch test system, and belongs to the technical field of device testing. The switch test system comprises: a cabinet and an in-cabinet cooling liquid distribution unit; the cabinet is used for containing a switch to be tested; a backboard of the cabinet comprises a plurality of backboard units, the backboard units are provided with a backboard liquid inlet and a backboard liquid outlet, and the backboard liquid inlet and the backboard liquid outlet are respectively communicated with the in-cabinet cooling liquid distribution unit; the backboard units are configured to be docked with the switch, the switch is provided with a liquid cooling assembly, after the backboard units are docked with the switch, a liquid inlet pipe of the liquid cooling assembly is communicated with the backboard liquid inlet, and a liquid outlet pipe of the liquid cooling assembly is communicated with the backboard liquid outlet; and the in-cabinet cooling liquid distribution unit is used for conveying cooling liquid to the liquid cooling assembly after the switch is docked with the backboard units, and receiving backflow cooling liquid. Through the scheme, the integration of the installation function and the liquid cooling function of the switch test system is realized, and the liquid cooling pipe is not manually connected for the switch to be tested.

Description

Technical Field

[0001] This article relates to the field of equipment testing technology, and in particular to a switch testing system. Background Technology

[0002] With the development of information technologies such as cloud computing and big data, data centers are placing increasingly higher demands on the bandwidth, throughput, and processing capabilities of switches, leading to increased port density and power consumption density. Traditional air-cooling methods have limited cooling capacity in high-density, high-power scenarios, while liquid cooling, with its advantages of efficient heat exchange, energy saving, and low noise, is gradually becoming the mainstream cooling solution for high-power switches.

[0003] Currently, switch testing systems with liquid cooling capabilities generally adopt a design where the liquid cooling components and the test cabinet are separate.

[0004] However, in batch testing scenarios, the split structure requires manual connection and cooling circulation piping for each switch under test, resulting in low testing efficiency. Summary of the Invention

[0005] In view of this, a switch testing system is provided to at least solve or alleviate the above problems.

[0006] In one scenario, a switch testing system is provided, comprising: a cabinet and an internal coolant distribution unit; the cabinet is used to house the switch to be tested; the backplane of the cabinet includes multiple backplane units, each backplane unit having a backplane inlet and a backplane outlet, the backplane inlet and the backplane outlet respectively communicating with the internal coolant distribution unit; the backplane unit is configured to dock with the switch, the switch being equipped with a liquid cooling assembly, after the backplane unit is docked with the switch, the inlet pipe of the liquid cooling assembly is connected to the backplane inlet, and the outlet pipe of the liquid cooling assembly is connected to the backplane outlet; the internal coolant distribution unit is used to supply coolant to the liquid cooling assembly and receive return coolant after the switch is docked with the backplane unit.

[0007] Based on the above solution, the integrated configuration design of the cabinet, multiple backplane units, and internal coolant distribution unit allows for the integration of installation and liquid cooling functions in the switch testing system. After the switches are connected to the backplane units, the liquid cooling component piping is connected to the fluid interface on the backplane. The internal coolant distribution unit then supplies coolant to the liquid cooling components of each switch and recovers the returned coolant, eliminating the need for manual connection of liquid cooling piping for each switch. This simplifies the test cabling and debugging process in batch switch testing scenarios. The switch testing system provided in this paper supports the installation and functional performance testing of single or multiple switches under test, while also providing centralized heat dissipation management to ensure uniform and stable cooling at each test station. This improves switch testing efficiency while ensuring equipment reliability. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the examples or prior art described herein, the accompanying drawings used in the description of the examples or prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some examples recorded in this article, and those skilled in the art can obtain other drawings based on these drawings.

[0009] Figure 1 This is a schematic diagram of a switch testing system used as an example in this article; Figure 2 This is an internal schematic diagram of a switch testing system used as an example in this article; Figure 3 This is a schematic diagram of a backplane unit as an example in this article; Figure 4 This is a schematic diagram of the internal circulation path of a switch test system, which is an example of the one described in this article. Figure 5 This is a schematic diagram of the external circulation path of a switch test system, as exemplified in this article. Figure 6 This is a schematic diagram of a test unit used in an example of this article. Detailed Implementation

[0010] The examples herein will now be described in more detail with reference to the accompanying drawings. While some examples of this document are shown in the drawings, it should be understood that this document can be implemented in various forms and should not be construed as limited to the examples set forth herein. Rather, these examples are provided to provide a more thorough and complete understanding of this document. It should be understood that the accompanying drawings and examples are for illustrative purposes only and are not intended to limit the scope of this document.

[0011] It should be noted that the headings of any section / subsection provided herein are not restrictive. Various examples are described throughout this document, and examples of any type may be included under any section / subsection. Furthermore, examples described in any section / subsection may be combined in any way with any other examples described in the same section / subsection and / or different sections / subsections.

[0012] In the description of the examples in this document, the term "including" and similar terms should be understood as open inclusion, i.e., "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "an example" or "the example" should be understood as "at least one example". The term "some examples" should be understood as "at least some examples". Other explicit and implicit definitions may also be included below. The terms "first", "second", etc., may refer to different or the same objects. Other explicit and implicit definitions may also be included below.

[0013] The examples in this document may involve user data, data acquisition, and / or use. All of these aspects comply with relevant laws, regulations, and rules. In the examples presented herein, all data collection, acquisition, processing, manipulation, forwarding, and use are conducted with the user's knowledge and confirmation. Accordingly, in implementing each example in this document, the type, scope of use, and usage scenarios of any data or information that may be involved should be communicated to the user and their authorization obtained in accordance with relevant laws and regulations through appropriate means. The specific methods of notification and / or authorization may vary depending on the actual situation and application scenario; the scope of this document is not limited in this regard.

[0014] In this manual and the sample solutions, any processing of personal information will be conducted only under legal grounds (such as obtaining the consent of the data subject or being necessary for the performance of a contract) and will only be carried out within the scope stipulated or agreed upon. A user's refusal to process personal information beyond what is necessary for basic functions will not affect the user's use of basic functions.

[0015] First, some nouns or terms that appear in the description of the examples in this article shall be interpreted as follows: Switch: A switch is a network device used for forwarding electrical (optical) signals. Based on the target MAC address or IP address, it forwards received data frames or packets to the target port after processing by a switching matrix and port queue scheduling, thereby providing access devices with dedicated bandwidth, conflict-free communication and multi-node interconnection functions.

[0016] Switch testing is a systematic evaluation activity that verifies the functionality, performance, and reliability of switch devices. It quantifies and judges the key indicators of the switch to provide objective data support for equipment selection, network access acceptance, and fault diagnosis.

[0017] Coolant Distribution Unit (CDU): The Coolant Distribution Unit (CDU) is the core heat exchange and fluid distribution device in a liquid cooling system. Through a built-in plate heat exchanger or pump-driven circulation assembly, it physically isolates and precisely exchanges heat between the primary side cold source and the secondary side load end, realizing coolant flow distribution, supply temperature regulation, pressure maintenance, and cleanliness management, providing efficient and reliable liquid heat dissipation for high-density computing power equipment.

[0018] Data center: A data center is a physical space that centrally houses IT equipment such as computing, storage, and networking devices and provides a stable operating environment. It is equipped with precision air conditioning and cooling systems to regulate temperature and humidity, deploys uninterruptible power supplies and power distribution systems to ensure power supply, lays out structured cabling systems to achieve high-speed interconnection, integrates fire protection and security systems to ensure physical security, and conducts real-time monitoring and centralized management of environmental parameters, energy consumption indicators, and equipment status. In this way, it provides a core physical environment carrier for critical information infrastructure to operate under highly available, highly reliable, manageable, and controllable conditions.

[0019] Power Distribution Unit (PDU): A power distribution unit (PDU) is a terminal power distribution device used for rack-level power routing, distribution and management. It distributes the input bus power to each load device through circuit breakers, multi-output socket modules and monitoring and control modules, realizing the orderly power supply of multiple devices, real-time voltage and current monitoring, remote on / off control and energy consumption management functions.

[0020] The following is a detailed description of the switch testing system provided in this example, with reference to the accompanying drawings.

[0021] Switch testing system Figure 1 A schematic diagram of a switch testing system 10 is shown. Figure 2 An internal schematic diagram of a switch testing system 10 is shown. Figure 3 A schematic diagram of a backplane unit 13 is shown. (As shown) Figures 1 to 3As shown, the switch testing system 10 includes a cabinet 11 and an internal coolant distribution unit 12. The cabinet 11 houses the switch 20 to be tested. The backplane of the cabinet 11 includes multiple backplane units 13, each with a backplane inlet 131 and a backplane outlet 132, which are connected to the internal coolant distribution unit 12. The backplane units 13 are configured to dock with the switch 20, which is equipped with a liquid cooling assembly 21. After the backplane unit 13 is docked with the switch 20, the inlet pipe of the liquid cooling assembly 21 is connected to the backplane inlet 131, and the outlet pipe of the liquid cooling assembly 21 is connected to the backplane outlet 132. The internal coolant distribution unit 12 supplies coolant to the liquid cooling assembly 21 and receives return coolant after the switch 20 is docked with the backplane unit 13.

[0022] The cabinet 11 serves as the physical support for the switch testing system 10, featuring an internal cavity and a high-strength load-bearing frame to accommodate the installation requirements of multiple switches 20 and the internal coolant distribution unit 12. The cabinet 11 contains the internal coolant distribution unit 12, which supplies coolant and receives return coolant.

[0023] The backplane of the rack 11 is formed by assembling multiple independent backplane units 13. The backplane units 13 adopt a modular design, with each unit serving as an independent interface carrier for interfacing with a switch 20 under test, enabling the installation of the switch 20 relative to the rack 11. Inside the rack 11, corresponding to each backplane unit 13, are multiple mounting cavities. These cavities accommodate the switch 20 under test and provide an installation reference for the interfacing of the switch 20 with the backplane units 13. In one example, such as... Figure 1 As shown, the mounting cavity adopts a modular slot structure, with each slot (SLOT) corresponding to a backplate unit 13 to achieve independent liquid cooling pipeline control.

[0024] It should be noted that the backplane unit 13 adopts a modular and independent design. Each backplane unit 13 can be specifically designed according to the interface layout, size specifications, and heat dissipation requirements of the switch 20 under test. This facilitates overall equipment assembly and subsequent maintenance and repair, and allows for flexible expansion of the number of backplane units 13 according to the testing scale, making system expansion and functional expansion convenient and flexible. When testing different models and specifications of switches 20, there is no need to modify the overall frame of the cabinet 11 and the coolant distribution unit 12 inside the cabinet. Only the backplane unit 13 corresponding to the specifications of the switch 20 under test needs to be replaced, which can quickly achieve functional adaptation and expansion of the switch testing system 10. Furthermore, the switch testing system 10 can simultaneously perform parallel testing of multiple different types of switches 20. The system has wide versatility and applicability, and can meet the diverse needs of different application scenarios.

[0025] The backplane unit 13 is provided with a backplane liquid inlet 131 and a backplane liquid outlet 132, which are respectively connected to the coolant distribution unit 12 inside the cabinet. In order to achieve unified distribution and recovery of coolant, the backplane liquid inlet 131 of each backplane unit 13 is connected to the outlet of the coolant distribution unit 12 inside the cabinet through an independent fluid pipeline, and the backplane liquid outlet 132 of each backplane unit 13 is connected to the return port of the coolant distribution unit 12 inside the cabinet through an independent fluid pipeline, thereby forming multiple cooling channels, providing each backplane unit 13 with its own independent and non-interfering liquid cooling path, and realizing parallel cooling of multiple switches 20 under test.

[0026] The switch 20 is equipped with a liquid cooling assembly 21, which is used to contact the heat-generating components (such as switching chips, CPUs, etc.) inside the switch 20 and absorb the heat generated by these components. The liquid cooling assembly 21 has an inlet pipe for coolant input and an outlet pipe for coolant output, which are connected via a cooling channel. Low-temperature coolant enters the cooling channel inside the liquid cooling assembly 21 through the inlet pipe. As the low-temperature coolant flows through the cooling channel, it absorbs the heat generated by the heat-generating components in contact with the liquid cooling assembly 21. The heated coolant then flows out through the outlet pipe of the liquid cooling assembly 21.

[0027] After the switch under test 20 is installed with the corresponding backplane unit 13 according to the preset installation direction and alignment, the liquid inlet pipe of the liquid cooling component 21 on the switch under test 20 is connected to the backplane liquid inlet 131 on the backplane unit 13, and then connected to the outlet of the cabinet coolant distribution unit 12, so that the cabinet coolant distribution unit 12 can deliver low-temperature coolant to the liquid cooling component 21. At the same time, the liquid outlet pipe of the liquid cooling component 21 on the switch under test 20 is connected to the backplane liquid outlet 132 on the backplane unit 13, and then connected to the return port of the cabinet coolant distribution unit 12, so that the cabinet coolant distribution unit 12 can receive the high-temperature return coolant generated by the liquid cooling component 21. The high-temperature return coolant can be cooled by the cabinet coolant distribution unit 12 and then output as low-temperature coolant again, realizing a circulating cooling path.

[0028] Through the overall configuration design of the cabinet 11, multiple backplane units 13, and the cabinet-internal coolant distribution unit 12, the switch testing system 10 integrates the installation and liquid cooling functions. After the switch 20 is installed and connected to the backplane unit 13, the piping of the liquid cooling component 21 is connected to the fluid interface on the backplane. The cabinet-internal coolant distribution unit 12 then supplies coolant to the liquid cooling components 21 of each switch 20 and recovers the returned coolant. This eliminates the need for manual connection of liquid cooling piping to each switch 20 under test, simplifying the test cabling and debugging process in batch testing scenarios. The switch testing system 10 provided in this paper can support the installation and functional performance testing of single or multiple switches 20 under test, and also provides centralized heat dissipation management to ensure uniform and stable cooling at each test station. This improves the testing efficiency of the switch 20 while ensuring equipment reliability.

[0029] Figure 4 A schematic diagram of the internal circulation path of a switch testing system 10 is shown. Figure 5 A schematic diagram of the external circulation path of a switch testing system 10 is shown. (As shown) Figure 4 and Figure 5 As shown, the cabinet-in-cabinet coolant distribution unit 12 includes a path switching subunit 121. The path switching subunit 121 connects the backplane inlet 131 and backplane outlet 132 to the cabinet-in-cabinet circulation path in low-load mode, and connects the backplane inlet 131 and backplane outlet 132 to the cabinet-outside circulation path in high-load mode. The coolant in the cabinet-in-cabinet circulation path is cooled by the fan included in the cabinet-in-cabinet coolant distribution unit 12 as it flows through the cabinet-in-cabinet coolant distribution unit 12. The coolant in the cabinet-outside circulation path is cooled by the cabinet-outside coolant distribution unit 14 as it flows through the cabinet-outside coolant distribution unit 14, which is located outside the cabinet 11.

[0030] Low-load mode refers to the operating mode of the switch under test 20 when it is running below a preset power consumption threshold, and / or when the ambient temperature inside the cabinet 11 is below a preset temperature threshold. For example, when the switch 20 performs basic function tests, protocol conformance tests, or light-load aging tests in a normal temperature environment (such as 25°C), the heat generated by the core heat-generating components of the switch 20 is relatively limited, and the system identifies it as low-load mode.

[0031] In low-load mode, the channel switching subunit 121 connects the backplate inlet 131 and backplate outlet 132 to the internal circulation path. In the internal circulation path, after absorbing heat and heating up, the coolant flows through the internal coolant distribution unit 12, where a fan provides air cooling. The cooled coolant can then be recycled. Thus, in low-load mode, the system can independently dissipate heat without relying on an external cold source, meeting the system's low-power cooling requirements and reducing overall energy consumption.

[0032] High load mode refers to the operating mode of the switch under test 20 when it reaches or exceeds a preset power consumption threshold, and / or when the ambient temperature inside the cabinet 11 reaches a preset upper temperature limit. For example, when the switch 20 is running a full-load stress test or undergoing extreme heat dissipation evaluation in a high-temperature environment (such as 40°C or higher), its internal heat-generating components are at maximum power consumption, and the heat generated exceeds the upper limit of the cabinet's circulating cooling capacity, which the system identifies as high load mode.

[0033] In high-load mode, the path switching subunit 121 connects the backplane inlet 131 and the backplane outlet 132 to the external circulation path. The external circulation path includes an external coolant distribution unit 14 located outside the cabinet 11, and a fluid pipeline is provided between the external coolant distribution unit 14 and the internal coolant distribution unit 12. The external coolant distribution unit 14 is a high-power liquid-cooled heat dissipation device with a large heat exchange capacity, which can provide sufficient external cold source support for the cabinet 11 operating under high load.

[0034] In the external circulation path, after absorbing heat and heating up, the coolant is transferred through the internal coolant distribution unit 12 and flows into the external coolant distribution unit 14 via the fluid pipeline between the internal and external coolant distribution units 12. As the coolant flows through the external coolant distribution unit 14, it undergoes more powerful cooling. The cooled coolant is then returned to the internal coolant distribution unit 12 via the fluid pipeline between the internal and external coolant distribution units 12, enabling the internal coolant distribution unit 12 to supply low-temperature coolant to the liquid cooling assembly 21. It is understood that in the external circulation path, as the coolant flows through the internal coolant distribution unit 12, the fan within the internal coolant distribution unit 12 can also provide a certain degree of air cooling. Thus, under high load conditions, the system achieves efficient heat dissipation with the help of an external cold source to meet the heat dissipation requirements of high-power operation, thereby ensuring the stable operation of the switch 20 during testing.

[0035] By configuring the path switching subunit 121, the test system can dynamically switch between the internal and external circulation paths based on the actual load of the switch 20. In low-load mode, the test system switches to the internal circulation path, meeting low heat dissipation requirements while avoiding unnecessary activation of the external coolant distribution unit 14, thus reducing system energy consumption. In high-load mode, the test system switches to the external circulation path, utilizing an external cold source for efficient heat dissipation, ensuring the stability and reliability of tests under high-power scenarios. This balances the energy efficiency and heat dissipation performance of the test system, improving its adaptability to different power consumption conditions.

[0036] In one scenario, the external coolant distribution unit 14 includes a centralized coolant distribution unit for the computer room.

[0037] The centralized coolant distribution unit of the data center is deployed outside the racks 11, specifically in the common cooling source area or the dedicated equipment area within the data center. The centralized coolant distribution unit possesses significantly higher cooling power and heat exchange efficiency than the internal coolant distribution units 12 within each rack 11, and enables unified heat recovery and scheduling management at the data center level. The centralized coolant distribution unit is connected to the internal coolant distribution units 12 within each rack 11 via fluid piping between the internal coolant distribution units 12 and the external coolant distribution units 14. The connection between the internal loop of each rack 11 and the external circulation path of the centralized coolant distribution unit is controlled by the corresponding internal path switching subunit 121 of the rack 11.

[0038] The centralized coolant distribution unit has the ability to provide parallel cooling for multiple cabinets 11, and can provide centralized coolant distribution and recycling services for multiple switch 20 test cabinets 11 at the same time. When the path switching subunit 121 in any cabinet 11 connects the backplane inlet 131 and backplane outlet 132 on the backplane unit 13 to the external circulation path, the coolant in the cabinet 11 that has absorbed heat and become heated is transferred through the cabinet coolant distribution unit 12 and then transported along the fluid pipeline to the centralized coolant distribution unit for cooling. The cooled low-temperature coolant can flow back along the fluid pipeline to the cabinet coolant distribution unit 12 of the corresponding cabinet 11 and re-enter the internal cooling path of the cabinet 11 for circulation.

[0039] By using the centralized coolant distribution unit in the computer room, the existing centralized cooling infrastructure in the computer room can be reused. There is no need to repeatedly configure independent external cooling devices for each test cabinet 11. This can reduce the overall construction cost, space occupation and later operation and maintenance complexity of the system. It can also provide sufficient cooling capacity for high-power test scenarios, meet the heat dissipation requirements of high-power operation of the system, and thus ensure the stability and reliability of the switch 20 test.

[0040] In one configuration, the channel switching subunit 121 includes a first switcher 1211 and a second switcher 1212. The inlet of the first switcher 1211 is connected to the backplate outlet 132, the inner circulation outlet of the first switcher 1211 is connected to the inner circulation inlet of the second switcher 1212, and the outer circulation outlet of the first switcher 1211 is connected to the inlet of the external coolant distribution unit 14. The outer circulation inlet of the second switcher 1212 is connected to the outlet of the external coolant distribution unit 14, and the outlet of the second switcher 1212 is connected to the backplate inlet 131. In low-load mode, the inlet of the first switcher 1211 is connected to its inner circulation outlet, and the inner circulation inlet of the second switcher 1212 is connected to its outlet. In high-load mode, the inlet of the first switch 1211 is connected to the external circulation outlet of the first switch 1211, and the external circulation inlet of the second switch 1212 is connected to the outlet of the second switch 1212.

[0041] The first switch 1211 is installed on the fluid pipeline on the return side of the cabinet 11. The first switch 1211 has one inlet and two outlets, which are the internal circulation outlet and the external circulation outlet, respectively. The inlet of the first switch 1211 is in fluid communication with the back panel outlet 132 and is used to receive the high-temperature coolant after absorbing heat from the switch 20. The internal circulation outlet of the first switch 1211 is in fluid communication with the internal circulation inlet of the second switch 1212, forming a return branch of the internal circulation path. The external circulation outlet of the first switch 1211 is in fluid communication with the inlet of the external coolant distribution unit 14, forming a return branch of the external circulation path.

[0042] The second switch 1212 is installed on the fluid pipeline on the liquid supply side of the cabinet 11. The second switch 1212 has two liquid inlets and one liquid outlet, which are respectively the internal circulation liquid inlet and the external circulation liquid inlet. The internal circulation liquid inlet of the second switch 1212 is connected to the internal circulation liquid outlet of the first switch 1211, and is used to receive the low-temperature coolant after being cooled by the fan of the cabinet coolant distribution unit 12, forming the liquid inlet branch of the cabinet circulation path. The external circulation liquid inlet of the second switch 1212 is connected to the liquid outlet of the external coolant distribution unit 14, and is used to receive the low-temperature coolant after being cooled by the external coolant distribution unit 14, forming the liquid inlet branch of the external circulation path. The liquid outlet of the second switch 1212 is connected to the backplane liquid inlet 131, and is used to supply low-temperature coolant to the switch 20.

[0043] In low-load mode, the inlet of the first switch 1211 is connected to the inner circulation outlet of the first switch 1211, and the outer circulation outlet of the first switch 1211 is in a closed state. At the same time, the inner circulation inlet of the second switch 1212 is connected to the outlet of the second switch 1212, and the outer circulation inlet of the second switch 1212 is in a closed state, forming an internal circulation path in the cabinet.

[0044] In the internal circulation mode, the low-temperature coolant flows into the switch 20 through the back panel inlet 131. After absorbing the heat generated by the switch 20 during testing, its temperature rises. The heated coolant then flows out of the switch 20 through the back panel outlet 132 and into the internal coolant distribution unit 12. It then flows sequentially through the inlet of the first switcher 1211, the internal circulation outlet of the first switcher 1211, and the internal circulation inlet of the second switcher 1212. During the flow of the coolant within the internal coolant distribution unit 12, the fan of the internal coolant distribution unit 12 simultaneously cools the coolant. The cooled coolant then flows out of the internal coolant distribution unit 12 through the outlet of the second switcher 1212 and is transported back to the back panel inlet 131, thus achieving internal circulation. At this time, the external coolant distribution unit 14 can be in standby or low-power operation mode, reducing the overall energy consumption of the heat dissipation system and achieving energy-saving operation.

[0045] In high-load mode, the inlet of the first switch 1211 is connected to the outer circulation outlet of the first switch 1211, and the inner circulation outlet of the first switch 1211 is in a closed state. At the same time, the outer circulation inlet of the second switch 1212 is connected to the outlet of the second switch 1212, and the inner circulation inlet of the second switch 1212 is in a closed state, forming an external circulation path.

[0046] In the external circulation mode, the low-temperature coolant flows into the switch 20 through the back panel inlet 131. After absorbing the heat generated by the switch 20 during testing, its temperature rises. The heated coolant then flows out of the switch 20 through the back panel outlet 132 and into the internal coolant distribution unit 12. It then flows sequentially through the inlet of the first switcher 1211 and the external circulation outlet of the first switcher 1211, before being delivered to the inlet of the external coolant distribution unit 14. After being cooled by the external coolant distribution unit 14, the low-temperature coolant flows from the outlet of the external coolant distribution unit 14 into the external circulation inlet of the second switcher 1212, and then flows out of the internal coolant distribution unit 12 through the outlet of the second switcher 1212, before being delivered back to the back panel inlet 131, thus achieving coordinated circulation between the internal and external systems.

[0047] In one example, the first switch 1211 and the second switch 1212 are two-position three-way valves, which can complete the path switching action while the circuit is energized, without interrupting the normal operation of the cabinet 11.

[0048] By synchronously linking the first switcher 1211 and the second switcher 1212, the switching between the internal circulation path and the external circulation path can be realized, thereby matching the heat dissipation requirements of the cabinet 11 under different operating loads and ensuring the operational stability and reliability of the heat dissipation system.

[0049] In one configuration, a first flow control unit 15 is provided between the backplate outlet 132 and the coolant distribution unit 12 inside the cabinet, and / or a second flow control unit 16 is provided between the backplate inlet 131 and the coolant distribution unit 12 inside the cabinet. The first flow control unit 15 is used to detect the coolant flow rate of the backplate outlet 132 and control the coolant flow rate of the backplate outlet 132 based on the detection result. The second flow control unit 16 is used to detect the coolant flow rate of the backplate inlet 131 and control the coolant flow rate of the backplate inlet 131 based on the detection result.

[0050] When only the return flow needs to be controlled, a first flow control unit 15 can be installed between each backplate outlet 132 and the coolant distribution unit 12 inside the cabinet. When only the supply flow needs to be controlled, a second flow control unit 16 can be installed between each backplate inlet 131 and the coolant distribution unit 12 inside the cabinet. When higher precision flow control is required, both the first flow control unit 15 and the second flow control unit 16 can be installed on the backplate outlet 132 side and the backplate inlet 131 side.

[0051] The number of first flow control units 15 matches the number of backplate units 13. Each first flow control unit 15 is connected in series on an independent fluid pipeline between the corresponding backplate outlet 132 and the cabinet coolant distribution unit 12, so as to realize independent adjustment of the outlet flow of each branch.

[0052] The first flow control unit 15 can collect data such as the instantaneous flow rate and cumulative flow rate of the coolant flowing through the backplate outlet 132 in the corresponding pipeline to detect the coolant flow rate at the backplate outlet 132, and control the coolant flow rate at the backplate outlet 132 based on the detection results. For example, the first flow control unit 15 compares the detected flow rate with a preset flow range. When the coolant flow rate deviates from the preset flow range, it changes its own flow area to stabilize the coolant flow rate within the preset flow range. In one example, the first flow control unit 15 supports an intelligent temperature control system, which can dynamically adjust the liquid cooling flow rate according to the load.

[0053] The number of second flow control units 16 matches the number of backplate units 13. Each second flow control unit 16 is connected in series on an independent fluid pipeline between the corresponding backplate inlet 131 and the cabinet coolant distribution unit 12, so as to realize independent adjustment of the inlet flow of each branch.

[0054] The second flow control unit 16 can collect data such as the instantaneous flow rate and cumulative flow rate of the coolant flowing through the backplate inlet 131 in the corresponding pipeline, thereby detecting the coolant flow rate at the backplate inlet 131 and controlling the coolant flow rate at the backplate inlet 131 based on the detection results. For example, the second flow control unit 16 compares the detected flow rate with a preset flow range. When the coolant flow rate deviates from the preset range, it adjusts its own flow area to stabilize the coolant flow rate within the preset flow range. In one example, the second flow control unit 16 supports an intelligent temperature control system, which can dynamically adjust the liquid cooling flow rate according to the load.

[0055] It should be noted that, since each backplane unit 13 has an independent first flow control unit 15 for its outlet pipe and / or an independent second flow control unit 16 for its inlet pipe, the control of the liquid cooling channels in each tank is independent and does not interfere with each other. When a single switch under test 20 fails, the system can independently cut off the coolant supply from the coolant distribution unit 12 in the cabinet to the corresponding backplane unit 13, so that the coolant no longer flows into the faulty switch 20. Thus, without stopping the system or affecting the normal testing of other switches 20, the liquid cooling circuit of the faulty switch 20 can be isolated independently, ensuring the continuity and stability of the testing of the remaining switches 20.

[0056] In one example, the first flow control unit 15 and / or the second flow control unit 16 include a communication interface for connecting to the system centralized control unit. The system centralized control unit can collect the coolant flow results of each first flow control unit 15 and / or second flow control unit 16, determine a thermal management strategy based on the global load, and synchronously schedule each first flow control unit 15 and / or second flow control unit 16 according to the thermal management strategy to control the coolant flow of the corresponding liquid cooling channel, thereby achieving global centralized scheduling and management.

[0057] Through the first flow control unit 15 and / or the second flow control unit 16, the flow rate of the liquid cooling circulation loop corresponding to each backplane unit 13 can be independently detected and adjusted, so that the coolant flowing through the liquid cooling component 21 of each switch 20 matches its actual heat load, avoiding local overheating or overcooling caused by uneven flow distribution in each branch, thereby improving heat dissipation efficiency and system energy efficiency, and ensuring the stability and efficiency of the test system.

[0058] In one scenario, both the backplane inlet 131 and the backplane outlet 132 employ quick-connect couplings. This quick-connect coupling structure ensures reliable sealing and stable assembly at the interface connection, and allows for rapid connection, assembly, and disassembly between the switch 20 and the backplane unit 13 without the need for auxiliary tools. This simplifies assembly and disassembly operations, reduces the difficulty of later inspection, maintenance, and pipeline replacement, and ultimately balances system stability and maintainability.

[0059] In one scenario, the switch testing system 10 also includes a power supply unit 17 and a power supply copper busbar 18 disposed within the cabinet 11, with the power supply unit 17 electrically connected to the power supply copper busbar 18. The backplane unit 13 is provided with a power interface 133, which is electrically connected to the power supply copper busbar 18. After the backplane unit 13 is installed and connected to the switch 20, the power supply interface of the switch 20 is electrically connected to the power interface 133.

[0060] The power supply unit 17 receives external power input and converts it to the required level for the switch under test 20 before outputting it to the power supply bus 18. In one example, the power supply unit 17 includes multiple power distribution units (PDUs) connected in parallel. Each PDU's input is connected to an independent external power supply circuit, forming a multi-redundant input architecture. Each PDU's output is electrically connected to the power supply bus 18. Under normal operating conditions, multiple PDUs share the total system load. When any PDU fails or its corresponding upstream external power supply circuit is interrupted, the remaining normally operating PDUs can automatically take over the total system load, maintaining uninterrupted power supply to the test system.

[0061] The power supply copper busbar 18 serves as the centralized power transmission carrier inside the cabinet 11, which can improve the current carrying capacity of power transmission, reduce line transmission loss, and make the power supply wiring inside the cabinet 11 more organized, facilitating later line inspection and maintenance operations.

[0062] Each backplane unit 13 is equipped with a power interface 133, which serves as an independent electrical connection node and is electrically connected to the power supply copper busbar 18 to achieve power transmission. The power interface 133 also features insulation protection to ensure the safety and reliability of the power supply. After the backplane unit 13 is installed with the switch 20, the power supply interface of the switch 20 is electrically connected to the power interface 133. This eliminates the need for additional external power supply lines, enabling the power supply path of the switch under test 20 to be established, simplifying the power supply wiring process before testing. This power supply connection, in conjunction with the aforementioned liquid cooling pipeline connection, allows for the simultaneous connection of the liquid cooling circuit and power supply circuit of the switch under test 20 during the installation of the switch 20 with the backplane unit 13.

[0063] It should be noted that the power supply circuits corresponding to different backplane units 13 are independent of each other. When a single backplane unit 13 or its corresponding test station switch 20 experiences a power supply abnormality, the system can cut off the power supply from the power supply copper busbar 18 to the corresponding backplane unit 13. This allows for the independent isolation of the power path of the faulty switch 20 without shutting down the system or affecting the normal testing of other switches 20, thus ensuring the continuity and stability of the testing of the remaining switches 20.

[0064] In one example, the power supply copper busbars 18 are configured in two sets, namely a positive copper busbar and a negative copper busbar. The two sets of power supply copper busbars 18 are mutually insulated and arranged in parallel. The output terminals of the power supply unit 17 are simultaneously electrically connected to the corresponding positive and negative copper busbars. Each backplane unit 13 is provided with two power interfaces 133, one for electrical connection to the positive copper busbar and the other for electrical connection to the negative copper busbar. After the switch 20 is installed and connected to the backplane unit 13, the power supply interfaces of the switch 20 are connected to the positive and negative power interfaces respectively, forming a closed power supply loop based on the dual copper busbars to meet the power supply requirements of the entire machine.

[0065] By installing power supply units 17 and power supply copper busbars 18 within the cabinet 11, and electrically connecting the power interfaces 133 of each backplane unit 13 to the power supply copper busbars 18, the switch 20 can obtain converted and adapted power through the backplane unit 13 after being installed and connected to it. This forms a centralized power supply and distributed power acquisition architecture within the cabinet 11, realizing the integration of power supply functions of the switch test system 10, thereby improving the power supply reliability of the test system, while enhancing the system's versatility, scalability, and electrical safety performance.

[0066] In one situation, such as Figure 2 As shown, the power supply unit 17 is located at the top of the cabinet 11, and the coolant distribution unit 12 is located at the bottom of the cabinet 11. Multiple backplane units 13 are arranged sequentially from the top to the bottom of the cabinet 11. After the backplane units 13 are connected and installed with the switch 20, the switch 20 is positioned between the power supply unit 17 and the coolant distribution unit 12. This spatial layout fully utilizes the vertical space of the cabinet 11 and achieves physical separation between the power supply system and the liquid cooling circulation system, effectively reducing mutual interference between the two systems and improving the electrical safety performance of the system. Simultaneously, the placement of the power supply unit 17 at the top of the cabinet 11 facilitates the introduction and centralized management of external power cables, while the placement of the coolant distribution unit 12 at the bottom of the cabinet allows for gravity-assisted coolant return, reducing the operating power consumption of the liquid cooling circulation pump to a certain extent and improving the energy efficiency of the liquid cooling system.

[0067] The power supply copper busbar 18 extends from the top to the bottom of the cabinet 11, providing a unified power access reference for each backplane unit 13 arranged vertically. It can also make the connection distance between each backplane unit 13 and the power supply copper busbar 18 relatively uniform, reducing the voltage drop problem caused by the difference in line length, ensuring the stability of the power supply voltage at test positions at different heights, and providing a reliable and consistent power supply environment for each switch 20 under test.

[0068] Figure 6 A schematic diagram of a test unit 19 is shown. (As shown) Figure 3 and Figure 6 As shown, the switch testing system 10 also includes a testing unit 19. The backplane unit 13 is provided with multiple first data interfaces 134, which are connected to the testing unit 19. After the backplane unit 13 is installed and connected to the switch 20, the first data interfaces 134 are connected to the second data interface 22 of the switch 20. The testing unit 19 is used to communicate with the second data interface 22 through the first data interfaces 134 to test the second data interface 22.

[0069] The mainboard of switch 20 is equipped with a switching chip, which integrates a data signal transmitter and a data signal receiver for transmitting and receiving data signals. Switch 20 also has a second data interface 22, which is electrically connected to the switching chip. In one example, switch 20 has a modular backplane connector, which is electrically connected to the switching chip, and the second data interface 22 is integrated into the backplane connector.

[0070] The backplane unit 13 is provided with multiple first data interfaces 134, each of which is electrically connected to the test unit 19. The number and bandwidth of the first data interfaces 134 correspond to the number and bandwidth of the second data interfaces 22 on the switch 20. After the backplane unit 13 is installed and connected to the switch under test 20, the first data interfaces 134 on the backplane unit 13 are connected to the second data interfaces 22 of the switch under test 20, thereby establishing a bidirectional data transmission link between the switching chip and the test unit 19.

[0071] Test unit 19 can communicate bidirectionally with second data interface 22 via first data interface 134, and interact with switch under test 20 via bidirectional data transmission link between switch chip and test unit 19. Test unit 19 can send test signals of preset specifications to switch chip and receive response signals returned by switch chip. Based on the comparison and analysis of parameters of sent and received signals, it can test multiple performance indicators of second data interface 22 of switch under test 20, such as connectivity, transmission rate, and signal integrity.

[0072] The test unit 19 is connected to multiple first data interfaces 134 on the backplane unit 13. After the backplane unit 13 is installed and connected to the switch 20, the first data interfaces 134 are connected to the second data interfaces 22 of the switch 20. This enables bidirectional data transmission between the test unit 19 and the switch 20, thereby enabling the testing of the second data interfaces 22. Furthermore, the switch test system 10 supports parallel testing of multiple second data interfaces 22 without the need for repeated manual plugging and unplugging of cables, thus improving testing efficiency and reliability.

[0073] In one scenario, the test unit 19 includes a loss regulator 191. The loss regulator 191 is used to adjust the data transmitted between the test unit 19 and the second data interface 22 to simulate signal loss in the link and test the second data interface 22 under different loss conditions.

[0074] The test unit 19 is equipped with a loss regulator 191. The loss regulator 191 can adjust the data signal transmitted between the test unit 19 and the second data interface 22, simulate the signal loss characteristics of the data signal in the transmission link such as insertion loss and return loss, and thus realize the transmission performance test of the second data interface 22 under different link loss conditions.

[0075] The loss regulator 191 can communicate with preset test software. The test software can send control commands to the loss regulator 191. After receiving the control commands, the loss regulator 191 can dynamically adjust the link loss parameters in real time according to the control commands. The control commands can indicate a variety of preset rack slot loss modes to simulate the actual link loss conditions of the switch under test 20 when it is installed in different positions in the rack 11, including but not limited to near-end slot, middle slot, and far-end slot loss modes.

[0076] The loss conditioner 191 can perform bit error rate (BER) testing. It sends a preset test stream to the switch under test 20 and receives the stream returned via the switching chip, calculating the link's BER to evaluate the link's loss characteristics and signal integrity (SI) performance. Furthermore, the loss conditioner 191 can set differentiated test pass thresholds based on different simulated link loss values ​​to improve test coverage and efficiency.

[0077] The loss regulator 191 enables controllable adjustment of the signal loss of the transmission link between the test unit 19 and the second data interface 22, simulating the signal loss characteristics of the data signal in actual deployment scenarios. This allows for testing the transmission performance of the second data interface 22 under different link loss conditions. Furthermore, the loss regulator 191 enables dynamic adjustment of the link loss, reducing the cost of manual debugging and intervention, thereby improving testing efficiency and the reliability of test results.

[0078] In one example, the first data interface 134, the backplane inlet 131, and the backplane outlet 132 are set in the backplane unit 13.

[0079] The mounting surface of the backplane unit 13 is divided into independent areas such as a data interface area, a fluid interface area, and a power interface 133 area. Pre-set safety isolation distances can be reserved between different areas, and / or isolation can be achieved using insulated and heat-insulating physical isolation structures (such as isolation partitions). Multiple first data interfaces 134 are centrally located in the data interface area, the backplane liquid inlet 131 and backplane liquid outlet 132 are located in the fluid interface area, and the power interface 133 is located in the power interface 133 area. The functional interfaces on the backplane unit 13 adopt an integrated design, allowing the backplane unit 13 to interface with the entire switch 20 as an independent functional module, eliminating the need for separate plugging and unplugging of various types of interfaces. This supports rapid plugging and unplugging of the entire switch 20, improving testing efficiency.

[0080] In one example, such as Figure 3 As shown, a ventilation hole 135 is provided in the fluid interface arrangement area. The ventilation hole 135 penetrates the backplane unit 13 and maintains a preset safe distance from the backplane liquid inlet 131 and the backplane liquid outlet 132, forming an independent air-cooled airflow channel to assist in heat dissipation. This can meet the air-cooled heat dissipation requirements of the backplane and 20 components of the switch, and improve the adaptability of the heat dissipation system to different scenarios.

[0081] By partitioning the backplane unit 13 with the first data interface 134, the backplane liquid inlet 131, and the backplane liquid outlet 132, the diffusion path of fluid leakage to the data interface and power interface areas can be blocked from a physical perspective. This also reduces electromagnetic interference between different types of interfaces, improving the operational safety of the switch testing system 10. Furthermore, the partitioned arrangement of functional interfaces allows maintenance personnel to quickly identify the interface type and location, thereby improving equipment maintenance efficiency.

[0082] It should be understood that the examples in this specification are described in a progressive manner. Similar or identical parts between examples can be referred to interchangeably. Each example focuses on highlighting its differences from the others. In particular, the method examples are relatively simple in description because they are fundamentally similar to the methods described in the apparatus and system examples; relevant details can be found in the descriptions of other examples.

[0083] It should be understood that the foregoing describes specific examples in this specification. Other examples are within the scope of the claims. In some cases, the actions or steps recited in the claims may be performed in a different order than those shown in the examples and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are possible or may be advantageous.

[0084] It should be understood that the use of a singular form to describe an element or to show only one element in the accompanying drawings does not imply that the number of such element is limited to one. Furthermore, modules or elements described or shown as separate herein may be combined into a single module or element, and modules or elements described or shown as single herein may be broken down into multiple modules or elements.

[0085] It should also be understood that the terminology and expressions used herein are for descriptive purposes only, and one or more examples in this specification should not be limited to these terms and expressions. The use of these terms and expressions does not mean the exclusion of any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various modifications that may exist should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.

Claims

1. A switch testing system, comprising: Cabinet and internal coolant distribution unit; The cabinet is used to house the switches to be tested; The back panel of the cabinet includes multiple back panel units, each back panel unit being provided with a back panel liquid inlet and a back panel liquid outlet, the back panel liquid inlet and the back panel liquid outlet being respectively connected to the coolant distribution unit inside the cabinet; The backplane unit is configured to dock with the switch, which is equipped with a liquid cooling assembly. After the backplane unit is docked with the switch, the liquid inlet pipe of the liquid cooling assembly is connected to the liquid inlet of the backplane, and the liquid outlet pipe of the liquid cooling assembly is connected to the liquid outlet of the backplane. The cabinet coolant distribution unit is used to deliver coolant to the liquid cooling assembly and receive return coolant after the switch is connected to the backplane unit.

2. The switch testing system according to claim 1, wherein, The cabinet-mounted coolant distribution unit includes a path switching subunit; The channel switching subunit is used to connect the backplane inlet and outlet to the internal circulation channel in low-load mode, and to connect the backplane inlet and outlet to the external circulation channel in high-load mode. The coolant in the internal circulation channel is cooled by a fan included in the internal coolant distribution unit as it flows through the internal coolant distribution unit. The coolant in the external circulation channel is cooled by the external coolant distribution unit, which is located outside the cabinet, as it flows through the external coolant distribution unit.

3. The switch testing system according to claim 2, wherein, The external coolant distribution unit includes a centralized coolant distribution unit in the computer room.

4. The switch testing system according to claim 2, wherein, The path switching subunit includes a first switcher and a second switcher; The inlet of the first switcher is connected to the outlet of the back plate, the inner circulation outlet of the first switcher is connected to the inner circulation inlet of the second switcher, and the outer circulation outlet of the first switcher is connected to the inlet of the external coolant distribution unit. The external circulation inlet of the second switch is connected to the outlet of the external coolant distribution unit, and the outlet of the second switch is connected to the inlet of the back plate. In the low-load mode, the inlet of the first switch is connected to the outlet of the first switch, and the inlet of the inner circulation of the second switch is connected to the outlet of the second switch. In the high-load mode, the inlet of the first switch is connected to the outlet of the first switch, and the inlet of the second switch is connected to the outlet of the second switch.

5. The switch testing system according to claim 1, wherein, A first flow control unit is provided between the liquid outlet of the back plate and the coolant distribution unit inside the cabinet, and / or a second flow control unit is provided between the liquid inlet of the back plate and the coolant distribution unit inside the cabinet. The first flow control unit is used to detect the coolant flow rate at the back plate outlet and control the coolant flow rate at the back plate outlet based on the detection result. The second flow control unit is used to detect the coolant flow rate at the backplate inlet and control the coolant flow rate at the backplate inlet based on the detection result.

6. The switch testing system according to claim 1, wherein, Both the liquid inlet and the liquid outlet of the back plate adopt a quick-connect connector structure.

7. The switch testing system according to claim 1 further includes a power supply unit and a power supply copper busbar disposed in the cabinet, wherein the power supply unit is electrically connected to the power supply copper busbar; The backplane unit is provided with a power interface, which is electrically connected to the power supply copper busbar; After the backplane unit is installed and connected to the switch, the power supply interface of the switch is electrically connected to the power interface.

8. The switch testing system according to claim 7, wherein, The power supply unit is located at the top of the cabinet, and the coolant distribution unit inside the cabinet is located at the bottom of the cabinet. The plurality of backplane units are arranged sequentially from the top to the bottom of the cabinet. After the backplane units are connected and installed with the switch, the switch is located between the power supply unit and the coolant distribution unit inside the cabinet. The power supply copper busbar extends from the top to the bottom of the cabinet.

9. The switch testing system according to any one of claims 1-8, further comprising: Test unit; The backplane unit is provided with multiple first data interfaces, and the first data interfaces are connected to the test unit. After the backplane unit is installed and connected to the switch, the first data interface is connected to the second data interface of the switch. The test unit is used to communicate with the second data interface through the first data interface to test the second data interface.

10. The switch testing system according to claim 9, wherein, The test unit includes a loss regulator; The loss regulator is used to adjust the data transmitted between the test unit and the second data interface to simulate the signal loss in the link and to test the second data interface under different loss conditions.

11. The switch testing system according to claim 9, wherein, The first data interface, the backplate liquid inlet, and the backplate liquid outlet are arranged in the partitions of the backplate unit.

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